Vertical interconnection structure

Abstract

The invention relates to a vertical interconnection structure. The vertical interconnection structure comprises a first transmission line and a second transmission line which are arranged along a first direction. The first transmission line includes: a first package substrate having a first groove on one side in a first direction, the first groove extending in a second direction perpendicular to the first direction; the first boss is arranged at the groove bottom of the first groove in a protruding mode and extends in the second direction, and the side wall of the first boss and the side wall of the first groove are arranged in a spaced mode; the first conductive layer is arranged on the top surface of the first boss, and the first conductive layer is coupled or electrically connected with the second transmission line; the second conducting layer is at least arranged on the side wall of the first groove, and the second conducting layer and the first conducting layer are arranged in an insulated mode; the grounding plate is arranged on the side, provided with the first groove, of the first packaging substrate, the grounding plate and the first conductive layer are arranged in an insulated mode, the second conductive layer is electrically connected with the grounding plate, the transmission loss of the first transmission line is reduced, and the first transmission line can be conveniently integrated with a microwave and millimeter wave circuit to form a three-dimensional circuit structure.

Description

Technical Field

[0001] The present application relates to the field of microwave transmission technology, and in particular to a vertical interconnection structure. Background Art

[0002] In microwave multilayer boards, vertical interconnects between layers are often used to achieve miniaturization and high-density component design. When signals are transmitted between different layers, a high-performance interconnect structure is required to achieve good matching. Otherwise, transmission characteristics deteriorate, resulting in additional insertion loss. Therefore, research on vertical interconnects between transmission lines on different layers is essential. Summary of the Invention

[0003] The purpose of the present invention is to provide a vertical interconnection structure that can solve technical problems such as high insertion loss in existing vertical interconnection structures.

[0004] The present invention provides a vertical interconnection structure, which includes a first transmission line and a second transmission line arranged along a first direction, wherein the first transmission line includes: a first packaging substrate, which has a first groove on one side in the first direction, and the first groove extends along a second direction perpendicular to the first direction; a first boss, which is protruding from the bottom of the first groove and extends along the second direction, and the sidewall of the first boss is spaced apart from the sidewall of the first groove; a first conductive layer, which is arranged on the top surface of the first boss, and the first conductive layer is coupled or electrically connected to the second transmission line; a second conductive layer, which is arranged at least on the sidewall of the first groove, and the second conductive layer is insulated from the first conductive layer; and a ground plate, which is arranged on the side of the first packaging substrate having the first groove, and the ground plate is insulated from the first conductive layer, and the second conductive layer is electrically connected to the ground plate.

[0005] Furthermore, the first conductive layer includes a first conductive portion and a second conductive portion that are connected, the first conductive portion and the second conductive portion are extended along the second direction, the first conductive portion is coupled or electrically connected to the second transmission line; the maximum width of the first conductive portion is greater than the maximum width of the second conductive portion.

[0006] Furthermore, the width of the first conductive portion on a side close to the second conductive portion is greater than or equal to the width of the second conductive portion on a side close to the first conductive portion.

[0007] Furthermore, the first boss includes a first boss portion and a second boss portion connected to each other, the maximum thickness of the first boss portion is greater than the maximum thickness of the second boss portion; the first conductive portion is arranged on the top surface of the first boss portion, and the second conductive portion is arranged on the top surface of the second boss portion.

[0008] Furthermore, the thickness of the first boss portion on a side close to the second boss portion is greater than or equal to the thickness of the second boss portion on a side close to the first boss portion.

[0009] Furthermore, the second transmission line is arranged on a side of the grounding plate away from the first packaging substrate; the second transmission line includes: a second packaging substrate, a surface of which is close to the grounding plate and has a second groove, and the second groove extends along the second direction; a second boss, protruding from the bottom of the second groove and extending along the second direction, and the side wall of the second boss is spaced apart from the side wall of the second groove; a third conductive layer, arranged on the top surface of the second boss, the third conductive layer is coupled or electrically connected to the first conductive layer, and the third conductive layer is insulated from the grounding plate; and a fourth conductive layer, at least arranged on the side wall of the second groove, the fourth conductive layer is insulated from the third conductive layer, and the fourth conductive layer is electrically connected to the grounding plate; wherein, a first through hole is provided on the grounding plate, the first through hole at least partially exposes the first conductive layer and the third conductive layer, a fifth conductive layer is provided on the hole wall of the first through hole, one end of the fifth conductive layer is electrically connected to the second conductive layer, and the other end of the fifth conductive layer is electrically connected to the fourth conductive layer.

[0010] Furthermore, the first conductive layer and the third conductive layer are spaced apart, and the third conductive layer is coupled to the first conductive layer.

[0011] Furthermore, the first through hole extends along a third direction, which is perpendicular to the first direction and intersects with the second direction.

[0012] Furthermore, the first conductive layer and the third conductive layer are in direct contact, and the third conductive layer is electrically connected to the first conductive layer.

[0013] Furthermore, the first conductive layer has a first clamping portion, the first boss has a second clamping portion engaged with the first clamping portion; the third conductive layer has a third clamping portion engaged with the first clamping portion, the second boss has a fourth clamping portion engaged with the third clamping portion.

[0014] Furthermore, the first through hole extends along the second direction.

[0015] Furthermore, the second transmission line includes a coaxial connector, which includes: an inner conductor, an insulating layer surrounding the inner conductor, and an outer conductor surrounding the insulating layer, wherein the inner conductor protrudes from the insulating layer along a first direction; wherein the inner conductor is electrically connected to the first conductive layer and is insulated from the ground plate; wherein the second conductive layer also covers the bottom of the first groove, and the outer conductor is electrically connected to the second conductive layer at the bottom of the first groove.

