An insertion test mechanism for memory chip testing

Abstract

This invention relates to the field of memory chip testing technology and discloses an insertion test mechanism for memory chip testing. The mechanism includes a testing body, with clamping and positioning mechanisms on the inner sides of both ends. Each clamping and positioning mechanism includes a test probe assembly. A fixed seat is located on one side of the test probe assembly. A bidirectional adjusting rod is rotatably connected to the inner wall of the fixed seat. Two adjusting blocks are threaded onto the outer surface of the bidirectional adjusting rod. A clamping block is fixedly connected to one end of each adjusting block. A positioning post is fixedly connected to one side of each clamping block. A docking block is fixedly connected to one side of the fixed seat. A positioning seat is slidably connected to the inner wall of the docking block. An auxiliary positioning mechanism, including an arc-shaped positioning block, is located inside the docking block. This invention achieves convenient clamping, fixing, and precise positioning of the test probe assembly through the clamping and positioning mechanism, and, in conjunction with the auxiliary positioning mechanism, completes pre-fixation, ensuring the stability and accuracy of the testing process.

Description

Technical Field

[0001] This invention relates to the field of memory chip testing technology, and in particular to an insertion test mechanism, a supporting test system, and a test method for memory chip testing. Background Technology

[0002] As a core component of electronic devices, memory chips are widely used in various electronic products such as computers, mobile phones, servers, and IoT devices. Their quality directly affects the performance and stability of electronic devices. With the rapid development of electronic technology, memory chips are becoming increasingly integrated, with more pins and smaller pin spacing, which places higher demands on their detection accuracy and efficiency.

[0003] In the manufacturing process of memory chips, comprehensive testing is required on the chips' electrical performance, communication functions, data storage and retrieval capabilities, etc., to screen out qualified products and eliminate unqualified ones. Insertion testing is a key step in memory chip testing, which achieves the acquisition and analysis of various electrical and functional signals through precise contact between test probes and chip pins.

[0004] In existing memory chip insertion testing equipment, test probe assemblies are typically secured with multiple bolts. However, test probes experience wear and aging over long-term use, requiring regular replacement and maintenance. The traditional bolt-fixing method makes disassembly and installation of the test probe assembly cumbersome, requiring significant time to tighten the bolts and severely impacting testing efficiency. Furthermore, traditional equipment lacks effective pre-positioning and precise positioning structures, making it difficult to quickly and accurately position the test probe assembly during installation. This results in insufficient contact precision between the test probe and the chip pins, affecting the accuracy of test data and potentially damaging the chip pins. In addition, existing testing equipment has limited functionality, poor coordination between modules, and a lack of standardized testing procedures, further reducing testing efficiency and the reliability of test results.

[0005] To address the aforementioned problems in the existing technology, this invention provides an insertion test mechanism, a supporting test system, and a test method for memory chip testing. This enables convenient replacement, precise positioning, and stable clamping of the test probe assembly. Furthermore, through a systematic test design and standardized test process, it improves the testing efficiency and accuracy of memory chips, meeting the testing requirements in mass production scenarios. Summary of the Invention

[0006] The purpose of this invention is to address the shortcomings of existing memory chip insertion testing equipment, such as inconvenient replacement of test probe components, insufficient positioning accuracy, poor coordination of the detection system, and cumbersome detection process, and to provide an insertion testing mechanism, supporting testing system, and testing method for memory chip testing.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: An insertion test mechanism for testing memory chips includes: a testing body, with clamping and positioning mechanisms on the inner sides of both ends of the testing body. Each clamping and positioning mechanism includes a test probe assembly. A fixed seat is provided on one side of the test probe assembly. A bidirectional adjusting rod is rotatably connected to the inner wall of the fixed seat. An adjusting block is threadedly connected to the outer surface of the bidirectional adjusting rod. There are two adjusting blocks. A clamping block is fixedly connected to one end of each adjusting block. A positioning post is fixedly connected to one side of each clamping block. A docking block is fixedly connected to one side of the fixed seat. A positioning seat is slidably connected to the inner wall of the docking block. An auxiliary positioning mechanism is provided inside the docking block. The auxiliary positioning mechanism includes an arc-shaped positioning block.

[0008] In a preferred embodiment, the fixed base is fixedly connected to the testing body, the adjusting block is sleeved inside the fixed base, the adjusting block is slidably connected to the inner wall of the fixed base, and the positioning post is sleeved inside the test probe assembly.

[0009] In a preferred embodiment, the positioning post is slidably connected to the inner wall of the test probe assembly, the positioning seat is fixedly connected to the test probe assembly, and a rotating bearing is sleeved on the outer surface of one end of the bidirectional adjusting rod, the rotating bearing being placed inside the fixed seat.

