Circuit board, battery and electronic equipment
Through the compressed connection and overlapping design of the circuit board and the reinforcement board, the problems of insufficient space and complex welding are solved, high flow, good heat dissipation and stability are achieved, and miniaturization, high density and high integration are supported. development.
Patent Information
- Application Number
- CN202420485315.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-13
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-03-13
AI Technical Summary
In the prior art, the overall end face connection between the circuit board and the reinforcement board leads to a small operational space of the circuit board, which limits the layout of components, and the welding connection steps are complicated and prone to adverse phenomena, which affects the miniaturization and high density of the circuit board. , the development of high integration.
The main body of the plate and the reinforcement plate are connected by press-fitting to form a overlapping part and open a connecting hole to realize flow and heat dissipation between the plates, simplify production steps and improve connection stability.
Improve the flow and heat dissipation performance of the circuit board, expand the component layout space, simplify the production process, reduce costs and the probability of false welding, enhance the reliability and stability of the circuit board, and support the circuit board to The development of miniaturization, high density and high integration.
Smart Images

Figure CN222321827U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board, a battery and an electronic device. Background Art
[0002] As electronic equipment is rapidly developing towards miniaturization, high density, high integration and high reliability, in order to improve the current flow performance and heat dissipation function of the circuit board, the circuit board is often connected to a reinforcing plate. In the prior art, the circuit board and one end surface of the reinforcing plate are often connected as a whole. With such a connection method, the reinforcing plate occupies an entire end surface of the circuit board, which makes the operating space of the circuit board small. Only circuits can be designed on one side of the circuit board, which is not conducive to the layout of components on the circuit board. For example, if the same number of components are to be laid out on the circuit board, the volume of the single-sided circuit board design needs to be larger than the volume of the double-sided circuit board design, which is contrary to the development trend of electronic equipment towards miniaturization, high density and high integration. Utility Model Content
[0003] The main purpose of the utility model is to provide a circuit board, a battery and an electronic device, aiming to solve the technical problems in the prior art that when the circuit board and the reinforcement plate are connected by an integral end face, it is not conducive to the layout of components on the circuit board, the operating space of the circuit board is small, and it is not conducive to the development of the circuit board, the battery and the electronic equipment towards miniaturization, high density and high integration.
[0004] To achieve the above object, the utility model proposes a circuit board, comprising:
[0005] A plate body, one end of which has a first pressing portion;
[0006] A reinforcing plate, wherein one end of the reinforcing plate has a second pressing portion, the second pressing portion is pressed onto the first pressing portion to form an overlapping portion between the reinforcing plate and the plate body, the overlapping portion is provided with a connecting hole, and the connecting hole passes through the first pressing portion and the second pressing portion.
[0007] In some embodiments, an insulating layer is provided at both ends of the connection hole along the thickness direction of the circuit board, and the insulating layer seals both ends of the connection hole.
[0008] In some embodiments, along the width direction of the circuit board, the circuit board has a first end and a second end that are oppositely disposed, and the overlapping portion extends from the first end to the second end.
[0009] In some embodiments, the overlapping portion includes a first straight segment, a second straight segment and a third straight segment, one end of the first straight segment is disposed at the first end portion, one end of the second straight segment is connected to an end of the first straight segment away from the first end portion, one end of the third straight segment is connected to an end of the second straight segment away from the first straight segment, and the other end of the third straight segment is disposed at the second end portion;
[0010] The first straight section and the second straight section are arranged at an angle, and the second straight section and the third straight section are arranged at an angle, so that the overlapping portion extends from the first end portion to the second end portion along the fold line.
[0011] In some embodiments, along the thickness direction of the circuit board, the connection hole obliquely penetrates through both ends of the overlapping portion.
[0012] In some embodiments, along the thickness direction of the circuit board, the connection hole passes through both ends of the overlapping portion in a straight line.
