Liquid density measuring device and method and electronic equipment

Abstract

The invention discloses a liquid density measuring device and method and electronic equipment, and relates to the field of density measurement, the device comprises a metal base, a metal vibration platform, a measuring pool and a driving sensor, the measuring pool comprises a glass sealing shell, a U-shaped tube, a reference oscillation tube, a vibration acquisition sensor and a temperature acquisition device, and the U-shaped tube is used for filling measured liquid; the reference oscillation tube is not filled with liquid; the U-shaped tube, the reference oscillation tube, the vibration acquisition sensor and the temperature acquisition device are all arranged in the glass sealing shell; the measuring cell is arranged on the metal vibration platform, and the metal vibration platform is arranged on the metal base; the driving sensor is arranged in the metal base and located below the metal vibration platform, so that the metal vibration platform is conveniently driven to generate mechanical oscillation. Through the glass sealing shell, the influence of the external environment is reduced, the density is calculated at a proper temperature, synchronous oscillation of the U-shaped tube and the reference oscillation tube is ensured, density compensation is ensured, and the liquid density measurement precision is effectively improved.

Description

Technical Field

[0001] This application relates to the field of density measurement technology, and in particular to a liquid density measuring device, method and electronic device. Background Technology

[0002] Liquid density is an important parameter involved in calculations during many tests, inspections, and laboratory measurements. In some experiments with extremely harsh conditions, high-precision liquid density measurement can ensure that experimental conditions are precisely controlled.

[0003] Because the measurement of liquid density is affected by many factors, such as gas flow and air humidity, the current accuracy of liquid density measurement is relatively low. Summary of the Invention

[0004] In view of the above problems, this application provides a liquid density measuring device, method, and electronic device to improve the measurement accuracy of liquid density. The specific solution is as follows:

[0005] The first aspect of this application provides a liquid density measuring device, which includes: a metal base, a metal vibration platform, a measuring cell and a driving sensor. The measuring cell includes a glass sealing shell, a U-shaped tube, a reference oscillating tube, a vibration acquisition sensor and a temperature acquisition device. The U-shaped tube is used to fill the liquid to be measured, and the reference oscillating tube is not filled with liquid.

[0006] The U-shaped tube, the reference oscillation tube, the vibration acquisition sensor, and the temperature acquisition device are all housed in the glass sealing shell.

[0007] The measuring cell is disposed on the metal vibration platform, and the metal vibration platform is disposed on the metal base;

[0008] The drive sensor is disposed in the metal base and located below the metal vibration platform, so as to facilitate driving the metal vibration platform to generate mechanical oscillation.

[0009] In one possible implementation, the vibration acquisition sensor includes: a first vibration receiving sensor and a second vibration receiving sensor;

[0010] Both the first vibration receiving sensor and the second vibration receiving sensor are disposed in the glass sealing shell;

[0011] The first vibration receiving sensor is used to receive the oscillation signal of the U-shaped tube, and the second vibration receiving sensor is used to receive the oscillation signal of the reference oscillating tube.

[0012] In one possible implementation, the temperature acquisition device includes: a first temperature acquisition device and a second temperature acquisition device;

[0013] The first temperature acquisition device is disposed in the glass sealing shell, and the second temperature acquisition device is disposed in the metal base;

[0014] The first temperature acquisition device is used to acquire the internal temperature of the glass sealing shell, and the second temperature acquisition device is used to acquire the temperature of the metal base.

[0015] In one possible implementation, the liquid density measuring device further includes a density detection circuit;

[0016] The density detection circuit includes: a main control module, a digital-to-analog conversion module, a drive amplification module, a vibration signal acquisition module, an analog-to-digital conversion module, and a temperature acquisition module;

[0017] The main control module, the digital-to-analog conversion module, the drive amplification module, the vibration signal acquisition module, the analog-to-digital conversion module, and the temperature acquisition module are all mounted on the metal base;

[0018] The signal input terminal of the main control module is connected to the temperature acquisition module and the analog-to-digital conversion module, and the analog-to-digital conversion module is connected to the vibration signal acquisition module;

[0019] The signal output terminal of the main control module is connected to the digital-to-analog converter module, the digital-to-analog converter module is connected to the drive amplifier module, and the drive amplifier module is connected to the drive sensor.

[0020] A second aspect of this application provides a liquid density measurement method, applied to a liquid density measuring device according to the first aspect or any implementation thereof, the liquid density measurement method comprising:

[0021] During the heating process of the metal base, the first oscillation signal of the U-shaped tube and the second oscillation signal of the reference oscillation tube are collected. The U-shaped tube is filled with the liquid to be tested, while the reference oscillation tube is not filled with liquid.

