Vacuum eutectic reflux equipment and use method thereof

Abstract

The invention relates to the technical field of semiconductor welding, and particularly discloses vacuum eutectic backflow equipment and a using method thereof.The vacuum eutectic backflow equipment comprises a glove box used for providing an inert gas environment and comprises a closed cavity, an observation window fixed to the closed cavity and operation gloves arranged on the observation window; a first material opening and a second material opening which can be opened and closed are formed in the closed cavity; the vacuum eutectic reflow furnace is arranged in the glove box, comprises a furnace body and a cover body which is arranged on the furnace body and can be opened and closed, and is used for vacuum eutectic reflow soldering of the soldering material; and the vacuum and atmosphere control module comprises a vacuum pump communicated with the furnace body and a plurality of gas circuit pipelines and is used for providing vacuum or different atmosphere environments for the furnace body of the vacuum eutectic reflow furnace. The invention can ensure that the semiconductor welding process meets the requirement of preventing small particle pollution.

Description

Technical Field

[0001] This invention relates to the field of semiconductor welding technology, and more specifically to a vacuum eutectic reflow apparatus. Background Technology

[0002] In high-end electronic manufacturing fields such as semiconductor packaging, the requirements for the welding quality between chips and substrates are extremely stringent. Traditional welding methods are carried out in ordinary atmospheric environments, and the solder joints are prone to problems such as voids and oxide contamination, which seriously affect the heat dissipation, conductivity, mechanical strength and sealing performance of the device. For example, the traditional process of bonding with conductive adhesive has the defects of high resistivity and low thermal conductivity, which will cause problems such as high microwave loss, high thermal resistance between the die and the substrate, high junction temperature and limited power output, resulting in a decline in the performance indicators and reliability of circuit components.

[0003] Vacuum eutectic reflow soldering technology has emerged to address this issue. It involves welding in a vacuum environment and introducing reducing gases (such as N2, formic acid, N2H2, H2, etc.) during the heating or cooling process. This effectively removes voids and oxides from the solder joints and improves solder joint defects.

[0004] However, existing vacuum eutectic reflow ovens still have some shortcomings: the simple vacuum environment and the introduction of reducing gas are still insufficient for some chip soldering scenarios with extremely high environmental requirements, such as some high-end semiconductor device packaging, to fully meet the requirements for preventing microparticle contamination. Summary of the Invention

[0005] In view of this, the present invention provides a vacuum eutectic reflow apparatus to ensure that the semiconductor soldering process meets the requirements for preventing microparticle contamination.

[0006] To achieve the above objectives, the basic solution of the present invention provides a vacuum eutectic reflux apparatus, comprising, A glove box for providing an inert gas environment includes a sealed cavity, an inert gas circulation module connected to the sealed cavity, an observation window fixed on the sealed cavity, and an operating glove set on the observation window. The sealed cavity has an openable and closable first material port and a second material port. A vacuum eutectic reflow furnace, built into a glove box, includes a furnace body and an openable cover mounted on the furnace body, for vacuum eutectic reflow welding of welding materials; The vacuum and atmosphere control module includes a vacuum pump connected to the furnace body and several gas pipelines, which are used to provide a vacuum or different atmosphere environment for the furnace body of the vacuum eutectic reflow furnace. The control module is electrically connected to the glove box, vacuum eutectic reflow furnace, and vacuum and atmosphere control module. It monitors and controls the glove box, vacuum eutectic reflow furnace, and vacuum and atmosphere control module according to the set parameters to complete the vacuum eutectic reflow welding of the welding material.

[0007] In one possible design, the first material inlet of the sealed cavity of the glove box is connected to an oven, and the second material inlet is connected to a transfer box.

[0008] In one possible design, the connection between the oven and the first material inlet, and the connection between the transfer box and the second material inlet, are both equipped with electrically operated doors that are electrically connected to the control module.

[0009] In one possible design, heating wires are installed on the pipe connecting the vacuum pump and the furnace body.

[0010] In one possible design, an alarm module electrically connected to the control module is also included. When a parameter exceeds a preset range or the equipment malfunctions, the alarm module issues an alarm under the control of the control module.

