High-density LED support

By adopting a matrix-arranged cavity area and cut rib connection design in the LED bracket, the problems of low density and high waste discharge rate of existing LED brackets are solved, and a higher density LED bracket design and cost reduction are achieved.

CN222168425UActive Publication Date: 2024-12-13DONGGUAN YOUSHUN OPTOELECTRONICS CO LTD
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Patent Information

Application Number
CN202323425837.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-15
Publication Date
2024-12-13
Estimated Expiration
2033-12-15

AI Technical Summary

Technical Problem

When stamping design of existing LED brackets, connecting ribs need to be reserved for the connecting parts of the pads and guide rails, resulting in poor compact layout of the LED brackets and high waste discharge rate during production, wasting resources and increasing costs.

Method used

Design a high-density LED bracket, using metal substrates and plastic brackets, set left and right pads through the cavity area arranged in matrix, and use cutting ribs to connect to the cut part from the longitudinal direction, directly connecting the adjacent left and right The pads are used to eliminate intermediate rails and connecting ribs, and use chipless cutting technology to reduce waste.

Benefits of technology

The density of LED brackets is improved, the layout density and manufacturing cost are reduced, the waste generation is reduced, and the cutting accuracy is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a high-density LED support, which comprises a metal substrate and a plastic support, the metal substrate comprises a substrate frame, left pads, right pads and cut ribs which are integrally arranged, the substrate frame is provided with a plurality of groups of cavity areas which are arranged in a matrix, the left pads and the right pads are alternately arranged in a group of cavity areas along the transverse direction, and the cut ribs are arranged on the left pads and the right pads. The plastic support is fixed to the right ends of the left bonding pads and the left ends of the right bonding pads, the left ends of the leftmost set of left bonding pads are connected with the substrate frame, the right ends of the rightmost set of right bonding pads are connected with the substrate frame, the right ends of the adjacent right bonding pads are connected with the left ends of the left bonding pads, and the connection positions are cut-off positions. The LED support has the advantages that not only can the arrangement density of the LED support be improved, but also the waste discharge rate and the manufacturing cost can be reduced.
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Description

Technical Field

[0001] The utility model relates to the field of LED brackets, in particular to a high-density LED bracket. Background Art

[0002] For the existing LED bracket structure, during stamping design, a certain width of connecting ribs need to be reserved for the connection between the pad and the guide rail on the LED bracket. After the LED bracket is injection molded, the connecting ribs are cut off to separate the pad and the guide rail, and then the pad is bent to form a single LED bracket. The setting of the connecting ribs not only takes up space, which is not conducive to the compact arrangement of the LED bracket, but also can only be treated as waste after the connecting ribs are cut off, which is wasteful and not conducive to cost reduction. With the increasing maturity of chipless cutting technology, it is necessary to develop a high-density LED bracket that can be used with chipless cutting technology to reduce the waste rate in the LED bracket manufacturing process to solve the above problems. Utility Model Content

[0003] The purpose of the utility model is to provide a high-density LED bracket to solve the problems mentioned in the background technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A high-density LED bracket comprises a metal substrate and a plastic bracket, wherein the metal substrate comprises an integrally arranged substrate frame, a left soldering pad, a right soldering pad and a cut-off rib, wherein a plurality of groups of cavity areas arranged in a matrix are provided on the substrate frame, wherein a plurality of groups of left soldering pads and right soldering pads are alternately arranged in a horizontal direction in a group of cavity areas, wherein the plastic bracket is fixed to the right end of the left soldering pad and the left end of the right soldering pad, wherein the left end of the leftmost group of left soldering pads is connected to the substrate frame, the right end of the rightmost group of right soldering pads is connected to the substrate frame, the right end of the adjacent right soldering pad is connected to the left end of the left soldering pad and the connection position is a cut-off position, and the cut-off position is connected to the substrate frame through a longitudinally arranged cut-off rib.

[0006] Further description of the utility model: In a group of cavity areas, two rows of left and right pads are arranged in the longitudinal direction, and two rows of cut-off parts are arranged. The metal substrate also includes a middle rib, and the upper and lower ends of the middle rib are respectively connected to the two rows of cut-off parts.

[0007] Further description of the utility model: the cut rib is connected to the left end of the left welding pad.

[0008] Further description of the utility model: the cut rib is connected to the right end of the right welding pad.

[0009] Further description of the utility model: the cut rib is connected to the left end of the left pad and the right end of the right pad.

[0010] Further description of the utility model: In a group of cavity areas, the plastic brackets, left pads and right pads are arranged in two, three or four groups along the horizontal direction.

[0011] The beneficial effects of the utility model are: by directly connecting the left and right pads of two adjacent groups of LED brackets, the previous method of setting guide rails and connecting ribs in the middle is abolished, and the cutting ribs are used to connect with the cut-off parts from the longitudinal direction, so that the arrangement density of the LED brackets is higher. When cutting, the chipless cutting technology can be directly used to cut off the cutting ribs and cut the cut-off parts, which greatly reduces the waste of cutting. The advantage of this design is that it can not only improve the arrangement density of the LED brackets, but also reduce the waste rate and manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is an LED bracket structure in the prior art;

[0013] Figure 2 This is the overall structural diagram of the utility model (two groups of plastic brackets are provided);

[0014] Figure 3 This is the overall structure diagram of the utility model (three groups of plastic brackets are provided);

[0015] Figure 4 This is the overall structure diagram of the utility model (four groups of plastic brackets are provided);

