Heterogeneous thermal interface material element and pressure measuring device with heterogeneous thermal interface material element
By designing heterogeneous thermal interface material elements, combined with graphite pads and soft thermal conductive sheets, the problem of heat accumulation was solved, achieving more efficient heat conduction and testing accuracy.
Patent Information
- Application Number
- CN202411850283.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-05-31
- Filing Date
- 2024-12-16
- Publication Date
- 2025-12-02
AI Technical Summary
In existing technologies, thermal interface materials cannot effectively conduct heat, leading to heat accumulation, which may cause semiconductor packaged wafers to overheat and burn out, and affect the accuracy of test results.
The system employs heterogeneous thermal interface material elements, combining graphite pads and soft thermal conductive sheets. The graphite pads have high thermal conductivity and high ductility, while the soft thermal conductive sheets have high ductility and low thermal conductivity. The combination of different materials improves heat transfer efficiency.
The increased contact area improves heat dissipation efficiency, reduces the risk of overheating and burning of semiconductor packaged chips, and enhances the accuracy of test data.
Smart Images
Figure CN121049543A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a pressure testing device, and more particularly to a pressure testing device having a heterogeneous thermal interface material element. Background Technology
[0002] Generally, when conducting electrical testing on a component under test (such as a semiconductor packaged wafer, hereinafter referred to as a DUT), the DUT is placed on a test socket, and a crimp connector is pressed against the DUT and connected to its electrical terminals to perform electrical testing. After the crimp connector presses against the DUT, a lot of heat will quickly accumulate on the crimp connector. Therefore, conventional technology involves placing a thermal interface material (TIM) on the lower surface of the crimp connector to fill the gap between the crimp connector and the DUT.
[0003] However, TIM materials with limited performance cannot effectively conduct heat, and are prone to contamination on the DUT surface due to heat accumulation and melting. This not only poses a risk of the DUT burning out due to overheating, but may also lead to inaccurate test data and affect the test results.
[0004] It is evident that the aforementioned technology still has inconveniences and shortcomings, requiring further improvement. Therefore, effectively addressing these inconveniences and shortcomings is a crucial research and development issue and a pressing goal for improvement in related fields. Summary of the Invention
[0005] One object of the present invention is to provide a heterogeneous thermal interface material element and a pressure testing device having such heterogeneous thermal interface material element, so as to solve the difficulties mentioned in the prior art.
[0006] An embodiment of the present invention provides a heterogeneous thermal interface material element. The heterogeneous thermal interface material element includes a graphite gasket and a flexible thermally conductive sheet. The graphite gasket includes an upper body, a lower body, an arc-shaped portion, and a sealing portion. The lower body is opposite to the upper body, and the arc-shaped portion integrally connects the upper body and the lower body, forming a C-shaped bag structure together with the upper and lower bodies. The C-shaped bag structure has an internal space and a bag opening, with the internal space communicating with the bag opening and the sealing portion sealing the bag opening. The flexible thermally conductive sheet is completely contained within the internal space of the C-shaped bag structure and is sandwiched between the upper body and the lower body, with air gaps separating it from the arc-shaped portion and the sealing portion. The flexible thermally conductive sheet and the graphite gasket are made of different materials; the thermal conductivity of the graphite gasket is greater than that of the flexible thermally conductive sheet, and the ductility of the flexible thermally conductive sheet is greater than that of the graphite gasket.
[0007] According to one or more embodiments of the present invention, in the above-mentioned heterogeneous thermal interface material element, the flexible thermal conductive sheet includes a stretchable sheet body, a plurality of first microparticle protrusions, and a plurality of second microparticle protrusions. The stretchable sheet body has a first surface and a second surface that are opposite to each other. The first microparticle protrusions are spaced apart and protrude from the first surface, and directly contact the heat dissipation pad. The second microparticle protrusions are spaced apart and protrude from the second surface, and directly contact the heat dissipation pad.
[0008] According to one or more embodiments of the present invention, in the above-mentioned heterogeneous thermal interface material element, the soft thermal conductive sheet is a mesh or a porous or sponge-like solid, and a portion of the graphite pad passes through the soft thermal conductive sheet from the lower body and connects to the upper body.
[0009] According to one or more embodiments of the present invention, in the above-mentioned heterogeneous thermal interface material element, the soft thermal conductive sheet is one of indium sheet, copper sheet and silver sheet.
