Temperature control fixture and testing device

Abstract

The application discloses a temperature control jig, which comprises a top plate, an intermediate layer and a bottom plate arranged in layers, wherein the top plate and the bottom plate are flat plate structures, a frame is arranged along the edge of the top plate, one side surface of the frame protrudes from the surface of the top plate, the top plate and the frame form a containing space for containing a display panel to be tested, a plurality of heat conduction columns are arranged on the side surface of the bottom plate away from the intermediate layer, and the intermediate layer is provided with a plurality of arrayed through holes, so that the cross section of the intermediate layer is a grid structure. The grid design of the intermediate layer of the temperature control jig greatly reduces the overall mass and heat capacity of the jig, so that heat can be more quickly conducted to the top plate through the bottom plate heat conduction columns, and the temperature rising and falling waiting time is shortened. Moreover, when the grid structure is heated and expanded, the through holes provide internal deformation space, effectively avoiding macro warping of the jig as a whole, and ensuring flat and close fitting of the panel and the jig during the test.

Description

Technical Field

[0001] This invention relates to the field of display panel testing. More specifically, it relates to a temperature-controlled fixture and testing apparatus. Background Technology

[0002] With the rapid development of display technology, the performance of display panels is significantly affected by temperature. Especially under high brightness and high refresh rate operating conditions, temperature changes will directly affect key parameters such as color accuracy, contrast ratio and response speed.

[0003] Temperature control platforms used for optical testing in related technologies generally suffer from low heat conduction efficiency and uneven temperature distribution. This is especially true in the testing of flexible screens, Mini-LEDs, and OLED screens, where it is difficult to achieve rapid and uniform temperature control, causing test data to deviate from actual usage scenarios. Furthermore, existing thermal management fixtures are mostly modular designs that cannot adapt to the thermal characteristics of IC components, resulting in localized overheating or insufficient heat dissipation, affecting test stability and accuracy. Summary of the Invention

[0004] The purpose of this invention is to provide a temperature control fixture and testing device that can significantly improve the uniformity of heat distribution and avoid local overheating.

[0005] According to one aspect of the present invention, a temperature control fixture is provided, comprising a top plate, an intermediate layer, and a bottom plate stacked together, wherein the top plate and the bottom plate are flat plate structures, a frame is provided along the edge of the top plate, one side surface of the frame protrudes from the surface of the top plate, the top plate and the frame enclose a receiving space for receiving a display panel to be tested, a plurality of heat-conducting pillars are provided on the side surface of the bottom plate away from the intermediate layer, and the intermediate layer has a plurality of through holes arranged in an array such that the cross-section of the intermediate layer is a grid structure.

[0006] Optionally, the cross-sectional shape of the through hole is a regular hexagon, so that the intermediate layer forms a honeycomb structure.

[0007] Optionally, the temperature-controlled fixture is made of a boron nitride and aluminum oxide composite material.

[0008] Optionally, the top plate has a cutout area for accommodating chips on the display panel to be tested.

[0009] Optionally, it also includes an adapter plate disposed on the frame, the adapter plate being provided with connection ports for connecting the display panel to be tested and external circuitry.

[0010] Optionally, the frame has a scalable structure.

[0011] Optionally, the cross-sectional shape of the through hole is rectangular, so that the intermediate layer is formed into a rectangular grid structure.

[0012] Optionally, at least one of the inner surfaces of the through hole is provided with a temperature sensor.

[0013] Optionally, the side surface of the frame away from the center of the top plate is provided with heat dissipation fins.

[0014] According to one aspect of the present invention, a testing apparatus is provided, comprising a temperature control fixture and a temperature control platform as described above, wherein the surface of the temperature control platform is provided with a plurality of positioning holes arranged in an array, and the temperature control fixture and the temperature control platform are connected by inserting the heat-conducting column into the positioning holes.

[0015] The beneficial effects of this invention are as follows: The temperature control fixture of the present invention has the following effects: significantly improved temperature uniformity. By setting an intermediate layer with a grid-like or honeycomb-like cross-section, multiple independent temperature control microchannels are formed. Heat can be uniformly conducted to the top plate through the through-hole walls, avoiding local overheating or undercooling and ensuring temperature consistency in all areas of the display panel.

