Heat dissipation device, electronic equipment and packaging fragile disc

Abstract

The utility model provides a heat dissipation device, electronic equipment and a packaging fragile disc. The heat dissipation device is applied to the electronic equipment and comprises a fan shell, a fan is arranged in the fan shell, the fan shell is in a plate shape, an elastic piece integrated with the fan shell is arranged on the fan shell, the free end of the elastic piece tilts in the direction away from one plate face of the fan shell relative to the fixed end of the elastic piece, and the free end elastically abuts against the inner wall face of a shell of the electronic equipment. And the fan shell is grounded through the shell of the electronic equipment. According to the heat dissipation device, the elastic piece integrated with the fan shell is arranged on the fan shell, and the elastic piece elastically abuts against the shell of the electronic equipment, so that the heat dissipation effect of the heat dissipation device is not affected, the conductive stability of the heat dissipation device is improved, the shielding performance of the heat dissipation device on interference signals is improved, and electromagnetic interference is reduced. In addition, the fan shell and the elastic piece are designed into a whole, the number of parts is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device, electronic equipment and a packaging crisp plate. Background Art

[0002] With the consumer market's demand for thinner and more multifunctional electronic devices, the speed of the CPU / GPU core components of electronic devices continues to increase, which increases the power consumption of electronic devices and the challenges of electromagnetic compatibility. The increase in power consumption also puts higher requirements on the heat dissipation of electronic devices, and the size of the heat dissipation devices of electronic devices continues to increase. The miniaturization of electronic devices (such as laptops) has continuously increased the requirements for small-sized motherboards, and the space for installing motherboards is becoming more and more compact. Based on the coupling model, GPU noise will be coupled to the heat dissipation device, that is, a noise processing module is set between the motherboard and the heat dissipation device of the electronic device. The noise processing module includes an internal circuit including parasitic capacitance. The GPU noise is coupled to the heat dissipation device through the parasitic capacitance, so that the interference signal is introduced into the ground through the grounding design before entering the internal circuit, avoiding interference to the internal circuit. However, the large area of ​​the heat dissipation device and the compact installation space make it difficult to solve the EMI (electromagnetic interference) problem.

[0003] The existing solutions to the above problems include: improving the shielding effect of the heat sink through multi-point grounding, generally by opening bare copper in the heat sink and applying conductive foam and other auxiliary materials to increase the connection between the heat sink shell and the laptop shell, thereby enhancing the shielding effect of the heat sink. However, the grounding continuity of the above solution is poor. In addition, due to the large number of conductive foams and the need for injection and application, the production efficiency is low; the consistency of material control and manual application is also not high; the conductive backing adhesive is easily affected by high temperature and falls off, and the bare copper area is easily oxidized, affecting its performance. Utility Model Content

[0004] The purpose of the embodiments of the utility model is to provide a heat dissipation device, an electronic device and a packaging crisp plate, so as to solve the problems of poor grounding performance and low production efficiency when the heat dissipation device in the prior art is grounded by opening bare copper pasting auxiliary materials.

[0005] An embodiment of the utility model adopts the following technical solution: a heat dissipation device is applied to an electronic device, the heat dissipation device includes a fan housing, a fan is arranged in the fan housing, the fan housing is plate-shaped, a spring piece which is integral with the fan housing is arranged on the fan housing, the free end of the spring piece is tilted relative to its fixed end in a direction away from one of the plate surfaces of the fan housing, and the free end is elastically abutted against the inner wall surface of the outer shell of the electronic device so that the fan housing is grounded through the outer shell of the electronic device.

[0006] In some embodiments, the spring sheet includes a first extension portion and an abutment portion, one end of the first extension portion is connected to the fan case, the other end of the first extension portion extends from the fan case in a direction away from one of the plate surfaces of the fan case, one end of the abutment portion is connected to the other end of the first extension portion, the other end of the abutment portion is formed as the free end, and the abutment portion is parallel to the inner wall surface of the outer shell.

[0007] In some embodiments, the other end of the abutting portion is provided with a second extending portion extending in a direction close to one of the plate surfaces of the fan housing.

[0008] In some embodiments, at least two of the elastic sheets are disposed on the fan housing, so that there are at least two connection points between the fan housing and the inner wall surface of the outer housing.

[0009] In some embodiments, three long spring clips are provided on the fan housing, and the three spring clips are respectively a first spring clip, a second spring clip and a third spring clip; the strong air outlet of the fan housing during heat dissipation is respectively located at the first edge and the second edge; the first spring clip and the second spring clip are respectively arranged at the first edge, and the third spring clip is arranged at the second edge, wherein the first edge is perpendicular to the second edge.

[0010] In some embodiments, the fan housing and the spring are integrally formed by stamping.