[0016] Furthermore, the coaxial connector is located on a side of the ground plate away from the first packaging substrate; the ground plate is provided with an insulating portion at a position corresponding to the insulating layer, and the insulating portion is provided with a second through hole at a position corresponding to the inner conductor; an opening is provided on the first boss, and the first conductive layer is also provided in the opening; the inner conductor is inserted into the opening through the second through hole and is electrically connected to the first conductive layer; at least one third through hole is provided on the ground plate on the peripheral side of the insulating portion, and a sixth conductive layer is provided on the hole wall of the third through hole, one end of the sixth conductive layer is electrically connected to the second conductive layer, and the other end of the sixth conductive layer is electrically connected to the outer conductor.

[0017] Furthermore, the coaxial connector is located on a side of the first packaging substrate away from the ground plate; the first boss is provided with a fourth through hole, and the inner conductor passes through the fourth through hole and is electrically connected to the first conductive layer; the first packaging substrate is provided with at least one fifth through hole, and a seventh conductive layer is provided on the hole wall of the fifth through hole, one end of the seventh conductive layer is electrically connected to the second conductive layer, and the other end of the seventh conductive layer is electrically connected to the outer conductor.

[0018] Furthermore, the second transmission line is arranged on a side of the first packaging substrate away from the ground plane; the second transmission line includes a coplanar waveguide transmission line, and the coplanar waveguide transmission line includes: a center band and a grounding band arranged around the center band; the first boss has a sixth through hole, and an eighth conductive layer is provided on the hole wall of the sixth through hole, one end of the eighth conductive layer is electrically connected to the first conductive layer, and the other end of the eighth conductive layer is electrically connected to the center band; the second conductive layer also covers the bottom of the first groove; the first packaging substrate has at least one seventh through hole, and a ninth conductive layer is provided on the hole wall of the seventh through hole, one end of the ninth conductive layer is electrically connected to the second conductive layer at the bottom of the first groove, and the other end of the ninth conductive layer is electrically connected to the grounding band.

[0019] The advantages of the present invention are: the first transmission line of the present invention is provided with a first groove on the first packaging substrate, a first boss is provided at the bottom of the first groove, a first conductive layer is provided on the first boss, a second conductive layer is provided on the side wall of the first groove, the second conductive layer is insulated from the first conductive layer, a grounding plate is provided on the side of the first packaging substrate having the first groove, the grounding plate is insulated from the first conductive layer, and the second conductive layer is electrically connected to the grounding plate, thereby greatly reducing the transmission loss of the first transmission line, facilitating integration with microwave and millimeter wave circuits, and facilitating the formation of a three-dimensional circuit structure.

[0020] The first transmission line and the second transmission line of the present invention are arranged along a first direction, and the first transmission line and the second transmission line are coupled or electrically connected to realize signal transmission, with low insertion loss, low reflection, broadband and simple structure at high frequency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 is an assembly diagram of the vertical interconnection structure of Example 1 of the present invention;

[0023] Figure 2 is an exploded view of the vertical interconnect structure of Example 1 of the present invention;

[0024] Figure 3 yes Figure 1 AA cross-section of

[0025] Figure 4 is a structural schematic diagram of a second packaging substrate of the present invention;

[0026] Figure 5 yes Figure 4 A partial enlarged view of

[0027] Figure 6 yes Figure 2 A partial enlarged view of

[0028] Figure 7 is an assembly diagram of the vertical interconnection structure of Example 2 of the present invention;

[0029] Figure 8 is an exploded view of the vertical interconnect structure of Example 2 of the present invention;

[0030] Figure 9 yes Figure 7 BB cross-section diagram;

[0031] Figure 10 is an exploded cross-sectional view of the first packaging substrate, the ground plate, and the second packaging substrate of Example 2;

[0032] Figure 11 is an assembly diagram of the vertical interconnection structure of Example 3 of the present invention;

[0033] Figure 12 is an exploded view of the vertical interconnect structure of Example 3 of the present invention;

[0034] Figure 13 yes Figure 11 CC cross-section diagram;

[0035] Figure 14 is an exploded cross-sectional view of the first package substrate, the ground plate, and the coaxial connector of Example 3;

[0036] Figure 15 is an assembly diagram of a vertical interconnection structure according to Example 4 of the present invention;

[0037] Figure 16 is an exploded view of the vertical interconnect structure of Example 4 of the present invention;

[0038] Figure 17 yes Figure 15 DD profile;

[0039] Figure 18 is an exploded cross-sectional view of the first package substrate, the ground plate, and the coaxial connector of Example 4;

[0040] Figure 19 The vertical interconnection structure of the fifth embodiment of the present invention is assembled Figure 1 ;

[0041] Figure 20 is an exploded view of the vertical interconnect structure of Example 5 of the present invention;

[0042] Figure 21 The vertical interconnection structure of the fifth embodiment of the present invention is assembled Figure 2 ;

[0043] Figure 22 It is a plan view of the first conductive layer of Example 5 of the present invention.

[0044] Description of reference numerals:

[0045] 1. First transmission line; 2. Second transmission line;

[0046] 11. First packaging substrate; 12. First boss; 13. First conductive layer; 14. Second conductive layer; 15. Ground plate;

[0047] 111, first groove; 1101, first surface; 1102, second surface; 112, fifth through hole; 1121, seventh conductive layer; 113, seventh through hole; 1131, ninth conductive layer;

[0048] 121, first boss portion; 122, second boss portion; 1201, second clamping portion; 1202, opening; 1203, fourth through hole; 1204, sixth through hole; 12041, eighth conductive layer;

[0049] 131, first conductive portion; 132, second conductive portion; 1301, first clamping portion; 133, 1 / 4 wavelength impedance converter;

[0050] 151, first through hole; 152, insulating portion; 1521, second through hole; 153, third through hole; 1531, sixth conductive layer;

[0051] 21. Second packaging substrate; 22. Second boss; 23. Third conductive layer; 24. Fourth conductive layer;

[0052] 211, second groove; 2101, third surface; 2102, fourth surface;

[0053] 221, third boss portion; 222, fourth boss portion; 2201, fourth clamping portion;

[0054] 231, third conductive portion; 232, fourth conductive portion; 2301, third clamping portion;

[0055] 201, coaxial connector; 2011, inner conductor; 2012, insulation layer; 2013, outer conductor;

[0056] 202. Coplanar waveguide transmission line; 2021. Center strip; 2022. Ground strip. DETAILED DESCRIPTION

[0057] The following describes in detail preferred embodiments of the present invention in conjunction with the accompanying drawings to fully introduce the technical content of the present invention to those skilled in the art, to illustrate that the present invention can be implemented, to make the technical content disclosed in the present invention clearer, and to make it easier for those skilled in the art to understand how to implement the present invention. However, the present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments described herein. The description of the embodiments below is not intended to limit the scope of the present invention.