[0016] Fast thermal response: The mesh-like intermediate layer significantly reduces heat capacity, while the through-hole structure increases the contact area with air, enabling the fixture to heat up and cool down rapidly, shortening temperature conditioning time and improving testing efficiency. The mesh design of the intermediate layer significantly reduces the overall mass and heat capacity of the fixture, allowing heat to be conducted more quickly to the top plate through the heat-conducting pillars on the bottom plate, shortening the waiting time for heating and cooling. When the mesh structure expands due to heat, the through-holes provide internal deformation space, effectively preventing macroscopic warping of the fixture as a whole, ensuring a flat and snug fit between the panel and the fixture during testing.

[0017] High structural strength: The honeycomb structure reduces weight while maintaining excellent mechanical strength and compressive strength, making it suitable for high-frequency use in large-scale production lines.

[0018] High temperature control accuracy: Temperature sensors can be installed inside the through holes to achieve real-time monitoring and precise control of the temperature at multiple points on the fixture.

[0019] Highly adaptable: The retractable bezel design can accommodate display panels of different sizes, the cutout area design can avoid the driver chip, and the adapter board enables quick connection between the display panel and external test circuits.

[0020] Excellent material properties: It adopts a composite material of boron nitride and aluminum oxide, which has high thermal conductivity, good insulation and excellent thermal stability, ensuring long-term reliability.

[0021] Modular design: The fixture can be quickly installed, disassembled and replaced by the cooperation of the heat-conducting column and the positioning hole of the temperature control station, supporting multi-station parallel testing and improving testing capacity. Attached Figure Description

[0022] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0023] Figure 1 An exploded view of the temperature control fixture of the present invention is shown.

[0024] Figure 2 A schematic diagram of the temperature control fixture of the present invention is shown.

[0025] Figure 3 An exploded structural diagram of another embodiment of the temperature control fixture of the present invention is shown.

[0026] Figure 4 A schematic diagram of the structure of the intermediate layer of the present invention is shown.

[0027] Figure 5 A schematic diagram of another embodiment of the intermediate layer of the present invention is shown.

[0028] Figure 6 A schematic diagram of the top plate and the adapter plate of the present invention is shown.

[0029] Figure 7 A schematic diagram of the temperature control console of the present invention is shown.

[0030] Figure 8 The diagram shows the structure of the temperature control table and temperature control fixture of the present invention. Detailed Implementation

[0031] To more clearly illustrate the present invention, the following description, in conjunction with preferred embodiments and accompanying drawings, further explains the invention. Similar components in the drawings are indicated by the same reference numerals. Those skilled in the art should understand that the specific description below is illustrative rather than restrictive and should not be construed as limiting the scope of protection of the present invention.

[0032] In the description of this invention, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0033] It should be noted that although the terms "first," "second," etc., may be used herein to describe various components, members, elements, regions, layers, and / or portions, these components, members, elements, regions, layers, and / or portions should not be limited by these terms. Rather, these terms are used to distinguish one component, member, element, region, layer, and / or portion from another. Thus, for example, the first component, first member, first element, first region, first layer, and / or first portion discussed below may be referred to as a second component, second member, second element, second region, second layer, and / or second portion without departing from the teachings of the invention.

[0034] It should also be noted that in the description of this invention, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0035] To address the issues of excessive weight, high thermal inertia, and easy deformation of fixtures during display panel testing, this disclosure provides a temperature control fixture 100, which aims to improve temperature uniformity and response speed during display panel temperature testing.

[0036] Please refer to Figures 1 to 3 In one embodiment of the present invention, the temperature control fixture 100 includes a top plate 110, a middle layer 120 and a bottom plate 130 stacked together.

[0037] The top plate 110 and bottom plate 130 are flat structures made of highly thermally conductive materials to achieve rapid and uniform heat conduction. A frame 111 is provided along the edge of the top plate 110, with one side surface of the frame 111 protruding from the surface of the top plate 110. The top plate 110 and the frame 111 enclose a receiving space for accommodating the display panel to be tested. The height of the frame 111 protruding from the surface of the top plate 110 can be designed according to the thickness of the display panel to be tested, ensuring that the display panel can be stably placed within the receiving space, and that the upper surface of the top plate 110 is in full contact with the back of the display panel 300 for efficient heat conduction. The frame 111 also serves to limit and protect the display panel, preventing it from slipping during testing.

