Lens AA assembling and testing equipment based on laser soldering tin and using method of lens AA assembling and testing equipment

Abstract

The invention relates to the technical field of lens module AA assembly design, in particular to a lens AA assembly test device based on laser soldering and a use method thereof.The lens AA assembly test device based on laser soldering is characterized in that a square tube frame is fixed to a bottom plate through four stand columns, and three-axis soldering head assemblies are arranged at the four corners of the inner side of the square tube frame; the testing assembly comprises a six-dimensional force sensor, a square seat used for installing a lens is fixed to the top of the six-dimensional force sensor, a plurality of pins are arranged on the top of the square seat, a circuit board is connected to the pins in an inserted mode, and the circuit board is fixed to the testing table through a clamping mechanism and keeps electrically connected with the electric connector female head in the welding process. Through a cooperative measurement mechanism integrating the six-dimensional force sensor and the three-axis micrometer, the three-dimensional stress and deformation quantity of the circuit board in the laser soldering process can be accurately obtained in real time, and the problem that traditional AA soldering equipment design depends on experience debugging is solved; and reliable data support is provided for clamping force and positioning compensation design of mass production equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of lens module AA assembly design, and in particular to a lens AA assembly test device based on laser soldering and a use method thereof. Background Art

[0002] The traditional process for AA lens module assembly involves first integrating the circuit board with the image sensor into a square mount, then gluing the lens flange end face to the end face of the square mount, and then curing with UV light to secure the connection. However, some customers use a threaded connection between the lens and the square mount, making AA assembly impossible. The typical assembly process for these lenses involves first attaching the lens and square mount together using glue and threads, then securing the square mount to the circuit board with the image sensor using AA soldering (for example, the patent application disclosed in Publication No. CN104954638B, which electrically connects pin 15 to circuit board 50 via soldering).

[0003] When AA soldering is performed on the square seat and the circuit board with the image sensor mounted thereon, the ideal state is that after the circuit board and the square seat are AA aligned, the circuit board will no longer be deformed by external forces during the soldering process, thereby ensuring the accuracy of the AA assembly of the image sensor and the lens. However, in actual production, the circuit board is often affected by factors such as welding stress and will shift during the soldering process. The thickness and hardness of the circuit boards of different customers vary, and the stresses they are subjected to during soldering vary, resulting in different amounts of shift. This shift will affect the AA alignment of the image sensor on the circuit board and the lens. The current main practice in the industry is to first design AA soldering equipment for mass production and then debug it. The debugging workload is large, the efficiency is low, and it seriously affects delivery time.

[0004] Publication No. CN117300329A describes a thermodynamic hybrid control system for robotic shoulder friction stir welding. This system mounts a multi-dimensional force sensor on the robot's six-axis end flange. By directly measuring temperature and multi-dimensional force signals and utilizing thermodynamic hybrid control, it actively controls heat input and force during the welding process, fundamentally improving weld quality. However, this solution, in which the multi-dimensional force sensor is located at the actuating end of the welding device, rather than on the circuit board side, cannot detect the force and offset applied to the circuit board during laser welding, making it unsuitable for lens module AA assembly design technology.

[0005] In summary, there is an urgent need to design a lens AA assembly and testing equipment based on laser soldering and its use method to solve the problems in the existing technology that the design of mass-produced AA soldering equipment relies on experience, has a long debugging cycle, low efficiency, and is difficult to quantify the relationship between welding stress and deformation. Summary of the Invention

[0006] In view of this, the present invention aims to propose a lens AA assembly and testing equipment based on laser soldering and its use method, so as to solve the problems in the prior art that the design of mass-produced AA soldering equipment relies on experience, has a long debugging cycle, is inefficient, and is difficult to quantify the relationship between welding stress and deformation.

[0007] This solution uses the test equipment provided by this solution to test the stress and deformation of the circuit board from various directions during the soldering process before designing the mass-produced AA soldering equipment for the lens module. This allows the influence of these forces and deformations to be considered when designing the mass-produced AA soldering equipment, thereby improving the design accuracy of the mass-produced AA soldering equipment.

[0008] The technical solution of the present invention is achieved as follows: One object of the present invention is to disclose a laser soldering-based AA lens assembly and testing device, comprising a base plate and a test assembly disposed on the base plate, wherein a square frame is fixed to the base plate via four columns, and a three-axis solder head assembly is disposed at each of the four inner corners of the square frame; The test assembly includes a test bench, a test base is provided on the test bench, a six-dimensional force sensor is provided on the test base, a square seat for mounting a lens is fixed on the top of the six-dimensional force sensor, a plurality of pins are provided on the top of the square seat, a circuit board is plugged into the pins, and the circuit board is fixed to the test bench by a clamping mechanism and maintains electrical conductivity with the female head of the electrical connector during the welding process.

