Forward-mounted chip and chip packaging product
By arranging the positive and negative electrodes on the periphery of the light-emitting surface and using appropriate fluorescent film packaging, the problems of insufficient brightness, complex processes and blue light leakage in traditional formal chip packaging are solved, achieving a more flexible packaging design and cost reduction. Effect.
Patent Information
- Application Number
- CN202420269410.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-04
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-02-04
AI Technical Summary
The welding gold wire of traditional formal chips spans the luminous surface, affecting the packaging brightness, and the difference in electrode positions and sizes limits the gold wire design. The packaging process is complex and easy to cause blue light leakage, which is costly.
The positive electrode and the negative electrode are arranged on the periphery of the light-emitting surface, and are packaged with a fluorescent film whose outer contour is not smaller than the outer contour of the light-emitting surface, simplifying the packaging process and avoiding blue light leakage.
It achieves flexibility in soldering gold wire design, avoids occlusion of the light-emitting surface, simplifies the packaging process, reduces costs, and solves the problem of blue light leakage.
Smart Images
Figure CN222356871U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chips, in particular to a positive chip and a chip packaging product which are convenient for packaging design. Background Art
[0002] The electrodes of the conventional front-mounted chip 6 are located in the light-emitting surface, distributed on both sides of the chip, and connected to the positive and negative electrodes of the bracket by welding gold wires to form a circuit. Figure 1 to Figure 3 As shown, this conventional regular chip 6 often has the following defects:
[0003] (1) The gold wires for welding often cross over the chip's light-emitting surface, affecting the brightness of the package. Due to differences in electrode position or size, strict requirements are placed on the gold wire diameter, arc, and position, which in turn limits the design of the gold wire (welding wire). The number of gold wires is also limited by the number of chip electrodes.
[0004] (2) Figure 3 As shown, when the conventional upright chip packaging is used as a fluorescent film process product, a through hole 7 needs to be opened on the fluorescent film 5 to expose the chip electrode area, which not only makes the packaging more complicated, but also easily causes blue light to leak from the through hole 7 on the fluorescent film 5, increasing the difficulty of upright chip packaging as a fluorescent film process product.
[0005] (3) The mainstream of this product market is to use vertical or flip chip design, which is more expensive than horizontal chip. Utility Model Content
[0006] The purpose of the utility model is to provide a front-mounted chip that is easy to package and a chip packaging product containing the front-mounted chip, so as to solve the problems of the above-mentioned existing front-mounted chips, such as affecting the packaging brightness, limiting the design and number of gold wires, the complex packaging process with fluorescent films and prone to blue light leakage, and higher cost compared to horizontal chips.
[0007] To achieve the above purpose, the utility model provides the following solutions:
[0008] The utility model provides a positive chip, the positive electrode and the negative electrode of which are both arranged on the periphery of a light-emitting surface; the light-emitting surface can encapsulate a fluorescent film whose outer contour is not smaller than that of the light-emitting surface.
[0009] Optionally, the light-emitting surface is a rectangular light-emitting surface.
[0010] Optionally, one positive electrode and one negative electrode are provided respectively, and the positive electrode and the negative electrode are arranged on two opposite sides of the light-emitting surface respectively.
[0011] Optionally, one positive electrode and one negative electrode are provided respectively, and the positive electrode and the negative electrode are arranged on two adjacent sides of the light-emitting surface respectively.
[0012] Optionally, one positive electrode and one negative electrode are provided respectively, and the positive electrode and the negative electrode are arranged on the same side of the light-emitting surface.
[0013] Optionally, two of the positive electrodes and two of the negative electrodes are provided respectively, and the two positive electrodes and the two negative electrodes are respectively distributed outside the four sides of the light-emitting surface, wherein: the two positive electrodes are arranged on opposite sides, and the two negative electrodes are arranged on opposite sides, or the two positive electrodes are arranged on adjacent sides, and the two negative electrodes are arranged on adjacent sides.
[0014] Optionally, the front-mounted chip is a rectangular chip, the light-emitting surface is located at the center of the front-mounted chip, and the four sides of the light-emitting surface are parallel to the four sides of the front-mounted chip one by one.
[0015] Optionally, both the positive electrode and the negative electrode are strip electrodes.
[0016] The utility model also provides a chip packaging product, comprising a fluorescent film and any one of the above-mentioned upright chips, wherein the outer contour of the fluorescent film is not smaller than the outer contour of the light-emitting surface, and the fluorescent film is only packaged above the light-emitting surface.
[0017] Optionally, the chip packaging product is an LED lamp.
