Preparation method of modified epoxy butyl adhesive and packaging method of perovskite module

Abstract

The application belongs to the technical field of perovskite components, and relates to a preparation method of modified epoxy butyl glue and a packaging method of perovskite components. The preparation method of the modified epoxy butyl glue comprises the following steps: placing butyl rubber after being cut into a round-bottom flask provided with a magnet, then adding a n-hexane solvent to obtain rubber cement; adding m-chloroperbenzoic acid-toluene solution dropwise to obtain glue solution; adjusting the pH value of the glue solution to 7-10 by using a sodium hydroxide solution, and washing the glue solution with distilled water until a glue block is formed; adding 0.5-5.0 wt% of an imidazole or derivative modifier to the glue block, heating on a heating table at 50-60 DEG C and performing magnetic stirring, so that the modifier is mixed with the glue block, and the modified epoxy butyl glue is obtained after 1-2 hours of reaction. The modified epoxy butyl glue contains the imidazole or derivative modifier, improves the packaging yield of perovskite component production and the stability of the perovskite component after packaging, and enables the perovskite component after packaging to have good aging performance.

Description

Technical Field

[0001] This invention belongs to the technical field of perovskite modules, and specifically relates to a method for preparing modified epoxy butyl rubber and a method for encapsulating perovskite modules. Background Technology

[0002] During the encapsulation process of perovskite modules, butyl rubber is typically used for edge sealing to prevent water and oxygen intrusion. When the butyl rubber thickness or size does not match the film thickness, gaps can easily appear at joints or corners. After vacuum lamination of the perovskite modules, these gaps are highly susceptible to water and oxygen intrusion, ultimately leading to module failure. Currently, there is no satisfactory solution. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a method for preparing modified epoxy butyl rubber and a method for encapsulating perovskite modules. The epoxy butyl rubber contains imidazole or its derivative modifier, which improves the encapsulation yield of perovskite modules and the stability of perovskite modules after encapsulation, so that the encapsulated perovskite modules have better aging performance.

[0004] This invention provides a method for preparing modified epoxy butyl rubber, comprising the following steps: placing 8-12g of shredded butyl rubber into a round-bottom flask equipped with a magnetic stir bar, then adding 100-250mL of n-hexane solvent, causing the butyl rubber to dissolve in the solvent to form rubber cement; slowly adding 25-35mL of m-chloroperoxybenzoic acid-toluene solution at room temperature, controlling the reaction temperature at 20-40℃, and maintaining the reaction time for 2-3 hours to obtain a rubber solution; adjusting the pH of the rubber solution to 7-10 using sodium hydroxide solution, then washing the rubber solution 3-4 times with distilled water until a rubber block is formed; adding 0.5-5.0wt% of imidazole or its derivative modifier to the rubber block, heating on a heating platform at 50-60℃ and magnetically stirring to mix the modifier with the rubber block, reacting for 1-2 hours to obtain the desired modified epoxy butyl rubber; wherein the weight-average molecular weight of the butyl rubber is 300,000-600,000, and the degree of unsaturation is 1-2%.

[0005] Furthermore, the imidazole or its derivative modifier is any one of imidazole, 1-ethylimidazole, or 1-ethyl-3-methylimidazole acetate.

[0006] This invention is implemented as follows, and also provides a method for encapsulating a perovskite module. The encapsulation method includes the following steps: first, a layer of POE film is laid on the back of the perovskite module on which each functional layer has been prepared; then, adhesive strips are evenly laid around the perimeter of the perovskite module; finally, a cover glass is placed on top of the perovskite module; and the entire assembly is fed into a laminator for lamination to complete the encapsulation of the perovskite module. The adhesive strips are prepared by extruding modified epoxy butyl rubber raw material prepared using the modified epoxy butyl rubber preparation method described above.

[0007] Furthermore, during the lamination process, the lamination temperature is 120~140℃, the time is 5~15min, and the lamination pressure is 60~90kPa.

