Wafer bearing mechanism

Abstract

The utility model provides a wafer bearing mechanism. The wafer bearing mechanism comprises a base, a translation driving module, a mounting plate, a rotation driving module, a moving platform and a wafer bearing table. A mounting groove is formed in a mounting part of the base, and the first guide rail and the second guide rail are mounted on two supporting surfaces of the mounting part; the translation driving module is arranged in the mounting groove, and the mounting plate is mounted on the translation driving module; the moving platform is slidably connected to the first guide rail and the second guide rail, and a mounting hole is formed in the moving platform; the rotary driving module is mounted on the mounting plate and located in the mounting hole; the wafer bearing table is mounted on the rotary driving module; the translation driving module drives the wafer bearing table to translate synchronously, and the rotation driving module drives the wafer bearing table to rotate. The rotation driving module is installed in the installation groove, and when a height error exists between the two supporting surfaces of the installation part, the height difference between the wafer bearing table and the supporting surfaces on the two sides of the installation part is reduced, so that the surface inclination of the wafer bearing table is reduced.

Description

Technical Field

[0001] The present application relates to the field of wafer processing, and in particular to a wafer carrying mechanism. Background Art

[0002] During the chip production process, a dicing machine is needed to slice the wafer to divide the wafer into individual chips.

[0003] In order to achieve wafer cutting, the wafer carrier will be slidably installed on the angle adjustment component, and the angle adjustment component is installed on the transverse module. In order to ensure the stability of the wafer carrier, the two sides of the angle adjustment component need to be slidably connected to the guide rails on both sides of the transverse module.

[0004] Since an angle adjustment component is installed between the guide rails and the wafer carrier table, the height difference between the guide rails on both sides and the upper surface of the wafer carrier table is relatively large. During actual processing and assembly, there is usually an allowable height deviation between the guide rails on both sides. However, this height deviation will cause the inclination of the wafer carrier table surface to be magnified due to the large height difference between the guide rails and the upper surface of the wafer carrier table, thereby affecting the accuracy of wafer cutting. Utility Model Content

[0005] In view of the above problems existing in the traditional dicing machine, the present application provides a wafer carrying mechanism, and its detailed technical solution is as follows:

[0006] A wafer carrying mechanism comprises a base, a translation driving module, a mounting plate, a rotation driving module, a moving platform and a wafer carrying table, wherein:

[0007] The base comprises a mounting portion, a mounting groove with an opening facing upward is arranged in the middle of the mounting portion along a first horizontal direction, two supporting surfaces of the mounting portion are respectively located on two opposite sides of the mounting groove, and a first guide rail and a second guide rail extending along the first horizontal direction are respectively installed on the two supporting surfaces of the mounting portion;

[0008] The translation drive module is arranged in the installation groove, and the installation plate is horizontally installed on the driving end of the translation drive module;

[0009] One end of the mobile platform is slidably connected to the first guide rail, the other end of the mobile platform is slidably connected to the second guide rail, the bottom of the mobile platform is fixedly connected to the mounting plate, and a mounting hole is formed in the mobile platform and penetrates the mobile platform from top to bottom;

[0010] The rotary drive module is mounted on the mounting plate and is located in the mounting hole, and the driving end of the rotary drive module extends upwardly out of the mounting hole;

[0011] The wafer carrier is horizontally mounted on the driving end of the rotary driving module;

[0012] The translation drive module is used to drive the mounting plate to translate along the first horizontal direction, so as to drive the mobile platform and the wafer carrier to translate synchronously along the first horizontal direction; the rotation drive module is used to drive the wafer carrier to rotate in a horizontal plane.

[0013] The wafer bearing mechanism provided by the present application is provided with a mounting groove with an opening facing upward in the mounting portion of the base, and the rotary drive module is installed in the mounting groove, thereby reducing the height difference between the wafer bearing platform and the supporting surfaces on both sides of the mounting portion. When there is an allowable height error between the two supporting surfaces of the mounting portion, the height difference between the wafer bearing platform and the supporting surfaces on both sides of the mounting portion becomes smaller, thereby reducing the influence of the height error of the two supporting surfaces on the inclination of the surface of the wafer bearing platform, thereby improving the dicing accuracy. In addition, due to the reduced error of the wafer bearing platform, and then the design of slidingly installing the mobile platform on the two supporting surfaces of the mounting portion, the wafer dicing machine provided by the present application can be compatible with larger wafer specifications, such as 8 inches, 12 inches, 14 inches, 16 inches and even 20 inches.

