Silicon wafer cleaning equipment

Abstract

The invention relates to the technical field of semiconductor processing, and particularly discloses silicon wafer cleaning equipment which comprises a cleaning tank; the carrying table is arranged in the cleaning tank; the driving part is connected with the carrying platform and is used for driving the carrying platform to do reciprocating rectilinear motion in the vertical and horizontal directions; the supporting plate is arranged on the carrying table, the supporting plate is elastically connected with the carrying table, and the supporting plate and the carrying table can generate relative displacement in the horizontal direction; the cleaning box is separably arranged on the supporting plate and used for containing a plurality of silicon wafers, and liquid can pass through the four sides of the cleaning box. The silicon wafer cleaning device can drive a silicon wafer to ascend, descend and horizontally move in the cleaning tank, the contact degree between the silicon wafer and cleaning liquid is improved, and therefore the cleaning effect is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, specifically to a silicon wafer cleaning device. Background Technology

[0002] Silicon wafer cleaning is primarily used to remove surface contaminants, ensuring the stability of subsequent processes and device performance. Major contaminant sources include organic matter, metallic impurities, particulate matter, and oxides. These contaminants can lead to circuit failure, decreased insulation performance, and unstable resistivity. For example, patent CN202110686731.6 discloses a silicon wafer cleaning device and method. The device includes a cleaning tank comprising an inner tank for holding polished silicon wafers and an outer tank surrounding the inner tank; a rinsing tank positioned directly above the cleaning tank, with multiple drainage holes at the bottom for discharging deionized water to rinse the silicon wafers placed in the inner tank; and a water supply mechanism for supplying deionized water to the rinsing tank. While this type of cleaning device directly cleans the silicon wafers through rinsing, the wafers are placed within the cleaning tank, inevitably creating dead zones and hindering complete and effective cleaning. Summary of the Invention

[0003] The purpose of this invention is to provide a silicon wafer cleaning device and a corresponding power tool to solve the problems mentioned in the background art.

[0004] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: a silicon wafer cleaning device, comprising: Cleaning tank; A platform set inside the cleaning tank; A drive unit connected to the platform, the drive unit being used to drive the platform to perform reciprocating linear motion in the vertical and horizontal directions; A support plate is set on the platform, and the support plate is elastically connected to the platform, allowing the support plate and the platform to move relative to each other in the horizontal direction; A detachable cleaning box is mounted on a support plate. The cleaning box is used to hold multiple silicon wafers, and liquid can pass through all four sides of the cleaning box.

[0005] Furthermore, the platform includes a connecting plate and a connecting block, the connecting block being connected to a driving unit, and the driving unit driving the connecting block to move.

[0006] Furthermore, the support plate is disposed on opposite sides of the connecting plate, a protrusion is disposed below the support plate, and a sliding groove is disposed inside the connecting plate. The length of the sliding groove is greater than the length of the protrusion, and the protrusion can move along its length direction within the sliding groove.

[0007] Furthermore, elastic bodies are provided on both sides of the protrusion along its length, and the elastic bodies abut against the inner wall of the sliding groove.

[0008] Furthermore, the support plate is provided with multiple connecting posts, and the bottom of the cleaning box is provided with multiple connecting slots, and the connecting posts and connecting slots are inserted into each other.

[0009] Furthermore, the driving unit includes a first module and a second module. The first module drives the second module to make a vertical linear motion, and the second module is connected to the platform and can drive the platform to make a horizontal linear motion.

[0010] Furthermore, the second module drives the platform to make stepping motions, causing the platform to make periodic horizontal displacements in the same direction.

[0011] The present invention has the following beneficial effects: This invention can move silicon wafers up and down and horizontally within the cleaning tank, increasing their contact with the cleaning solution and thus improving the cleaning effect.

[0012] This invention uses a step-by-step elastomer to achieve the shaking of the silicon wafer, which facilitates the entry of cleaning fluid into the cleaning box to perform multi-position contact cleaning of the internal silicon wafer. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of a silicon wafer cleaning device according to Example 1; Figure 2 for Figure 1 Top view of the intermediate platform and support plate; Figure 3 for Figure 2 A cross-sectional view of the location of the connecting column and the connecting groove.