[0008] Compared with existing technologies, the modified epoxy butyl rubber preparation method of this invention involves adding imidazole or its derivatives as modifiers to epoxy butyl rubber to obtain modified epoxy butyl rubber. At high lamination temperatures, the imidazole or its derivative modifiers can form hydrogen bonds or ionic complexes with the epoxy butyl rubber, resulting in better flowability and rapid bonding and overlapping even with minor defects and gaps. It also exhibits better adhesion and self-adhesion to the encapsulation glass, ultimately improving the encapsulation yield of perovskite modules and the stability of the encapsulated perovskite modules. Because imidazole cations can form ion pairs with epoxy ions, further forming ion clusters, these ion clusters possess self-healing properties, restricting the migration of molecules in the rubber and bonding the epoxy butyl rubber together. This is also the reason for the reduced self-healing time in the thermal self-healing experiment. Finally, the encapsulated perovskite modules exhibit good aging performance, maintaining good sealing performance after 6000 hours of IEC61215 accelerated damp heat aging test, with module power decay of less than 5%. Attached Figure Description

[0009] Figure 1 This is a schematic diagram showing the efficiency degradation curves of the encapsulated perovskite modules in Examples 6-8 and Comparative Example 2 of the present invention. Detailed Implementation

[0010] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0011] A preferred embodiment of the preparation method of the modified epoxy butyl rubber of the present invention includes the following steps: placing 8-12g of shredded butyl rubber into a round-bottom flask equipped with a magnetic stir bar, then adding 100-250 mL of n-hexane solvent, allowing the butyl rubber to fully dissolve in the solvent to form a homogeneous rubber cement; slowly adding 25-35 mL of m-chloroperoxybenzoic acid-toluene solution at room temperature, controlling the reaction temperature at 20-40°C, and maintaining the reaction time for 2-3 hours to obtain a rubber solution; adjusting the pH of the rubber solution to 7-10 using sodium hydroxide solution, then washing the rubber solution 3-4 times with distilled water until a rubber block is formed; adding 0.5-5.0 wt% of imidazole or its derivative modifier to the above rubber block, heating on a heating platform at 50-60°C and magnetically stirring to fully mix the modifier with the rubber block, reacting for 1-2 hours to obtain the desired modified epoxy butyl rubber; wherein the weight-average molecular weight of the butyl rubber is 300,000-600,000, and the degree of unsaturation is 1-2%.

[0012] Specifically, the imidazole or its derivative modifier is any one of imidazole, 1-ethylimidazolium, or 1-ethyl-3-methylimidazolium acetate.

[0013] This invention also discloses a method for encapsulating a perovskite module. The encapsulation method includes the following steps: first, a layer of POE film is laid on the back of the perovskite module with each functional layer prepared; then, adhesive strips are evenly laid around the perovskite module; finally, a cover glass is placed on top of the perovskite module; and the entire assembly is fed into a laminator for lamination to complete the encapsulation of the perovskite module. The adhesive strips are prepared by extruding modified epoxy butyl rubber raw material prepared using the modified epoxy butyl rubber preparation method described above.

[0014] Specifically, during the lamination process, the lamination temperature is 120~140℃, the time is 5~15min, and the lamination pressure is 60~90kPa.

[0015] The preparation method of the modified epoxy butyl rubber and the encapsulation method of the perovskite components of the present invention are further illustrated below through specific embodiments and comparative examples.

[0016] Example 1

[0017] The first embodiment of the preparation method of the modified epoxy butyl rubber of the present invention includes the following steps: 10g of shredded butyl rubber is placed in a round-bottom flask equipped with a magnetic stir bar, and then 100mL of n-hexane solvent is added. The butyl rubber is fully dissolved in the solvent to form a homogeneous rubber cement. At room temperature, 31.5mL of a 2% m-chloroperoxybenzoic acid-toluene solution is slowly added dropwise, the reaction temperature is controlled at 30℃, and the reaction time is maintained for 2h to obtain a rubber solution. The pH value of the rubber solution is adjusted to 8 using a 1% sodium hydroxide solution, and then the rubber solution is washed 3-4 times with 200mL of distilled water until a rubber block is formed. 4.0wt% of imidazole modifier is added to the above rubber block, and the mixture is heated to 50℃ on a heating platform and magnetically stirred to fully mix the modifier with the rubber block. The reaction is carried out for 1h to obtain the desired modified epoxy butyl rubber.

