Multilayer electronic assembly and its mounting plate

Abstract

The present disclosure provides a multilayer electronic component and a mounting plate thereof, the multilayer electronic component including a main body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer, the main body having a first surface and a second surface opposite to each other in a thickness direction, a third surface and a fourth surface opposite to each other in a length direction, and a fifth surface and a sixth surface opposite to each other in a width direction, an external electrode disposed on the third surface and the fourth surface and extending to a portion of the first surface and a portion of the second surface, and a metal terminal disposed on the first surface or the second surface and connected to the external electrode, the metal terminal having a recess provided on an outer side surface thereof in the length direction, and an upper hole and a lower hole respectively provided on an upper surface and a lower surface thereof, and the upper hole being not superimposed with the lower hole in the thickness direction.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2025-0026991, filed on February 28, 2025, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component and its mounting plate. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards in various electronic products, such as video display devices (such as liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, and mobile phones, to charge or discharge them. MLCCs are used as components in various electronic devices due to their small size, high capacitance, and ease of installation.

[0004] Because the dielectric layer of an MLCC is piezoelectric, it can vibrate when a voltage is applied. These vibrations are transmitted to the printed circuit board via solder, producing a rattling sound. This rattling sound can correspond to audible frequencies that are uncomfortable to hear and is known as acoustic noise. Furthermore, whether the user is aware of it or not, if the piezoelectric vibration of an MLCC occurs in the high-frequency range of 20 kHz or higher, it can cause malfunctions in various sensors used in the information technology (IT) and electrical industries.

[0005] To reduce acoustic noise, conventional methods have been proposed, such as mounting bumps on the external electrode or installing an intermediary between the MLCC and the printed circuit board. However, if bumps are mounted on the external electrode, there is a risk that the flexural strength of the MLCC will be reduced, and the bonding strength between the external electrode and the bump must be considered separately. Summary of the Invention

[0006] One aspect of this disclosure is to provide a multilayer electronic component that has excellent flexural strength while reducing acoustic noise.

[0007] Another aspect of this disclosure is to provide a multilayer electronic component with improved bonding strength between the external electrode and the metal terminal.

[0008] However, the aspects of this disclosure are not limited to those set forth herein, and will be more readily understood in the process of describing specific exemplary embodiments of this disclosure.

[0009] According to one aspect of this disclosure, a multilayer electronic component may include: a body comprising a dielectric layer and inner electrodes alternately disposed with respect to the dielectric layer, the body having a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in the width direction; an outer electrode disposed on the third surface and the fourth surface and extending to a portion of the first surface and a portion of the second surface; and a metal terminal disposed on the first surface or the second surface and connected to the outer electrode. The metal terminal may have a recess on its outer surface in the length direction, and an upper hole and a lower hole are respectively disposed on its upper and lower surfaces in the thickness direction, and the upper hole may not overlap with the lower hole in the thickness direction.

[0010] According to another aspect of this disclosure, a mounting plate includes: a printed circuit board including electrode pads; a multilayer electronic component as described above disposed on the printed circuit board; and a conductive material disposed between the electrode pads and the metal terminals, wherein the conductive material fills at least a portion of the lower hole.

[0011] As one of the many effects of this disclosure, a multilayer electronic component can be provided that has excellent flexural strength while reducing acoustic noise.

[0012] As one of the effects of this disclosure, a multilayer electronic component with improved bonding strength between the external electrode and the metal terminal can be provided. Attached Figure Description

[0013] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure; Figure 2 This is an exploded perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure; Figure 3 It is a cross-sectional view schematically showing the cross-section of the main body and the outer electrode; Figure 4 It is along Figure 1 A schematic cross-sectional view of line I-I'; Figure 5 It is along Figure 1 A schematic cross-sectional view taken from line II-II'; Figure 6 It is shown schematically. Figure 5The diagram shows a cross-sectional view of a multilayer electronic component mounted on a printed circuit board. Figure 7A and Figure 7B yes Figure 1 Top view of the first and second metal terminals; Figure 8A , Figure 8B , Figure 9A , Figure 9B , Figure 10A , Figure 10B , Figure 11A , Figure 11B , Figure 12A as well as Figure 12B The first metal terminal and the second metal terminal of other embodiments of this disclosure are related to... Figure 7A and Figure 7B The corresponding top view; Figure 13 It is a graph showing the measurement results of the bonding strength of the comparative example, example 1 and example 2; Figure 14 This is a schematic perspective view of a multilayer electronic assembly according to another embodiment of the present disclosure; Figure 15 It is along Figure 14 A schematic cross-sectional view taken from line III-III'; Figure 16A and Figure 16B yes Figure 14 Top view of the first and second metal terminals; Figure 17A , Figure 17B , Figure 18A , Figure 18B , Figure 19A and Figure 19B The first metal terminal and the second metal terminal of other embodiments of this disclosure are related to... Figure 16A and Figure 16B The corresponding top view. Detailed Implementation

[0014] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, embodiments of the present disclosure may be exemplified in many different forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure are provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of explanation, the shape and size of elements in the drawings may be exaggerated, and elements identified by the same reference numerals in the drawings are the same elements.

[0015] Furthermore, for clarity in describing this disclosure, irrelevant details have been omitted throughout the specification, and for ease of description, the dimensions (e.g., thicknesses) of the various components shown in the accompanying drawings are arbitrarily illustrated. Therefore, this disclosure is not necessarily limited to the illustrated embodiments. Additionally, the same reference numerals are used to describe components that have the same function within the scope of the same concept. Furthermore, throughout the specification, unless otherwise stated, when a component is referred to as "comprising" another component, it means that the component includes other components but does not exclude other components.

[0016] In the attached figures, the X direction can be defined as the thickness direction, the Y direction can be defined as the length direction, and the Z direction can be defined as the width direction.

[0017] 1. First example Multilayer electronic components Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure.

[0018] Figure 2 This is an exploded perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure.

[0019] Figure 3 It is a schematic cross-sectional view showing the body and the outer electrode.

[0020] Figure 4 It is along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0021] Figure 5 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0022] Figure 6 It is shown schematically. Figure 5 The diagram shows a cross-sectional view of a multilayer electronic component mounted on a printed circuit board.

[0023] Figure 7A and Figure 7B yes Figure 1 Top view of the first and second metal terminals.

[0024] In the following text, reference will be made to Figures 1 to 7B A multilayer electronic assembly 100 according to an embodiment is described in detail. Furthermore, although a multilayer ceramic capacitor is described as an example of a multilayer electronic assembly, this disclosure is not limited thereto, and the multilayer electronic assembly of this disclosure can also be various other multilayer electronic assemblies such as inductors, piezoelectric elements, varistors, or thermistors.