[0038] Multiple heat-conducting pillars 131 are provided on the surface of the base plate 130 away from the intermediate layer 120. The heat-conducting pillars 131 are used to connect to external temperature control equipment (such as a temperature control console), conducting heat from an external heat or cold source to the base plate 130, and then through the intermediate layer 120 to the top plate 110, ultimately achieving temperature control of the display panel 300. The number and distribution of the heat-conducting pillars 131 can be optimized according to the fixture size and heat load to ensure uniform heat distribution. Preferably, these heat-conducting pillars 131 are integrally formed with the base plate 130, enabling rapid transfer of external heat to the entire fixture or heat dissipation from the fixture.

[0039] In the entire structure, the intermediate layer 120 is intentionally provided with multiple through holes 121 arranged in an array, the purpose of which is to give the cross-section of the intermediate layer 120 a grid-like structure. These through holes 121 penetrate the upper and lower surfaces of the intermediate layer 120, thus forming interconnected heat exchange channels. This unique grid-like structure has the following technical effects: First, the sidewalls of the through holes 121 can form multiple heat conduction paths, which can evenly disperse the heat generated by the bottom plate 130 and then conduct it to the top plate 110; second, the air or optional phase change material inside the through holes 121 can act as a heat buffer medium, which can mitigate temperature fluctuations; third, the grid structure greatly reduces the weight of the fixture and also reduces the heat capacity, thereby accelerating the thermal response; finally, the array of through holes 121 can ensure that all areas of the top plate 110 receive uniform heat input, thus significantly improving temperature uniformity.

[0040] The through hole 121 can be round, rectangular, or polygonal. Please refer to... Figure 4 In a preferred embodiment of this disclosure, the cross-sectional shape of the through-hole 121 is designed as a regular hexagon, the purpose of which is to form a honeycomb structure for the intermediate layer 120. It should be noted that the honeycomb structure is the optimal space-filling structure formed through long-term evolution in nature, possessing significant advantages, including the highest space utilization and excellent structural strength. Specifically, the sidewalls of the regular hexagonal through-hole 121 form a 120° angle, resulting in the shortest conduction path and the most uniform heat distribution when heat is conducted along the sidewalls, thus minimizing temperature gradients. Simultaneously, the honeycomb structure has the largest specific surface area while maintaining the same volume, a characteristic highly beneficial for rapid heat exchange. Moreover, the isotropic nature of the honeycomb structure gives it balanced mechanical and thermal properties in different directions, making it suitable for various installation orientations.

[0041] like Figure 5As shown, in another embodiment of this disclosure, the cross-sectional shape of the through-hole 121 is designed to be rectangular, which allows the intermediate layer 120 to be formed into a rectangular grid structure. This rectangular grid structure has the significant advantage of being easy to process and requires relatively low cost, making it particularly suitable for cost-sensitive applications. The arrangement direction of the rectangular through-hole 121 can be aligned with the pixel arrangement direction of the display panel, which has the advantage of achieving optimal thermal matching with the display area.

[0042] The size of the through-hole 121 in the intermediate layer 120 can be adjusted according to specific application requirements. Larger through-holes can achieve lighter weight and faster thermal response, but the structural strength will be correspondingly reduced; smaller through-holes have higher structural strength, but the advantages of lightweight and thermal response will be weakened. In actual design, a balance needs to be struck between performance indicators and structural strength, and a through-hole side length between 5mm and 20mm is usually selected.

[0043] In this embodiment of the invention, the temperature control fixture 100 is made of a composite material of boron nitride and alumina. Boron nitride (BN) possesses extremely excellent thermal conductivity, reaching 600 W / (m·K), and also has good electrical insulation properties. Boron nitride is a compound composed of boron and nitrogen elements, existing in two main crystal systems: hexagonal (h-BN) and cubic (c-BN). Hexagonal boron nitride, due to its layered structure resembling graphite, is called "white graphite" and possesses the following core characteristics: 1. High thermal conductivity and low coefficient of thermal expansion: Hexagonal boron nitride has a thermal conductivity of up to 33 W / (m·K) and a coefficient of thermal expansion of only 2.6 × 10⁻⁶. -6 / ℃, which means that it can conduct heat quickly in high-temperature environments while maintaining dimensional stability, avoiding cracking or deformation caused by thermal stress.