[0058] The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only directions in the drawings. The directional terms used in this article are used to explain and illustrate the present invention, and are not used to limit the scope of protection of the present invention.

[0059] In the accompanying drawings, components with the same structure are represented by the same numerical labels, and components with similar structures or functions are represented by similar numerical labels. In addition, for ease of understanding and description, the size and thickness of each component shown in the accompanying drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component.

[0060] In microwave multilayer boards, vertical interconnects between layers are often used to achieve miniaturization and high-density component design. When signals are transmitted between different layers, a high-performance interconnect structure is required to achieve good matching. Otherwise, transmission characteristics deteriorate, resulting in additional insertion loss. Therefore, research on vertical interconnects between transmission lines on different layers is essential.

[0061] Example 1

[0062] like Figures 1-6As shown, this embodiment provides a vertical interconnection structure. The vertical interconnection structure includes a first transmission line 1 and a second transmission line 2 arranged along a first direction Z. The first transmission line 1 and the second transmission line 2 are coupled or electrically connected. It is worth noting that the electrical connection here refers to direct contact to achieve signal transmission, and coupling refers to signal transmission without mutual contact. In this embodiment, the first transmission line 1 and the second transmission line 2 are coupled. As shown Figure 2 and Figure 3 As shown, the first transmission line 1 includes: a first packaging substrate (can be called a dielectric substrate) 11, a first boss (can be called a dielectric ridge) 12, a first conductive layer (can be called a metal conductive strip) 13, a second conductive layer 14 and a ground plane 15.

[0063] like Figure 6 As shown, the first packaging substrate 11 has a first groove 111 on one side in the first direction Z. The first groove 111 extends along a second direction X perpendicular to the first direction Z. Specifically, the first packaging substrate 11 has a first surface (i.e., an upper surface) 1101 and a second surface (i.e., a lower surface) 1102 perpendicular to the first direction Z. In this embodiment, the first groove 111 is located on the first surface 1101. The first packaging substrate 11 is used to provide external protection for the first transmission line 1, preventing the external environment from affecting the first transmission line 1. At the same time, different dielectric materials can be selected to specifically guide and transmit electromagnetic waves.

[0064] like Figure 2 and Figure 6 As shown, the first boss 12 protrudes from the bottom of the first groove 111 and extends along the second direction X. The first boss 12 is used to support the first conductive layer 13. The sidewalls of the first boss 12 are spaced apart from the sidewalls of the first groove 111. In other words, there is a gap between the sidewalls of the first boss 12 and the sidewalls of the first groove 111, thereby preventing the first conductive layer 13 on the first boss 12 from contacting and the second conductive layer 14 on the sidewalls of the first groove 111, thereby preventing a short circuit.

[0065] The first conductive layer 13 is disposed on the top surface of the first boss 12. The first conductive layer 13 serves as the transmission line of the first transmission line 1, conducting electricity and transmitting electromagnetic wave signals. The first conductive layer 13 is coupled to the second transmission line 2, thereby enabling signal transmission between the first transmission line 1 and the second transmission line 2.

[0066] The second conductive layer 14 is disposed at least on the sidewalls of the first groove 111. The second conductive layer 14 is insulated from the first conductive layer 13, thereby preventing short circuits between the first conductive layer 13 and the second conductive layer 14. The first conductive layer 13 and the second conductive layer 14 interact with each other to guide and transmit electromagnetic waves.

[0067] The ground plane 15 is disposed on the side of the first package substrate 11 having the first groove 111, that is, the ground plane 15 is disposed on the first surface of the first package substrate 11. Specifically, an air cavity is formed between the surface of the ground plane 15 on the side closest to the first package substrate 11 and the first groove 111 of the first package substrate 11. The first boss 12, the first conductive layer 13, and the second conductive layer 14 are disposed within the air cavity. The use of a flat ground plane 15 makes assembly of the first transmission line 1 tighter and easier, improves the fit between the first package substrate 11 and the ground plane 15, and better meets design requirements and functions.

[0068] The ground plane 15 is used for grounding. The ground plane 15 is insulated from the first conductive layer 13, and the second conductive layer 14 is electrically connected to the ground plane 15. In this embodiment, the ground plane 15 is an FR4 copper clad laminate. Other types of copper clad laminates may also be used in other embodiments, and this is not a mandatory requirement of this application.

[0069] In this embodiment, the second transmission line 2 is disposed on a side of the ground plate 15 away from the first packaging substrate 11 .

[0070] like Figure 2 、 Figure 4 and Figure 5 As shown, the second transmission line 2 includes: a second packaging substrate 21 , a second boss 22 , a third conductive layer 23 and a fourth conductive layer 24 .

[0071] like Figure 5 As shown, the second packaging substrate 21 has a second groove 211 on its surface near the ground plate 15, and the second groove 211 extends along the second direction X. Specifically, the second packaging substrate 21 has a third surface (i.e., an upper surface) 2101 and a fourth surface (i.e., a lower surface) 2102 perpendicular to the first direction Z. In this embodiment, the second groove 211 is located on the fourth surface 2102. The second packaging substrate 21 is used to provide external protection for the second transmission line 2, preventing the external environment from affecting the second transmission line 2. At the same time, different dielectric materials can be selected to specifically guide and transmit electromagnetic waves.