[0025] The length of the multilayer electronic component 100 may be greater than the width and thickness of the multilayer electronic component 100, but the present disclosure is not limited thereto. For example, the length of the multilayer electronic component 100 may be less than the width of the multilayer electronic component 100. The width of the multilayer electronic component 100 may be less than or greater than the thickness of the multilayer electronic component 100, and may vary depending on the specification or characteristics of the multilayer electronic component 100.

[0026] The multilayer electronic component 100 may include a main body 110, external electrodes 131 and 132, and metal terminals 141 and 142.

[0027] Although there is no specific limitation on the detailed shape of the main body 110, as Figure 1 shown, the main body 110 may be formed into a hexahedral shape or a similar shape. Due to shrinkage of the ceramic powder contained in the main body 110 during the sintering process or due to the polishing process for edges of the main body 110, the main body 110 may not have a perfectly straight hexahedral shape, but may have a substantially hexahedral shape.

[0028] The main body 110 may have a first surface 1 and a second surface 2 opposing each other in the thickness direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposing each other in the length direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposing each other in the width direction.

[0029] The main body 110 may include dielectric layers 111 and internal electrodes 121 and 122 alternately disposed with the dielectric layers 111. The plurality of dielectric layers 111 forming the main body 110 are in a sintered state, and adjacent dielectric layers 111 may be integrated such that it is difficult to distinguish the boundary therebetween without a scanning electron microscope (SEM).

[0030] For example, the dielectric layer 111 may include a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 may include, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0<x<1), Ba(Ti 1-y Ca y )O3 (0<y<1), (Ba 1- x Ca x )(Ti 1-y Zr y )O3 (0<x<1, 0<y<1), Ba(Ti 1-y Zr y )O3 (0<y<1), CaZrO3 and (Ca 1-x Sr x )(Zr1-y Ti y )O3, wherein 0 < x ≤ 0.5 and 0 < y ≤ 0.5.

[0031] The average thickness of the dielectric layer 111 may be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0032] The main body 110 may include a capacitance forming portion Ac, where the capacitance forming portion Ac forms a capacitance by including a first internal electrode 121 and a second internal electrode 122 that are alternately arranged, with the dielectric layer 111 interposed between the first internal electrode 121 and the second internal electrode 122. The stacking direction of the internal electrodes 121 and 122 may be the thickness direction or the width direction. In the present disclosure, an embodiment where the stacking direction of the internal electrodes 121 and 122 is along the thickness direction is described.

[0033] The first internal electrode 121 is spaced apart from the fourth surface 4 and may be connected to the first external electrode 131 on the third surface 3. The second internal electrode 122 is spaced apart from the third surface 3 and may be connected to the second external electrode 132 on the fourth surface 4.

[0034] The conductive metal included in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti and alloys thereof, and more preferably may include Ni, but the present disclosure is not limited thereto.

[0035] The average thickness of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0036] The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be measured by scanning the length direction-thickness direction cross-section of the multilayer electronic component 100 at a magnification of 10000 times using a scanning electron microscope (SEM). More specifically, the average thickness of the dielectric layer 111 can be measured by measuring the thickness at multiple points (for example, five equally spaced points along the length direction) on a single dielectric layer 111, and then calculating the average value. In addition, the average thickness of the internal electrodes 121 and 122 can be measured by measuring the thickness at multiple points (for example, five equally spaced points along the length direction) on a single internal electrode 121 or 122, and then calculating the average value. Five equally spaced points can be designated in the capacitance forming portion Ac. By applying the above method for obtaining an average value to ten dielectric layers 111 and ten internal electrodes 121 and 122, the average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121 and 122 can be more generalized.

[0037] The main body 110 may include: cover portions 112 and 113, disposed on two opposing surfaces of the capacitor forming portion Ac in the thickness direction; and edge portions 114 and 115, disposed on two opposing surfaces of the capacitor forming portion Ac in the width direction. Cover portions 112 and 113 and edge portions 114 and 115 do not include internal electrodes, and the cover portions 112 and 113 and edge portions 114 and 115 may have a composition similar to that of the dielectric layer 111.

[0038] The average thickness of covers 112 and 113 can be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. For example, the average thickness of covers 112 and 113 can be 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness tc of covers 112 and 113 can represent the average thickness of each of the first cover 112 and the second cover 113. The average thickness tc of covers 112 and 113 can be the average of the thicknesses measured at five equally spaced points along the length direction of the covers 112 and 113 in a cross-section along the length-thickness direction of the multilayer electronic assembly 100.

[0039] The average width-direction dimension of edge portions 114 and 115 can be, for example, 150 μm or less, 100 μm or less, 20 μm or less, or 15 μm or less. The average width-direction dimension of edge portions 114 and 115 can, for example, be 5 μm or greater, 10 μm or greater, or 30 μm or greater. Here, the average width-direction dimension of edge portions 114 and 115 can represent the average width-direction dimension of each of the first edge portion 114 and the second edge portion 115. The average width-direction dimension of edge portions 114 and 115 can be the average of the width-direction dimensions of edge portions 114 and 115 measured at five equally spaced points in the thickness direction on the width-thickness direction cross-section of the multilayer electronic assembly 100.

[0040] External electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4, and may extend to a portion of the first surface 1 and a portion of the second surface 2. External electrodes 131 and 132 may include, for example, a first external electrode 131 and a second external electrode 132, wherein the first external electrode 131 is disposed on the third surface 3 and extends to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5 and a portion of the sixth surface 6, and the second external electrode 132 is disposed on the fourth surface 4 and extends to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5 and a portion of the sixth surface 6.

[0041] The region of the first external electrode 131 disposed on the third surface 3 can be defined as the first connecting portion CP1, and the region extending from the first connecting portion CP1 and disposed on the first surface 1 and the second surface 2 can be defined as the first strip portion BP1. The region of the second external electrode 132 disposed on the fourth surface 4 can be defined as the second connecting portion CP2, and the region extending from the second connecting portion CP2 and disposed on the first surface 1 and the second surface 2 can be defined as the second strip portion BP2.

[0042] There are no particular limitations on the type or shape of the outer electrodes 131 and 132, and they may have a multilayer structure. For example, the outer electrodes 131 and 132 may include base electrode layers 131a and 132a in contact with the inner electrodes 121 and 122, and metal layers 131b and 132b disposed on the base electrode layers 131a and 132a.