[0011] In some embodiments, the fan housing and the spring are both made of hot-dip galvanized steel plates.

[0012] An embodiment of the utility model further discloses an electronic device, comprising the heat dissipation device as described in any one of the above embodiments.

[0013] In some embodiments, the electronic device includes two of the heat dissipation devices.

[0014] An embodiment of the utility model further discloses a packaging crisp plate, which is used to package a heat dissipation device as described in any of the above embodiments, and an accommodating portion corresponding to the spring pieces of the heat dissipation device is provided on the inner wall of the packaging crisp plate, and the accommodating portion is used to accommodate at least a part of the spring pieces.

[0015] The beneficial effects of the embodiments of the utility model are:

[0016] By arranging a spring sheet integrated with the fan shell on the fan shell and elastically contacting the shell of the electronic device through the spring sheet, the conductive stability of the heat sink is improved without affecting the heat dissipation effect of the heat sink, thereby improving its shielding performance for interference signals and reducing electromagnetic interference. In addition, the fan shell and the spring sheet are designed as one body, which improves its production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the fan housing of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the fan housing of the utility model from another perspective;

[0020] Figure 3 This is a structural schematic diagram of the fan housing of the utility model from another perspective;

[0021] Figure 4 This is a comparison diagram of the radiation intensity at a far field of 10 meters when the fan housing of the utility model is provided with a shrapnel and when the fan housing is not provided with a shrapnel;

[0022] Figure 5 It is a structural schematic diagram of the shrapnel of the utility model;

[0023] Figure 6 It is a structural schematic diagram of the utility model for packaging crisp trays.

[0024] Reference numerals: 1, fan housing; 101, first edge; 102, second edge;

[0025] 2. Spring piece; 201. First extension portion; 202. Abutment portion; 203. Second extension portion; 204. Rounded corner;

[0026] 3. Packaging crisp tray; 301. Accommodation unit. DETAILED DESCRIPTION

[0027] Various aspects and features of the present invention are described herein with reference to the accompanying drawings.

[0028] It should be understood that various modifications may be made to the embodiments of the present application. Therefore, the above description should not be considered as limiting, but only as an example of the embodiments. Other modifications within the scope and spirit of the present utility model will occur to those skilled in the art.

[0029] The accompanying drawings, which are included in and constitute a part of the specification, illustrate embodiments of the present invention and, together with the general description of the present invention given above and the detailed description of the embodiments given below, are used to explain the principles of the present invention.

[0030] These and other characteristics of the invention will become apparent from the following description of a preferred form of embodiment given as a non-limiting example, with reference to the accompanying drawings.

[0031] It should also be understood that, although the present invention has been described with reference to some specific examples, those skilled in the art will be able to realize many other equivalent forms of the present invention with certainty, which have features such as the above-mentioned "utility model content" and are therefore within the scope of protection defined thereby.

[0032] The above and other aspects, features and advantages of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

[0033] Specific embodiments of the present invention are described hereinafter with reference to the accompanying drawings; however, it should be understood that the embodiments applied for are merely examples of the present invention, which may be implemented in a variety of ways. Well-known and / or repeated functions and structures are not described in detail to avoid unnecessary or redundant details that obscure the present invention. Therefore, the specific structural and functional details applied for herein are not intended to be limiting, but merely serve as the basis and representative basis for the above-mentioned "utility model content" to teach those skilled in the art to use the present invention in a variety of ways with substantially any suitable detailed structure.

[0034] This specification may use the phrases "in one embodiment", "in another embodiment", "in yet another embodiment" or "in other embodiments", all of which may refer to one or more of the same or different embodiments according to the present invention.

[0035] In order to solve the problems in the background technology, the utility model provides a heat dissipation device, which is applied to electronic equipment, including but not limited to laptop computers.

[0036] Combination Figure 1 , Figure 2 and Figure 3 The heat dissipation device includes a fan housing 1, and a fan is arranged in the fan housing 1. The fan housing 1 is plate-shaped, and a mounting position for installing the fan is formed on the plate-shaped fan housing 1, and a mounting hole is opened at the corresponding mounting position for installing the fan. The fan housing 1 is provided with a spring piece 2 which is integrated with the fan housing 1, and the spring piece 2 has a certain length and a certain elastic deformation ability. The spring piece 2 is designed to be integrated with the fan housing 1, which reduces the number of parts and improves the production efficiency of the heat dissipation device.

[0037] Specifically, the free end of the spring piece 2 is tilted relative to its fixed end in a direction away from one of the plate surfaces of the fan housing 1, and the free end of the spring piece 2 elastically abuts against the inner wall surface of the housing of the electronic device, so that the fan housing 1 is grounded through the housing of the electronic device. The structural form of the spring piece 2 solves the problems of poor grounding continuity, low production efficiency, and poor grounding performance in the prior art when the shielding effect of the heat sink is enhanced by applying conductive foam and other auxiliary materials to the bare copper of the heat sink.