[0009] Furthermore, the clamping mechanism includes two vertical plates arranged on the test bench, and a lower horizontal plate and an upper horizontal plate are arranged between the two vertical plates from bottom to top; The lower horizontal plate is provided with an XZ-axis precision adjustment platform, the XZ-axis precision adjustment platform is provided with a parallel clamping cylinder, the clamping claws of the parallel clamping cylinder have a step surface, and the circuit board is clamped on the step surface; A Z-axis slide cylinder is provided on the upper horizontal plate, and downward pressure ribs are provided on both sides of the driving plate of the Z-axis slide cylinder. Positioning blocks for pressing the circuit board onto the step surface are fixed on the downward pressure ribs.

[0010] Furthermore, an L-shaped bracket is provided on the lower horizontal plate, and a female electrical connector is provided on the L-shaped bracket, and the female electrical connector is plugged into and matched with a male electrical connector provided on the top surface of the circuit board; A compression spring is sleeved on the outer side of the female head of the electrical connector, and the compression spring is used to apply a pre-tightening force to the female head of the electrical connector toward the male head of the electrical connector to maintain the electrical connection during the welding process.

[0011] Furthermore, the test bench is also provided with a micrometer assembly for measuring the deformation of the circuit board in the X, Y, and Z directions. The micrometer assembly includes three micrometers arranged along the X, Y, and Z directions, respectively. The probes of the micrometers are in contact with the side or top surface of the circuit board after the circuit board is clamped.

[0012] Furthermore, the three-axis solder head assembly includes a support fixed on the square frame, the support is provided with an angle adjustment platform rotating around the X-axis, the angle adjustment platform is provided with a rotating slide rotating around the Y-axis, the rotating slide is provided with a rotating arm, the rotating arm is provided with a Z-axis displacement platform, and a laser is fixed on the Z-axis displacement platform.

[0013] Furthermore, the laser is integrated with a monitoring camera and a temperature measuring device for monitoring the soldering process. The monitoring camera is used to obtain the solder joint image, and the temperature measuring device is used to detect the temperature of the welding area in real time.

[0014] Furthermore, the pins and the through holes on the circuit board are clearance-fitted, so that the position of the circuit board relative to the square seat can be adjusted within a certain range to avoid interference between the pins and the inner wall of the through hole.

[0015] Furthermore, the bottom of the square seat is connected to the six-dimensional force sensor through screws, and the bottom of the square seat is also threadedly connected to a simulation lens to reproduce the actual product weight and connection method.

[0016] Furthermore, the XZ-axis precision adjustment table is used to fine-tune the position of the parallel clamping cylinder so that the circuit board is not subjected to additional pressure when in contact with the square seat, ensuring that the six-dimensional force sensor only detects the stress generated during the soldering process.

[0017] Another object of the present invention is to disclose a method for using a laser soldering-based AA lens assembly and testing device, which comprises the following steps: S1: Install the circuit board to be tested in the clamping mechanism and connect it to the pins on the square seat; S2: Adjust the position through the clamping mechanism so that the circuit board contacts the square seat without pre-pressure; S3: Start the clamping mechanism to fix the circuit board and make it conductive with the female head of the electrical connector; S4: Start the three-axis soldering head assembly to perform laser soldering, and at the same time collect stress and deformation data during the welding process through the six-dimensional force sensor and micrometer; S5: Analyze data and establish a stress-deformation model to guide the design of mass production equipment.

[0018] Compared with the prior art, the laser soldering-based lens AA assembly and testing equipment and its use method of the present invention have the following advantages: 1. By integrating a six-axis force sensor and a three-axis micrometer in a collaborative measurement mechanism, this invention can accurately and in real time obtain the three-dimensional stress and deformation of a circuit board during the laser soldering process. This solves the problems of traditional AA soldering equipment design, which relies on empirical debugging, has long debugging cycles, low efficiency, and difficulty in quantifying the relationship between welding stress and deformation. It improves the prediction accuracy of welding offset by over 90%, provides reliable data support for the clamping force and positioning compensation design of mass production equipment, and significantly improves the first-time success rate of AA alignment.

[0019] 2. This invention adopts a stepped surface clamping and independent downward pressure structure to ensure that the clamping force is not transmitted to the sensor below. At the same time, combined with the power-on monitoring function of the electrical connector, it realizes the pure collection of mechanical signals during the welding process and the simultaneous verification of electrical connection reliability. It effectively avoids the influence of external interference on test results, improves the accuracy and comprehensiveness of test data, and ensures the authenticity and repeatability of process verification.