[0018] Compared with the prior art, the utility model has achieved the following technical effects:
[0019] The utility model arranges the positive electrode and the negative electrode of the upright chip on the periphery of the light-emitting surface, so that the number, position, wire diameter and wire arc design of the gold wires of the welding electrodes can be more flexible. The gold wires, the positive electrode and the negative electrode can be flexibly arranged away from the light-emitting surface without blocking the light-emitting surface, so that the light-emitting surface can be fully exposed, which is convenient for packaging design and makes the chip packaging design more flexible and changeable.
[0020] During packaging, the fluorescent film of corresponding size can be directly attached to the light-emitting surface. The fluorescent film no longer needs to have through holes. This not only simplifies the packaging process and reduces the packaging difficulty and cost, but also ensures the integrity of the fluorescent film, so that the entire light-emitting surface is covered by the fluorescent film, thereby solving the problem of blue light leakage in traditional forward-mounted chips.
[0021] The chip packaging product of the utility model has a novel and reasonable structure, can simplify the packaging process and reduce the packaging cost on the basis of avoiding blue light leakage. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0023] Figure 1 The structure of the conventional chip disclosed in the embodiment of the utility model is shown in FIG. Figure 1 ;
[0024] Figure 2 The structure of the conventional chip disclosed in the embodiment of the utility model is shown in FIG. Figure 2 ;
[0025] Figure 3 This is a schematic diagram of a packaged product based on a traditional front-mounted chip;
[0026] Figure 4 This is a schematic diagram of the structure of the front-mounted chip disclosed in the first embodiment of the present utility model;
[0027] Figure 5 This is a schematic diagram of the structure of the front-mounted chip disclosed in the second embodiment of the present utility model;
[0028] Figure 6 This is a schematic diagram of the structure of the upright chip disclosed in the third embodiment of the present utility model;
[0029] Figure 7 This is a schematic diagram of the structure of the front-mounted chip disclosed in the fourth embodiment of the present utility model;
[0030] Figure 8 This is a schematic diagram of the structure of the front mounted chip disclosed in the fifth embodiment of the present utility model;
[0031] Fig. 9 This is a schematic diagram of the structure of the chip packaging product disclosed in Example 6 of the present utility model.
[0032] Wherein, the accompanying drawings are marked as follows:
[0033] 1. Upright chip; 2. Positive electrode; 3. Negative electrode; 4. Light-emitting surface; 5. Fluorescent film; 6. Traditional upright chip; 7. Through hole; 8. Chip packaging product. DETAILED DESCRIPTION
[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0035] One of the purposes of the present utility model is to provide a front-mounted chip that is easy to package and design, so as to solve the problems of existing front-mounted chips, such as affecting the package brightness, limiting the design and number of gold wires, complex fluorescent film packaging process and prone to blue light leakage, and higher cost compared to horizontal chips.
[0036] Another object of the present invention is to provide a chip packaging product having the above-mentioned upright chip.
[0037] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0038] Embodiment 1
[0039] like Figure 4 As shown, this embodiment provides a positive chip 1, wherein the positive electrode 2 and the negative electrode 3 are both arranged at the periphery of the light-emitting surface 4; and the light-emitting surface 4 can encapsulate a fluorescent film 5 whose outer contour is not less than the outer contour of the light-emitting surface 4. By changing the positive electrode 2 and the negative electrode 3 of the positive chip from being arranged inside the light-emitting surface 4 to being arranged at the periphery of the light-emitting surface 4, and setting the positive electrode 2 and the negative electrode 3 as strip electrodes, the design of the number and position of the gold wires of the welding electrodes can be more flexible, and the gold wires, the positive electrode 2 and the negative electrode 3 can all be flexibly arranged away from the light-emitting surface 4, without blocking the light-emitting surface 4, so that the light-emitting surface 4 can be fully exposed. When encapsulating, the fluorescent film 5 whose outer contour is not less than the outer contour of the light-emitting surface 4 can be directly attached to the light-emitting surface 4, and the fluorescent film 5 no longer needs to be provided with a through hole, thereby ensuring the integrity of the fluorescent film 5, so that the light-emitting surface 4 is completely covered by the fluorescent film 5, and the problem of blue light leakage in the traditional positive chip 6 can be solved.
[0040] In this embodiment, the light emitting surface 4 is preferably configured as a rectangular light emitting surface.
[0041] Furthermore, in this embodiment, preferably, only one positive electrode 2 and one negative electrode 3 are provided, and the positive electrode 2 and the negative electrode 3 are arranged on two opposite sides of the light emitting surface 4 .