[0018] Example 2

[0019] A second embodiment of the preparation method of the modified epoxy butyl rubber of the present invention includes the following steps: 10g of shredded butyl rubber is placed in a round-bottom flask equipped with a magnetic stir bar, and then 100mL of n-hexane solvent is added. The butyl rubber is fully dissolved in the solvent to form a homogeneous rubber cement. At room temperature, 31.5mL of a 2% m-chloroperoxybenzoic acid-toluene solution is slowly added dropwise, the reaction temperature is controlled at 30℃, and the reaction time is maintained for 2h to obtain a rubber solution. The pH value of the rubber solution is adjusted to 8 using a 1% sodium hydroxide solution, and then the rubber solution is washed 3-4 times with 200mL of distilled water until a rubber block is formed. 4.0wt% of 1-ethylimidazole modifier is added to the above rubber block, and the mixture is heated to 50℃ on a heating platform and magnetically stirred to fully mix the modifier with the rubber block. The reaction is carried out for 1h to obtain the desired modified epoxy butyl rubber.

[0020] Example 3

[0021] A third embodiment of the preparation method of the modified epoxy butyl rubber of the present invention includes the following steps: 10g of shredded butyl rubber is placed in a round-bottom flask equipped with a magnetic stir bar, and then 100mL of n-hexane solvent is added. The butyl rubber is fully dissolved in the solvent to form a homogeneous rubber cement. At room temperature, 31.5mL of a 2% m-chloroperoxybenzoic acid-toluene solution is slowly added dropwise, the reaction temperature is controlled at 30℃, and the reaction time is maintained for 2h to obtain a rubber solution. The pH value of the rubber solution is adjusted to 8 using a 1% sodium hydroxide solution, and then the rubber solution is washed 3-4 times with 200mL of distilled water until a rubber block is formed. 4.0wt% of 1-ethyl-3-methylimidazolium acetate modifier is added to the above rubber block, and the mixture is heated to 50℃ on a heating platform and magnetically stirred to fully mix the modifier with the rubber block. The reaction is carried out for 1h to obtain the desired modified epoxy butyl rubber.

[0022] Example 4

[0023] The fourth embodiment of the preparation method of the modified epoxy butyl rubber of the present invention includes the following steps: 8g of shredded butyl rubber is placed in a round-bottom flask equipped with a magnetic stir bar, and then 180 mL of n-hexane solvent is added. The butyl rubber is fully dissolved in the solvent to form a homogeneous rubber cement. At room temperature, 35 mL of a 2% m-chloroperoxybenzoic acid-toluene solution is slowly added dropwise, the reaction temperature is controlled at 20°C, and the reaction time is maintained for 2.5 h to obtain a rubber solution. The pH value of the rubber solution is adjusted to 10 using a 1% sodium hydroxide solution, and then the rubber solution is washed 3-4 times with 200 mL of distilled water until a rubber block is formed. 0.5 wt% of imidazole modifier is added to the above rubber block, and the mixture is heated to 55°C on a heating platform and magnetically stirred to fully mix the modifier with the rubber block. The reaction is carried out for 1.5 h to obtain the desired modified epoxy butyl rubber.