[0038] Taking the electronic device as a laptop computer as an example, the free end of the spring 2 can elastically abut against the inner wall surface of the bottom shell of the laptop computer system end, so that the fan housing 1 is grounded through the bottom shell of the laptop computer system end, and then the interference signal is introduced into the ground through the above grounding design before entering the internal circuit between the heat sink and the motherboard, thereby preventing the internal circuit from being interfered. While not affecting the heat dissipation effect of the heat sink, the conductive stability of the heat sink is improved, thereby improving its shielding performance for interference signals and reducing electromagnetic interference.

[0039] Combination Figure 4 , where m1 corresponds to the radiation intensity curve of the embodiment of the utility model at 10 meters far field; m2 is the radiation intensity curve of the fan housing in the prior art when a shrapnel is set at 10 meters far field. By testing the anti-electromagnetic interference performance of the prior art and the embodiment of the utility model, it is found that the anti-electromagnetic interference performance is significantly improved after adopting the embodiment of the utility model, especially the radiation intensity is significantly improved at 875mhz.

[0040] The utility model embodiment provides a spring sheet 2 integrated with the fan housing 1 on the fan housing 1, and elastically contacts the housing of the electronic device through the spring sheet 2, thereby improving the conductive stability of the heat sink without affecting the heat dissipation effect of the heat sink, thereby improving its shielding performance against interference signals and reducing electromagnetic interference. In addition, the fan housing 1 and the spring sheet 2 are designed as one body, which improves its production efficiency.

[0041] In one embodiment of the utility model, the spring piece 2 includes a first extension portion 201 and a contact portion 202, and the first extension portion 201 and the contact portion 202 are an integrated structure. Among them, one end of the first extension portion 201 is connected to the fan housing 1, and the other end of the first extension portion 201 extends from the fan housing 1 to a direction away from one of the plate surfaces of the fan housing 1, and the first extension portion 201 is inclined relative to the plate surface of the fan housing 1. One end of the contact portion 202 is connected to the other end of the first extension portion 201, and the other end of the contact portion 202 is formed as a free end, and the contact portion 202 is parallel to the inner wall surface of the housing of the electronic device, so that the free end of the spring piece 2 can be more stably contacted with the inner wall surface of the housing. Because the spring piece 2 has a certain elasticity, even if the heat dissipation device is loose relative to the housing or the housing is subjected to external effects, the fan housing 1 can still be well contacted with the inner wall surface of the housing through the spring piece 2, thereby ensuring the grounding relationship between the fan housing 1 and the housing, thereby ensuring the conductive stability of the heat dissipation device and the shielding effect of interference signals.

[0042] In one embodiment of the present invention, the other end of the abutting portion 202 is provided with a second extension portion 203 extending in a direction close to one of the plate surfaces of the fan housing 1. Specifically, a second extension portion 203 is formed at the end of the abutting portion 202, and the second extension portion 203 is inclined relative to the abutting portion 202, that is, the second extension portion 203 is tilted away from the inner wall surface of the housing of the electronic device. Figure 5 Moreover, chamfers 204 can be provided at the connection between the second extension portion 203 and the abutting portion 202 and at the connection between the abutting portion 202 and the first extension portion 201 to prevent the edge of the other end of the abutting portion 202 of the spring sheet 2 from scratching and wearing the inner wall surface of the shell.

[0043] In one embodiment of the utility model, at least two springs 2 are provided on the fan housing 1, so that there are at least two connection points between the fan housing 1 and the inner wall surface of the housing, so that the interference signal can be grounded through at least two springs 2, thereby improving the shielding capability of the interference signal and further reducing the electromagnetic interference. Of course, it is understandable that the number of springs 2 can be set according to specific needs, and no specific limitation is made here.

[0044] In one embodiment of the utility model, three long strip-shaped springs 2 are arranged on the fan housing 1, and the three springs 2 are respectively a first spring, a second spring and a third spring. Among them, the first spring and the second spring are respectively arranged at the first edge 101 of the fan housing 1, and the third spring is arranged at the second edge 102 of the fan housing 1, wherein the first edge 101 is perpendicular to the second edge 102, and the strong air outlet of the fan housing 1 when dissipating heat is respectively located at the first edge 101 and the second edge 102. The first spring and the second spring can extend in two opposite directions along the first edge 101. Specifically, the position of the strong air outlet when the heat dissipation device dissipates heat through the fan housing 1 can be determined by thermal simulation, and then the setting position of the spring 2 can be determined. When the strong air outlet in the fan housing 1 is located at the first edge 101 and the second edge 102 respectively, the above-mentioned springs 2 can be respectively arranged at the first edge 101 and the second edge 102 of the fan housing 1. Of course, it can be understood that both springs 2 can be arranged at the second edge 102, and one spring 2 can be arranged at the first edge 101. This is only an example and does not limit the scope of protection of the claims.