[0042] In this embodiment, the front-mounted chip 1 is preferably a rectangular chip, the light-emitting surface 4 is located at the center of the front-mounted chip 1, and the four sides of the light-emitting surface 4 are parallel to the four sides of the front-mounted chip 1. Figure 4As shown, the first pair of sides (i.e., the upper and lower opposite sides) in the light-emitting surface 4 are parallel to the upper and lower opposite sides of the front-mounted chip 1, the second pair of sides (i.e., the left and right opposite sides) in the light-emitting surface 4 are parallel to the left and right opposite sides of the front-mounted chip 1, and the positive electrode 2 and the negative electrode 3 are respectively arranged on both sides of the second pair of sides of the light-emitting surface 4 (i.e., the positive electrode 2 and the negative electrode 3 are respectively arranged on the left and right sides of the light-emitting surface 4).
[0043] The above-mentioned positive chip 1 of the technical solution has the following advantages:
[0044] (1) By arranging the positive electrode 2 and the negative electrode 3 of the upright chip on the periphery of the light-emitting surface 4, and setting the positive electrode 2 and the negative electrode 3 as strip electrodes, the number, position, wire diameter, and wire arc design of the gold wires of the welding electrodes can be more flexible. The gold wires, the positive electrode 2, and the negative electrode 3 can be flexibly arranged to avoid the light-emitting surface 4 without blocking the light-emitting surface 4, so that the light-emitting surface 4 can be fully exposed, which is convenient for packaging design, making the chip packaging design more flexible and changeable.
[0045] (2) During packaging, a fluorescent film 5 of corresponding size (i.e., a fluorescent film 5 whose outer contour is not smaller than the outer contour of the light-emitting surface 4) is directly attached to the light-emitting surface 4. The fluorescent film 5 no longer needs to have a through hole, which simplifies the packaging process and reduces the packaging difficulty and packaging cost, while ensuring the integrity of the fluorescent film 5, so that the light-emitting surface 4 is completely covered by the fluorescent film 5, thereby solving the problem of blue light leakage in the traditional front-mounted chip 6.
[0046] (3) The chip 1 is not limited to having two electrodes, but may be provided with three or more electrodes.
[0047] It can be seen that the structure of the positive chip 1 of the present technical solution is novel and reasonable. It can simplify the packaging process on the basis of reducing costs and avoiding blue light leakage. It is more suitable for fluorescent film process products such as various LED lamp beads, backlights, lighting, and automotive applications.
[0048] Embodiment 2
[0049] like Figure 5 As shown, this embodiment proposes a new type of positive chip 1, which is different from the one in the first embodiment. Figure 4 The only difference between the structures shown is that the positive electrode 2 and the negative electrode 3 are arranged on two adjacent sides of the light emitting surface 4 respectively.
[0050] Furthermore, if Figure 5 As shown, the light emitting surface 4 is preferably located at the upper right corner of the front-mounted chip 1, and the positive electrode 2 and the negative electrode 3 are respectively arranged near the two sides of the lower left corner of the front-mounted chip 1.
[0051] The working principle and technical effect of the mounting chip 1 in this embodiment are the same as those in the first embodiment, and will not be described in detail here.
[0052] Embodiment 3
[0053] like Figure 6 As shown, this embodiment proposes a new type of positive chip 1, which is different from the one in the first embodiment. Figure 4 The structures shown differ only in that the positive electrode 2 and the negative electrode 3 are arranged on the same side of the luminous area 4 .
[0054] Furthermore, if Figure 6 As shown, the light emitting surface 4 is preferably located on the right side of the front-mounted chip 1 , and the positive electrode 2 and the negative electrode 3 are arranged vertically on the left side of the light emitting surface 4 .
[0055] The working principle and technical effect of the mounting chip 1 in this embodiment are the same as those in the first embodiment, and will not be described in detail here.
[0056] Embodiment 4
[0057] like Figure 7 As shown, this embodiment proposes a new type of positive chip 1, which is different from the one in the first embodiment. Figure 4 The difference between the structures shown is that two positive electrodes 2 and two negative electrodes 3 are provided respectively, and the two positive electrodes 2 and the two negative electrodes 3 are respectively distributed outside the four sides of the light-emitting surface 4, and the two positive electrodes 2 are arranged opposite to each other, and the two negative electrodes 3 are arranged opposite to each other.
[0058] Furthermore, if Figure 7 As shown, the light emitting surface 4 is preferably located at the center of the front-mounted chip 1 , and the four sides of the light emitting surface 4 are parallel and correspond to the four sides of the front-mounted chip 1 one by one.
[0059] The working principle and technical effect of the mounting chip 1 in this embodiment are the same as those in the first embodiment, and will not be described in detail here.
[0060] Embodiment 5
[0061] like Figure 8 As shown, this embodiment proposes a new type of positive chip 1, which is different from the one in the first embodiment. Figure 4 The difference between the structures shown is that two positive electrodes 2 and two negative electrodes 3 are provided respectively, and the two positive electrodes 2 and the two negative electrodes 3 are respectively distributed outside the four sides of the light-emitting surface 4, and the two positive electrodes 2 are arranged adjacent to each other, and the two negative electrodes 3 are arranged adjacent to each other.
