Chip taking device and chip production system

Abstract

The utility model discloses a chip taking device and a chip production system. The chip taking device comprises a bottom plate; the bearing seat is used for placing a membrane to be taken; the bearing seat is arranged on the bottom plate; the ejector pin assembly comprises an ejector pin cap and an ejector pin; the ejector pin cap is arranged below the bearing seat, an ejector pin hole is formed in the upper end of the ejector pin cap, and the upper end of the ejector pin cap makes contact with a membrane to be taken; the ejector pin is arranged in the ejector pin cap in a lifting mode, and the ejector pin penetrates through the ejector pin hole when rising and can jack up a chip on the membrane to be taken. The first vacuum device is used for vacuumizing the interior of the ejector pin cap; the first fixing frame is arranged on the bottom plate; the material taking assembly is arranged on the first fixing frame and located above the bearing seat; the heating device is arranged on the first fixing frame and located above the bearing base. According to the chip taking device provided by the utility model, the success rate of taking the product from the diaphragm is effectively improved, manual operation is not needed in the whole process, and the taking efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of film material taking, in particular to a chip material taking device and a chip production system. Background Art

[0002] Among the existing chip manufacturing processes, the use of sputtering product manufacturing processes is more common. Sputtering is a process that uses ions to bombard the surface of a material so that it is sprayed onto other objects. This process is often used to prepare thin films, such as metal or semiconductor thin film layers in chip manufacturing. The chip products produced by this process need to be peeled off from the film after the chip processing is completed. Currently, most of the methods for removing products from the film on the market still use manual stripping methods. The manual stripping method is not only inefficient, but also when encountering a situation where a large product is removed from a film with high viscosity / a film with high hardness / a double-layer film, it is easy to damage the chip product, and the success rate of removing the material is low. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a chip picking device, which has improved efficiency and success rate of picking compared to manual picking.

[0004] In a first aspect, an embodiment of the present utility model provides a chip picking device, comprising:

[0005] Base plate;

[0006] A bearing seat, used for placing the film to be taken; the bearing seat is arranged on the bottom plate;

[0007] An ejector assembly, comprising an ejector cap and an ejector pin; the ejector cap is arranged below the bearing seat, an ejector hole is arranged at the upper end of the ejector cap, and the upper end of the ejector cap contacts the film to be taken; the ejector pin is arranged in the ejector cap in a movably manner, and when the ejector pin is raised, it passes through the ejector hole and can lift the chip on the film to be taken;

[0008] A first vacuum device, used to evacuate the interior of the ejector cap to a vacuum state;

[0009] A first fixing frame is arranged on the bottom plate;

[0010] A pick-up assembly is arranged on the first fixing frame and is located above the bearing seat; the pick-up assembly is used to pick up the chip on the film to be picked up;

[0011] A heating device is arranged on the first fixing frame and located above the bearing seat; the heating device is used to soften the film to be taken.

[0012] In some embodiments of the utility model, the base plate includes a first base plate and a second base plate; a first slide rail arranged along a first direction is provided on the first base plate, and the second base plate can be slidably arranged on the first slide rail; a second slide rail arranged along a second direction is provided on the second base plate, and the supporting seat can be slidably arranged on the second slide rail.

[0013] In some embodiments of the utility model, the supporting seat includes a supporting frame, a rotating bracket and a rotating disk; the film to be taken is arranged on the supporting frame, the supporting frame is arranged on the rotating disk, and the rotating disk is rotatably arranged on the rotating bracket; the rotating bracket is slidably arranged on the second slide rail.

[0014] In some embodiments of the present invention, the rotating bracket includes a lifting screw; the rotating disk can rise or fall along the lifting screw.

[0015] In some embodiments of the utility model, the ejector assembly also includes a second fixed frame, an ejector lifting device and a servo drive device; the second fixed frame is arranged on the first base plate, and the ejector lifting device is arranged on the second fixed frame; the servo drive device is arranged on the ejector lifting device, and the ejector cap is arranged on the servo drive device, and the output shaft of the servo drive device is drivingly connected to the ejector; the ejector lifting device is used to drive the servo drive device to rise and fall; the servo drive device is used to drive the ejector to rise and fall.