[0010] In a preferred embodiment, the rotating bearing is fixedly connected to the inner wall of the fixed seat and the outer surface of the bidirectional adjusting rod, and an adjusting drive block is fixedly connected to one end of the bidirectional adjusting rod.

[0011] In a preferred embodiment, the arc-shaped positioning block is sleeved inside the docking block and the positioning seat, and the arc-shaped positioning block is slidably connected to the inner walls of both the docking block and the positioning seat. One end of the arc-shaped positioning block is provided with a limiting block, and the limiting block is fixedly connected to the arc-shaped positioning block.

[0012] In a preferred embodiment, the limiting block is sleeved inside the docking block, the limiting block is slidably connected to the inner wall of the docking block, and one side of the limiting block is provided with an elastic reset member.

[0013] In a preferred embodiment, the two ends of the elastic reset member are fixedly connected to the outer surface of the limiting block and the inner wall of the docking block, respectively, and a manual adjustment block is fixedly connected to one end of the limiting block.

[0014] The present invention also discloses a test system supporting the above insertion test mechanism, including a chip conveying module, a clamping and positioning module, a probe contact module, a signal acquisition module, a signal processing module, a data analysis module, a result output module and a control system. Each module works in cooperation to achieve full-process automatic control of the storage chip from conveying, positioning, detection to result output.

[0015] The present invention also discloses a test method supporting the above test system, including steps such as equipment initialization, installation of the test probe assembly, feeding of the chip to be detected, precise docking of the probe, signal acquisition and processing, data analysis and result determination, result output and chip shunting, and continuous detection. Through standardized process design, the normativity and efficiency of the detection process are ensured.

[0016] Compared with the prior art, the advantages and positive effects of the present invention are as follows: 1. By setting the clamping and positioning mechanism, the present invention realizes the convenient clamping and fixing of the test probe assembly. When the bidirectional adjusting rod rotates, it can drive the two adjusting blocks by thread, causing the adjusting blocks to move towards or away from each other simultaneously, and then带动 the clamping blocks and the positioning columns to move synchronously, enabling the positioning columns to enter or exit the test probe assembly, so as to achieve the purpose of fixing and releasing the fixation. Compared with the traditional bolt fixing method, there is no need to frequently turn multiple bolts, which greatly simplifies the installation and replacement process of the test probe assembly, and effectively improves the maintenance efficiency and detection efficiency of the detection equipment.

[0017] 2. Multiple positioning columns in the clamping and positioning mechanism can enter the test probe assembly simultaneously and closely fit with the inner wall of the test probe assembly, significantly improving the stability of the test probe assembly after installation, avoiding detection errors caused by the晃动 of the test probe assembly during the detection process, and ensuring the accuracy of the detection data.

[0018] 3. The matching design of the docking block and the positioning seat realizes the precise pre-positioning of the test probe assembly. The positioning seat is installed inside the docking block following the test probe assembly. When the positioning seat is completely and precisely connected to the docking block, the test probe assembly is exactly at the preset detection position, ensuring that the positioning columns in the clamping and positioning mechanism can accurately engage into the interior of the test probe assembly, further improving the positioning accuracy of the test probe assembly, and providing a reliable guarantee for the subsequent precise contact between the test probe and the pins of the storage chip.

[0019] 4. The auxiliary positioning mechanism further optimizes the installation process of the test probe assembly. The auxiliary positioning mechanism works in conjunction with the test probe assembly to achieve pre-fixation. The arc-shaped positioning block, under the action of the elastic reset component, automatically engages into the slot of the positioning seat, temporarily fixing the test probe assembly in the appropriate position. This facilitates subsequent final clamping and fixing by the operator using the bidirectional adjustment rod, eliminating the need for the operator to continuously support the test probe assembly during installation, reducing operational difficulty and improving installation efficiency. Simultaneously, the design of the manual adjustment block allows the operator to easily remove the arc-shaped positioning block from the positioning seat when it is necessary to disassemble the test probe assembly, thus releasing the pre-fixation state. This convenient operation is key.

[0020] 5. The supporting testing system enables the coordinated operation of various functional modules. The chip delivery module ensures the precise delivery and positioning of the memory chip; the clamping and positioning module ensures the stable installation and precise positioning of the test probe assembly; the probe contact module achieves precise contact between the test probe and the chip pins; the signal acquisition module, signal processing module, and data analysis module complete the acquisition, processing, and analysis of detection signals; the result output module enables the intuitive display and storage of test results; and the control system coordinates the workflow of each module, realizing automated control of memory chip testing and effectively improving testing efficiency and the standardization of the testing process.