[0045] In one embodiment of the utility model, the fan housing 1 and the spring piece 2 are integrally formed by stamping, and the integrally formed production method improves the production efficiency of the fan housing 1 and the spring piece 2. Compared with the production method of manually attaching auxiliary materials to the heat sink by opening copper in the prior art, the production method of the utility model embodiment also reduces the production cost to a certain extent.

[0046] In an embodiment of the present invention, the fan housing 1 and the spring piece 2 are both made of hot-dip galvanized steel sheet (SGCC), which can ensure the strength of the fan housing 1 and the elasticity of the spring piece 2.

[0047] The utility model also discloses an electronic device, which includes a heat dissipation device as described in any of the above embodiments. The electronic device using the heat dissipation device can ensure heat dissipation effect and anti-electromagnetic interference capability under the condition of ensuring its lightweight design, making the electronic device more competitive in the market.

[0048] In one embodiment of the utility model, the electronic device includes two heat dissipation devices, and the two heat dissipation devices can be symmetrically arranged to further improve the heat dissipation effect and anti-electromagnetic interference capability of the electronic device.

[0049] The utility model embodiment also discloses a packaging crisp plate 3, combined with Figure 6The packaging crisp tray 3 is used to package the heat sink as described in any of the above embodiments. The inner wall of the packaging crisp tray 3 is provided with a receiving portion 301 corresponding to the spring piece 2 of the heat sink, and the receiving portion 301 is used to receive at least a part of the spring piece 2, for example, the abutting portion 202 of the spring piece 2 can be placed in the receiving portion 301. The packaging crisp tray 3 can achieve good packaging and protection of the heat sink, and avoid damage to the spring piece 2 of the heat sink during transportation or handling.

[0050] The above describes in detail a number of embodiments of the present invention, but the present invention is not limited to these specific embodiments. Those skilled in the art can make various variations and modifications to the embodiments based on the concept of the present invention, and these variations and modifications should all fall within the scope of protection claimed by the present invention.

Claims

1. A heat dissipation device, applied to electronic equipment, It is characterized in that The heat dissipation device includes a fan shell, a fan is arranged in the fan shell, the fan shell is in the shape of a plate, a spring piece which is integral with the fan shell is arranged on the fan shell, the free end of the spring piece is tilted relative to its fixed end in a direction away from one of the plate surfaces of the fan shell, and the free end is elastically abutted against the inner wall surface of the outer shell of the electronic device so that the fan shell is grounded through the outer shell of the electronic device.

2. The heat dissipation device according to claim 1, It is characterized in that The spring piece includes a first extension portion and a butting portion, one end of the first extension portion is connected to the fan case, the other end of the first extension portion extends from the fan case in a direction away from one of the plate surfaces of the fan case, one end of the butting portion is connected to the other end of the first extension portion, the other end of the butting portion is formed as the free end, and the butting portion is parallel to the inner wall surface of the outer shell.

3. The heat dissipation device according to claim 2, It is characterized in that The other end of the abutting portion is provided with a second extending portion extending in a direction close to one of the plate surfaces of the fan housing.

4. The heat dissipation device according to claim 1, It is characterized in that At least two of the elastic sheets are arranged on the fan housing, so that there are at least two connection points between the fan housing and the inner wall surface of the outer housing.

5. The heat dissipation device according to claim 4, It is characterized in that The fan housing is provided with three long spring clips, which are respectively a first spring clip, a second spring clip and a third spring clip; the strong air outlet of the fan housing during heat dissipation is respectively located at the first edge and the second edge; the first spring clip and the second spring clip are respectively arranged at the first edge, and the third spring clip is arranged at the second edge, wherein the first edge is perpendicular to the second edge.

6. The heat dissipation device according to claim 1, It is characterized in that The fan housing and the spring sheet are integrally formed by stamping.

7. The heat dissipation device according to claim 1, It is characterized in that The fan housing and the spring pieces are both made of hot-dip galvanized steel plates.

8. An electronic device, It is characterized in that The invention comprises a heat dissipation device as claimed in any one of claims 1 to 7.

9. The electronic device according to claim 8, It is characterized in that The electronic device comprises two heat dissipation devices.

10. A packaging crisp plate, It is characterized in that The packaging crisp tray is used to package the heat dissipation device as described in any one of claims 1 to 7, and an accommodating portion corresponding to the spring pieces of the heat dissipation device is provided on the inner wall of the packaging crisp tray, and the accommodating portion is used to accommodate at least a part of the spring pieces.

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