Wafer cleaning device based on ultrasonic cleaning

Abstract

The invention discloses a wafer cleaning device based on ultrasonic cleaning, and relates to the technical field of wafer cleaning devices. Comprising a cleaning machine outer tank body, a wafer cleaning glass tank, an ultrasonic cleaning tank, an ultrasonic device, a bottom plate, a housing, a cleaning tank rail, a flow dividing water supply device and a bubble removing uniform vibration device, ultrapure water serves as a medium, ultrasonic vibration is effectively conducted to the wafer cleaning glass tank, a strong acid solution in the tank is driven to uniformly vibrate, and efficient cleaning of wafers is achieved. High turbulence pulsation and local shearing stress are formed at the junction of oblique water replenishing and the stock solution, large bubbles are sheared into small bubbles, bubble gathering is prevented, and the liquid purity and the ultrasonic cleaning efficiency are improved. Under the centrifugal separation action of the rotational flow connecting base and the annular rotational flow piece, bubbles in water flow are concentrated in the center position, ultrapure water on the outer side is rapidly discharged, the bubbles are efficiently absorbed after making contact with the hydrophobic porous membrane, and the bubble removing effect is remarkably improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer cleaning device, and particularly relates to a wafer cleaning device based on ultrasonic cleaning. BACKGROUND

[0002] The ultrasonic wafer cleaning equipment is a key device for removing the particles, metal ions, photoresist residues and chemical by-products on the wafer surface in the semiconductor manufacturing process, and the cleaning effect directly affects the yield and the finished product rate of the subsequent photoetch, etching and deposition core processes. With the continuous reduction of the chip line width, any slight pollution on the wafer surface may cause circuit defects or even functional failure, therefore, the modern wafer cleaning equipment not only requires high efficiency, uniformity and low damage cleaning capacity, but also needs to maintain stable operation in different chemical environments such as strong acid, strong alkali or ultrapure water.

[0003] In the ultrasonic wafer cleaning process, since the wafer cleaning tank is a glass container, if the ultrasonic wave directly acts on the glass, local stress concentration is easily caused and the glass is broken; meanwhile, the air entrained by the supplemented and circulated ultrapure water produces bubbles, and these bubbles are unstable under the ultrasonic vibration and may be violently burst, which not only has the risk of damaging the glass container, but also reduces the contact area of the ultrapure water and the glass, weakens the vibration conduction effect and causes incomplete cleaning. SUMMARY

[0004] The present application aims to provide a wafer cleaning device based on ultrasonic cleaning to solve the problems in the prior art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a wafer cleaning device based on ultrasonic cleaning, comprising a cleaning machine outer tank body and an ultrasonic cleaning tank, the ultrasonic cleaning tank is provided with cleaning tank supporting legs at the bottom, the cleaning tank supporting legs are installed in the cleaning machine outer tank body, a bottom plate is installed on the ultrasonic cleaning tank, an ultrasonic device is installed on the ultrasonic cleaning tank, a cover is installed on the bottom plate, the cover is connected with the ultrasonic cleaning tank, cleaning tank tracks are symmetrically installed on the bottom plate, a wafer cleaning glass tank is installed on the cleaning tank tracks, a shunt water supply device is further installed in the ultrasonic cleaning tank, and a bubble removing and vibration uniformizing device is installed on the shunt water supply device.

[0006] The wafer cleaning glass tank is filled with a strong acid solution, and the strong acid solution is used for cleaning the wafer. The cleaning machine outer tank body and the wafer cleaning glass tank are filled with ultrapure water. The wafer cleaning device is connected with a control cabinet, and the control cabinet is used for controlling the operation of the entire wafer cleaning device.

[0007] During cleaning, the control system starts the ultrasonic device, the ultrasonic device generates vibration, the vibration is transmitted to the wafer cleaning glass tank through ultrapure water, the wafer cleaning glass tank drives the internal strong acid solution to vibrate and clean the wafer. The control system supplies water to the water distribution device through the water supply equipment, the replenished ultrapure water is evenly distributed to the inclined water outlet, the distributed ultrapure water enters the corresponding cyclone connecting seat and the bubble removing uniform vibration head, and the treated ultrapure water is discharged into the ultrasonic cleaning tank and then into the outer tank body of the cleaning machine, so that the purpose of continuously replenishing the consumed ultrapure water is achieved.

