A uniformly filled semiconductor package mold

Abstract

The application discloses a kind of even filling semiconductor packaging mould, it is related to semiconductor packaging technical field, the even filling semiconductor packaging mould includes mould group slide rail and lower mould frame, mould group slide rail is slidably installed with closing mould telescopic link, closing mould telescopic link is installed with upper mould frame, a plurality of glue injection pipes are installed on upper mould frame, a plurality of glue injection pipes are all installed with flow tube, flow meter and stop valve are installed on glue injection pipe, upper mould is installed on upper mould frame, lower mould is installed in lower mould frame, after closing mould, glue is inputted to storage glue layer by glue inlet pipe, the outlet of flow tube is distributed at the center of mould cavity and four corners, so that glue solution can evenly enter mould cavity, ensure that glue solution flow front is flat and slowly advances, reduce the impact force that line arc receives in plastic packaging process, ensure electrical connection is complete, improve packaging quality, flow meter controls stop valve, ensure that each mould cavity is evenly fed, improve product consistency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically a semiconductor packaging mold with uniform filling. Background Technology

[0002] In semiconductor device packaging processes, transfer molding is a widely used technology. Its core lies in injecting epoxy molding compound into the cavity through a precision mold, which then provides protection for the chip after curing.

[0003] Under current technology, uneven liquid injection is a prominent problem. Due to limitations in mold flow channel design or injection port layout, molten molding compound is difficult to reach all areas simultaneously when filling complex cavities, which can easily lead to air gaps or insufficient filling, directly affecting product yield. Secondly, long curing time restricts production efficiency. Traditional processes often require a long heating cycle to ensure full cross-linking of the molding compound, resulting in increased energy consumption and limited output per unit time. In addition, the problem of mold residue cannot be ignored. During demolding, some material easily adheres to the mold surface. If it is not cleaned in time, it will not only affect the subsequent molding accuracy but may also cause impurity contamination, forcing frequent equipment shutdowns for maintenance and affecting packaging quality. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor packaging mold with uniform filling, so as to solve the problems of low production efficiency and packaging quality caused by uneven liquid injection, long curing time and mold residue in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: the uniformly filled semiconductor packaging mold includes a module slide rail and a lower mold frame. A mold closing telescopic rod is slidably mounted on the module slide rail. An upper mold frame is mounted on the mold closing telescopic rod. A glue inlet pipe is mounted on the upper mold frame. A lower mold is mounted on the lower side of the upper mold frame. A flow equalization component is provided between the upper mold frame and the upper mold. A lower mold is mounted inside the lower mold frame. A thermosetting component for heating and curing is provided on the lower mold. A cleaning component for cleaning the upper mold is provided on the side of the module slide rail away from the lower mold frame.

[0006] The flow equalization assembly includes a glue storage layer, a glue injection pipe, a flow equalization pipe, a flow meter, and a shut-off valve. A glue storage layer is provided inside the upper mold frame. Multiple glue injection pipes are installed on the glue storage layer. Each of the multiple glue injection pipes is equipped with a flow equalization pipe. A flow meter and a shut-off valve are installed on each glue injection pipe. An upper mold is installed below the upper mold frame. The upper mold is connected to the flow equalization pipe, and the flow equalization pipe passes through the upper mold.

[0007] As a preferred technical solution, the thermosetting assembly includes a liquid exchange tank, an inner flow channel, a liquid inlet, a liquid outlet, an installation chamber, a liquid inlet valve, a liquid outlet valve, a liquid inlet knob, and a liquid outlet knob;

[0008] The lower mold has an internal flow channel, and the lower mold frame has a liquid inlet and a liquid outlet. The liquid inlet and the liquid outlet are connected through an installation chamber. The installation chamber is equipped with a liquid inlet valve and a liquid outlet valve, as well as a liquid inlet knob and a liquid outlet knob. The inlet of the liquid inlet valve and the outlet of the liquid outlet valve are connected through a liquid exchange tank.