[0010] According to one or more embodiments of the present invention, in the above-mentioned heterogeneous thermal interface material element, the thermal conductivity of the graphite gasket is 400 to 600 W / m·Kelvin, and the thermal conductivity of the soft thermal conductive sheet is 80 to 429 W / m·Kelvin.
[0011] According to one or more embodiments of the present invention, in the above-mentioned heterogeneous thermal interface material element, the thermal conductivity coefficient of the heat dissipation pad along the planar axis is higher than the thermal conductivity coefficient of the heat dissipation pad along the vertical axis.
[0012] According to one or more embodiments of the present invention, in the above-mentioned heterogeneous thermal interface material element, the heat resistance of the heat dissipation pad is not greater than 400°C, and the heat resistance of the soft thermal conductive sheet is not greater than 125°C.
[0013] According to one or more embodiments of the present invention, in the above-mentioned heterogeneous thermal interface material element, the heat dissipation pad has a Mohs hardness of 2, and the soft thermal conductive sheet has a Mohs hardness of 1.2.
[0014] An embodiment of the present invention provides a pressure testing device. The pressure testing device includes a device body, a pick-and-place section, and the aforementioned heterogeneous thermal interface material element. The pick-and-place section is connected to the device body and is used to pick up and transport a test component. The heterogeneous thermal interface material element is fixedly attached to the lower surface of the pick-and-place section and is electrically connected to the pick-and-place section for direct contact with the test component.
[0015] According to one or more embodiments of the present invention, the pressure testing device further includes a heat exchange module. The heat exchange module is connected to the device body and is used to exchange heat energy with the tested component.
[0016] According to one or more embodiments of the present invention, the pressure testing device further includes a temperature sensor, a heater, and a control unit. The temperature sensor is located on the pick-and-place section and is used to sense the contact temperature between the heterogeneous thermal interface material element and the test element. The heater is located on the device body and is used to heat the test element. The control unit is electrically connected to the heat exchange module, the temperature sensor, and the heater, and is used to adjust the heat exchange capacity of the heat exchange module and the heating capacity of the heater accordingly based on the sensing result of the temperature sensor.
[0017] Thus, through the above architecture, the heterogeneous thermal interface material element of the present invention and the pressure testing device having the heterogeneous thermal interface material element combine heat dissipation materials with different properties, enabling them to respectively capture the advantages of these heat dissipation materials. That is, the heterogeneous thermal interface material element of the present invention can not only increase the extension size and increase the contact area with the test element after pressing, but also improve the original heat dissipation efficiency, thereby reducing the risk of overheating and burning of the test element and insufficient test data.
[0018] The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings. Attached Figure Description
[0019] To make the above and other objects, features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described below:
[0020] Figure 1 This is a cross-sectional schematic diagram of a heterogeneous thermal interface material element according to an embodiment of the present invention;
[0021] Figure 2 This is a cross-sectional schematic diagram of a heterogeneous thermal interface material element according to an embodiment of the present invention;
[0022] Figures 3 to 16 These are schematic diagrams and side views of the continuous operation for fabricating heterogeneous thermal interface material elements;
[0023] Figure 17 This is a cross-sectional schematic diagram of a heterogeneous thermal interface material element according to an embodiment of the present invention;
[0024] Figure 18 for Figure 17 A front view of the flexible thermal conductive sheet;
[0025] Figure 19 This is a schematic diagram of a pressure testing device according to an embodiment of the present invention.
[0026] [Symbol Explanation]
[0027] 10, 11, 12, 13: Heterogeneous thermal interface material elements
[0028] 100, 101, 102: Graphite gaskets
[0029] 110: Interior space
[0030] 111: Inner wall
[0031] 112: Upper inner wall
[0032] 113: Lower inner wall
[0033] 114: Part
[0034] 120: Graphite sheet
[0035] 121: Front
[0036] 122: Midline
[0037] 123: First half-plane region
[0038] 123A: Lateral edge
[0039] 124: Second half area
[0040] 130: Thermal adhesive residue
[0041] 140: Auxiliary rod
[0042] 150: C-type bag structure
[0043] 151: Bag opening
[0044] 152: Upper body
[0045] 153: Lower layer
[0046] 154: Arc-shaped part
[0047] 155: Sealing section
[0048] 200, 201, 202: Flexible thermal conductive sheet
[0049] 210: Stretchable sheet
[0050] 211: First Surface
[0051] 212: Second Surface
[0052] 213: Air gap
[0053] 220: First microparticle protrusion
[0054] 230: Second microparticle protrusion
[0055] 240: Net
[0056] 250: Net
[0057] 300: Pressure testing device
[0058] 310:Device body
[0059] 320: Pick-up and Drop-off Section
[0060] 330: Heat exchange module
[0061] 340: Temperature sensor
[0062] 350: Control Unit
[0063] 360: Heater
[0064] 400: Test slot
[0065] DUT: Test Component Detailed Implementation
[0066] The following describes several embodiments of the present invention with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, these practical details are not essential in the various embodiments of the invention. Furthermore, for the sake of simplicity, some conventional structures and elements will be illustrated in the drawings in a simple schematic manner.