[0021] 6. The standardized test method design provides a unified operating procedure for the testing of memory chips. From equipment initialization, test probe assembly installation, chip loading, probe docking, signal processing to result output and chip splitting, each step has clear operating specifications, ensuring consistency and reliability of testing for different operators and different batches, reducing the impact of human error on test results, and also facilitating the operation training and management of the testing equipment.

[0022] 7. The insertion testing mechanism, testing system, and testing method of this invention have a reasonable overall structural design, with each part working in harmony, making them suitable for batch testing scenarios of various memory chips. Whether it's a common memory chip or a highly integrated memory chip with fine pin pitch, this invention can achieve accurate and efficient testing, demonstrating broad applicability and promotional value. Attached Figure Description

[0023] Figure 1 This is a perspective view of an insertion test mechanism for detecting memory chips provided by the present invention.

[0024] Figure 2 This invention provides a schematic diagram of the tool body mounting of an insertion test mechanism for memory chip testing.

[0025] Figure 3This is a split schematic diagram of the clamping mechanism of an insertion test mechanism for memory chip detection provided by the present invention.

[0026] Figure 4 This invention provides a schematic diagram of the installation of a bidirectional threaded rod in an insertion test mechanism for memory chip testing.

[0027] Figure 5 A cross-sectional perspective view of an auxiliary mechanism for an insertion test mechanism for memory chip detection provided by the present invention; Figure 6 The present invention provides a flowchart of a test system for an insertion test mechanism for testing memory chips.

[0028] Legend: 1. Testing body; 2. Clamping and positioning mechanism; 3. Auxiliary positioning mechanism; 21. Test probe assembly; 22. Fixing base; 23. Bidirectional adjusting rod; 24. Adjusting block; 25. Clamping block; 26. Positioning column; 27. Docking block; 28. Positioning seat; 29. ​​Rotary bearing; 201. Adjustment drive block; 31. Arc-shaped positioning block; 32. Limit stop block; 33. Elastic reset component; 34. Manual adjusting block; 4. Chip delivery module; 5. Clamping and positioning module; 6. Probe contact module; 7. Signal acquisition module; 8. Signal processing module; 9. Data analysis module; 10. Result output module; 11. Control system. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1 An insertion test mechanism for testing memory chips includes: a testing body 1, with clamping and positioning mechanisms 2 on the inner sides of both ends of the testing body 1. Each clamping and positioning mechanism 2 includes a test probe assembly 21. A fixed seat 22 is provided on one side of the test probe assembly 21. A bidirectional adjusting rod 23 is rotatably connected to the inner wall of the fixed seat 22. An adjusting block 24 is threadedly connected to the outer surface of the bidirectional adjusting rod 23. There are two adjusting blocks 24. A clamping block 25 is fixedly connected to one end of each adjusting block 24. A positioning post 26 is fixedly connected to one side of the clamping block 25. A docking block 27 is fixedly connected to one side of the fixed seat 22. A positioning seat 28 is slidably connected to the inner wall of the docking block 27. An auxiliary positioning post is provided inside the docking block 27. Positioning mechanism 3, auxiliary positioning mechanism 3 includes arc-shaped positioning block 31, fixed seat 22 fixedly connected to the detection body 1, adjusting block 24 sleeved inside the fixed seat 22, adjusting block 24 slidably connected to the inner wall of the fixed seat 22, positioning column 26 sleeved inside the test probe assembly 21, positioning column 26 slidably connected to the inner wall of the test probe assembly 21, positioning seat 28 fixedly connected to the test probe assembly 21, a rotating bearing 29 sleeved on the outer surface of one end of the bidirectional adjusting rod 23, the rotating bearing 29 is placed inside the fixed seat 22, the rotating bearing 29 is fixedly connected to the inner wall of the fixed seat 22 and the outer surface of the bidirectional adjusting rod 23, and an adjusting drive block 201 is fixedly connected to one end of the bidirectional adjusting rod 23.

[0031] In this embodiment, the fixed base 22 is fixedly connected to the detection body 1, providing a stable installation foundation for the entire clamping and positioning mechanism 2. The bidirectional adjusting rod 23 is mounted on the inner wall of the fixed base 22 via a rotating bearing 29. The rotating bearing 29 reduces the friction force when the bidirectional adjusting rod 23 rotates, ensuring that the bidirectional adjusting rod 23 can rotate flexibly and smoothly. It also plays a role in axial positioning of the bidirectional adjusting rod 23, preventing axial displacement during rotation.

