Copolymerized polyamide-imide, film, preparation method and electronic device

By preparing copolymer polyamide-imide films, the problems of insufficient light transmittance and mechanical properties of traditional polyimide materials in flexible displays have been solved, and films with high modulus, low coefficient of thermal expansion and high transparency have been achieved, which are suitable for substrates and encapsulation layers of flexible display devices.

CN122080404APending Publication Date: 2026-05-26ZHEJIANG SHENGKE NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202610143510.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-02-02
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Traditional polyimide materials have insufficient light transmittance, thermal stability, and mechanical strength in flexible displays. Furthermore, the doping of inorganic nanoparticles leads to a decrease in light transmittance and an increase in haze, making it difficult to meet the requirements of flexible displays for high transparency, low coefficient of thermal expansion, and high mechanical properties.

Method used

A copolymer polyamide-imide film is formed by copolymerizing fluorinated aromatic dianhydride monomers, ether-bonded aromatic diamine monomers, and aromatic diacyl chloride monomers to form imide and amide units. High transparency and mechanical properties are ensured by low-temperature drop-addition and stepwise imidization processes.

Benefits of technology

It achieves high modulus, low coefficient of thermal expansion, excellent transparency and tear resistance, and is suitable for substrates and encapsulation layers of flexible display devices, supporting high-temperature fabrication and large-scale production.

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Abstract

The invention provides copolymerized polyamide-imide, a film, a preparation method and an electronic device, and belongs to the field of flexible display materials. The copolymerized polyamide-imide is at least prepared from a reaction system containing the following monomers: a) a fluorine-containing aromatic dianhydride monomer; b) an aromatic diamine monomer containing ether bonds and fluorine; and c) an aromatic diacyl chloride monomer. The copolymerized polyamide-imide disclosed by the invention is prepared by carrying out polycondensation and chemical imidization on a dianhydride component, a diamine component and an acyl chloride component in a polar solvent; a rigid benzene ring structure and a hydrogen bond in a main chain can improve the modulus to be larger than or equal to 6 Gpa, the size stability is high, the thermal expansion coefficient is smaller than or equal to 10 ppm / DEG C, meanwhile, a large-steric-hindrance side group of a benzene ring on the main chain can effectively improve the optical performance of the thin film, light transmittance is prevented from being affected by low-temperature dropwise adding and step-by-step imidization (the light transmittance of the waveband of 360-780 nm is larger than or equal to 88%), the benzene ring structure containing an ether bond on the main chain, and the light transmittance of the thin film is larger than or equal to 80%. The tearing strength of the membrane material can be effectively improved.
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