[0072] The second boss 22 protrudes from the bottom of the second groove 211 and extends along the second direction X. The second boss 22 is used to support the third conductive layer 23. The sidewalls of the second boss 22 are spaced apart from the sidewalls of the second groove 211. That is, a gap exists between the sidewalls of the second boss 22 and the sidewalls of the second groove 211, thereby preventing the third conductive layer 23 on the second boss 22 from contacting and the fourth conductive layer 24 on the sidewalls of the second groove 211, thereby preventing a short circuit.

[0073] The third conductive layer 23 is disposed on the top surface of the second boss 22. The third conductive layer 23 serves as the transmission line for the second transmission line 2, conducting electricity and transmitting electromagnetic wave signals. The third conductive layer 23 is coupled to the first conductive layer 13, thereby enabling signal transmission between the first transmission line 1 and the second transmission line 2.

[0074] The fourth conductive layer 24 is disposed at least on the sidewalls of the second groove 211 and is insulated from the third conductive layer 23. This prevents short circuits between the third conductive layer 23 and the fourth conductive layer 24. The third conductive layer 23 and the fourth conductive layer 24 interact with each other to guide and transmit electromagnetic waves.

[0075] The third conductive layer 23 is insulated from the ground plane 15 , and the fourth conductive layer 24 is electrically connected to the ground plane 15 . That is, the signal on the ground plane 15 can only be transmitted to the fourth conductive layer 24 but not to the third conductive layer 23 .

[0076] The ground plate 15 is provided with a first through hole 151. The first through hole 151 at least partially exposes the first conductive layer 13 and the third conductive layer 23. Providing the first through hole 151 in the ground plate 15 enables electromagnetic coupling of energy, resulting in improved transmission performance. In this embodiment, the first through hole 151 is rectangular. In other embodiments, the first through hole 151 can also be a regular shape such as an ellipse, or a different shape.

[0077] A fifth conductive layer (not shown) is provided on the wall of the first through hole 151. One end of the fifth conductive layer is electrically connected to the second conductive layer 14, and the other end of the fifth conductive layer is electrically connected to the fourth conductive layer 24. In other words, the electrical connection between the second conductive layer 14 and the fourth conductive layer 24 is achieved through the fifth conductive layer on the wall of the first through hole 151.

[0078] In this embodiment, the first conductive layer 13 and the third conductive layer 23 are spaced apart, and the third conductive layer 23 is coupled to the first conductive layer 13. That is, the first conductive layer 13 and the third conductive layer 23 do not directly contact each other, but instead achieve signal transmission through coupling. This coupling method enables signal transmission between the first conductive layer 13 and the third conductive layer 23, utilizing electromagnetic coupling to transmit microwave network energy between the two layers without direct contact or welding. This solves the existing problem of difficult welding of vertical interconnect structures and the impact of welding abnormalities on the reliability of vertical interconnect structures, significantly reducing process requirements and complexity.

[0079] The first through hole 151 extends along a third direction Y, which is perpendicular to the first direction Z and intersects the second direction X. In this embodiment, the third direction Y is perpendicular to the first direction Z and the second direction X, thereby reducing leakage of electromagnetic waves in the second direction X and ensuring sufficient coupling of electromagnetic waves in the third direction Y, resulting in excellent energy propagation performance and very low loss.

[0080] In this embodiment, the first conductive layer 13 includes a first conductive portion 131 and a second conductive portion 132 connected to each other. The first conductive portion 131 is coupled to the second transmission line 2. Specifically, the first conductive portion 131 and the second conductive portion 132 are arranged along the second direction X from the center to the edge of the first package substrate 11.

[0081] like Figure 2 and Figure 6 As shown, the maximum width of the first conductive portion 131 is greater than the maximum width of the second conductive portion 132. By increasing the width of the first conductive portion 131 coupled to the second transmission line 2, the coupling performance of the first conductive portion 131 and the second transmission line 2 is improved, making it more applicable. It is worth noting that the maximum width of the first conductive portion 131 refers to the maximum dimension of the first conductive portion 131 in the third direction Y. Similarly, the maximum width of the second conductive portion 132 refers to the maximum dimension of the second conductive portion 132 in the third direction Y.

[0082] The width of the first conductive portion 131 on the side close to the second conductive portion 132 is greater than or equal to the width of the second conductive portion 132 on the side close to the first conductive portion 131. In this embodiment, the width of the first conductive portion 131 on the side close to the second conductive portion 132 is greater than the width of the second conductive portion 132 on the side close to the first conductive portion 131.

[0083] like Figure 2 and Figure 6 As shown, the first boss 12 includes a first boss portion 121 and a second boss portion 122 connected to each other. The first boss portion 121 and the second boss portion 122 are arranged from the center to the edge of the first package substrate 11 along the second direction X. The first conductive portion 131 is disposed on the top surface of the first boss portion 121, and the second conductive portion 132 is disposed on the top surface of the second boss portion 122.

[0084] like Figure 3As shown, the maximum thickness of the first platform portion 121 is greater than the maximum thickness of the second platform portion 122. By increasing the thickness of the first platform portion 121, the height of the first conductive portion 131 located on the first platform portion 121 is increased, thereby reducing the coupling distance between the first conductive portion 131 and the third conductive layer 23, enhancing the coupling strength, and significantly reducing energy reflection in the vertical interconnect structure. It is worth noting that the maximum thickness of the first platform portion 121 refers to the maximum dimension of the first platform portion 121 in the first direction Z. Similarly, the maximum thickness of the second platform portion 122 refers to the maximum dimension of the second platform portion 122 in the first direction Z.

