Power pipeline sleeve of raised floor of semiconductor clean room

Abstract

The utility model provides a power pipeline sleeve of a raised floor of a semiconductor clean room, the power pipeline sleeve is detachably installed in a reserved wire passing hole of the raised floor, the power pipeline sleeve comprises an upper sleeve and a lower sleeve which are detachably connected in an oppositely inserted mode, and the upper sleeve and the lower sleeve are both T-shaped pipes formed by pressing rings and central pipes. The pressing rings of the upper sleeve and the lower sleeve are respectively pressed on the upper surface and the lower surface of the raised floor, the central pipe of the upper sleeve and the central pipe of the lower sleeve are detachably connected through annular sawteeth, annular corrugations or threads, the upper surface of the upper sleeve is provided with an annular shallow groove positioned on the periphery of the central pipe, and a sealing ring is detachably mounted in the shallow groove. The power pipeline sleeve of the raised floor of the semiconductor clean room has the advantages of being simple in structure, convenient to install, stable, reliable, good in sealing performance and the like, can be widely applied to circuit arrangement and maintenance of the raised floor of the semiconductor clean room, and improves efficiency and stability of semiconductor production.

Description

Technical Field

[0001] The utility model relates to the floor paving of a semiconductor clean room, in particular to a power pipeline sleeve of an elevated floor of a semiconductor clean room. Background Art

[0002] Semiconductor raised floor, as a kind of raised floor designed for semiconductor clean room, has unique structure and function. Its main purpose of design is to meet the requirements of clean environment and high-precision operation in semiconductor production process.

[0003] Semiconductor production needs to be carried out in a dust-free, sterile, constant temperature and humidity environment to ensure the high quality and stability of the product. The design of the elevated floor can effectively reduce the accumulation of dust and microorganisms, thereby providing a cleaner working environment. In addition, the elevated floor can also easily arrange and adjust the lines and equipment at the bottom, providing convenience for semiconductor production.

[0004] like Figure 1 As shown, on the semiconductor elevated floor 1, a wire trough 2 through which the lines pass from the bottom needs to be opened so that wires, cables and other lines can pass through the floor in an orderly manner to provide stable power and signal transmission for the operation of semiconductor equipment.

[0005] The existing conventional practices have the following problems: 1. Directly opening holes in the elevated floor can easily cause cables and network cables to be damaged by sharp cuts at the openings; 2. If the openings are too large, it will affect the airflow pattern in the clean room, especially in clean rooms with high requirements such as Class 100 and Class 1000; 3. Conventional casings and anti-static elevated floors are not connected, there is a risk of static electricity generation, and the sealing effect is poor. Utility Model Content

[0006] The utility model provides a power pipeline sleeve for an elevated floor of a semiconductor clean room, wherein the power pipeline sleeve is detachably installed in a wire-passing hole reserved in the elevated floor, and the power pipeline sleeve comprises an upper sleeve and a lower sleeve which are detachably connected by plugging, and the upper sleeve and the lower sleeve are both T-shaped tubes composed of a pressure ring and a center tube, and the pressure rings of the upper sleeve and the lower sleeve are respectively pressed tightly on the upper surface and the lower surface of the elevated floor, and the center tubes of the upper sleeve and the lower sleeve are detachably connected by annular serrations, annular corrugations or threads, and the upper surface of the upper sleeve is provided with an annular shallow groove located on the periphery of the center tube, and a sealing ring is detachably installed in the shallow groove.

[0007] Furthermore, the sealing ring is bonded in the shallow groove by double-sided adhesive.

[0008] Furthermore, the sealing ring is a rubber ring.

[0009] Furthermore, the upper sleeve and the lower sleeve are both made of 304 stainless steel.

[0010] Furthermore, the length of the central tube of the upper sleeve and the lower sleeve is between 2 / 3 and 1 times the thickness of the elevated floor.

