Universal tin planting and glue removing platform

Abstract

The utility model discloses a universal tin planting degumming platform, which comprises a chip, the tin planting degumming platform comprises a platform body, a degumming assembly and a tin planting assembly, the degumming assembly comprises an adjusting suite, a translation clamping block and a fixed clamping block, the adjusting suite is spirally connected with the translation clamping block, the fixed clamping block is fixedly arranged below the translation clamping block, and the chip is arranged on the platform body. The translation clamping block translates up and down through the adjusting suite and is matched with the fixed clamping block to clamp a chip, and a first chip groove for placing the chip is formed between the translation clamping block and the fixed clamping block; according to the glue removing assembly, the chip is clamped and fixed in a mode of adjusting the clamping force, a traditional mode of fixing the chip by adopting a spring springback type structure is replaced, and the situation that the chip is sprung away or is clamped, cracked and damaged due to the fact that the clamping force is too large is avoided; besides, the surface of the platform body is also provided with a stepped groove, and a tin planting steel mesh can be placed in the stepped groove, so that stable alignment of chips with different specifications is realized, and the tin planting step is ensured to be carried out smoothly.

Description

Technical Field

[0001] The utility model belongs to the field of electronic product maintenance, and in particular relates to a universal tin planting and glue removal platform. Background Art

[0002] The repair technology of electronic components has very high requirements for the use of tools, so there are certain requirements for the repair tools used. When repairing a mobile phone motherboard, it is often necessary to temporarily remove the chip on the motherboard, and then remove the glue and tin the chip on the tin planting and de-sticking platform before the chip can be used normally again.

[0003] However, the existing tin planting and glue removal platforms still have the following defects. For example, the glue removal structures on the existing tin planting and glue removal platforms mostly use a spring rebound structure to fix the chip. During use, it is easy for the chip to be bounced off or the chip to be cracked and damaged due to the excessive clamping force of the structure. In addition, when the chip is tinned, it is necessary to first cover the chip surface with a tin planting steel mesh to achieve chip alignment, thereby preventing the chip from shifting to facilitate the tin planting step. However, the existing tin planting steel mesh alignment method is mostly manual alignment, and manual alignment is prone to offset during the tin planting process, resulting in alignment failure and affecting the tin planting effect. Therefore, there is an urgent need for a tin planting and glue removal platform with adjustable chip clamping force and stable alignment to solve the above problems. Utility Model Content

[0004] In order to solve the problems arising from the above-mentioned background technology, the purpose of the utility model is to provide a universal tin planting and glue removal platform, including a glue removal component, which can adjust the clamping force of the chip to avoid the chip being bounced away or being cracked and damaged due to excessive clamping force; in addition, a stepped groove is provided on the surface of the platform body, and the stepped groove cover is connected to an externally arranged tin planting steel mesh, which can achieve stable alignment of chips of different specifications to prevent displacement during the tin planting process.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A universal tin planting and glue removal platform comprises a chip. The tin planting and glue removal platform comprises a platform body, a glue removal component, and a tin planting component. The glue removal component comprises an adjustment kit, a translation clamp block, and a fixed clamp block. The adjustment kit is spirally connected to the translation clamp block. The fixed clamp block is fixedly installed below the translation clamp block. The translation clamp block translates up and down through the adjustment kit and cooperates with the fixed clamp block to clamp the chip. A first chip slot for placing the chip is provided between the translation clamp block and the fixed clamp block. A placement groove is provided on the surface of the platform body. The tin planting component is fixedly provided inside the placement groove.

[0007] Furthermore, a stepped groove is provided on the surface of the platform body, the stepped groove is arranged at the upper end of the placement groove, and the stepped groove cover is connected to an externally arranged tin-planted steel mesh.

[0008] Furthermore, the tin implanting assembly includes a chip fixing plate and a translation clip. The chip fixing plate is fixedly attached to the inside of the placement groove. The chip fixing plate is provided with a magnetic base, and the translation clip is slidably connected to the inner side of the magnetic base.

[0009] Furthermore, the adjustment kit includes an adjustment knob and a spiral connecting rod, wherein the adjustment knob is arranged at the upper end of the platform body, one end of the spiral connecting rod is spirally connected to the adjustment knob, and the other end of the spiral connecting rod passes through the platform body and is spirally connected to the translation clamp.

[0010] Furthermore, a translation groove is provided on the surface of the platform body, the translation clamp block is slidably connected to the inner side of the translation groove, and the translation clamp block translates up and down in the translation groove through the adjustment kit and cooperates with the fixed clamp block to clamp the chip.