[0085] The thickness of the first boss portion 121 on the side closest to the second boss portion 122 is greater than or equal to the thickness of the second boss portion 122 on the side closest to the first boss portion 121. In this embodiment, the thickness of the first boss portion 121 on the side closest to the second boss portion 122 is equal to the thickness of the second boss portion 122 on the side closest to the first boss portion 121. The first boss portion 121 has a slope at one end closest to the second boss portion 122, and the height of the slope gradually increases from the second boss portion 122 toward the first boss portion 121. The slope increases the height of the first boss portion 121, thereby preventing the first conductive layer 13 from vertically climbing at the junction of the second boss portion 122 and the first boss portion 121, which could affect the performance of the first conductive layer 13.

[0086] like Figure 3 As shown, in this embodiment, the third conductive layer 23 includes a third conductive portion 231 and a fourth conductive portion 232 connected to each other, and the third conductive portion 231 is coupled to the first conductive portion 131. Specifically, the third conductive portion 231 and the fourth conductive portion 232 are arranged along the second direction X from the center to the edge of the second packaging substrate 21.

[0087] The maximum width of the third conductive portion 231 is greater than the maximum width of the fourth conductive portion 232. By increasing the width of the third conductive portion 231 coupled to the first conductive portion 131, the coupling performance of the third conductive portion 231 and the first conductive portion 131 is improved, thereby extending its applicability. It is worth noting that the maximum width of the third conductive portion 231 refers to the maximum dimension of the third conductive portion 231 in the third direction Y. Similarly, the maximum width of the fourth conductive portion 232 refers to the maximum dimension of the fourth conductive portion 232 in the third direction Y.

[0088] The width of the third conductive portion 231 on the side close to the fourth conductive portion 232 is greater than or equal to the width of the fourth conductive portion 232 on the side close to the third conductive portion 231. In this embodiment, the width of the third conductive portion 231 on the side close to the fourth conductive portion 232 is greater than the width of the fourth conductive portion 232 on the side close to the third conductive portion 231.

[0089] The second boss 22 includes a third boss portion 221 and a fourth boss portion 222 connected to each other. The third boss portion 221 and the fourth boss portion 222 are arranged from the center to the edge of the second package substrate 21 along the second direction X. The third conductive portion 231 is disposed on the top surface of the third boss portion 221, and the fourth conductive portion 232 is disposed on the top surface of the fourth boss portion 222.

[0090] The maximum thickness of the third boss portion 221 is greater than the maximum thickness of the fourth boss portion 222. By increasing the thickness of the third boss portion 221, the height of the third conductive portion 231 located on the third boss portion 221 is increased, thereby reducing the coupling distance between the third conductive portion 231 and the first conductive portion 131, enhancing the coupling strength, and significantly reducing energy reflection in the vertical interconnect structure. It is worth noting that the maximum thickness of the third boss portion 221 refers to the maximum dimension of the third boss portion 221 in the first direction Z. Similarly, the maximum thickness of the fourth boss portion 222 refers to the maximum dimension of the fourth boss portion 222 in the first direction Z.

[0091] The thickness of the third boss portion 221 on the side closest to the fourth boss portion 222 is greater than or equal to the thickness of the fourth boss portion 222 on the side closest to the third boss portion 221. In this embodiment, the thickness of the third boss portion 221 on the side closest to the fourth boss portion 222 is equal to the thickness of the fourth boss portion 222 on the side closest to the third boss portion 221. The end of the third boss portion 221 closest to the fourth boss portion 222 has a slope, the height of which gradually increases from the fourth boss portion 222 toward the third boss portion 221. This slope increases the height of the third boss portion 221, thereby preventing the third conductive layer 23 from vertically climbing at the junction of the fourth boss portion 222 and the third boss portion 221, which could affect the performance of the third conductive layer 23.

[0092] In summary, this embodiment mainly describes a transmission scenario in which a Tiered Circuit Board (TCB) is converted to a Tiered Circuit Board (TCB) through coupling.

[0093] Example 2

[0094] like Figure 7-10 As shown, this embodiment includes most of the technical features of Example 1. The difference between this embodiment and Example 1 is that the first conductive layer 13 and the third conductive layer 23 are electrically connected, that is, the first conductive layer 13 and the third conductive layer 23 are in direct contact to achieve signal transmission, rather than using the coupling method in Example 1 to achieve signal transmission.

[0095] The thickness of the first boss portion 121 in this embodiment is greater than the thickness of the first boss portion 121 in Example 1; and / or the thickness of the third boss portion 221 is greater than the thickness of the third boss portion 221 in Example 1, thereby allowing the first conductive layer 13 on the first boss portion 121 or the third conductive layer 23 on the third boss portion 221 to achieve direct contact through the first through hole 151 in the grounding plate 15.

[0096] Furthermore, if Figure 8 and Figure 10 As shown, the first conductive layer 13 has a first clamping portion 1301, and the first boss 12 has a second clamping portion 1201 that interlocks with the first clamping portion 1301; the third conductive layer 23 has a third clamping portion 2301 that interlocks with the first clamping portion 1301, and the second boss 22 has a fourth clamping portion 2201 that interlocks with the third clamping portion 2301. Specifically, in this embodiment, the second clamping portion 1201 is a recessed portion, and the fourth clamping portion 2201 is a protruding portion. The first clamping portion 1301 covers the bottom and sidewalls of the recessed portion, thereby interlocking with the second clamping portion 1201. The third clamping portion 2301 covers the top surface and sidewalls of the protruding portion, thereby interlocking with the fourth clamping portion 2201. Furthermore, the protrusion is shaped like a truncated cone, and the radius of the protrusion's surface on the side closest to the recessed portion is smaller than the radius of its surface on the side away from the recessed portion, thereby ensuring a more secure contact between the first engaging portion 1301 and the third engaging portion 2301. In other embodiments, the second engaging portion 1201 may be a protrusion, and the fourth engaging portion 2201 may be a recessed portion.