[0022] Determine whether the internal temperature of the measuring cell is lower than the controlled temperature value;

[0023] If the internal temperature of the measuring cell is less than the temperature control value, the current driving signal of the driving sensor is adjusted according to the first oscillation signal to continue driving the metal vibration platform to generate mechanical oscillation, and the process returns to the step of collecting the first oscillation signal of the U-tube and the second oscillation signal of the reference oscillation tube.

[0024] If the internal temperature of the measuring cell reaches the controlled temperature value, the viscosity decay amount is determined according to the first oscillation signal, and the resonance period is calculated based on the viscosity decay amount. The elastic modulus compensation amount is calculated based on the frequency of the second oscillation signal.

[0025] The density of the tested liquid is calculated based on the resonance period and the elastic modulus compensation.

[0026] In one possible implementation, the temperature control value is the current temperature of the metal base, and determining whether the internal temperature of the measuring cell is less than the temperature control value includes:

[0027] Obtain the current temperature of the metal base and compare whether the internal temperature of the measuring cell is the same as the current temperature of the metal base.

[0028] In one possible implementation, adjusting the current drive signal of the drive sensor according to the first oscillation signal to continue driving the metal vibration platform to generate mechanical oscillations includes:

[0029] Adjust the phase of the drive signal according to the drive timing;

[0030] The amplitude of the first oscillation signal is compared with the amplitude of the initial oscillation signal of the U-tube. The amplitude of the current driving signal is amplified or reduced so that the amplitude of the current driving signal is the same as the amplitude of the initial oscillation signal, and the amplification or reduction ratio parameter is recorded.

[0031] The current drive signal, with adjusted phase and amplitude, continues to drive the metal vibration platform to generate mechanical oscillations.

[0032] In one possible implementation, determining the viscosity decay based on the first oscillation signal includes:

[0033] The viscosity decay is calculated by fitting the phase difference between the first oscillation signal and the initial oscillation signal of the U-shaped tube.

[0034] In one possible implementation, the step of fitting and calculating the density of the measured liquid based on the resonance period and the elastic modulus compensation includes:

[0035] The first parameter is calculated by fitting the elastic modulus compensation amount, and the second parameter is calculated by fitting the air density in the reference oscillation tube.

[0036] The liquid density of the tested liquid is calculated based on the resonance period, the first parameter, and the second parameter.

[0037] A third aspect of this application provides an electronic device, comprising at least one processor and a memory connected to the processor, wherein:

[0038] The memory is used to store computer programs;

[0039] The processor is used to execute the computer program so that the electronic device can implement the liquid density measurement method of the second aspect or any implementation thereof.

[0040] By employing the above technical solution, this application provides a liquid density measuring device, method, and electronic device. This device seals a U-shaped tube and a reference oscillating tube within a glass enclosure, reducing the impact of external environmental factors such as gas flow and humidity on density measurement. Since temperature also affects density measurement, this device uses a temperature acquisition device to determine the current temperature, allowing density calculation at a suitable temperature. Furthermore, this device drives a sensor to oscillate a metal vibration platform, and both the U-shaped tube and the reference oscillating tube are mounted on the same metal vibration platform, ensuring synchronous oscillation of the U-shaped tube and the reference oscillating tube, and guaranteeing compensation for the mass of the measuring cell (e.g., elastic modulus, damping state). Therefore, this device can effectively improve the accuracy of liquid density measurement. Attached Figure Description

[0041] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0042] Figure 1 This is a front view of a liquid density measuring device provided in an embodiment of this application;

[0043] Figure 2 This is a top view of a liquid density measuring device provided in an embodiment of this application.

[0044] Figure 3 This is a front view schematic diagram of another liquid density measuring device provided in the embodiments of this application;

[0045] Figure 4 This is a schematic diagram of the structure of a density detection circuit provided in an embodiment of this application;

[0046] Figure 5 A schematic flowchart illustrating a liquid density measurement method provided in an embodiment of this application;

[0047] Figure 6 This is a hardware structure block diagram of an electronic device provided in an embodiment of this application.

[0048] Figure label:

[0049] 1-Metal base, 2-Metal vibration platform, 3-Measuring pool; 4-Drive sensor, 5-Glass sealing shell, 6-U-tube, 7-Reference oscillation tube, 8-Vibration acquisition sensor; 9-Temperature acquisition device; 10-First vibration receiving sensor; 11-Second vibration receiving sensor; 12-First temperature acquisition device; 13-Second temperature acquisition device. Detailed Implementation

[0050] The embodiments of this application are described below with reference to the accompanying drawings. The terminology used in the implementation section of this application is for explaining specific embodiments only and is not intended to limit the scope of this application.

[0051] The embodiments of this application will now be described with reference to the accompanying drawings. Those skilled in the art will recognize that, with technological advancements and the emergence of new scenarios, the technical solutions provided in the embodiments of this application are equally applicable to similar technical problems.

