Depth camera

Abstract

The utility model belongs to the technical field of 3D sensing, and especially relates to a depth camera. The depth camera comprises a three-dimensional imaging module, a mainboard support, a mainboard, an elastic piece and an adapter support, the three-dimensional imaging module comprises a laser emission module, an acquisition module and a photoelectric support, and the laser emission module and the acquisition module are arranged on the photoelectric support; the mainboard bracket is arranged on the back side of the photoelectric bracket and a gap is formed between the mainboard bracket and the back of the photoelectric bracket; the mainboard is installed on the mainboard support and is electrically connected with the laser emission module and the acquisition module. The two ends of each adapter bracket are respectively connected to the photoelectric bracket and the mainboard bracket, and the at least two adapter brackets are respectively connected to at least two sides of the photoelectric bracket and the mainboard bracket, so that the photoelectric bracket is connected to the mainboard bracket in a suspended manner; and the elastic piece is arranged between the adapter bracket and the mainboard bracket, and / or between the adapter bracket and the photoelectric bracket. The depth camera is good in impact resistance, and high precision can be guaranteed when the depth camera is impacted.

Description

Technical Field

[0001] The utility model belongs to the technical field of 3D sensing, and in particular relates to a depth camera. Background Art

[0002] With the rapid development of computer vision, depth cameras, as one of the core modules for realizing 3D vision, have been greatly developed and widely used in smart phones, smart homes, smart cars, security equipment, VR (Virtual Reality, virtual reality technology) / AR (Augmented Reality, augmented reality technology) gesture interaction and intelligent robots. The application scenarios are gradually becoming more complex, and the requirements for depth cameras are getting higher and higher. In some special application scenarios (such as outdoor bumpy scenes), it is easy to be impacted. If the impact resistance of the depth camera is poor, it will lead to a decrease in accuracy during the working process. Therefore, a depth camera with good impact resistance and vibration avoidance performance is urgently needed. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a depth camera, aiming to solve the technical problem of poor impact resistance of the depth camera.

[0004] To achieve the above-mentioned purpose, the present application provides a depth camera, including a three-dimensional imaging module, a mainboard bracket, a mainboard, an elastic member and at least two adapter brackets. The three-dimensional imaging module includes a laser emission module, a collection module and a photoelectric bracket. The laser emission module and the collection module are arranged on the photoelectric bracket; the mainboard bracket is arranged on the back side of the photoelectric bracket, and there is a gap between the mainboard bracket and the back of the photoelectric bracket; the mainboard is installed on the mainboard bracket and is electrically connected to the laser emission module and the collection module; the two ends of each adapter bracket are respectively connected to the photoelectric bracket and the mainboard bracket, and at least two adapter brackets are respectively connected to at least two sides of the photoelectric bracket and the mainboard bracket, so that the photoelectric bracket is suspended and connected to the mainboard bracket; the elastic member is arranged between the adapter bracket and the mainboard bracket, and\or between the adapter bracket and the photoelectric bracket.

[0005] In some embodiments, lugs are provided on at least two sides of the photoelectric support, and one end of the adapter support is connected to the lugs. In some embodiments, the lugs are in sheet form. In some embodiments, lugs are provided on at least two sides of the mainboard support, and the other end of the adapter support is connected to the lugs. In some embodiments, the adapter support is L-shaped, including a body and a connecting arm connected to one end of the body, the body is fixedly connected to the photoelectric support, the connecting arm is perpendicular to the body, the elastic member is clamped to the connecting arm and fixedly connected to the mainboard support, and the elastic member is at least partially sandwiched between the connecting arm and the mainboard support.

[0006] In some embodiments, the elastic member is made of silicone, and the two ends of the elastic member clamp the connecting arm together. The elastic member is formed with a through hole, and the depth camera also includes a fastener, which passes through the through hole and is fixedly connected to the mainboard bracket to fix the elastic member to the mainboard bracket. In some embodiments, the elastic member includes a rod body and a first cantilever and a second cantilever connected to both ends of the rod body, the diameter of the rod body is smaller than the diameter of the first cantilever and the second cantilever, the connecting arm clamps the rod body and is located between the first cantilever and the second cantilever, the first cantilever is clamped between the fastener and the connecting arm, and the second cantilever is clamped between the connecting arm and the mainboard bracket.