[0013] In some embodiments, there are multiple connection holes, and the multiple connection holes are arranged at intervals.
[0014] In some embodiments, the diameter of the connecting hole is R 1 , along the direction from the plate body to the reinforcing plate, the distance between the two opposite sides of the overlapped portion is R 2 , R 1 and R 2 The relationship between them satisfies: R 1 =R 2 .
[0015] The utility model also provides a battery, comprising the circuit board described in any one of the above embodiments.
[0016] The utility model also provides an electronic device, comprising the battery described in any one of the above embodiments.
[0017] Compared with the prior art, the beneficial effects of the utility model are:
[0018] In the technical solution of the utility model, a circuit board is provided. The circuit board includes a board body and a reinforcement plate. One end of the board body has a first pressing part, and one end of the reinforcement plate has a second pressing part. The first pressing part and the second pressing part are pressed together to form an overlapping part to achieve overlapping connection between the board body and the reinforcement plate, and a connection hole is provided in the overlapping part to achieve internal and external flow of the circuit board. The circuit board provided by the utility model has the advantages of good flow performance and good heat dissipation performance, and the end connection is achieved between the board body and the reinforcement plate in the circuit board provided by the utility model. With such a connection method, the circuit board can realize a double-sided design circuit, so that the operating space for arranging components on the circuit board is larger, which effectively improves the space utilization rate of the circuit board. On the premise of ensuring perfect functions, it is conducive to the development of the circuit board in the direction of miniaturization, high density and high integration.
[0019] In addition, the main body and the reinforcement plate of the circuit board are connected together by pressing. Compared with the traditional welding method, the production steps are simple and the production efficiency is high, which can reduce the production cost. The pressing method can avoid the occurrence of poor welding and reduce the probability of false welding, which is beneficial to improving the yield rate of the circuit board. The pressing method does not occupy the layout position of the circuit board, and will not affect the performance of the components on the circuit board due to high temperature, which is beneficial to improving the reliability and stability of the circuit board.
[0020] The battery and electronic equipment using the circuit board provided by the utility model have good flow effect and excellent heat dissipation performance, which is beneficial to improving the stability and reliability of the battery and electronic equipment during operation, and is beneficial to the development of the battery and electronic equipment towards miniaturization, high density, high integration and high reliability. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0022] Figure 1 A schematic diagram of a connection structure of a circuit board provided by an embodiment of the utility model from a first perspective;
[0023] Figure 2 A schematic diagram of a connection structure of a circuit board provided by another embodiment of the utility model from a first perspective;
[0024] Figure 3 A schematic diagram of a connection structure of a circuit board provided by another embodiment of the present utility model from a first perspective;
[0025] Figure 4 A schematic diagram of a connection structure of a circuit board provided by another embodiment of the utility model from a first perspective;
[0026] Figure 5 A schematic diagram of a second viewing angle of a connection structure of a circuit board provided in an embodiment of the utility model;
[0027] Figure 6 A schematic diagram of a connection structure of a circuit board provided by another embodiment of the utility model from a second viewing angle;
[0028] Figure 7 A schematic diagram of a connection structure of a circuit board provided by another embodiment of the utility model from a second viewing angle;
[0029] Figure 8 A schematic diagram from a second perspective of a connection structure of a circuit board provided in yet another embodiment of the present invention.
[0030] Description of Figure Numbers:
[0031] 100-board body;
[0032] 200-Reinforcement plate;
[0033] 300- overlapping part;
[0034] 301-first straight section; 302-second straight section; 303-third straight section;
[0035] 400-connection hole;
[0036] X-length direction of the circuit board;
[0037] Y-width direction of the circuit board;
[0038] Z-thickness direction of the circuit board.
