Multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device

Abstract

The invention relates to a multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device which is characterized in that a plurality of semiconductor laser modules are mounted on a base, a first cooling liquid interface and a second cooling liquid interface are formed in the base, and the first cooling liquid interface is communicated to the interior of the base to form a first cooling liquid channel; the second cooling liquid interface is communicated with the interior of the base to form a second cooling liquid channel, the first cooling liquid channel and the second cooling liquid channel are respectively provided with a plurality of base through holes, and the base through holes are respectively and correspondingly communicated with the semiconductor laser modules; and the cooling liquid simultaneously enters the plurality of semiconductor laser modules for parallel shunt cooling and then flows out. Compared with the prior art, the integrated parallel-connection liquid cooling heat dissipation device gives consideration to overall heat dissipation uniformity and multi-module integration flexibility, can achieve integrated parallel-connection liquid cooling heat dissipation of a multi-module semiconductor laser, has the advantages of being compact in structure, high in heat exchange efficiency, flexible to assemble and the like, and meets the efficient heat dissipation requirement of a high-heat-flux laser system under various power levels.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of high-power electronic device thermal management, in particular to a multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device. BACKGROUND

[0002] With the wide application of semiconductor lasers in the fields of communication, industrial processing, medical treatment and military, the integration and output power of semiconductor lasers are continuously improved, which brings higher heat flux density and more stringent thermal management challenges. Especially in the integrated application of multi-module semiconductor lasers, a large amount of heat is generated by laser chips under high power density working conditions, which will seriously affect the output stability, photoelectric conversion efficiency and service life of the device if it cannot be effectively dissipated in time.

[0003] Most of the traditional liquid cooling heat dissipation structures are designed in a single module form, which is difficult to meet the integrated heat dissipation needs of multiple semiconductor laser modules in high-power intensive systems. At the same time, some traditional liquid cooling schemes have deficiencies in channel arrangement, heat dissipation uniformity and structural compactness, which can easily cause uneven distribution of cooling fluid flow field, local insufficient heat dissipation capacity, complex assembly and other problems. In addition, the micro-rib structure has been widely used in enhancing heat exchange, but the existing schemes only focus on the internal single module, lack of collaborative optimization design with multi-module integrated system, and it is difficult to balance the uniformity of fluid distribution and overall heat dissipation efficiency, which limits its popularization and application in high-power laser systems.

[0004] The existing Chinese patent CN114498284A proposes a semiconductor laser array packaging assembly, which is designed to form multiple stepped steps on the heat sink, at least one laser module is arranged on each step, and a heat dissipation piece is arranged on the heat sink and forms a heat dissipation channel corresponding to the position of the multiple steps for dissipating heat of the multiple laser modules. Although this scheme can realize the series-parallel integration of multiple laser modules, the cooling liquid cannot equally exchange heat with each laser module, resulting in uneven overall heat dissipation and low cooling efficiency. SUMMARY

[0005] The purpose of the present application is to overcome the defects of the prior art and provide a multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device, which can balance the overall heat dissipation uniformity and multi-module integration flexibility.

[0006] The purpose of the application can be realized by the following technical solutions: a multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device, comprising a base, a plurality of semiconductor laser modules are installed on the base, a first cooling liquid interface and a second cooling liquid interface are opened on the base, the first cooling liquid interface is communicated to the inside of the base to form a first cooling liquid channel, the second cooling liquid interface is communicated to the inside of the base to form a second cooling liquid channel, a plurality of base through holes are opened on the first cooling liquid channel and the second cooling liquid channel, and the base through holes are respectively communicated with the semiconductor laser modules, so that the cooling liquid simultaneously enters the plurality of semiconductor laser modules for parallel shunt cooling and then flows out.

[0007] Further, the semiconductor laser module comprises a laser shell and a cover plate connected thereto, the cover plate is located between the base and the laser shell, a module cooling liquid through hole is opened on the cover plate, and the module cooling liquid through hole is communicated with the corresponding base through hole.

[0008] Further, the first cooling liquid interface and the second cooling liquid interface are respectively connected with a joint, and the joint is connected with an external cooling system pipeline.

[0009] Further, the first cooling liquid channel and the second cooling liquid channel are arranged in parallel, and the communication corresponding relationship between the base through hole and the module cooling liquid through hole includes one-to-one, one-to-many and many-to-one, if the communication corresponding relationship between the base through hole and the module cooling liquid through hole is one-to-one, the axis of the base through hole and the corresponding module cooling liquid through hole coincides.

[0010] Further, the laser shell is provided with a plurality of arrayed micro-rib structures on the side facing the cover plate, the inside of the side of the cover plate attached to the laser shell is provided with a cover plate groove, the cover plate groove is used for avoiding the micro-rib structure on the laser shell, and the cover plate groove and the laser shell jointly define a cooling liquid flow channel, the projection of the cooling liquid flow channel in the vertical direction covers at least the whole area of the shell groove, and a plurality of micro-channels are formed between the micro-rib structures and / or between the micro-rib structures and the inner wall of the cover plate groove for the flow of the cooling liquid.

[0011] Further, the shape of the cross section of the module cooling liquid through hole and the base through hole includes a circle, an ellipse, a triangle, a rounded rectangle, a parallelogram or a polygon.

[0012] Further, the projection shape of the micro-rib structure in the vertical direction includes a rounded rectangle, a parallelogram, a circle, a triangle, an S shape, an ellipse, a water-drop-like shape or a polygon, and the three-dimensional form is a cylinder, a cone, a prism, a hemisphere or an umbrella shape.

