COC chip coupling test device

Abstract

The utility model discloses a COC chip coupling test device which comprises a bread board capable of being adjusted in a lifting mode, the upper side of the bread board capable of being adjusted in the lifting mode is fixedly connected with a fixed bottom plate, the upper side of the fixed bottom plate is fixedly connected with an air cylinder supporting frame, and the front side of the air cylinder supporting frame is fixedly connected with a sliding table air cylinder. An upper fixing strip is fixedly connected to the lower side of the sliding table air cylinder, a probe fixing seat is arranged on the lower side of the upper fixing strip, a large-current probe is fixedly connected to the lower side of the probe fixing seat, and a cold water passing plate is fixedly connected to the upper side of the bread board capable of being adjusted in a lifting mode and located in front of the fixing bottom plate. By arranging the fixed bottom plate, the cylinder supporting plate, the sliding table cylinder, the probe fixing seat, the large-current probe, the cold water passing plate, the mounting plate and the limiting plate, the pneumatic pressing device can solve the problem that a product is damaged by pressing, the chip is cooled, and the test waiting time is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip coupling testing, in particular to a COC chip coupling testing device. Background Art

[0002] Before the final packaging of the integrated circuit, the finished circuit must be fully tested for circuit performance according to the test specifications in order to select qualified finished products. Spectral analysis identifies substances and determines their chemical composition and relative content based on the spectrum of the substance. Its advantages are sensitivity and rapidity. According to the analysis principle, spectral analysis can be divided into emission spectral analysis and absorption spectral analysis. According to the form of the measured components, it can be divided into atomic spectral analysis and molecular spectral analysis. Spectral analysis of atoms is called atomic spectroscopy, and spectral analysis of molecules is called molecular spectroscopy.

[0003] Among common chip testing equipment, the equipment can simulate fewer actual application scenarios, which reduces the accuracy of chip testing and increases the defective rate of products.

[0004] The COC chip coupling test is usually carried out by manufacturers through some simple screw locking devices. This detection method is easy to damage the product and cause pits on the surface of the product. Therefore, a device capable of testing the COC chip coupling is developed to safely and completely test the product and ensure the appearance quality of the product, so as to improve the qualified rate of the product. Utility Model Content

[0005] In order to overcome the disadvantage of the prior art that the chip is easily crushed during testing, one of the purposes of the utility model is to provide a COC chip coupling test device.

[0006] One of the purposes of the utility model is achieved by the following technical scheme: a COC chip coupling test device, comprising a standard breadboard that can be raised and lowered and adjusted: a fixed base plate is fixedly connected to the upper side of the breadboard that can be raised and lowered, a cylinder support frame is fixedly connected to the upper side of the fixed base plate, a slide cylinder is fixedly connected to the front side of the cylinder support frame, an upper fixed bar is fixedly connected to the lower side of the slide cylinder, a probe fixing seat is arranged on the lower side of the upper fixed bar, a large current probe is fixedly connected to the lower side of the probe fixing seat, a cold water flow plate is fixedly connected to the upper side of the breadboard that can be raised and lowered and located in front of the fixed base plate, a TEC semiconductor refrigeration plate is arranged on the upper side of the cold water flow plate, a mounting plate is arranged on the upper side of the TEC semiconductor refrigeration plate, and a limiting plate is arranged on the upper side of the mounting plate.

[0007] According to the COC chip coupling test device, a pressure regulating valve is provided on the left side of the slide cylinder.

[0008] According to the COC chip coupling test device, a pneumatic reversing valve is provided on the upper side of the standard breadboard that can be raised and lowered and is located behind the fixed bottom plate.

[0009] According to the COC chip coupling test device, a water inlet is arranged on the left side of the cold water flow plate, and a water outlet is arranged on the right side of the cold water flow plate.

[0010] Beneficial effects:

[0011] By providing a fixed base plate, a cylinder support plate, a slide cylinder, a probe fixing seat, a high-current probe, a cold water flow plate, a mounting plate and a limit plate, the pneumatic clamping device solves the problem of product crushing, cools the chip, and saves test waiting time.

[0012] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0014] Figure 1 This is an overall three-dimensional structural diagram of a COC chip coupling test device of the utility model;

[0015] Figure 2 This is a front view of a COC chip coupling test device of the utility model;

[0016] Figure 3 The utility model is a three-dimensional structural diagram of a cold water flow plate in a COC chip coupling test device.