[0008] Further, the water distribution device comprises a water supply shell, the water supply shell is installed in the ultrasonic cleaning tank, the water supply shell is provided with a water inlet, the water supply shell is provided with a distribution cavity, the water supply shell is provided with a plurality of inclined water outlets at the top end, the inclined water outlets are communicated with the distribution cavity, and the water supply shell is provided with a bubble removing uniform vibration device, and the bubble removing uniform vibration device is communicated with the inclined water outlets.

[0009] The water inlet is connected with the water supply equipment, the water supply equipment is used for replenishing ultrapure water into the distribution cavity through the water inlet, the replenished ultrapure water is evenly distributed to the inclined water outlets, the distributed ultrapure water enters the corresponding cyclone connecting seat and the bubble removing uniform vibration head, and the treated ultrapure water is discharged into the ultrasonic cleaning tank and then into the outer tank body of the cleaning machine.

[0010] Further, the inclined water outlets are arranged in an inclined manner.

[0011] The inclined water outlets cooperate with the inclined cyclone connecting seat and the bubble removing uniform vibration head, so that the water flow can enter the outer tank body of the cleaning machine in an inclined manner. When the inclined replenished water contacts the original liquid, a transition area with a speed changing from fast to slow and a direction changing will appear at the interface of them, high turbulent pulsation and local shear stress are generated in the area, bubbles can be effectively torn, large bubbles are sheared and broken into small bubbles, and the aggregation of bubbles is avoided.

[0012] Further, the bubble removing uniform vibration device comprises a plurality of cyclone connecting seats and a transmission tooth belt, the cyclone connecting seats are installed on the water supply shell, the cyclone connecting seats are communicated with the inclined water outlets, the bubble removing uniform vibration heads are rotatably installed on the cyclone connecting seats, a connecting shell is installed on the cyclone connecting seat, a driving motor is installed on the connecting shell, a driving gear is installed on the output shaft of the driving motor, the transmission tooth belt is engaged with the plurality of bubble removing uniform vibration heads for transmission, and the transmission tooth belt is engaged with the driving gear for transmission.

[0013] The inner circle of the transmission tooth belt is engaged with the transmission gear for transmission, and the outer circle of the transmission tooth belt is engaged with the driving gear for transmission.

[0014] During water supply, the control system starts the driving motor, the motor output shaft drives the driving gear to rotate, the driving gear drives the transmission gear belt to rotate, the transmission gear belt drives the defoaming and uniform vibration rotating head to rotate through the driven gear. The shunt shell rotates, and the water outlet on the shunt shell continuously discharges water during rotation, continuously changes the direction and speed of the ultrapure water, and makes the added ultrapure water form a continuously changing propagation path in the original liquid, thereby generating a disturbance effect. The continuous disturbance of the liquid changes the propagation path of the ultrasonic wave in the liquid synchronously, thereby avoiding the formation of a stable standing wave of the fixed sound wave in the square cleaning pool, making the vibration around the wafer cleaning glass tank change continuously and more uniformly, avoiding local stress concentration around the glass and even glass breakage, and preventing uneven cleaning.

[0015] Further, the defoaming and uniform vibration rotating head comprises a shunt shell, the shunt shell is rotatably installed on the rotating flow connecting seat, a defoaming inner shell is installed in the shunt shell, a rotating joint is rotatably installed on the defoaming inner shell, a sliding detection plug is slidably installed in the defoaming inner shell, a membrane holder is installed on the defoaming inner shell, a plurality of hydrophobic porous membranes are installed on the membrane holder, and a pressure sensor is installed on the side of the sliding detection plug close to the membrane holder.

[0016] The rotating joint is connected with a pressure control device, and the pressure control device is used for pressurizing or depressurizing the inside of the defoaming inner shell through the rotating joint. The hydrophobic porous membrane is used for allowing air to pass through and blocking ultrapure water.