[0013] Further, the micro-rib structure is specifically a solid structure covered with a capillary structure layer on the surface and / or bottom surface, the ratio of the thickness of the capillary structure layer to the overall thickness of the micro-rib structure is 0% to 100%, and the thickness of the capillary structure layer is greater than or equal to 0.

[0014] Further, the micro-rib structure is specifically a columnar structure or a sheet structure, and the plurality of micro-rib structures are arranged in a row or a bank arrangement.

[0015] The row arrangement refers to a regular linear arrangement of the micro-rib structures in rows and columns, which is suitable for application scenarios with limited total pressure of the cooling circuit or sensitive to energy consumption.

[0016] The bank arrangement refers to a staggered arrangement of the micro-rib structures, which is suitable for application scenarios with high local heat flux and high cooling intensity requirements.

[0017] Further, the side of the laser shell away from the cover plate is provided with a shell groove, the chip mounting platform and the optical element mounting platform are arranged in the shell groove, the optical element mounting platform is located at the side or adjacent area of the chip mounting platform, and the chip mounting platform and the optical element mounting platform both adopt a stepped structure.

[0018] Compared with the prior art, the present application has the following advantages:

[0019] The present application designs to install multiple semiconductor laser modules on the base, and opens a first cooling liquid interface and a second cooling liquid interface on the base, wherein the first cooling liquid interface is communicated to the inside of the base to form a first cooling liquid channel, the second cooling liquid interface is communicated to the inside of the base to form a second cooling liquid channel, a plurality of base through holes are opened on the first cooling liquid channel and the second cooling liquid channel, and the base through holes are respectively communicated with the semiconductor laser modules, so that the cooling liquid can enter the multiple semiconductor laser modules for parallel shunt cooling and then flow out, thereby balancing the overall heat dissipation uniformity and the flexibility of multiple module integration, and realizing the integrated parallel liquid cooling heat dissipation of multiple semiconductor laser modules.

[0020] The present application opens a module cooling liquid through hole on the cover plate of the semiconductor laser module, the module cooling liquid through hole is communicated with the corresponding base through hole, thereby being communicated with the first / second cooling liquid channel and the first / second cooling liquid interface, constructing a complete and expandable cooling liquid flow path, so that multiple semiconductor laser modules can be independently connected to the cooling liquid channel, and the overall heat dissipation uniformity is significantly improved.

[0021] The present application is provided with a plurality of arrayed micro-rib structures on the side of the laser shell facing the cover plate, and a cover plate groove is provided inside the side of the cover plate adhering to the laser shell, the cover plate groove cooperates with the micro-rib structure to form a cooling liquid flow channel area, the projection of the cooling liquid flow channel in the vertical direction completely covers the overall area of the shell groove, thereby adapting to the diversified arrangement form and heat dissipation requirement of different functional components in the shell groove, improving the versatility and adaptability of the system, in addition, a plurality of micro-channels are formed between the micro-rib structures and / or between the micro-rib structures and the inner wall of the cover plate groove, which can effectively guide the cooling liquid to flow in the space surrounded by the back of the laser shell, the micro-rib structure and the cover plate groove, and enhance the heat exchange effect.

[0022] In the present application, the cross-sectional shape of the module cooling liquid through hole and the base through hole can be circular, oval, triangular, rounded rectangular, parallelogram, trapezoidal, polygonal or other irregular shape, to adapt to different processing methods and fluid distribution requirements; the projection shape of the micro-rib structure in the vertical direction can be rounded rectangular, parallelogram, circle, triangle, S shape, oval, water drop shape, hexagon, honeycomb or other irregular polygon, and its three-dimensional shape can be a cylinder (circular cylinder, square cylinder, long strip rib), cone, prism, hemisphere or umbrella shape, or any combination of the above shapes, to simultaneously consider heat exchange efficiency and flow resistance.

[0023] In the present application, the micro-rib column is designed as a solid structure, and the outer surface, upper end surface and / or bottom surface of the micro-rib column are covered with a capillary structure, which can not only significantly expand the heat exchange contact area between the cooling liquid and the solid surface, but also guide the cooling liquid to move along the surface of the micro-rib column covered with the capillary structure by capillary action, so that the liquid can maintain continuous wetting of the cooling surface even under low flow rate or insufficient gravity conditions, thereby effectively inhibiting the occurrence of dry areas and hot spots, and improving the heat exchange capacity and operation reliability under high heat flux conditions. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0025] Figure 2 It is an exploded schematic diagram of the assembly relationship between the plurality of semiconductor laser modules and the base in the embodiment;

[0026] Figure 3 It is an exploded schematic diagram of the structure of the semiconductor laser module in the embodiment;

[0027] Figure 4 It is a schematic diagram of the structure of the laser shell front face (i.e. the side of the laser shell facing away from the cover plate) of the present application;

[0028] Figure 5Structure diagram of the back side of the laser shell (i.e. the side of the laser shell facing the cover plate) of the present application;

[0029] Figure 6 Optional structure diagram of the projected shape of the micro-rib structure in the vertical direction of the present application;

[0030] Figure 7 Structure diagram of the surrounding capillary structure layer of the micro-rib structure of the present application;

[0031] Figure 8 Structure diagram of the micro-rib structure of the present application in the form of a columnar structure in the order arrangement mode;

[0032] Figure 9 Structure diagram of the micro-rib structure of the present application in the form of a continuous sheet structure in the order arrangement mode;

[0033] Figure 10 Structure diagram of the micro-rib structure of the present application in the form of an intermittent sheet structure in the order arrangement mode;