[0067] Figure 1 This is a cross-sectional schematic diagram of a heterogeneous thermal interface material element 10 according to an embodiment of the present invention. Figure 1 As shown, in this embodiment, the heterogeneous thermal interface material (TIM) element 10 includes a graphite pad 100 with high thermal conductivity and a flexible thermally conductive sheet 200 with high flexibility. The graphite pad 100 is bag-shaped and contains an internal space 110. The flexible thermally conductive sheet 200 is completely contained within the internal space 110 of the graphite pad 100 and is sandwiched by the graphite pad 100, and each side of the flexible thermally conductive sheet 200 is laterally separated from the graphite pad 100 by an air gap 213. The flexible thermally conductive sheet 200 and the graphite pad 100 are made of different materials, and the thermal conductivity of the graphite pad 100 is greater than that of the flexible thermally conductive sheet 200, and the ductility and malleability of the flexible thermally conductive sheet 200 are greater than those of the graphite pad 100.
[0068] More specifically, in this embodiment, for example, the graphite pad 100 is a graphite sheet and the flexible thermal conductive sheet 200 is an indium sheet; however, the invention is not limited thereto.
[0069] Figure 2 This is a cross-sectional schematic diagram of a heterogeneous thermal interface material element 11 according to an embodiment of the present invention. Figure 2As shown, this embodiment is largely the same as the previous embodiment, except that in this embodiment, the flexible thermal conductive sheet 201 includes a stretchable sheet body 210, a plurality of first microparticle protrusions 220, and a plurality of second microparticle protrusions 230. The stretchable sheet body 210 is located within the internal space 110 and has a first surface 211 and a second surface 212 that are opposite to each other. The first microparticle protrusions 220 are spaced apart and protrude from the first surface 211, and directly contact the graphite pad 101 within the internal space 110. The second microparticle protrusions 230 are spaced apart and protrude from the second surface 212, and directly contact the graphite pad 101 within the internal space 110.
[0070] More specifically, since the soft thermal conductive sheet 201 is made of a soft material, the first microparticle protrusions 220 will be flattened or embedded in the first surface 211 to a certain extent when partially compressed, and the second microparticle protrusions 230 will be flattened or embedded in the second surface 212 to a certain extent when partially compressed, so as to ensure that the soft thermal conductive sheet 201 directly abuts against the inner wall 111 of the graphite pad 101, thereby maintaining the thermal conductivity of the soft thermal conductive sheet 201 between the opposite sides of the graphite pad 101.
[0071] Figures 3 to 16 The figures are a schematic diagram and a side view of the continuous operation for fabricating heterogeneous thermal interface material elements. Figure 4 for Figure 3 Side view, Figure 6 for Figure 5 Side view, Figure 8 for Figure 7 Side view, Figure 10 for Figure 9 Side view, Figure 12 for Figure 11 Side view, Figure 14 for Figure 13 The side view, and Figure 16 for Figure 15 A side view. In this embodiment, the fabrication of the heterogeneous thermal interface material element includes steps 1 to 5.
[0072] In step 1, as Figure 3 and Figure 4 As shown, a flexible graphite sheet 120 is provided, the front side 121 of the graphite sheet 120 having a midline 122. The midline 122 divides the front side 121 of the graphite sheet 120 into a first half-area 123 and a second half-area 124.
[0073] In step 2, thermally conductive adhesive residues 130 are applied to the first half-surface region 123 of the graphite sheet 120 near its two opposite side edges 123A. Figure 3 and Figure 4 ).
