Temperature-controllable clamping tool for welding

Abstract

The temperature-controllable clamping tool for welding comprises a machining platen, a pressing air cylinder is fixed to the bottom face of the machining platen, the top end of a push rod of the pressing air cylinder extends out of the top face of the machining platen, and an upper pressing block is fixed to the top end of the push rod of the pressing air cylinder; a middle through groove is formed in the position, in front of the upper pressing block, of the machining table plate, a heat conduction block is inserted into the middle through groove in a sleeved mode and fixed to the machining table plate, a semiconductor chilling plate is fixed to the bottom face of the heat conduction block, and a liquid cooling plate heat exchanger is fixed to the bottom face of the semiconductor chilling plate. The top face of the heat conduction block is flush with the top face of the machining platen. The end of a frame to be welded can be placed on the heat conduction block, the heat conduction block is cooled through the semiconductor chilling plate, the end of the frame is cooled through the heat conduction block, and the semiconductor chilling plate is cooled through the liquid cooling plate heat exchanger below, so that the temperature of the welded end of the frame is not too high, and the surface of the frame has no color change; and an oxide film cannot fall off.

Description

Technical field:

[0001] The utility model relates to the technical field of hardware processing equipment, and more specifically to a temperature-controllable welding clamping tool. Background technology:

[0002] During the processing of the existing LCD screen frame, it needs to be laser welded after anodizing;

[0003] The existing laser welding melting point is above 650℃-700℃. After laser welding, the anodized frame will change color, turn yellow and black at this high temperature, and the oxide film will easily fall off. At this time, it will be necessary to perform anodization again, which increases the processing difficulty and time, and the effect is not ideal. Utility model content:

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a temperature-controllable welding clamping tool, which can place the end of the frame to be welded on the heat-conducting block, cool the heat-conducting block through the semiconductor refrigeration sheet, and the heat-conducting block cools the end of the frame, and the semiconductor refrigeration sheet is dissipated through the liquid cooling plate heat exchanger below, so that the temperature of the end of the frame will not be too high after welding, so that the color of its surface will not change, and the oxide film will not fall off.

[0005] The solution of the utility model to solve the technical problem is:

[0006] A temperature-controllable welding clamping tool comprises a processing platen, a clamping cylinder is fixed to the bottom surface of the processing platen, and the top end of the push rod of the clamping cylinder extends out of the top surface of the processing platen and is fixed with an upper clamping block;

[0007] A central through groove is formed on the processing table in front of the upper pressing block, the heat conducting block is inserted into the central through groove and fixed on the processing table, a semiconductor cooling sheet is fixed on the bottom surface of the heat conducting block, and a liquid cooling plate heat exchanger is fixed on the bottom surface of the semiconductor cooling sheet;

[0008] The top surface of the heat conducting block is flush with the top surface of the processing table, so that when the frame is clamped, its bottom surface is flat and the clamping is stable.

[0009] Two oblique grooves extending obliquely backward and outward are formed in the middle of the top surface of the heat conducting block, the front ends of the two oblique grooves are connected, and the rear ends of the two oblique grooves extend out of the rear wall surface of the heat conducting block and communicate with the oblique guide grooves formed on the top surface of the processing table. The oblique grooves and the oblique guide grooves can be used to flip into the two extension strips of the frame.

[0010] The bottom surfaces of the left and right side portions of the upper pressing block face the top surfaces at the front portions of the corresponding oblique guiding grooves.

[0011] The top surface of the semiconductor refrigeration plate is pressed against the middle part of the bottom surface of the heat conductive block, the bottom surface of the semiconductor refrigeration plate is pressed against the top surface of the liquid cooling plate heat exchanger, the horizontal plate of the bent connecting plate is pressed against the bottom surface of the liquid cooling plate heat exchanger, the left and right ends of the horizontal plate of the bent connecting plate are formed with vertical parts extending upward, the vertical parts are close to the corresponding side walls of the liquid cooling plate heat exchanger, the top end of the vertical part is formed with a horizontal part bent horizontally, the horizontal part is fixedly connected to the bottom surface of the left or right part of the heat conductive block by bolts, and the semiconductor refrigeration plate can be cooled by the liquid cooling plate heat exchanger.