[0009] As a preferred technical solution, the thermosetting assembly further includes a slide, a piston rod, an external threaded sleeve, an adjusting telescopic rod, an internal threaded sleeve, a fluid changing drive gear, a fluid changing driven gear, a squeezing rod, and a return spring;

[0010] A sliding cylinder is installed on the installation chamber, and a piston rod is slidably installed inside the sliding cylinder. An adjusting telescopic rod is installed at the lower end of the piston rod, and an external threaded sleeve is installed on the adjusting telescopic rod. An internal threaded sleeve is rotatably installed inside the installation chamber, and the threads of the internal threaded sleeve and the external threaded sleeve are engaged. A liquid-changing drive gear is fitted on the internal threaded sleeve, and a liquid-changing driven gear is coaxially installed on the liquid outlet knob. The liquid-changing driven gear meshes with the liquid-changing drive gear. An extrusion rod is installed on the upper mold frame, and the piston rod is connected to the installation chamber by a return spring.

[0011] As a preferred technical solution, a pressure sensor is installed on the side of the liquid outlet valve inside the installation chamber, and a vent hole is opened on the lower mold frame, which is connected to the inner flow channel.

[0012] As a preferred technical solution, the cleaning component includes a side plate, a cleaning frame, a blocking sensor, a cleaning roller, and a waste discharge port;

[0013] The module slide rail is provided with a side plate on the side away from the lower mold frame. A cleaning frame is installed on the side plate. An obstruction sensor is installed inside the cleaning frame. Two cleaning rollers are installed inside the cleaning frame. A waste discharge port is opened on the cleaning frame and is located below the cleaning rollers.

[0014] As a preferred technical solution, the cleaning assembly further includes a rotating shaft, a trigger rod, a special-shaped sleeve, a cleaning drive gear, a cleaning transmission gear, a cleaning driven gear, a screw, a triangular slider, and a wiping block;

[0015] A rotating shaft is mounted on the cleaning frame, a trigger rod is mounted on the rotating shaft, a shaped sleeve is mounted on the cleaning frame, the shaped sleeve is coaxial with the rotating shaft, a cleaning drive gear is sleeved on the shaped sleeve, a cleaning transmission gear and a cleaning driven gear are mounted on the cleaning frame, the cleaning drive gear meshes with the cleaning transmission gear, the cleaning transmission gear meshes with the cleaning driven gear, a screw is rotatably mounted on the cleaning frame, the cleaning driven gear is mounted on the screw, two triangular sliders are symmetrically mounted at both ends of the screw, and a wiping block is slidably mounted on the cleaning frame, the triangular sliders are located below the wiping block.

[0016] As a preferred technical solution, a reset sleeve is installed on the cleaning frame, the reset sleeve is coaxially installed with the irregular sleeve, and an annular elastic element is installed on the reset sleeve, the annular elastic element connecting the reset sleeve and the irregular sleeve.

[0017] As a preferred technical solution, a contact roller is rotatably mounted at the end of the trigger rod.

[0018] As a preferred technical solution, two grips are symmetrically installed on the lower mold, and the lower mold frame is provided with an insertion port for embedding the grips.

[0019] As a preferred technical solution, a plurality of heating rods are installed inside the adhesive storage layer, and a temperature sensor is installed inside the adhesive storage layer.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. The outlets of the flow equalization tubes are distributed at the center and four corners of the mold cavity, which allows the adhesive to enter the mold cavity evenly, achieve uniform material distribution, ensure that the flow front of the adhesive is flat and advances slowly, reduce the impact force on the line arc during the molding process, ensure the integrity of electrical connection, and improve the packaging quality.

[0022] 2. By using flow meters and shut-off valves, uniform feeding is ensured in each mold cavity, improving product consistency.

[0023] 3. Set up thermosetting components to change the adhesive during the injection process, shortening the time required for subsequent curing and improving encapsulation efficiency.

[0024] 4. Set up a cleaning component to clean the area below the upper mold, keep the mold cavity clean, and improve the packaging quality. Attached Figure Description

[0025] Figure 1 This is a first-view structural diagram of the present invention;

[0026] Figure 2 This is a schematic diagram of the second perspective structure of the present invention;

[0027] Figure 3 This is a schematic diagram of the first cross-sectional structure of the present invention;

[0028] Figure 4 This is a schematic diagram of a partial explosion structure of the present invention;

[0029] Figure 5 This is a first partial cross-sectional view of the present invention;

[0030] Figure 6 This is a partial structural diagram of the present invention;

[0031] Figure 7This is a schematic diagram of the second partial cross-sectional structure of the present invention;

[0032] Figure 8 This is a schematic diagram of the third partial cross-sectional structure of the present invention;

[0033] Figure 9 For the present invention Figure 3 Enlarged structural diagram at point A;

[0034] Figure 10 For the present invention Figure 3 Enlarged structural diagram at point B;

[0035] Figure 11 For the present invention Figure 4 A magnified structural diagram at point C.