[0032] The adjusting block 24 is fitted inside the fixed base 22 and slidably connected to the inner wall of the fixed base 22. The inner wall of the fixed base 22 guides the movement direction of the adjusting block 24, ensuring that the adjusting block 24 can move stably along the length of the fixed base 22. The outer surface of the bidirectional adjusting rod 23 is provided with two sections of threads with opposite directions of rotation. The two adjusting blocks 24 are respectively threaded onto these two sections of threads. When the bidirectional adjusting rod 23 rotates, it will generate driving forces in opposite directions on the two adjusting blocks, so that the two adjusting blocks can move towards or in opposite directions simultaneously.

[0033] One end of the adjusting block 24 is fixedly connected to the clamping block 25. Multiple positioning posts 26 are fixedly connected to one side of the clamping block 25. The number of positioning posts 26 can be reasonably set according to the structure of the test probe assembly 21 to ensure stable clamping of the test probe assembly 21. The positioning posts 26 are slidably connected to the inner wall of the test probe assembly 21. When the two adjusting blocks 24 move towards each other, they will drive the clamping block 25 and the positioning posts 26 to move synchronously. The positioning posts 26 gradually insert into the corresponding positioning holes on the test probe assembly 21 until they are tightly fitted against the inner wall of the positioning holes, thus achieving stable clamping of the test probe assembly 21. When it is necessary to disassemble the test probe assembly 21, the bidirectional adjusting rod 23 is rotated in the opposite direction, causing the two adjusting blocks 24 to move in opposite directions, driving the positioning posts 26 out of the positioning holes of the test probe assembly 21, releasing the clamping fixation.

[0034] The adjustment drive block 201 is fixedly connected to the bidirectional adjustment rod 23. The adjustment drive block 201 can adopt an internal hexagonal structure, an external hexagonal structure, or other structures that are easy to drive with tools. The operator can use the corresponding tool to insert into the adjustment drive block 201 and rotate the tool to drive the bidirectional adjustment rod 23 to rotate, which is convenient and labor-saving.

[0035] The positioning seat 28 is fixedly connected to the test probe assembly 21, and the docking block 27 is fixedly connected to the fixing seat 22. The inner wall of the docking block 27 is provided with a sliding groove that matches the positioning seat 28, allowing the positioning seat 28 to slide along the sliding groove into the interior of the docking block 27. When the positioning seat 28 is fully slid into the docking block 27, the test probe assembly 21 is exactly in the preset detection position. At this time, the positioning post 26 is precisely aligned with the positioning hole on the test probe assembly 21, ensuring that the subsequent positioning post can be smoothly inserted into the positioning hole, thus achieving precise positioning of the test probe assembly 21.

[0036] In Example 2, an arc-shaped positioning block 31 is fitted inside the docking block 27 and the positioning seat 28. The arc-shaped positioning block 31 is slidably connected to the inner walls of the docking block 27 and the positioning seat 28. One end of the arc-shaped positioning block 31 is provided with a limiting block 32, which is fixedly connected to the arc-shaped positioning block 31. The limiting block 32 is fitted inside the docking block 27 and is slidably connected to the inner wall of the docking block 27. One side of the limiting block 32 is provided with an elastic reset member 33, and the two ends of the elastic reset member 33 are fixedly connected to the outer surface of the limiting block 32 and the inner wall of the docking block 27, respectively. One end of the limiting block 32 is fixedly connected with a manual adjustment block 34.

[0037] In this embodiment, an installation cavity for accommodating the arc-shaped positioning block 31, the limiting stop block 32 and the elastic resetting member 33 is provided inside the docking block 27. One end of the arc-shaped positioning block 31 extends out of the installation cavity and can cooperate with the card slot formed on the positioning seat 28. An arc-shaped card slot matching the arc-shaped positioning block 31 is provided on the side surface of the positioning seat 28. When the positioning seat 28 slides into the docking block 27, the end of the positioning seat 28 will contact the inclined surface of the arc-shaped positioning block 31 and exert a squeezing force on the arc-shaped positioning block 31, causing the arc-shaped positioning block 31 to slide towards the inside of the installation cavity.

[0038] When the arc-shaped positioning block 31 slides, it will带动 the limiting stop block 32 to move synchronously. The limiting stop block 32 is slidably connected to the inner wall of the docking block 27, and the inner wall of the installation cavity guides the movement of the limiting stop block 32 to ensure that the limiting stop block 32 can move smoothly. When the limiting stop block 32 moves, it will compress the elastic resetting member 33. The elastic resetting member 33 can adopt components with good elastic resetting performance such as springs, and stores elastic potential energy during the compression process.

[0039] When the positioning seat 28 completely slides into the docking block 27 and the card slot on the positioning seat 28 is aligned with the arc-shaped positioning block 31, the elastic potential energy stored in the elastic resetting member 33 is instantly released, pushing the limiting stop block 32 and the arc-shaped positioning block 31 to slide towards the outside of the installation cavity. One end of the arc-shaped positioning block 31 is stuck into the card slot of the positioning seat 28, realizing the pre-fixation of the positioning seat 28, and further temporarily fixing the test probe assembly 21 at the preset position.

