Laser packaging structure

Abstract

The utility model relates to a laser packaging structure, which comprises an optical regulation and control heat sink platform and a shell, the optical regulation and control heat sink platform comprises a chip assembly area and an optical modulation area, a heat sink is fixedly arranged on the left side of the optical modulation area and at the top of the chip assembly area, and a laser chip is fixedly arranged on the top of the heat sink. According to the laser packaging structure, an optical regulation and control heat sink platform is arranged to be a chip assembling area and an optical modulation area, the thickness of the optical modulation area is larger than the length of the chip assembling area, the chip assembling area provides the installation position of a heat sink, and the height b of the optical modulation area is larger than the thickness c of the heat sink and smaller than the sum of the thickness (c + d) of the heat sink and the thickness (c + d) of a laser chip. Therefore, the optical modulation area can selectively shield the light-emitting cavity surface of the laser chip without influencing normal light emitting of the laser chip, the influence of an invalid light-emitting area on the light-emitting surface of the laser is reduced, and the light beam quality of the laser is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a laser packaging structure. Background Art

[0002] The packaging of semiconductor chips has the functions of protection, support, connection, heat dissipation and reliability. Only strict working environment control, good support and fixation to facilitate circuit connection and mechanical protection of the appearance, enhanced heat dissipation and other measures can ensure the stability and service life of the chip. Therefore, packaging plays an important role in semiconductor chips. Semiconductor chip packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, and different chip types have great particularity. Semiconductor laser packaging completes the output of electrical signals, protects the normal operation of the chip, and finally outputs the laser function. It has both electrical interconnection and chip protection, as well as optical output design and technical requirements. It is impossible to simply use discrete device packaging for semiconductor lasers.

[0003] Due to the expansion of the laser spot area caused by the waveguide limitation effect of the laser light output surface cavity mask and the light leakage phenomenon of the epitaxial structure, the beam quality is seriously degraded. The platform of the fixed heat sink used in the existing packaging laser technology mainly tends to be flat in design and does not involve optical structure design. There is no good solution to the problem of degraded beam quality of cavity surface luminescence caused by the high reflectivity of the laser light output cavity surface and the leakage mode of the epitaxial structure. Utility Model Content

[0004] In view of the shortcomings of the prior art, the utility model provides a laser packaging structure, which innovatively designs a novel structure with optical regulation function for the platform used to fix the heat sink in the existing packaging laser technology, so that the problem of output light beam degradation caused by laser cavity surface emission is smoothly solved, and the preparation of the new structure is compatible with the existing processing technology and has high implementation feasibility.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a laser packaging structure, comprising an optically controlled heat sink platform and a housing, wherein the optically controlled heat sink platform comprises a chip mounting area and an optical modulation area, a heat sink is fixedly installed on the left side of the optical modulation area and located on the top of the chip mounting area, and a laser chip is fixedly installed on the top of the heat sink;

[0006] The shell comprises a bracket, electrode pins and a protective shell.

[0007] Furthermore, the chip assembly area and the optical modulation area of ​​the optical control heat sink platform are formed by stamping or bending.

[0008] Furthermore, the material of the optically controllable heat sink platform is a visible light absorbing material, and copper or the like is preferably used for the 380nm-530nm band, which can further enhance the optical control capability.

[0009] Furthermore, the thickness of the optical modulation area is smaller than the length of the chip mounting area, the width of the optical modulation area is the same as the thickness of the chip mounting area, and the width of the optical modulation area is a.

[0010] Furthermore, the length of the chip mounting area is greater than the length of the heat sink, the thickness b of the optical modulation area is greater than the thickness c of the heat sink and less than the sum of the thickness (c+d) of the heat sink and the laser chip, and the distance between the end point of the optical modulation area near the laser chip and the light emitting surface of the laser chip is ≤ (c+db) / tanθ ⊥ -a, θ ⊥ is the fast axis divergence half angle, b is the thickness of the optical modulation area, c is the thickness of the heat sink, and d is the thickness of the laser chip, which can ensure that the height of the optical modulation area does not block the outgoing light.

[0011] Furthermore, there is a distance e between the optical modulation area and the laser chip, and the distance e is 10 μm-50 μm.

[0012] Furthermore, the optically controlled heat sink platform is adapted to TO packaging and plastic packaging.

[0013] Compared with the prior art, the utility model provides a laser packaging structure, which has the following beneficial effects:

[0014] 1. The laser packaging structure is provided by setting the optical control heat sink platform as a chip assembly area and an optical modulation area, the thickness of the optical modulation area is less than the length of the chip assembly area, the chip assembly area provides a heat sink installation position, and the thickness b of the optical modulation area is greater than the thickness c of the heat sink and less than the sum of the thickness (c+d) of the heat sink and the laser chip, and the distance between the end point of the optical modulation area near the laser chip and the light-emitting surface of the laser chip is ≤ (c+db) / tanθ ⊥ -a, θ ⊥ The fast axis divergence half angle enables the optical modulation area to selectively block the light-emitting cavity surface of the laser chip without affecting the normal light emission of the laser chip, thereby reducing the influence of the invalid light-emitting area of ​​the laser light-emitting surface and improving the output beam quality of the laser.