[0039] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0040] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0041] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0042] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or", "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0043] As electronic equipment is rapidly developing towards miniaturization, high density, high integration and high reliability, in order to improve the current flow performance and heat dissipation function of the circuit board, the circuit board is often connected to a reinforcing plate. In the prior art, the circuit board and one end surface of the reinforcing plate are often connected as a whole. With such a connection method, the reinforcing plate occupies an entire end surface of the circuit board, which makes the operating space of the circuit board small. Only circuits can be designed on one side of the circuit board, which is not conducive to the layout of components on the circuit board. For example, if the same number of components are to be laid out on the circuit board, the volume of the single-sided circuit board design needs to be larger than the volume of the double-sided circuit board design, which is contrary to the development trend of electronic equipment towards miniaturization, high density and high integration.
[0044] In addition, in the prior art, the circuit board and the reinforcement plate are usually connected together by welding. However, the production steps of the welding reinforcement plate are relatively large, the pad connection occupies the layout position, and the welding method may also cause poor welding, which is prone to false welding, resulting in poor performance of the circuit board. In addition, welding is often high-temperature welding, which will also affect the performance of components on the circuit board.
[0045] To solve the above problems, refer to Figures 1 to 8An embodiment of the utility model provides a circuit board, including a board body 100 and a reinforcement plate 200. One end of the board body 100 has a first pressing portion, and one end of the reinforcement plate 200 has a second pressing portion, and the second pressing portion is pressed on the first pressing portion, so that an overlapping portion 300 is formed between the reinforcement plate 200 and the board body 100, and a connection hole 400 is opened in the overlapping portion 300, and the connection hole 400 passes through the first pressing portion and the second pressing portion.
[0046] Specifically, the circuit board provided in this embodiment is a multi-layer circuit board, which connects the board body 100 and the reinforcement plate 200 into one by adopting an end connection method. While improving the flow performance and heat dissipation function of the circuit board, the end surface space of the circuit board can be greatly utilized to increase the design circuit of the circuit board and the number of components arranged on the circuit board, ensuring that the circuit board is fully functional while helping to reduce the size of the circuit board. The board body 100 and the reinforcing plate 200 are connected together by using a pressing process. For example, the reinforcing plate 200 can be pressed on the upper part of the board body 100 along the thickness direction Z of the circuit board to achieve the connection between the board body 100 and the reinforcing plate 200. The end of the reinforcing plate 200 and the end of the board body 100 can also be put together along the length direction X of the circuit board to achieve the connection between the board body 100 and the reinforcing plate 200. Because no filling material is required, the processing can be carried out quickly, the processing efficiency of the circuit board is improved, the processing time of the circuit board is shortened, and the processing cost of the circuit board is reduced. Moreover, the connection strength of the product made by the pressing process is very high, which can reach the strength of the material itself, so it is beneficial to improve the connection stability and reliability of the circuit board and ensure the use performance of the circuit board. In addition, the pressing process also has the advantage of environmental protection, and no harmful gas will be generated during the pressing process. By opening the connection hole 400 in the overlapping part 300, the connection between the circuit board and the reinforcing plate 200, as well as between each layer of the multi-layer circuit board, can be achieved to achieve the purpose of flow and heat dissipation.
[0047] In short, in the technical solution of this embodiment, a circuit board is provided. This circuit board includes a board body 100 and a reinforcement plate 200. One end of the board body 100 has a first pressing part, and one end of the reinforcement plate 200 has a second pressing part. The first pressing part and the second pressing part are pressed together to form a superposition part 300 to achieve superposition connection between the board body 100 and the reinforcement plate 200, and a connection hole 400 is provided in the superposition part 300 to achieve internal and external flow of the circuit board. The circuit board provided in this embodiment has the advantages of good flow performance and good heat dissipation performance, and the end connection between the board body 100 and the reinforcement plate 200 is realized in the circuit board provided in this embodiment. With such a connection method, the circuit board can realize a double-sided design circuit, so that the operating space for arranging components on the circuit board is larger, which effectively improves the space utilization rate of the circuit board. Under the premise of ensuring perfect functions, it is conducive to the development of the circuit board in the direction of miniaturization, high density and high integration. The board body 100 can be a hard board structure, that is, PCB (Printed Circuit Board).