[0024] Example 5

[0025] The fifth embodiment of the preparation method of the modified epoxy butyl rubber of the present invention includes the following steps: 12g of shredded butyl rubber is placed in a round-bottom flask equipped with a magnetic stir bar, and then 250mL of n-hexane solvent is added. The butyl rubber is fully dissolved in the solvent to form a homogeneous rubber cement. At room temperature, 25mL of a 2% m-chloroperoxybenzoic acid-toluene solution is slowly added dropwise, the reaction temperature is controlled at 40℃, and the reaction time is maintained for 3h to obtain a rubber solution. The pH value of the rubber solution is adjusted to 7 using a 1% sodium hydroxide solution, and then the rubber solution is washed 3-4 times with 200mL of distilled water until a rubber block is formed. 5.0wt% of imidazole modifier is added to the above rubber block, and the mixture is heated to 60℃ on a heating platform and magnetically stirred to fully mix the modifier with the rubber block. The reaction is carried out for 2h to obtain the desired modified epoxy butyl rubber.

[0026] Comparative Example 1 This comparative example describes a method for preparing epoxy butyl rubber, comprising the following steps: 10g of shredded butyl rubber is placed in a round-bottom flask equipped with a magnetic stir bar, followed by the addition of 100mL of n-hexane solvent. The butyl rubber dissolves completely in the solvent to form a homogeneous rubber cement. At room temperature, 31.5mL of a 2% m-chloroperoxybenzoic acid-toluene solution is slowly added dropwise, controlling the reaction temperature at 30℃ and maintaining the reaction time for 2 hours to obtain a rubber solution. The pH of the rubber solution is adjusted to 8 using a 1% sodium hydroxide solution, and then the solution is washed 3-4 times with 200mL of distilled water until a rubber block is formed. The solution is heated to 50℃ on a heating platform and magnetically stirred for 1 hour to obtain the desired epoxy butyl rubber.

[0027] The difference between this comparative example and Example 1 is that the imidazole modifier is not used, but the other steps and conditions are the same as in Example 1.

[0028] Example 6

[0029] The first embodiment of the encapsulation method for perovskite modules of the present invention includes the following steps: first, a layer of POE adhesive film is laid on the back of the perovskite module to which each functional layer has been prepared; then, adhesive strips are evenly laid around the perimeter of the perovskite module; finally, a cover glass plate is placed on top of the perovskite module; and the entire assembly is then fed into a laminator for lamination to complete the encapsulation of the perovskite module. The adhesive strips are obtained by extrusion molding using the modified epoxy butyl rubber raw material prepared in Example 1. During the lamination process, the lamination temperature is 120°C, the time is 10 minutes, and the lamination pressure is 60 kPa.

[0030] Example 7

[0031] A second embodiment of the encapsulation method for perovskite modules of the present invention includes the following steps: first, a layer of POE film is laid on the back of the perovskite module with each functional layer prepared; then, adhesive strips are evenly laid around the perimeter of the perovskite module; finally, a cover glass plate is placed on top of the perovskite module; and the entire assembly is then fed into a laminator for lamination to complete the encapsulation of the perovskite module. The adhesive strips are obtained by extrusion molding using the modified epoxy butyl rubber raw material prepared in Example 2. During the lamination process, the lamination temperature is 130°C, the time is 10 minutes, and the lamination pressure is 80 kPa.

[0032] Example 8

[0033] A third embodiment of the encapsulation method for perovskite modules of the present invention includes the following steps: first, a layer of POE film is laid on the back of the perovskite module with each functional layer prepared; then, adhesive strips are evenly laid around the perimeter of the perovskite module; finally, a cover glass plate is placed on top of the perovskite module; and the entire assembly is fed into a laminator for lamination to complete the encapsulation of the perovskite module. The adhesive strips are obtained by extrusion molding using the modified epoxy butyl rubber raw material prepared in Example 3. During the lamination process, the lamination temperature is 140°C, the time is 15 minutes, and the lamination pressure is 90 kPa.

[0034] Comparative Example 2 This comparative example is the first comparative example of the encapsulation method for perovskite modules. The only difference between this comparative example and Example 6 is that when encapsulating the perovskite modules, the adhesive strip produced by extrusion molding of epoxy butyl rubber prepared in Comparative Example 1 is used. The other steps and conditions are the same as those in Example 6, and will not be repeated here.