[0007] In some embodiments, the 3D imaging module further includes a head plate, which is fixed to the back of the photoelectric bracket and is electrically connected to the laser emission module, the acquisition module, and the mainboard. In some embodiments, the depth camera further includes a front shell and a rear shell, which together form a receiving cavity for accommodating the 3D imaging module, the mainboard bracket, the mainboard, the elastic member, and the adapter bracket, the rear shell is mounted on the rear side of the front shell, and the mainboard bracket is fixed to the front shell or the rear shell. In some embodiments, the depth camera further includes an elastic fastener, and the mainboard bracket is fixedly connected to the front shell or the rear shell through the elastic fastener.

[0008] The depth camera provided by the present application has a photoelectric bracket connected to the main board bracket through an adapter bracket, and an elastic member is provided between the adapter bracket and the main board bracket, and / or between the adapter bracket and the photoelectric bracket. When the depth camera is impacted, the elastic member can play a buffering and vibration reduction role, and can buffer the impact transmitted from the main board bracket to the photoelectric bracket. Moreover, since the three-dimensional imaging module is suspended and mounted on the main board bracket through the adapter bracket, the impact force transmitted to the three-dimensional imaging module is relatively small, which can reduce the impact of the impact on the three-dimensional imaging module, thereby effectively improving the impact resistance of the depth camera, so that the depth camera can also ensure a high accuracy when it is impacted. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or exemplary technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0010] Figure 1 is a schematic diagram of the overall structure of a depth camera provided in an embodiment of the present application;

[0011] Figure 2 is a schematic diagram of the decomposed structure of a depth camera provided in an embodiment of the present application;

[0012] Figure 3 is a partial structural diagram of a depth camera provided in one embodiment of the present application;

[0013] Figure 4 yes Figure 3 A schematic diagram of the enlarged structure of part A;

[0014] Figure 5 is a partial structural diagram of a depth camera provided by another embodiment of the present application;

[0015] Figure 6 It is a schematic diagram of partial structural decomposition of a depth camera provided in an embodiment of the present application.

[0016] Among them, the reference numerals in the figure are:

[0017] 11. front shell; 111. connecting boss; 12. rear shell; 121. avoidance gap; 122. second connecting hole; 13. lens; 20. three-dimensional imaging module; 21. laser emission module; 22. acquisition module; 23. photoelectric bracket; 231. lug; 24. head plate; 25. sealing sleeve; 26. proximity sensor; 27. RGB module; 30. main board; 40. main board bracket; 41. mounting boss; 411. second mounting hole; 42. first mounting hole; 51. elastic member; 511. first cantilever; 512. second cantilever; 513. rod body; 52. adapter bracket; 521. main body; 522. connecting arm; 53. fastener; 54. connecting screw; 55. elastic fastener; 61. flexible circuit board. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model.

[0019] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "rear", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0021] See also Figures 1 to 3 The embodiment of the present application provides a depth camera, including a three-dimensional imaging module 20, a mainboard bracket 40, a mainboard 30, an elastic member 51 and at least two adapter brackets 52, the three-dimensional imaging module 20 includes a laser emission module 21, a collection module 22 and a photoelectric bracket 23, the laser emission module 21 and the collection module 22 are arranged on the photoelectric bracket 23; the mainboard bracket 40 is arranged on the back side of the photoelectric bracket 23, and there is a gap between the front and the back of the photoelectric bracket 23; the mainboard 30 is installed on the mainboard bracket 40, and is electrically connected to the laser emission module 21 and the collection module 22; the two ends of each adapter bracket 52 are respectively connected to the photoelectric bracket 23 and the mainboard bracket 40, and at least two adapter brackets 52 are respectively connected to at least two sides of the photoelectric bracket 23 and the mainboard bracket 40, so that the photoelectric bracket 23 is suspended and connected to the mainboard bracket 40; the elastic member 51 is arranged between the adapter bracket 52 and the mainboard bracket 40, and\or between the adapter bracket 52 and the photoelectric bracket 23.