[0011] Furthermore, a rubber pad is provided on the back of the platform body, and the rubber pad is fixedly mounted on the back of the platform body by fixing screws.

[0012] The beneficial effects of the utility model are:

[0013] (1) The debonding assembly of the utility model includes an adjustment kit, a translation clamp block, and a fixed clamp block. The adjustment kit includes an adjustment knob and a spiral connecting rod. By twisting the adjustment knob, the translation clamp block spirally connected to the spiral connecting rod can be translated up and down inside the translation groove. The translation clamp block translates downward and cooperates with the fixed clamp block to clamp the chip. The adjustable clamping force replaces the traditional spring rebound clamping method, effectively avoiding the chip from being bounced or the chip from being cracked and damaged due to excessive clamping force of the structure, ensuring the smooth progress of the debonding step and reducing unnecessary cost loss in the debonding process.

[0014] (2) The surface of the platform body of the utility model is provided with a stepped groove, which is arranged at the upper end of the placement groove and can cover the externally arranged tin-planting steel mesh to facilitate the stable alignment of chips of different specifications, replacing the traditional manual alignment method, and can effectively avoid the offset during the tin-planting process, thereby ensuring the smooth progress of the tin-planting step. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a front view schematic diagram of a universal tin planting and glue removal platform of the utility model;

[0016] Figure 2 The utility model is a schematic diagram of the back side of a universal tin planting and glue removal platform.

[0017] In the figure, 1 is the platform body, 101 is the translation groove, 102 is the stepped groove, 103 is the rubber pad, 1031 is the fixing screw, 2 is the glue removal component, 201 is the adjustment kit, 2011 is the adjustment knob, 2012 is the spiral connecting rod, 202 is the translation clamp block, 203 is the fixed clamp block, 204 is the first chip slot, 3 is the tin planting component, 301 is the chip fixing plate, 3011 is the magnetic base, 302 is the translation clamp plate, and 4 is the placement groove. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] like Figure 1-2 As shown, in an embodiment of the utility model, a universal tin planting and glue removal platform is provided, including a chip, the tin planting and glue removal platform includes a platform body 1, a glue removal component 2, and a tin planting component 3, the glue removal component 2 includes an adjustment kit 201, a translation clamp 202, and a fixed clamp 203, the adjustment kit 201 is spirally connected to the translation clamp 202, the fixed clamp 203 is fixedly installed below the translation clamp 202, the translation clamp 202 is translated up and down by the adjustment kit 201 and cooperates with the fixed clamp 203 to clamp the chip, a first chip slot 204 for placing the chip is arranged between the translation clamp 202 and the fixed clamp 203, a placement groove 4 is arranged on the surface of the platform body 1, and the tin planting component 3 is fixedly arranged inside the placement groove 4.

[0020] Specifically, the platform body 1 has the advantages of a small overall volume and a light overall weight, and is easy to carry and has high versatility.

[0021] The surface of the platform body 1 of the utility model is provided with a stepped groove 102, which is arranged at the upper end of the placement groove 4, and the stepped groove 102 is covered with an externally arranged tin-planting steel mesh.

[0022] Specifically, the stepped groove 102 can hold an externally set tin-planting steel mesh, so that the tin-planting steel mesh can be fixedly covered and adhered to the surface of the chip to prevent the chip from shifting during the tin-planting process, ensuring the smooth progress of the tin-planting step, thereby effectively ensuring the quality of the tin-planting work.

[0023] The tin implanting assembly 3 of the present invention comprises a chip fixing piece 301 and a translation clip 302 . The chip fixing piece 301 is fixedly attached to the inside of the placement groove 4 . The chip fixing piece 301 is provided with a magnetic base 3011 . The translation clip 302 is slidably connected to the inner side of the magnetic base 3011 .

[0024] Specifically, the material of the magnetic base 3011 is set to be a magnetic material, which can tightly absorb the chip placed on its upper end, and cooperate with the translation clamp 302 to clamp and fix the chip to prevent the chip from shifting during the soldering process.

[0025] The adjustment kit 201 of the utility model includes an adjustment knob 2011 and a spiral connecting rod 2012. The adjustment knob 2011 is arranged at the upper end of the platform body 1. One end of the spiral connecting rod 2012 is spirally connected to the adjustment knob 2011. The other end of the spiral connecting rod 2012 passes through the platform body 1 and is spirally connected to the translation clamp 202.

[0026] The platform body 1 of the present invention is provided with a translation groove 101 on its surface, and the translation clamp 202 is slidably connected to the inner side of the translation groove 101 . The translation clamp 202 translates up and down in the translation groove 101 through the adjustment kit 201 and cooperates with the fixed clamp 203 to clamp the chip.