[0035] The modified epoxy butyl rubbers prepared in Examples 1-3 were characterized in the following manner.

[0036] (1) Characterization item 1: Thermal self-healing test. In order to evaluate the self-healing behavior of rubber at 120°C, a 5 mm slit was cut in the center of the rubber sample with a sharp blade, and then it was placed in an oven at 120°C for 10 min. The healing of the rubber was observed and recorded. The rubber was then stretched to observe whether it could be twisted arbitrarily and the degree of stretching was recorded to evaluate the regeneration of damage.

[0037] (2) Characterization Item 2: Rheometer Test. To test the flowability of the rubber, a rotational rheometer test is performed. The rotational rheometer applies shear forces by rotating one or two disks and measures the sample's response to these forces. The general procedure involves fixing one disk and rotating the other, thereby generating shear stress in the rubber. The viscosity of the sample can be calculated by measuring the torque required to rotate the disks and the rotational speed. The calculation method is as follows: γ = ω * r, Where γ represents the shear rate and ω represents the rotational speed.

[0038] Shear stress (τ) is usually the torque (ε) directly measured by the rheometer, but it needs to be normalized according to the area of ​​the disk.

[0039] τ = ε / (2 * π * r^2), Where r is the radius of the disk.

[0040] Viscosity (η) is the ratio of shear stress (τ) to shear rate (γ), and according to the definition of a Newtonian fluid, it can be calculated using the following formula: η = τ / γ.

[0041] The viscosity of rubber changes with temperature, so it is necessary to test the viscosity of rubber at 120°C.

[0042] (3) Characterization Item 3: Rigid Substrate Adhesion Test. To further characterize the good adhesion between rubber and glass, a rigid substrate adhesion test is required, which is conducted according to ASTM D42981 standard. A cylindrical rubber sample with a diameter of 39.9 mm is placed on a glass plate with a thickness of 9.5 mm, and then placed on a tension testing machine. Careful installation and adjustment are performed to ensure even tension distribution. Before the rubber tears, a fixed tension load is applied to the rubber at a specified speed, and the total applied pressure is recorded at the moment of tearing. The adhesion force is calculated according to the following formula: Adhesion Force = Total Applied Pressure / Area, and the magnitude of the adhesion force is recorded.

[0043] The aging performance of the perovskite modules encapsulated in Examples 6-8 was evaluated by damp heat stability testing. The method for damp heat stability testing was to subject the encapsulated perovskite modules to 6000 hours of damp heat stability testing and compare the efficiency changes before and after. The damp heat conditions were 60±5℃ and 85%RH.

[0044] The following results were obtained through testing: (11) When the modified epoxy butyl rubber prepared in Example 1 was subjected to a heat self-healing test, the degree of stretching was 110% of that of the original rubber; when the rheometer test was conducted, the calculated viscosity was 47 Pa·s; when the rigid substrate adhesion test was conducted, the adhesion of the glass substrate was calculated to be 105 N.

[0045] (12) After 6,000 hours of damp heat stability testing, the efficiency of the perovskite module packaged in Example 6 decreased from 16.51% to 15.72%.

[0046] (13) When the modified epoxy butyl rubber prepared in Example 2 was subjected to a heat self-healing test, the stretching degree was 110% of that of the original rubber; when the rheometer test was conducted, the calculated viscosity was 47 Pa·s; when the rigid substrate adhesion test was conducted, the calculated adhesion of the glass substrate was 105 N.

[0047] (14) After 6,000 hours of damp heat stability testing, the efficiency of the perovskite module packaged in Example 7 decreased from 16.56% to 15.88%.

[0048] (15) When the modified epoxy butyl rubber prepared in Example 3 was subjected to a heat self-healing test, the stretching degree was 150% of that of the original rubber; when the rheometer test was performed, the calculated viscosity was 43 Pa·s; when the rigid substrate adhesion test was performed, the calculated adhesion of the glass substrate was 115 N.

[0049] (16) After 6,000 hours of damp heat stability testing, the efficiency of the perovskite module packaged in Example 8 decreased from 16.14% to 15.54%.