[0017] During water supply, the pressure control device depressurizes the adjusting area between the rotating joint and the sliding detection plug in the defoaming inner shell, the negative pressure makes the sliding detection plug slide in the defoaming inner shell towards the rotating joint, after the sliding detection plug slides, the collection area between the sliding detection plug and the hydrophobic porous membrane is vacuumized, the control system controls the moving distance of the sliding detection plug through the electric signal transmitted by the pressure sensor, and a moderate negative pressure is generated in the collection area, so that the air bubbles in contact with the hydrophobic porous membrane can be accelerated to be sucked in.

[0018] During maintenance, the ultrapure water in the outer tank body of the cleaning machine is discharged, then the pressure control device pressurizes the adjusting area, the sliding detection plug reversely slides, and the collected air is discharged.

[0019] Further, an anti-blocking needle is further installed on the membrane holder, and the anti-blocking needle penetrates through the rotating flow connecting seat, the inclined water outlet and enters the shunt cavity.

[0020] After the anti-blocking needle penetrates through the rotating flow connecting seat and the inclined water outlet, the needle tip of the anti-blocking needle enters the shunt cavity. When a large air bubble appears to block the hole between the shunt cavity and the inclined water outlet, the rotating needle tip can break the air bubble.

[0021] Further, a plurality of staggered water outlets are arranged on the shunt shell, a transmission gear is installed on the shunt shell, and the transmission gear is in meshing transmission with the transmission gear belt.

[0022] Further, the swirl connecting seat is provided with a plurality of swirl vanes, and the swirl connecting seat is provided with a swirl cavity, which is communicated with the oblique water outlet, and the plurality of swirl vanes are arranged around the swirl cavity.

[0023] When the ultrapure water enters the swirl connecting seat from the oblique water outlet, the ultrapure water is in contact with the annularly arranged swirl vanes, and the ultrapure water is rotated under the action of the swirl vanes, and the centrifugal force is generated by the rotation of the water flow, and the ultrapure water in the water flow is controlled to move outward due to the large mass, and the bubbles in the water flow gradually move to the center of the water flow, and when the water flow enters the shunt shell, the water flow on the outside is quickly introduced into the area between the bubble removing inner shell and the shunt shell, and is discharged from the water uniformizing outlet, and the bubbles in the center of the water flow are in contact with the hydrophobic porous membrane on the membrane frame at the front end of the bubble removing inner shell, and the hydrophobic porous membrane absorbs the bubbles in contact with the bubbles, so that the bubble absorption effect is achieved.

[0024] Compared with the prior art, the beneficial effects of the present application are: 1. By using ultrapure water as a medium, ultrasonic vibration is effectively transmitted to the wafer cleaning glass tank, and the strong acid solution in the tank is uniformly vibrated, so that efficient cleaning of the wafer is achieved. The continuous replenishment of ultrapure water loss is realized by the water conveying equipment and the shunt water supply device, so that the water level of the cleaning machine outer tank and the ultrasonic cleaning tank can always be maintained at an appropriate level, reducing manual intervention and saving resources.

[0025] 2. The oblique water outlet and the rotational disturbance of the shunt shell break the fixed sound wave propagation path in the liquid, avoid the formation of standing waves, make the vibration around the glass tank change continuously and uniformly, reduce the risk of local stress concentration and glass rupture, and prevent uneven cleaning. When a large bubble appears between the shunt cavity and the oblique water outlet, the rotating needle tip can break the bubble.

[0026] 3. The centrifugal separation effect of the swirl connecting seat and the annular swirl vane makes the bubbles in the water flow concentrate in the center position, and the ultrapure water on the outside is quickly discharged, and after the bubbles come into contact with the hydrophobic porous membrane, they are efficiently absorbed, significantly improving the bubble removal effect.

[0027] 4. The oblique water replenishment forms high turbulent pulsation and local shear stress at the junction with the original liquid, shearing large bubbles into small bubbles, preventing bubble aggregation, and improving the purity of the liquid and the efficiency of ultrasonic cleaning.