[0011] The present invention also provides a method of using the vacuum eutectic reflux equipment as described above, comprising the following steps: Step 1: Place the welding material into the vacuum eutectic reflow oven through the first material port of the glove box, which provides an inert gas environment. Step 2: The chip and substrate are fixed by reflow soldering, wherein the soldering material is heated and soldered in a vacuum eutectic reflow oven through multiple temperature zones with different preset temperatures to obtain the product. Step 3: Remove the product from the furnace and place it in a glove box to cool to room temperature.

[0012] In one possible design, step 2 includes, Step 21: After the welding material is placed into the furnace body, close the lid and start the vacuum pump to evacuate the furnace body. At the same time, heat the welding material to 50 degrees Celsius and then stop evacuating the vacuum. Pour nitrogen gas through the furnace for 0.3-0.5 minutes. Step 22: Maintain the welding material temperature at 50 degrees Celsius for 1.2-1.5 minutes, and continue to apply vacuum to remove oxidation during the process; Step 23: Preheat the welding material to 270 degrees Celsius over 3-5 minutes and maintain this temperature for 4-6 minutes. Then, heat the welding material to 330 degrees Celsius over 0.5-2 minutes, continuously introducing nitrogen gas during the process. Continue to maintain the welding material at 330 degrees Celsius for 1-2 minutes, during which time the vacuum pump will be activated to remove fumes. Step 24: Introduce nitrogen gas to cool down the temperature. The temperature will drop from 330 degrees Celsius to 60 degrees Celsius within 12-16 minutes.

[0013] In one possible design, in step 21, after the welding material is placed into the furnace body, the cover is closed and the vacuum pump is started to evacuate the furnace body. At the same time, the welding material is heated to 50 degrees Celsius and then the vacuuming is stopped. Nitrogen gas is then introduced for 0.4 minutes. Step 22: Maintain the welding material temperature at 50 degrees Celsius for 1.3 minutes, and continue to evacuate the vacuum to remove oxidation. After the vacuum pump stops, introduce nitrogen into the furnace. Step 23: Preheat the welding material from 50 degrees Celsius to 270 degrees Celsius within 3 minutes and maintain it for 5 minutes. Then, heat the welding material to 330 degrees Celsius within 1 minute, continuously introducing nitrogen gas during the process. Continue to maintain the welding material at 330 degrees Celsius for 1 minute, and start the vacuum pump to remove fumes during the process. Step 24: Introduce nitrogen gas to cool down the temperature, reducing it from 330 degrees Celsius to 60 degrees Celsius within 15 minutes.

[0014] In one possible design, in step 24, the nitrogen flow rate is 900 L / min; the pressure is 0.5-0.6 MPa.

[0015] In one possible design, in step 1, the pressure of the inert gas environment is maintained at 0-12 millibars.

[0016] Compared with the prior art, the present invention has the following advantages: 1. Significantly improves welding quality: Under the pure environment provided by the inert gas glove box and the synergistic effect of the advanced vacuum and atmosphere control, heating and cooling system of the vacuum eutectic reflow oven, it is possible to achieve ultra-low void ratio (<1%) or even void-free brazing, effectively removing voids and oxides in the solder joint, greatly improving the defect problem of the solder joint, significantly improving the heat dissipation and conductivity performance, mechanical strength and sealing performance of the device, meeting the extremely high requirements for welding quality in high-end semiconductor device packaging, extending the service life of the product, and improving the reliability and stability of the product.

[0017] 2. Flexible Adaptability to Diverse Process Requirements: The unique atmosphere control system can precisely provide various process atmospheres according to the requirements of different chip welding processes. Whether a reducing atmosphere is needed for reduction treatment or a non-reducing atmosphere is needed to create a protective environment, it can easily meet the requirements. This high degree of flexibility allows the equipment to be widely used in various chip packaging processes and other material handling processes with strict atmosphere requirements, expanding the application range of the equipment and improving its versatility and applicability.