[0016] In some embodiments of the utility model, the material picking assembly includes a suction nozzle and a three-axis moving device; the three-axis moving device is arranged on the first fixed frame and is located above the supporting seat; the suction nozzle is arranged on the three-axis moving device; the three-axis moving device is used to move the suction nozzle to adsorb and pick up the chip.

[0017] In some embodiments of the utility model, the material picking assembly also includes a second vacuum device and a flow sensor, and the second vacuum device and the flow sensor are both arranged on the first fixed frame; the second vacuum device is used to generate vacuum to provide adsorption force for the suction nozzle; the flow sensor is used to detect the magnitude of the adsorption force.

[0018] In some embodiments of the present invention, the chip picking device further includes a visual component, and the visual component is disposed on the first fixing frame and located above the supporting seat.

[0019] In some embodiments of the present invention, the chip picking device further comprises a pressing ring, and the pressing ring is arranged above the supporting seat; the pressing ring is used to assist the picking component in picking up the chip.

[0020] In a second aspect, an embodiment of the utility model provides a chip production system, including the chip picking device described in the embodiment of the above aspect.

[0021] According to the chip picking device of the utility model, at least the following beneficial effects are achieved: in the chip picking device provided by the utility model, a pin cap is used to suck the diaphragm arranged on the supporting seat, the pin pushes the product out of the diaphragm to separate the product from the diaphragm, the suction nozzle takes the product off the diaphragm, and hot air is blown above the chip product to heat it when picking up the material, so as to soften the film / glue and assist the product to be peeled off from the film, thereby effectively improving the success rate of picking up the product from the diaphragm, and no manual operation is required throughout the process, thereby improving the efficiency of picking up the material. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 A schematic diagram of a chip retrieval device according to an embodiment of the utility model;

[0024] Figure 2 It is a front view of the chip picking device according to an embodiment of the utility model;

[0025] Figure 3 This is an exploded schematic diagram of the ejector assembly of an embodiment of the utility model;

[0026] Figure 4 It is a partial schematic diagram of a chip picking device according to an embodiment of the utility model;

[0027] Figure 5 It is a side view of the chip retrieval device according to an embodiment of the utility model.

[0028] Figure numerals: base plate 100, first base plate 110, first slide rail 111, second base plate 120, second slide rail 121, first fixed frame 130, bearing seat 200, bearing frame 210, rotating bracket 220, lifting screw 221, rotating disk 230, ejector assembly 300, ejector 310, ejector cap 320, second fixed frame 330, ejector lifting device 340, servo drive device 350, material picking assembly 400, suction nozzle 410, three-axis moving device 420, heating device 500, pressing ring 600, film to be picked up 700, visual component 800. DETAILED DESCRIPTION

[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0030] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] In the description of the present utility model, "several" means one or more, "more" means two or more, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of the first, second or third, it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0032] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0033] In the chip picking device provided by the utility model, a diaphragm arranged on a supporting seat is sucked by a pin cap, the pin pushes the product out of the diaphragm to separate the product from the diaphragm, the suction nozzle takes the product away from the diaphragm, and hot air is blown above the chip product to heat it during picking, so as to soften the diaphragm / glue and assist the product to be peeled off from the diaphragm, thereby effectively improving the success rate of picking the product from the diaphragm, and no manual operation is required in the whole process, thereby improving the efficiency of picking.

[0034] The specific device of the embodiment of the utility model is described below in conjunction with the accompanying drawings.

[0035] Reference Figure 1 to Figure 5 , Figure 1 This is a schematic diagram of a chip picking device according to an embodiment of the utility model, which specifically includes:

[0036] Bottom plate 100;

[0037] The bearing seat 200 is used to place the film 700 to be taken out; the bearing seat 200 is arranged on the bottom plate 100;

[0038] The ejector assembly 300 includes an ejector cap 320 and an ejector pin 310; the ejector cap 320 is arranged below the support seat 200, an ejector hole is arranged at the upper end of the ejector cap 320, and the upper end of the ejector cap 320 contacts the film 700 to be removed; the ejector pin 310 is arranged in the ejector cap 320 in a liftable manner, and when the ejector pin 310 is raised, it passes through the ejector hole and can lift the chip on the film 700 to be removed; the first vacuum device is used to evacuate the inside of the ejector cap 320 to a vacuum state; the first fixing frame 130 is arranged on the bottom plate 100; the material removal assembly 400 is arranged on the first fixing frame 130 and located above the support seat 200; the material removal assembly 400 is used to pick up the chip on the film 700 to be removed; the heating device 500 is arranged on the first fixing frame 130 and located above the support seat 200; the heating device 500 is used to soften the film 700 to be removed.