[0097] In this embodiment, the first clamping portion 1301 and the third clamping portion 2301 are engaged with each other, thereby achieving direct contact between the first conductive layer 13 and the third conductive layer 23 in the first direction Z, thereby effectively achieving energy propagation in the first direction Z. The first clamping portion 1301 and the third clamping portion 2301 are used to compensate for or offset discontinuities in the transmission process of the first transmission line 1 and the second transmission line 2 in the vertical interconnection structure, thereby achieving impedance matching and thereby achieving low reflection of electromagnetic signals.

[0098] In this embodiment, the first through hole 151 extends along the second direction X. Specifically, the first through hole 151 is elliptical, and the major axis of the ellipse is parallel to the second direction X. This can maximize the connection performance of the first transmission line 1 and the second transmission line 2.

[0099] In summary, this embodiment mainly describes a transmission scenario in which a Tiered Circuit Board (TCB) is transferred to another Tiered Circuit Board (TCB) through direct contact.

[0100] Example 3

[0101] like Figure 11-14 As shown, this embodiment includes most of the technical features of Example 1. The difference between this embodiment and Example 1 is that in this embodiment, the first conductive layer 13 and the third conductive layer 23 are electrically connected, that is, the first conductive layer 13 and the third conductive layer 23 are in direct contact to achieve signal transmission, rather than using the coupling method in Example 1 to achieve signal transmission. The second transmission line 2 includes a coaxial connector 201. The coaxial connector 201 includes an inner conductor 2011, an insulating layer 2012 surrounding the inner conductor 2011, and an outer conductor 2013 surrounding the insulating layer 2012. The inner conductor 2011 protrudes from the insulating layer 2012 along a first direction Z. The axis of the outer conductor 2013 coincides with the axis of the inner conductor 2011.

[0102] The inner conductor 2011 is electrically connected to the first conductive layer 13 and is insulated from the ground plate 15 .

[0103] In this embodiment, the second conductive layer 14 also covers the bottom of the first groove 111 , and the outer conductor 2013 is electrically connected to the second conductive layer 14 at the bottom of the first groove 111 .

[0104] In this embodiment, the coaxial connector 201 is located on a side of the ground plate 15 away from the first packaging substrate.

[0105] Specifically, the ground plate 15 has an insulating portion 152 at a position corresponding to the insulating layer 2012, and the insulating portion 152 has a second through hole 1521 at a position corresponding to the inner conductor 2011. The insulating portion 152 prevents the entire ground plate from causing a short circuit between the inner conductor 2011 and the outer conductor 2013.

[0106] The first boss 12 is provided with an opening 1202, and the first conductive layer 13 is further disposed within the opening 1202. The first conductive layer 13 within the opening 1202 is utilized to compensate for or offset the discontinuity in the transmission process of the first transmission line 1 and the second transmission line 2 in the vertical interconnect structure, thereby achieving impedance matching and thereby achieving low reflection of electromagnetic signals.

[0107] The inner conductor 2011 is inserted into the opening 1202 through the second through hole 1521 and electrically connected to the first conductive layer 13. The slope of the end of the first boss portion 121 near the second boss portion 122 is utilized to increase the height of the first boss portion 121. The opening 1202 is then provided on the first conductive portion 131, and the inner conductor 2011 is inserted into the opening 1202. This allows the inner conductor 2011 and the first conductive layer 13 to be more securely welded together, improving the reliability of the connection between the inner conductor 2011 and the first conductive layer 13, avoiding poor contact, preventing misalignment between the inner conductor 2011 and the first conductive layer 13, and improving the assembly accuracy of the vertical interconnect structure.

[0108] like Figure 12 As shown, in this embodiment, a tenth conductive layer 1205 may be further provided on the wall of the second through hole 1521. One end of the tenth conductive layer 1205 is electrically connected to the inner conductor 2011, and the other end thereof is electrically connected to the first conductive layer 13. When the inner conductor 2011 is too short to contact the first conductive layer 13, the tenth conductive layer 1205 can still ensure electrical connection between the inner conductor 2011 and the first conductive layer 13.

[0109] In this embodiment, at least one third through hole 153 is defined in the ground plate 15 around the insulating portion 152. A sixth conductive layer 1531 is defined on the wall of the third through hole 153. One end of the sixth conductive layer 1531 is electrically connected to the second conductive layer 14, and the other end of the sixth conductive layer 1531 is electrically connected to the outer conductor 2013.

[0110] In summary, this embodiment mainly describes a transmission scenario in which a Tiered Circuit Board (TCB) is transferred to a coaxial connector by direct contact, and the coaxial connector is located on the side of the ground plate 15 away from the first packaging substrate 11 .

[0111] Example 4

[0112] like Figure 15-18 As shown, this embodiment includes most of the technical features of Example 1. The difference between this embodiment and Example 1 is that in this embodiment, the first conductive layer 13 and the third conductive layer 23 are electrically connected, that is, the first conductive layer 13 and the third conductive layer 23 are in direct contact to achieve signal transmission, rather than using the coupling method in Example 1 to achieve signal transmission. The second transmission line 2 includes a coaxial connector 201. The coaxial connector 201 includes an inner conductor 2011, an insulating layer 2012 surrounding the inner conductor 2011, and an outer conductor 2013 surrounding the insulating layer 2012. The inner conductor 2011 protrudes from the insulating layer 2012 along a first direction Z. The axis of the outer conductor 2013 coincides with the axis of the inner conductor 2011.

[0113] In this embodiment, the coaxial connector 201 is located on a side of the first package substrate 11 away from the ground plane 15. Since the coaxial connector 201 is located on a side of the first package substrate 11 away from the ground plane 15, the maximum thickness of the first boss portion 121 in this embodiment can be equal to or even less than the maximum thickness of the second boss portion 122, thereby avoiding increasing the spacing between the first conductive layer 13 and the inner conductor 2011 and affecting the transmission performance between the first conductive layer 13 and the inner conductor 2011.

[0114] The inner conductor 2011 is electrically connected to the first conductive layer 13 and is insulated from the ground plate 15 .