[0074] In step 3, as Figure 5 and Figure 6 As shown, the graphite sheet 120 is bent in half according to the midline 122, so that the first half-area 123 of the graphite sheet 120 faces and covers the second half-area 124, and the first half-area 123 and the second half-area 124 are bonded together by thermally conductive adhesive marks 130, thereby forming a C-shaped bag structure 150 with a C-shaped cross-section. Figure 7 and Figure 8 ).
[0075] In one embodiment, such as Figure 5 and Figure 6 As shown, an auxiliary rod 140 can be pressed onto the center line 122 of the graphite sheet 120, and the graphite sheet 120 can be wrapped around the auxiliary rod 140, so that the first half-area 123 of the graphite sheet 120 suspends and covers the second half-area 124, thereby forming a C-shaped cross-section on its left side. Figure 8 To avoid pressing creases directly onto the midline 122 of the graphite sheet 120, thus reducing the chance of damage to the graphite sheet 120. Figure 6 and Figure 8 ).like Figure 9 and Figure 10 As shown, after the thermally conductive adhesive residue 130 has dried, remove the auxiliary rod 140.
[0076] In step 4, as Figure 11 and Figure 12 As shown, the aforementioned soft thermal conductive sheet 201 is inserted laterally into the internal space 110 of the C-shaped bag structure 150 from the bag opening 151, so that the soft thermal conductive sheet 201 is completely located inside the C-shaped bag structure 150. Figure 13 and Figure 14 ).
[0077] In step 5, as Figure 15 and Figure 16 As shown, a thermally conductive adhesive is injected into the bag opening 151 of the C-shaped bag structure 150, so that the thermally conductive adhesive becomes the sealing part 155 that seals the bag opening 151, thereby sealing the soft thermally conductive sheet 201 within the internal space 110.
[0078] like Figure 2 and Figure 16As shown, the C-type bag structure 150 includes an upper body 152, a lower body 153, an arc-shaped portion 154, and a sealing portion 155. The lower body 153 is opposite to the upper body 152. The arc-shaped portion 154 integrally connects the upper body 152 and the lower body 153, and is connected to both the upper body 152 and the lower body 153. The bag opening 151 of the C-type bag structure 150 is connected to the internal space 110 and completely accommodates the soft thermal conductive sheet 201. The sealing portion 155 seals the bag opening 151, so that the soft thermal conductive sheet 201 is sealed within the internal space 110. It should be understood that the heterogeneous thermal interface material element 10 is different from a vapor chamber, therefore the internal space 110 of the C-type bag structure 150 does not contain a heat-conducting liquid.
[0079] Figure 17 This is a cross-sectional schematic diagram of a heterogeneous thermal interface material element 12 according to an embodiment of the present invention. Figure 18 for Figure 17 A front view of the flexible thermally conductive sheet 202. (See diagram below.) Figure 17 and Figure 18 As shown, this embodiment is largely the same as the above embodiments, except that the flexible thermal conductive sheet 202 is a mesh body instead of a sheet without mesh. For example, the flexible thermal conductive sheet 202 includes a mesh body 240 and a plurality of meshes 250. The meshes 250 are distributed throughout and on the mesh body 240. A portion 114 of the graphite pad 102 passes through the meshes 250 of the flexible thermal conductive sheet 202 from the lower inner wall 113 of the graphite pad 102 and connects to the upper inner wall 112 of the graphite pad 102. However, the present invention is not limited thereto; in other embodiments, the flexible thermal conductive sheet 202 may also be a porous or sponge-like solid.
[0080] Furthermore, in the above embodiments, for example, the graphite gaskets 100-102 are made of graphite, and the flexible thermal conductive sheets 200-202 are made of 90% indium (In) and 10% silver (Ag). However, the present invention is not limited thereto; in other embodiments, the flexible thermal conductive sheets 200-202 may also contain copper sheets, silver sheets, or combinations thereof. The thermal conductivity of the graphite gaskets 100-102 is 400-600 W / m Kelvin, and the thermal conductivity of the flexible thermal conductive sheets 200-202 is 80-429 W / m Kelvin, wherein the thermal conductivity of indium is 80 W / m Kelvin, the thermal conductivity of silver is 429 W / m Kelvin, and the thermal conductivity of gold is 317 W / m Kelvin. Furthermore, graphite gaskets of 100–102 (e.g., graphite) achieve a planar axial (XY axis) thermal conductivity of 400–600 W / mK and a vertical axial (Z axis) thermal conductivity of 5–20 W / mK. Flexible thermal conductive sheets of 200–202 (e.g., indium sheets) achieve a planar axial (XY axis) thermal conductivity of 67–80 W / mK and a vertical axial (Z axis) thermal conductivity of 67–80 W / mK. The graphite gaskets 100-102 have a heat resistance not exceeding 400°C, and the soft thermal conductive sheets 200-202 have a heat resistance not exceeding 125°C. The graphite gaskets 100-102 have a Mohs hardness of 2, and the soft thermal conductive sheets 200-202 have a Mohs hardness of 1.2. The heterogeneous thermal interface material (TIM) elements 10-12 have an area of approximately 3 x 3 cm. However, the invention is not limited thereto.