[0016] Description of reference numerals:

[0017] 01. Metal substrate; 11. Substrate frame; 12. Left solder pad; 13. Right solder pad; 14. Cut-off ribs; 15. Middle ribs; 02. Plastic bracket; 03. Cavity area; 04. Cutting part; 05. Longitudinal guide rail; 06. Connecting ribs; 07. Cutting line. DETAILED DESCRIPTION

[0018] The utility model is further described below in conjunction with the accompanying drawings:

[0019] like Figure 1 As shown, an existing LED bracket structure is provided between two groups of plastic brackets 02 in a group of cavity areas 03, and a longitudinal guide rail 05 is provided. The longitudinal guide rail 05 is connected to the pads on both sides through connecting ribs 06. When punching and cutting the pads, the entire connecting rib 06 needs to be removed. The LED bracket at the side position also needs to remove the connecting rib 06 to separate the pads from the substrate frame 11. The scrap rate is relatively high, and because the pads are separated by the connecting ribs 06 and the longitudinal guide rail 05, the arrangement density of the LED bracket is very low.

[0020] like Figure 2As shown, the design provides a high-density LED bracket, including a metal substrate 01 and a plastic bracket 02, the metal substrate 01 includes an integrally arranged substrate frame 11, a left solder pad 12, a right solder pad 13 and a cut-off rib 14, the substrate frame 11 is provided with a plurality of groups of cavity areas 03 arranged in a matrix, the left solder pad 12 and the right solder pad 13 are alternately arranged in a plurality of groups in the horizontal direction in a group of cavity areas 03, the plastic bracket 02 is fixed to the right end of the left solder pad 12 and the left end of the right solder pad 13, the left end of the leftmost group of left solder pads 12 is connected to the substrate frame 11, the right end of the rightmost group of right solder pads 13 is connected to the substrate frame 11, the right end of the adjacent right solder pad 13 is connected to the left end of the left solder pad 12 and the connection position is the cut-off portion 04, and the cut-off portion 04 is connected to the substrate frame 11 through the longitudinally arranged cut-off rib 14.

[0021] By directly connecting the left pad 12 and the right pad 13 of two adjacent groups of LED brackets, the previous method of setting a guide rail and a connecting rib 06 in the middle is abolished, and the cutting rib 14 is used to connect with the cutting part 04 from the longitudinal direction, so that the arrangement density of the LED bracket is higher. When cutting, the chip-free cutting technology can be directly used to cut the cutting rib 14 and cut the cutting part 04 along the cutting line 07, which greatly reduces the waste of cutting. For the LED bracket at the edge position, it is cut along the cutting line 07 without generating waste. The advantage of this design is that it can not only improve the arrangement density of the LED bracket, but also reduce the waste rate and manufacturing cost.

[0022] In a group of cavity areas 03, the left pads 12 and the right pads 13 are arranged in two rows along the longitudinal direction, and the cutting parts 04 are arranged in two rows. The metal substrate 01 also includes a middle rib 15, and the upper and lower ends of the middle rib 15 are respectively connected to the two rows of cutting parts 04. The middle rib 15 makes the positions of the pads on the upper and lower sides more stable, and the cutting accuracy is higher during the cutting process.

[0023] The cut rib 14 can be connected to both the left end of the left pad 12 and the right end of the right pad 13, that is, the cutting line 07 and the cut rib 14 are at the same longitudinal position. The cut rib 14 can also be connected to the left end of the left pad 12 alone, or to the right end of the right pad 13 alone.

[0024] like Figures 2 to 4 As shown, within a group of cavity areas 03, the plastic brackets 02, the left solder pads 12 and the right solder pads 13 can be arranged in two, three or four groups, or even more, in the horizontal direction to further improve the arrangement density of the LED brackets.

[0025] The above does not limit the technical scope of the present invention. Any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A high-density LED bracket, characterized by: It comprises a metal substrate and a plastic bracket, wherein the metal substrate comprises an integrally arranged substrate frame, a left solder pad, a right solder pad and a cut-off rib, the substrate frame is provided with a plurality of groups of cavity areas arranged in a matrix, the left solder pad and the right solder pad are arranged in a plurality of groups alternately in the horizontal direction in a group of the cavity areas, the plastic bracket is fixed to the right end of the left solder pad and the left end of the right solder pad, the left end of the left solder pad of the leftmost group is connected to the substrate frame, the right end of the right solder pad of the rightmost group is connected to the substrate frame, the right end of the adjacent right solder pad is connected to the left end of the left solder pad and the connection position is a cut-off position, and the cut-off position is connected to the substrate frame through the cut-off rib arranged longitudinally.

2. A high-density LED bracket according to claim 1, characterized in that: In one group of the cavity areas, the left pads and the right pads are arranged in two rows along the longitudinal direction, the cut-off parts are arranged in two rows, and the metal substrate also includes a middle rib, and the upper and lower ends of the middle rib are respectively connected to the two rows of cut-off parts.

3. The high-density LED bracket according to claim 1, characterized in that: The cut rib is connected to the left end of the left pad.

4. The high-density LED bracket according to claim 1, characterized in that: The cut rib is connected to the right end of the right pad.

5. The high-density LED bracket according to claim 1, characterized in that: The cut-off rib is connected to both the left end of the left pad and the right end of the right pad.

6. The high-density LED bracket according to claim 1, characterized in that: In one group of the cavity areas, the plastic brackets, the left pads and the right pads are arranged in two, three or four groups in the horizontal direction.

Citation Information

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