[0052] The terms "first," "second," etc., used in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate; this is merely a way of distinguishing objects with the same attributes in the embodiments of this application. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, so that a process, method, system, product, or apparatus that comprises a series of units is not necessarily limited to those units, but may include other units not explicitly listed or inherent to those processes, methods, products, or apparatuses.

[0053] To address the aforementioned problem of low density measurement accuracy, this application provides a liquid density measuring device. The liquid density measuring device of this application embodiment will be described in detail below with reference to the accompanying drawings.

[0054] Reference Figure 1 and Figure 2 , Figure 1 This is a front view schematic diagram of a liquid density measuring device provided in an embodiment of this application. Figure 2 This is a top view schematic diagram of a liquid density measuring device provided in an embodiment of this application, as shown below. Figure 1 and Figure 2 As shown in the embodiment of this application, a liquid density measuring device may include a metal base 1, a metal vibration platform 2, a measuring cell 3, and a drive sensor 4. The measuring cell 3 includes a glass sealing shell 5, a U-shaped tube 6, a reference oscillation tube 7, a vibration acquisition sensor 8, and a temperature acquisition device 9. The U-shaped tube 6 is used to fill the liquid to be measured, and the reference oscillation tube 7 is not filled with liquid.

[0055] The U-shaped tube 6, the reference oscillation tube 7, the vibration acquisition sensor 8, and the temperature acquisition device 9 are all housed in the glass sealing shell 5.

[0056] The measuring cell 3 is mounted on the metal vibration platform 2, and the metal vibration platform 2 is mounted on the metal base 1;

[0057] The drive sensor 4 is set in the metal base 1 and located below the metal vibration platform 2, so as to facilitate the drive of the metal vibration platform 2 to generate mechanical oscillation.

[0058] The metal base serves as the foundation for the liquid density measuring device. This heavy metal base helps eliminate the transmission of vibrations from non-vibrating units caused by the driving oscillation, thus isolating resonance and supporting the metal vibration platform and the measuring cell. The metal base can be made of a metal with high thermal conductivity. A temperature control module, such as a Peltier (a semiconductor cooling device based on the Peltier effect, which can transfer heat through current to achieve cooling or heating), can be installed below the metal base. The temperature control module controls the measuring cell to reach the set temperature and maintain temperature equilibrium. When the temperature control module heats up, the metal base can rapidly transfer heat; other materials with high thermal conductivity can also be used.

[0059] A metal vibration platform can serve as a vibrating base for a measuring cell, used to fix the measuring cell in place. When the metal vibration platform vibrates, it can cause the measuring cell to vibrate.

[0060] The measuring cell is the main component for liquid density measurement. It is filled with the liquid being measured, and different liquids can have different natural / resonant frequencies. The measuring cell may include: a glass sealing shell, a U-tube, a reference oscillating tube, a vibration acquisition sensor, and a temperature acquisition device. The measuring cell may have inlet and outlet ports for injecting and discharging the liquid being measured, and these ports can be connected to the U-tube.

[0061] The glass sealing shell is used to seal and protect the internal oscillation system, ensuring that the U-tube and reference oscillation tube are not affected by damping changes caused by differences in external air density and humidity, guaranteeing the accuracy and efficiency of temperature balance, and enhancing the stability of the vibration signal frequency of the U-tube and reference oscillation tube. The cross-section of the glass sealing shell can be semi-circular, covering the metal vibration platform and partially encircling the oscillation system, with the system in direct contact with the metal platform. Alternatively, the cross-section of the glass sealing shell can be a complete circle, completely sealing the oscillation system within the shell, where the system does not directly contact the metal platform, but the glass sealing shell does.

[0062] The U-tube serves as the component for filling the liquid being measured and is the primary unit for density conversion. Different liquid densities within the U-tube result in different vibration frequencies in the U-tube's vibration signal. The reference oscillating tube, on the other hand, does not require liquid filling and is used to compensate for aging changes, environmental variations, and temperature changes in the U-tube within the measuring cell, thereby compensating for liquid density measurements. Both the U-tube and the reference oscillating tube can be mounted on a metal vibration platform, in direct contact with it. Alternatively, they can be fixed at one end to the metal vibration platform, indirect contact.

[0063] A vibration acquisition sensor can be a device for acquiring the oscillation signals of a U-tube and a reference oscillating tube. It converts the mechanical vibration signals of the U-tube and the reference oscillating tube into electrical signals. Optionally, the vibration acquisition sensor can employ electromagnetic, infrared, or other oscillation capture transducers. For example... Figure 3 As shown, in this embodiment, the vibration acquisition sensor 8 may include: a first vibration receiving sensor 10 and a second vibration receiving sensor 11. Both the first vibration receiving sensor 10 and the second vibration receiving sensor 11 are disposed in the glass sealing shell 5. The first vibration receiving sensor 10 can be used to receive the oscillation signal of the U-shaped tube 6, and the second vibration receiving sensor 11 can be used to receive the oscillation signal of the reference oscillation tube 7.