[0036] In the diagram: 1. Module slide rail; 2. Mold closing telescopic rod; 3. Upper mold frame; 4. Lower mold frame; 5. Inlet pipe; 6. Glue storage layer; 7. Injection pipe; 8. Flow equalization pipe; 9. Upper mold; 10. Lower mold; 11. Flow meter; 12. Shut-off valve; 13. Handle; 14. Insertion port; 15. Heating rod; 16. Temperature sensor;

[0037] 17. Thermosetting assembly; 1701. Fluid changing tank; 1702. Inner flow channel; 1703. Inlet; 1704. Outlet; 1705. Installation chamber; 1706. Inlet valve; 1707. Outlet valve; 1708. Inlet knob; 1709. Outlet knob; 1710. Slide cylinder; 1711. Piston rod; 1712. External threaded sleeve; 1713. Adjusting telescopic rod; 1714. Internal threaded sleeve; 1715. Fluid changing drive gear; 1716. Fluid changing driven gear; 1717. Pressure sensor; 1718. Vent; 1719. Return spring; 1720. Extrusion rod;

[0038] 18. Cleaning assembly; 1801. Side plate; 1802. Cleaning frame; 1803. Occlusion sensor; 1804. Cleaning roller; 1805. Waste outlet; 1806. Shaft; 1807. Trigger rod; 1808. Irregular sleeve; 1809. Cleaning drive gear; 1810. Cleaning transmission gear; 1811. Cleaning driven gear; 1812. Screw; 1813. Triangular slider; 1814. Wiping block; 1815. Reset sleeve; 1816. Annular elastic element; 1817. Contact roller. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Example: Figures 1-11 As shown, the present invention provides a semiconductor packaging mold technology solution for uniform filling. The semiconductor packaging mold for uniform filling includes a module slide rail 1 and a lower mold frame 4. A mold closing telescopic rod 2 is slidably installed on the module slide rail 1. An upper mold frame 3 is installed on the mold closing telescopic rod. A glue inlet tube 5 is installed on the upper mold frame 3. A lower mold 9 is installed on the lower side of the upper mold frame 3. A flow equalization component is provided between the upper mold frame 3 and the upper mold 9. A lower mold 10 is installed inside the lower mold frame 4. A thermosetting component 17 for heating and curing is provided on the lower mold 10. A cleaning component 18 for cleaning the upper mold 9 is provided on the side of the module slide rail 1 away from the lower mold frame 4.

[0041] The flow equalization assembly includes a glue storage layer 6, a glue injection pipe 7, a flow equalization pipe 8, a flow meter 11, and a shut-off valve 12. The glue storage layer 6 is provided inside the upper mold frame 3. Multiple glue injection pipes 7 are installed on the glue storage layer 6. Each of the multiple glue injection pipes 7 is equipped with a flow equalization pipe 8. The flow meter 11 and the shut-off valve 12 are installed on the glue injection pipe 7. An upper mold 9 is installed on the lower side of the upper mold frame 3. The upper mold 9 is connected to the flow equalization pipe 8, and the flow equalization pipe 8 passes through the upper mold 9.

[0042] When performing semiconductor packaging, the components are placed in the lower mold 10, and then the lower mold 10 is placed in the lower mold frame 4. After placement, the mold closing telescopic rod 2 is driven by the module slide rail 1 to move the upper mold frame 3 to directly above the lower mold frame 4. Then, the mold closing telescopic rod 2 is retracted, so that the upper mold 9 in the upper mold frame 3 and the lower mold 10 are closed. After the mold is closed, the glue is input into the glue storage layer 6 through the glue injection pipe 5. The glue enters the mold cavity through the glue injection pipe 7 and the flow equalization pipe 8. The outlet of the flow equalization pipe 8 is distributed at the center and four corners of the mold cavity, so that the glue can enter the mold cavity evenly, achieve uniform material distribution, ensure that the flow front of the glue is flat and slowly advances, reduce the impact force on the line arc during the molding process, ensure the integrity of electrical connection, improve the packaging quality, and solve the problem that the molten molding material is difficult to reach each area at the same time when filling complex cavities, which easily produces air gaps or insufficient filling, resulting in poor packaging quality.

[0043] At the same time, when the flow meter 11 detects that the feed amount has reached the preset value, the flow meter 11 will send an electrical signal to close the shut-off valve 12 and stop the feed, ensuring uniform feeding of each mold cavity and improving product consistency.