[0039] Specifically, the material taking process of the chip picking device provided by the embodiment of the utility model is as follows: the film 700 to be picked up is placed on the supporting seat 200, the ejector cap 320 of the ejector assembly 300 contacts the film 700 to be picked up from the bottom of the film 700 to be picked up, and the first vacuum device (not shown in the figure) draws the inside of the ejector cap 320 into a vacuum state, so that the ejector assembly 300 sucks the film 700 to be picked up, and then the ejector 310 inside the ejector cap 320 lifts up the chip at the corresponding position sucked, so that the chip is separated from the film 700 to be picked up, and finally the chip is taken away by the picking assembly 400; in this process, if the area of ​​the chip is large or the viscosity of the film is high, it may cause the picking failure, so the embodiment of the utility model further provides a heating device 500, and the heating device 500 heats the picking point above the film 700 to soften the film at the picking point position, so that the chip is easier to be removed. Furthermore, the film of the film sheet 700 to be taken out can be a blue film, a UV film or a PI film.

[0040] Reference Figure 1 In some embodiments of the utility model, the base plate 100 includes a first base plate 110 and a second base plate 120; the first base plate 110 is provided with a first slide rail 111 arranged along a first direction, and the second base plate 120 is slidably arranged on the first slide rail 111; the second base plate 120 is provided with a second slide rail 121 arranged along a second direction, and the supporting seat 200 is slidably arranged on the second slide rail 121.

[0041] Specifically, the first slide rail 111 and the second slide rail 121 are as follows Figure 1As shown, the first slide rail 111 and the second slide rail 121 are alternately arranged, which can enable the support seat 200 to move in the first direction and the second direction. The second bottom plate 120 is moved when moving along the first direction or the opposite direction, and the support seat 200 is moved when moving along the second direction or the opposite direction. The moving support seat 200 can change the relative position of the ejector pin 310 mechanism and the film 700 to be picked up, so that after the chip film at the current position is successfully picked up, it can quickly move to the position where the next chip is located for picking up. In one embodiment of the utility model, the first slide rail 111 and the second slide rail 121 are arranged perpendicular to each other, so that the chip picking device can pick up chip products at any position on the film 700 to be picked up.

[0042] Reference Figure 2 In some embodiments of the utility model, the supporting seat 200 includes a supporting frame 210, a rotating bracket 220 and a rotating disk 230; the film 700 to be taken is arranged on the supporting frame 210, the supporting frame 210 is arranged on the rotating disk 230, and the rotating disk 230 is rotatably arranged on the rotating bracket 220; the rotating bracket 220 is slidably arranged on the second slide rail 121.

[0043] Specifically, Figure 2 The rotating bracket 220 and the rotating disk 230 are shown in the figure. The rotating disk 230 can rotate on the rotating bracket 220. When the position of the chip on the film 700 to be taken out is offset from the taking point, the position or angle of the chip can be adjusted by rotating the rotating disk 230, so that the taking component 400 can take out the material more easily.

[0044] Reference Figure 2 In some embodiments of the present invention, the rotating bracket 220 includes a lifting screw rod 221 ; the rotating disk 230 can rise or fall along the lifting screw rod 221 .

[0045] Specifically, Figure 2 The lifting screw 221 is shown in the figure. Since the viscosity of various types of diaphragms is different, the length of the ejector pin 310 required to extend is also different for different types of diaphragms. At this time, the lifting screw 221 can be adjusted to make the rotating disk 230 rise or fall, so that the relative distance between the diaphragm 700 to be removed and the ejector pin assembly 300 is changed, so that the stroke of the ejector pin 310 lifting the diaphragm 700 to be removed is changed, thereby improving the success rate of removing chips.