[0043] The base electrode layers 131a and 132a may include sintered electrode layers comprising metal and glass. The metal included in the sintered electrode layers may include at least one of, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb and / or alloys thereof. The glass included in the sintered electrode layers may include one or more oxides of, for example, Ba, Ca, Zn, Al, B and Si.

[0044] In addition, the base electrode layers 131a and 132a may be constructed using only sintered electrode layers, but this disclosure is not limited thereto. The base electrode layers 131a and 132a may include sintered electrode layers and resin electrode layers. The sintered electrode layers include metal and glass, and the resin electrode layers are disposed on the sintered electrode layers and include metal particles and resin.

[0045] The metal particles included in the resin electrode layer may include at least one of spherical particles and plate-like particles. The metal particles included in the resin electrode layer may include at least one of, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and / or alloys thereof. The resin included in the resin electrode layer may include one or more of, for example, epoxy resin, acrylic resin, and ethyl cellulose resin.

[0046] Metal layers 131b and 132b may comprise, for example, Ni, Sn, Pd, and / or alloys thereof, and may be formed using multiple layers. Metal layers 131b and 132b may be, for example, Ni plating or Sn plating, or may be formed in a manner in which Ni plating and Sn plating are formed sequentially. Metal layers 131b and 132b may comprise multiple Ni platings and / or multiple Sn platings.

[0047] although Figure 1The multilayer electronic assembly 100 is shown to have a structure with two external electrodes 131 and 132, but is not limited thereto. The number or shape of the external electrodes 131 and 132 may be changed depending on the shape of the internal electrodes 121 and 122 or for other purposes.

[0048] Metal terminals 141 and 142 may be disposed on the first surface 1 or the second surface 2 and connected to the external electrodes 131 and 132. The first metal terminal 141 may be disposed on the first surface 1 or the second surface 2 and connected to the first external electrode 131, and the second metal terminal 142 may be disposed on the first surface 1 or the second surface 2 and connected to the second external electrode 132. Specifically, metal terminals 141 and 142 may be connected to the strips BP1 and BP2.

[0049] Reference Figure 4 and Figure 5 A first conductive adhesive 151 may be disposed between the first external electrode 131 and the first metal terminal 141. A second conductive adhesive (not shown) may be disposed between the second external electrode 132 and the second metal terminal 142. The first conductive adhesive 151 may be, for example, solder or conductive epoxy resin.

[0050] Metal terminals 141 and 142 are primarily used to prevent piezoelectric vibrations generated in the body 110 from being transmitted to the printed circuit board by maintaining a sufficient distance between the body 110 and the printed circuit board. The metal terminals 141 and 142 can be made of metallic components, and because metallic components have better ductility than ceramic components, they can effectively absorb piezoelectric vibrations generated in the body 110, thereby reducing the acoustic noise of the multilayer electronic assembly 100.

[0051] Recesses R1 and R2 may be provided in metal terminals 141 and 142. A first recess R1 may be provided in the first metal terminal 141, and a second recess R2 may be provided in the second metal terminal 142. (Refer to...) Figure 7A and Figure 7B Recesses R1 and R2 may be provided on the outer surfaces OS1 and OS2 in the longitudinal direction of the metal terminals 141 and 142.

[0052] Reference Figure 7A and Figure 7B The recesses R1 and R2 may have a shape that is recessed in the length direction toward the inner surfaces IS1 and IS2 of the metal terminals 141 and 142, and in the cross-sectional view, the recesses R1 and R2 may have C-shaped edges. However, this disclosure is not limited thereto, and the cross-sections of the recesses R1 and R2 in the length-width direction may have U-shaped or C-shaped edges.

[0053] When mounting the multilayer electronic assembly 100 onto a printed circuit board using a conductive mounting agent, the recesses R1 and R2 can act as containment pockets by providing space to fill the molten conductive mounting agent (e.g., solder). This reduces the height the conductive mounting agent climbs along the outer electrodes 131 and 132, thereby reducing the height of the conductive mounting agent fillet and thus blocking the transmission path of piezoelectric vibrations generated in the body 110, thereby reducing the acoustic noise of the multilayer electronic assembly 100.

[0054] Reference Figure 2 Upper holes UH1 and UH2 can be disposed on the upper surfaces US1 and US2 of metal terminals 141 and 142. (Refer to...) Figure 1 The lower holes LH1 and LH2 can be disposed on the lower surfaces LS1 and LS2 of the metal terminals 141 and 142. The first metal terminal 141 may include a first upper hole UH1 and a first lower hole LH1 disposed on the upper surface US1 and the lower surface LS1, respectively. The second metal terminal 142 may include a second upper hole UH2 and a second lower hole LH2 disposed on the upper surface US2 and the lower surface LS2, respectively. The upper holes UH1 and UH2 and the lower holes LH1 and LH2 have a shape that does not completely penetrate the metal terminals 141 and 142, for example, they may have a blind hole shape.

[0055] Metal terminals 141 and 142 include upper holes UH1 and UH2 and lower holes LH1 and LH2, thereby reducing the stiffness of metal terminals 141 and 142 and thereby increasing the bending strength of the multilayer electronic assembly 100.

[0056] Furthermore, the upper holes UH1 and UH2 can increase the contact area between the metal terminals 141 and 142 and the conductive adhesive, thereby improving the bonding strength between the external electrodes 131 and 132 and the metal terminals 141 and 142. For example, refer to Figure 4 The first conductive adhesive 151 can fill at least a portion of the first upper hole UH1.

[0057] The lower holes LH1 and LH2 can increase the contact area between the metal terminals 141 and 142 and the conductive material 330 (a conductive mounting agent), thereby improving the bonding strength between the metal terminals 141 and 142 and the printed circuit board.

[0058] According to embodiments of this disclosure, the upper holes UH1 and UH2 may not overlap with the lower holes LH1 and LH2 along the thickness direction. Specifically, the first upper hole UH1 may not overlap with the first lower hole LH1 along the thickness direction, and the second upper hole UH2 may not overlap with the second lower hole LH2 along the thickness direction. This allows each upper hole UH1 and UH2 and the lower holes LH1 and LH2 to have sufficient depth and sufficiently increases the contact area between the metal terminals 141 and 142 and the conductive adhesive, as well as the contact area between the metal terminals 141 and 142 and the conductive mounting agent.

[0059] In the embodiments, multiple upper holes UH1 and UH2 and multiple lower holes LH1 and LH2 can be provided, and the multiple upper holes UH1 and UH2 can be separate from the multiple lower holes LH1 and LH2 along the thickness direction. The number of upper holes UH1 and UH2 and the number of lower holes LH1 and LH2 are not particularly limited, and can be two or more, three or more, four or more, or five or more, respectively. Since each of the multiple upper holes UH1 and UH2 is separate from the multiple lower holes LH1 and LH2 along the thickness direction, the bending strength improvement effect and bonding strength improvement effect of this disclosure can be further enhanced.