[0018] 3. Optimized Production Space and Efficiency: The high integration of the vacuum eutectic reflow oven and inert gas glove box reduces the equipment's footprint and optimizes the production space layout. Simultaneously, the seamless integration and automated control of the equipment minimize manual operation and external environmental interference with the process, improving production efficiency and product quality consistency. In processes such as hermetic device packaging, this enables efficient, reliable, and stable production, reducing production costs and enhancing the company's market competitiveness.

[0019] 4. Enhanced Equipment Safety: When using reducing gases with certain hazards, such as H2, the enclosed environment of the glove box and a comprehensive gas path control and monitoring system can effectively reduce safety risks. Simultaneously, the equipment's automated control and alarm functions can promptly detect and address potential safety hazards, ensuring the safety of operators and equipment. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A perspective view of a vacuum eutectic reflux apparatus according to an embodiment of this application is shown; Figure 2 A front view of a vacuum eutectic reflux apparatus according to an embodiment of this application is shown; Figure 3 A rear view of a vacuum eutectic reflux apparatus according to an embodiment of this application is shown; Figure 4 A left view of a vacuum eutectic reflux apparatus according to an embodiment of this application is shown; Figure 5 A right view of a vacuum eutectic reflux apparatus according to an embodiment of this application is shown; Figure 6 A top view of a vacuum eutectic reflux apparatus according to an embodiment of this application is shown; Figure 7 A bottom view of a vacuum eutectic reflux apparatus according to an embodiment of this application is shown; Figure 8 A schematic diagram of the structure of a vacuum eutectic reflux furnace in a vacuum eutectic reflux apparatus according to an embodiment of this application is shown. Detailed Implementation

[0022] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these drawings, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the drawings are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0023] Explanation of reference numerals in the attached figures: Vacuum eutectic reflux equipment 1. Vacuum and atmosphere control module 2. Vacuum eutectic reflux furnace 3. Glove box 4. Drying oven 5. Vacuum pump 6. Electric opening and closing door 7. Cover 8. Operating gloves 9. Observation window 10. Transfer box 11.

[0024] First set of embodiments: like Figure 1-7 As shown, the present invention provides a vacuum eutectic reflux device 1, the basic scheme of which includes, The glove box 4 is used to provide an inert gas environment. It includes a sealed cavity, an inert gas circulation module connected to the sealed cavity, an observation window 10 fixed on the sealed cavity, and an operating glove 9 set on the observation window 10. The sealed cavity has an openable and closable first material port and a second material port. As the external main structure, the glove box 4 is made of highly airtight material to ensure the stability of the internal inert gas environment and prevent the entry of external air and impurities. The glove box 4 is equipped with an observation window 10, operating gloves 9, etc., so that operators can place materials and operate equipment without damaging the internal environment.

[0025] The vacuum eutectic reflow furnace 3, built into the glove box 4, includes a furnace body and an openable cover 8 set on the furnace body, for vacuum eutectic reflow welding of welding materials; Vacuum and atmosphere control module 2 includes a vacuum pump and several gas pipelines connected to the furnace body, used to provide vacuum or different atmosphere environments for the furnace body of vacuum eutectic reflow furnace 3; The control module is electrically connected to the glove box 4, the vacuum eutectic reflow furnace 3, and the vacuum and atmosphere control module 2. It monitors and controls the glove box 4, the vacuum eutectic reflow furnace 3, and the vacuum and atmosphere control module 2 according to the set parameters to complete the vacuum eutectic reflow welding of the welding material.

[0026] In this invention, the vacuum eutectic reflow oven 3 is entirely integrated within the glove box 4, and the two are connected by a sealed structure to ensure effective isolation and connection between the inert gas environment inside the glove box 4 and the working environment of the vacuum eutectic reflow oven 3. Under the synergistic effect of the pure environment provided by the inert gas glove box 4 and the advanced vacuum and atmosphere control, heating and cooling systems of the vacuum eutectic reflow oven 3, ultra-low void ratio (<1%) or even void-free brazing can be achieved. This effectively removes voids and oxides from the solder joints, greatly improving solder joint defects, significantly enhancing the heat dissipation, electrical conductivity, mechanical strength, and sealing performance of the device. This meets the extremely high requirements for welding quality in high-end semiconductor device packaging, extends product lifespan, and improves product reliability and stability.

