Sealed semiconductor chip storage device

Abstract

The utility model relates to the technical field of semiconductors, in particular to a sealed semiconductor chip storage device, which is internally provided with a main box body, a sealing cavity with a forward opening is arranged in the main box body, and a rubber ring is fixedly arranged on the rear wall of the sealing cavity, so that the rubber ring has waterproof and sealing effects; a cover rack is arranged on the front side of the main box body and covers the front end face of the main box body, the rear end face of the cover rack is inserted into the sealing cavity, an air exhaust cavity is formed in the cover rack, a vacuum pump is fixedly arranged on the front end face of the cover rack and covers the air exhaust cavity, and then the vacuum pump plays a role in vacuumizing; the exhaust valve plays a role in exhausting air and facilitating opening of the cover and the rack, so that the semiconductor chip is ensured to be in a vacuum state, the semiconductor chip is further prevented from being in contact with air to be oxidized in the storage process, the performance of the semiconductor chip is protected, and the storage time is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a sealed semiconductor chip storage device. Background Art

[0002] Semiconductors are materials whose electrical conductivity is between that of conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement. For example, diodes are devices made of semiconductors. Semiconductors are materials whose electrical conductivity can be controlled, ranging from that of insulators to conductors.

[0003] During use, most existing semiconductor storage devices store semiconductors alone, which results in water vapor and air entering the interior during the storage process, causing easy oxidation, resulting in the formation of an oxide layer, which damages the electrical performance of the device, resulting in poor practicality of the device. Utility Model Content

[0004] The purpose of the utility model is to provide a sealed semiconductor chip storage device to overcome the above-mentioned defects in the prior art.

[0005] According to the utility model, a sealed semiconductor chip storage device includes a main box body, a sealed cavity opening forward is provided in the main box body, a rubber ring is fixedly provided on the rear wall of the sealed cavity, and the rubber ring plays a role of waterproofing and sealing, a cover frame is provided on the front side of the main box body and covers the front end face of the main box body, the rear end face of the cover frame is inserted into the sealed cavity, an air extraction cavity is provided in the cover frame, a vacuum pump is fixedly provided on the front end face of the cover frame and covers the air extraction cavity, and the vacuum pump plays a role of vacuuming, and an exhaust valve is fixedly provided on the cover frame, and the exhaust valve plays a role of exhausting and facilitating the opening of the cover frame.

[0006] In some embodiments, a controller is fixedly provided on the front end surface of the cover frame, and the controller plays a cooperative role in regulating various movements.

[0007] In some embodiments, a threaded cavity is provided in the main housing, and two groups of threaded sliders with opposite threads and capable of moving toward each other are provided in the threaded cavity. A clamping plate is fixedly provided on the lower end surface of the threaded slider, and a foam plate is fixedly provided on the end surface of the clamping plate close to one side that is symmetrical to each other, so that the foam plate serves to increase the clamping friction.

[0008] In some embodiments, a threaded screw is rotatably provided between the left and right walls of the threaded cavity, the threaded screw is threadably matched with the threaded slider, a threaded motor is fixedly provided in the right wall of the threaded cavity, and the right end face of the threaded screw is dynamically connected to the threaded motor.

[0009] In some embodiments, a storage cavity is provided in the main box body and is interconnected with the threaded cavity, so that the storage cavity serves to store semiconductor chips.

[0010] Compared with the prior art, the advantages of the utility model are:

[0011] 1. The utility model starts by starting a threaded motor, thereby driving the threaded screw to start rotating, and then driving two sets of threaded sliders that are opposite to the threads and can move toward each other to start moving toward each other, thereby driving the clamping plate and the foam plate to start moving toward each other, thereby achieving clamping and fixing of the semiconductor chip, thereby ensuring the stability during subsequent storage and transportation, thereby ensuring the practicality of the device.

[0012] 2. The utility model covers the cover frame by the front side of the main box body. At the same time, the vacuum pump starts to extract the air and water vapor in the threaded cavity and the storage cavity into the exhaust cavity, and then the vacuum pump discharges them to the outside, thereby ensuring that the semiconductor chip is in a vacuum state, further preventing the semiconductor chip from coming into contact with the air and generating oxidation during the storage process, thereby protecting the performance of the semiconductor chip and extending the storage time.

[0013] 3. The utility model is that when the air is discharged, the air in the storage cavity and the threaded cavity is lost, and suction is generated between the main box body and the cover frame. At this time, the cover frame can be taken out to cover the main box body and press the rubber ring, thereby ensuring the waterproof effect of the device, thereby ensuring the protection of the semiconductor chip, and thus ensuring the sealing. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a left view of the utility model;

[0015] Figure 2 It is a left view of the utility model;

[0016] Figure 3 It is a front view of the utility model;

[0017] Figure 4 This utility model Figure 3 Schematic diagram of AA in the middle;

[0018] Figure 5 This utility model Figure 2 Schematic diagram of the middle BB;

[0019] Figure 6 This utility model Figure 4 Schematic diagram of the main box body.