[0034] Figure 11 Structure diagram of the front side of the cover plate (i.e. the side of the cover plate facing the laser shell) in the embodiment;

[0035] Figure 12 Structure diagram of the back side of the cover plate (i.e. the side of the cover plate facing away from the laser shell) in the embodiment;

[0036] Figure 13 Structure diagram of the base of the present application;

[0037] Figure 14 Perspective view of the base of the present application;

[0038] Figure 15 Perspective view of the back side of the base after the installation of a plurality of semiconductor laser modules of the present application;

[0039] Figure 16 Structure diagram of the first sealing element in the embodiment;

[0040] Figure 17 Structure diagram of the second sealing element in the embodiment;

[0041] The markings in the diagram are as follows: 1. Base, 2. Cover plate, 5. Laser housing, 6. Connector, 11. First coolant interface, 12. Second coolant interface, 13. Base through hole, 14. Base threaded hole, 21. Base fixing through hole, 22. Module fixing through hole, 23. Module coolant through hole, 24. Cover plate groove, 25. First sealing groove, 26. Second sealing groove, 31. First sealing element, 32. Second sealing element, 41. First screw, 42. Second screw, 51. Housing threaded hole, 52. Housing through hole, 53. Fiber optic through hole, 54. Fiber optic fixing hole, 55. Housing groove, 551. Chip mounting platform, 552. Optical component mounting platform, 56. Power-conducting element, 57. Microrib structure, 571. Capillary layer, 58. Microchannel. Detailed Implementation

[0042] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0043] Example

[0044] This embodiment proposes a parallel liquid cooling heat dissipation device for multi-module semiconductor lasers, such as... Figure 1 As shown, the system includes multiple semiconductor laser modules, a base 1, and a connector 6 mounted on the side of the base 1. The connector 6 is used for the inlet and outlet of coolant. The type of connector 6 can be flexibly selected according to the system structure and installation requirements, including pagoda connectors, quick-connect connectors, quick-tight connectors, flange connectors, or self-locking connectors. Its structural form can be straight-through, right-angle, T-type, or Y-type to meet different pipeline layout, connection strength, and space adaptation requirements. A right-angle pagoda connector is preferred. This type of connector has a simple structure, strong versatility, and a firm connection. It is suitable for various specifications of flexible hose systems, facilitating quick connection and disassembly with external cooling system pipelines. This type of connector has a rotatable structure, making it suitable for space-constrained installation environments and contributing to flexible cooling pipeline layout and compact system integration.

[0045] Each semiconductor laser module consists of a cover plate 2 and a laser housing 5 connected together. Various connection methods are used for fixing and installing the module, including threaded connections, snap-fit ​​connections, riveting connections, or welding connections, depending on structural requirements and assembly conditions. Furthermore, depending on specific application needs, structural adhesive bonding, spring pin locking, and snap ring engagement can also be used, flexibly selected based on strength, sealing performance, and assembly efficiency. The cover plate 2 and the laser housing 5 together define the structural boundaries of the semiconductor laser module and its internal liquid cooling channels.

[0046] When the snap connection is used to fix and install the cover plate 2 and the laser shell 5, the snap connection can realize quick positioning and assembly through the complementary snap tongue and slot structure at the corresponding positions of the two, and is suitable for application scenarios with high requirements for assembly convenience and modular replacement.

[0047] When the rivet connection is used to fix and install the cover plate 2 and the laser shell 5, the rivet connection is suitable for structural requirements that need to realize non-detachable and long-term stable connection, and a rivet hole can be preset at the joint of the two, and permanent mechanical connection is realized through a rivet; the rivet connection has the advantages of firm connection and strong vibration resistance, but is not conducive to later disassembly and maintenance, and is suitable for system design in which the semiconductor laser module structure is relatively stable and does not need to be frequently replaced.

[0048] When the welding connection is used to fix and install the cover plate 2 and the laser shell 5, such as laser welding, spot welding, brazing and other metal connection processes, the welding connection can realize structural integration, reduce contact thermal resistance and improve heat conduction and air tightness; the welding connection is suitable for heat dissipation occasions with higher requirements for thermal conductivity and structural sealing.

[0049] In actual application, the materials of the cover plate 2 and the laser shell 5 can be flexibly selected according to the requirements of the use environment, thermal conductivity, electrical insulation and structural strength, and the preferred materials include metal materials such as copper, aluminum, copper-aluminum alloy, aluminum alloy, stainless steel, titanium alloy and magnesium alloy, which have good thermal conductivity and processing adaptability; in order to meet special requirements such as insulation, high temperature resistance or corrosion resistance, ceramic materials such as aluminum oxide, aluminum nitride, silicon nitride and silicon carbide, or silicon-based semiconductor materials with thermal conductivity can be selected; part of the lightweight or complex structure can also be formed by engineering plastics, epoxy resin or glass and other high polymer materials.

[0050] The base 1 is the bearing basis of the parallel integrated structure of the multi-module semiconductor laser, and needs to have good thermal conductivity, mechanical strength and structural stability, and the preferred materials include metal materials with both thermal conductivity and strength, such as high-purity copper, copper alloy, aluminum alloy and stainless steel; for scenes with corrosion resistance, high strength or insulation requirements, surface ceramic coating or special metal composite material structure can also be used.

[0051] In addition, the shape and thickness of the cover plate 2 and the base 1 can be reasonably designed and optimized according to specific application requirements, layout of the semiconductor laser module and heat flux density distribution and other factors; the thickness should meet the structural strength and rigidity requirements, and take into account the thermal efficiency, system integration and weight control, so as to realize the optimization balance between space utilization, heat dissipation performance and mechanical stability, and adapt to diversified packaging forms and heat dissipation requirements.