[0022] In the depth camera provided in the present application, the photoelectric bracket 23 is connected to the main board bracket 40 through the adapter bracket 52, and an elastic member 51 is provided between the adapter bracket 52 and the main board bracket 40, and / or between the adapter bracket 52 and the photoelectric bracket 23. When the depth camera is impacted, the elastic member 51 can play a buffering and vibration reduction role, and can buffer the impact transmitted from the main board bracket 40 to the photoelectric bracket 23. Moreover, since the three-dimensional imaging module 20 is suspended and installed on the main board bracket 40 through the adapter bracket 52, the impact force transmitted to the three-dimensional imaging module 20 is relatively small, which can reduce the impact of the three-dimensional imaging module 20, thereby effectively improving the impact resistance of the depth camera, so that the depth camera can also ensure a high accuracy when it is impacted.

[0023] In some embodiments, Figure 3 and Figure 4As shown, at least two sides of the photoelectric bracket 23 are provided with lugs 231, and one end of the adapter bracket 52 is connected to the lugs 231, so that there can be a larger suspension space between the photoelectric bracket 23 and the mainboard bracket 40, thereby further reducing the impact transmitted from the mainboard bracket 40 to the photoelectric bracket 23. Figure 4 and Figure 5 As shown, the adapter bracket 52 and the lug 231 can be fixed by a connecting screw 54. The lug 231 is provided with a first connecting hole, and the adapter bracket 52 is provided with a fixing hole at a position corresponding to the first connecting hole. The connecting screw 54 is passed through the first connecting hole and the fixing hole to fix the adapter bracket 52 and the lug 231. Figure 3 and Figure 4 As shown, lugs 231 are provided on the left and right sides of the photoelectric bracket 23, so that the connection stability between the photoelectric bracket 23 and the mainboard bracket 40 is better. In other embodiments, lugs can also be provided on the upper and lower sides of the photoelectric bracket 23, which is not limited here.

[0024] In other embodiments, an elastic member 51 may be connected between the photoelectric bracket 23 and the adapter bracket 52. The elastic member 51 is fixed to the photoelectric bracket 23, and the adapter bracket 52 is connected to the photoelectric bracket 23 via the elastic member 51. Therefore, multiple elastic members 51 play a role in the transmission path of the impact force from the mainboard bracket 40 to the photoelectric bracket 23, so as to further improve the impact resistance of the depth camera. Figure 3 and Figure 4 For example, an elastic member 51 may be provided between the adapter bracket 52 and the lug 231 , and the elastic member 51 may buffer the impact brought by the adapter bracket 52 . For example, the elastic member 51 may be a silicone sleeve that may be sleeved on the lug 231 ; or the elastic member 51 may be a silicone ring that may be provided between the lug 231 and the adapter bracket 52 .

[0025] In some embodiments, the lug 231 is in the form of a sheet, and the sheet-shaped lug 231 can be deformed when subjected to external force, so that the photoelectric bracket 23 and the adapter bracket 52 are not rigidly connected, and the impact transmitted from the adapter bracket 52 to the lug 231 can cause the lug 231 to deform, thereby buffering this part of the impact without transmitting it to the three-dimensional imaging module 20, thereby further reducing the impact on the three-dimensional imaging module 20 and further improving the buffering performance. The number of lugs 231 can be the same as the number of adapter brackets 52. The photoelectric bracket 23 of the present application can be made of materials such as aluminum and aluminum alloy, so that the photoelectric bracket 23 has good heat dissipation performance.