[0020] In the figure:

[0021] 11. Main box body; 12. Sealing chamber; 13. Rubber ring; 14. Cover frame; 15. Threaded chamber; 16. Threaded motor; 17. Threaded screw; 18. Threaded slider; 19. Clamping plate; 20. Foam board; 21. Vacuum pump; 22. Exhaust valve; 23. Storage chamber; 24. Controller; 25. Vacuum chamber. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Embodiment 1

[0024] See also Figure 1-Figure 6 , is the first embodiment of the utility model, which provides an embodiment of a sealed semiconductor chip storage device, including a main box body 11, a sealed cavity 12 opening forward is provided in the main box body 11, a rubber ring 13 is fixedly provided on the rear wall of the sealed cavity 12, and the rubber ring 13 plays a role of waterproofing and sealing, a cover frame 14 is provided on the front side of the main box body 11 and covers the front end face of the main box body 11, the rear end face of the cover frame 14 is inserted into the sealed cavity 12, a vacuum cavity 25 is provided in the cover frame 14, a vacuum pump 21 is fixedly provided on the front end face of the cover frame 14 and covers the vacuum cavity 25, and the vacuum pump 21 plays a role of vacuuming, an exhaust valve 22 is fixedly provided on the cover frame 14, and the exhaust valve 22 plays a role of exhausting and facilitating the opening of the cover frame 14.

[0025] A controller 24 is fixedly disposed on the front end surface of the cover frame 14, and the controller 24 plays a role in regulating various movements.

[0026] A threaded cavity 15 is provided in the main box body 11, and two groups of threaded sliders 18 with opposite threads and capable of moving toward each other are provided in the threaded cavity 15. A clamping plate 19 is fixedly provided on the lower end surface of the threaded slider 18, and a foam plate 20 is fixedly provided on the end surface of the clamping plate 19 close to one side that is symmetrical to each other, so that the foam plate 20 serves to increase the clamping friction.

[0027] A threaded screw 17 is rotatably provided between the left and right walls of the threaded cavity 15 , and the threaded screw 17 is threadedly matched with the threaded slider 18 . A threaded motor 16 is fixedly provided in the right wall of the threaded cavity 15 , and the right end face of the threaded screw 17 is dynamically connected to the threaded motor 16 .

[0028] The main housing 11 is provided with a storage cavity 23 which is in communication with the threaded cavity 15 , so that the storage cavity 23 serves to store semiconductor chips.

[0029] Specific workflow:

[0030] When in use, the semiconductor chip to be stored is placed in the storage cavity 23 and between the foam plates 20 on the left and right sides. At this time, according to the length of the semiconductor chip, the threaded motor 16 starts to start, thereby driving the threaded screw 17 to start rotating, and then driving the two sets of threaded sliders 18 with opposite threads and capable of moving toward each other to start moving toward each other, thereby driving the clamping plate 19 and the foam plate 20 to start moving toward each other, thereby achieving the clamping and fixation of the semiconductor chip.

[0031] At this time, the cover frame 14 is covered on the front side of the main box body 11. At the same time, the vacuum pump 21 starts to start, thereby extracting the air and water vapor in the threaded cavity 15 and the storage cavity 23 into the exhaust cavity 25, and then the vacuum pump 21 discharges them to the outside, thereby ensuring that the semiconductor chip is in a vacuum state.

[0032] And because of the above-mentioned exhaust of air, the air in the storage chamber 23 and the threaded chamber 15 is lost at this time, and suction is generated between the main box body 11 and the cover frame 14. At this time, the cover frame 14 is taken out to cover the main box body 11 and achieve compression of the rubber ring 13, thereby ensuring that the waterproof effect of the device can be achieved.

[0033] The above description is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A sealed semiconductor chip storage device, comprising a main box (11), characterized in that: The main box body (11) is provided with a sealed cavity (12) opening forward, a rubber ring (13) is fixedly provided on the rear wall of the sealed cavity (12), a cover frame (14) is provided on the front side of the main box body (11) and covers the front end surface of the main box body (11), the rear end surface of the cover frame (14) is inserted into the sealed cavity (12), and an air extraction cavity (25) is provided in the cover frame (14); A vacuum pump (21) is fixedly provided on the front end surface of the cover frame (14) and covers the air extraction cavity (25); an exhaust valve (22) is fixedly provided on the cover frame (14).

2. The sealed semiconductor chip storage device according to claim 1, characterized in that: A controller (24) is fixedly provided on the front end surface of the cover frame (14).

3. The sealed semiconductor chip storage device according to claim 1, characterized in that: A threaded cavity (15) is provided in the main box body (11), and two groups of threaded sliders (18) with opposite threads and capable of moving toward each other are provided in the threaded cavity (15). A clamping plate (19) is fixedly provided on the lower end surface of the threaded slider (18), and a foam plate (20) is fixedly provided on the end surface of one side of the clamping plate (19) that is close to being symmetrical to each other.

4. The sealed semiconductor chip storage device according to claim 3, characterized in that: A threaded screw (17) is rotatably provided between the left and right walls of the threaded cavity (15), the threaded screw (17) is threadably matched with the threaded slider (18), a threaded motor (16) is fixedly provided in the right wall of the threaded cavity (15), and the right end surface of the threaded screw (17) is dynamically connected to the threaded motor (16).

5. The sealed semiconductor chip storage device according to claim 3, characterized in that: A storage cavity (23) is provided in the main box body (11) and is in communication with the threaded cavity (15).

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