[0027] This invention highly integrates the vacuum eutectic reflow furnace 3 with the inert gas glove box 4, reducing the equipment's footprint and optimizing the production space layout. Simultaneously, the tight integration and automated control between the equipment reduce manual operation and external environmental interference in the process, improving production efficiency and product quality consistency. In processes such as hermetic device packaging, it enables efficient, reliable, and stable production, reducing production costs and enhancing the company's market competitiveness.

[0028] In at least one embodiment, the vacuum eutectic reflow furnace 3 of the present invention includes, Heating system: The vacuum eutectic reflow oven 3 adopts advanced heating technology, such as infrared radiation heating principle, which can achieve a uniform heating effect, reduce the temperature difference on the PCB surface, meet the temperature uniformity requirements of different chip soldering, and at the same time have high-precision temperature control capability. The temperature control accuracy is high and can be freely adjusted at various stages of component processing to adapt to the diverse needs of different chip soldering processes in terms of heating rate, holding temperature and time. For example, the heating rate can reach 270K / min. Cooling system: To ensure rapid and uniform cooling after welding, thereby improving production efficiency and weld quality, the cooling system employs a diversified design. In addition to traditional water cooling for the heating platform, multiple cooling pipes are embedded at the bottom of the platform. The inlet of each cooling pipe is connected to a three-way valve, which in turn connects to a liquid inlet pipe (for introducing liquid cooling medium) and an air inlet pipe (for introducing gaseous cooling medium). During the cooling process, liquid or gaseous cooling media can be flexibly selected according to actual needs, or both can be used simultaneously, achieving a more efficient and flexible cooling effect.

[0029] The specific structure of other parts of the vacuum eutectic reflow furnace 3 in this application can be referred to the structure of the vacuum eutectic reflow furnace in Chinese invention patent with publication number CN118768683A.

[0030] In at least one embodiment, the first material inlet of the sealed cavity of the glove box 4 is connected to an oven 5, and the second material inlet is connected to a transfer box 11. The main function of the oven 5 is to heat, dry, cure, or heat treat the product or welding material in an inert environment that isolates it from the outside air (such as oxygen and moisture) to avoid the product or welding material from being oxidized, damp, or contaminated during the heating process. The main function of the transfer box 11 is to achieve safe and contamination-free transfer of products or welding materials, tools, and other items between the inside of the glove box 4 and the outside world while maintaining the inert environment inside the glove box 4.

[0031] Among them, the oven 5 is connected to the first material port and the transfer box 11 is connected to the second material port. Both are equipped with electric opening and closing doors 7 that are electrically connected to the control module. The electric opening and closing doors 7 are opened and closed by sliding or flipping. In this embodiment, the sliding method is used, which is achieved by cooperating with the guide rail fixed on the glove box 4.

[0032] In at least one embodiment, the vacuum and atmosphere control module 2 includes, Vacuum system: The vacuum eutectic reflow furnace 3 is equipped with a high-performance vacuum pump, which can quickly reduce the pressure inside the furnace to the required vacuum level, such as reaching an ultimate vacuum of 5E-6mbar, to meet the vacuum environment requirements of high-requirement welding processes. During the vacuuming process, a reasonable gas path design is adopted, such as passing the gas inside the cavity through the main valve, the vacuum pump, and then through a pipe with a heating wire to discharge it, preventing impurities in the gas from condensing in the pipe and affecting the performance of the vacuum system.

[0033] Atmosphere control system: It features multiple built-in gas pipelines, enabling flexible input of various atmospheres. It includes a first pipeline, a second pipeline, and a formic acid supply assembly for providing formic acid gas. The inert protective gas (such as N2) at the first inlet can flow into the formic acid supply assembly, undergo a series of reactions, and exit from the first outlet, providing a corrosive reducing atmosphere (such as a mixture of N2 and formic acid); alternatively, it can flow along the second pipeline to the second outlet, providing a non-reducing atmosphere (such as pure N2). The second inlet can be connected to a non-corrosive reducing gas (such as H2), which flows along the second pipeline to the second outlet, providing a non-corrosive reducing atmosphere (such as a mixture of 95% N2 and 5% H2). This highly integrated and flexible gas path design enables the provision of different process atmospheres according to the requirements of different chip soldering processes.