[0012] The liquid cooling plate heat exchanger comprises a liquid cooling shell, a front end plate of the liquid cooling shell is connected with a water inlet connector and a water outlet connector, and the top surface of the liquid cooling shell is pressed against the bottom surface of the semiconductor cooling plate;

[0013] The water inlet connector and the water outlet connector are inserted into a long groove formed on the bottom surface of the processing table in front of the middle through groove, and the front end of the long groove extends out of the front end of the processing table.

[0014] The outstanding effects of the utility model are:

[0015] It can place the end of the frame to be welded on the heat-conducting block, cool the heat-conducting block through the semiconductor refrigeration sheet, and the heat-conducting block cools the end of the frame, and the semiconductor refrigeration sheet is dissipated through the liquid cooling plate heat exchanger below, so that the temperature of the end of the frame will not be too high after welding, and the color of its surface will not change, the oxide film will not fall off, and there is no need for secondary anodizing subsequently, so as to improve the processing effect, reduce manual labor, ensure the temperature of the welding point of the frame during welding, and reduce the influence on the deformation of the material of the frame. Description of the drawings:

[0016] Figure 1 It is a partial structural schematic diagram of the utility model;

[0017] Figure 2 yes Figure 1 Schematic diagram of the angle-changing local structure;

[0018] Figure 3 It is a schematic diagram of the local structure of the processing table;

[0019] Figure 4 It is a partial structural schematic diagram of the utility model without the processing table;

[0020] Figure 5 yes Figure 5 Schematic diagram of the local structure for changing angle. Specific implementation method:

[0021] For example, see Figures 1 to 5As shown, a temperature-controllable welding clamping tool comprises a processing platen 10, a clamping cylinder 20 is fixed to the bottom surface of the processing platen 10, and the clamping cylinder 20 is a double-rod cylinder, the top ends of the two push rods of which extend out of the top surface of the processing platen 10 and are fixed to the bottom surface of the same upper clamping block 21;

[0022] A middle through groove 11 is formed on the processing table 10 in front of the upper clamping block 21, and the heat conductive block 30 is inserted into the middle through groove 11. The side walls of the heat conductive block 30 are close to or close to the corresponding inner wall of the middle through groove 11. Extension parts 111 are formed on the left and right inner walls of the lower part of the middle through groove 11. The left and right bottom surfaces of the heat conductive block 30 are pressed against the top surfaces of the corresponding extension parts 111 and are fixedly connected by bolts.

[0023] A semiconductor cooling sheet 40 is fixed to the bottom surface of the heat conducting block 30 , and a liquid cooling plate heat exchanger 50 is fixed to the bottom surface of the semiconductor cooling sheet 40 ;

[0024] The top surface of the heat conducting block 30 is flush with the top surface of the processing table 10 .

[0025] The heat conducting block 30 is a copper block with good heat conducting performance.

[0026] Furthermore, two oblique grooves 31 extending obliquely backward and outward are formed in the middle of the top surface of the heat conductive block 30, the front ends of the two oblique grooves 31 are connected, and the rear ends of the two oblique grooves 31 extend out of the rear wall surface of the heat conductive block 30, and the two oblique grooves 31 form an angle of 90 degrees so that they correspond and cooperate with the end of the frame to be processed, and the oblique groove 31 is connected with the oblique guide groove 12 formed on the top surface of the processing table 10, and the front end of the oblique guide groove 12 is connected with the corresponding oblique groove 31, and the rear end of the oblique guide groove 12 extends out of the rear end of the processing table 10.

[0027] The bottom surfaces of the left and right side portions of the upper pressing block 21 face the top surfaces of the front portions of the corresponding oblique guiding grooves 12 .

