NCSP lamp bead structure capable of reducing top light emission

By designing the inclined settings of the refractive bracket and light-transmitting colloid layer in the NCSP lamp beads, combining arcuate grooves and jagged surfaces, the problem of excessive light intensity on the top of the NCSP lamp beads is solved, and the side light intensity and visual effect are improved.

CN222126574UActive Publication Date: 2024-12-06JIANGXI ZHAO CHI SEMICON CO LTD
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Patent Information

Application Number
CN202420915370.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-29
Publication Date
2024-12-06
Estimated Expiration
2034-04-29

AI Technical Summary

Technical Problem

Due to its small volume, the colloid thickness is thin, and the top colloid cannot effectively block the light. When the backlight patch is backlight, the top luminous light intensity is too high, the side light intensity is weak, and the visual effect is poor.

Method used

Design a structure including a substrate, an LED chip, a refractive support and a light-transmissive colloid layer. The upper end of the light-transmissive colloid layer is provided with a refractive structure. The refractive structure is located in the vertical direction of the LED chip and is arranged inclined on both sides of the upper end of the light-transmissive colloid layer. Combining curved grooves and serrated surfaces, add fluorescent silicone to improve light scattering effect.

Benefits of technology

Through the refractive structure and tilt setting, the top light intensity is reduced, the side light intensity is increased, and the visual effect of the NCSP lamp beads is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an NCSP lamp bead structure capable of reducing top light emission, which comprises a substrate, an LED chip arranged on the substrate, and refraction supports arranged at two ends of the LED chip, one side, close to the LED chip, of each refraction support is obliquely arranged in the direction far away from the LED chip from bottom to top, and the other side, close to the LED chip, of each refraction support is obliquely arranged in the direction far away from the LED chip from bottom to top. A light-transmitting colloid layer is arranged above the LED chip and the refraction support, a refraction structure is arranged at the upper end of the light-transmitting colloid layer and located in the vertical direction of the LED chip, and the two sides of the upper end of the light-transmitting colloid layer are obliquely arranged in the direction away from the refraction structure from top to bottom. According to the NCSP lamp bead structure capable of reducing top light emission, the light intensity of the top is reduced, the light intensity of the side face and the light effect of the front face are improved, and the visual effect of the NCSP lamp bead is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to a NCSP lamp bead structure for reducing top light emission. Background Art

[0002] With the development of technology, the proportion of mini LED devices used in backlight displays has increased. Compared with traditional backlight beads, MINI NCSP products have been more widely used due to their smaller size.

[0003] In the existing technology, due to its smaller size, the colloid thickness of NCSP is thinner than that of conventional lamp beads, and the top colloid cannot provide a good shading effect. When the backlight is mounted, the top light intensity is prone to be too high and the side light intensity is weak, resulting in poor visual effects. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a NCSP lamp bead structure with reduced top light emission, aiming to solve the technical problems in the prior art that, due to its smaller volume, the colloid thickness of NCSP is thinner than that of conventional lamp beads, the top colloid cannot play a good shading effect, and the top light intensity is prone to being too high and the side light intensity is weak when backlighting, resulting in poor visual effects.

[0005] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0006] A NCSP lamp bead structure for reducing top light emission comprises a substrate, an LED chip arranged on the substrate, and refraction brackets arranged at both ends of the LED chip, wherein the refraction bracket is arranged obliquely from bottom to top in a direction away from the LED chip on a side close to the LED chip, a light-transmitting colloid layer is arranged above the LED chip and the refraction bracket, a refraction structure is arranged at the upper end of the light-transmitting colloid layer, the refraction structure is located in the vertical direction of the LED chip, and both sides of the upper end of the light-transmitting colloid layer are arranged obliquely from top to bottom in a direction away from the refraction structure.

[0007] According to one aspect of the above technical solution, there is a cavity between the light-transmitting colloid layer and the LED chip.

[0008] According to one aspect of the above technical solution, the side of the light-transmitting colloid layer close to the LED chip is arranged in a trapezoidal shape, and the inner side wall of the light-transmitting colloid layer is inclined from bottom to top towards the LED chip.

[0009] According to one aspect of the above technical solution, the refractive structure is an arc-shaped groove arranged at the upper end of the light-transmitting colloid layer, and the surface of the light-transmitting colloid layer at the arc-shaped groove is arranged in a serrated shape.

[0010] According to one aspect of the above technical solution, the surfaces of the two sides of the inclined upper end of the light-transmitting colloid layer are arranged in a serrated shape.

[0011] According to one aspect of the above technical solution, the substrate includes a metal layer, an insulating layer, and a circuit copper layer in sequence from bottom to top.

[0012] According to one aspect of the above technical solution, an electrode and a pad are provided below the LED chip, the electrode is connected to the circuit copper layer, and the LED chip is fixedly connected to the circuit copper layer through the pad.

[0013] According to one aspect of the above technical solution, a heat dissipation hole is formed through the metal layer, and the heat dissipation hole is located at a vertical position of the LED chip.