[0050] (17) When the epoxy butyl rubber prepared in Comparative Example 1 was subjected to a heat self-healing test, the stretching degree was 100% of the original rubber; when the rheometer test was performed, the calculated viscosity was 50 Pa·s; when the adhesion test on the rigid substrate was performed, the adhesion test on the glass substrate was 101 N.

[0051] (18) After 6,000 hours of damp heat stability testing, the efficiency of the perovskite module packaged in Comparative Example 2 decreased from 16.50% to 15.13%.

[0052] The modified epoxy butyl rubber prepared in Examples 1-3 and the epoxy butyl rubber prepared in Comparative Example 1 were characterized and tested, and the results are summarized in Table 1.

[0053] Table 1. Characterization results of the modified epoxy butyl rubber prepared in Examples 1-3 and the epoxy butyl rubber prepared in Comparative Example 1.

[0054] From Table 1, we can see that: The modified epoxy butyl rubber prepared in Examples 1-3 of this invention can be stretched to 110%-150% of the ordinary epoxy butyl rubber prepared in Comparative Example 1 during a thermal self-healing test. This is because imidazole and its derivatives have self-healing properties, which restrict the migration of molecules in the epoxy butyl rubber and bind the epoxy butyl rubber together. Simultaneously, the modified epoxy butyl rubber exhibits lower viscosity and better flowability; its adhesive strength is enhanced, enabling better bonding to the encapsulated glass substrate. The modified epoxy butyl rubber of this invention shows better application prospects in the encapsulation of perovskite components.

[0055] In addition, after conducting damp heat stability tests on the perovskite modules packaged in Examples 6-8 of this invention and the perovskite module packaged in Comparative Example 2, the efficiency degradation data summary table in Table 2 was obtained. Figure 1 A schematic diagram showing the efficiency decay comparison curves.

[0056] Table 2. Summary of efficiency degradation data for encapsulated perovskite modules in Examples 6-8 and Comparative Example 2.

[0057] From Table 2, we can see that: Comparative Example 2 (i.e., epoxy butyl rubber) encapsulated perovskite modules underwent 6000 hours of damp heat stability testing, and the efficiency decreased from 16.50% to 15.13%, with a degradation rate of 8.3%.

[0058] In Example 6, the encapsulated perovskite module underwent a 6000-hour damp heat stability test, and the efficiency decreased from 16.51% to 15.72%, with a degradation rate of 4.78%.

[0059] In Example 7, the encapsulated perovskite module underwent a 6000-hour damp heat stability test, and the efficiency decreased from 16.56% to 15.88%, with a degradation rate of 4.11%.

[0060] In Example 8, the encapsulated perovskite module underwent a 6000-hour damp heat stability test, and the efficiency decreased from 16.54% to 15.89%, with a degradation rate of 3.93%.

[0061] This indicates that the modified epoxy butyl rubber of the present invention has better water and oxygen barrier effects, and can significantly improve the stability of encapsulated perovskite components.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for preparing modified epoxy butyl rubber, characterized in that, The process includes the following steps: 8-12g of shredded butyl rubber is placed in a round-bottom flask equipped with a magnetic stir bar, followed by the addition of 100-250mL of n-hexane solvent. The butyl rubber dissolves in the solvent to form rubber cement. At room temperature, 25-35mL of m-chloroperoxybenzoic acid-toluene solution is slowly added dropwise, controlling the reaction temperature at 20-40℃ and maintaining the reaction time for 2-3 hours to obtain a rubber solution. The pH of the rubber solution is adjusted to 7-10 using sodium hydroxide solution, and then the solution is washed 3-4 times with distilled water until a rubber block is formed. 0.5-5.0wt% of imidazole or its derivative modifier is added to the rubber block, and the mixture is heated to 50-60℃ on a heating platform with magnetic stirring to mix the modifier with the rubber block. The reaction is carried out for 1-2 hours to obtain the desired modified epoxy butyl rubber. The butyl rubber has a weight-average molecular weight of 300,000-600,000 and an unsaturation of 1-2%.