[0064] The temperature acquisition device can be a device for measuring temperature. Optionally, the temperature acquisition device can be a thermometer or a temperature sensor. When the temperature acquisition device is a temperature sensor, the temperature sensor can be a high-precision PT100 temperature sensor (a sensor based on the temperature sensitivity principle of platinum (Pt) resistance) or an NTC (Negative Temperature Coefficient) temperature sensor. Figure 3 As shown, in this embodiment, the temperature acquisition device may include a first temperature acquisition device 12 and a second temperature acquisition device 13. The first temperature acquisition device 12 may be disposed in the glass sealing shell 5 for acquiring the internal temperature of the glass sealing shell 5, and the second temperature acquisition device 13 may be disposed in the metal base for acquiring the temperature of the metal base. Of course, in another optional embodiment, the temperature in the glass sealing shell 5 may be controlled solely by the temperature acquisition device in the glass sealing shell 5.

[0065] The driving sensor can be a device for driving the U-tube and the reference oscillator to perform mechanical oscillations, and is used to convert electrical signals into mechanical oscillation signals. In this embodiment, the driving sensor can be an electromagnetic, piezoelectric ceramic, or other driving oscillation transducer. Specifically, the driving sensor is set below the metal vibration platform, and by driving the metal vibration platform to perform mechanical oscillations, it can indirectly drive the U-tube and the reference oscillator on the metal vibration platform to perform mechanical oscillations.

[0066] Both the vibration acquisition sensor and the drive sensor use transducers, which can achieve high efficiency in energy conversion and avoid energy loss during energy transfer.

[0067] Furthermore, the metal base in this embodiment may also be provided with, for example, Figure 4 The density detection circuit shown may include: a main control module, a digital-to-analog (DA) conversion module, a drive amplification module, a vibration signal acquisition module, an analog-to-digital (AD) conversion module, and a temperature acquisition module. All of these modules are mounted on a metal base.

[0068] The main control module's signal input terminal is connected to the temperature acquisition module and the analog-to-digital converter module, and the analog-to-digital converter module is connected to the vibration signal acquisition module.

[0069] The signal output terminal of the main control module is connected to the digital-to-analog converter module, the digital-to-analog converter module is connected to the drive amplifier module, and the drive amplifier module is connected to the drive sensor.

[0070] The main control module can be a DSP (Digital Signal Processing) main control module. In this embodiment, the main control module may include the following functions: acquiring the signal input from the analog-to-digital conversion module and performing phase modulation and amplitude modulation on the signal; driving the digital-to-analog conversion module to generate a drive signal; acquiring the temperature data transmitted by the temperature acquisition module and performing temperature control calculations; processing the signal and performing density, viscosity, and measurement cell state conversions; and transmitting the converted data to the host computer or interface.

[0071] The digital-to-analog conversion module can be a module that converts discrete digital signals into continuous analog signals. In this embodiment, the digital-to-analog conversion module can receive high-frequency harmonic signals sent by the main control module to generate a drive waveform to form a drive signal, and then transmit the drive signal to the drive amplification module.

[0072] The drive amplification module can be a module that boosts the signal power to a level sufficient to drive the load. In this embodiment, the drive amplification module can be built based on an operational amplifier, which can reduce the impedance of the drive signal output by the digital-to-analog converter module and increase the drive voltage of the drive signal, and transmit the amplified drive signal to the drive sensor in the metal base to control it to drive the metal vibration platform.

[0073] The vibration signal acquisition module can acquire the electrical signal converted from the mechanical oscillation signal by the vibration acquisition sensor in the measuring cell, perform filtering and shaping operations on the electrical signal, and then transmit the processed electrical signal to the analog-to-digital conversion module. Specifically, this vibration signal acquisition module can also be built based on an operational amplifier.

[0074] The analog-to-digital conversion module can be a module that converts continuous analog signals into discrete digital signals. In this embodiment, the analog-to-digital conversion module can receive electrical signals sent by the vibration signal acquisition module, convert the electrical signals into discrete voltage value signals, and transmit the discrete voltage value signals to the main control module for processing.

[0075] The temperature acquisition module can acquire temperature data from the temperature acquisition device in the liquid density measuring device and transmit the temperature data to the main control module for processing.