[0044] It solves the problem that when molten molding compound fills complex cavities, it is difficult to reach all areas simultaneously, which can easily lead to air gaps or insufficient filling and result in poor packaging quality. The thermosetting component solves the problem of long heating cycles, which increase energy consumption and limit output per unit time. The cleaning component solves the problem that some materials tend to adhere to the mold surface during demolding, affecting the subsequent molding accuracy and causing possible impurity contamination, which forces the equipment to stop frequently for maintenance and affects the packaging quality.

[0045] The thermosetting assembly 17 includes a liquid exchange tank 1701, an inner flow channel 1702, a liquid inlet 1703, a liquid outlet 1704, an installation chamber 1705, a liquid inlet valve 1706, a liquid outlet valve 1707, a liquid inlet knob 1708, and a liquid outlet knob 1709.

[0046] The lower mold 10 has an internal flow channel 1702, and the lower mold frame 4 has a liquid inlet 1703 and a liquid outlet 1704. The liquid inlet 1703 and the liquid outlet 1704 are connected through an installation chamber 1705. The installation chamber 1705 is equipped with an inlet valve 1706 and a liquid outlet valve 1707. The installation chamber 1705 is also equipped with an inlet knob 1708 and a liquid outlet knob 1709. The inlet of the inlet valve 1706 and the outlet of the liquid outlet valve 1707 are connected through a liquid exchange tank 1701.

[0047] The lower mold 10 has an inner flow channel 1702, which is distributed in the lower part and around the mold cavity. In the initial state, the heat exchange liquid is only distributed in the inner flow channel 1702 at the bottom of the mold cavity. When the glue is injected into the mold cavity, the liquid level of the heat exchange liquid in the inner flow channel 1702 gradually rises. At the same time as the glue is injected, the temperature is slowly raised for curing, which shortens the curing time, improves the encapsulation efficiency, and solves the problem of long heating cycle, which leads to increased energy consumption and limited output per unit time.

[0048] The thermoset assembly 17 also includes a slide 1710, a piston rod 1711, an external threaded sleeve 1712, an adjusting telescopic rod 1713, an internal threaded sleeve 1714, a fluid change drive gear 1715, a fluid change driven gear 1716, a squeeze rod 1720, and a return spring 1719.

[0049] A slide cylinder 1710 is installed on the installation chamber 1705. A piston rod 1711 is slidably installed inside the slide cylinder 1710. An adjusting telescopic rod 1713 is installed at the lower end of the piston rod 1711. An external threaded sleeve 1712 is installed on the adjusting telescopic rod 1713. An internal threaded sleeve 1714 is rotatably installed inside the installation chamber 1705. The thread of the internal threaded sleeve 1714 is engaged with the thread of the external threaded sleeve 1712. A liquid replacement drive gear 1715 is fitted on the internal threaded sleeve 1714. A liquid replacement driven gear 1716 is coaxially installed on the liquid outlet knob 1709. The liquid replacement driven gear 1716 meshes with the liquid replacement drive gear 1715. A pressing rod 1720 is installed on the upper mold frame 3. The piston rod 1711 is connected to the installation chamber 1705 through a return spring 1719.

[0050] When the upper mold 9 moves down to close the mold, when the extrusion rod 1720 contacts the piston rod 1711 and presses the piston rod 1711 downward, the piston rod 1711 pushes the external threaded sleeve 1712 downward. Since the external threaded sleeve 1712 is threadedly engaged with the internal threaded sleeve 1714, when the external threaded sleeve 1712 moves down, it will drive the internal threaded sleeve 1714 to rotate. When the internal threaded sleeve 1714 rotates, it will drive the liquid changing drive gear 1715 to rotate synchronously. The liquid changing drive gear 1715 drives the liquid changing driven gear 1716 to rotate due to gear meshing. When the liquid changing driven gear 1716 rotates, it will drive the liquid outlet knob 1709 to rotate forward. The forward rotation of the liquid outlet knob 1709 controls the liquid outlet valve 1707 to reduce the liquid outlet. Since the liquid inlet is constant, the liquid level of the heat exchange liquid in the inner flow channel 1702 gradually rises. Liquid changing is carried out at the same time as glue injection, which shortens the time required for subsequent curing and improves the encapsulation efficiency.