[0020] 3. This invention utilizes four independently adjustable three-axis soldering head assemblies, coupled with an angle adjustment stage, a rotary slide, and a Z-axis displacement platform, to achieve high-precision dynamic positioning of the laser focus point. This supports multi-point sequential soldering and real-time temperature monitoring, simulating the soldering process in a mass production environment. It can also flexibly adapt to different product models, shortening the test cycle by 40%, significantly improving equipment versatility and R&D efficiency, making it suitable for R&D and verification scenarios involving small batches of multiple products. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which constitute part of the present invention, are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings: Figure 1 It is a structural schematic diagram of the testing device of the present invention; Figure 2 It is a schematic structural diagram of the test assembly of the present invention; Figure 3 It is a partial enlarged view of the test assembly of the present invention; Figure 4 It is a structural schematic diagram of the three-axis solder head assembly of the present invention.

[0022] Reference numerals: 1. Base plate; 2. Test assembly; 21. Test bench; 22. Test base; 23. Six-dimensional force sensor; 24. Square seat; 25. Pin; 26. Circuit board; 261. Male connector; 27. Vertical plate; 28. Lower horizontal plate; 281. XZ-axis precision adjustment table; 282. Parallel clamp cylinder; 283. Step surface; 284. L-shaped bracket; 285. Female connector; 286. Compression spring; 29. ​​Upper horizontal plate; 291. Z-axis slide cylinder; 292. Lower pressure rib; 293. Positioning block; 3. Column; 4. Square frame; 5. Three-axis soldering head assembly; 51. Support; 52. Angle adjustment table; 53. Rotating slide; 54. Rotating arm; 55. Z-axis displacement platform; 56. Laser; 561. Monitoring camera; 562. Temperature measuring device. DETAILED DESCRIPTION

[0023] In order to make the technical means, objectives and effects of the present invention easier to understand, embodiments of the present invention are described in detail below with reference to specific figures.

[0024] It should be noted that all terms used in the present invention to indicate direction and position, such as "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside", "top", "low", "lateral", "longitudinal", "center", etc., are only used to explain the relative positional relationship and connection status between various components in a specific state. They are only for the convenience of describing the present invention, and do not require that the present invention must be constructed and operated in a specific orientation. Therefore, they cannot be understood as limiting the present invention. In addition, the descriptions of "first", "second", etc. in the present invention are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features.

[0025] In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed, detachable, or integral connections; mechanical connections; direct connections or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0026] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0027] This invention provides a lens module AA assembly and testing device based on a laser soldering process. This device aims to address the existing challenges of mass-production AA soldering equipment, which relies heavily on experience, suffers from long commissioning cycles, suffers from low efficiency, and struggles to quantify the relationship between welding stress and deformation. This test device allows for precise measurement of the stress and deformation of different types of circuit boards during the laser soldering process before formally designing mass-production equipment. This provides a scientific basis for the design of the equipment's clamping system, welding parameters, and compensation algorithms.

[0028] like Figures 1-4 As shown, the lens module AA assembly test equipment of this embodiment includes a base plate 1 and a test assembly 2 mounted on the base plate 1, which is used to simulate the actual AA assembly structure of the lens module and collect data. A rectangular square frame 4 is fixedly connected to the four corners of the base plate 1 via four columns 3. The square frame 4 can be made of welded or bolted plates and is used to support and position four three-axis solder head assemblies 5.

[0029] There are four three-axis solder head assemblies 5, corresponding to the pins 25 at the four corners of the top of the lens module square seat 24. Each three-axis solder head assembly 5 can independently adjust the spatial posture of the laser 56 to ensure that the laser beam can be accurately focused on the solder joint position.

[0030] Test assembly 2 includes a test table 21 fixed to base plate 1, with a test base 22 mounted on top. A six-axis force sensor 23 is mounted on the test base 22. Test table 21 serves as the main support platform for test assembly 2 and is fixed to base plate 1. It possesses high rigidity and stability. It is used to mount and integrate all underlying structures, such as the test base 22, clamping mechanism, and electrical connectors, ensuring the relative positional accuracy between components and preventing vibration or deformation from affecting test results. The test base 22 provides a stable, flat mounting surface and features vibration damping and thermal insulation, minimizing the impact of the external environment on the sensor. The six-axis force sensor 23 can simultaneously measure forces in the X, Y, and Z directions, as well as torques around the three axes. Its core function is to capture in real time the full mechanical response generated by thermal expansion, solder melting, and solidification contraction during the laser soldering process. These forces are transmitted through the path from pin 25 to circuit board 26 to square base 24 to six-axis force sensor 23, providing a true reflection of the potential impact of soldering on AA alignment accuracy.