[0060] Reference Figures 4 to 6 The first metal terminal 141 may include a first metal core MC and a first plating layer PL disposed on the first metal core MC. Similarly, the second metal terminal 142 may include a second metal core (not shown) and a second plating layer (not shown) disposed on the second metal core. The first plating layer PL may be configured to cover, for example, the outer surface of the first metal core MC, and the first plating layer PL may extend into the interior of the first upper hole UH1 and the first lower hole LH1. The first plating layer PL may extend into each of the plurality of first upper holes UH1 and each of the plurality of first lower holes LH1. This allows the first conductive adhesive 151 to flow sufficiently into the interior of the first upper hole UH1 through the first plating layer PL.

[0061] The metal core MC may include one or more of the following materials: Cu, Ni, Ag, Sn, Pt, Pd, Fe, Al and their alloys, phosphor bronze, and stainless steel. The plating PL may include one or more of the following materials: Ni, Sn, and Au. The plating PL may be formed using multiple layers and may include sequentially stacked Ni and Sn plating layers.

[0062] Mounting plate for multilayer electronic components In the following text, refer to Figure 6 The mounting substrate 300 of a multilayer electronic component according to an embodiment of the present disclosure will be described. Redundant descriptions of the construction of the aforementioned multilayer electronic component 100 will be omitted.

[0063] Reference Figure 6 The mounting substrate 300 for the multilayer electronic components may include a printed circuit board 310, which includes electrode pads 320. The printed circuit board 310 may include, for example, a resin (such as glass epoxy resin) or a ceramic (such as glass ceramic). The printed circuit board 310 may have, for example, a form in which multiple insulating layers are stacked. The printed circuit board 310 may include a first electrode pad 320 connected to a first external electrode 131 and a second electrode pad (not shown) connected to a second external electrode.

[0064] The mounting substrate 300 of the multilayer electronic component may include a conductive material 330 disposed between the electrode pads 320 and the metal terminals 141 and 142. The conductive material 330 may be, for example, solder for bonding, and may include at least one of tin (Sn), antimony (Sb), cadmium (Cd), lead (Pb), zinc (Zn), aluminum (Al) and copper (Cu), but this disclosure is not limited thereto.

[0065] According to an embodiment, conductive material 330 may fill at least a portion of the lower hole LH1 disposed on the lower surface LS1 of metal terminals 141 and 142. This improves the bonding strength between metal terminals 141 and 142 and the printed circuit board, and provides a mounting substrate 300 for multilayer electronic components on which multilayer electronic components 100 are stably mounted.

[0066] Various variations of metal terminals Figure 8A , Figure 8B , Figure 9A , Figure 9B , Figure 10A , Figure 10B , Figure 11A , Figure 11B , Figure 12A as well as Figure 12B The first metal terminal and the second metal terminal of other embodiments of this disclosure are related to... Figure 7A and Figure 7B The corresponding top view. Refer to the following text. Figures 7A to 12B Various variations of the metal terminals are described. Each variation is described separately, but repeated descriptions are omitted.

[0067] Reference Figure 7A and Figure 7B The plurality of upper holes UH1 and UH2 can be positioned closer to the inner surfaces IS1 and IS2 of the metal terminals 141 and 142 in the length direction than the plurality of lower holes LH1 and LH2. The plurality of upper holes UH1 and UH2 can be positioned closer to the center portion of the metal terminals 141 and 142 in the width direction than the plurality of lower holes LH1 and LH2. The plurality of upper holes UH1 and UH2 can be spaced apart from each other in the width direction, and the plurality of lower holes LH1 and LH2 can also be spaced apart from each other in the width direction. The distance between the plurality of upper holes UH1 and UH2 in the width direction can be smaller than the distance between the plurality of lower holes LH1 and LH2 in the width direction.

[0068] Reference Figure 8A and Figure 8BEach of the metal terminals 141a and 142a may be provided with a plurality of upper holes and a plurality of lower holes. The plurality of lower holes LH1 and LH2 may be positioned closer to the inner surfaces IS1 and IS2 of the metal terminals 141a and 142a in the length direction than the plurality of upper holes UH1 and UH2. The plurality of lower holes LH1 and LH2 may be positioned closer to the center of the metal terminals 141a and 142a in the width direction than the plurality of upper holes UH1 and UH2. The plurality of upper holes UH1 and UH2 may be spaced apart from each other in the width direction, and the plurality of lower holes LH1 and LH2 may also be spaced apart from each other in the width direction. The distance between the plurality of lower holes LH1 and LH2 in the width direction may be less than the distance between the plurality of upper holes UH1 and UH2 in the width direction. That is, Figure 8A and Figure 8B The positions of the upper and lower holes of the metal terminals 141a and 142a shown in the figure can be compared with those of the upper and lower holes of the metal terminals 141a and 142a shown in the figure. Figure 7A and Figure 7B The upper and lower holes of the metal terminals 141 and 142 shown are in opposite positions.

[0069] Reference Figure 9A and Figure 9B Each of the metal terminals 141b and 142b may be provided with a plurality of upper holes and a plurality of lower holes. In an embodiment, when viewed in the thickness direction, the upper holes UH1 and UH2 and the lower holes LH1 and LH2 may be alternately provided along the periphery of the recesses R1 and R2.

[0070] exist Figures 7A to 9B In the present invention, the cross-sections of the upper holes UH1 and UH2 and the lower holes LH1 and LH2 can be circular or elliptical, but this disclosure is not limited thereto.

[0071] exist Figure 9A and Figure 9B In this configuration, upper holes UH1 and UH2 are disposed adjacent to the inner surfaces IS1 and IS2 of metal terminals 141b and 142b in the longitudinal direction, and lower holes LH1 and LH2 are disposed adjacent to the outer surfaces OS1 and OS2 of metal terminals 141b and 142b in the longitudinal direction. However, this disclosure is not limited thereto. For example, the positions of upper holes UH1 and UH2 and lower holes LH1 and LH2 can be interchanged. In this case, upper holes UH1 and UH2 can be disposed adjacent to the outer surfaces OS1 and OS2 of metal terminals 141b and 142b in the longitudinal direction, and lower holes LH1 and LH2 can be disposed adjacent to the inner surfaces IS1 and IS2 of metal terminals 141b and 142b in the longitudinal direction.