[0052] For example, Figure 2 and Figure 3As shown, in this embodiment, the cover plate 2 and the laser shell 5 are connected by screwing, the cover plate 2 and the laser shell 5 are fastened and connected by the first screw 41, and the first sealing element 31 is arranged between the bonding interface of the two, which is used to ensure the sealing of the cooling liquid channel inside the semiconductor laser module and prevent the leakage of the cooling liquid. Each semiconductor laser module is installed and fixed on the base 1 by the second screw 42, and the second sealing element 32 is arranged between the semiconductor laser module and the base 1 to realize the sealed connection between the two, thereby constructing a complete and reliable liquid cooling circuit.

[0053] As shown in Figure 4 and Figure 5 The front surface of the laser shell 5 is provided with a shell groove 55, the shell groove 55 is provided with a chip mounting platform 551 arranged in a stepped manner on both sides, and a stepped optical element mounting platform 552 corresponding to the chip mounting platform 551 is arranged beside the chip mounting platform 551 (i.e. the side or adjacent area), the chip mounting platform 551 and the optical element mounting platform 552 cooperate with each other in height and layout; the upper surface of the chip mounting platform 551 is parallel to the upper surface of the front surface of the laser shell 5, which is used to fixedly install laser chips, and the optical element mounting platform 552 can be used to install lenses, mirrors, optical filters and other optical elements or other auxiliary functional components to realize the path adjustment of the light beam (including collimation, focusing, deflection or shaping regulation), and meet the light path requirements in different application scenarios;

[0054] The side surface of the laser shell 5 is provided with a fiber through hole 53, a fiber fixing hole 54 and a power supply element 56; the fiber through hole 53 is used to guide the laser beam emitted by the laser chip to be coupled into the optical fiber, and the fiber fixing hole 54 arranged around the fiber through hole 53 is used to fixedly install the external optical fiber component to prevent the displacement or loosening of the optical fiber during work and avoid the adverse effects on the coupling efficiency; the power supply element 56 is used to provide working voltage and driving signal for the internal elements of the laser shell 5 to ensure the normal and stable operation of the semiconductor laser module; in addition, the laser output by multiple semiconductor laser modules can be further uniformly output through specific beam focusing, superposition or power synthesis devices to meet the requirements of high power output applications.

[0055] The laser shell 5 is provided with a shell threaded hole 51 and a shell through hole 52, which are respectively used for the fixed connection with the cover plate 2 and the base 1; the shell threaded hole 51 is arranged as a threaded through hole at the edge region of the laser shell 5 to enhance the assembly strength, and the shell threaded hole 51 is preferably arranged as a threaded blind hole at the corresponding position of the shell groove 55 to avoid the interference of threaded processing on the front surface structure of the laser shell 5 and its functional elements; the shell through hole 52 is preferably arranged as a smooth through hole without threads.

[0056] The back of the laser shell 5 is provided with a plurality of arrayed micro-rib structures 57 for increasing the heat exchange area and enhancing the mixing and disturbance of the cooling liquid. The setting direction of the micro-rib structure 57 is consistent with the main flow direction of the cooling liquid, and the gap between the micro-rib structures 57 constitutes a plurality of micro-channels 58 for guiding the flow of the cooling liquid. In actual application, as shown in Figure 6 The projection shape of the micro-rib structure 57 in the vertical direction includes but is not limited to a rounded rectangle, a parallelogram, a circle, a triangle, an S shape, an oval, a water-drop-like shape or other polygons, and its three-dimensional form can be a column, a cone, a prism, a hemisphere or an umbrella-shaped structure, so as to adapt to different flow characteristics and enhance the disturbance of the cooling liquid. The S-shaped structure refers to an axis with a continuous curved shape, similar to a corrugated or serpentine shape, which can introduce complex disturbance in the flow path of the cooling liquid, i.e. introducing additional disturbance in the flow path to enhance heat exchange. The umbrella-shaped structure is a composite rib column structure with a wide top and a thin bottom. The top can be circular, rectangular, trapezoidal or oval in cross-section, and the bottom can be columnar, conical or prismatic in structure. The top and bottom can be combined in the same or different shapes, which has the functions of expanding the heat exchange surface area and guiding the flow.

[0057] As shown in Figure 7 To further improve the heat exchange performance, the micro-rib structure 57 adopts a solid structure, and the surface and / or bottom surface thereof can be covered with a capillary structure layer 571 for enhancing the wettability and capillary adsorption capacity of the liquid. The thickness h of the capillary structure layer 571 is greater than or equal to 0, the thickness of the entire micro-rib structure 57 is H, and the ratio h / H is in the range of 0-100%. In particular, when h=0, i.e. the ratio h / H is 0, the outer surface and the bottom surface of the micro-rib structure 57 are in the original smooth state, and when the ratio h / H is 100%, the micro-rib structure 57 is entirely composed of the capillary structure layer 571.

[0058] In actual application, the thickness h of the capillary structure layer 571 can be flexibly set according to the heat dissipation intensity, wettability and manufacturing process requirements. The capillary structure layer 571 can be made of metal materials, which can adopt various physical forms including but not limited to metal powder, metal wire, metal mesh and metal foam. The capillary structure layer 571 can be sintered by a single form of metal material or sintered by mixing two or more metal forms to form a capillary layer with a porous structure. The capillary structure layer 571 not only optimizes the wettability and liquid absorption rate of the cooling liquid on the surface, but also has good pore geometry stability and firmness with the micro-rib structure 57, thereby maintaining long-term effective capillary performance.