[0014] In some embodiments, the base also includes a first side support portion and a second side support portion, wherein: the first side support portion and the second side support portion are symmetrically arranged on both sides of the mounting portion along a second horizontal direction, wherein the second horizontal direction is perpendicular to the first horizontal direction; the first side support portion and the second side support portion are used to support a wafer slicing mechanism, and the wafer slicing mechanism is used to perform slicing on a wafer carried on a wafer supporting table.

[0015] By symmetrically arranging the first side support portion and the second side support portion on both sides of the mounting portion, on the one hand, an installation space is provided for the wafer dicing mechanism, and on the other hand, the base is made to have a symmetrical structure, thereby improving the supporting stability of the base to the wafer dicing mechanism and the wafer supporting platform, and reducing the influence of mechanical mounting stress and thermal stress on the base, thereby improving the dicing accuracy.

[0016] In some embodiments, the mounting portion, the first side support portion, and the second side support portion are integrally formed.

[0017] The manufacturing and forming of the base is facilitated, the assembly stability between the wafer dicing mechanism and the wafer supporting platform is improved, and the deformation resistance of the base is improved.

[0018] In some embodiments, the translation drive module includes a motor, a screw and a screw nut, wherein the screw is connected to the driving end of the motor and extends along a first horizontal direction, the screw nut is threaded on the screw and fixed to the bottom of the mounting plate, and when the motor drives the screw to rotate, it drives the screw nut and the mounting plate to translate along the screw.

[0019] A translation drive module with a simple structure and stable driving is provided to ensure stable translation of a mobile platform and a wafer carrier along a first horizontal direction.

[0020] In some embodiments, a first column is disposed at the first end of the mounting plate, and a second column is disposed at the second end of the mounting plate, and an avoidance space for avoiding the rotating drive module is formed between the first column and the second column; the bottom of the mobile platform is fixedly mounted on the upper ends of the first column and the second column.

[0021] An avoidance space for the rotary drive module is formed between the mobile platform and the mounting plate, and finally the bottom of the rotary drive module is installed on the mounting plate.

[0022] In some embodiments, the rotary drive module includes a rotary motor, and a plurality of first mounting holes are circumferentially arranged at the bottom of the rotary motor; a plurality of second mounting holes corresponding to the first mounting holes are arranged on the mounting plate; and the rotary motor is fixed to the mounting plate by bolts passing through the first mounting holes and the corresponding second mounting holes.

[0023] The connection strength between the rotary drive module and the mounting plate is ensured, and the disassembly, assembly and maintenance of the rotary drive module are facilitated.

[0024] In some embodiments, the rotary electric machine is a DD motor.

[0025] The DD motor has stable driving and high driving accuracy, which improves the angle adjustment accuracy of the wafer carrier.

[0026] In some embodiments, adsorption holes for adsorbing wafers are provided on the supporting surface of the wafer supporting platform.

[0027] The wafer is adsorbed and fixed to ensure the dicing effect.

[0028] In some embodiments, the movable platform is provided with a plurality of clamping assemblies arranged circumferentially on the peripheral side of the wafer carrier, and the clamping assemblies are used to clamp the wafer carrier.

[0029] After completing the angle adjustment of the wafer carrier, the clamping assembly can realize the clamping and positioning of the wafer carrier to prevent the wafer carrier from accidentally rotating during the dicing process.

[0030] In some embodiments, the clamping assembly includes a clamping drive and a clamping block. The clamping drive is mounted on a mobile platform, and the clamping block is connected to the driving end of the clamping drive. The clamping drive is used to drive the clamping block to move toward or away from the wafer carrier to clamp or release the wafer carrier.