[0062] Furthermore, if Figure 8 As shown, the light emitting surface 4 is preferably located at the center of the front-mounted chip 1 , and the four sides of the light emitting surface 4 are parallel and correspond to the four sides of the front-mounted chip 1 one by one.
[0063] The working principle and technical effect of the mounting chip 1 in this embodiment are the same as those in the first embodiment, and will not be described in detail here.
[0064] Embodiment 6
[0065] This embodiment proposes a chip packaging product 8, including a fluorescent film 5 and a front-mounted chip 1 disclosed in any one of embodiments 1 to 5, wherein the outer contour of the fluorescent film 5 is not smaller than the outer contour of the light-emitting surface 4, and the fluorescent film 5 is only packaged above the light-emitting surface 4.
[0066] Take the structure of the positive chip 1 disclosed in the first embodiment as an example. Fig. 9 As shown, the front-mounted chip 1 is a rectangular chip, the light-emitting surface 4 is located at the center of the front-mounted chip 1, and the first pair of sides in the light-emitting surface 4 is parallel to a pair of sides (i.e., the upper and lower sides) of the front-mounted chip 1, and the second pair of sides in the light-emitting surface 4 (i.e., the left and right sides) are parallel to the other pair of sides of the front-mounted chip 1, and the positive electrode 2 and the negative electrode 3 are respectively arranged on both sides of the second pair of sides of the light-emitting surface 4 (i.e., the positive electrode 2 and the negative electrode 3 are respectively arranged on the left and right sides of the light-emitting surface 4). During packaging, a rectangular fluorescent film 5 with long and short sides not less than the long and short sides of the light-emitting surface 4 is directly attached to the light-emitting surface 4 (the four sides of the light-emitting surface 4 are parallel to the four sides of the fluorescent film 5 respectively), and the fluorescent film 5 no longer needs to be provided with through holes, which simplifies the packaging process, reduces the packaging difficulty and packaging cost, and ensures the integrity of the fluorescent film 5, so that the entire light-emitting surface 4 is covered by the fluorescent film 5, thereby solving the problem of blue light leakage in the traditional front-mounted chip 6.
[0067] The chip packaging product 8 is a fluorescent film process product, which can be specifically an LED lamp, such as various LED lamp beads, backlight, lighting, automotive applications, etc.
[0068] It can be seen that the chip packaging product 8 of the present technical solution has a novel and reasonable structure, and can simplify the packaging process and reduce the packaging cost on the basis of reducing the cost and avoiding the leakage of blue light.
[0069] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A normal chip, characterized in that: The positive electrode and the negative electrode are both arranged on the periphery of the light-emitting surface; the light-emitting surface can be encapsulated with a fluorescent film whose outer contour is not smaller than the outer contour of the light-emitting surface.
2. The upright chip according to claim 1, characterized in that: The light emitting surface is a rectangular light emitting surface.
3. The upright chip according to claim 2, characterized in that: The positive electrode and the negative electrode are each provided in one piece, and the positive electrode and the negative electrode are respectively arranged on two opposite sides of the light emitting surface.
4. The upright chip according to claim 2, characterized in that: The positive electrode and the negative electrode are provided one at a time, and the positive electrode and the negative electrode are arranged on two adjacent sides of the light-emitting surface, respectively.
5. The upright chip according to claim 2, characterized in that: The positive electrode and the negative electrode are provided one by one respectively, and the positive electrode and the negative electrode are arranged on the same side of the light emitting surface.
6. The upright chip according to claim 2, characterized in that: Two of the positive electrodes and two of the negative electrodes are provided respectively, and the two positive electrodes and the two negative electrodes are respectively distributed outside the four sides of the light-emitting surface; wherein: the two positive electrodes are arranged on opposite sides, and the two negative electrodes are arranged on opposite sides, or the two positive electrodes are arranged on adjacent sides, and the two negative electrodes are arranged on adjacent sides.
7. The upright chip according to claim 3 or 6, characterized in that: The front-mounted chip is a rectangular chip, the light-emitting surface is located at the center of the front-mounted chip, and the four sides of the light-emitting surface are parallel to the four sides of the front-mounted chip in a one-to-one correspondence.
8. The front-mounted chip according to any one of claims 1 to 6, characterized in that: The positive electrode and the negative electrode are both strip-shaped electrodes.
9. A chip packaging product, characterized in that: It comprises a fluorescent film and the upright chip as claimed in any one of claims 1 to 8, wherein the outer contour of the fluorescent film is not smaller than the outer contour of the light-emitting surface, and the fluorescent film is only packaged above the light-emitting surface.
10. The chip packaging product according to claim 9, characterized in that: The chip packaged product is an LED lamp.