[0076] This application provides a liquid density measuring device that seals a U-shaped tube and a reference oscillating tube within a glass enclosure, reducing the impact of external environmental factors such as gas flow and humidity on density measurement. Since temperature also affects density measurement, this device uses a temperature acquisition device to determine the current temperature, allowing density calculation to be performed at a suitable temperature. Furthermore, the device drives a sensor to oscillate a metal vibration platform, with both the U-shaped tube and the reference oscillating tube positioned on the same platform, ensuring synchronous oscillation and compensating for the mass of the measuring cell (e.g., elastic modulus, damping state). Therefore, this device effectively improves the accuracy of liquid density measurement.

[0077] The above describes a liquid density measuring device provided by an embodiment of this application. The following describes a method for using the above-described liquid density measuring device.

[0078] Please see Figure 5 , Figure 5 This is a schematic flowchart illustrating a liquid density measurement method provided in an embodiment of this application. Figure 5 As shown, the liquid density measurement method may include the following steps:

[0079] S10. During the heating process of the metal base, the first oscillation signal of the U-shaped tube and the second oscillation signal of the reference oscillation tube are collected. The U-shaped tube is filled with the liquid to be tested, while the reference oscillation tube is not filled with liquid.

[0080] During the initialization of the liquid density measuring device, based on the noise-induced vibration principle, the analog-to-digital conversion module collects the noise at startup and transmits it as an initial signal to the main control module. The main control module controls the analog-to-digital conversion module to output a drive signal based on the initial signal. The drive amplification module amplifies the drive signal and uses it to control the drive sensor to mechanically oscillate the metal vibration platform. The vibration acquisition sensor collects the first oscillation signal of the U-shaped tube and the second oscillation signal of the reference oscillation tube and performs subsequent processing.

[0081] S11. Determine whether the internal temperature of the measuring cell is lower than the temperature control value;

[0082] S12. If the internal temperature of the measuring cell is less than the temperature control value, the current driving signal of the driving sensor is adjusted according to the first oscillation signal to continue driving the metal vibration platform to generate mechanical oscillation, and then the process returns to step S10.

[0083] S13. If the internal temperature of the measuring cell reaches the controlled temperature value, the viscosity decay amount is determined according to the first oscillation signal, and the resonance period is calculated based on the viscosity decay amount. The elastic modulus compensation amount is calculated based on the frequency of the second oscillation signal.

[0084] Steps S12 and S13 may not have a specific execution order.

[0085] The temperature control value can be a fixed temperature determined by the host computer. Due to the order of heat transfer, the metal base can reach and maintain this temperature first. Therefore, the temperature control value can also be the current temperature of the metal base. The density of the liquid being measured will only be output when the measuring cell reaches and maintains this temperature.

[0086] When the liquid density measuring device is started, the temperature control module in the metal base can be activated simultaneously. The temperature control module begins heating the metal base. The main control module receives temperature control information sent from the host computer and controls the temperature of the metal base through the temperature control module. Specifically, the first temperature acquisition device is located in the glass sealed shell of the measuring pool, and the second temperature acquisition device is located in the metal base. When the temperature control module starts heating, due to heat transfer, the second temperature acquisition device in the metal base reaches the controlled temperature first. Once the second temperature acquisition device reaches the controlled temperature, the temperature of the metal base is maintained at the controlled temperature through PID regulation. When the first temperature acquisition device in the measuring pool also reaches the controlled temperature, the liquid density measuring device can be considered to have reached temperature equilibrium. During the temperature control process, the main control module continuously calculates the density of the liquid being measured based on the acquired signals. When temperature equilibrium is reached, the main control module outputs the currently calculated density of the liquid being measured, and the density measurement ends.

[0087] Since temperature can affect the vibration frequency of the first oscillation signal of the U-tube and the second oscillation signal of the reference oscillation tube, this embodiment selects the density calculated at temperature equilibrium as the final liquid density, which can effectively reduce the influence of temperature on density measurement.

[0088] Therefore, based on the above process, determining whether the internal temperature of the measuring pool is less than the controlled temperature value can be done as follows: After obtaining the current temperature of the metal base, compare the internal temperature of the measuring pool with the current temperature of the metal base. If the internal temperature of the measuring pool is not the same as the current temperature of the metal base, it indicates that the metal base and the measuring pool have not yet reached temperature equilibrium, and the main control module continues to adjust the drive signal to oscillate the U-tube and the reference oscillating tube; if the internal temperature of the measuring pool is the same as the current temperature of the metal base, it indicates that the metal base and the measuring pool have reached temperature equilibrium, and the main control module can calculate the density of the liquid being measured based on the first oscillation signal of the current U-tube and the second oscillation signal of the reference oscillating tube, and output it to the host computer.

[0089] Of course, in another alternative embodiment, the host computer can simply collect the current temperature inside the glass sealing shell, determine whether a preset temperature control value has been reached, and adjust the temperature control through PID.