[0027] Specifically, the material of the adjusting knob 2011 is set to plastic, and the material of the spiral connecting rod 2012 is set to stainless steel. When the adjusting knob 2011 is twisted, the spiral connecting rod 2012 spirally connected to the adjusting knob 2011 will drive the translation clamp 202 to translate up and down in the translation groove 101, and clamp the chip by cooperating with the fixed clamp 203.

[0028] The back of the platform body 1 of the utility model is provided with a rubber pad 103, which is fixedly installed on the back of the platform body 1 by fixing screws 1031. The setting of the rubber pad 103 can reduce the contact area between it and the relative contact surface, making the platform body 1 easy to take and put.

[0029] Combined with Figure 1-2 The working process of the utility model of a universal tin planting and glue removal platform is as follows:

[0030] First, the glue removal step is performed. The chip is placed in the first chip slot 204 between the translation clamp block 202 and the fixed clamp block 203. Then, the adjusting knob 2011 is twisted to make the translation clamp block 202, which is spirally connected to the spiral connecting rod 2012, translate in the direction of the fixed clamp block 203 on the inner side of the translation slot 101. The translation clamp block 202 clamps the chip between the two by cooperating with the fixed clamp block 203. When the chip is stably clamped, the adjusting knob 2011 is stopped from being twisted. Then, a special glue removal tool is used to remove the glue from the chip. After the glue removal is completed, the adjusting knob 2011 is twisted in the opposite direction to make the translation clamp block 202 translate upward, so that the chip stops being clamped, and then the chip can be taken out.

[0031] Secondly, the tin planting step is carried out. The chip after debonding is placed on the magnetic base 3011 opened on the chip fixing plate 301, and then the translation clamp 302 on the inner side of the magnetic base 3011 is translated upward to clamp and fix the chip, and then the external tin planting steel mesh is placed into the stepped groove 102, so that the tin planting steel mesh covers and fits the surface of the chip and stabilizes it to prevent the chip from shifting during the tin planting process, and then a special tin planting tool is used to tin the chip. After the tin planting is completed, the tin planting steel mesh is taken out, and then the translation clamp 302 is translated downward to stop the chip from being clamped, and finally the chip can be taken out with special tweezers.

[0032] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made within the scope of this application should still fall within the scope of the present invention.

Claims

1. A universal tin implanting and glue removal platform, comprising a chip, characterized in that: The tin implanting and glue removal platform includes a platform body, a glue removal component, and a tin implanting component. The glue removal component includes an adjustment kit, a translation clamp block, and a fixed clamp block. The adjustment kit is spirally connected to the translation clamp block. The fixed clamp block is fixedly installed below the translation clamp block. The translation clamp block translates up and down through the adjustment kit and cooperates with the fixed clamp block to clamp the chip. A first chip slot for placing the chip is provided between the translation clamp block and the fixed clamp block. A placement groove is provided on the surface of the platform body, and the tin implanting component is fixedly provided inside the placement groove.

2. A universal tin implanting and glue removal platform according to claim 1, characterized in that: A stepped groove is provided on the surface of the platform body, the stepped groove is arranged at the upper end of the placement groove, and the stepped groove cover is connected to an externally arranged tin-planting steel mesh.

3. The universal tin implanting and glue removal platform according to claim 1, characterized in that: The tin implanting assembly comprises a chip fixing plate and a translation clip. The chip fixing plate is fixedly attached to the inside of the placement groove. The chip fixing plate is provided with a magnetic base, and the translation clip is slidably connected to the inner side of the magnetic base.

4. The universal tin implanting and glue removal platform according to claim 1, characterized in that: The adjustment kit includes an adjustment knob and a spiral connecting rod. The adjustment knob is arranged at the upper end of the platform body. One end of the spiral connecting rod is spirally connected to the adjustment knob, and the other end of the spiral connecting rod passes through the platform body and is spirally connected to the translation clamp.

5. The universal tin implanting and glue removal platform according to claim 1, characterized in that: The surface of the platform body is provided with a translation groove, the translation clamp block is slidably connected to the inner side of the translation groove, and the translation clamp block translates up and down in the translation groove through the adjustment kit and cooperates with the fixed clamp block to clamp the chip.

6. The universal tin implanting and glue removal platform according to claim 1, characterized in that: A rubber pad is arranged on the back of the platform body, and the rubber pad is fixedly mounted on the back of the platform body by fixing screws.

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