[0026] like Figure 3 and Figure 4As shown, in some embodiments, the adapter bracket 52 is L-shaped, and the adapter bracket 52 includes a body 521 and a connecting arm 522 connected to one end of the body 521. The body 521 is fixedly connected to the lug 231, and the connecting arm 522 is perpendicular to the body 521. The elastic member 51 is clamped on the connecting arm 522 and fixedly connected to the mainboard bracket 40. The elastic member 51 is at least partially sandwiched between the connecting arm 522 and the mainboard bracket 40. When the mainboard bracket 40 is impacted, the vibration generated by the impact is transmitted to the connecting arm 522 in a direction perpendicular to the board surface of the mainboard bracket 40. At this time, the elastic member 51 between the connecting arm 522 and the mainboard bracket 40 can effectively reduce the vibration of the mainboard bracket 40 from being transmitted to the connecting arm 522. In addition, the elastic member 51 is arranged on the side of the mainboard bracket 40 away from the photoelectric bracket 23, so that there is a larger gap between the photoelectric bracket 23 and the mainboard bracket 40, and the photoelectric bracket 23 can have a larger suspension space.

[0027] like Figure 3 and Figure 4 As shown, in some embodiments, the elastic member 51 is made of silicone material, so that the elastic member 51 has good buffering and vibration reduction performance, the two ends of the elastic member 51 clamp the connecting arm 522 together, the elastic member 51 is formed with a through hole, and the depth camera also includes a fastener 53, the fastener 53 is passed through the through hole and fixedly connected to the mainboard bracket 40, so that the elastic member 51 is fixedly connected to the mainboard bracket 40, so that the elastic member 51 is firmly connected to the mainboard bracket 40, thereby ensuring the buffering effect of the elastic member 51. Figure 6 As shown, a first mounting hole 42 is formed on the mainboard bracket 40 , and the fastener 53 can pass through the through hole and be fixed on the first mounting hole 42 .

[0028] like Figure 4As shown, in some embodiments, the elastic member 51 includes a rod body 513 and a first cantilever 511 and a second cantilever 512 connected to both ends of the rod body 513, the diameter of the rod body 513 is smaller than the diameter of the first cantilever 511 and the second cantilever 512, the connecting arm 522 clamps the rod body 513 and is located between the first cantilever 511 and the second cantilever 512, the first cantilever 511 and the second cantilever 512 can clamp the two end surfaces of the connecting arm 522, the first cantilever 511 is clamped between one end of the fastener 53 and the connecting arm 522, and the second cantilever 512 is clamped between the connecting arm 522 and the mainboard bracket 40, so that the hard connection between the adapter bracket 52 and the mainboard bracket 40 is avoided as much as possible, and the elastic member 51 has a good buffering effect on different vibration transmission paths, and the vibration transmitted from the fastener 53 to the connecting arm 522 and the vibration transmitted from the mainboard bracket 40 to the connecting arm 522 can be alleviated. In the present application, the elastic member 51 is silicone. Of course, in other possible implementations, the elastic member 51 may also be sponge or rubber, etc. It should be noted that the expression of "diameter" in the present application is for the convenience of description, and does not limit the cross-sectional shape of the rod body 513, the first cantilever 511 and the second cantilever 512 to be circular. The cross-sectional shape of the rod body 513, the first cantilever 511 and the second cantilever 512 may also be other shapes.

[0029] In the present application, the connecting arm 522 is also provided with a clamping hole, and the rod body 513 can be clamped in the clamping hole, so as to achieve a stable connection between the adapter bracket 52 and the elastic member 51. Among them, the clamping hole can be a circular hole, a semicircular hole or a three-quarter circular hole, that is, the connecting arm 522 can clamp part of the rod body 513, or can clamp the entire rod body 513, so that the entire rod body 513 is surrounded by the hole wall of the clamping hole. In addition, in the present application, a certain gap is formed between the elastic member 51 and the connecting arm 522. When the depth camera is impacted, the gap between the elastic member 51 and the connecting arm 522 can allow the elastic member 51 to have a certain deformation space, so that the elastic member 51 can better play a buffering role.