[0046] Reference Figure 3In some embodiments of the utility model, the ejector assembly 300 further includes a second fixed frame 330, an ejector lifting device 340 and a servo drive device 350; the second fixed frame 330 is arranged on the first bottom plate 110, and the ejector lifting device 340 is arranged on the second fixed frame 330; the servo drive device 350 is arranged on the ejector lifting device 340, and the ejector cap 320 is arranged on the servo drive device 350, and the output shaft of the servo drive device 350 is transmission-connected with the ejector 310; the ejector 310 moving device is used to drive the servo drive device 350 to rise and fall; the servo drive device 350 is used to drive the ejector 310 to rise and fall.

[0047] Specifically, Figure 3 The schematic diagram of the ejector assembly 300 of the embodiment of the utility model is shown in FIG. 1 . The first fixed frame 130 is used to place the ejector lifting device 340 and the servo drive device 350. The ejector lifting device 340 can raise or lower the servo drive device 350, thereby changing the relative distance between the ejector cap 320 set on the servo drive device 350 and the ejector 310 and the film to be taken 700, thereby improving the success rate of taking the chip. The servo drive device 350 can control the lifting and lowering of the ejector 310. When the ejector assembly 300 is located at the material taking position, the servo drive device 350 drives the ejector 310 to rise. After the material taking is completed, the servo drive mechanism retracts the ejector 310. Furthermore, a heating device 500 can also be set on the second fixed frame 330, so that the heating device 500 heats the material taking position at the same time under the film to be taken 700, thereby improving the softening effect of the film.

[0048] Reference Figure 2 In some embodiments of the present invention, the material picking component 400 includes a suction nozzle 410 and a three-axis moving device 420; the three-axis moving device 420 is arranged on the first fixed frame 130 and is located above the supporting seat 200; the suction nozzle 410 is arranged on the three-axis moving device 420; the three-axis moving device 420 is used to move the suction nozzle 410 to adsorb and pick up the chip.

[0049] Specifically, the material picking component 400 moves the suction nozzle 410 to the material picking position through the three-axis moving device 420, and picks up the chip at the material picking position where the viscosity is weakened after heating through the suction nozzle 410, and then moves the sucked chip to the storage position of the subsequent chip processing flow through the three-axis material picking chip, thereby improving the efficiency of chip product material picking.

[0050] In some embodiments of the utility model, the material picking component 400 also includes a second vacuum device and a flow sensor, both of which are arranged on the first fixed frame 130; the second vacuum device is used to generate vacuum to provide adsorption force for the suction nozzle 410; the flow sensor is used to detect the magnitude of the adsorption force.

[0051] Specifically, the material picking component 400 provides suction force to the suction nozzle 410 through the second vacuum device (not shown in the figure) so that the suction nozzle 410 can pick up materials. In addition, the chip picking device provided by the embodiment of the utility model can be controlled by an industrial computer or other control module that can realize the control function. When picking up materials, due to the different viscosities of different types of diaphragms, the suction nozzle 410 provides different degrees of suction force. At this time, the flow rate of the gas extracted when the second vacuum device generates a vacuum can be detected by a flow sensor (not shown in the figure) and uploaded to the industrial computer, thereby knowing the current suction force of the suction nozzle 410, which is convenient for adjusting the suction force of the suction nozzle 410 so that it can use any type of diaphragm to pick up materials.

[0052] In some embodiments of the present invention, the chip picking device further includes a visual component 800 . The visual component 800 is disposed on the first fixing frame 130 and located above the supporting seat 200 .

[0053] Specifically, the visual component 800 is as follows Figure 5 As shown, the visual component 800 is disposed on the first fixing frame 130 ( Figure 5 The visual component 800 is also controlled by the industrial computer provided in the above-mentioned embodiments, and can assist in locating the position of the chip on the film 700 to be picked up, so as to facilitate the quick picking component 400 and the ejector pin component 300 to quickly locate the picking position, thereby improving the efficiency of picking up.