[0017] Legend:

[0018] 1. Standard breadboard that can be raised and lowered; 2. Cold water flow board; 3. TEC semiconductor refrigeration board; 4. Mounting plate; 5. Limit plate; 6. High current probe; 7. Probe fixing seat; 8. Upper fixing bar; 9. Slide cylinder; 10. Pressure regulating valve; 11. Cylinder support frame; 12. Fixed base plate; 13. Pneumatic reversing valve. DETAILED DESCRIPTION

[0019] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0020] Reference Figure 1-3A COC chip coupling test device comprises a standard breadboard 1 which can be raised and lowered and adjusted: the upper side of the standard breadboard 1 which can be raised and lowered and adjusted is fixedly connected with a fixed bottom plate 12, the upper side of the fixed bottom plate 12 is fixedly connected with a cylinder support frame 11, the front side of the cylinder support frame 11 is fixedly connected with a slide cylinder 9, the lower side of the slide cylinder 9 is fixedly connected with an upper fixed bar 8, the lower side of the upper fixed bar 8 is provided with a probe fixing seat 7, the lower side of the probe fixing seat 7 is fixedly connected with a high current probe 6, ... fixed bottom plate 11, the upper side of the fixed bottom plate 12 is fixedly connected with a fixed bottom plate 11, the upper side of the fixed bottom plate 12 is fixedly connected with a fixed bottom plate 11, the upper side of the fixed bottom plate 12 is fixedly connected with a fixed bottom plate 11, the upper side of the fixed bottom plate 12 is fixedly connected with a fixed bottom plate 11, the upper side of the fixed bottom plate 12 is fixedly connected with a fixed bottom plate 11, the upper side of the fixed bottom plate 12 is fixedly connected with a fixed bottom plate 11, the upper side of the A cold water flow plate 2 is fixedly connected in front of the fixed bottom plate 12, a TEC semiconductor refrigeration plate 3 is arranged on the upper side of the cold water flow plate 2, a mounting plate 4 is arranged on the upper side of the TEC semiconductor refrigeration plate 3, a limit plate 5 is arranged on the upper side of the mounting plate 4, a pressure regulating valve 10 is arranged on the left side of the slide cylinder 9, and a pneumatic reversing valve 13 is arranged on the upper side of the standard breadboard 1 that can be raised and lowered and located behind the fixed bottom plate 12, a water inlet is arranged on the left side of the cold water flow plate 2, and a water outlet is arranged on the right side of the cold water flow plate 2. 2 is fixed on the breadboard 1 with adjustable lifting standards by screw fastening, and then the TEC semiconductor refrigeration plate 3 is bonded to the cold water flow plate 2 by thermal conductive silicone grease, and then the TEC semiconductor refrigeration plate 3 is pressed by the connection between the mounting plate 4 and the cold water flow plate 2, and then the limit plate 5 and the mounting plate 4 are fixed, so that the position of the tooling for the COC chip test is confirmed, and the fixed bottom plate 12 is fixed on the breadboard 1 with adjustable lifting standards by confirming the position, that is, behind the cold water flow 2, and the slide cylinder 9 is fixed on the cylinder support frame 11 through the connection between the cylinder support frame 11 and the fixed bottom plate 12, and the pressure regulating valve 10 is installed on the slide cylinder 9 to facilitate the adjustment of the air pressure. Finally, the pneumatic reversing valve 13 is installed on the breadboard 1 with adjustable lifting standards, that is, behind the fixed bottom 12, and the installation of the device is completed through the connection of the air pipe, and the fast assembly improves the test efficiency. Every time the large current probe 6 contacts the COC chip product, it will not crush the product and reliably measure the performance of the product, which is convenient and fast with good test effect.

[0021] Working principle: When in use, place the COC chip product on the limit plate 5, and then cool the chip through the cold water plate 2 and the TEC semiconductor refrigeration plate 3, and then control the slide cylinder 9 to drive the upper fixed bar 8 to descend, and the upper fixed bar 8 drives the high-current probe 6 to contact the product for testing, which will not crush the product and reliably measure the product's performance. It is convenient and fast with good testing effect.

[0022] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A COC chip coupling test device, characterized in that: The invention comprises a breadboard (1) with a standard that can be raised and lowered and adjusted: the upper side of the breadboard (1) with a standard that can be raised and lowered and adjusted is fixedly connected to a fixed base plate (12), the upper side of the fixed base plate (12) is fixedly connected to a cylinder support frame (11), the front side of the cylinder support frame (11) is fixedly connected to a slide cylinder (9), the lower side of the slide cylinder (9) is fixedly connected to an upper fixed bar (8), the lower side of the upper fixed bar (8) is provided with a probe fixing seat (7), the lower side of the probe fixing seat (7) is fixedly connected to a high current probe (6), the upper side of the breadboard (1) with a standard that can be raised and lowered and adjusted and located in front of the fixed base plate (12) is fixedly connected to a cold water flow plate (2), the upper side of the cold water flow plate (2) is provided with a TEC semiconductor refrigeration plate (3), the upper side of the TEC semiconductor refrigeration plate (3) is provided with a mounting plate (4), and the upper side of the mounting plate (4) is provided with a limit plate (5).

2. A COC chip coupling test device according to claim 1, characterized in that: A pressure regulating valve (10) is arranged on the left side of the slide cylinder (9).

3. A COC chip coupling test device according to claim 1, characterized in that: A pneumatic reversing valve (13) is arranged on the upper side of the breadboard (1) that can be raised and lowered and adjusted to a standard and located behind the fixed bottom plate (12).

4. A COC chip coupling test device according to claim 1, characterized in that: A water inlet is arranged on the left side of the cold water flow plate (2), and a water outlet is arranged on the right side of the cold water flow plate (2).

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