[0072] Reference Figure 10A and Figure 10BMetal terminals 141c and 142c may include main portions M1 and M2 facing the recesses R1 and R2 in the length direction, and extension portions E1 and E2 disposed on both sides of the main portions M1 and M2 in the width direction. For example, the main portions M1 and M2 may refer to regions in the metal terminals 141c and 142c whose length varies along the width direction, and the extension portions E1 and E2 may refer to regions in the metal terminals 141c and 142c whose length does not vary along the width direction. For example, the length of the main portions M1 and M2 may decrease as they approach the center of the metal terminals 141c and 142c in the width direction. The cross-sections of the extension portions E1 and E2 may be, for example, rectangular.

[0073] In this embodiment, upper holes UH1-1 and UH2-1 may be disposed in the main portions M1 and M2, and lower holes LH1-1 and LH2-1 may be disposed in the extension portions E1 and E2. Upper holes UH1-1 and UH2-1 may have a shape extending in the width direction, and lower holes LH1-1 and LH2-1 may have a shape extending in the length direction. Upper holes UH1-1 and UH2-1 may have a shape where the dimension in the width direction is greater than the dimension in the length direction, and lower holes LH1-1 and LH2-1 may have a shape where the dimension in the length direction is greater than the dimension in the width direction.

[0074] For example, the upper holes UH1-1 and UH2-1 can be provided across the entire main body M1 and M2 in the width direction. The lower holes LH1-1 and LH2-1 can be provided in the two extensions E1 and E2 respectively provided on both sides of the main body M1 and M2. The cross-sections of the upper holes UH1-1 and UH2-1 and the lower holes LH1-1 and LH2-1 can have a rectangular or square shape.

[0075] In the embodiment, when viewed in the thickness direction, the area of ​​the region where the metal terminals 141c and 142c are provided with upper holes UH1-1 and UH2-1 and lower holes LH1-1 and LH2-1 can be greater than the area of ​​the region where the upper holes UH1-1 and UH2-1 and lower holes LH1-1 and LH2-1 are not provided.

[0076] Figure 10A and Figure 10B The diagram shows a structure in which upper holes UH1-1 and UH2-1 are disposed in main portions M1 and M2, and lower holes LH1-1 and LH2-1 are disposed in extensions E1 and E2; however, this disclosure is not limited thereto. As another example, the upper holes may be disposed in the extensions, and the lower holes may be disposed in the main portions. In this case, the upper holes may have a shape extending in the length direction, and the lower holes may have a shape extending in the width direction. That is, the shape and position of the upper holes may be interchanged with those of the lower holes.

[0077] Reference Figure 11A and Figure 11B The metal terminals 141d and 142d may include main portions M1 and M2 facing the recesses R1 and R2 in the length direction, and extension portions E1 and E2 provided on both sides of the main portions M1 and M2 in the width direction.

[0078] In an embodiment, the upper holes UH1-2 and UH2-2 may include main upper holes mh1-2 and mh2-2 disposed in the main portions M1 and M2, and auxiliary upper holes ah1-2 and ah2-2 disposed in the extension portions E1 and E2.

[0079] The dimensions of the main upper holes mh1-2 and mh2-2 in the width direction can be larger than the dimensions of the auxiliary upper holes ah1-2 and ah2-2 in the width direction. The auxiliary upper holes ah1-2 and ah2-2 can be respectively provided in the two extensions E1 and E2 provided on both sides of the main parts M1 and M2.

[0080] The lower holes LH1-2 and LH2-2 can be provided on both sides of the main upper holes mh1-2 and mh2-2 in the width direction, but can be positioned closer to the inner surfaces IS1 and IS2 of the metal terminals 141d and 142d in the length direction than the auxiliary upper holes ah1-2 and ah2-2. The lower holes LH1-2 and LH2-2 can be formed across the main portions M1 and M2 and the extensions E1 and E2.

[0081] The cross-sections of the upper holes UH1-2 and UH2-2 and the lower holes LH1-2 and LH2-2 in the length-width direction can have a rectangular shape.

[0082] In the embodiment, when viewed in the thickness direction, the area of ​​metal terminals 141d and 142d with upper holes UH1-2 and UH2-2 and lower holes LH1-2 and LH2-2 can be larger than the area without upper holes UH1-2 and UH2-2 and lower holes LH1-2 and LH2-2.

[0083] Furthermore, the shape and position of the upper holes UH1-2 and UH2-2 can be interchanged with the shape and position of the lower holes LH1-2 and LH2-2. In this case, the lower holes may include a main lower hole provided in the main part and an auxiliary lower hole provided in the extension part, and the upper holes may be provided on both sides of the main lower hole in the width direction, but may be set closer to the inner surface of the metal terminal in the length direction than the auxiliary lower holes.

[0084] Reference Figure 12A and Figure 12B The metal terminals 141e and 142e may include main portions M1 and M2 facing the recesses R1 and R2 in the length direction, and extension portions E1 and E2 provided on both sides of the main portions M1 and M2 in the width direction.

[0085] In an embodiment, the upper holes UH1-3 and UH2-3 may include auxiliary upper holes ah1-3 and ah2-3 disposed in main portions M1 and M2, and main upper holes mh1-3 and mh2-3 disposed in extension portions E1 and E2. In an embodiment, the lower holes LH1-3 and LH2-3 may be disposed in the main portions M1 and M2. The main upper holes mh1-3 and mh2-3 may be respectively disposed in the two extension portions E1 and E2 provided on both sides of the main portions M1 and M2.

[0086] When viewed in the thickness direction, the lower holes LH1-3 and LH2-3 may be disposed between the auxiliary upper holes ah1-3 and ah2-3 and the main upper holes mh1-3 and mh2-3. The dimension of the lower holes LH1-3 and LH2-3 in the length direction may be greater than the dimension of the auxiliary upper holes ah1-3 and ah2-3 in the length direction, and smaller than the dimension of the main upper holes mh1-3 and mh2-3 in the length direction.

[0087] The cross-sections of the upper holes UH1-3 and UH2-3 and the lower holes LH1-3 and LH2-3 in the length direction-width direction may have a rectangular shape.

[0088] In addition, the shapes and positions of the upper holes UH1-3 and UH2-3 and the lower holes LH1-3 and LH2-3 are interchangeable. In this case, the lower holes may include auxiliary lower holes disposed in the main portion and main lower holes disposed in the extension portion, and when viewed in the thickness direction, the upper holes may be disposed between the auxiliary lower holes and the main lower holes.

[0089] Manufacturing method of multilayer electronic components Hereinafter, an example of a method for forming a multilayer electronic component 100 will be described. Based on Figures 1 to 7B The description is made with reference to the illustrated multilayer electronic component 100 including metal terminals 141 and 142, but the manufacturing method of the multilayer electronic component 100 is not limited thereto.