[0040] One end of the manual adjustment block 34 extends out of the docking block 27, which is convenient for the operator to operate. When it is necessary to解除 the pre-fixation, the operator can pull the manual adjustment block 34. The manual adjustment block 34带动 the limiting stop block 32 and the arc-shaped positioning block 31 to slide towards the inside of the installation cavity. The arc-shaped positioning block 31脱离 the card slot of the positioning seat 28. At this time, the positioning seat 28 can be抽出 from the docking block 27 to complete the disassembly of the test probe assembly 21.

[0041] The elastic resetting member 33 is always in a pre-compressed state, ensuring that the arc-shaped positioning block 31 can be tightly engaged in the card slot of the positioning seat 28 and improving the stability of the pre-fixation. At the same time, the elastic force of the elastic resetting member 33 can be reasonably selected according to actual needs,既要保证 the reliability of the pre-fixation,又要避免 the elastic force being too large导致 the positioning seat 28 being difficult to slide in or抽出.

[0042] Embodiment 3 The present invention also discloses a test system配套 to the above insertion test mechanism, including a chip conveying module, a clamping and positioning module, a probe contact module, a signal acquisition module, a signal processing module, a data analysis module, a result output module and a control system.

[0043] It should be noted that there are some inaccuracies or unclear expressions in the original text, such as "带动" which should be more accurately translated as "带动" (it might be a misspelling), "解除" which should be more precisely "解除" (it might be a misspelling), "抽出" which should be more accurately "抽出" (it might be a misspelling), and "既要保证......又要避免......导致......" which has some incorrect grammar in the context. The above translation tries to make sense based on the overall context while keeping the original text's problems as much as possible for reference.The chip delivery module includes a delivery track, a positioning fixture, and a drive unit. The delivery track carries the memory chip to be tested. The drive unit can use a motor, cylinder, or other drive components to move the delivery track and deliver the chip to the testing station. The positioning fixture is set at the testing station and can be a pneumatic fixture or an electric fixture. It is used to fix the chip delivered to the testing station, ensuring that the chip will not be displaced during the testing process and that the chip pins are accurately aligned with the test probe assembly.

[0044] The clamping and positioning module, namely the clamping and positioning mechanism and the auxiliary positioning mechanism mentioned above, is used to achieve pre-fixation, precise positioning and stable clamping of the test probe assembly, and to ensure precise contact between the test probe and the chip pin.

[0045] The probe contact module includes a driving component and a guiding mechanism. The driving component can be a servo motor, a precision cylinder, etc., used to drive the test probe assembly to move along a preset direction to achieve contact and separation between the test probe and the chip pin. The guiding mechanism is used to ensure the movement accuracy of the test probe assembly and ensure that the test probe can be accurately aligned with the chip pin.

[0046] The signal acquisition module includes various signal sensors, data acquisition cards, etc., used to acquire various detection signals such as electrical signals (such as voltage and current signals) and communication signals (such as data transmission signals and control signals) between the test probe assembly and the memory chip, and transmit the acquired raw signals to the signal processing module.

[0047] The signal processing module includes signal filtering circuits, signal amplification circuits, and analog-to-digital conversion circuits, used to process the acquired raw signals. The signal filtering circuit removes interference signals from the raw signal, the signal amplification circuit amplifies weak signals, and the analog-to-digital conversion circuit converts analog signals into digital signals for subsequent processing by the data analysis module.

[0048] The data analysis module can utilize devices with data processing capabilities, such as microcontrollers, PLCs, and industrial computers, and has built-in preset standard data for memory chip testing. The data analysis module receives digital signals transmitted from the signal processing module and performs multi-dimensional comparative analysis against the preset standard data, including signal strength, transmission rate, response time, and data accuracy. Based on the comparison results, it determines whether the memory chip is qualified.

[0049] The results output module includes a display screen, a printer, and a storage unit. The display screen is used to show the test results in real time (such as pass / fail, non-compliant items, test quantity, etc.), the printer can print test reports, and the storage unit is used to store test data and test reports for easy subsequent query and traceability.

[0050] The control system can adopt a PLC controller, an industrial computer, etc., establish communication connections with the chip conveying module, the clamping and positioning module, the probe contact module, the signal acquisition module, the signal processing module, the data analysis module, and the result output module, receive the feedback signals of each module, send control instructions, coordinate the working processes of each module, and achieve the automatic control of the detection process.