[0059] In addition, the micro-rib structure 57 can adopt a columnar structure with similar length and width of cross-sectional dimension, or a sheet structure with one side significantly longer than the other, forming a three-dimensional elongated strip. For the sheet structure, gaps can be provided in the length direction to form discontinuous ribs, or can be provided as continuous long ribs along the flow direction of the cooling liquid to guide the flow of the cooling liquid, thereby further optimizing the fluid distribution and heat transfer effect. The main difference between the columnar structure and the sheet structure lies in the aspect ratio, which is used to enhance the disturbance and turbulence of the cooling liquid flow, break the liquid boundary layer, and thus improve the convective heat transfer coefficient, thereby improving the heat dissipation performance of the entire liquid cooling heat dissipation device.

[0060] Preferably, to further improve the heat conduction efficiency, the bottom surface of the micro-rib structure 57 is as close as possible to the bottom surface of the shell groove 55 without damaging the overall structural strength and functional implementation, so as to shorten the heat transfer path, reduce the thermal resistance, and thus more effectively conduct the heat generated by the heat generating elements such as laser chips in the shell groove 55 to the liquid cooling heat exchange area, improving the overall heat dissipation performance.

[0061] The arrangement mode of the micro-rib structure 57 includes in-line or plug-in, specifically: Figure 8 and Figure 9 As shown in FIGS. 1 and 2, the in-line arrangement of the micro-rib structure 57 is a columnar structure and a continuous sheet structure, respectively. This arrangement mode has high overall regularity and is arranged in line along the main flow direction of the cooling liquid, has the advantages of convenient processing and low pressure drop, and is beneficial to reduce the pressure drop and flow resistance of the cooling liquid, and is suitable for application scenarios where the total pressure of the cooling circuit is limited or the energy consumption is sensitive. Figure 10 As shown in FIG. 3, the plug-in arrangement of the micro-rib structure 57 is a discontinuous sheet structure. In this arrangement mode, the micro-rib structures 57 of adjacent rows are staggered, which is beneficial to enhance the disturbance and mixing effect of the cooling liquid in the micro-channel 58, improve the local heat exchange strength, and is suitable for application scenarios with higher heat dissipation performance requirements, i.e., the cooling liquid can form a stronger mixing and disturbance effect in the flow process, break the boundary layer and enhance the development of turbulence, thereby significantly improving the convective heat transfer efficiency, and is especially suitable for situations with high local heat flux and high cooling strength requirements. In actual design, the arrangement mode of the micro-rib structure 57 can be flexibly selected according to the required cooling strength, pressure drop tolerance, processing cost, etc., to achieve an optimized balance between heat transfer performance and flow performance, and to improve the overall efficiency of the liquid cooling heat dissipation system.

[0062] Figure 8 , Figure 9 , Figure 10The blue arrow shown in the middle indicates the flow direction of the cooling liquid in a common working state. In other embodiments, the cooling liquid can also flow in the opposite direction or at an angle to the direction shown in the figure to adapt to different cooling systems or heat dissipation requirements. In this embodiment, the micro-rib structure 57 is a discontinuous sheet structure, the projection shape in the vertical direction is rectangular, and the whole micro-rib structure 57 is arranged in a row. The whole micro-rib structure 57 has high arrangement regularity, which is beneficial to processing and forming and reduces the flow resistance of the cooling liquid.

[0063] As shown in Figure 11 and Figure 12 The cover plate 2 is provided with a base fixing through hole 21, a module fixing through hole 22 and a module cooling liquid through hole 23. The base fixing through hole 21 is preferably a smooth through hole without threads, which is used in cooperation with the shell through hole 52 on the laser shell 5 to realize the fixed connection of the semiconductor laser module and the base 1. The module fixing through hole 22 is preferably a countersunk through hole without threads, the size, number and distribution position of which correspond to the shell threaded hole 51. The first screw 41 can pass through the module fixing through hole 22 and be screwed into the shell threaded hole 51, thereby realizing the reliable connection and fixation of the laser shell 5 and the cover plate 2. The module cooling liquid through hole 23 is used to realize the inflow and outflow of the cooling liquid into and out of the semiconductor laser module, and constitutes part of the liquid cooling heat dissipation passage. The size, number and distribution of the base fixing through hole 21 and the shell threaded hole 51 can be flexibly set according to the actual assembly requirements to balance the structural strength and installation convenience.

[0064] The front inner part of the cover plate 2 is provided with a cover plate groove 24, and a first sealing groove 25 is arranged around the periphery of the cover plate groove 24. The back of the cover plate 2 is provided with a second sealing groove 26 around the module cooling liquid through hole 23. The cover plate groove 24 is used to avoid the micro-rib structure 57 protruding on the back of the laser shell 5, and cooperates with the laser shell 5 to define the main flow passage area of the cooling liquid. The depth of the cover plate groove 24 is preferably consistent with the height of the micro-rib structure 57, so as to be in close contact with the micro-rib structure 57, thereby facilitating the installation of the cover plate 2 and ensuring the sealing and continuity of the cooling liquid passage. The projection of the cooling liquid passage area formed by the cover plate groove 24 and the micro-rib structure 57 in the vertical direction covers at least the whole area of the shell groove 55, so as to adapt to the diversified arrangement form and heat dissipation requirement of different functional components in the shell groove 55, and improve the universality and adaptability of the system.