[0090] Furthermore, when the liquid density measuring device has not yet reached temperature equilibrium, the main control module continuously adjusts the next drive signal based on the currently acquired oscillation signal. Specifically, when the main control module acquires the first oscillation signal of the U-tube sent by the analog-to-digital converter module, it obtains the phase, amplitude, and frequency information of the first oscillation signal through Fourier transform and Hilbert transform. It calculates the timing required for the next drive signal and controls the phase of the next drive signal output by the digital-to-analog converter module based on this timing. It compares the amplitude of the first oscillation signal with the amplitude of the initial oscillation signal of the U-tube, amplifying or reducing the amplitude of the current drive signal to make it the same as the amplitude of the initial oscillation signal, and records the amplification or reduction ratio. The adjusted current drive signal, with adjusted phase and amplitude, continues to drive the metal vibration platform to generate mechanical oscillation, thereby acquiring the next first oscillation signal of the U-tube. The initial oscillation signal of the U-tube can be a reference signal for the oscillation signal of the U-tube during the density measurement process; this signal can be the initially acquired oscillation signal of the U-tube.

[0091] When the liquid density measuring device reaches temperature equilibrium, the main control module can determine the viscosity decay based on the first oscillation signal of the current U-tube, and calculate the resonance period based on the viscosity decay. It can also calculate the elastic modulus compensation based on the frequency of the second oscillation signal of the current reference oscillation tube.

[0092] The formula for calculating the density of the filling liquid under the same temperature conditions is as follows:

[0093] ;

[0094] in, It can represent the density of the liquid being measured; The resonance period can be represented as the time required for the vibrating tube to complete one full vibration when it reaches the resonance state. and Both can represent a constant calibrated experimentally. It can reflect the sensitivity of the vibrating tube to density changes. It can represent the equivalent density offset of the vibrating tube when it is unloaded.

[0095] Because viscous fluids can form a boundary layer on the surface of vibrating elements, hindering their movement and consuming their vibrational energy, viscosity can dampen the vibration of these elements; the higher the viscosity, the greater the damping force. Due to this damping effect, the vibrating element needs to overcome additional resistance during vibration, resulting in a delay in its vibrational motion compared to the undamped state. Therefore, viscosity can cause a hysteresis effect on the phase of the vibration signal.

[0096] Since the U-tube is filled with the liquid being measured, the viscosity of the liquid can increase the phase lag of the oscillation signal of the U-tube, leading to inaccurate resonance period. Therefore, the influence of viscosity needs to be eliminated when measuring density. Because there can be a functional relationship between the phase lag and the viscosity of the liquid being measured, this embodiment can determine the viscosity change of the liquid by measuring the phase change of the oscillation signal of the U-tube, thereby compensating for the density change in resonance period and improving the accuracy of density calculation.

[0097] During density measurement, the viscosity decay throughout the entire measurement process can be determined by analyzing the phase difference between the first oscillation signal and the initial oscillation signal from the U-tube multiple times. Specifically, in this embodiment, the viscosity decay calculated by fitting the phase difference between the first oscillation signal at temperature equilibrium and the initial oscillation signal from the U-tube is selected as the viscosity decay throughout the entire density measurement process. After obtaining the viscosity decay, the period compensation amount of the first oscillation signal can be determined based on the viscosity decay. Adding this period compensation amount to the current period of the first oscillation signal yields the resonance period of the first oscillation signal.

[0098] The elastic modulus refers to a material's ability to resist deformation during its elastic deformation phase. Since the elastic modulus can change with temperature, and this change can affect the expression in the formula... and Drift reduces the accuracy of density calculation. Since the frequency of the oscillation signal is proportional to the elastic modulus, this embodiment calculates the density when the temperature reaches equilibrium, reducing the influence of temperature on the elastic modulus. Furthermore, this embodiment introduces a reference oscillation tube made of the same material as the U-shaped tube, and uses the oscillation signal of the reference oscillation tube to achieve elastic modulus compensation for density.

[0099] In this embodiment, both the U-tube and the reference oscillating tube exhibit changes in their elastic modulus due to temperature. Since the reference oscillating tube and the U-tube are made of the same material, the temperature-dependent elastic modulus of the reference oscillating tube can offset the temperature-dependent elastic modulus of the U-tube. In addition to the temperature-dependent elastic modulus, the U-tube also exhibits an elastic modulus due to the presence of the test liquid within it. Because the reference oscillating tube is not filled with the test liquid, and the U-tube and the reference oscillating tube oscillate synchronously, this embodiment can calculate the elastic modulus compensation amount using the frequency of the second oscillation signal of the reference oscillating tube and incorporate it into the density calculation, thus achieving elastic modulus compensation for density.

[0100] S14. Calculate the density of the liquid being measured based on the resonance period and elastic modulus compensation.