[0028] 5. The pressure control device adjusts the pressure in the area to control the movement distance of the sliding detection plug, accelerates the bubble absorption by using moderate negative pressure, and improves the bubble removal efficiency. During the maintenance stage, the collected air can be discharged by reverse pressure, achieving the purpose of collecting and removing bubbles. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a whole perspective view of the wafer cleaning device of the present application. Figure 2A perspective view of the wafer cleaning device of the present application Figure One ; Figure 3 A perspective view of the wafer cleaning device of the present application Figure Two ; Figure 4 A perspective view of the water supply device of the present application Figure 5 An exploded view of the wafer cleaning device of the present application Figure 6 A perspective view of the wafer cleaning device of the present application Figure Three ; Figure 7 A partial enlarged view of the A area of the present application Figure 3 ; Figure 8 A perspective view of the bubble removing and uniform vibrating device of the present application Figure 9 A perspective view of the bubble removing and uniform vibrating turntable of the present application Figure 10 A partial enlarged view of the B area of the present application Figure 9 .

[0030] In the figure: 1, outer tank of cleaning machine; 2, wafer cleaning glass tank; 3, ultrasonic cleaning tank; 4, ultrasonic device; 5, bottom plate; 6, cover; 7, cleaning tank track; 8, water supply device; 9, bubble removing and uniform vibrating device; 31, cleaning tank support; 91, bubble removing and uniform vibrating turntable; 92, transmission tooth belt; 93, driving motor; 94, driving gear; 95, cyclone connecting seat; 96, connecting shell; 911, water supply shell; 912, bubble removing inner shell; 913, sliding detection plug; 914, anti-blocking needle; 915, film frame; 916, rotating joint; 9111, uniform water outlet; 9112, transmission gear; 951, cyclone sheet; 81, water supply shell; 82, oblique water outlet; 83, water inlet; 84, water supply cavity. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0032] As Figures 1-10As shown, the present application provides a kind of based on ultrasonic cleaning wafer cleaning device technical scheme: including cleaning machine outer tank body 1 and ultrasonic cleaning tank 3, ultrasonic cleaning tank 3 bottom is equipped with cleaning tank support leg 31, cleaning tank support leg 31 is installed in cleaning machine outer tank body 1, ultrasonic cleaning tank 3 is equipped with bottom plate 5, ultrasonic cleaning tank 3 is equipped with ultrasonic device 4, bottom plate 5 is equipped with cover 6, cover 6 is connected with ultrasonic cleaning tank 3, bottom plate 5 is equipped with cleaning tank track 7 symmetrically, cleaning tank track 7 is equipped with wafer cleaning glass tank 2, ultrasonic cleaning tank 3 is also equipped with shunt water supply device 8, shunt water supply device 8 is equipped with bubble removing uniform vibration device 9.

[0033] Wafer cleaning glass tank 2 is filled with strong acid solution, and the strong acid solution is used to clean the wafer. The cleaning machine outer tank body 1 and the wafer cleaning glass tank 2 are filled with ultrapure water. The wafer cleaning device is connected with a control cabinet, and the control cabinet is used to control the operation of the entire wafer cleaning device. During cleaning, the control system starts the ultrasonic device 4, the ultrasonic device 4 generates vibration, the vibration is transmitted to the wafer cleaning glass tank 2 through the ultrapure water, the wafer cleaning glass tank 2 drives the internal strong acid solution to vibrate and clean the wafer. The control system supplies water to the shunt water supply device 8 through the water supply equipment, the supplementary ultrapure water is evenly shunted to the inclined water outlet 82, the shunted ultrapure water enters the corresponding cyclone connecting seat 95 and the bubble removing uniform vibration head 91, and the treated ultrapure water is discharged into the ultrasonic cleaning tank 3 and then into the cleaning machine outer tank body 1, achieving the purpose of continuously supplementing the loss of ultrapure water.

[0034] The shunt water supply device 8 includes a water supply shell 81, which is installed in the ultrasonic cleaning tank 3. The water supply shell 81 is provided with a water inlet 83, and the water supply shell 81 is provided with a shunt cavity 84. The water supply shell 81 is provided with a plurality of inclined water outlets 82 at the top end, and the inclined water outlets 82 are in communication with the shunt cavity 84. The water supply shell 81 is provided with a bubble removing uniform vibration device 9, and the bubble removing uniform vibration device 9 is in communication with the inclined water outlets 82.

[0035] The water inlet 83 is connected with a water supply equipment, which is used to supplement the ultrapure water into the shunt cavity 84 through the water inlet 83. The supplementary ultrapure water is evenly shunted to the inclined water outlets 82, the shunted ultrapure water enters the corresponding cyclone connecting seat 95 and the bubble removing uniform vibration head 91, and the treated ultrapure water is discharged into the ultrasonic cleaning tank 3 and then into the cleaning machine outer tank body 1.