[0048] In addition, the board body 100 and the reinforcement board 200 of the circuit board are connected together by pressing. Compared with the traditional welding method, the production steps are simple and the production efficiency is high, which can reduce the production cost. The pressing method can avoid the occurrence of poor welding and reduce the probability of false welding, which is beneficial to improving the yield rate of the circuit board. The pressing method does not occupy the layout position of the circuit board, and will not affect the performance of the components on the circuit board due to high temperature, which is beneficial to improving the reliability and stability of the circuit board.
[0049] In some embodiments, an insulating layer is provided at both ends of the connection hole 400 along the thickness direction Z of the circuit board, and the insulating layer seals both ends of the connection hole 400. That is, a layer of insulating film is laid flat in the area of the connection hole 400 to isolate the connection hole 400 from the external environment, so as to prevent the performance of the circuit board from being reduced due to the influence of the external environment.
[0050] Specifically, if an insulating film is not laid at the connecting hole 400, dust and other impurities will inevitably fall into the hole or the hole wall, making the circuit board very prone to oxidation or short circuit, affecting the normal use of the circuit board. By laying an insulating film at both ends of the connecting hole 400, dust and other impurities can be effectively prevented from falling into the connecting hole 400, ensuring that the connecting hole 400 is not contaminated, thereby improving the operating stability and reliability of the circuit board and ensuring that the circuit board can operate normally.
[0051] In some embodiments, reference Figure 1, a structural form of an overlapping portion 300 is provided, wherein the circuit board has a first end and a second end oppositely disposed along the width direction Y of the circuit board, and the overlapping portion 300 extends from the first end to the second end. For example, the overlapping portion 300 may extend from the first end to the second end along a straight line, the overlapping portion 300 may extend from the first end to the second end along a fold line, or the overlapping portion 300 may extend from the first end to the second end along a curve.
[0052] Specifically, at the press-fit connection between the board body 100 and the reinforcement plate 200, the overlapping portion 300 extends in a straight line from one end of the circuit board to the other opposite end of the circuit board, thereby realizing the connection between the board body 100 and the reinforcement plate 200. The overlapping portion 300 adopts the above-mentioned structural form, which has low requirements for the pressing machine, facilitates the processing of the circuit board, simplifies the processing route of the circuit board, thereby improving the processing efficiency of the circuit board and reducing the processing cost of the circuit board.
[0053] In some embodiments, reference Figures 2 to 4 , another structural form of the overlapping portion 300 is provided, the circuit board has a first end and a second end arranged oppositely, and the overlapping portion 300 includes a first straight section 301, a second straight section 302 and a third straight section 303. One end of the first straight section 301 is arranged at the first end, one end of the second straight section 302 is connected to an end of the first straight section 301 away from the first end, one end of the third straight section 303 is connected to an end of the second straight section 302 away from the first straight section 301, and the other end of the third straight section 303 is arranged at the second end, wherein the first straight section 301 and the second straight section 302 are arranged at an angle, and the second straight section 302 and the third straight section 303 are arranged at an angle, so that the overlapping portion 300 extends from the first end to the second end along the fold line.
[0054] Specifically, refer to Figures 2 to 4At the press-fit connection between the plate body 100 and the reinforcing plate 200, the overlapping portion 300 extends along the fold line from one end of the circuit board to the other opposite end of the circuit board. For example, the angle between the first straight section 301 and the second straight section 302 can be a right angle, the angle between the second straight section 302 and the third straight section 303 can be a right angle, the angle between the first straight section 301 and the second straight section 302 can also be an acute angle, the angle between the second straight section 302 and the third straight section 303 can also be an acute angle, the angle between the first straight section 301 and the second straight section 302 can also be an obtuse angle, and the angle between the second straight section 302 and the third straight section 303 can also be an obtuse angle. It can be understood that the angle between the first straight section 301 and the second straight section 302, and the angle between the second straight section 302 and the third straight section 303 can be any combination of the above forms. The overlapping portion 300 adopts the above-mentioned structural form. Due to the complex and diverse structural trends, the connection stability and reliability between the board body 100 and the reinforcing plate 200 can be improved, thereby improving the performance of the circuit board.