[0051] Embodiment 4 The present invention also discloses a testing method for the above-mentioned testing system, including the following steps: S1: Equipment initialization: Start the detection body and the supporting testing system, and each module starts self-checking. The chip conveying module checks whether the conveying track and the positioning fixture are operating normally; the clamping and positioning module checks whether components such as the bidirectional adjusting rod and the arc-shaped positioning block can move flexibly, and whether the elastic resetting member is in a normal state; the probe contact module checks whether the driving component and the guiding mechanism are working normally; the signal acquisition module, the signal processing module, and the data analysis module check whether the circuit connection is normal and whether the data transmission is smooth; the result output module checks whether the display screen and the storage unit are working normally. After the self-check is completed, if all modules are in a normal working state, the equipment enters the standby state; if there is an abnormality, the display screen displays the abnormal information, and the operator conducts troubleshooting and repair. At the same time, the data analysis module 9 loads the preset standard data for detecting the storage chip, and the standard data can be adjusted and updated according to different types and specifications of the storage chips.

[0052] S2: Installation of the test probe assembly: According to the model and specifications of the storage chip to be detected, select the corresponding test probe assembly 21. Send the test probe assembly 21 to the detection area of the detection body 1, make the test probe assembly 21 drive the positioning seat 28 to approach the docking block 27, align the positioning seat 28 with the chute of the docking block 27, and slowly push the test probe assembly 21. The positioning seat 28 fits into the inner part of one end of the docking block 27. During the sliding process of the positioning seat 28 in the chute, its end contacts and presses the inclined surface of the arc-shaped positioning block 31, and the arc-shaped positioning block 31 slides into the inner part of the installation cavity of the docking block 27, and at the same time带动 the limit stop block 32 to move, and the limit stop block 32 compresses the elastic resetting member 33. When the positioning seat 28 cannot continue to slide inside the docking block 27, it indicates that the positioning seat 28 has completely slid into the docking block 27. At this time, the card slot on the positioning seat 28 is aligned with the arc-shaped positioning block 31, and the elastic resetting member 33 releases its elastic force,带动 the limit stop block 32 and the arc-shaped positioning block 31 to reset, and the arc-shaped positioning block 31 is clamped into the card slot of the positioning seat 28 to complete the pre-fixing of the test probe assembly 21.

[0053] Insert a tool (such as an Allen wrench) that matches the adjustment drive block 201 into the adjustment drive block 201. Rotating the tool causes the adjustment drive block 201 to rotate, which in turn causes the bidirectional adjustment rod 23 to rotate in conjunction with the rotating bearing 29. When the bidirectional adjustment rod 23 rotates, it generates a threaded driving force on the two adjustment blocks 24. Since the two threads of the bidirectional adjustment rod 23 rotate in opposite directions, the two adjustment blocks 24 move towards each other along the inner wall of the fixed base 22. The adjustment blocks 24 drive the clamping block 25 and the positioning pin 26 to move synchronously. The positioning pin 26 gradually inserts into the positioning hole of the test probe assembly 21 until the positioning pin 26 is tightly fitted with the inner wall of the positioning hole. At this point, stop rotating the tool to complete the stable clamping of the test probe assembly 21.

[0054] S3: Loading the chip to be tested: The memory chip to be tested is placed into the feeding hopper of the chip conveying module. The drive unit of the chip conveying module is started, driving the conveying track to transport the chips one by one to the testing station. When the chip arrives at the testing station, the positioning fixture is activated to clamp and fix the chip, ensuring that the chip's position is stable and that the chip's pins are accurately aligned with the test probes of the test probe assembly 21.

[0055] S4: Precise Probe Docking: The control system receives the chip positioning signal from the chip delivery module and sends a drive command to the probe contact module. The drive component of the probe contact module is activated, driving the test probe assembly 21 to move towards the memory chip. During the movement, the guide mechanism ensures the movement accuracy of the test probe assembly 21. Simultaneously, the signal acquisition module monitors the contact status between the test probe and the chip pin in real time. When the test probe and chip pin are in complete and good contact, the signal acquisition module sends a contact success signal to the control system. The control system then stops driving the probe contact module, and the test probe assembly 21 remains in its current position.

[0056] S5: Signal Acquisition and Processing: After receiving the successful contact signal, the control system sends an acquisition command to the signal acquisition module. The signal acquisition module starts and acquires various detection signals, such as electrical signals and communication signals, between the test probe assembly 21 and the memory chip. The acquired raw signals are transmitted to the signal processing module in real time. The signal processing module processes the raw signals: it removes interference signals through a signal filtering circuit, amplifies weak signals through a signal amplification circuit, and converts analog signals into digital signals through an analog-to-digital converter circuit. The processed digital signals are then transmitted to the data analysis module.