[0065] In addition, a plurality of micro-channels 58 are formed between the micro-rib structures 57 and / or between the micro-rib structures 57 and the inner wall of the cover plate groove 24, which are used to guide the flow of the cooling liquid in the space surrounded by the back of the laser shell 5, the micro-rib structure 57 and the cover plate groove 24, thereby enhancing the heat exchange effect.

[0066] The first sealing groove 25 is used to position and accommodate the first sealing element 31 (such as an O-shaped ring). The second sealing groove 26 is used to position and accommodate the second sealing element 32 (such as a gasket).Figure 16 The first sealing groove 25 is used to position and accommodate the first sealing element 31 (as shown in FIG. 6), so as to realize effective sealing between the cover plate 2 and the laser shell 5 and prevent leakage of the cooling liquid. The depth of the first sealing groove 25 is less than the thickness of the first sealing element, so that a compression deformation is generated after the cover plate 2 and the laser shell 5 are pressed, thereby forming a reliable sealing and preventing leakage of the cooling liquid. It should be noted that in actual applications, the first sealing groove 25 can also be arranged on the laser shell 5. In order to enhance the sealing performance of the fitting interface, the first sealing groove 25 and the first sealing element 31 can be arranged when the cover plate 2 and the laser shell 5 are connected by means of buckling connection or riveting connection. If the cover plate 2 and the laser shell 5 are connected by means of welding connection, the first sealing groove 25 and the first sealing element 31 can be generally omitted because the welding connection itself has good sealing performance. However, for some application occasions in which there is a small assembly gap or the sealing performance needs to be enhanced, the sealing structure can be used in combination as appropriate to further improve the reliability.

[0067] The second sealing groove 26 is used to position and accommodate the second sealing element 32 (as shown in FIG. 7), so as to ensure that the passage between the semiconductor laser module and the base 1 has reliable sealing performance. The second sealing groove 26 is arranged around the module cooling liquid through hole 23, and the depth of the second sealing groove 26 is less than the thickness of the second sealing element 32, so as to form a reliable sealing structure after assembly and pressing. Figure 17

[0068] The materials of the first sealing element 31 and the second sealing element 32 can be selected according to the use environment, sealing level and reliability requirements, and the structural forms thereof can be O-shaped rings, rectangular sealing rings or sealing gaskets and the like. The preferred materials include elastomers such as silicone rubber, fluorosilicone rubber, fluoro rubber, ethylene-propylene-diene rubber, nitrile rubber, hydrogenated nitrile rubber, polyurethane rubber and the like, and high molecular or composite materials such as polytetrafluoroethylene, polyimide and flexible graphite and the like, so as to have heat resistance, corrosion resistance, flexibility and sealing performance.

[0069] The semiconductor laser module 5 and the base 1 can be fixed and installed by means of threaded connection or welding connection. In the embodiment, the threaded connection is adopted, as shown in FIG. 8. Figures 13-15 ​As shown, the base 1 is provided with a first cooling liquid interface 11, a second cooling liquid interface 12, a base through hole 13 and a base threaded hole 14. Among them, the first cooling liquid interface 11 and the second cooling liquid interface 12 are used to install the joint 6 to realize the inflow and outflow of the cooling liquid into the liquid cooling heat dissipation device (the cooling liquid flows into the first cooling liquid interface 11 or the second cooling liquid interface 12 through the joint 6, and then flows out from the other cooling liquid interface), the joint 6 can be directly screwed into the first cooling liquid interface 11 or the second cooling liquid interface 12 provided with threads, and the head of the joint 6 can rotate within a certain range to adapt to the installation direction and space limitation of different cooling pipelines, improve the assembly flexibility and system compatibility, in addition, in order to improve the sealing effect of the interface, the joint 6 can be used with raw material belt, threaded sealant, sealing gasket or O-ring and other sealing accessories during installation to further ensure the sealing of the cooling liquid flow path and prevent leakage. In practical application, the joint 6 between the joint and the first cooling liquid interface 11 and the second cooling liquid interface 12 can also be fixed by using various ways such as clamp connection, quick plug connection, welding connection; In some application scenarios with lower structural strength requirements or higher requirements for assembly convenience, the joint 6 can also be fixed by structural adhesive and the first cooling liquid interface 11 or the second cooling liquid interface 12, but the sealing performance and use reliability need to be considered comprehensively.

[0070] The base through hole 13 is in communication with the first cooling liquid interface 11, the second cooling liquid interface 12 and the module cooling liquid through hole 23 respectively, and the hole diameter size, number and distribution thereof maintain one-to-one correspondence with the module cooling liquid through hole 23, which can ensure that the cooling liquid flows into and out of the semiconductor laser module smoothly. Specifically, the first cooling liquid interface 11 and the second cooling liquid interface 12 extend to the inside of the base 1, form an internal cooling channel structure (i.e. first cooling liquid channel and second cooling liquid channel) and are in communication with the base through hole 13, and the base through hole 13 is in structural communication with the module cooling liquid through hole 23 provided on the cover plate 2, thereby building a complete and continuous cooling liquid flow path; the cooling liquid can enter multiple semiconductor laser modules at the same time for shunt cooling, thereby significantly reducing the overall thermal resistance and improving the heat exchange efficiency, realizing parallel shunt and efficient heat dissipation of the cooling liquid between the semiconductor laser modules.