[0036] The inclined water outlets 82 are inclined. The inclined water outlets 82 cooperate with the inclined cyclone connecting seat 95 and the bubble removing uniform vibration head 91 to make the water flow inclined into the cleaning machine outer tank body 1. When the inclined supplementary water contacts the original liquid, a transition area with speed from fast to slow and direction change occurs at their junction, high turbulent pulsation and local shear stress are generated in the area, which can effectively tear the gas bubbles, shear the large gas bubbles into small gas bubbles, and avoid the aggregation of gas bubbles.

[0037] The bubble removing and uniform vibrating device 9 comprises a plurality of spiral flow connecting seats 95 and a transmission tooth belt 92. The spiral flow connecting seats 95 are installed on the water supply shell 81 and communicate with the oblique water outlet 82. The spiral flow connecting seats 95 are rotatably installed with the bubble removing and uniform vibrating rotating heads 91. The connecting shell 96 is installed on the spiral flow connecting seats 95. The driving motor 93 is installed on the connecting shell 96. The driving gear 94 is installed on the output shaft of the driving motor 93. The transmission tooth belt 92 is engaged with the plurality of bubble removing and uniform vibrating rotating heads 91 for transmission. The transmission tooth belt 92 is engaged with the driving gear 94 for transmission.

[0038] The inner ring of the transmission tooth belt 92 is engaged with the transmission tooth and the driving gear 912 for transmission. The outer ring of the transmission tooth belt 92 is engaged with the driving gear 94 for transmission.

[0039] During the water supply of the water supply equipment, the control system starts the driving motor 93. The output shaft of the motor drives the driving gear 94 to rotate. The driving gear 94 drives the transmission tooth belt 92 to rotate through the driven gear. The bubble removing and uniform vibrating rotating heads 91 are driven to rotate through the driven gear. The shunt shell 911 rotates. The uniform water outlet 9111 on the shunt shell 911 continuously discharges water during the rotation process. The discharge direction and speed of the ultrapure water are continuously changed. The added ultrapure water forms a continuously changing propagation path in the original liquid to produce a disturbance effect. The continuous disturbance of the liquid changes the propagation path of the ultrasonic wave in the liquid synchronously. Therefore, the stable standing wave formed by the fixed sound wave in the square cleaning pool is avoided. The vibration around the glass slot 2 of the wafer cleaning is continuously changed and more uniform. The problems such as local stress concentration around the glass and even glass breakage are avoided. At the same time, the cleaning is also prevented from being uneven.

[0040] A plurality of spiral flow pieces 951 are arranged in the spiral flow connecting seat 95. The spiral flow connecting seat 95 is provided with a spiral flow cavity. The spiral flow cavity communicates with the oblique water outlet 82. The plurality of spiral flow pieces 951 are arranged in the spiral flow cavity. When the ultrapure water enters the spiral flow connecting seat 95 from the oblique water outlet 82, the ultrapure water is contacted with the annularly arranged spiral flow pieces 951. The ultrapure water is rotated under the action of the spiral flow pieces 951. The water flow generates a centrifugal force. The ultrapure water in the water flow is controlled to move outward because of the large mass. The bubbles in the water flow gradually move to the center of the water flow. When the water flow enters the shunt shell 911, the water flow on the outside quickly enters the area between the bubble removing inner shell 912 and the shunt shell 911 and is discharged from the uniform water outlet 9111. The bubbles in the center of the water flow are contacted with the hydrophobic porous membrane on the membrane frame 915 at the front end of the bubble removing inner shell 912. The hydrophobic porous membrane absorbs the contacted bubbles to achieve the bubble absorption effect.

[0041] The bubble removing uniform vibration rotating head 91 comprises a shunt shell 911, which is rotationally installed on the cyclone connecting seat 95, and a bubble removing inner shell 912 installed in the shunt shell 911, a rotating joint 916 rotationally installed on the bubble removing inner shell 912, a sliding detection plug 913 slidingly installed in the bubble removing inner shell 912, a membrane rack 915 installed on the bubble removing inner shell 912, a plurality of hydrophobic porous membranes installed on the membrane rack 915, and a pressure sensor installed on one side of the sliding detection plug 913 close to the membrane rack 915.