[0101] In this embodiment, after obtaining the resonance period and elastic modulus compensation based on viscosity compensation, the first parameter can be calculated by fitting the elastic modulus compensation, and the second parameter can be calculated by fitting the air density in the reference oscillation tube; the main control module calculates the liquid density of the liquid being tested based on the resonance period, the first parameter, and the second parameter.

[0102] Specifically, the first parameter can be from the density calculation formula. The second parameter can be from the density calculation formula. After obtaining the elastic modulus compensation value, this embodiment can substitute the elastic modulus compensation value into a preset first fitting formula to calculate... Of course, in another optional embodiment, this embodiment can directly use the elastic modulus compensation amount to correct the density calculation formula. and .

[0103] This application provides a liquid density measurement method. The method calculates the density using the oscillation signals of a U-tube and a reference oscillating tube. Viscosity compensation is introduced through the first oscillation signal of the U-tube, and elastic modulus compensation is introduced through the second oscillation signal of the reference oscillating tube, ensuring real-time accuracy of density measurement and effectively improving the density measurement accuracy.

[0104] This application also provides an electronic device in its embodiments. (See reference...) Figure 6The diagram illustrates a structural schematic suitable for implementing the electronic device in the embodiments of this application. The electronic device in the embodiments of this application may include, but is not limited to, fixed terminals such as mobile phones, laptops, PDAs (personal digital assistants), PADs (tablet computers), desktop computers, etc. Figure 6 The electronic device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of this application.

[0105] like Figure 6 As shown, the electronic device may include a processing unit (e.g., a central processing unit, a graphics processing unit, etc.) 601, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 602 or a program loaded from a storage device 608 into a random access memory (RAM) 603. When the electronic device is powered on, the RAM 603 also stores various programs and data required for the operation of the electronic device. The processing unit 601, ROM 602, and RAM 603 are interconnected via a bus 604. An input / output (I / O) interface 605 is also connected to the bus 604.

[0106] Typically, the following devices can be connected to I / O interface 605: input devices 606 including, for example, touchscreens, touchpads, keyboards, mice, cameras, microphones, accelerometers, gyroscopes, etc.; output devices 607 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 608 including, for example, memory cards, hard drives, etc.; and communication devices 609. Communication device 609 allows electronic devices to communicate wirelessly or wiredly with other devices to exchange data. Although Figure 6 Electronic devices with various devices are shown, but it should be understood that it is not required to implement or have all of the devices shown. More or fewer devices may be implemented or have alternatively.

[0107] This application also provides a computer program product including computer-readable instructions, which, when executed on an electronic device, cause the electronic device to implement any of the liquid density measurement methods provided in this application.

[0108] This application also provides a computer-readable storage medium carrying one or more computer programs. When the one or more computer programs are executed by an electronic device, the electronic device can implement any of the liquid density measurement methods provided in this application.

[0109] It should also be noted that the device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. In addition, in the circuit embodiment drawings provided in this application, the connection relationship between modules indicates that they have a communication connection, which can be implemented as one or more communication buses or signal lines.

[0110] Through the above description of the embodiments, those skilled in the art can clearly understand that this application can be implemented by means of software plus necessary general-purpose hardware, or it can be implemented by special-purpose hardware including application-specific integrated circuits, special-purpose CPUs, special-purpose memory, special-purpose components, etc. Generally, any function performed by a computer program can be easily implemented by corresponding hardware, and the specific hardware structure used to implement the same function can also be diverse, such as analog circuits, digital circuits, or special-purpose circuits. However, for this application, software program implementation is more often the preferred implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a readable storage medium, such as a computer floppy disk, USB flash drive, mobile hard disk, ROM, RAM, magnetic disk, or optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, training equipment, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0111] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product.

[0112] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from one website, computer, training device, or data center to another website, computer, training device, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a training device or data center that integrates one or more available media. The available media may be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., DVDs), or semiconductor media (e.g., solid-state drives (SSDs)).

[0113] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the apparatus embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0114] It is understood that before using the technical solutions disclosed in the various embodiments of this disclosure, users should be informed of the types, scope of use, and usage scenarios of the personal information involved in this disclosure in an appropriate manner in accordance with relevant laws and regulations, and user authorization should be obtained.

[0115] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A liquid density measuring device, characterized in that, The liquid density measuring device includes: a metal base, a metal vibration platform, a measuring cell, and a drive sensor. The measuring cell includes a glass sealing shell, a U-shaped tube, a reference oscillation tube, a vibration acquisition sensor, and a temperature acquisition device. The U-shaped tube is used to fill the liquid to be measured, and the reference oscillation tube is not filled with liquid. The U-shaped tube, the reference oscillation tube, the vibration acquisition sensor, and the temperature acquisition device are all housed in the glass sealing shell. The measuring cell is disposed on the metal vibration platform, and the metal vibration platform is disposed on the metal base; The drive sensor is disposed in the metal base and located below the metal vibration platform, so as to facilitate driving the metal vibration platform to generate mechanical oscillation.