[0044] 2. Excellent chemical stability: Boron nitride does not react with most acids, alkalis and salts at room temperature, and remains stable even in molten metals (such as aluminum and copper). This property makes it an ideal refractory material for the metallurgical industry.

[0045] 3. Good electrical insulation: Hexagonal boron nitride has a band gap of up to 5.5 eV, which is a wide band gap semiconductor. It can maintain high resistivity at high temperatures, making it an ideal material for heat dissipation substrates of electronic devices.

[0046] However, pure boron nitride also suffers from drawbacks such as low mechanical strength and high brittleness. Alumina (Al₂O₃), on the other hand, possesses high strength, high hardness, and good chemical stability. When these two materials are combined, not only is the high thermal conductivity retained, but the mechanical strength and wear resistance are also significantly improved. Simultaneously, this composite material exhibits good matching of thermal expansion coefficients, thus preventing structural deformation during temperature cycling. This composite material can be prepared using processes such as hot pressing sintering and spark plasma sintering. Its layers can be integrally formed or processed separately and then precisely assembled.

[0047] In one example, spherical alumina particles and modifiers are filled into the interlayer of multilayered hexagonal boron nitride sheets for composite processing. The spherical alumina particles have different sizes. Larger alumina particles can connect the boron nitride sheets in the outward direction and promote heat transfer, while smaller alumina particles act as bridges, filling the gaps between large spheres and between boron nitride sheets and alumina spheres, establishing abundant heat conduction paths, improving the integrity of the heat conduction network, and reducing internal defects.

[0048] Preferably, the bottom plate 130 and the intermediate layer 120 are integrally formed by hot pressing and sintering process, and the top plate 110 is also formed by hot pressing and sintering process. Then, the top plate 110 is bonded to the top surface of the intermediate layer 120 with thermally conductive silicone to finally form the temperature control fixture 100.

[0049] like Figure 1 As shown, in this embodiment, the top plate 110 also has a cutout area 112 for accommodating the chip on the display panel to be tested. Driver ICs and flexible printed circuit boards (FPCs) are typically bonded to the back of the display panel, protruding from the back surface of the display panel. Traditional planar fixtures cannot avoid these components, resulting in the display panel not being placed flat, or the driver IC being damaged by compression. By providing a cutout area 112 at a corresponding position on the top plate 110, clearance space is provided for the driver IC, ensuring full contact between the back of the display area of ​​the display panel and the top plate 110, while the chip is suspended within the cutout area 112, protecting the driver IC and ensuring effective temperature control of the display area.

[0050] like Figure 6As shown, in one example, the temperature control fixture 100 further includes an adapter plate 140 disposed on the frame 111. The adapter plate 140 is provided with connection ports for connecting the display panel under test and external circuitry. The adapter plate 140 can be detachably installed on one side of the frame 111 by means of clips, screws, or magnets. The connection ports include connectors (such as ZIF connectors, board-to-board connectors, etc.) that mate with the flexible circuit board of the display panel, and interfaces (such as BNC interfaces, SMA interfaces, USB interfaces, etc.) for connecting external testing equipment (such as signal generators, power supplies, data acquisition systems, etc.). The adapter plate 140 enables a quick and reliable connection between the display panel and the external testing circuitry, avoiding the contact problems and signal interference issues caused by traditional flying wire connections.

[0051] In one example, the frame 111 is a retractable structure. Specifically, the frame 111 may consist of multiple telescopic segments, and its length and width can be adjusted via slide rails, slots, or elastic structures to accommodate display panels of different sizes. The retractable frame 111 enables the same temperature control fixture 100 to meet the testing needs of display panels of various sizes, significantly improving the versatility and economy of the equipment.

[0052] Preferably, the frame 11 includes a fixed section and a sliding section, wherein the fixed section is fixedly installed on the surface of the top plate 110, and the sliding section is slidably connected to the fixed section, and the length of the fixed section is much greater than the length of the sliding section, so as to increase the firmness of the connection between the frame 11 and the top plate 110.