[0034] This invention's unique atmosphere control system can precisely provide various process atmospheres according to the requirements of different chip soldering processes. Whether a reducing atmosphere is needed for reduction treatment or a non-reducing atmosphere is needed to create a protective environment, it can easily meet the requirements. This high degree of flexibility allows the equipment to be widely used in various chip packaging processes and other material handling processes with strict atmosphere requirements, expanding the equipment's application range and improving its versatility and applicability.

[0035] In at least one embodiment, the control module: The glove box 4 and the vacuum eutectic reflow oven 3 are linked and automatically controlled. Through the control module, the operating parameters of the entire equipment can be uniformly set and monitored, including vacuum degree, atmosphere type and flow rate, heating temperature curve, cooling rate, etc. At the same time, it also includes an alarm module electrically connected to the control module. When a parameter exceeds the preset range or the equipment malfunctions, it can issue an alarm in time to remind the operator to handle it, ensuring the efficient, reliable and stable operation of the production process. For example, in the packaging process of hermetically sealed devices, it can meet the strict requirements for atmosphere control and realize an automated production process. The control module can be a PLC, an industrial computer or a microcontroller. In this embodiment, the control module is a microcontroller.

[0036] This invention effectively reduces safety risks when using reducing gases with certain hazards, such as H2, through the enclosed environment of the glove box 4 and a comprehensive gas path control and monitoring system. Simultaneously, the equipment's automated control and alarm functions can promptly detect and address potential safety hazards, ensuring the safety of operators and equipment.

[0037] Second set of embodiments: Example S1: The present invention also provides a method for using a vacuum eutectic reflux device, including the following steps: Step 1: The welding material is placed into the vacuum eutectic reflow oven 3 through the first material port of the glove box 4. The glove box 4 provides an inert gas environment, and the pressure of the inert gas environment is maintained at 0-12 mbar. In this embodiment, the solder can be gold-tin solder or SAC305. In this embodiment, it is gold-tin solder. Step 2: The chip and substrate are fixed by reflow soldering, wherein the soldering material is heated and soldered in a vacuum eutectic reflow oven 3 through multiple temperature zones with different preset temperatures to obtain the product. Step 3: Remove the product from the furnace and place it in the glove box 4 to cool to room temperature.

[0038] Step 2 includes, Step 21: After the welding material is placed into the furnace body, close the cover 8 and start the vacuum pump to evacuate the furnace body. At the same time, heat the welding material to 50 degrees Celsius and then stop evacuating the vacuum. Pour nitrogen gas through the furnace for 0.3 minutes. Step 22: Maintain the welding material temperature at 50 degrees Celsius for 1.2 minutes, and continue to evacuate the vacuum during the process to remove oxidation; Step 23: Preheat the welding material to 270 degrees Celsius within 3 minutes and maintain this temperature for 4 minutes. Then, heat the welding material to 330 degrees Celsius within 0.5 minutes, continuously introducing nitrogen gas during the process. Continue to maintain the welding material at 330 degrees Celsius for 1 minute, during which time the vacuum pump will be activated to remove fumes. Step 24: Introduce nitrogen gas to cool down the temperature. The temperature will drop from 330 degrees Celsius to 60 degrees Celsius within 12 minutes. The nitrogen flow rate is 900 L / min and the pressure is 0.5-0.6 MPa.

[0039] Example S2 differs from Example 1 only in that: Step 21: After the welding material is placed into the furnace body, close the cover 8 and start the vacuum pump to evacuate the furnace body. At the same time, heat the welding material to 50 degrees Celsius and then stop evacuating the vacuum. Pour nitrogen gas through the furnace for 0.4 minutes. Step 22: Maintain the welding material temperature at 50 degrees Celsius for 1.3 minutes, and continue to evacuate the vacuum to remove oxidation. After the vacuum pump stops, introduce nitrogen into the furnace. Step 23: Preheat the welding material from 50 degrees Celsius to 270 degrees Celsius within 3 minutes and maintain it for 5 minutes. Then, heat the welding material to 330 degrees Celsius within 1 minute, continuously introducing nitrogen gas during the process. Continue to maintain the welding material at 330 degrees Celsius for 1 minute, and start the vacuum pump to remove fumes during the process. Step 24: Introduce nitrogen gas to cool down the temperature, reducing it from 330 degrees Celsius to 60 degrees Celsius within 15 minutes.