2. The preparation method of the modified epoxy butyl rubber according to claim 1, characterized in that, The imidazole or its derivative modifier is any one of imidazole, 1-ethylimidazolium, or 1-ethyl-3-methylimidazolium acetate.

3. The preparation method of the modified epoxy butyl rubber according to claim 2, characterized in that, The steps include: placing 10g of shredded butyl rubber into a round-bottom flask equipped with a magnetic stir bar, then adding 100ml of n-hexane solvent, causing the butyl rubber to dissolve in the solvent to form rubber cement; slowly adding 31.5mL of a 2% m-chloroperoxybenzoic acid-toluene solution at room temperature, controlling the reaction temperature at 30℃, and maintaining the reaction time for 2 hours to obtain a rubber solution; adjusting the pH of the rubber solution to 8 using a 1% sodium hydroxide solution, then washing the rubber solution 3-4 times with 200mL of distilled water until a rubber block is formed; adding 4.0wt% imidazole modifier to the above rubber block, heating it on a heating platform at 50℃ and magnetically stirring to mix the modifier with the rubber block, reacting for 1 hour to obtain the desired modified epoxy butyl rubber.

4. The method for preparing modified epoxy butyl rubber as described in claim 2, characterized in that, The steps include: placing 10g of shredded butyl rubber into a round-bottom flask equipped with a magnetic stir bar, then adding 100ml of n-hexane solvent, causing the butyl rubber to dissolve in the solvent to form rubber cement; slowly adding 31.5mL of a 2% m-chloroperoxybenzoic acid-toluene solution at room temperature, controlling the reaction temperature at 30℃, and maintaining the reaction time for 2 hours to obtain a glue solution; adjusting the pH of the glue solution to 8 using a 1% sodium hydroxide solution, then washing the glue solution 3-4 times with 200mL of distilled water until a glue block is formed; adding 4.0wt% of 1-ethylimidazolium modifier to the above glue block, heating it on a heating platform at 50℃ and magnetically stirring to mix the modifier with the glue block, reacting for 1 hour to obtain the desired modified epoxy butyl rubber.

5. The method for preparing modified epoxy butyl rubber as described in claim 2, characterized in that, The steps include: placing 10g of shredded butyl rubber into a round-bottom flask equipped with a magnetic stir bar, then adding 100mL of n-hexane solvent, where the butyl rubber dissolves to form rubber cement; slowly adding 31.5mL of a 2% m-chloroperoxybenzoic acid-toluene solution at room temperature, controlling the reaction temperature at 30℃, and maintaining the reaction time for 2 hours to obtain a rubber solution; adjusting the pH of the rubber solution to 8 using a 1% sodium hydroxide solution, then washing the rubber solution 3-4 times with 200mL of distilled water until a rubber block is formed; adding 4.0wt% of 1-ethyl-3-methylimidazolium acetate modifier to the above rubber block, heating on a heating platform to 50℃ and magnetically stirring to mix the modifier with the rubber block, reacting for 1 hour to obtain the desired modified epoxy butyl rubber.

6. A method for encapsulating a perovskite module, the encapsulation method comprising the steps of: firstly, laying a layer of POE adhesive film on the back of a perovskite module to which each functional layer has been prepared; then, uniformly laying adhesive strips around the perimeter of the perovskite module; finally, covering the perovskite module with a cover glass plate; and then feeding the entire assembly together into a laminator for lamination to complete the encapsulation of the perovskite module; characterized in that... The adhesive strip is obtained by extruding modified epoxy butyl rubber raw material prepared using the preparation method of modified epoxy butyl rubber as described in any one of claims 1 to 5 using an extruder.

7. The encapsulation method for a perovskite component as described in claim 6, characterized in that, During lamination, the lamination temperature is 120~140℃, the time is 5~15min, and the lamination pressure is 60~90kPa.

Images