[0015] Reference numerals: 10 - gear, 20 - drive gear, 30 - transmission shaft, 31 - helical groove, 311 - inner side, 40 - first blade, 50 - second blade, 60 - pin, 70 - bearing. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Example 1 like Figures 1-3 As shown, the silicon wafer cleaning equipment in this embodiment mainly consists of a cleaning tank 10, a platform 20 disposed in the cleaning tank 10, a drive unit 30 connected to the platform 20, a support plate 40 disposed on the platform 20, and a cleaning box 50 that can be separated and disposed on the support plate 40.

[0018] The cleaning tank 10 is used to hold the cleaning solution, which can be water or other cleaning solutions. It can be connected to an external water source through a pipeline for replenishment of the cleaning solution.

[0019] The platform 20 includes a connecting plate 21 and a connecting block 22. The connecting block 22 is connected to the driving unit 30. The driving unit 30 drives the connecting block 22 to move, and then the driving unit 30 drives the platform 20 to make reciprocating linear motion in the vertical and horizontal directions.

[0020] Furthermore, the support plate 40 and the platform 20 are elastically connected, and the support plate 40 and the platform 20 can undergo relative displacement in the horizontal direction.

[0021] Support plates 40 are disposed on opposite sides of connecting plate 21. A protrusion 41 is disposed below the support plate 40. A sliding groove 211 is disposed inside the connecting plate 21. The length of the sliding groove 211 is greater than the length of the protrusion 41. The protrusion 41 can move along its length direction inside the sliding groove 211. Elastic bodies 61, such as springs, are disposed on both sides of the protrusion 41 along its length direction. The elastic bodies 61 abut against the inner wall of the sliding groove 211.

[0022] Furthermore, the support plate 40 is provided with multiple connecting posts 42, and the bottom of the cleaning box 50 is provided with multiple connecting slots. The connecting posts 42 are inserted into the connecting slots to facilitate the insertion and removal of the cleaning box 50, which can be achieved by a robotic arm or manually.

[0023] The drive unit 30 includes a first module 31 and a second module 32 with waterproof performance. The first module 31 drives the second module 32 to make a vertical linear movement. The second module 32 is connected to the stage 20 and can drive the stage 20 to make a horizontal linear movement. The second module 32 drives the stage 20 to make a stepping movement, which in turn drives the cleaning box 50 to make a periodic horizontal displacement in the same direction, such as stepping 1 cm per second and pausing for 2 seconds, repeating the above steps. When the cleaning box 50 moves forward and pauses, under the action of inertia and water flow resistance, and with the cooperation of the elastic body 61, the cleaning box 50 will make a slight back-and-forth vibration in the horizontal direction, which improves the contact cleaning effect of the cleaning fluid entering the cleaning box 50 and contacting the silicon wafer.

[0024] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A silicon wafer cleaning apparatus, characterized by comprising: The utility model relates to a cleaning device for silicon wafer, comprising: a cleaning tank for containing cleaning liquid; a carrier arranged in the cleaning tank; a driving unit connected to the carrier for driving the carrier to make vertical and horizontal reciprocating linear motion; a support plate arranged on the carrier, which is elastically connected to the carrier and can be displaced relative to the carrier in the horizontal direction; a detachable cleaning box arranged on the support plate for containing a plurality of silicon wafers, and the four sides of the cleaning box are provided for liquid to pass through.

2. The apparatus of claim 1 wherein: The carrier comprises a connecting plate and a connecting block, the connecting block is connected to the driving unit, and the driving unit drives the connecting block to move. ​ 3. The apparatus of claim 2 wherein: The support plate is arranged on opposite sides of the connecting plate, a protrusion is arranged below the support plate, a sliding groove is arranged in the connecting plate, the length of the sliding groove is greater than the length of the protrusion, and the protrusion can move in the length direction of the sliding groove. ​ 4. The apparatus of claim 3 wherein: Elastic bodies are arranged on both sides of the length direction of the protrusion, and the elastic bodies abut against the inner wall of the sliding groove. ​ 5. The apparatus of claim 3 wherein: A plurality of connecting columns are arranged on the support plate, a plurality of connecting grooves are arranged at the bottom of the cleaning box, and the connecting columns and the connecting grooves are inserted and matched.

6. The apparatus of claim 1 wherein: The driving unit comprises a first module and a second module, the first module drives the second module to make vertical linear motion, the second module is connected to the carrier and can drive the carrier to make horizontal linear motion.

7. The apparatus of claim 7 wherein: The second module drives the carrier to make step motion and drives the carrier to make periodic horizontal displacement in the same direction.

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