[0057] S6: Data Analysis and Result Determination: The data analysis module receives the digital signal transmitted by the signal processing module and performs a comprehensive comparative analysis with preset storage chip testing standard data. Comparison dimensions include whether the signal strength is within the standard range, whether the transmission rate meets the standard requirements, whether the response time meets the standard specifications, and whether data storage and retrieval are accurate. If all comparison dimensions meet the standard requirements, the data analysis module determines that the storage chip is a qualified product; if any comparison dimension fails to meet the standard requirements, the storage chip is determined to be a non-qualified product, and the specific non-qualified items are recorded (such as insufficient signal strength, slow transmission rate, data retrieval errors, etc.).

[0058] S7: Result Output and Chip Diversion: The data analysis module transmits the test results to the result output module. The display screen of the result output module shows the test result (pass / fail, unqualified items) of the chip in real time, and stores the test data (including test time, chip number, test data, judgment result, etc.) in the storage unit. If a test report needs to be printed, the operator can issue a print command through the operation panel, and the printer will print the test report. At the same time, the control system 11 sends a diversion command to the chip conveying module. If the chip is qualified, the positioning fixture is released, and the conveying track transports the qualified chip to the qualified product storage box; if the chip is unqualified, the positioning fixture is released, and the conveying track transports the unqualified chip to the unqualified product storage box, and the unqualified chip is marked by a marking device (such as an inkjet printer) for easy subsequent differentiation and processing.

[0059] S8: Continuous Testing: Repeat steps S3-S7. The chip delivery module continuously delivers the chips to be tested to the testing station. The equipment sequentially completes chip positioning, probe docking, signal acquisition and processing, data analysis and result judgment, result output, and chip distribution according to the above process, realizing continuous automated testing of multiple memory chips. After all the chips to be tested have been tested, the operator turns off the equipment power, backs up the test data in the storage unit, and then cleans and maintains the testing body, test probe assembly 21, chip delivery track, and other components to remove dust, debris, etc., to ensure that the equipment can be used normally next time.

[0060] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the protection scope of the present invention.

Claims

1. An insertion test mechanism for detecting memory chips, characterized in that, include: Detection of the machine body, clamping and positioning mechanism, and test probe assembly; The clamping and positioning mechanism is two in number, and is respectively located on the inner sides of both ends of the detection body; Each of the clamping and positioning mechanisms includes: Test probe components; A mounting base (22) is provided on one side of the test probe assembly; A bidirectional adjusting rod (23) is rotatably connected to the inner wall of the fixed seat (22); Two adjusting blocks (24) are threaded to the outer surface of the bidirectional adjusting rod (23) and are sleeved inside the fixed seat (22) and slidably connected to the inner wall of the fixed seat (22); Two clamping blocks (25) are fixedly connected to one end of the two adjusting blocks (24) respectively; The positioning post (26) is fixedly connected to one side of the clamping block (25), and is sleeved inside the test probe assembly and slidably connected to the inner wall of the test probe assembly; The docking block (27) is fixedly connected to one side of the fixing seat (22); The positioning seat (28) is fixedly connected to the test probe assembly and slidably connected to the inner wall of the docking block (27); An auxiliary positioning mechanism is located inside the docking block (27). The auxiliary positioning mechanism includes an arc-shaped positioning block (31), which is sleeved inside the docking block (27) and the positioning seat (28) and is slidably connected to the inner walls of the docking block (27) and the positioning seat (28).

2. The insertion test mechanism for memory chip testing according to claim 1, characterized in that: The mounting base (22) is fixedly connected to the testing machine body.

3. The insertion test mechanism for memory chip testing according to claim 1, characterized in that: A rotating bearing (29) is sleeved on the outer surface of one end of the bidirectional adjusting rod (23). The rotating bearing (29) is placed inside the fixed seat (22), and the rotating bearing (29) is fixedly connected to the inner wall of the fixed seat (22) and the outer surface of the bidirectional adjusting rod (23).

4. The insertion test mechanism for memory chip testing according to claim 3, characterized in that: One end of the bidirectional adjusting rod (23) is fixedly connected to an adjusting drive block (201).

5. The insertion test mechanism for memory chip testing according to claim 1, characterized in that: One end of the arc-shaped positioning block (31) is provided with a limiting block (32), which is fixedly connected to the arc-shaped positioning block (31), and is sleeved inside the docking block (27) and slidably connected to the inner wall of the docking block (27).

6. An insertion test mechanism for memory chip testing according to claim 5, characterized in that: One side of the limiting block (32) is provided with an elastic reset member (33), and the two ends of the elastic reset member (33) are respectively fixedly connected to the outer surface of the limiting block (32) and the inner wall of the docking block (27).