[0115] In this embodiment, the second conductive layer 14 also covers the bottom of the first groove 111 , and the outer conductor 2013 is electrically connected to the second conductive layer 14 at the bottom of the first groove 111 .

[0116] like Figure 16 、 Figure 17 and Figure 18 As shown, the first boss 12 has a fourth through hole 1203 , and the inner conductor 2011 passes through the fourth through hole 1203 to be electrically connected to the first conductive layer 13 .

[0117] The first package substrate 11 has at least one fifth through hole 112, and a seventh conductive layer 1121 is provided on the wall of the fifth through hole 112. One end of the seventh conductive layer 1121 is electrically connected to the second conductive layer 14, and the other end of the seventh conductive layer 1121 is electrically connected to the outer conductor 2013.

[0118] In summary, this embodiment mainly describes a transmission scenario in which a Tiered Circuit Board (TCB) is transferred to a coaxial connector by direct contact, and the coaxial connector is located on a side of the first packaging substrate 11 away from the ground plane 15 .

[0119] Example 5

[0120] like Figures 19-21 As shown, this embodiment includes most of the technical features of Example 1. The difference between this embodiment and Example 1 is that in this embodiment, the first conductive layer 13 and the third conductive layer 23 are electrically connected, that is, the first conductive layer 13 and the third conductive layer 23 are in direct contact to achieve signal transmission, rather than using the coupling method in Example 1 to achieve signal transmission. The second transmission line 2 is arranged on the side of the first packaging substrate 11 away from the ground plate 15. Because the second transmission line 2 is located on the side of the first packaging substrate 11 away from the ground plate 15, the maximum thickness of the first boss portion 121 in this embodiment can be equal to or even less than the maximum thickness of the second boss portion 122, thereby avoiding increasing the distance between the first conductive layer 13 and the inner conductor 2011 and affecting the transmission performance between the first conductive layer 13 and the inner conductor 2011.

[0121] In this embodiment, the second transmission line 2 comprises a coplanar waveguide transmission line 202 , which comprises a central strip 2021 and a ground strip 2022 surrounding the central strip 2021 .

[0122] The first boss 12 has a sixth through hole 1204 , and an eighth conductive layer 12041 is formed on the wall of the sixth through hole 1204 . One end of the eighth conductive layer 12041 is electrically connected to the first conductive layer 13 , and the other end of the eighth conductive layer 12041 is electrically connected to the center strip 2021 .

[0123] The second conductive layer 14 also covers the bottom of the first groove 111. The first package substrate 11 has at least one seventh through hole 113, and a ninth conductive layer 1131 is provided on the wall of the seventh through hole 113. One end of the ninth conductive layer 1131 is electrically connected to the second conductive layer 14 at the bottom of the first groove 111, and the other end of the ninth conductive layer 1131 is electrically connected to the grounding strap 2022.

[0124] like Figure 22 As shown, in this embodiment, a quarter wavelength impedance converter 133 is provided between the first conductive portion 131 and the second conductive portion 132 of the first conductive layer 13. The quarter wavelength impedance converter 133 is used to match a wider line width and then transition to the second conductive portion 132.

[0125] like Figure 20 As shown, the first groove 111 passes through the first packaging substrate 11 along the first direction X, thereby thinning the thickness of the first packaging substrate 11 corresponding to the coplanar waveguide transmission line 202, thereby avoiding the first packaging substrate 11 being too thick to affect the transmission performance of the coplanar waveguide transmission line 202 and the first conductive layer 13.

[0126] like Figure 21 As shown, the grounding strip 2022 of the coplanar waveguide transmission line 202 partially covers the second surface 1102 of the first packaging substrate 11, thereby preventing strong resonance between the grounding strip 2022 and the ground plate 15, which would significantly affect the transmission performance.

[0127] In summary, this embodiment mainly describes a transmission scenario in which a Tiered Circuit Board (TCB) is transferred to a coplanar waveguide transmission line through direct contact.

[0128] The above is a detailed introduction to a vertical interconnection structure provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A vertical interconnection structure, characterized in that: It comprises a first transmission line (1) and a second transmission line (2) arranged along a first direction, wherein the first transmission line (1) comprises: A first packaging substrate (11), having a first groove (111) on one side thereof in the first direction, wherein the first groove (111) extends along a second direction perpendicular to the first direction; a first boss (12) protruding from the bottom of the first groove (111) and extending along the second direction, with the side wall of the first boss (12) spaced apart from the side wall of the first groove (111); a first conductive layer (13) disposed on the top surface of the first boss (12), the first conductive layer (13) being coupled or electrically connected to the second transmission line (2); a second conductive layer (14) disposed at least on a side wall of the first groove (111), the second conductive layer (14) being insulated from the first conductive layer (13); and A ground plate (15) is provided on a side of the first packaging substrate (11) having the first groove (111), the ground plate (15) is insulated from the first conductive layer (13), and the second conductive layer (14) is electrically connected to the ground plate (15).

2. The vertical interconnection structure according to claim 1, characterized in that: The first conductive layer (13) comprises a first conductive portion (131) and a second conductive portion (132) connected to each other, the first conductive portion (131) and the second conductive portion (132) extending along the second direction, and the first conductive portion (131) is coupled or electrically connected to the second transmission line (2); The maximum width of the first conductive portion (131) is greater than the maximum width of the second conductive portion (132).

3. The vertical interconnection structure according to claim 2, characterized in that: The width of the first conductive portion (131) on a side close to the second conductive portion (132) is greater than or equal to the width of the second conductive portion (132) on a side close to the first conductive portion (131).

4. The vertical interconnection structure according to claim 2, wherein: The first boss (12) comprises a first boss portion (121) and a second boss portion (122) connected to each other, and the maximum thickness of the first boss portion (121) is greater than the maximum thickness of the second boss portion (122); The first conductive portion (131) is arranged on the top surface of the first boss portion (121), and the second conductive portion (132) is arranged on the top surface of the second boss portion (122).