[0031] Preferably, the test base 22 includes two bases and a connecting plate connecting the two bases. The two bases are arranged with the central axis of the test bench 21 as the axis of symmetry. The bases are mounted on the test bench 21 by screws, and the two ends of the connecting plate are respectively connected to the base screws. When the six-dimensional force sensor 23 is placed on the connecting plate, the overall structure is easier to align with the anti-vibration support structure. The six-dimensional force sensor 23 is only placed on the connecting plate and is not directly fixed to the base, or is only lightly contacted for positioning. The force exerted on the sensor only comes from the square seat 24 and the simulated lens above. It does not bear the pre-tightening force or structural deformation stress from the base mounting screws, avoiding "preload" or "eccentric force" caused by improper assembly of the test base 22. During the laser soldering process, local temperature rise may cause thermal expansion of the metal structure. The split structure allows a small relative displacement between the base and the connecting plate to release thermal stress. The connecting plate can be made of a material with a low thermal expansion coefficient to further improve thermal stability.

[0032] Preferably, a heat insulating gasket may be provided between the square seat 24 and the six-dimensional force sensor 23 to reduce heat conduction to the sensor during laser welding, thereby improving the service life and measurement accuracy of the sensor.

[0033] A square mount 24 for mounting a lens is fixed to the top of the six-dimensional force sensor 23. This mount simulates the structure used to connect a lens in an actual product. The bottom of the mount is internally threaded, allowing it to be threaded with a simulated lens. This simulated lens has the same mass as the actual lens, replicating the weight and center of gravity distribution under real-world conditions.

[0034] Four pins 25 are provided at the four corners of the top of the square seat 24, and through holes corresponding to the pins 25 are provided on the circuit board 26. After the pins 25 are inserted into the through holes, the two are clearance-fitted. The range of the single-side clearance can be 0.05~0.1mm, so that the position of the circuit board 26 relative to the square seat 24 can be adjusted within a certain range to avoid interference between the pins 25 and the inner wall of the through hole.

[0035] In order to achieve stable clamping and precise positioning of the circuit board 26, an image sensor is provided at the bottom of the circuit board 26, which is fixed on the test bench 21 through a clamping mechanism and can maintain electrical conduction with the electrical connector female head 285 during the welding process.

[0036] Specifically, the clamping mechanism includes two vertical plates 27 positioned along the Z-axis on the test bench 21. A lower horizontal plate 28 and an upper horizontal plate 29 are positioned between the two vertical plates 27, from bottom to top. A XZ-axis precision adjustment platform 281 is mounted on the lower horizontal plate 28, which in turn is equipped with a parallel clamping cylinder 282. This XZ-axis precision adjustment platform 281 is a commercially available micron-level displacement platform used to fine-tune the position of the parallel clamping cylinder 282, ensuring that the circuit board 26 is not subjected to additional pressure when in contact with the square seat 24, and that the six-dimensional force sensor 23 only detects stress generated during soldering. The parallel clamping cylinder 282 is screwed to the movable slider on the XZ-axis precision adjustment platform 281.

[0037] The clamping jaws of the parallel clamping cylinder 282 have a stepped surface 283, on which the circuit board 26 is clamped. The clamping force is controlled by air pressure and can be adjusted from 20 to 100 N, or the clamping force can be selected as needed. The lower horizontal plate 28 is also provided with an L-shaped bracket 284, on which is mounted a female electrical connector 285. The female electrical connector 285 can be plugged into the male electrical connector 261 disposed on the top surface of the circuit board 26. A compression spring 286 is sleeved on the outside of the female electrical connector 285. The compression spring 286 is used to apply a preload force to the female electrical connector 285 toward the male electrical connector 261, ensuring a stable electrical connection during welding. External circuitry can be used to monitor whether a circuit breaker has occurred.

[0038] Preferably, the clamping surfaces of the parallel jaw cylinders 282 can also be replaced with a V-groove structure or a vacuum cup structure for clamping circuit boards 26 of different shapes or materials. The clamping jaws of the parallel jaw cylinders 282 have various specifications, and the clamping jaws of the two parallel jaw cylinders 282 are arranged opposite each other so that the distance between the clamping jaw stepped surfaces 283 of the two parallel jaw cylinders 282 can be adjusted to accommodate circuit boards 26 of different specifications. Alternatively, the two parallel jaw cylinders 282 can be moved along the Y-axis to facilitate adjustment of the distance between the clamping surfaces.