[0051] Inside the installation chamber 1705, a liquid outlet valve 1707 is installed on one side, and a pressure sensor 1717 is installed. A vent hole 1718 is opened on the lower mold frame 4, and the vent hole 1718 is connected to the inner flow channel 1702.

[0052] After the mold is closed, the liquid output is less than the liquid inlet to facilitate raising the liquid level of the heat exchange fluid. When the pressure sensor 1717 detects that the heat exchange fluid fills the inner flow channel 1702, that is, when the hydraulic pressure reaches a certain value, the pressure sensor 1717 will control the adjusting telescopic rod 1713 to retract and drive the outer threaded sleeve 1712 to move upward. When the outer threaded sleeve 1712 moves upward, it will drive the inner threaded sleeve 1714 to flip, increasing the liquid output of the liquid outlet valve 1707 to be equal to the liquid inlet, ensuring the circulation of the heat exchange fluid in the inner flow channel 1702, and ensuring the curing efficiency.

[0053] Vent 1718 ensures that the air pressure in the inner flow channel 1702 is the same as the atmospheric pressure, ensuring that the pressure sensor 1717 detects hydraulic pressure, thereby accurately judging the liquid level and improving control accuracy. At the same time, vent 1718 is higher than the highest point of the inner flow channel 1702 to avoid heat exchange liquid overflow.

[0054] After curing is complete, the reset spring 1719 releases its elastic potential energy, causing the liquid outlet valve 1707 to increase the liquid flow and lower the liquid level, thus reducing unnecessary heat loss. When the liquid level drops to the initial state, the pressure sensor 1717 sends an electrical signal to control the extension rod 1713 to extend, so that the liquid outlet valve 1707 is in the same open state as the initial state.

[0055] The cleaning assembly 18 includes a side plate 1801, a cleaning frame 1802, an obstruction sensor 1803, a cleaning roller 1804, and a waste discharge port 1805;

[0056] A side plate 1801 is provided on the side of the module slide rail 1 away from the lower mold frame 4. A cleaning frame 1802 is installed on the side plate 1801. An obstruction sensor 1803 is installed inside the cleaning frame 1802. Two cleaning rollers 1804 are installed inside the cleaning frame 1802. A waste discharge port 1805 is opened on the cleaning frame 1802 and is located below the cleaning rollers 1804.

[0057] After the glue injection is completed, the heat exchange fluid is used for timed heating and curing. After the fluid exchange is completed, the mold closing telescopic rod 2 and the module slide rail 1 drive the upper mold 9 to move upward, and then move to the side closer to the side plate 1801 to facilitate the removal of the packaged product.

[0058] When the upper mold frame 3 enters the cleaning frame 1802 and blocks the blocking sensor 1803, the blocking sensor 1803 controls the cleaning roller 1804 to start rotating to clean the residual adhesive material under the upper mold 9, so as to avoid the residue from affecting the next packaging quality and further improve the packaging quality.

[0059] The two cleaning rollers 1804 rotate in opposite directions to ensure that residues are swept between the two cleaning rollers 1804, thus improving the cleaning quality.

[0060] This solves the problem that some materials tend to adhere to the mold surface during the demolding process, affecting the subsequent molding accuracy and causing potential impurity contamination, forcing frequent equipment shutdowns for maintenance, and affecting packaging quality.

[0061] The cleaning assembly 18 also includes a rotating shaft 1806, a trigger rod 1807, a special-shaped sleeve 1808, a cleaning drive gear 1809, a cleaning transmission gear 1810, a cleaning driven gear 1811, a screw 1812, a triangular slider 1813, and a wiping block 1814;

[0062] A rotating shaft 1806 is mounted on the cleaning frame 1802, and a trigger rod 1807 is mounted on the rotating shaft 1806. A special-shaped sleeve 1808 is mounted on the cleaning frame 1802, and the special-shaped sleeve 1808 is coaxial with the rotating shaft 1806. A cleaning drive gear 1809 is fitted over the special-shaped sleeve 1808. A cleaning transmission gear 1810 and a cleaning driven gear 1811 are mounted on the cleaning frame 1802. The cleaning drive gear 1809 meshes with the cleaning transmission gear 1810, and the cleaning transmission gear 1810 meshes with the cleaning driven gear 1811. A screw 1812 is rotatably mounted on the cleaning frame 1802, and the cleaning driven gear 1811 is mounted on the screw 1812. Two triangular sliders 1813 are symmetrically mounted at both ends of the screw 1812. A wiping block 1814 is slidably mounted on the cleaning frame 1802, and the triangular sliders 1813 are located below the wiping block 1814.