[0090] First, ceramic powder for forming the dielectric layer 111 is prepared. The ceramic powder may be a perovskite-type compound powder represented by ABO3. The ceramic powder may include, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0<x<1), Ba(Ti 1-y Ca y )O3 (0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0<x<1, 0<y<1), Ba(Ti 1-y Zr y )O3 (0<y<1), CaZrO3 and (Ca1-x Sr x )(Zr 1-y Ti y )O3, wherein 0<x≤0.5 and 0<y≤0.5. BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Methods for synthesizing ceramic powder include, for example, solid-state method, sol-gel method, hydrothermal synthesis method, etc., but the present disclosure is not limited thereto. Next, the prepared ceramic powder is dried and ground, and then mixed with an organic solvent such as ethanol and a binder such as polyvinyl butyral to prepare ceramic slurry. Then, the ceramic slurry is coated on a carrier film and dried to prepare a ceramic green sheet.

[0091] Next, a conductive paste for internal electrodes, comprising metal powder, a binder, an organic solvent and the like, is printed on the ceramic green sheet to a predetermined thickness by using screen printing, gravure printing or the like, thereby forming an internal electrode pattern.

[0092] Hereinafter, the ceramic green sheets with the internal electrode pattern printed thereon are peeled off from the carrier film, and then a predetermined number of the ceramic green sheets with the internal electrode pattern printed thereon are stacked and pressed to form a ceramic stack. A predetermined number of ceramic green sheets without internal electrode patterns may be stacked on the upper part and the lower part of the ceramic stack to form covering portions 112 and 113 after firing. Then, the ceramic stack is cut into unit ceramic stacks having a predetermined sheet size, and the cut unit ceramic stacks are fired to form a main body 110. For example, firing may be performed at a temperature of 1000°C to 1400°C for 1 to 3 hours in an atmosphere of 1.0% H2 / 99.0% N2 (vol%) to 3.5% H2 / 96.5% N2 (vol%).

[0093] Next, external electrodes 131 and 132 are formed. For example, when the base electrode layers 131a and 132a comprise sintered electrode layers, the main body 110 may be immersed in a conductive paste for external electrodes comprising metal powder, glass frit, a binder and an organic solvent, and then the conductive paste for external electrodes may be sintered at a temperature of 500°C to 900°C to form the sintered electrode layers.

[0094] For example, when the base electrode layers 131a and 132a comprise resin electrode layers, the main body may be immersed in a conductive resin composition comprising metal powder, resin, a binder and an organic solvent, and then cured and heat-treated at a temperature of 250°C to 550°C to form the resin electrode layers.

[0095] In addition, metal layers 131b and 132b may be formed on the base electrode layers 131a and 132a by additionally performing an electrolytic plating method and / or an electroless plating method.

[0096] Next, after fabricating the metal core MC with recesses R1 and R2, holes can be machined on the surface of the metal core MC using methods such as semi-etching. Through hole machining, upper holes UH1 and UH2 and lower holes LH1 and LH2 can be formed. Metal terminals 141 and 142 can be formed on the surface of the machined metal core MC by forming a plating layer PL using electrolytic plating and / or chemical plating methods. The metal core MC may include one or more of, for example, Cu, Ni, Ag, Sn, Pt, Pd, Fe, Al and their alloys, phosphor bronze, and stainless steel, and the plating layer PL may include one or more of, for example, Ni, Sn, and Au.

[0097] Next, the multilayer electronic assembly 100 can be formed by attaching the metal terminals 141 and 142 to the external electrodes 131 and 132 using a conductive adhesive.

[0098] Experimental Example After preparing a multilayer ceramic capacitor of size 1608 (length: approx. 1.6 mm, width: approx. 0.8 mm, thickness: approx. 0.8 mm), a sample sheet is prepared by attaching metal terminals to the external electrodes.

[0099] In the comparative example, the metal terminal only has a recess, without upper and lower holes.

[0100] In Example 1, an upper hole and a lower hole are formed in the metal terminal, and the metal terminal has... Figure 7A and 7B The shape shown.

[0101] In Example 2, an upper hole and a lower hole are formed in the metal terminal, and the metal terminal has... Figure 8A and 8B The shape shown.

[0102] The sample sheets of Comparative Example, Example 1 and Example 2 were mounted on a printed circuit board using a conductive mounting agent, and then their respective bond strength and flexural strength were measured.

[0103] The bonding strength is defined as the force applied to the printed circuit board at the moment the sample breaks when the opposing surfaces of the printed circuit board on which the sample is mounted are pressed until the sample breaks, and the average bonding strength of 40 sample pieces in each of the comparative examples, example 1 and example 2 is taken.

[0104] Figure 13 This is a graph showing the bonding strength of Comparative Example, Example 1, and Example 2. (Refer to...) Figure 13The average bonding strength of the comparative examples was 39.163 N, the average bonding strength of Example 1 was 42.3732 N, and the average bonding strength of Example 2 was 42.1183 N. In other words, it can be confirmed that Example 1 and Example 2 have superior bonding strength compared to the comparative examples.

[0105] The bending strength test was conducted as follows: Approximately 2 mm was pressed against the surface of the printed circuit board opposite to the mounting surface on which the sample piece was mounted, and held for 10 seconds. Then, a voltage of 1 Vr (rated voltage) was applied for 24 hours at a temperature of 85°C and a relative humidity of 85%. Afterward, the cross-section of the sample piece was observed under a microscope, and the number of sample pieces exhibiting bending cracks was recorded in Table 1 below.

[0106] [Table 1]

[0107] Referring to Table 1 above, compared with the comparative examples, Examples 1 and 2 have fewer sample pieces exhibiting bending cracks. In particular, Example 1 has a lower bending crack incidence rate than Example 2, which is believed to be because the bending cracks mainly occur at the ends of the strip, and Example 1 effectively reduces the rigidity of the metal terminal and absorbs stress by setting the upper hole adjacent to the end of the strip.

[0108] 2. Second example Multilayer electronic components Figure 14 This is a perspective view schematically illustrating a multilayer electronic assembly according to another embodiment of the present disclosure.

[0109] Figure 15 It is along Figure 14 A schematic cross-sectional view taken from line III-III'.

[0110] Figure 16A and Figure 16B yes Figure 14 Top view of the first and second metal terminals.

[0111] Figure 17A , Figure 17B , Figure 18A , Figure 18B , Figure 19A as well as Figure 19B The first metal terminal and the second metal terminal of other embodiments of this disclosure are related to... Figure 16A and Figure 16B The corresponding top view.