[0031] A clamping assembly with a simple structure is provided, which drives a clamping block to move toward or away from a wafer carrier through a clamping driving member, so as to implement rapid clamping and release of the wafer carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1It is a structural schematic diagram of a wafer carrying mechanism in an embodiment of the present application;

[0033] Figure 2 It is a schematic diagram of the assembly structure of the rotation drive module and the mounting plate in the embodiment of the present application;

[0034] Figure 1 to Figure 2 Included:

[0035] Base 1: mounting portion 11, mounting groove 12, first guide rail 13, second guide rail 14, first side support portion 15, second side support portion 16;

[0036] Translation drive module 2;

[0037] Mounting plate 3:

[0038] Rotation drive module 4: rotation motor 41, bolt 42;

[0039] Mobile platform 5;

[0040] Wafer carrier 6;

[0041] First column 7;

[0042] The second column 8;

[0043] Pressing assembly 9. DETAILED DESCRIPTION

[0044] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0045] like Figure 1 As shown, the wafer carrying mechanism in the embodiment of the present application includes a base 1, a translation drive module 2, a mounting plate 3, a rotation drive module 4, a moving platform 5 and a wafer carrying table 6, wherein:

[0046] The base 1 includes a mounting portion 11, the middle of the mounting portion 11 is along a first horizontal direction (eg Figure 1 A mounting groove 12 with an upward opening is provided (in the X-axis direction), the two supporting surfaces of the mounting portion 11 are respectively located on the opposite sides of the mounting groove 12, and the first guide rail 13 and the second guide rail 14 extending along the first horizontal direction are respectively installed on the two supporting surfaces of the mounting portion 11.

[0047] The translation driving module 2 is arranged in the mounting groove 12 , and the mounting plate 3 is horizontally mounted on the driving end of the translation driving module 2 .

[0048] One end of the mobile platform 5 is slidably connected to the first guide rail 13, and the other end of the mobile platform 5 is slidably connected to the second guide rail 14. The bottom of the mobile platform 5 is fixedly connected to the mounting plate 3, and a mounting hole is formed in the mobile platform 5 and passes through the mobile platform 5 from top to bottom.

[0049] The rotary drive module 4 is mounted on the mounting plate 3 and is located in the mounting hole, and the driving end of the rotary drive module 4 extends upward out of the mounting hole.

[0050] The wafer carrying platform 6 is horizontally mounted on the driving end of the rotation driving module 4 .

[0051] The translation drive module 2 is used to drive the mounting plate 3 to translate along the first horizontal direction, so as to drive the mobile platform 5 and the wafer carrier 5 to translate synchronously along the first horizontal direction. The rotation drive module 4 is used to drive the wafer carrier 6 to rotate in a horizontal plane.

[0052] The translation drive module 2 and the rotation drive module 4 cooperate to drive the wafer carrier 6 to translate and rotate, thereby achieving position and angle adjustment of the wafer carried on the wafer carrier 6 .

[0053] The wafer bearing mechanism provided in the embodiment of the present application is provided with a mounting groove 12 with an opening facing upward in the mounting portion 11 of the base 1, and the rotary drive module 4 is installed in the mounting groove 12, thereby reducing the height difference between the wafer bearing table 6 and the supporting surfaces on both sides of the mounting portion 11. In this way, when there is an allowable height error between the two supporting surfaces of the mounting portion 11, the height difference between the wafer bearing table 6 and the supporting surfaces on both sides of the mounting portion becomes smaller, thereby reducing the influence of the height error on the surface inclination of the wafer bearing table 6, thereby improving the dicing accuracy. In addition, since the error of the wafer bearing table is reduced, and then the design of slidingly installing the mobile platform on the two supporting surfaces of the mounting portion makes it possible for the wafer dicing machine provided in the present application to be compatible with larger wafer specifications, such as 8 inches, 12 inches, 14 inches, 16 inches and even 20 inches.

[0054] Optionally, the base 1 further includes a first side support portion 15 and a second side support portion 16, wherein: the first side support portion 15 and the second side support portion 16 are arranged along a second horizontal direction (eg Figure 1 The first side support portion 15 and the second side support portion 16 are symmetrically arranged on both sides of the mounting portion 11 in the Y-axis direction, wherein the second horizontal direction is perpendicular to the first horizontal direction. The first side support portion 15 and the second side support portion 16 are used to support a wafer dicing mechanism, which is used to perform dicing on a wafer carried on the wafer carrying table 6.