[0063] When the upper mold frame 3, carrying the upper mold 9, moves out of the cleaning frame 1802 for the next encapsulation, the upper mold frame 3 will push the trigger rod 1807 to rotate along the rotating shaft 1806. Due to the limiting of the shaped sleeve 1808, the trigger rod 1807 will drive the shaped sleeve 1808 to rotate synchronously. When the shaped sleeve 1808 rotates, it will drive the cleaning drive gear 1809 to rotate. The cleaning drive gear 1809, due to gear meshing, drives the cleaning driven gear 1811 to rotate through the cleaning transmission gear 1810. When the cleaning driven gear 1811 rotates, it will drive the screw 1812 to rotate. When the screw 1812 rotates, it engages with the triangular slider 1813, and the two ends of the screw 1812 have opposite threads. When the screw 1812 rotates clockwise, it drives the two triangular sliders 1813 to move closer together. The wiping block 1814 can only slide up and down along the cleaning frame 1802. When the two triangular sliders 1813 move closer together, they will push the wiping block 1814 upward, so that the wiping block 1814 contacts the bottom of the upper mold 9, and further cleans the residue that may remain on the lower surface of the upper mold 9, so as to avoid poor mold closing caused by residue and further improve the packaging quality.

[0064] The irregular sleeve 1808 is an incomplete ring. When the upper mold frame 3 enters the cleaning frame 1802, the trigger rod 1807 rotates at the gap in the irregular sleeve 1808. At this time, it will not drive the wiping block 1814 to move. Therefore, the wiping block 1814 will only clean the lower surface of the upper mold 9 when the upper mold frame 3 moves out of the cleaning frame 1802, ensuring that impurities can be discharged through the waste discharge port 1805. In conjunction with the use of the cleaning roller 1804, the wear of the wiping block 1814 is reduced and the cleanliness is improved.

[0065] A reset sleeve 1815 is installed on the cleaning frame 1802. The reset sleeve 1815 is coaxially installed with the irregular sleeve 1808. An annular elastic element 1816 is installed on the reset sleeve 1815. The annular elastic element 1816 connects the reset sleeve 1815 and the irregular sleeve 1808.

[0066] When the upper mold frame 3 is completely removed from the cleaning frame 1802, after there is no downward pressure on the trigger rod 1807, the annular elastic element 1816 releases its elastic potential energy to restore the irregular sleeve 1808 to its initial state and causes the wiping block 1814 to move down to prepare for the next wiping.

[0067] Meanwhile, a reset sleeve 1815 and an annular elastic element 1816 are also installed on the outside of the rotating shaft 1806 for resetting the rotating shaft 1806 and the trigger rod 1807. After the upper mold frame 3 is fully inserted into the cleaning frame 1802, the trigger rod 1807 is reset, which facilitates the subsequent upward movement of the wiping block 1814.

[0068] A contact roller 1817 is rotatably mounted on the end of the trigger rod 1807.

[0069] The contact roller 1817 can reduce frictional loss when the contact roller 1817 contacts the upper mold frame 3, avoid insufficient contact between the wiping block 1814 and the upper mold 9 caused by wear, and improve cleaning quality.

[0070] Two grips 13 are symmetrically installed on the lower mold 10, and the lower mold frame 4 has an insertion port 14 for inserting the grips 13.

[0071] The handle 13 makes it easy to remove the lower mold 10 and the packaged semiconductor, facilitating operation.

[0072] Several heating rods 15 are installed inside the glue storage layer 6, and a temperature sensor 16 is installed inside the glue storage layer 6.

[0073] Temperature sensor 16 can detect the temperature of adhesive in the storage layer 6 in real time. When the temperature is low, it can be heated by heating rod 15 to avoid poor flowability caused by insufficient preheating.

[0074] Working principle of the invention:

[0075] When performing semiconductor packaging, the components are placed in the lower mold 10, and then the lower mold 10 is placed in the lower mold frame 4. After placement, the mold closing telescopic rod 2 is driven by the module slide rail 1 to move the upper mold frame 3 to directly above the lower mold frame 4. Then, the mold closing telescopic rod 2 is retracted, so that the upper mold 9 in the upper mold frame 3 and the lower mold 10 are closed. After the mold is closed, the adhesive is fed into the adhesive storage layer 6 through the glue injection pipe 5. The adhesive enters the mold cavity through the glue injection pipe 7 and the flow equalization pipe 8. The outlets of the flow equalization pipe 8 are distributed at the center and four corners of the mold cavity, so that the adhesive can enter the mold cavity evenly, achieve uniform material distribution, ensure that the flow front of the adhesive is flat and advances slowly, reduce the impact force on the line arc during the molding process, ensure the integrity of electrical connection, and improve the packaging quality.