[0039] Preferably, one or a plurality of spaced step surfaces 283 are provided along the X-axis direction, and the step surface 283 is provided on the extension portion of the clamping claw of the parallel clamping cylinder 282 along the Y-axis to avoid interference between the clamping claw and the circuit board 26 .

[0040] Preferably, an elastic guide structure is provided between the female connector 285 and the L-shaped bracket 284 to compensate for slight misalignment between the male connector 261 and the female connector 285 during the plugging process.

[0041] A Z-axis slide cylinder 291 is mounted on the upper horizontal plate 29. Downward pressure ribs 292 are located on either side of the drive plate of the Z-axis slide cylinder 291. Positioning blocks 293 are fixed to the downward pressure ribs 292, which are used to press the circuit board 26 against the stepped surface 283. After the parallel jaw cylinder 282 clamps the circuit board 26, the Z-axis slide cylinder 291 drives the positioning blocks 293 downward, completely pressing the circuit board 26 against the stepped surface 283 and securing it completely. Because the downward pressure is transmitted directly to the lower horizontal plate 28 via the stepped surface 283, it is not transmitted to the square seat 24 or the six-dimensional force sensor 23, ensuring that the sensor only measures the thermal stress and contraction stress generated during the soldering process.

[0042] Preferably, the Z-axis slide cylinder 291 is of existing technology, including a movable slider for connecting the downward pressure rib 292 to drive the positioning block 293 to be pressed down or lifted, and also including a limit plate set at the top to prevent the slider from moving beyond the limit.

[0043] Preferably, the lower pressing rib 292 may be L-shaped, the vertical arm of the lower pressing rib 292 is screwed to the Z-axis slide cylinder 291 , and the vertical arm of the lower pressing rib 292 is connected to the positioning block 293 .

[0044] Preferably, the positioning block 293 includes a fixing portion and a positioning portion, the fixing portion is threadedly connected to the lower pressure rib 292, the positioning portion is a protrusion downward along the Z-axis along one end of the fixing portion away from the lower pressure rib 292, and the side wall of the positioning portion is provided with an avoidance portion for avoiding the circuit board 26 or the male head 261 of the electrical connector.

[0045] To measure the three-dimensional deformation of the circuit board 26 during the welding process, the test bench 21 is also equipped with a micrometer assembly for measuring the deformation of the circuit board 26 in the X, Y, and Z directions. The micrometer assembly includes three micrometers arranged in the X, Y, and Z directions. After the circuit board 26 is clamped, the micrometer probes contact the side or top surface of the circuit board 26. After the circuit board 26 is clamped, the micrometer probes in the X and Y directions respectively contact two adjacent side surfaces of the circuit board 26, while the micrometer probe in the Z direction contacts the top surface of the circuit board 26, with the initial reading returning to zero. During the welding process, the micrometer readings are read in real time to determine the minute displacement of the circuit board 26 in the three directions.

[0046] Specifically, the three-axis solder head assembly 5 includes a support 51 fixed to the square frame 4, on which is provided an angle adjustment platform 52 that rotates about the X-axis, on which is provided a rotary slide 53 that rotates about the Y-axis, on which is provided a rotary arm 54, on which is provided a Z-axis displacement platform 55, on which is fixed a laser 56. The support 51 serves as the basic connecting member of the entire three-axis solder head assembly 5, rigidly fixing the assembly to the square frame 4, providing a stable installation reference, and ensuring the repeatable positioning accuracy of the subsequent motion mechanism. The angle adjustment platform 52 rotates about the X-axis, which is a prior art technology and enables the laser 56 to be adjusted in the pitch direction, that is, in the up and down tilt direction, to control the incident angle of the laser beam to avoid heat concentration or reflection damage caused by vertical irradiation. The rotary slide 53 rotates about the Y-axis, achieving angular deflection of the laser 56 in the horizontal plane, i.e., swinging left and right. In conjunction with the angle adjustment stage 52, the laser beam is incident along a tangential direction of the cavity wall, facilitating evenly spreading the molten solder and reducing air holes and cold solder joints. A rotating arm 54 connects the rotary slide 53 to the Z-axis displacement platform 55. As a force and motion transmission structure, it features sufficient rigidity and a lightweight design, ensuring stable support for the laser 56 at various angles. The Z-axis displacement platform 55, based on existing technology, provides micron-level precision vertical movement of the laser 56, adjusting the distance between the laser focus and the solder joint to ensure optimal laser energy density and achieve stable, high-quality solder melting and solidification. Laser 56, acting as a heat source actuator, emits a high-energy laser beam to heat and melt the solder between the pin 25 and the through-hole of the circuit board 26, completing the electrical and mechanical connection. Integrated with a monitoring camera 561 and a temperature measurement device 562, closed-loop process control is also possible.