[0055] In some embodiments, reference Figure 6 and Figure 8 , a structural form of a connecting hole 400 is provided, and along the thickness direction Z of the circuit board, the connecting hole 400 obliquely penetrates the two ends of the overlapping part 300.
[0056] Specifically, the connection hole 400 can realize the conduction between different layers of the circuit board. As the conductive path of the circuit board, the flow capacity of the connection hole 400 directly affects the reliability and stability of the circuit board. The connection hole 400 adopts a structural form of obliquely penetrating both ends of the overlapping part 300, which is conducive to realizing the connection between multiple layers of the circuit board, thereby improving the flow capacity of the connection hole 400, and further improving the reliability and stability of the circuit board.
[0057] In some embodiments, reference Figures 5 to 7 , another structural form of the connecting hole 400 is provided, and along the thickness direction Z of the circuit board, the connecting hole 400 passes through both ends of the overlapping part 300 in a straight line.
[0058] Specifically, the connection hole 400 adopts a structure that passes through both ends of the overlapped portion 300 in a straight line, which greatly reduces the processing difficulty of the connection hole 400, facilitates the processing and forming of the connection hole 400, and improves the hole forming rate of the connection hole 400. For example, the connection hole 400 can be processed by irradiating the overlapped portion 300 along a straight line with a laser beam.
[0059] In some embodiments, reference Figures 1 to 8 , another structural form of the connecting hole 400 is provided, and the connecting hole 400 is a cylindrical hole.
[0060] Specifically, since the laser beam is generally columnar, the connection hole 400 is designed as a cylindrical hole. When the connection hole 400 is processed by the laser beam, the processing difficulty of the connection hole 400 can be greatly reduced, which is beneficial to the processing and forming of the connection hole 400 and improves the hole forming rate of the connection hole 400.
[0061] It is understandable that the connection hole 400 may also be a hole of other structural forms. For example, the connection hole 400 may also be a triangular prism hole, a quadrangular prism hole, etc., which will not be enumerated one by one here.
[0062] In some embodiments, the diameter of the connecting hole 400 is R 1 , along the direction from the plate body 100 to the reinforcing plate 200, the distance between the two opposite sides of the overlapping portion 300 (here, the width of the overlapping portion 300) is R 2 , R 1 and R 2 The relationship between them satisfies: R 1 =R 2 .
[0063] Specifically, the flow capacity of the connection hole 400 is closely related to its size. Generally, the larger the aperture of the connection hole 400, the stronger its flow capacity, because a larger aperture can provide a larger conductive area, thereby reducing the resistance when the current passes through the connection hole 400. Therefore, in the circuit board provided in this embodiment, the aperture of the connection hole 400 is designed to be equal to the distance between the two sides opposite to the overlapping part 300, that is, the aperture of the connection hole 400 is designed to be equal to the width of the overlapping part 300, so that the flow capacity of the connection hole 400 can be maximized, thereby improving the performance of the circuit board.
[0064] In some embodiments, reference Figures 1 to 4 The number of the connection holes is multiple, and the multiple connection holes are arranged in the overlapping portion 300 at intervals.
[0065] Specifically, the current carrying capacity of the entire circuit board is closely related to the number of connection holes 400. Generally, the more connection holes 400 there are, the more conductive paths there are on the entire circuit board, which is beneficial to improving the current carrying capacity of the circuit board. In the actual production process, it is necessary to design an appropriate number of connection holes 400 according to the production requirements of the circuit board, because too many connection holes 400 will also increase the manufacturing cost and may cause the reliability of the circuit board to decrease.