7. An insertion test mechanism for memory chip testing according to claim 6, characterized in that: One end of the limiting block (32) is fixedly connected to a manual adjustment block (34).

8. A test system for an insertion test mechanism for memory chip testing according to any one of claims 1-7, characterized in that, include: Chip delivery module: Used to accurately deliver the memory chip to be tested to the testing station, and to deliver the chip to the designated area after testing; Clamping and positioning module: namely, the clamping and positioning mechanism and auxiliary positioning mechanism as described in claims 1-7, used to achieve pre-fixation, precise positioning and stable clamping of the test probe assembly (21); Probe contact module: used to control the precise contact between the test probe assembly (21) and the pins of the memory chip to ensure the stability of signal transmission; Signal acquisition module: used to acquire various detection signals such as electrical signals and communication signals between the test probe assembly (21) and the memory chip; Signal processing module: Used to process the acquired detection signals by filtering, amplification, analog-to-digital conversion, etc., and to extract valid detection data; Data analysis module: used to compare and analyze the processed test data with preset standard data to determine whether the memory chip is qualified; Results output module: Used to output test results, including the number of qualified chips, the marking of unqualified chips, and a preliminary determination of the reasons for unqualification; Control system: Used to coordinate the workflow of each module, receive feedback signals from each module, and realize automated control of the detection process.

9. The testing method for supporting the testing system according to claim 8, characterized in that, Includes the following steps: S1: Equipment initialization: Start the testing machine and supporting testing system. Each module performs self-tests to ensure that the chip delivery module, clamping and positioning module, probe contact module, etc. are in normal working condition. The data analysis module loads the preset storage chip testing standard data. S2: Test probe assembly installation: The test probe assembly (21) is sent to the detection area of ​​the detection machine. The test probe assembly (21) drives the positioning seat (28) to approach the docking block (27). The positioning seat (28) fits into one end of the docking block (27). During the sliding process, the arc-shaped positioning block (31) is squeezed. The arc-shaped positioning block (31) drives the limit stop (32) to move and compress the elastic reset member (33). When the positioning seat (28) can no longer slide, the elastic reset member (33) releases its elastic force, driving the limit stop (32) and the arc-shaped positioning block (31) to reset. The positioning block (31) is engaged in the slot of the positioning seat (28) to complete the pre-fixation of the test probe assembly (21); the tool that fits with the adjustment drive block (201) is used to drive it to rotate. The adjustment drive block (201) drives the bidirectional adjustment rod (23) to rotate under the cooperation of the rotating bearing (29). The bidirectional adjustment rod (23) drives the two adjustment blocks (24) to move towards each other. The adjustment blocks (24) drive the clamping block (25) and the positioning post (26) to move. The positioning post (26) is completely inserted into the test probe assembly (21) to complete the stable clamping of the test probe assembly (21). S3: Chip loading: The chip conveying module receives the storage chip to be tested and accurately conveys the chip to the testing station through the conveying track and positioning fixture. The positioning fixture fixes the chip to ensure that the chip pins face the test probe assembly (21). S4: Probe precise docking: The control system controls the probe contact module to move the test probe assembly (21) toward the memory chip until the test probe makes precise contact with the chip pin. During the contact process, the signal acquisition module monitors the contact status in real time to ensure good contact. S5: Signal Acquisition and Processing: The signal acquisition module starts up and acquires electrical signals and communication signals between the test probe component (21) and the memory chip during the test. The acquired raw signals are transmitted to the signal processing module. The signal processing module performs filtering, amplification, analog-to-digital conversion and other processing on the raw signals to remove interference signals and extract valid detection data. S6: Data Analysis and Result Judgment: The data analysis module receives valid detection data transmitted from the signal processing module and performs a comprehensive comparative analysis with preset standard data, including comparisons of multiple dimensions such as signal strength, transmission rate, response time, and data accuracy. Based on the comparison results, it determines whether the memory chip meets the quality standards. If all detection dimensions meet the standard requirements, the chip is deemed qualified; if any dimension fails to meet the standard, the chip is deemed unqualified, and the unqualified item is recorded. S7: Result Output and Chip Distribution: The result output module displays the test results on the device screen in real time and generates a test report which is stored in the device storage unit; at the same time, the chip delivery module distributes the chips according to the test results. Qualified chips are delivered to the qualified product storage box, and unqualified chips are delivered to the unqualified product storage box, and the unqualified chips are marked. S8: Continuous testing: Repeat steps S3-S7 to achieve continuous automated testing of multiple memory chips until all chips to be tested have been tested; after testing, turn off the power to the equipment, back up the test data, and clean and maintain the equipment.

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