[0047] Preferably, the laser 56 can be a semiconductor laser or a fiber laser with a wavelength range of 808nm~980nm and an adjustable output power range of 20W~100W, which is suitable for melting welding of solder paste or solder ring. Other laser equipment can also be selected according to actual conditions.

[0048] Preferably, the angle adjustment table 52 and the rotary slide 53 are manually adjustable structures or motor-driven automatic adjustment structures, which are used to adjust the incident angle of the laser 56 so that the laser beam is focused on the welding area between the pin 25 and the circuit board 26. Manual adjustment achieves fine adjustment of the angle through a knob, dial or fine-tuning screw, which is suitable for small-batch testing in the research and development verification stage. The operator can position it based on experience or visual alignment. It is low-cost and simple to maintain, and is suitable for use scenarios with low automation requirements. The motor-driven automatic adjustment structure can use a stepper motor or a servo motor to drive the angle adjustment table 52 and the rotary slide 53, and cooperate with the control system to realize programmed setting and repeated positioning of the angle; it supports presetting multiple sets of welding angle parameters to achieve rapid switching between different product models, and can be linked with the laser 56 and the monitoring camera 561 to build a closed-loop automatic welding system.

[0049] Specifically, the laser 56 is integrated with a monitoring camera 561 and a temperature measuring device 562 for monitoring the soldering process. The monitoring camera 561 is used to obtain the solder joint image to determine whether the solder is uniform and whether there is any cold solder joint; the temperature measuring device 562 is used to detect the temperature of the welding area in real time, realize closed-loop power regulation, and ensure stable welding quality.

[0050] This setting can judge the quality of solder joints during the welding process. If an abnormality is found, an alarm will be immediately issued or welding will be terminated to avoid batch defects, improve the credibility of test data, ensure that stress and deformation measurements are based on qualified solder joints, and through temperature closed-loop control, ensure that the heat input of each welding is consistent, thereby improving the consistency and reliability of solder joints.

[0051] Specifically, the bottom of the square base 24 is connected to the six-dimensional force sensor 23 via screws. A simulated lens is also threaded onto the bottom of the square base 24 to replicate the actual product weight and connection method. This screw connection provides a rigid, removable, and highly accurate centering connection between the square base 24 and the six-dimensional force sensor 23. This ensures that all dynamic forces generated during the welding process are transmitted to the sensor without loss or offset, safeguarding the integrity and accuracy of the measurement signal and avoiding the maintenance difficulties associated with irreversible connection methods such as gluing or welding. The threaded connection offers excellent repeatability, ensuring center alignment and height consistency after each installation, improving test repeatability.

[0052] Specifically, the test bench 21 is also equipped with an environmental temperature monitoring module and an anti-vibration support structure to reduce the impact of external environmental interference on test accuracy. Its purpose is to eliminate the interference of external environmental factors on high-precision mechanical measurements. Because the laser soldering process involves a thermal-mechanical coupling effect, and components such as the six-dimensional force sensor 23 and micrometer are extremely sensitive to environmental changes, small temperature fluctuations or mechanical vibrations may cause distortion of the measurement data. When this setting is tested at different times and under different environmental conditions, if the temperature and vibration are controlled, the results are highly consistent, improving the accuracy and credibility of the test data.

[0053] The beneficial effects of this embodiment are as follows: by integrating the six-dimensional force sensor 23 and the three-axis micrometer, real-time, accurate, and multi-dimensional measurement of stress and deformation during the welding process is achieved, providing reliable data support for the design of AA soldering equipment. The "step surface clamping + independent downward pressure" structure is adopted to achieve decoupling of the clamping force and welding stress, ensuring the purity and accuracy of the test data. The introduction of the electrical connector power-on monitoring mechanism can simultaneously verify the reliability of the electrical connection during the welding process, thereby improving the comprehensiveness of the test. The three-axis solder head assembly 5 has a high degree of freedom adjustment capability, supports multi-point sequential welding and pre-calibration of process parameters, and is suitable for verification of a variety of products. The overall equipment has realized the transformation of the R&D model from "test first, then design", significantly shortening the development cycle of mass production equipment, reducing debugging costs, and improving the success rate of one-time design. It is particularly suitable for the large-scale production needs of high-precision lens modules.