[0112] In the following text, reference will be made to Figures 14 to 19B Description of a multilayer electronic assembly 200 according to another embodiment and other embodiments of the present disclosure. For use with... Figures 1 to 12B The multilayer electronic assembly 100 described herein has the same / similar construction, uses the same / similar reference numerals, and omits repeated descriptions.

[0113] The multilayer electronic assembly 200 may include a body 110, external electrodes 131 and 132, and metal terminals 241 and 242.

[0114] Recesses R1 and R2 may be provided in metal terminals 241 and 242. The first recess R1 may be provided in the first metal terminal 241, and the second recess R2 may be provided in the second metal terminal 242.

[0115] Recesses R1 and R2 may have a shape in which their inner surfaces IS1 and IS2 are recessed in the length direction toward the metal terminals 241 and 242, and the cross-sections of recesses R1 and R2 in the length and width directions may have C-shaped edges. However, this disclosure is not limited thereto, and the cross-sections of recesses R1 and R2 in the length and width directions may have U-shaped or C-shaped edges.

[0116] When mounting the multilayer electronic component 200 onto a printed circuit board using a conductive mounting agent, the recesses R1 and R2 can serve as containment pockets by providing space to fill the molten conductive mounting agent. In this way, the height by which the conductive mounting agent fillet rises along the outer electrodes 131 and 132 in the thickness direction is reduced, thereby blocking the transmission path of piezoelectric vibrations generated in the body 110, and thus reducing the acoustic noise of the multilayer electronic component 200.

[0117] In an embodiment, metal terminals 241 and 242 may include stepped portions SP1 and SP2 having relatively thin thicknesses. The first metal terminal 241 may include a first stepped portion SP1 having a relatively thin thickness, and the second metal terminal 242 may include a second stepped portion SP2 having a relatively thin thickness.

[0118] That is, metal terminals 241 and 242 may have stepped portions SP1 and SP2 defined in the upper surfaces US1 and US2 and the inner surfaces IS1 and IS2 in the longitudinal direction. Here, the upper surfaces US1 and US2 of metal terminals 241 and 242 may refer to the uppermost surfaces of metal terminals 241 and 242.

[0119] The rigidity of the metal terminals 241 and 242 can be reduced by the steps SP1 and SP2, thereby improving the bending strength of the multilayer electronic assembly 200. Specifically, the steps SP1 and SP2 can be provided in the upper surfaces US1 and US2 and the inner surfaces IS1 and IS2 in the longitudinal direction of the metal terminals 241 and 242, adjacent to the ends of the outer electrodes 131 and 132. Since the ends of the outer electrodes 131 and 132 are the main points where bending cracks begin to appear, the bending strength of the multilayer electronic assembly 200 can be effectively improved by forming the steps SP1 and SP2 in this region.

[0120] Reference Figure 16A and Figure 16B The stepped portions SP1 and SP2 may have a shape that extends in the width direction. Specifically, the stepped portions SP1 and SP2 may be formed to span the entire metal terminals 241 and 242 in the width direction.

[0121] In the following text, reference will be made to Figures 17A to 19B Various variations of metal terminals are described. Each variation is described separately, but repeated descriptions are omitted.

[0122] Reference Figure 17A and Figure 17B Metal terminals 241a and 242a may include stepped portions SP1-1 and SP2-1 having relatively thin thicknesses. Metal terminals 241a and 242a may have stepped portions SP1-1 and SP2-1 defined in the upper surfaces US1 and US2 and in the inner surfaces IS1 and IS2 in the longitudinal direction.

[0123] The stepped portions SP1-1 and SP2-1 may have a shape extending in the width direction. However, the stepped portions SP1-1 and SP2-1 may be formed on a portion of the metal terminals 241a and 242a in the width direction. For example, the stepped portions SP1-1 and SP2-1 may be spaced apart from the two surfaces of the metal terminals 241a and 242a in the width direction. For example, the dimensions of the stepped portions SP1-1 and SP2-1 in the width direction may be smaller than the dimensions of the metal terminals 241a and 242a in the width direction.

[0124] Reference Figure 18A and Figure 18B Metal terminals 241b and 242b may include stepped portions SP1-2 and SP2-2 having relatively thin thicknesses. Metal terminals 241b and 242b may have stepped portions SP1-2 and SP2-2 defined in the upper surfaces US1 and US2.

[0125] Stepped portions SP1-2 and SP2-2 may have a shape extending in the width direction. However, stepped portions SP1-2 and SP2-2 may be formed on a portion of the metal terminals 241b and 242b in the width direction. For example, stepped portions SP1-2 and SP2-2 may be spaced apart from the two surfaces of the metal terminals 241b and 242b in the width direction. For example, the dimensions of stepped portions SP1-2 and SP2-2 in the width direction may be smaller than the dimensions of the metal terminals 241b and 242b in the width direction.

[0126] Multiple steps SP1-2 and SP2-2 may be provided. For example, multiple first steps SP1-2 may be provided on the first metal terminal 241b, and multiple second steps SP2-2 may be provided on the second metal terminal 242b. The multiple first steps SP1-2 may be spaced apart in the width direction, and the multiple second steps SP2-2 may be spaced apart in the width direction. The multiple steps SP1-2 and SP2-2 may be spaced apart from the inner surfaces of the metal terminals 241b and 242b in the length direction. However, this disclosure is not limited thereto, and the multiple steps SP1-2 and SP2-2 may be open to the inner surfaces of the metal terminals 241b and 242b in the length direction.

[0127] Reference Figure 19A and Figure 19B Metal terminals 241c and 242c may include stepped portions SP1-3 and SP2-3 having relatively thin thicknesses. Metal terminals 241c and 242c may have stepped portions SP1-3 and SP2-3 defined in the upper surfaces US1 and US2 and in the inner surfaces IS1 and IS2 in the longitudinal direction.

[0128] Viewed in the thickness direction, the stepped portions SP1-3 and SP2-3 may have an arc shape. The stepped portions SP1-3 and SP2-3 may be configured as a portion spanning the width direction of the metal terminals 241c and 242c. For example, the stepped portions SP1-3 and SP2-3 may be spaced apart from the two surfaces of the metal terminals 241c and 242c in the width direction. For example, the dimensions of the stepped portions SP1-3 and SP2-3 in the width direction may be smaller than the dimensions of the metal terminals 241c and 242c in the width direction.