[0076] At the same time, when the flow meter 11 detects that the feed amount has reached the preset value, the flow meter 11 will send an electrical signal to close the shut-off valve 12 and stop the feed, ensuring uniform feeding of each mold cavity and improving product consistency.

[0077] The lower mold 10 has an inner flow channel 1702, which is distributed in the lower part and around the mold cavity. In the initial state, the heat exchange liquid is only distributed in the inner flow channel 1702 at the bottom of the mold cavity. When the glue is injected into the mold cavity, the liquid level of the heat exchange liquid in the inner flow channel 1702 gradually rises. At the same time as the glue is injected, the temperature is slowly raised for curing, which shortens the curing time and improves the encapsulation efficiency.

[0078] After the glue injection is completed, the heat exchange fluid is used for timed heating and curing. After the fluid exchange is completed, the mold closing telescopic rod 2 and the module slide rail 1 drive the upper mold 9 to move upward, and then move to the side closer to the side plate 1801 to facilitate the removal of the packaged product.

[0079] When the upper mold frame 3 enters the cleaning frame 1802 and blocks the blocking sensor 1803, the blocking sensor 1803 controls the cleaning roller 1804 to start rotating to clean the residual adhesive material under the upper mold 9, so as to avoid the residue from affecting the next packaging quality and further improve the packaging quality.

[0080] The two cleaning rollers 1804 rotate in opposite directions to ensure that the residue is swept between the two cleaning rollers 1804, thus improving the cleaning quality.

[0081] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor packaging mold with uniform filling, characterized in that: The uniformly filled semiconductor packaging mold includes a module slide rail (1) and a lower mold frame (4). A mold closing telescopic rod (2) is slidably installed on the module slide rail (1). An upper mold frame (3) is installed on the mold closing telescopic rod (2). A glue inlet pipe (5) is installed on the upper mold frame (3). A lower upper mold (9) is installed on the lower side of the upper mold frame (3). A flow equalization component is provided between the upper mold frame (3) and the upper mold (9). A lower mold (10) is installed inside the lower mold frame (4). A thermosetting component (17) for heating and curing is provided on the lower mold (10). A cleaning component (18) for cleaning the upper mold (9) is provided on the side of the module slide rail (1) away from the lower mold frame (4). The flow equalization assembly includes a glue storage layer (6), a glue injection pipe (7), a flow equalization pipe (8), a flow meter (11), and a shut-off valve (12). The upper mold frame (3) has a glue storage layer (6) inside. Multiple glue injection pipes (7) are installed on the glue storage layer (6). Each of the multiple glue injection pipes (7) is equipped with a flow equalization pipe (8). A flow meter (11) and a shut-off valve (12) are installed on the glue injection pipes (7). An upper mold (9) is installed below the upper mold frame (3). The upper mold (9) is connected to the flow equalization pipe (8), and the flow equalization pipe (8) passes through the upper mold (9). The thermosetting component (17) includes an inner flow channel (1702) and an extrusion rod (1720). The lower mold (10) has an inner flow channel (1702) and the upper mold frame (3) is equipped with an extrusion rod (1720). The liquid is changed while the glue is being injected, which shortens the time required for subsequent curing. The cleaning assembly (18) includes a side plate (1801), a cleaning frame (1802), a blocking sensor (1803), a cleaning roller (1804), and a waste discharge port (1805). The module slide rail (1) is provided with a side plate (1801) on the side away from the lower mold frame (4). A cleaning frame (1802) is installed on the side plate (1801). An obstruction sensor (1803) is installed inside the cleaning frame (1802). Two cleaning rollers (1804) are installed inside the cleaning frame (1802). A waste discharge port (1805) is opened on the cleaning frame (1802) and the waste discharge port (1805) is located below the cleaning rollers (1804).