[0028] Furthermore, the top surface of the semiconductor refrigeration sheet 40 is a cooling surface, which is pressed against the middle of the bottom surface of the heat-conducting block 30 (the two can be fixed by bonding with thermal conductive glue or bolts, and thermal conductive glue is used for bonding and fixing in this embodiment), the bottom surface of the semiconductor refrigeration sheet 40 is a cooling surface, which is pressed against the top surface of the liquid-cooled shell 51 of the liquid-cooled plate heat exchanger 50 (the two can be fixed by bonding with thermal conductive glue or bolts, and thermal conductive glue is used for bonding and fixing in this embodiment), and the side wall of the semiconductor refrigeration sheet 40 is close to the corresponding extension portion 111. The side wall or the lower inner wall of the middle through groove 11, the horizontal plate of the bent connecting piece 60 is pressed against the bottom surface of the liquid-cooled shell 51 of the liquid-cooled plate heat exchanger 50, and the left and right ends of the horizontal plate of the bent connecting piece 60 are formed with vertical parts extending upward, and the vertical parts are close to the corresponding side walls of the liquid-cooled shell 51 of the liquid-cooled plate heat exchanger 50. The top of the vertical part is formed with a horizontal part 61 that is horizontally bent. The horizontal part 61 is fixedly connected to the bottom surface of the left or right part of the heat-conducting block 30 by bolts, and the top surface of the horizontal part 61 does not contact the bottom surface of the left or right part of the heat-conducting block 30.

[0029] Furthermore, the liquid-cooled plate heat exchanger 50 includes a liquid-cooled housing 51, and a water inlet connector 52 and a water outlet connector 53 are connected to the front end plate of the liquid-cooled housing 51;

[0030] The water inlet connector 52 and the water outlet connector 53 are inserted into an elongated groove 13 formed on the bottom surface of the processing table 10 in front of the middle through groove 11. The front end of the elongated groove 13 extends out of the front end of the processing table 10, and the rear end of the elongated groove 13 is connected to the middle through groove 11.

[0031] In this embodiment, the end of the frame 100 to be processed can be inserted into the front ends of the two oblique grooves 31, and the two extension strips of the frame 100 are inserted into the corresponding oblique grooves 31 and the oblique guide grooves 12. The bottom surfaces of the two extension strips of the frame 100 are pressed against the bottom surfaces of the corresponding oblique grooves 31 and the bottom surfaces of the oblique guide grooves 12. Then, the push rod of the pressing cylinder 20 is retracted, so that the upper pressing block 21 is lowered, so that the bottom surfaces of the left and right ends thereof are pressed against the bottom horizontal plate portions of the two extension strips of the frame 100, thereby achieving clamping and fixing.

[0032] Then, the end of the frame 100 may be welded.

[0033] The water inlet connector 52 and the water outlet connector 53 are both connected with connecting pipes, the other end of the connecting pipe of the water outlet connector 53 extends into the circulating water tank, and the connecting pipe connected to the water inlet end of the water pump fixed on the circulating water tank also extends into the circulating water tank, and the water outlet end of the water pump is connected to the connecting pipe of the water inlet connector 52, which is operated by the circulating water pump to circulate the water, and the water in the circulating water tank can be brought into the liquid cooling housing 51 through the water inlet connector 52, and the top surface of the liquid cooling housing 51 is in close contact with the heat conducting surface of the semiconductor cooling sheet 40, so as to exchange heat with the bottom surface of the semiconductor cooling sheet 40 and dissipate heat therefrom, and the water after heat exchange flows back to the circulating water tank from the water outlet connector 53 to realize the circulation of the water, which is a conventional structure and will not be described in detail here;

[0034] The cold surface of the semiconductor refrigeration plate 40 cools down the heat conductive block 30 all the time, so that the end welding position of the frame 100 thereon is also in a cooling state all the time. During welding, the end temperature of the frame 100 will not be too high, and the color of its surface will not change, and the oxide film will not fall off, so that there is no need for secondary anodizing later, which improves the processing effect and reduces the amount of manual labor.