[0129] Multiple steps SP1-3 and SP2-3 may be provided. For example, multiple first steps SP1-3 may be provided on the first metal terminal 241c, and multiple second steps SP2-3 may be provided on the second metal terminal 242c. The multiple first steps SP1-3 may be spaced apart in the width direction, and the multiple second steps SP2-3 may be spaced apart in the width direction. The multiple steps SP1-3 and SP2-3 may be open to the inner surfaces IS1 and IS2 of the metal terminals 241c and 242c in the length direction. However, this disclosure is not limited thereto, and the multiple steps SP1-3 and SP2-3 may be spaced apart from the inner surfaces of the metal terminals 241c and 242c in the length direction.

[0130] This disclosure is not limited to the above embodiments and drawings, but is intended to be defined by the appended claims. Therefore, it will be possible for those skilled in the art to make various substitutions, modifications and alterations within the scope of the technical spirit of this disclosure as described in the claims, and these will also be considered to fall within the scope of this disclosure.

[0131] Furthermore, the term "embodiment" does not refer to the same embodiment and is provided to emphasize and describe different unique features. However, the embodiments presented above do not preclude implementation in combination with features of another embodiment. For example, unless there is a description contrary to or contradictory to the content in another embodiment, even if the content described in one specific embodiment is not described in another embodiment, the content may be understood as a description related to the other embodiment.

[0132] In this disclosure, the term "connection" includes not only direct connections but also indirect connections such as those via adhesive layers. Furthermore, the term "electrical connection" includes both physical connections and non-physical connections. Additionally, expressions such as "first" and "second" are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the claims, a first element may be named a second element, and similarly, a second element may be named a first element.

[0133] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body includes a dielectric layer and internal electrodes alternately disposed with the dielectric layer. The body has a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the length direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in the width direction. An external electrode is disposed on the third surface and the fourth surface, and extends to a portion of the first surface and a portion of the second surface; as well as A metal terminal is disposed on the first surface or the second surface and connected to the external electrode. The metal terminal has a recess on its outer surface along its length. The metal terminal has an upper hole and a lower hole respectively on its upper and lower surfaces in the thickness direction, and The upper hole does not overlap with the lower hole in the thickness direction.

2. The multilayer electronic component according to claim 1, wherein, Each of the upper hole and the lower hole is formed in multiple ways, and Among them, the multiple upper holes do not overlap with the multiple lower holes in the thickness direction.

3. The multilayer electronic component according to claim 1, wherein, Each of the upper hole and the lower hole is formed in multiple ways. Among them, the plurality of upper holes are positioned closer to the inner surface of the metal terminal in the longitudinal direction than the plurality of lower holes, and The plurality of upper holes are positioned closer to the center of the metal terminal in the width direction than the plurality of lower holes.

4. The multilayer electronic component according to claim 1, wherein, Each of the upper hole and the lower hole is provided in multiple configurations. Among them, the plurality of lower holes are configured to be closer to the inner surface of the metal terminal in the length direction than the plurality of upper holes, and The plurality of lower holes are positioned closer to the center of the metal terminal in the width direction than the plurality of upper holes.

5. The multilayer electronic component according to claim 3, wherein, The plurality of upper holes are spaced apart from each other in the width direction, and The plurality of lower holes are spaced apart from each other in the width direction.

6. The multilayer electronic component according to claim 4, wherein, The plurality of upper holes are spaced apart from each other in the width direction, and The plurality of lower holes are spaced apart from each other in the width direction.

7. The multilayer electronic assembly according to claim 1, wherein, The recess has a shape that is recessed into the inner surface of the metal terminal in the length direction.

8. The multilayer electronic component according to claim 7, wherein, When viewed in the thickness direction, the upper hole and the lower hole are alternately arranged along the outer periphery of the recess.

9. The multilayer electronic component according to claim 1, wherein, The metal terminal includes a main portion and an extension portion. The main portion faces the recess in the length direction, and the extension portion is disposed on both sides of the main portion in the width direction. The upper hole is disposed in the main portion and extends in the width direction, and The lower hole is disposed in the extension and extends in the length direction.

10. The multilayer electronic assembly according to claim 1, wherein, The metal terminal includes a main portion and an extension portion. The main portion faces the recess in the length direction, and the extension portion is disposed on both sides of the main portion in the width direction. The upper hole includes a main upper hole disposed in the main part and an auxiliary upper hole disposed in the extension part. The lower hole is disposed on both sides of the main upper hole in the width direction, and the lower hole is disposed closer to the inner surface of the metal terminal in the length direction than the auxiliary upper hole.

11. The multilayer electronic assembly according to claim 1, wherein, The metal terminal includes a main portion and an extension portion. The main portion faces the recess in the length direction, and the extension portion is disposed on both sides of the main portion in the width direction. The upper hole includes an auxiliary upper hole disposed in the main portion and a main upper hole disposed in the extension portion, and When viewed in the thickness direction, the lower hole is positioned between the auxiliary upper hole and the main upper hole.

12. The multilayer electronic assembly according to claim 1, wherein, A conductive adhesive is provided between the external electrode and the metal terminal, and The conductive adhesive fills at least a portion of the upper hole.

13. The multilayer electronic assembly according to claim 1, wherein, The metal terminal includes a metal core and a plating layer disposed on the metal core, and The coating extends into the interior of the upper hole and the interior of the lower hole.

14. The multilayer electronic assembly according to claim 1, wherein, The metal terminal has a stepped portion recessed from the upper surface of the metal terminal, the thickness of the stepped portion being less than the thickness of the other portions of the metal terminal.

15. The multilayer electronic assembly according to claim 14, wherein, The stepped portion extends to the side surface of the metal terminal in the width direction.

16. The multilayer electronic assembly according to claim 14, wherein, The stepped portion is spaced apart from the side surface of the metal terminal in the width direction.

17. The multilayer electronic assembly according to claim 14, wherein, The stepped portion extends to the inner surface of the metal terminal in the length direction.

18. The multilayer electronic assembly according to claim 14, wherein, The stepped portion is spaced apart from the inner surface of the metal terminal in the length direction.

19. The multilayer electronic assembly according to claim 14, wherein, The stepped portion is formed in multiple parts, and the multiple stepped portions are spaced apart from each other.

20. The multilayer electronic component according to claim 1, wherein, Each of the upper hole and the lower hole penetrates a portion of the metal terminal.

21. The multilayer electronic assembly according to claim 1, wherein, When viewed in the thickness direction, the area of ​​the metal terminal with the upper hole and the lower hole is larger than the area of ​​the metal terminal without the upper hole and the lower hole.

22. A mounting plate, comprising: Printed circuit board, including electrode pads; The multilayer electronic component according to any one of claims 1 to 21 is disposed on the printed circuit board; as well as A conductive material is disposed between the electrode pad and the metal terminal. The conductive material fills at least a portion of the lower hole.

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