[0030] In some embodiments, at least two sides of the mainboard bracket 40 may also be provided with lugs, and the adapter bracket 52 is connected to the lugs on the mainboard bracket 40. The form of the lugs may be similar to the lugs 231 on the photoelectric bracket 23. The elastic member 51 may be disposed in the lugs and clamp the lugs, and no limitation is made here.

[0031] In some embodiments, the three-dimensional imaging module 20 further includes a head plate 24, which is fixed to the photoelectric bracket 23. The head plate 24 can be fixed to the rear side of the photoelectric bracket 23, and the head plate 24 is electrically connected to the laser emission module 21 and the acquisition module 22 to power the laser emission module 21 and the acquisition module 22. The head plate 24 is also electrically connected to the main board 30 to receive control instructions and power supply from the main board 30, and transmit data to the main board 30. The head plate 24 can be fixedly mounted on the photoelectric bracket 23 by tightening screws, bonding, etc. The depth camera may include a flexible circuit board 61, and the head plate 24 can be electrically connected to the main board 30 through the flexible circuit board 61.

[0032] Among them, the laser emission module 21 emits a laser to the target object, and the acquisition module 22 is used to receive the laser reflected back by the target object, and transmit the collected data to the main board 30, and the main board 30 is used to obtain the depth data of the target after performing depth calculation. The three-dimensional imaging module 20 can be a structured light three-dimensional imaging module, a binocular imaging module, an iTOF (indirect Time-of-Flight) imaging module, a dTOF (direct Time-of-Flight) imaging module, etc. Taking the iTOF depth camera as an example, the laser emission module 21 emits a light beam toward the target object, and the acquisition module 22 collects the light beam reflected back by the target object. The main board 30 calculates the flight time of the light beam according to the phase offset between the emission light beam and the acquisition light beam, and then calculates the corresponding depth distance. In some embodiments, the depth camera is a binocular structured light depth camera, and there are two acquisition modules 22. The two acquisition modules 22 can respectively obtain an image, and the three-dimensional information of the target object, that is, the depth information, can be obtained through the two acquired images. The distance between the two acquisition modules 22 can be adjusted according to actual needs. In the present application, the two acquisition modules 22 are respectively close to the two end edges of the photoelectric bracket 23, so the distance between the two acquisition modules 22 can be increased, thereby enabling the depth camera to have higher accuracy. Of course, in other possible implementations, there can also be one acquisition module 22, and the depth camera is a monocular structured light depth camera. The number of acquisition modules 22 can be flexibly selected according to different application scenarios, and the present application does not limit the number of acquisition modules 22.

[0033] In some embodiments, the three-dimensional imaging module 20 also includes an RGB module 27, which is mounted on the photoelectric bracket 23 and electrically connected to the mainboard 30. The RGB module 27 can be mounted on the front end surface of the photoelectric bracket 23, and the RGB module 27 is located on the same baseline as the laser emission module 21 and the acquisition module 22. The RGB module 27 is used to acquire a color image of the target object. An image processing chip may be provided on the mainboard 30 to process the color image acquired by the RGB module 27, thereby improving the image quality. The three-dimensional imaging module 20 also includes a proximity sensor 26 for detecting the distance between the target object and the depth camera. The proximity sensor 26 is mounted on the photoelectric bracket 23, and the proximity sensor 26 is electrically connected to the mainboard 30.

[0034] The main board 30 is also provided with a main control chip, an image processing chip, capacitors, resistors, diodes and other components and a main control circuit composed of corresponding components. The main board 30 is mainly used to control components such as the three-dimensional imaging module 20 and the RGB module 27, and to receive image data collected by the three-dimensional imaging module 20 and process the image data. In some embodiments, the main board 30 can also be used to perform gesture recognition, skeleton recognition and other applications. The main board 30 can be fixedly mounted on the main board bracket 40 by means of screws or the like. The main board 30 can be provided with a depth calculation chip to calculate a depth image based on the data collected by the acquisition module 22.