[0040] Example S3 differs from Example S1 only in that: Step 21: After the welding material is placed into the furnace body, close the cover 8 and start the vacuum pump to evacuate the furnace body. At the same time, heat the welding material to 50 degrees Celsius and then stop evacuating the vacuum. Pour nitrogen gas for 0.5 minutes. Step 22: Maintain the welding material temperature at 50 degrees Celsius for 1.5 minutes, and continue to evacuate the vacuum during the process to remove oxidation; Step 23: Preheat the welding material to 270 degrees Celsius within 5 minutes and maintain this temperature for 6 minutes. Then, heat the welding material to 330 degrees Celsius within 0.5-2 minutes, continuously introducing nitrogen gas during the process. Continue to maintain the welding material at 330 degrees Celsius for 2 minutes, during which time the vacuum pump will be activated to remove fumes. Step 24: Introduce nitrogen gas to cool down the temperature, reducing it from 330 degrees Celsius to 60 degrees Celsius within 16 minutes.

[0041] Control group 1: The only difference from Example S1 is that step 1 is omitted, and the vacuum eutectic reflow oven is located in a conventional cleanroom for chip manufacturing, while the other settings are the same.

[0042] Control group 2: The only difference from Example S2 is that step 1 is omitted, and the vacuum eutectic reflow oven is located in a conventional cleanroom for chip manufacturing, while the other settings are the same.

[0043] Control group 3: The only difference from Example S3 is that step 1 is omitted, and the vacuum eutectic reflow oven is located in a conventional cleanroom for chip manufacturing, while the other settings are the same.

[0044] Following the methods of Examples S1-S3 and Control Groups 1-3, five products were produced in each group, and the average porosity of the products was tested. The results are as follows:

[0045] Conclusion: In the process conditions of Examples S1-S3, the vacuum eutectic reflow oven is entirely built into the internal space of the glove box 4, and the two are connected by a sealed structure, ensuring effective isolation and connection between the inert gas environment inside the glove box and the working environment of the vacuum eutectic reflow oven. Under the synergistic effect of the pure environment provided by the inert gas glove box and the advanced vacuum and atmosphere control, heating and cooling system of the vacuum eutectic reflow oven, ultra-low void ratio (<1%) or even void-free brazing can be achieved, effectively removing voids and oxides in the solder joints, greatly improving the defect problem of the solder joints, significantly improving the heat dissipation, conductivity, mechanical strength and sealing performance of the device, meeting the extremely high requirements for welding quality in high-end semiconductor device packaging, extending the service life of the product, and improving the reliability and stability of the product.

[0046] Meanwhile, the comparison between Examples S1-S3 and Control Groups 1-3 also shows that when the entire process of semiconductor device packaging steps 1-3 is completed in a glove box, semiconductor device products with porosity control far exceeding that of conventional processes can be obtained. The inert gas environment provided by the glove box throughout the process, combined with the special vacuum reflow soldering process of this invention, can achieve excellent porosity control.

[0047] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0048] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A vacuum eutectic reflux apparatus, characterized in that, include, A glove box for providing an inert gas environment includes a sealed cavity, an inert gas circulation module connected to the sealed cavity, an observation window fixed on the sealed cavity, and an operating glove set on the observation window. The sealed cavity has an openable and closable first material port and a second material port. A vacuum eutectic reflow furnace, built into a glove box, includes a furnace body and an openable cover mounted on the furnace body, for vacuum eutectic reflow welding of welding materials; The vacuum and atmosphere control module includes a vacuum pump connected to the furnace body and several gas pipelines, which are used to provide a vacuum or different atmosphere environment for the furnace body of the vacuum eutectic reflow furnace. The control module is electrically connected to the glove box, vacuum eutectic reflow furnace, and vacuum and atmosphere control module. It monitors and controls the glove box, vacuum eutectic reflow furnace, and vacuum and atmosphere control module according to the set parameters to complete the vacuum eutectic reflow welding of the welding material.