[0071] Coolant can be one or more of the following: water, alcohols, oils, molten salt solutions, fluorinated liquids, ammonia, or hydrocarbons, or a composite coolant composed of multiple components in a certain proportion. Different cooling media have different advantages in terms of thermal conductivity, electrical insulation, volatility stability, corrosion resistance, and environmental adaptability. They can be flexibly selected based on factors such as power density, operating temperature, and maintenance cycle in specific application scenarios to improve the heat dissipation efficiency, operational reliability, and long-term stability of liquid cooling devices. Coolant can be a single-phase fluid or a two-phase cooling medium that undergoes a liquid-gas phase change during heat dissipation. Single-phase coolants have the characteristics of low flow resistance and simple system control, making them suitable for thermal management under medium to low heat flux density conditions. Two-phase coolants, on the other hand, utilize the latent heat absorption during the phase change process, achieving significant heat exchange effects with a small temperature difference, making them suitable for efficient cooling of high heat flux density or locally heated areas. Specifically, single-phase or two-phase cooling schemes can be flexibly selected based on the system heat load, heat exchange structure, and the physical properties of the coolant itself to achieve stable, efficient, and highly adaptable heat dissipation performance.

[0072] In this embodiment, to prevent the coolant from being obstructed by the local micro-rib structure 57 when flowing into or out of the semiconductor laser module, such as... Figure 3 and Figure 15 As shown, a certain distance is left between the micro-rib structure 57 and the module coolant through hole 23. On the back of the laser housing, a portion of the area located in the module coolant through hole 23 does not have the micro-rib structure 57, so that the upper surface of the area without the micro-rib structure 57 forms a cavity area between the bottom surface of the cover plate groove 24. The length of the cavity area is basically the same as the length or width of the cover plate groove 24, and the width of the cavity area is greater than the diameter of the module coolant through hole 23. This is used to construct a flow channel for the coolant to diffuse rapidly after flowing in and to converge fully before flowing out, thereby reducing local flow resistance and improving heat transfer performance.

[0073] In practical applications, the module coolant through-hole 23 can be located at the midpoint of both ends or diagonally in the corresponding area of ​​the cover plate groove 24; when the module coolant through-hole 23 is located at a symmetrical position at the midpoint of both ends, a gradually expanding structure is preferably provided on the side of the cover plate 2 near the micro-rib structure 27 to increase the distribution range of the inlet and outlet coolant; in this embodiment, the module coolant through-hole 23 is located diagonally in the cover plate groove 24 (e.g., Figure 11 and Figure 12 As shown in the figure, an ideal flow buffer zone can be formed without the need for an additional gradually expanding structure, thereby simplifying the structural design while optimizing the uniformity of coolant distribution.

[0074] It should be noted that the second sealing groove 26 can also be provided around the base through hole 13.

[0075] In practical applications, the number relationship between the base through hole 13 and the module cooling liquid through hole 23 can be one-to-one, one-to-many or many-to-one; wherein, in the case of one-to-one setting, the axis of the base through hole 13 and the corresponding module cooling liquid through hole 23 is preferably coincident to ensure that the cooling liquid flows into or out of the corresponding semiconductor laser module efficiently and smoothly. In addition, the cross-sectional shape of the module cooling liquid through hole 23 and the base through hole 13 can be circular, oval, triangular, rounded rectangular, parallelogram or other polygonal form to adapt to different cooling liquid flow requirements and processing process requirements.

[0076] The size, number and distribution of the base threaded hole 14 correspond to the base fixing hole 21 and the shell through hole 52. When installed, the second screw 42 passes through the shell through hole 52 on the laser shell 5 and the base fixing hole 21 on the cover plate 2 in turn, and is screwed into the base threaded hole 14 on the base, realizing firm connection and reliable sealing between the semiconductor laser module and the base 1.

[0077] The shell through hole 52 and the base fixing hole 21 are preferably through holes without threads, and the base threaded hole 14 can be a threaded through hole or a threaded blind hole. The shell through hole 52, the base fixing hole 21 and the base threaded hole 14 are one-to-one corresponding, and the number, size and specific arrangement of the above hole positions can also be flexibly set and adjusted according to actual structure layout, number of semiconductor laser modules and assembly space, etc. to adapt to the integration needs of semiconductor laser modules of different specifications.

[0078] When the semiconductor laser module 5 and the base 1 are connected by welding, the semiconductor laser module and the base 1 can be directly welded and fixed to realize firm connection. Welding connection usually does not need to set the second sealing groove 26 and the second sealing element 32, and is suitable for application scenarios with higher requirements for sealing performance or the need to improve the overall strength of the structure.

[0079] In addition, in specific application scenarios, in order to prevent electrical short circuit or potential interference between the semiconductor laser module and the base 1, an insulating structure or insulating layer can be provided therebetween; the insulation treatment method can be selected according to actual use requirements, such as heat-conducting insulating gasket, heat-conducting ceramic sheet, polyimide film, heat-conducting silicone gasket, flexible graphite insulating layer or surface coating insulating paint; the insulating layer has good electrical insulation performance and also considers the heat conduction capacity to ensure the heat dissipation efficiency and electrical safety of the semiconductor laser module, and is suitable for multi-module parallel integration, high power density and high electrical isolation requirement thermal management system.

[0080] The heat dissipation device can be integrated with an external control system, such as a speed regulator, a temperature controller, a liquid pump control module or a flow monitoring device, to realize real-time monitoring and intelligent adjustment of the flow rate, temperature and running state of the cooling liquid, thereby improving the running efficiency, stability and safety of the overall heat dissipation system and meeting the dynamic thermal management requirements under complex working conditions.

[0081] In summary, the present application integrates a micro-rib structure with a turbulence effect on the laser shell of a semiconductor laser module, forms a closed micro-channel with the cover plate and the base, organizes and guides the flow of cooling liquid, and significantly improves the heat exchange efficiency. On the other hand, through the modular structure and the communication design between the module cooling liquid through hole on the cover plate, the base through hole on the base and the cooling liquid interface, a continuous and expandable parallel cooling flow path is constructed, which takes into account the flexibility of heat dissipation performance and multi-module integration.