[0035] In some embodiments, the mainboard 30 is provided with a power interface, a Type-C interface, and a multi-machine synchronization interface. The power interface can be plugged into a power source to power the depth camera. The Type-C interface is used to connect to a host computer such as a computer to test, debug, and burn data on the depth camera, or to perform visual development and visual applications based on the depth camera. The multi-machine synchronization interface is used to connect other depth cameras to synchronize data with other depth cameras. The power interface, the Type-C interface, and the multi-machine synchronization interface can be located on the back side of the mainboard 30.

[0036] In some embodiments, the depth camera further includes a front shell 11 and a rear shell 12, which are enclosed together to form a receiving cavity for accommodating the three-dimensional imaging module 20, the mainboard bracket 40, the mainboard 30, the elastic member 51 and the adapter bracket 52. The rear shell 12 is installed on the rear side of the front shell 11, and the mainboard 30 and the mainboard bracket 40 can be mounted on the rear shell 12. The rear shell 12 can be used to protect the mainboard 30 and the components on the mainboard 30. At the same time, the rear shell 12 can also be used to dissipate heat for the mainboard 30. The front shell 11 can be mounted on the three-dimensional imaging module 20, and the front shell 11 can be used to protect the three-dimensional imaging module 20. Among them, the front shell 11 and the rear shell 12 can be made of stainless steel, aluminum, alloy and other materials, so that the front shell 11 and the rear shell 12 have good heat dissipation performance.

[0037] like Figure 6As shown, in some embodiments, the inner wall of the front shell 11 is formed with a connecting boss 111, and a threaded hole is provided on the connecting boss 111. The rear shell 12 is provided with a second connecting hole 122 corresponding to the threaded hole. Fasteners such as screws can pass through the second connecting hole 122 and be fixed in the threaded hole, thereby fixing the rear shell 12 on the front shell 11. Of course, the rear shell 12 can also be fixed to the front shell 11 by bonding (such as dispensing glue, back glue, etc.).

[0038] The motherboard bracket 40 can be fixed to the front shell 11 or the rear shell 12, and no specific limitation is made here. In some embodiments, in order to prevent the impact of the front shell 11 or the rear shell 12 from being transmitted to the motherboard bracket 40, the motherboard bracket 40 can be installed on the front shell 11 or the rear shell 12 through an elastic fastener 55. Since the elastic fastener 55 can realize the fixed connection between the motherboard bracket 40 and the front shell 11 or the rear shell 12, and can make the motherboard bracket 40 and the front shell 11 or the rear shell 12 have elasticity, the elastic fastener 55 can buffer the impact of the front shell 11 or the rear shell 12 on the motherboard bracket 40. Among them, the elastic fastener 55 can be a spring screw, the spring can play a role of buffering and vibration reduction, and the screw can play a role of fastening.

[0039] In some embodiments, in order to install the depth camera on other devices, the mainboard bracket 40 may be provided with a mounting boss 41, and the mounting boss 41 may have a second mounting hole 411. The depth camera can be installed on other devices through the second mounting hole 411. The rear shell 12 may be provided with an avoidance notch 121 corresponding to the mounting boss 41 to avoid the mounting boss 41 so that the mounting boss 41 can be exposed from the surface of the rear shell 12.

[0040] In some embodiments, in order to protect the laser emission module 21, the acquisition module 22 and the RGB module 27, the depth camera also includes a lens 13 disposed on the front shell 11. The lens 13 can be fixed to the front shell 11 by bonding or other means to protect the laser emission module 21, the acquisition module 22 and the RGB module 27 from scratches and dust. The lens 13 is made of a translucent material so that the laser emission module 21, the acquisition module 22 and the RGB module 27 are invisible to the naked eye, thereby enhancing the beauty of the depth camera. The three-dimensional imaging module 20 of the present application also includes a sealing sleeve 25. The sealing sleeve 25 can be made of silicone or rubber. The sealing sleeve 25 is attached to the surface of the photoelectric bracket 23. The sealing sleeve 25 can seal the gap between the laser emission module 21, the acquisition module 22 and the RGB module 27 and the photoelectric bracket 23, thereby achieving a waterproof effect.

