The invention relates to a laser sensor package structure. The laser sensor package structure comprises a PCB substrate, a vertical-cavity surface-emitting laser chip, a base, and a diffractive optical element (DOE), wherein the vertical-cavity surface-emitting laser chip is attached to the PCB substrate, the base is installed above the PCB substrate, the vertical-cavity surface-emitting laser chip is at the lower part inside the base, a placement cavity for placing the DOE is arranged above the base, the bottom of the placement cavity is provided with a glue tank for pasting the DOE through glue, a flange higher than the bottom of the glue tank is formed inside the glue tank, and the DOE is placed in the placement cavity and then is pasted and fixed through glue in the glue tank. The gluetank and the flange cooperate with each other so as to prevent glue overflow, deviation and inclination, and laser emitted by the chip is guaranteed to be emitted vertical to the DOE, use demands like human face recognition and 3D sensing are met, and air holes can release expansion gas effectively so as to prevent base cracking to cause DOE inclination.