[0054] Reference Figure 4 In some embodiments of the present invention, the chip picking device further comprises a pressing ring 600, which is disposed above the supporting seat 200; the pressing ring 600 is used to assist the picking component 400 in picking up the chip.

[0055] Specifically, Figure 4 This is a partial schematic diagram of a chip retrieval device according to an embodiment of the present utility model. Figure 4 As shown, the pressing ring 600 can press the diaphragm when the material taking assembly 400 is taking the material, so that the diaphragm will not be excessively lifted by the ejector pins 310, thereby making it easier to remove the chip from the diaphragm.

[0056] In a second aspect, an embodiment of the utility model provides a chip production system, including the chip picking device of the embodiment of the above aspect.

[0057] In the description of this specification, the description with reference to the terms "one embodiment", "further embodiments", "some specific embodiments" or "some examples" etc. means that the specific features, structures or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0058] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A chip picking device, characterized in that: include: Base plate; A bearing seat, used for placing the film to be taken; the bearing seat is arranged on the bottom plate; An ejector assembly, comprising an ejector cap and an ejector pin; the ejector cap is arranged below the bearing seat, an ejector hole is arranged at the upper end of the ejector cap, and the upper end of the ejector cap contacts the film to be taken; the ejector pin is arranged in the ejector cap in a movably manner, and when the ejector pin is raised, it passes through the ejector hole and can lift the chip on the film to be taken; A first vacuum device, used to evacuate the interior of the ejector cap to a vacuum state; A first fixing frame is arranged on the bottom plate; A pick-up assembly is arranged on the first fixing frame and is located above the bearing seat; the pick-up assembly is used to pick up the chip on the film to be picked up; A heating device is arranged on the first fixing frame and located above the bearing seat; the heating device is used to soften the film to be taken.

2. The chip picking device according to claim 1, characterized in that: The base plate includes a first base plate and a second base plate; a first slide rail arranged along a first direction is arranged on the first base plate, and the second base plate can be slidably arranged on the first slide rail; a second slide rail arranged along a second direction is arranged on the second base plate, and the bearing seat can be slidably arranged on the second slide rail.

3. The chip picking device according to claim 2, characterized in that: The bearing seat includes a bearing frame, a rotating bracket and a rotating disk; the film to be taken is arranged on the bearing frame, the bearing frame is arranged on the rotating disk, and the rotating disk is rotatably arranged on the rotating bracket; the rotating bracket is slidably arranged on the second slide rail.

4. The chip picking device according to claim 3, characterized in that: The rotating bracket comprises a lifting screw rod; the rotating disk can rise or fall along the lifting screw rod.

5. The chip picking device according to claim 2, characterized in that: The ejector assembly also includes a second fixing frame, an ejector lifting device and a servo drive device; the second fixing frame is arranged on the first bottom plate, and the ejector lifting device is arranged on the second fixing frame; the servo drive device is arranged on the ejector lifting device, and the ejector cap is arranged on the servo drive device, and the output shaft of the servo drive device is drivingly connected with the ejector; the ejector lifting device is used to drive the servo drive device to rise and fall; the servo drive device is used to drive the ejector to rise and fall.

6. The chip picking device according to claim 1, characterized in that: The material picking assembly includes a suction nozzle and a three-axis moving device; the three-axis moving device is arranged on the first fixed frame and is located above the supporting seat; the suction nozzle is arranged on the three-axis moving device; the three-axis moving device is used to move the suction nozzle to absorb and pick up the chip.

7. The chip picking device according to claim 6, characterized in that: The material picking assembly also includes a second vacuum device and a flow sensor, and the second vacuum device and the flow sensor are both arranged on the first fixed frame; the second vacuum device is used to generate vacuum to provide adsorption force for the suction nozzle; the flow sensor is used to detect the magnitude of the adsorption force.

8. The chip retrieval device according to claim 1, characterized in that: The chip picking device further comprises a visual component, and the visual component is arranged on the first fixing frame and located above the supporting seat.

9. The chip retrieval device according to claim 1, characterized in that: The chip picking device also includes a pressing ring, which is arranged above the supporting seat; the pressing ring is used to assist the picking component in picking up the chip.

10. A chip production system, characterized in that: A chip retrieval device comprising any one of claims 1 to 9.

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