[0055] By symmetrically arranging the first side support portion and the second side support portion on both sides of the mounting portion, on the one hand, an installation space is provided for the wafer dicing mechanism, and on the other hand, the base is made to have a symmetrical structure, thereby improving the supporting stability of the base to the wafer dicing mechanism and the wafer supporting platform, and reducing the influence of mechanical mounting stress and thermal stress on the base, thereby improving the dicing accuracy.

[0056] Optionally, the mounting portion 11 , the first side supporting portion 15 and the second side supporting portion 16 are integrally formed, which facilitates the manufacture of the base 1 and improves the deformation resistance of the base.

[0057] Optionally, the translation drive module 2 includes a motor, a screw and a screw nut, wherein the screw is connected to the driving end of the motor and extends along the first horizontal direction, the screw nut is screwed on the screw and fixed to the bottom of the mounting plate 3, and when the motor drives the screw to rotate, the screw nut and the mounting plate 3 are driven to translate along the screw. Of course, the translation drive module 2 can also adopt existing linear drive modules of other structures, as long as it can drive the mounting plate to translate along the first horizontal direction.

[0058] Continue to refer Figure 1 As shown, optionally, a first column 7 is provided at the first end of the mounting plate 3, and a second column 8 is provided at the second end of the mounting plate 3, and an escape space for escaping the rotation drive module 4 is formed between the first column 7 and the second column 8. The bottom of the mobile platform 5 is fixedly mounted on the upper ends of the first column 7 and the second column 8. In this way, it can be ensured that the bottom of the rotation drive module 4 is connected to the mounting plate 3. Optionally, two first columns and two second columns are provided, and they are symmetrically arranged at the bottom of the mobile platform in pairs to stably support the mobile platform.

[0059] like Figure 2 As shown, optionally, the rotary drive module 4 includes a rotary motor 41, and a plurality of (eg Figure 2 The mounting plate 3 is provided with a plurality of second mounting holes corresponding to the first mounting holes. The rotating motor 4 is fixed to the mounting plate by bolts 42 passing through the first mounting holes and the corresponding second mounting holes. Such a configuration can ensure the connection strength between the rotating drive module 4 and the mounting plate 3, and facilitate the disassembly and maintenance of the rotating drive module 4. Figure 2 The connecting line of the three first mounting holes forms an isosceles triangle, wherein the first mounting hole corresponding to the vertex angle is fixedly connected to the mounting plate 3, and the two first mounting holes corresponding to the bottom angle are fixedly connected to the mounting plate 3 through tightening bolts. The horizontality of the bearing surface of the rotary drive module is adjusted by respectively adjusting the tightness of the two tightening bolts.

[0060] Optionally, the rotary motor 41 is a DD motor. The DD motor has stable driving and high driving accuracy, thereby improving the angle adjustment accuracy of the wafer carrier 6. In a possible implementation, the rotary motor may include a servo motor, a synchronous pulley and a synchronous belt, and synchronous pulleys are respectively installed at the driving end of the servo motor and the bottom of the wafer carrier, and the two synchronous pulleys are connected by a synchronous belt, thereby achieving the effect of controlling the rotation of the wafer carrier with a servo motor.

[0061] Optionally, adsorption holes for adsorbing the wafer are provided on the bearing surface of the wafer bearing platform 6. In this way, the wafer bearing platform 6 can adsorb and fix the wafer to ensure the dicing effect.

[0062] Continue to refer Figure 1 As shown, the mobile platform 5 is provided with several (such as Figure 1 The four (four) clamping assemblies 9 are circumferentially arranged on the peripheral side of the wafer carrier 6, and the clamping assemblies 9 are used to clamp the wafer carrier.

[0063] After the rotation driving module 4 completes the angle adjustment of the wafer carrier 6, the clamping assembly 9 can realize the clamping and positioning of the wafer carrier 6 to prevent the wafer carrier 6 from accidentally rotating during the dicing process.

[0064] Optionally, the clamping assembly 9 includes a clamping driver and a clamping block, the clamping driver is mounted on the mobile platform 5, the clamping block is connected to the driving end of the clamping driver, and the clamping driver is used to drive the clamping block to move toward or away from the wafer carrier to clamp or release the wafer plate on the wafer carrier 6. In a possible embodiment, the clamping driver is a rotary cylinder or a rotary motor, and the clamping driver drives the clamping block to rotate. When the rotary block rotates to a high position, the wafer plate on the wafer carrier is released; when the rotary block rotates to a low position, the wafer plate on the wafer carrier is clamped.