[0082] Among them, the three-terminal flow path design of the module cooling liquid through hole, the base through hole and the cooling liquid interface makes multiple semiconductor laser modules can be independently connected to the cooling liquid channel, which significantly improves the overall heat dissipation uniformity. At the same time, since the number and layout of semiconductor laser modules can be adjusted, the heat dissipation device has good integration flexibility and system expandability, and is suitable for the thermal management integration requirements of multi-module high-power laser systems.

[0083] The micro-rib structure designed inside each semiconductor laser module can effectively disturb the flow of cooling liquid, break the boundary layer and improve the convective heat transfer coefficient, thereby realizing efficient heat dissipation on a single module scale and helping to maintain the temperature stability of the laser chip under high-power operating conditions.

[0084] In addition, the cover plate and the laser shell, the semiconductor laser module and the base are connected by various connection methods such as threaded connection and welding connection, which can adapt to the structural strength and assembly convenience requirements in different application scenarios. The sealing groove and sealing element arranged in cooperation can ensure the sealing of the cooling liquid channel, effectively prevent leakage and improve the system running stability.

[0085] The present application realizes a high-efficiency, compact and reliable liquid cooling heat dissipation device for integrated multi-module semiconductor lasers through the above structural optimization design and cooling path arrangement, has excellent adaptability and universality, can be widely used in the thermal management requirements of various high-power electronic devices, and has good application prospect and promotion value.

Claims

1. A multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device, characterized in that, Includes a base (1), on which multiple semiconductor laser modules are mounted. The base (1) has a first coolant interface (11) and a second coolant interface (12). The first coolant interface (11) is connected to the inside of the base (1) to form a first coolant channel, and the second coolant interface (12) is connected to the inside of the base (1) to form a second coolant channel. Multiple base through holes (13) are provided on both the first and second coolant channels. The base through holes (13) are respectively connected to the semiconductor laser modules, so that the coolant can simultaneously enter multiple semiconductor laser modules for parallel cooling and then flow out.

2. The multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device according to claim 1, characterized in that, The semiconductor laser module includes a laser housing (5) and a cover plate (2) connected thereto. The cover plate (2) is located between the base (1) and the laser housing (5). A module coolant through hole (23) is provided on the cover plate (2), and the module coolant through hole (23) is connected to the corresponding base through hole (13).

3. The multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device according to claim 1, characterized in that, The first coolant inlet (11) and the second coolant inlet (12) are respectively connected to a connector (6), which is connected to the external cooling system pipeline.

4. The multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device according to claim 2, characterized in that, The first coolant channel and the second coolant channel are arranged in parallel. The connection relationship between the base through hole (13) and the module coolant through hole (23) includes one-to-one, one-to-many, and many-to-one. If the base (1) through hole and the module coolant through hole (23) are in a one-to-one connection relationship, then the axes of the base through hole (13) and the corresponding module coolant through hole (23) coincide.

5. The multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device according to claim 2, characterized in that, The laser housing (5) has a plurality of microrib structures (57) arranged in an array on the side facing the cover plate (2). The cover plate (2) has a cover plate groove (24) inside the side that fits with the laser housing (5). The cover plate groove (24) is used to avoid the microrib structures (57) on the laser housing (5) and together with the laser housing (5) defines a coolant flow channel. The projection of the coolant flow channel in the vertical direction at least covers the entire area of ​​the housing groove (55). The microrib structures (57) together and / or the microrib structures (57) and the inner wall of the cover plate groove (24) form a plurality of microchannels (58) for coolant flow.

6. The multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device according to claim 5, characterized in that, The cross-sectional shapes of the module coolant through hole (23) and the base through hole (13) include circles, ellipses, triangles, rounded rectangles, parallelograms or polygons.

7. The multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device according to claim 5, characterized in that, The projection shape of the microrib structure (57) in the vertical direction includes rounded rectangle, parallelogram, circle, triangle, S-shape, ellipse, teardrop shape or polygon, and its three-dimensional form is column, cone, frustum, hemisphere or umbrella shape.

8. The multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device according to claim 5, characterized in that, The microrib structure (57) is specifically a solid structure with a capillary layer (571) covering its surface and / or bottom surface. The ratio of the thickness of the capillary layer (571) to the overall thickness of the microrib structure (57) is 0% to 100%, and the thickness of the capillary layer (571) is greater than or equal to 0.

9. A multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device according to claim 5, characterized in that, The microrib structure (57) is specifically a columnar structure or a sheet-like structure, and the multiple microrib structures (57) are arranged in a sequential or interleaved manner; Among them, the sequential arrangement refers to the regular linear arrangement of the micro-rib structures (57) in rows and columns, which is suitable for application scenarios where the total pressure of the cooling circuit is limited or energy consumption is sensitive. The interlocking arrangement refers to the staggered arrangement of micro-rib structures (57), which is suitable for application scenarios with high local heat flux density and high cooling intensity requirements.

10. A multi-module semiconductor laser integrated parallel liquid cooling heat dissipation device according to claim 2, characterized in that, The laser housing (5) has a housing groove (55) on the side facing away from the cover plate (2). A chip mounting platform (551) and an optical component mounting platform (552) are provided in the housing groove (55). The optical component mounting platform (552) is located on the side or adjacent to the chip mounting platform (551). Both the chip mounting platform (551) and the optical component mounting platform (552) adopt a stepped structure.

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