2. The liquid density measuring device according to claim 1, characterized in that, The vibration acquisition sensor includes: a first vibration receiving sensor and a second vibration receiving sensor; Both the first vibration receiving sensor and the second vibration receiving sensor are disposed in the glass sealing shell; The first vibration receiving sensor is used to receive the oscillation signal of the U-shaped tube, and the second vibration receiving sensor is used to receive the oscillation signal of the reference oscillating tube.

3. The liquid density measuring device according to claim 1, characterized in that, The temperature acquisition device includes: a first temperature acquisition device and a second temperature acquisition device; The first temperature acquisition device is disposed in the glass sealing shell, and the second temperature acquisition device is disposed in the metal base; The first temperature acquisition device is used to acquire the internal temperature of the glass sealing shell, and the second temperature acquisition device is used to acquire the temperature of the metal base.

4. The liquid density measuring device according to claim 1, characterized in that, The liquid density measuring device also includes a density detection circuit; The density detection circuit includes: a main control module, a digital-to-analog conversion module, a drive amplification module, a vibration signal acquisition module, an analog-to-digital conversion module, and a temperature acquisition module; The main control module, the digital-to-analog conversion module, the drive amplification module, the vibration signal acquisition module, the analog-to-digital conversion module, and the temperature acquisition module are all mounted on the metal base; The signal input terminal of the main control module is connected to the temperature acquisition module and the analog-to-digital conversion module, and the analog-to-digital conversion module is connected to the vibration signal acquisition module; The signal output terminal of the main control module is connected to the digital-to-analog converter module, the digital-to-analog converter module is connected to the drive amplifier module, and the drive amplifier module is connected to the drive sensor.

5. A method for measuring liquid density, characterized in that, The liquid density measuring device applied to any one of claims 1 to 4, wherein the liquid density measuring method comprises: During the heating process of the metal base, the first oscillation signal of the U-shaped tube and the second oscillation signal of the reference oscillation tube are collected. The U-shaped tube is filled with the liquid to be tested, while the reference oscillation tube is not filled with liquid. Determine whether the internal temperature of the measuring cell is lower than the controlled temperature value; If the internal temperature of the measuring cell is less than the temperature control value, the current driving signal of the driving sensor is adjusted according to the first oscillation signal to continue driving the metal vibration platform to generate mechanical oscillation, and the process returns to the step of collecting the first oscillation signal of the U-tube and the second oscillation signal of the reference oscillation tube. If the internal temperature of the measuring cell reaches the controlled temperature value, the viscosity decay amount is determined according to the first oscillation signal, and the resonance period is calculated based on the viscosity decay amount. The elastic modulus compensation amount is calculated based on the frequency of the second oscillation signal. The density of the tested liquid is calculated based on the resonance period and the elastic modulus compensation.

6. The liquid density measurement method according to claim 5, characterized in that, The temperature control value is the current temperature of the metal base, and determining whether the internal temperature of the measuring cell is lower than the temperature control value includes: Obtain the current temperature of the metal base and compare whether the internal temperature of the measuring cell is the same as the current temperature of the metal base.

7. The liquid density measurement method according to claim 5, characterized in that, The step of adjusting the current drive signal of the drive sensor according to the first oscillation signal to continue driving the metal vibration platform to generate mechanical oscillation includes: Adjust the phase of the drive signal according to the drive timing; The amplitude of the first oscillation signal is compared with the amplitude of the initial oscillation signal of the U-tube. The amplitude of the current driving signal is amplified or reduced so that the amplitude of the current driving signal is the same as the amplitude of the initial oscillation signal, and the amplification or reduction ratio parameter is recorded. The current drive signal, with adjusted phase and amplitude, continues to drive the metal vibration platform to generate mechanical oscillations.

8. The liquid density measurement method according to claim 5, characterized in that, The step of determining the viscosity decay based on the first oscillation signal includes: The viscosity decay is calculated by fitting the phase difference between the first oscillation signal and the initial oscillation signal of the U-shaped tube.

9. The liquid density measurement method according to claim 5, characterized in that, The method of calculating the density of the measured liquid based on the resonance period and the elastic modulus compensation includes: The first parameter is calculated by fitting the elastic modulus compensation amount, and the second parameter is calculated by fitting the air density in the reference oscillation tube. The liquid density of the tested liquid is calculated based on the resonance period, the first parameter, and the second parameter.

10. An electronic device, characterized in that, It includes at least one processor and a memory connected to the processor, wherein: The memory is used to store computer programs; The processor is used to execute the computer program to enable the electronic device to implement the liquid density measurement method as described in any one of claims 5 to 9.

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