[0081] Figure 19 This is a schematic diagram of a pressure testing device 300 according to an embodiment of the present invention. Figure 19 As shown, the pressure testing device 300 includes a device body 310, a pick-and-place section 320, a test slot 400, and a heterogeneous thermal interface material element 13. The pick-and-place section 320 is connected to one end of the device body 310 and is used to pick up and transport a device under test (DUT) (e.g., a semiconductor packaged wafer) into the test slot 400. The heterogeneous thermal interface material element 13 is fixedly attached to the lower surface of the pick-and-place section 320 relative to the device body 310, so as to directly contact the device under test (DUT). The pick-and-place section 320 can be, for example, a placement slot, a pick-up arm, or a pick-up suction cup, etc., for picking up the device under test (DUT). In this embodiment, the heterogeneous thermal interface material element 13 can be any of the heterogeneous thermal interface material elements used in the above embodiments.
[0082] More specifically, in this embodiment, the pressure testing device 300 further includes a heat exchange module 330, a temperature sensor 340, and a control unit 350. The heat exchange module 330 is connected to the device body 310 to exchange heat energy transmitted from the device under test (DUT). The heat exchange module 330 removes heat energy from the device body 310, for example, by passing a cooling liquid through it. The temperature sensor 340 is located on the pick-and-place section 320 and is used to sense the contact temperature of the heterogeneous thermal interface material element 13. The heater 360 is located on the device body and is used to heat the DUT. The control unit 350 is electrically connected to the heat exchange module 330, the heater 360, and the temperature sensor 340, and adjusts the heat exchange capacity of the heat exchange module 330 and the heating capacity of the heater 360 accordingly based on the sensing result of the temperature sensor 340. Furthermore, the control unit 350 is electrically connected to the heterogeneous thermal interface material element 13 through the pick-and-place section 320. Therefore, when the pressure testing device 300 is pressed down onto the test element DUT, the control unit 350 conducts and electrically tests the test element DUT through the pick-and-place part 320.
[0083] When the heterogeneous thermal interface material element 13 is disposed on the pressure testing device 300, and the pressure testing device 300 moves down to press the test component DUT in the test slot 400, the heterogeneous thermal interface material element 13 located between the test component DUT and the pick-and-place part 320 can serve as a heat conduction medium and a pressure buffer.
[0084] It should be understood that, due to the high ductility of the soft thermal conductive sheets 200-202 (e.g., indium sheets) of the heterogeneous thermal interface material element 10, when the pressure testing device 300 presses the test element DUT through the heterogeneous thermal interface material element 13, the soft thermal conductive sheets 200-202 can not only counteract the wafer warpage caused by the surface of the test element DUT, but also extend laterally within the internal space 110 of the graphite pads 100-102. Figure 2 This significantly increases the overall contact area between the heterogeneous thermal interface material element 13 and the DUT, thereby improving the thermal conductivity of the heterogeneous thermal interface material element 13.
[0085] Furthermore, since the thermal conductivity of the graphite pads 100-102 along the planar axis (i.e., the XY axis) is much higher than that along the vertical axis, compared to conventional TIM materials which only allow all the heat energy of the tested component DUT to be transferred to the pick-and-place section 320 in a vertical manner, most of the heat energy of the tested component DUT can be rapidly conducted from the lower body 153 and the arc-shaped portion 154 of the graphite pads 100-102 to the upper body 152, thereby receiving the heat exchange work of the heat exchange module 330. Figure 16 ).