5. The vertical interconnection structure according to claim 4, characterized in that: The thickness of the first boss portion (121) on a side close to the second boss portion (122) is greater than or equal to the thickness of the second boss portion (122) on a side close to the first boss portion (121).

6. The vertical interconnection structure according to claim 1, characterized in that: The second transmission line (2) is arranged on a side of the ground plate (15) away from the first packaging substrate (11); The second transmission line (2) comprises: A second packaging substrate (21), having a second groove (211) on a surface of the second packaging substrate (21) on a side close to the ground plate (15), wherein the second groove (211) extends along the second direction; A second boss (22) is convexly arranged on the bottom of the second groove (211) and extends along the second direction, with the side wall of the second boss (22) being spaced apart from the side wall of the second groove (211); a third conductive layer (23) disposed on the top surface of the second boss (22), the third conductive layer (23) being coupled or electrically connected to the first conductive layer (13), and the third conductive layer (23) being insulated from the ground plate (15); and a fourth conductive layer (24) disposed at least on a side wall of the second groove (211), the fourth conductive layer (24) being insulated from the third conductive layer (23), and the fourth conductive layer (24) being electrically connected to the ground plate (15); The ground plate (15) is provided with a first through hole (151), the first through hole (151) at least partially exposes the first conductive layer (13) and the third conductive layer (23), a fifth conductive layer is provided on the hole wall of the first through hole (151), one end of the fifth conductive layer is electrically connected to the second conductive layer (14), and the other end of the fifth conductive layer is electrically connected to the fourth conductive layer (24).

7. The vertical interconnection structure according to claim 6, characterized in that: The first conductive layer (13) and the third conductive layer (23) are spaced apart, and the third conductive layer (23) is coupled to the first conductive layer (13).

8. The vertical interconnection structure according to claim 7, characterized in that: The first through hole (151) extends along a third direction, which is perpendicular to the first direction and intersects with the second direction.

9. The vertical interconnection structure according to claim 6, characterized in that: The first conductive layer (13) and the third conductive layer (23) are in direct contact, and the third conductive layer (23) is electrically connected to the first conductive layer (13).

10. The vertical interconnection structure according to claim 9, characterized in that: The first conductive layer (13) has a first clamping portion (1301), and the first boss (12) has a second clamping portion (1201) interlocked with the first clamping portion (1301); The third conductive layer (23) has a third clamping portion (2301) interlocked with the first clamping portion (1301), and the second boss (22) has a fourth clamping portion (2201) interlocked with the third clamping portion (2301).

11. The vertical interconnection structure according to claim 9, wherein: The first through hole (151) extends along the second direction.

12. The vertical interconnection structure according to claim 1, wherein: The second transmission line (2) comprises a coaxial connector (201), the coaxial connector (201) comprising: an inner conductor (2011), an insulating layer (2012) surrounding the inner conductor (2011), and an outer conductor (2013) surrounding the insulating layer (2012), the inner conductor (2011) protruding from the insulating layer (2012) along the first direction; The inner conductor (2011) is electrically connected to the first conductive layer (13) and is insulated from the ground plate (15); The second conductive layer (14) also covers the bottom of the first groove (111), and the outer conductor (2013) is electrically connected to the second conductive layer (14) at the bottom of the first groove (111).

13. The vertical interconnection structure according to claim 12, wherein: The coaxial connector (201) is located on a side of the ground plate (15) away from the first packaging substrate (11); The ground plate (15) is provided with an insulating portion (152) at a position corresponding to the insulating layer (2012), and the insulating portion (152) is provided with a second through hole (1521) at a position corresponding to the inner conductor (2011); An opening (1202) is provided on the first boss (12), and the first conductive layer (13) is also arranged in the opening (1202); The inner conductor (2011) passes through the second through hole (1521) and is inserted into the opening (1202) to be electrically connected to the first conductive layer (13); At least one third through hole (153) is provided on the grounding plate (15) on the peripheral side of the insulating portion (152), and a sixth conductive layer (1531) is provided on the hole wall of the third through hole (153), one end of the sixth conductive layer (1531) is electrically connected to the second conductive layer (14), and the other end of the sixth conductive layer (1531) is electrically connected to the outer conductor (2013).

14. The vertical interconnect structure according to claim 12, wherein: The coaxial connector (201) is located on a side of the first packaging substrate (11) away from the ground plate (15); The first boss (12) has a fourth through hole (1203), and the inner conductor (2011) passes through the fourth through hole (1203) and is electrically connected to the first conductive layer (13); The first packaging substrate (11) has at least one fifth through hole (112), a seventh conductive layer (1121) is provided on the hole wall of the fifth through hole (112), one end of the seventh conductive layer (1121) is electrically connected to the second conductive layer (14), and the other end of the seventh conductive layer (1121) is electrically connected to the outer conductor (2013).

15. The vertical interconnect structure according to claim 1, wherein: The second transmission line (2) is arranged on a side of the first packaging substrate (11) away from the ground plate (15); The second transmission line (2) comprises a coplanar waveguide transmission line (202), and the coplanar waveguide transmission line (202) comprises: a central strip (2021) and a grounding strip (2022) arranged around the central strip (2021); The first boss (12) has a sixth through hole (1204), an eighth conductive layer (12041) is provided on the hole wall of the sixth through hole (1204), one end of the eighth conductive layer (12041) is electrically connected to the first conductive layer (13), and the other end of the eighth conductive layer (12041) is electrically connected to the central band (2021); The second conductive layer (14) also covers the bottom of the first groove (111); The first packaging substrate (11) has at least one seventh through hole (113), a ninth conductive layer (1131) is provided on the hole wall of the seventh through hole (113), one end of the ninth conductive layer (1131) is electrically connected to the second conductive layer (14) at the bottom of the first groove (111), and the other end of the ninth conductive layer (1131) is electrically connected to the grounding strip (2022).

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