[0014] According to one aspect of the above technical solution, the refractive structure is a fluorescent silica gel arranged above the light-transmitting colloid layer, and the fluorescent silica gel is arranged in a semicircular shape.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] By providing a light-transmitting colloid layer above the LED chip, and providing a refractive structure on the light-transmitting colloid layer perpendicular to the upper end of the LED chip, when the LED chip emits light, the light can be scattered by the refractive structure directly above it, so as to reduce the light intensity at the top of the lamp bead. At the same time, refractive brackets are provided on both sides of the LED chip, and the inner sides of the refractive brackets are provided in an inclined surface. When the light emitted by the LED chip hits the inclined surface of the refractive bracket, the light will be refracted to the refractive structure, so that the light intensity at the top is more uniform. By providing the two sides of the upper end of the transparent colloid layer at an angle, when the light hits the inclined surface, the light at the edge top will be partially converted into light at the side, so as to increase the light intensity at the side.

[0017] Through the above design, the utility model reduces the top light intensity, increases the side light intensity and the front light effect, and improves the visual effect of the NCSP lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the NCSP lamp bead structure with reduced top light output in the first embodiment of the utility model;

[0019] Figure 2 for Figure 1 A magnified view of part A;

[0020] Figure 3 for Figure 1 A magnified view of part B;

[0021] Figure 4This is a schematic diagram of the structure of the NCSP lamp bead structure with reduced top light output in the second embodiment of the utility model;

[0022] Description of main component symbols:

[0023] Transparent colloid layer 10 Refraction bracket 11 Circuit copper layer 12 Insulation layer 13 Metal layer 14 Pads 15 electrode 16 LED Chips 17 Cooling holes 18 Cavity 19 Arc groove 20 Fluorescent silicone 21

[0024] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0028] See also Figures 1 to 3 , shown is a NCSP lamp bead structure for reducing top light in the first embodiment of the utility model, characterized in that it includes a substrate, an LED chip 17 arranged on the substrate, and a refraction bracket 11 arranged at both ends of the LED chip 17, the refraction bracket 11 is arranged obliquely from bottom to top on a side close to the LED chip 17 and away from the LED chip 17, a light-transmitting colloid layer is arranged above the LED chip 17 and the refraction bracket 11, a refraction structure is arranged at the upper end of the light-transmitting colloid layer, the refraction structure is located in the vertical direction of the LED chip 17, and both sides of the upper end of the light-transmitting colloid layer are arranged obliquely from top to bottom and away from the refraction structure.

[0029] It can be understood that the utility model provides a light-transmitting colloid layer above the LED chip 17, and provides a refraction structure on the light-transmitting colloid layer perpendicular to the upper end of the LED chip 17. When the LED chip 17 emits light, the light can be scattered by the refraction structure directly above it to reduce the light intensity at the top of the lamp bead. At the same time, refraction brackets 11 are provided on both sides of the LED chip 17, and the inner side of the refraction bracket 11 is provided with an inclined surface. When the light emitted by the LED chip 17 hits the inclined surface of the refraction bracket 11, the light will be refracted to the refraction structure to make the light intensity at the top more uniform; by setting the two sides of the upper end of the transparent colloid layer 10 at an angle, when the light hits the inclined surface, the light at the top of the edge will be partially converted into light on the side to increase the light intensity on the side.

[0030] Through the above design, the utility model reduces the top light intensity, increases the side light intensity and the front light effect, and improves the visual effect of the NCSP lamp beads.

[0031] Furthermore, there is a cavity 19 between the light-transmitting colloid layer and the LED chip 17 .

[0032] It is understandable that since the LED chip 17 generates heat when it emits light, and the transparent colloid layer 10 is heat-conductive, excessive heat will reduce the luminous efficiency of the LED chip 17 and shorten its lifespan. Therefore, separating the transparent colloid layer and the LED chip 17 by a certain distance can reduce the heat around the LED chip 17.

[0033] Furthermore, a surface of the light-transmitting colloid layer close to the LED chip 17 is arranged in a trapezoidal shape, and an inner side wall of the light-transmitting colloid layer is arranged to be inclined from bottom to top toward the direction of the LED chip 17 .

[0034] It can be understood that the light from the side of the LED chip 17 passes through the inner side wall of the inclined light-transmitting colloid layer, which can better refract the light to both sides of the upper end of the inclined light-transmitting colloid layer to improve the light output intensity from the side.

[0035] Furthermore, in this embodiment, the refractive structure is an arc-shaped groove 20 provided at the upper end of the light-transmitting colloid layer, and the surface of the light-transmitting colloid layer at the arc-shaped groove 20 is provided in a serrated shape.

[0036] It can be understood that when the light emitted from the upper part of the LED chip 17 passes through the transparent colloid layer to the groove, it will be scattered in the groove, thereby dispersing the light intensity at the top of the lamp bead, reducing the light intensity while improving the lighting effect, and the serrated setting can further improve the scattering effect of the light.

[0037] Furthermore, the surfaces of both sides of the inclined upper end of the light-transmitting colloid layer are arranged in a serrated shape.

[0038] Similarly, this design structure can further increase the light output effect at the side angles.