[0086] It should be understood that since the flexible thermal conductive sheets 200-202 (e.g., indium sheets) become fluid due to their molten state during the high-temperature bonding process, the flexible thermal conductive sheets 200-202 are loaded into the internal space 110 of the graphite pads 100-102. This also prevents the flexible thermal conductive sheets 200-202 from moving out of the internal space 110 of the graphite pads 100-102 due to the flow.
[0087] Thus, through the above architecture, the heterogeneous thermal interface material element of the present invention and the pressure testing device having the heterogeneous thermal interface material element combine heat dissipation materials with different properties, enabling them to respectively capture the advantages of these heat dissipation materials. That is, the heterogeneous thermal interface material element of the present invention can not only increase the extension size and increase the contact area with the test element after pressing, but also improve the original heat dissipation efficiency, thereby reducing the risk of overheating and burning of the test element and insufficient test data.
[0088] Finally, the embodiments described above are not intended to limit the invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention, and all such modifications and refinements are protected under this invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.
Claims
1. A heterogeneous thermal interface material element, characterized in that, Include: A graphite gasket includes an upper body, a lower body, an arc-shaped portion, and a sealing portion. The lower body is opposite to the upper body. The arc-shaped portion integrally connects the upper body and the lower body, and together with the upper body and the lower body, forms a C-shaped bag structure. The C-shaped bag structure has an internal space and a bag opening. The internal space is connected to the bag opening, and the sealing portion seals the bag opening. A flexible thermally conductive sheet is completely contained within the internal space of the C-shaped bag structure, and is sandwiched between the upper and lower layers, with air gaps separating it from the arc-shaped portion and the sealing portion. The soft thermal conductive sheet is made of a different material than the graphite pad. The thermal conductivity of the graphite pad is greater than that of the soft thermal conductive sheet, and the ductility of the soft thermal conductive sheet is greater than that of the graphite pad.
2. The heterogeneous thermal interface material element as described in claim 1, characterized in that, The flexible thermal conductive sheet includes: A stretchable sheet having a first surface and a second surface that are opposite to each other; Multiple first microparticle protrusions are spaced apart and protrude from the first surface, directly contacting the upper body; as well as Multiple second microparticle protrusions are spaced apart and protrude from the second surface, directly contacting the lower body.
3. The heterogeneous thermal interface material element as described in claim 1, characterized in that, The soft thermal conductive sheet is a mesh, a porous or sponge-like solid, and a portion of the graphite pad passes through the soft thermal conductive sheet from the lower body to connect to the upper body.
4. The heterogeneous thermal interface material element as described in claim 1, characterized in that, The flexible thermal conductive sheet is one of an indium sheet, a copper sheet, or a silver sheet.
5. The heterogeneous thermal interface material element as described in claim 1, characterized in that, The thermal conductivity of the graphite gasket is 400–600 W / m·Kelvin, and the thermal conductivity of the soft thermal conductive sheet is 80–429 W / m·Kelvin.
6. The heterogeneous thermal interface material element as described in claim 1, characterized in that, The thermal conductivity coefficient of the graphite gasket along its planar axis is higher than that along its vertical axis.
7. The heterogeneous thermal interface material element as described in claim 1, characterized in that, The graphite gasket has a heat resistance of no more than 400°C, and the soft thermal conductive sheet has a heat resistance of no more than 125°C.
8. The heterogeneous thermal interface material element as described in claim 1, characterized in that, The graphite gasket has a Mohs hardness of 2, and the soft thermal conductive sheet has a Mohs hardness of 1.
2.
9. A pressure testing device, characterized in that, Include: One device body; A pick-and-place section, connected to the main body of the device, is used to pick up and transport a test component; and The heterogeneous thermal interface material element as described in any one of claims 1 to 8 is fixedly attached to the lower surface of the pick-and-place portion and electrically connected to the pick-and-place portion for direct contact with the tested element.
10. The pressure testing device as described in claim 9, characterized in that, Also includes: A heat exchange module, connected to the main body of the device, is used to exchange heat energy with the tested component.
11. The pressure testing device as described in claim 10, characterized in that, Also includes: A temperature sensor is located on the pick-and-place section to sense the contact temperature of the heterogeneous thermal interface material element with the tested element. A heater, located on the device body, is used to heat the tested element; and A control unit is electrically connected to the heat exchange module, the temperature sensor, and the heater, and is used to adjust the heat exchange capacity of the heat exchange module and the heating capacity of the heater according to the sensing result of the temperature sensor.