[0053] The top plate 110 is rectangular in shape, and its top surface has four connected frame segments 11, of which at least two adjacent frame segments 11 are retractable. For example, when the screen sizes being tested are 6.3 inches or 6.8 inches, the temperature control fixture 100 does not need to be replaced, but only the length of the frame segments 11 needs to be adjusted to fit the different screen sizes.

[0054] In one embodiment of the present invention, at least one of the inner surfaces of the through-hole 121 is provided with a temperature sensor. The temperature sensor may be a thermocouple, a thermistor, or a semiconductor temperature sensor, embedded in the sidewall of the through-hole 121 or attached to the sidewall surface. By arranging temperature sensors in multiple through-holes 121, the temperature distribution in each region of the intermediate layer 120 can be monitored in real time, providing feedback signals to the temperature control system and realizing closed-loop temperature control. Preferably, the temperature sensors are distributed in a gradient from the center to the edge of the intermediate layer 120 to comprehensively understand the temperature field distribution.

[0055] In one embodiment of the present invention, heat dissipation fins are provided on the side surface of the frame 111 away from the center of the top plate 110. When it is necessary to perform cooling tests or rapid heat dissipation on the display panel, the heat dissipation fins can increase the contact area with the air and accelerate heat dissipation. The heat dissipation fins can be integrally formed with the frame 111 or separately installed, and their shape can be flat, wavy, or needle-shaped, optimized according to heat dissipation requirements.

[0056] like Figure 7 As shown, this disclosure also provides a testing apparatus 200, including multiple temperature-controlled fixtures 100 and a temperature control platform 210 as described above. The temperature control platform 210 is a platform with temperature control functions, and can be internally equipped with temperature control elements such as a thermoelectric cooler (TEC), heating rods, and liquid cooling channels to achieve precise temperature control within a range of -40°C to 150°C. This temperature range covers the operating temperature range of most display panels, meeting the needs of various temperature testing projects. To achieve such a wide temperature adjustment range, the temperature control platform 210 typically needs to be equipped with both heating and cooling elements simultaneously.

[0057] Heating elements can be implemented in various forms. Resistance heating wires are the most common heating method, generating heat by current flowing through the resistance wire. They are characterized by simple structure, convenient control, and high thermal efficiency. Thin-film heaters use printing or deposition processes to arrange heating resistors on an insulating substrate, allowing for thinner heating layers and more uniform heat distribution. Semiconductor coolers (TECs, also known as Peltier elements) can achieve bidirectional cooling / heating under the action of an applied current, but their cooling capacity is limited, and they are typically used for auxiliary cooling or precision temperature control.

[0058] Refrigeration elements can be implemented in various ways. In applications requiring large cooling capacities, compressor-based refrigeration is typically used, offering high cooling capacity and efficiency, but it is also complex, noisy, and bulky. For applications requiring rapid response or precise temperature control, liquid nitrogen or dry ice refrigeration can be employed. These methods can achieve extremely low temperatures, but are costly and not conducive to precise control. For medium temperature ranges (e.g., 0°C to 80°C), thermoelectric coolers are a more ideal solution.

[0059] The surface of the temperature control platform 210 has multiple arrayed positioning holes 211, the positions and sizes of which match the heat-conducting pillars 131 on the base plate 130 of the temperature control fixture 100. By inserting the heat-conducting pillars 131 into the positioning holes 211, rapid positioning and heat conduction connection between the temperature control fixture 100 and the temperature control platform 210 are achieved. Multiple temperature control fixtures 100 can be installed in parallel on the temperature control platform 210, enabling simultaneous testing at multiple stations and significantly improving testing efficiency. A transition fit can be used between the heat-conducting pillars 131 and the positioning holes 211 to ensure good thermal contact and mechanical stability.

[0060] In one embodiment, the positioning holes 211 are arranged in a regular matrix with equal spacing between holes, which facilitates the installation of the temperature control fixture at any position; in another embodiment, the positioning holes 211 are arranged in groups by region, with different spacing between holes in different regions, to accommodate temperature control fixtures of different sizes and specifications.

[0061] The testing device 200 supports the parallel installation of multiple temperature-controlled fixtures 100 on the temperature control platform 210, enabling simultaneous testing at multiple workstations. This design significantly improves testing efficiency and is an important requirement in large-scale display panel production testing scenarios.