[0066] In some embodiments, reference Figures 5 to 8The bottom of the reinforcing plate 200 can be flush with the top of the board body 100, that is, along the thickness direction Z of the circuit board, the reinforcing plate 200 is pressed on the upper part of the board body 100, and the bottom of the reinforcing plate 200 can also be flush with the bottom of the board body 100, that is, along the length direction X of the circuit board, the end of the reinforcing plate 200 and the end of the board body 100 are put together. The overall structure of the circuit board can be freely designed according to actual production.
[0067] Correspondingly, another embodiment of the present invention further provides a battery, which includes the circuit board in any of the above embodiments.
[0068] The battery using the circuit board provided by any of the above embodiments has good current flow effect and excellent heat dissipation performance, which is beneficial to improving the stability and reliability of the battery during operation and is conducive to the development of the battery towards miniaturization, high density, high integration and high reliability.
[0069] The battery provided in this embodiment has the same technical effect as the above-mentioned circuit board, which will not be described in detail here.
[0070] Correspondingly, another embodiment of the present invention further provides an electronic device, which includes the battery in any of the above embodiments.
[0071] In this embodiment, specifically, the electronic device can be a computer, a mobile phone, etc. The electronic device using the battery provided by any of the above embodiments has good current flow effect and good heat dissipation performance, which is beneficial to improving the stability and reliability of the electronic device during operation, and is beneficial to the development of electronic equipment towards miniaturization, high density, high integration and high reliability.
[0072] It should be noted that other contents of the circuit board, battery and electronic device provided by the present invention can be found in the prior art and will not be described in detail here.
[0073] The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A circuit board, characterized in that: include: A plate body, one end of which has a first pressing portion; A reinforcing plate, wherein one end of the reinforcing plate has a second pressing portion, the second pressing portion is pressed onto the first pressing portion to form an overlapping portion between the reinforcing plate and the plate body, the overlapping portion is provided with a connecting hole, and the connecting hole passes through the first pressing portion and the second pressing portion.
2. The circuit board according to claim 1, characterized in that: Insulating layers are provided at both ends of the connecting hole along the thickness direction of the circuit board, and the insulating layers seal both ends of the connecting hole.
3. The circuit board according to claim 1, characterized in that: Along the width direction of the circuit board, the circuit board has a first end and a second end that are oppositely arranged, and the overlapping portion extends from the first end to the second end.
4. The circuit board according to claim 3, characterized in that: The overlapping portion includes a first straight section, a second straight section and a third straight section, one end of the first straight section is arranged at the first end portion, one end of the second straight section is connected to an end of the first straight section away from the first end portion, one end of the third straight section is connected to an end of the second straight section away from the first straight section portion, and the other end of the third straight section is arranged at the second end portion; The first straight section and the second straight section are arranged at an angle, and the second straight section and the third straight section are arranged at an angle, so that the overlapping portion extends from the first end portion to the second end portion along the fold line.
5. The circuit board according to claim 1, characterized in that: Along the thickness direction of the circuit board, the connection hole obliquely penetrates through both ends of the overlapping portion.
6. The circuit board according to claim 1, characterized in that: Along the thickness direction of the circuit board, the connection hole passes through both ends of the overlapping portion in a straight line.
7. The circuit board according to any one of claims 1 to 6, characterized in that: There are multiple connection holes, and the multiple connection holes are arranged at intervals.
8. The circuit board according to any one of claims 1 to 6, characterized in that: The diameter of the connecting hole is R1, and along the direction from the plate main body to the reinforcing plate, the distance between the two opposite sides of the overlapping portion is R2, and the relationship between R1 and R2 satisfies: R1=R2.
9. A battery, characterized in that: A circuit board comprising the circuit board described in any one of claims 1 to 8.
10. An electronic device, characterized in that: A battery comprising the battery of claim 9.