[0042] The rotating joint 916 is externally connected with a pressure control device, which is used to pressurize or depressurize the interior of the bubble removing inner shell 912 through the rotating joint 916. The hydrophobic porous membrane is used to pass air and block ultrapure water.

[0043] During water replenishment, the pressure control device depressurizes the adjusting area between the rotating joint 916 and the sliding detection plug 913 in the bubble removing inner shell 912, and the negative pressure makes the sliding detection plug 913 slide in the bubble removing inner shell 912 towards the rotating joint 916. After the sliding detection plug 913 slides, the collection area between the sliding detection plug 913 and the hydrophobic porous membrane is vacuumized, and the control system controls the moving distance of the sliding detection plug 913 through the electric signal transmitted by the pressure sensor, so that a moderate negative pressure appears in the collection area, so that the air bubbles in contact with the hydrophobic porous membrane can be accelerated to be sucked in.

[0044] During maintenance, the ultrapure water in the tank 1 outside the cleaning machine is discharged, and then the pressure control device pressurizes the adjusting area to make the sliding detection plug 913 slide reversely and discharge the collected air.

[0045] The membrane rack 915 is further provided with an anti-blocking needle 914, which penetrates through the cyclone connecting seat 95 and the inclined water outlet 82 and enters the shunt cavity 84.

[0046] After the anti-blocking needle 914 penetrates through the cyclone connecting seat 95 and the inclined water outlet 82, the needle tip thereof enters the shunt cavity 84. When a large air bubble appears to block the hole between the shunt cavity 84 and the inclined water outlet 82, the rotating needle tip can break the air bubble.

[0047] The shunt shell 911 is provided with a plurality of staggered water uniform outlets 9111, and a transmission gear 9112 is installed on the shunt shell 911 and engaged with the transmission toothed belt 92 for transmission.

[0048] The working principle of the present application is as follows: during cleaning, the control system starts the ultrasonic device 4, the ultrasonic device 4 generates vibration, the vibration is transmitted to the wafer cleaning glass tank 2 through ultrapure water, the wafer cleaning glass tank 2 drives the internal strong acid solution to vibrate and clean the wafer. The control system supplies water to the shunt water supply device 8 through the water supply equipment, the replenished ultrapure water is evenly shunted through the oblique water outlet 82, the shunted ultrapure water enters the corresponding cyclone connecting seat 95 and the bubble removal uniform vibration head 91, the treated ultrapure water is discharged into the ultrasonic cleaning tank 3, and then enters the cleaning machine outer tank body 1, so that the purpose of continuously replenishing the consumed ultrapure water is achieved.

[0049] When the ultrapure water enters the cyclone connecting seat 95 from the oblique water outlet 82, it contacts the annularly arranged cyclone sheet 951, and rotates under the action of the cyclone sheet 951. The rotation of the water flow generates centrifugal force. The ultrapure water in the water flow is controlled to move outward because its mass is greater, and the bubbles in the water flow gradually move to the center of the water flow. When the water flow enters the shunt shell 911, the water flow on the outside quickly enters the area between the bubble removal inner shell 912 and the shunt shell 911, and is discharged from the water uniform outlet 9111. The bubbles in the center of the water flow contact the hydrophobic porous membrane on the membrane rack 915 at the front end of the bubble removal inner shell 912, and the hydrophobic porous membrane absorbs the bubbles in contact with it, achieving the bubble absorption effect.

[0050] During the water supply of the water supply equipment, the control system starts the driving motor 93, the motor output shaft drives the driving gear 94 to rotate, the driving gear 94 drives the transmission tooth belt 92 to rotate, and the transmission tooth belt 92 drives the bubble removal uniform vibration head 91 to rotate through the driven gear. The shunt shell 911 rotates, and the water uniform outlet 9111 on it continuously discharges water during the rotation process, constantly changes the water discharge direction and speed of the ultrapure water, and makes the replenished ultrapure water form a continuously changing propagation path in the original liquid, generating a disturbance effect. The continuous disturbance of the liquid changes the propagation path of the ultrasonic wave in the liquid synchronously, thereby avoiding the formation of a stable standing wave of the fixed sound wave in the square cleaning pool, making the vibration around the wafer cleaning glass tank 2 continuously change and more uniform, avoiding problems such as local stress concentration around the glass and even glass rupture, and also preventing uneven cleaning.