[0011] The advantages of this device are:

[0012] 1. Protect the line: Due to the design of the upper and lower casings, wires, cables and other lines can pass through them in an orderly manner, avoiding the problem of the lines being damaged by sharp cuts. At the same time, the casing is made of 304 stainless steel and is directly connected to the anti-static elevated floor to eliminate the risk of static electricity.

[0013] 2. Adapt to different clean room requirements: By adjusting the length of the central tube of the upper and lower sleeves, it can adapt to elevated floors of different thicknesses, thereby meeting the airflow pattern requirements of different clean rooms. This design ensures the safe passage of the line without affecting the cleanliness of the clean room.

[0014] 3. Sealing ring anti-disturbance: The design of the sealing ring further protects the circuit, effectively avoids the impact of static electricity on semiconductor production, and prevents the opening from disturbing the clean room flow pattern.

[0015] 4. Easy to install and maintain: The power pipeline sleeve adopts a detachable connection method, which is very convenient to install and disassemble. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 This is a side cross-sectional view of a semiconductor clean room elevated floor with cable holes;

[0018] Figure 2 It is a side sectional view of the elevated floor of a semiconductor clean room equipped with the power pipeline cover of the utility model;

[0019] Figure 3 This is a schematic diagram of the assembly of the power pipeline sleeve of the utility model;

[0020] Figure 4 This is a schematic diagram of a zigzag connection between the upper and lower sleeves of the power pipeline sleeve of the utility model in one embodiment;

[0021] Figure 5 It is a schematic diagram of an embodiment in which the upper and lower sleeves of the power pipeline sleeve of the utility model are connected by a bellows. DETAILED DESCRIPTION

[0022] In the following description, a large number of specific details are given to provide a more thorough understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the utility model, some technical features known in the art are not described.

[0023] In order to thoroughly understand the present invention, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present invention. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0024] Reference Figure 2-3 As shown, the utility model provides a power pipeline sleeve 10 for the elevated floor of a semiconductor clean room. The power pipeline sleeve 10 can be detachably installed in the wire hole 2 reserved in the elevated floor 1. The power pipeline sleeve 10 includes an upper sleeve 11 and a lower sleeve 12 that are plug-in and detachably connected. The upper sleeve 11 and the lower sleeve 12 are both T-shaped tubes composed of a pressure ring 13 and a center tube 14. Among them, the pressure rings 13 of the upper sleeve 11 and the lower sleeve 12 are pressed tightly on the upper surface and the lower surface of the elevated floor 1 respectively, and the center tube 14 of the upper sleeve 11 and the lower sleeve 12 are connected in the wire hole 2.

[0025] In one embodiment, the upper casing 11 and the central tube 14 of the lower casing 12 are detachably connected by annular serrations, such as Figure 4 In another embodiment, the central tube 14 of the upper casing 11 and the lower casing 12 can be made into a corrugated tube to achieve a detachable connection between the upper casing 11 and the lower casing 12, such as Figure 5 As shown. Alternatively, an internal thread can be provided on the inner wall of the central tube of the upper casing 11, and an external thread can be provided on the outer wall of the central tube of the lower casing 12, so as to realize the detachable connection between the upper casing 11 and the lower casing 12 by means of threads. The above are three typical detachable connection methods of the upper and lower casings. Of course, in practical applications, other suitable detachable connection methods can also be selected according to actual needs, which will not be described in detail here.

[0026] like Figure 2-3As shown, an annular shallow groove 15 is provided on the upper surface of the upper sleeve 11 and is located outside the central tube 14. A sealing ring 16 is detachably installed in the shallow groove. The sealing ring 16 can protect the pipeline and prevent the outer insulating layer from being scratched. In an optional embodiment, the sealing ring 16 is a rubber ring, and the sealing ring 16 is bonded to the shallow groove 15 by double-sided tape. In practical applications, sealing rings 16 with different inner ring apertures can be selected and installed in the shallow groove 15 to adapt to pipelines of different diameters, and to avoid the opening from disturbing the clean room flow pattern.