2. The vacuum eutectic reflux apparatus according to claim 1, characterized in that, The glove box has a first material inlet connected to an oven and a second material inlet connected to a transfer box.

3. The vacuum eutectic reflux apparatus according to claim 2, characterized in that, The oven is equipped with an electric door that is electrically connected to the control module at the connection between the oven and the first material inlet, and at the connection between the transfer box and the second material inlet.

4. A vacuum eutectic reflux apparatus according to any one of claims 1-3, characterized in that, Heating wires are installed on the pipe connecting the vacuum pump and the furnace body.

5. A vacuum eutectic reflux apparatus according to any one of claims 1-3, characterized in that, It also includes an alarm module that is electrically connected to the control module. When a parameter exceeds the preset range or the equipment malfunctions, the alarm module issues an alarm under the control of the control module.

6. A method of using the vacuum eutectic reflux apparatus as described in any one of claims 1-5, characterized in that, Includes the following steps, Step 1: Place the welding material into the vacuum eutectic reflow oven through the first material port of the glove box, which provides an inert gas environment. Step 2: The chip and substrate are fixed by reflow soldering, wherein the soldering material is heated and soldered in a vacuum eutectic reflow oven through multiple temperature zones with different preset temperatures to obtain the product. Step 3: Remove the product from the furnace and place it in a glove box to cool to room temperature.

7. The method of using a vacuum eutectic reflux apparatus according to claim 6, characterized in that, Step 2 includes, Step 21: After the welding material is placed into the furnace body, close the lid and start the vacuum pump to evacuate the furnace body. At the same time, heat the welding material to 50 degrees Celsius and then stop evacuating the vacuum. Pour nitrogen gas through the furnace for 0.3-0.5 minutes. Step 22: Maintain the welding material temperature at 50 degrees Celsius for 1.2-1.5 minutes, and continue to apply vacuum to remove oxidation during the process; Step 23: Preheat the welding material to 270 degrees Celsius over 3-5 minutes and maintain this temperature for 4-6 minutes. Then, heat the welding material to 330 degrees Celsius over 0.5-2 minutes, continuously introducing nitrogen gas during the process. Continue to maintain the welding material at 330 degrees Celsius for 1-2 minutes, during which time the vacuum pump will be activated to remove fumes. Step 24: Introduce nitrogen gas to cool down the temperature. The temperature will drop from 330 degrees Celsius to 60 degrees Celsius within 12-16 minutes.

8. A method of using the vacuum eutectic reflux apparatus as described in claim 7, characterized in that, Step 21: After the welding material is placed into the furnace body, close the lid and start the vacuum pump to evacuate the furnace body. At the same time, heat the welding material to 50 degrees Celsius and then stop evacuating the vacuum. Pour nitrogen gas through the furnace for 0.4 minutes. Step 22: Maintain the welding material temperature at 50 degrees Celsius for 1.3 minutes, and continue to evacuate the vacuum to remove oxidation. After the vacuum pump stops, introduce nitrogen into the furnace. Step 23: Preheat the welding material from 50 degrees Celsius to 270 degrees Celsius within 3 minutes and maintain it for 5 minutes, then heat the welding material to 330 degrees Celsius within 1 minute, continuously introducing nitrogen gas during the process; Continue to maintain the welding material at 330 degrees Celsius for 1 minute, and start the vacuum pump to remove fumes and dust during the process; Step 24: Introduce nitrogen gas to cool down the temperature, reducing it from 330 degrees Celsius to 60 degrees Celsius within 15 minutes.

9. A method of using the vacuum eutectic reflux apparatus as described in claim 8, characterized in that, In step 24, the flow rate of nitrogen is 900 L / min; the pressure is 0.5-0.6 MPa.

10. A method of using the vacuum eutectic reflux apparatus as described in any one of claims 7-9, characterized in that, In step 1, the pressure of the inert gas environment is maintained at 0-12 millibars.

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