[0062] The multi-station parallel testing principle is based on the large-area temperature control capability of the temperature control station 210 and the coordinated operation of multiple independent temperature control fixtures. The temperature control element of the temperature control station 210 covers the entire working area, providing a uniform temperature environment for all temperature control fixtures installed on it. The display panel placed on each temperature control fixture can be tested under its own independent test program control, without interfering with each other during the test.

[0063] The advantages of multi-station parallel testing are multifaceted. From an efficiency perspective, simultaneous operation of multiple testing stations can increase test throughput several times over, significantly reducing the average testing time for a single display panel. From an equipment utilization perspective, a multi-station system can fully utilize the temperature control capabilities of the temperature control station, avoiding resource waste caused by single-station operation. From a testing flexibility perspective, different stations can be set with different test temperatures and programs to adapt to diverse testing needs.

[0064] In practical applications, the synchronous management of test programs in multi-station systems is a key technical challenge. Modern test systems typically employ centralized computer software for management, enabling automatic allocation of test tasks, real-time acquisition of test data, and automatic determination of test results. Test management software can intelligently schedule test tasks based on the testing progress of each station, maximizing system throughput.

[0065] In one example, the heat-conducting pillar 131 is frustum-shaped, with its diameter gradually decreasing away from the base plate 130; that is, the diameter of the distal end of the heat-conducting pillar 131 is smaller than the diameter of its contact end with the base plate 130. The diameter of the positioning hole 211 is equal to or slightly smaller than the diameter of the contact end of the heat-conducting pillar 131 with the base plate 130. This structure facilitates the quick insertion of the temperature control fixture 100 into the temperature control table 210 and ensures a tight fit between the heat-conducting pillar 131 and the positioning hole 211. When the heat-conducting pillar 131 is inserted into the positioning hole 211, the conical side automatically guides the heat-conducting pillar 131 toward the center of the hole, achieving automatic centering. This self-guiding design simplifies the alignment operation; even if there is a certain deviation in the initial position, it can be automatically corrected during insertion without the need for precise positioning.

[0066] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

[0067] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of the present invention are still within the protection scope of the present invention.

Claims

1. A temperature-controlled fixture, characterized in that, The device includes a top plate, an intermediate layer, and a bottom plate stacked together. The top plate and the bottom plate are flat structures. A frame is provided along the edge of the top plate. One side surface of the frame protrudes from the surface of the top plate. The top plate and the frame enclose a receiving space for accommodating a display panel to be tested. Multiple heat-conducting pillars are provided on the side surface of the bottom plate away from the intermediate layer. The intermediate layer has multiple arrayed through holes so that the cross-section of the intermediate layer has a grid structure.

2. The temperature-controlled fixture according to claim 1, characterized in that, The cross-sectional shape of the through hole is a regular hexagon, so that the intermediate layer forms a honeycomb structure.

3. The temperature-controlled fixture according to claim 1, characterized in that, The temperature-controlled fixture is made of a composite material of boron nitride and aluminum oxide.

4. The temperature-controlled fixture according to claim 1, characterized in that, The top plate has a cutout area for accommodating the chip on the display panel to be tested.

5. The temperature-controlled fixture according to claim 1, characterized in that, It also includes an adapter plate disposed on the frame, the adapter plate being provided with connection ports for connecting the display panel to be tested and external circuits.

6. The temperature-controlled fixture according to claim 1, characterized in that, The frame has a retractable structure.

7. The temperature-controlled fixture according to claim 1, characterized in that, The cross-sectional shape of the through hole is rectangular, so that the intermediate layer forms a rectangular grid structure.

8. The temperature-controlled fixture according to claim 1, characterized in that, At least one of the through holes has a temperature sensor on its inner surface.

9. The temperature-controlled fixture according to claim 1, characterized in that, The side surface of the frame away from the center of the top plate is provided with heat dissipation fins.

10. A testing apparatus, characterized in that, It includes multiple temperature control fixtures and temperature control platforms as described in any one of claims 1 to 9, wherein the surface of the temperature control platform is provided with multiple arrayed positioning holes, and the connection between the temperature control fixture and the temperature control platform is achieved by inserting the heat-conducting column into the positioning holes.

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