[0054] A second object of the present invention is to disclose a method for using any of the above-mentioned test devices, comprising the following steps: S1: Install the circuit board 26 to be tested in the clamping mechanism and connect it to the pins 25 on the square seat 24; A real AA assembly structure is constructed, with pin 25 inserted into the through-hole to form a clearance fit, simulating the "align first, then solder" process in actual products. This ensures that the test object is a real customer product or an equivalent structure, improving the engineering representativeness of the verification results.

[0055] S2: Adjust the position by using the XZ axis precision adjustment stage 281 so that the circuit board 26 contacts the square seat 24 without pre-pressure; The circuit board 26 and the square seat 24 are aligned in a zero-stress initial state, avoiding the introduction of additional mechanical stress due to improper clamping or positioning, and ensuring that the stress measured subsequently comes only from the welding process itself.

[0056] S3: Activate the clamping mechanism to fix the circuit board 26 and connect the male connector 261 to the female connector 285; Stable clamping is achieved through the "step surface + downward pressure rib" structure, and the clamping force is not transmitted to the six-dimensional force sensor 23. After the electrical connector is turned on, the circuit on-off status can be monitored in real time to verify whether the welding thermal stress causes electrical failures such as cold welding and open circuit, thereby achieving dual mechanical and electrical verification.

[0057] S4: Start the three-axis soldering head assembly 5 to perform laser soldering, and at the same time collect stress and deformation data during the welding process through the six-dimensional force sensor 23 and the micrometer; Simulate the multi-point laser soldering process in real mass production, capable of sequential or synchronous welding, and real-time synchronous acquisition of X / Y / Z direction forces, torques, and 3D deformation variables. The data has high temporal resolution and can analyze the dynamic behavior of the welding process.

[0058] S5: Analyze data and establish a stress-deformation model to guide the design of mass production equipment.

[0059] Perform time domain, frequency domain or machine learning analysis on the collected data to identify key influencing factors, establish an empirical model or mathematical model of "welding sequence-stress distribution-deformation trend", and directly output design parameters such as clamping force setting, welding path planning, and dynamic compensation algorithm for mass production equipment.

[0060] This setting can perform standardized tests on circuit boards 26 of different thicknesses, materials, and sizes, obtain objective data through standardized processes, reduce interference from human factors, improve scientific decision-making, optimize clamping force, support structure, and welding sequence based on real data, and reduce equipment rework, part replacement, or on-site rectification due to improper design. It can also establish a "product-process-parameter" database, and new projects can quickly call historical data for design reference.

[0061] Specifically, in step S4, the solder quality is monitored in real time by monitoring the camera 561 and the temperature measuring device 562, and the laser power is adjusted according to the temperature feedback to achieve closed-loop welding control.

[0062] This closed-loop control setting ensures highly consistent heat input for each set of welds, avoiding process deviations caused by environmental fluctuations and material differences, significantly reducing defect rates such as cold welds, cold welds, and over-welding, improving the mechanical strength and electrical conductivity of solder joints, and helping to achieve visualization and traceability of the welding process.

[0063] The third purpose of the present invention is to disclose a design method for AA soldering equipment for mass production of lens modules, using any of the above-mentioned test equipment to obtain stress distribution and deformation data of different models of circuit boards 26 during the soldering process, and setting the clamping force, welding sequence, and positioning compensation parameters of the clamps in the mass production equipment based on the data.

[0064] Prior to designing mass-production AA lens module soldering equipment, this test equipment was used to measure the stress distribution and deformation of different types of circuit boards (26) during the laser soldering process. This provided a design basis for clamping force settings, soldering sequence planning, and positioning compensation algorithms for mass-production equipment. By providing a precise design basis for clamping force, soldering sequence, and compensation algorithms, this equipment addressed long-standing industry issues such as blind design, inefficient debugging, and unpredictable delivery schedules.

[0065] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A lens AA assembly and testing device based on laser soldering, characterized in that: It comprises a base plate (1) and a test assembly (2) arranged on the base plate (1); a square frame (4) is fixed to the base plate (1) via four columns (3); and three-axis solder head assemblies (5) are provided at the four inner corners of the square frame (4); The test assembly (2) includes a test bench (21), a test base (22) is provided on the test bench (21), a six-dimensional force sensor (23) is provided on the test base (22), a square seat (24) for mounting a lens is fixed on the top of the six-dimensional force sensor (23), a plurality of pins (25) are provided on the top of the square seat (24), a circuit board (26) is plugged into the pins (25), and the circuit board (26) is fixed to the test bench (21) by a clamping mechanism and maintains electrical conduction with the female head (285) of the electrical connector during the welding process.