2. The semiconductor packaging mold with uniform filling according to claim 1, characterized in that: The thermosetting assembly (17) includes a liquid exchange tank (1701), a liquid inlet (1703), a liquid outlet (1704), an installation chamber (1705), a liquid inlet valve (1706), a liquid outlet valve (1707), a liquid inlet knob (1708), and a liquid outlet knob (1709). The lower mold frame (4) is provided with an inlet (1703) and an outlet (1704). The inlet (1703) and the outlet (1704) are connected through an installation chamber (1705). An inlet valve (1706) and an outlet valve (1707) are installed on the installation chamber (1705). An inlet knob (1708) and an outlet knob (1709) are installed on the installation chamber (1705). The inlet of the inlet valve (1706) and the outlet of the outlet valve (1707) are connected through a liquid exchange tank (1701).

3. The semiconductor packaging mold with uniform filling according to claim 2, characterized in that: The thermosetting assembly (17) also includes a slide (1710), a piston rod (1711), an external threaded sleeve (1712), an adjusting telescopic rod (1713), an internal threaded sleeve (1714), a fluid change drive gear (1715), a fluid change driven gear (1716), and a return spring (1719). A slide cylinder (1710) is installed on the installation chamber (1705). A piston rod (1711) is slidably installed inside the slide cylinder (1710). An adjusting telescopic rod (1713) is installed at the lower end of the piston rod (1711). An external threaded sleeve (1712) is installed on the adjusting telescopic rod (1713). An internal threaded sleeve (1714) is rotatably installed inside the installation chamber (1705). The thread of the internal threaded sleeve (1714) is engaged with the thread of the external threaded sleeve (1712). A fluid replacement drive gear (1715) is fitted on the internal threaded sleeve (1714). A fluid replacement driven gear (1716) is coaxially installed on the liquid outlet knob (1709). The fluid replacement driven gear (1716) meshes with the fluid replacement drive gear (1715). The piston rod (1711) is connected to the installation chamber (1705) through a return spring (1719).

4. A semiconductor packaging mold with uniform filling according to claim 3, characterized in that: The installation chamber (1705) is equipped with a liquid outlet valve (1707) and a pressure sensor (1717) is installed on one side. The lower mold frame (4) is provided with a vent hole (1718), which is connected to the inner flow channel (1702).

5. A semiconductor packaging mold with uniform filling according to claim 4, characterized in that: The cleaning assembly (18) also includes a rotating shaft (1806), a trigger rod (1807), a special-shaped sleeve (1808), a cleaning drive gear (1809), a cleaning transmission gear (1810), a cleaning driven gear (1811), a screw (1812), a triangular slider (1813), and a wiping block (1814). A rotating shaft (1806) is mounted on the cleaning frame (1802), a trigger rod (1807) is mounted on the rotating shaft (1806), and a special-shaped sleeve (1808) is mounted on the cleaning frame (1802). The special-shaped sleeve (1808) is coaxial with the rotating shaft (1806), and a cleaning drive gear (1809) is sleeved on the special-shaped sleeve (1808). A cleaning transmission gear (1810) and a cleaning driven gear (1811) are mounted on the cleaning frame (1802). The cleaning drive gear (1809) is connected to the cleaning shaft (1806). The cleaning transmission gear (1810) meshes with the cleaning driven gear (1811). A screw (1812) is rotatably mounted on the cleaning frame (1802). The cleaning driven gear (1811) is mounted on the screw (1812). Two triangular sliders (1813) are symmetrically mounted at both ends of the screw (1812). A wiping block (1814) is slidably mounted on the cleaning frame (1802). The triangular sliders (1813) are located below the wiping block (1814).

6. A semiconductor packaging mold with uniform filling according to claim 5, characterized in that: A reset sleeve (1815) is installed on the cleaning frame (1802). The reset sleeve (1815) is coaxially installed with the shaped sleeve (1808). An annular elastic element (1816) is installed on the reset sleeve (1815). The annular elastic element (1816) connects the reset sleeve (1815) and the shaped sleeve (1808).

7. A semiconductor packaging mold with uniform filling according to claim 5, characterized in that: A contact roller (1817) is rotatably mounted at the end of the trigger rod (1807).

8. A semiconductor packaging mold with uniform filling according to claim 1, characterized in that: Two grips (13) are symmetrically installed on the lower mold (10), and the lower mold frame (4) has an insertion port (14) for inserting the grips (13).

9. A semiconductor packaging mold with uniform filling according to claim 1, characterized in that: A plurality of heating rods (15) are installed in the glue storage layer (6), and a temperature sensor (16) is installed in the glue storage layer (6).

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