[0041] The following takes the example of fixing the mainboard bracket 40 to the front shell 11 to illustrate the installation process of the depth camera: assemble the laser emission module 21, the acquisition module 22, the RGB module 27 and the proximity sensor 26 together on the photoelectric bracket 23; fix the head board 24 to the photoelectric bracket 23, and assemble the flexible circuit board 61; assemble the elastic member 51 to the adapter bracket 52; fix the elastic member 51 to the mainboard bracket 40 with the fastener 53; fix the photoelectric bracket 23 to the adapter bracket 52 with the connecting screws 54; fix the mainboard 30 to the mainboard bracket 40, and assemble the second flexible circuit board 62 connected to the head board 24; fix the mainboard bracket 40 to the front shell 11 with screws; fix the rear shell 12 to the front shell 11 with screws; assemble the lens 13 to the front shell 11 to complete the installation.

[0042] The above are only optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A depth camera, characterized in that: include: A three-dimensional imaging module, comprising a laser emission module, a collection module and a photoelectric support, wherein the laser emission module and the collection module are arranged on the photoelectric support; A mainboard bracket is arranged on the back side of the photoelectric bracket and has a gap between the mainboard bracket and the back side of the photoelectric bracket; A mainboard, mounted on the mainboard bracket and electrically connected to the laser emission module and the acquisition module; At least two adapter brackets, each of which has two ends connected to the photoelectric bracket and the main board bracket, and the at least two adapter brackets are respectively connected to at least two sides of the photoelectric bracket and the main board bracket, so that the photoelectric bracket is suspended and connected to the main board bracket; The elastic member is arranged between the adapter bracket and the mainboard bracket, and / or between the adapter bracket and the photoelectric bracket.

2. The depth camera according to claim 1, wherein: At least two sides of the photoelectric bracket are provided with lugs, and one end of the adapter bracket is connected to the lugs.

3. The depth camera according to claim 2, wherein: The lug is in a sheet shape.

4. The depth camera according to claim 1, wherein: The adapter bracket is L-shaped, including a main body and a connecting arm connected to one end of the main body, the main body is fixedly connected to the photoelectric bracket, the connecting arm is perpendicular to the main body, the elastic member is clamped on the connecting arm and fixedly connected to the main board bracket, and the elastic member is at least partially clamped between the connecting arm and the main board bracket.

5. The depth camera according to claim 4, wherein: The elastic member is made of silicone, and the two ends of the elastic member clamp the connecting arm together. The elastic member is formed with a through hole. The depth camera also includes a fastener, which passes through the through hole and is fixedly connected to the mainboard bracket to fix the elastic member to the mainboard bracket.

6. The depth camera according to claim 5, characterized in that The elastic member includes a rod body and a first cantilever and a second cantilever connected to both ends of the rod body, the diameter of the rod body is smaller than the diameters of the first cantilever and the second cantilever, the connecting arm clamps the rod body and is located between the first cantilever and the second cantilever, the first cantilever is clamped between the fastener and the connecting arm, and the second cantilever is clamped between the connecting arm and the mainboard bracket.

7. The depth camera according to claim 1, wherein: At least two sides of the mainboard bracket are provided with lugs, and the other end of the adapter bracket is connected to the lugs.

8. The depth camera according to any one of claims 1 to 7, characterized in that: The three-dimensional imaging module also includes a head plate, which is fixed to the back of the photoelectric bracket and is electrically connected to the laser emission module, the acquisition module and the main board.

9. The depth camera according to any one of claims 1 to 7, characterized in that: The depth camera also includes a front shell and a rear shell, which together form a receiving cavity for accommodating the three-dimensional imaging module, the mainboard bracket, the mainboard, the elastic member and the adapter bracket, the rear shell is installed on the rear side of the front shell, and the mainboard bracket is fixed to the front shell or the rear shell.

10. The depth camera according to claim 9, wherein: The depth camera further includes an elastic fastener, and the mainboard bracket is fixedly connected to the front shell or the rear shell via the elastic fastener.

Images