[0065] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A wafer carrying mechanism, characterized in that: The wafer carrying mechanism includes a base, a translation drive module, a mounting plate, a rotation drive module, a mobile platform and a wafer carrying table, wherein: The base comprises a mounting portion, a mounting groove with an upward opening is arranged in the middle of the mounting portion along a first horizontal direction, two supporting surfaces of the mounting portion are respectively located on two opposite sides of the mounting groove, and a first guide rail and a second guide rail extending along the first horizontal direction are respectively installed on the two supporting surfaces of the mounting portion; The translation driving module is arranged in the installation groove, and the installation plate is horizontally installed on the driving end of the translation driving module; One end of the mobile platform is slidably connected to the first guide rail, the other end of the mobile platform is slidably connected to the second guide rail, the bottom of the mobile platform is fixedly connected to the mounting plate, and a mounting hole is formed in the mobile platform and passes through the mobile platform from top to bottom; The rotary drive module is mounted on the mounting plate and is located in the mounting hole, and the driving end of the rotary drive module extends upwardly out of the mounting hole; The wafer carrier is horizontally mounted on the driving end of the rotation driving module; The translation drive module is used to drive the mounting plate to translate along the first horizontal direction, so as to drive the movable platform and the wafer carrier to translate synchronously along the first horizontal direction; the rotation drive module is used to drive the wafer carrier to rotate in a horizontal plane.

2. The wafer carrying mechanism according to claim 1, characterized in that: The base further comprises a first side support portion and a second side support portion, wherein: The first side support portion and the second side support portion are symmetrically arranged on both sides of the mounting portion along a second horizontal direction, wherein the second horizontal direction is perpendicular to the first horizontal direction; The first side support portion and the second side support portion are used to support a wafer scribing mechanism, and the wafer scribing mechanism is used to scribing the wafer carried on the wafer carrying table.

3. The wafer carrying mechanism according to claim 2, characterized in that: The mounting portion, the first side supporting portion, and the second side supporting portion are integrally formed.

4. The wafer carrying mechanism according to claim 1, characterized in that: The translation drive module includes a motor, a screw and a screw nut, wherein the screw is connected to the driving end of the motor and extends along the first horizontal direction, the screw nut is screwed on the screw and fixed at the bottom of the mounting plate, and when the motor drives the screw to rotate, it drives the screw nut and the mounting plate to translate along the screw.

5. The wafer carrying mechanism according to claim 1, characterized in that: A first column is disposed at the first end of the mounting plate, and a second column is disposed at the second end of the mounting plate, wherein an escape space for evading the rotary drive module is formed between the first column and the second column; The bottom of the mobile platform is fixedly mounted on the upper ends of the first column and the second column.

6. The wafer carrying mechanism according to claim 1, characterized in that: The rotary drive module comprises a rotary motor, and a plurality of first mounting holes are arranged at the bottom of the rotary motor along the circumferential direction; The mounting plate is provided with a plurality of second mounting holes corresponding one to one with the first mounting holes; The rotating electric machine is fixed to the mounting plate via bolts penetrating the first mounting holes and the corresponding second mounting holes.

7. The wafer carrying mechanism according to claim 6, characterized in that: The rotating electric machine is a DD motor.

8. The wafer carrying mechanism according to claim 1, characterized in that: The wafer carrying platform has adsorption holes on its carrying surface for adsorbing wafers.

9. The wafer carrying mechanism according to claim 1, characterized in that: The movable platform is provided with a plurality of clamping assemblies arranged circumferentially on the peripheral side of the wafer carrying platform, and the clamping assemblies are used to clamp the wafer carrying platform.

10. The wafer carrying mechanism according to claim 9, characterized in that: The clamping assembly includes a clamping drive and a clamping block. The clamping drive is installed on the movable platform. The clamping block is connected to the driving end of the clamping drive. The clamping drive is used to drive the clamping block to move toward or away from the wafer carrier to clamp or release the wafer carrier.

Images