[0051] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A wafer cleaning device based on ultrasonic cleaning, characterized in that: The wafer cleaning device includes an outer tank (1) and an ultrasonic cleaning tank (3). The bottom of the ultrasonic cleaning tank (3) is equipped with a cleaning tank support (31), which is installed inside the outer tank (1). A base plate (5) is installed on the ultrasonic cleaning tank (3). An ultrasonic device (4) is installed on the ultrasonic cleaning tank (3). A cover (6) is installed on the base plate (5) and connected to the ultrasonic cleaning tank (3). Cleaning tank tracks (7) are symmetrically installed on the base plate (5). A wafer cleaning glass tank (2) is installed on the cleaning tank tracks (7). A water diversion device (8) is also installed inside the ultrasonic cleaning tank (3). A defoaming and vibration device (9) is installed on the water diversion device (8).

2. The wafer cleaning apparatus based on ultrasonic cleaning according to claim 1, characterized in that: The water supply device (8) includes a water supply housing (81), which is installed in the ultrasonic cleaning tank (3). The water supply housing (81) is provided with an inlet (83), and a diversion cavity (84) is provided inside the water supply housing (81). The top of the water supply housing (81) is provided with several inclined outlets (82), which are connected to the diversion cavity (84). A defoaming and vibration equalization device (9) is installed on the water supply housing (81), which is connected to the inclined outlets (82).

3. The wafer cleaning apparatus based on ultrasonic cleaning according to claim 2, characterized in that: The inclined outlet (82) is set at an angle.

4. A wafer cleaning apparatus based on ultrasonic cleaning according to claim 2, characterized in that: The defoaming and vibration equalization device (9) includes several swirling connecting seats (95) and a transmission toothed belt (92). The swirling connecting seats (95) are installed on the water supply housing (81). The swirling connecting seats (95) are connected to the inclined water outlet (82). A defoaming and vibration equalization rotor (91) is rotatably installed on the swirling connecting seats (95). A connecting shell (96) is installed on the swirling connecting seats (95). A drive motor (93) is installed on the connecting shell (96). A drive gear (94) is installed on the output shaft of the drive motor (93). The transmission toothed belt (92) meshes with several defoaming and vibration equalization rotors (91) for transmission. The transmission toothed belt (92) meshes with the drive gear (94) for transmission.

5. A wafer cleaning apparatus based on ultrasonic cleaning according to claim 4, characterized in that: The defoaming and oscillating rotary head (91) includes a flow-dividing shell (911), which is rotatably mounted on a cyclone connector (95). A defoaming inner shell (912) is installed inside the flow-dividing shell (911). A rotary joint (916) is rotatably mounted on the defoaming inner shell (912). A sliding detection plug (913) is slidably installed inside the defoaming inner shell (912). A membrane frame (915) is installed on the defoaming inner shell (912). A plurality of hydrophobic porous membranes are installed on the membrane frame (915). A pressure sensor is installed on the side of the sliding detection plug (913) near the membrane frame (915).

6. A wafer cleaning apparatus based on ultrasonic cleaning according to claim 5, characterized in that: The membrane frame (915) is also equipped with an anti-clogging needle (914), which passes through the swirl connector (95) and the oblique outlet (82) and enters the diversion chamber (84).

7. A wafer cleaning apparatus based on ultrasonic cleaning according to claim 5, characterized in that: The diversion housing (911) is provided with a plurality of staggered water distribution ports (9111), and a transmission gear (9112) is installed on the diversion housing (911), which meshes with the transmission belt (92) for transmission.

8. A wafer cleaning apparatus based on ultrasonic cleaning according to claim 4, characterized in that: The swirl connector (95) is provided with a plurality of swirl vanes (951), and the swirl connector (95) is provided with a swirl cavity. The swirl cavity is connected to the inclined outlet (82), and the plurality of swirl vanes (951) are arranged around the swirl cavity.

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