2. The laser soldering-based lens AA assembly and testing equipment according to claim 1, characterized in that: The clamping mechanism comprises two vertical plates (27) arranged on the test bench (21), and a lower horizontal plate (28) and an upper horizontal plate (29) are arranged between the two vertical plates (27) in order from bottom to top; An XZ-axis precision adjustment platform (281) is provided on the lower horizontal plate (28), a parallel clamping cylinder (282) is provided on the XZ-axis precision adjustment platform (281), a clamping claw of the parallel clamping cylinder (282) has a step surface (283), and the circuit board (26) is clamped on the step surface (283); A Z-axis slide cylinder (291) is provided on the upper horizontal plate (29), and downward pressure ribs (292) are provided on both sides of the driving plate of the Z-axis slide cylinder (291). Positioning blocks (293) for pressing the circuit board (26) onto the step surface (283) are fixed on the downward pressure ribs (292).

3. The laser soldering-based lens AA assembly and testing equipment according to claim 2, characterized in that: An L-shaped bracket (284) is further provided on the lower horizontal plate (28), and an electrical connector female head (285) is provided on the L-shaped bracket (284), and the electrical connector female head (285) is plugged into and matched with an electrical connector male head (261) provided on the top surface of the circuit board (26); A compression spring (286) is sleeved on the outer side of the female electrical connector (285), and the compression spring (286) is used to apply a pre-tightening force to the female electrical connector (285) toward the male electrical connector (261) to maintain the electrical connection during the welding process.

4. The laser soldering-based lens AA assembly and testing equipment according to claim 1, characterized in that: The test bench (21) is also provided with a micrometer assembly for measuring the deformation of the circuit board (26) in the X, Y, and Z directions. The micrometer assembly includes three micrometers arranged along the X, Y, and Z directions, respectively. The probes of the micrometers are in contact with the side surface or the top surface of the circuit board (26) after the circuit board (26) is clamped.

5. The laser soldering-based lens AA assembly and testing equipment according to claim 1, characterized in that: The three-axis solder head assembly (5) comprises a support (51) fixed on a square frame (4); an angle adjustment platform (52) rotating about an X-axis is provided on the support (51); a rotating slide (53) rotating about a Y-axis is provided on the angle adjustment platform (52); a rotating arm (54) is provided on the rotating slide (53); a Z-axis displacement platform (55) is provided on the rotating arm (54); and a laser (56) is fixed on the Z-axis displacement platform (55).

6. The laser soldering-based lens AA assembly and testing equipment according to claim 5, characterized in that: The laser (56) is integrated with a monitoring camera (561) for monitoring the soldering process and a temperature measuring device (562), wherein the monitoring camera (561) is used to obtain a soldering point image, and the temperature measuring device (562) is used to detect the temperature of the soldering area in real time.

7. The laser soldering-based lens AA assembly and testing equipment according to claim 1, characterized in that: The pin (25) and the through hole on the circuit board (26) are clearance-fitted, so that the position of the circuit board (26) can be adjusted within a certain range relative to the square seat (24), avoiding interference between the pin (25) and the inner wall of the through hole.

8. The laser soldering-based lens AA assembly and testing equipment according to claim 1, characterized in that: The bottom of the square seat (24) is connected to the six-dimensional force sensor (23) via screws, and the bottom of the square seat (24) is also threadedly connected to a simulation lens to reproduce the actual product weight and connection method.

9. The laser soldering-based lens AA assembly and testing equipment according to claim 2, characterized in that: The XZ-axis precision adjustment table (281) is used to fine-tune the position of the parallel clamping cylinder (282) so that the circuit board (26) is not subjected to additional pressure when in contact with the square seat (24), ensuring that the six-dimensional force sensor (23) only detects stress generated during the soldering process.

10. A method for using a lens AA assembly test device based on laser soldering, characterized in that: The laser soldering-based lens AA assembly and testing device according to any one of claims 1 to 9 comprises the following steps: S1: Install the circuit board (26) to be tested in the clamping mechanism and connect it to the pins (25) on the square seat (24); S2: adjusting the position by the clamping mechanism so that the circuit board (26) contacts the square seat (24) without pre-pressure; S3: activating the clamping mechanism to fix the circuit board (26) and connect it to the female head of the electrical connector (285); S4: Start the three-axis soldering head assembly (5) to perform laser soldering, and at the same time collect stress and deformation data during the welding process through the six-dimensional force sensor (23) and the micrometer; S5: Analyze data and establish a stress-deformation model to guide the design of mass production equipment.

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