[0039] Furthermore, the substrate includes a metal layer 14, an insulating layer 13, and a circuit copper layer 12 from bottom to top;

[0040] An electrode 16 and a soldering pad 15 are provided below the LED chip 17 . The electrode 16 is connected to the circuit copper layer 12 . The LED chip 17 is fixedly connected to the circuit copper layer 12 via the soldering pad 15 .

[0041] It can be understood that the LED chip 17 is connected to the circuit copper layer 12 through the electrode 16 to achieve the light-emitting function, and is fixedly connected to the circuit copper layer 12 through the soldering pad 15 .

[0042] Furthermore, a heat dissipation hole 18 is formed through the metal layer 14 , and the heat dissipation hole 18 is located at a vertical position of the LED chip 17 .

[0043] It can be understood that by providing the heat dissipation holes 18 , the heat under the LED chip 17 can be reduced, the heat dissipation efficiency can be further improved, and the service life of the LED chip 17 can be increased.

[0044] In summary, the NCSP lamp bead structure for reducing the top light emission in the above-mentioned embodiment of the utility model is provided with a light-transmitting colloid layer above the LED chip, and a refraction structure is provided on the light-transmitting colloid layer perpendicular to the upper end of the LED chip. When the LED chip emits light, the light can be scattered by the refraction structure directly above it to reduce the light intensity at the top of the lamp bead. At the same time, refraction brackets are provided on both sides of the LED chip, and the inner side of the refraction bracket is provided with an inclined surface. When the light emitted by the LED chip hits the inclined surface of the refraction bracket, the light will be refracted to the refraction structure to make the light intensity at the top more uniform; by setting the two sides of the upper end of the transparent colloid layer at an angle, when the light hits the inclined surface, the light at the top of the edge will be partially converted into light on the side to increase the light intensity on the side.

[0045] Through the above design, the utility model reduces the top light intensity, increases the side light intensity and the front light effect, and improves the visual effect of the NCSP lamp beads.

[0046] Please refer to Figure 4 , shown is the NCSP lamp bead structure for reducing top light in the second embodiment of the utility model. The difference between the NCSP lamp bead structure for reducing top light in this embodiment and the NCSP lamp bead structure for reducing top light in the first embodiment is that:

[0047] The refractive structure in this embodiment does not adopt the form of an arc-shaped groove, but an additional semicircular fluorescent silica gel 21 is arranged above the transparent colloid layer 10. The semicircular fluorescent silica gel 21 can also increase the refraction efficiency of light, and because the silica gel is doped with fluorescent powder, the NCSP lamp bead can have the characteristic of emitting white light.

[0048] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0049] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A NCSP lamp bead structure that reduces top light output. It is characterized in that The invention comprises a substrate, an LED chip arranged on the substrate, and a refraction bracket arranged at both ends of the LED chip, wherein the refraction bracket is arranged obliquely from bottom to top in a direction away from the LED chip on a side close to the LED chip, a light-transmitting colloid layer is arranged above the LED chip and the refraction bracket, a refraction structure is arranged at the upper end of the light-transmitting colloid layer, the refraction structure is located in a vertical direction of the LED chip, and both sides of the upper end of the light-transmitting colloid layer are arranged obliquely from top to bottom in a direction away from the refraction structure.

2. According to claim 1, the NCSP lamp bead structure with reduced top light emission, It is characterized in that There is a cavity between the light-transmitting colloid layer and the LED chip.

3. According to claim 2, the NCSP lamp bead structure with reduced top light emission, It is characterized in that The side of the light-transmitting colloid layer close to the LED chip is arranged in a trapezoidal shape, and the inner side wall of the light-transmitting colloid layer is arranged obliquely from bottom to top in a direction close to the LED chip.

4. The NCSP lamp bead structure for reducing top light emission according to claim 1, It is characterized in that The refractive structure is an arc-shaped groove arranged at the upper end of the light-transmitting colloid layer, and the surface of the light-transmitting colloid layer at the arc-shaped groove is arranged in a sawtooth shape.

5. The NCSP lamp bead structure for reducing top light emission according to claim 1, It is characterized in that The surfaces of the two sides of the upper end of the light-transmitting colloid layer are arranged in a serrated shape.

6. The NCSP lamp bead structure for reducing top light emission according to claim 1, It is characterized in that The substrate comprises a metal layer, an insulating layer, and a circuit copper layer in sequence from bottom to top.

7. The NCSP lamp bead structure for reducing top light emission according to claim 6, It is characterized in that An electrode and a soldering pad are provided below the LED chip, the electrode is connected to the circuit copper layer, and the LED chip is fixedly connected to the circuit copper layer via the soldering pad.

8. The NCSP lamp bead structure for reducing top light emission according to claim 6, It is characterized in that The metal layer is provided with heat dissipation holes, and the heat dissipation holes are located at a vertical position of the LED chip.

9. The NCSP lamp bead structure for reducing top light emission according to claim 1, It is characterized in that The refractive structure is a fluorescent silica gel arranged above the light-transmitting colloid layer, and the fluorescent silica gel is arranged in a semicircular shape.