[0027] In the present invention, the materials of the upper sleeve 11 and the lower sleeve 12 are anti-static materials to prevent static electricity from affecting the semiconductor production environment. For example, the upper sleeve 11 and the lower sleeve 12 can be made of stainless steel SUS304. In addition, in order to ensure the neatness and flatness of the elevated floor 1, the outer diameters of the upper sleeve 11 and the lower sleeve 12 should be slightly smaller than the inner diameter of the wire hole 2, so as to facilitate the insertion of the upper sleeve 11 and the lower sleeve 12 into the wire hole 2. At the same time, the length of the center tube 14 of the upper sleeve 11 and the lower sleeve 12 should be moderate. If the length of the center tube 14 is too short, the upper sleeve 11 and the lower sleeve 12 cannot be docked. If the length is too long, the upper sleeve 11 and the lower sleeve 12 cannot be pressed against the upper and lower surfaces of the elevated floor 1. Preferably, the length of the center tube 14 of the upper sleeve 11 and the lower sleeve 12 is between 2 / 3 and 1 times the thickness of the elevated floor 1.

[0028] The power pipeline sleeve provided by the utility model adopts a T-shaped tube design, which can be easily installed in the reserved wire hole 2 of the elevated floor 1; since the upper sleeve 11 and the lower sleeve 12 are both T-shaped tubes, they can be pressed on the upper and lower surfaces of the elevated floor 1 by the pressure ring 13, making the power pipeline sleeve more stable and not easy to fall off. In addition, since the upper and lower sleeves of the power pipeline sleeve adopt a detachable connection method, the line can be easily inspected and maintained, which improves work efficiency.

[0029] To sum up, the power pipeline cover of the semiconductor clean room elevated floor provided by the utility model has the advantages of simple structure, easy installation, stability and reliability, good sealing, etc. It can be widely used in the line layout and maintenance of the semiconductor clean room elevated floor, thereby improving the efficiency and stability of semiconductor production.

[0030] The above describes the preferred embodiments of the utility model. It should be understood that the utility model is not limited to the above-mentioned specific implementation methods, and the devices and structures that are not described in detail should be understood to be implemented in a common manner in the art; any technician familiar with the art can use the above-disclosed methods and technical contents to make many possible changes and modifications to the technical solutions of the utility model without departing from the scope of the technical solution of the utility model, or modify them into equivalent embodiments of equivalent changes, which does not affect the essential content of the utility model. Therefore, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model still falls within the scope of protection of the technical solution of the utility model.

Claims

1. A power pipeline cover for a semiconductor clean room elevated floor, characterized in that: The power pipeline sleeve (10) is detachably installed in a wire hole (2) reserved in the elevated floor (1). The power pipeline sleeve (10) comprises an upper sleeve (11) and a lower sleeve (12) which are pluggably connected and detachable. The upper sleeve (11) and the lower sleeve (12) are both T-shaped tubes consisting of a pressure ring (13) and a center tube (14). The pressure rings (13) of the upper sleeve (11) and the lower sleeve (12) are respectively pressed against the upper surface and the lower surface of the elevated floor (1). The upper sleeve (11) and the center tube (14) of the lower sleeve (12) are detachably connected via annular serrations, annular corrugations or threads. The upper surface of the upper sleeve (11) is provided with an annular shallow groove (15) located on the periphery of the center tube (14), and a sealing ring (16) is detachably installed in the shallow groove.

2. The power pipeline cover of the semiconductor clean room elevated floor according to claim 1, characterized in that: The sealing ring (16) is bonded in the shallow groove (15) by means of double-sided adhesive.

3. The power pipeline cover of the semiconductor clean room elevated floor according to claim 1, characterized in that: The sealing ring (16) is a rubber ring.

4. The power pipeline cover of the semiconductor clean room elevated floor according to claim 1, characterized in that: The upper sleeve (11) and the lower sleeve (12) are both made of 304 stainless steel.

5. The power pipeline cover of the semiconductor clean room elevated floor according to claim 1, characterized in that: The length of the central tube (14) of the upper casing (11) and the lower casing (12) is between 2 / 3 and 1 times the thickness of the elevated floor (1).

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