[0035] The semiconductor refrigeration chip 40 of this embodiment is a product that can be directly purchased on the market and will not be described in detail here. Both ends of the semiconductor refrigeration chip 40 are connected to a 12V power supply, and the semiconductor refrigeration chip 40 used in this embodiment can reduce the temperature to about -20°C.

[0036] The above implementation modes are only used to illustrate the present invention, but not to limit the present invention. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, all equivalent technical solutions also belong to the scope of the present invention. The scope of patent protection of the present invention should be limited by the claims.

Claims

1. A temperature-controllable welding clamping tool, comprising a processing table (10), characterized in that: A pressing cylinder (20) is fixed to the bottom surface of the processing table (10), and the top end of the push rod of the pressing cylinder (20) extends out of the top surface of the processing table (10) and is fixed with an upper pressing block (21); A central through groove (11) is formed on the processing table (10) in front of the upper pressing block (21); the heat conducting block (30) is inserted into the central through groove (11) and fixed on the processing table (10); a semiconductor cooling plate (40) is fixed on the bottom surface of the heat conducting block (30); and a liquid cooling plate heat exchanger (50) is fixed on the bottom surface of the semiconductor cooling plate (40); The top surface of the heat conducting block (30) is flush with the top surface of the processing table (10).

2. A temperature-controllable welding clamping tool according to claim 1, characterized in that: Two oblique grooves (31) extending obliquely backward and outward are formed in the middle of the top surface of the heat conductive block (30), the front ends of the two oblique grooves (31) are connected, and the rear ends of the two oblique grooves (31) extend out of the rear wall surface of the heat conductive block (30) and communicate with the oblique guide groove (12) formed on the top surface of the processing table (10).

3. A temperature-controllable welding clamping tool according to claim 2, characterized in that: The bottom surfaces of the left and right side portions of the upper pressing block (21) face the top surfaces at the front portions of the corresponding oblique guide grooves (12).

4. The temperature-controllable welding clamping tool according to claim 1, characterized in that: The pressing cylinder (20) is a double-rod cylinder, the top ends of the two push rods of which extend out of the top surface of the processing table (10) and are fixed on the bottom surface of the same upper pressing block (21).

5. The temperature-controllable welding clamping tool according to claim 1, characterized in that: Extension parts (111) are formed on the left and right inner side walls of the lower part of the middle through groove (11), and the left and right bottom surfaces of the heat conducting block (30) are pressed against the top surfaces of the corresponding extension parts (111) and fixedly connected by bolts.

6. The temperature-controllable welding clamping tool according to claim 1, characterized in that: The top surface of the semiconductor cooling plate (40) is pressed against the middle of the bottom surface of the heat conductive block (30), the bottom surface of the semiconductor cooling plate (40) is pressed against the top surface of the liquid cooling plate heat exchanger (50), the horizontal plate of the bent connecting plate (60) is pressed against the bottom surface of the liquid cooling plate heat exchanger (50), and the left and right ends of the horizontal plate of the bent connecting plate (60) are formed with vertical portions extending upward, the vertical portions are tightly attached to the corresponding side walls of the liquid cooling plate heat exchanger (50), and the top end of the vertical portion is formed with a horizontal portion (61) bent horizontally, and the horizontal portion (61) is fixedly connected to the bottom surface of the left or right part of the heat conductive block (30) by bolts.

7. The temperature-controllable welding clamping tool according to claim 1, characterized in that: The liquid cooling plate heat exchanger (50) comprises a liquid cooling shell (51), a front end plate of the liquid cooling shell (51) is connected with a water inlet connector (52) and a water outlet connector (53), and the top surface of the liquid cooling shell (51) is pressed against the bottom surface of the semiconductor cooling plate (40); The water inlet connector (52) and the water outlet connector (53) are inserted into a long groove (13) formed on the bottom surface of the processing table (10) in front of the middle through groove (11), and the front end of the long groove (13) extends out of the front end of the processing table (10).

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