[0015] 2. The laser packaging structure uses a stamping or bending process to process the optical control heat sink platform into a combination of a chip assembly area and an optical modulation area. The processing method is simple and easy to promote and use. By setting a spacing e between the optical modulation area and the laser chip, the optical modulation area can be prevented from contacting the light output cavity surface of the laser chip, thereby improving the stability of the device.

[0016] 3. The optical control heat sink platform material can be processed by selecting the corresponding absorption material according to the wavelength of the output laser, which can further improve the optical control ability. It can not only realize the luminescence of the invalid area of ​​the cavity surface by spatial shielding, but also be an excellent light absorber in the output laser band, further increasing the optical control effect and improving the quality of the output laser beam. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a structural cross-sectional view of the optically controlled heat sink platform of the utility model;

[0018] Figure 2 It is a schematic diagram of the fast axis divergence of the emitted light packaged by the utility model;

[0019] Figure 3 This is a schematic diagram of the light emitted by the light-emitting surface film of a conventionally packaged laser;

[0020] Figure 4 This is a schematic diagram of light emission from the light-emitting surface film of the laser packaged in the utility model;

[0021] Figure 5 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;

[0022] Figure 6 This is a schematic diagram of the structure of Example 2 of the utility model.

[0023] In the figure: 1 optical control heat sink platform, 11 chip assembly area, 12 optical modulation area, 2 heat sink, 3 laser chip, 4 housing, 41 bracket, 42 electrode pin, 43 protective shell. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] TO package, please refer to Figure 1-3 and Figure 4 A laser packaging structure includes an optically regulated heat sink platform 1 and a housing 4. The optically regulated heat sink platform 1 includes a chip mounting area 11 and an optical modulation area 12. A heat sink 2 is fixedly installed on the left side of the optical modulation area 12 and located on the top of the chip mounting area 11. A laser chip 3 is fixedly installed on the top of the heat sink 2.

[0026] The housing 4 includes a bracket 41 , electrode pins 42 and a protective shell 43 .

[0027] In this embodiment, the chip mounting area 11 and the optical modulation area 12 of the optical control heat sink platform 1 are formed by bending.

[0028] In this embodiment, the lasing wavelength of the laser chip 3 is 450 nm, and the optical control heat sink platform 1 is made of copper material, which is an excellent absorber of blue light.

[0029] In this embodiment, the thickness of the optical modulation area 12 is smaller than the length of the chip mounting area 11 , the width of the optical modulation area 12 is the same as the thickness of the chip mounting area 11 , and the width a of the optical modulation area 12 is 300 μm.

[0030] In this embodiment, the length of the chip mounting area 11 is greater than the length of the heat sink 2, and the chip mounting area 11 can provide an installation position for the heat sink 2. The thickness b of the optical modulation area 12 is greater than the thickness c of the heat sink 2 and less than the sum of the thicknesses (c+d) of the heat sink 2 and the laser chip 3, b is 300 μm, c is 300 μm, d is 100 μm, and the distance between the end point of the optical modulation area 12 near the laser chip 3 and the light emitting surface of the laser chip 3 is ≤267 μm, and the fast axis divergence half angle θ is ⊥ =10°, ensuring that the height of the optical modulation area does not block the outgoing light.

[0031] In this embodiment, there is a distance e between the optical modulation area 12 and the laser chip 3, and the distance e is 50 μm.

[0032] In this embodiment, a light emitting surface mask is arranged on the right side of the laser chip 3, and the emitted light is emitted in a direction parallel to the light emitting surface mask.

[0033] In this embodiment, the housing 4 is a TO package housing.

[0034] Embodiment 2:

[0035] Plastic package, please refer to Figure 1-3 and Figure 5 A laser packaging structure includes an optically regulated heat sink platform 1 and a housing 4. The optically regulated heat sink platform 1 includes a chip mounting area 11 and an optical modulation area 12. A heat sink 2 is fixedly installed on the left side of the optical modulation area 12 and located on the top of the chip mounting area 11. A laser chip 3 is fixedly installed on the top of the heat sink 2.

[0036] The housing 4 includes a bracket 41 , electrode pins 42 and a protective shell 43 .

[0037] In this embodiment, the chip mounting area 11 and the optical modulation area 12 of the optical control heat sink platform 1 are formed by stamping.

[0038] In this embodiment, the lasing wavelength of the laser chip 3 is 510 nm, and the optical control heat sink platform 1 is made of iron material, which is an excellent absorber of green light.

[0039] In this embodiment, the thickness of the optical modulation area 12 is smaller than the length of the chip mounting area 11 , the width of the optical modulation area 12 is the same as the thickness of the chip mounting area 11 , and the width a of the optical modulation area 12 is 400 μm.

[0040] In this embodiment, the length of the chip mounting area 11 is greater than the length of the heat sink 2, and the chip mounting area 11 can provide an installation position for the heat sink 2. The thickness b of the optical modulation area 12 is greater than the thickness c of the heat sink 2 and less than the sum of the thickness (c+d) of the heat sink 2 and the laser chip 3, b is 300 μm, c is 300 μm, d is 90 μm, and the distance between the end point of the optical modulation area 12 near the laser chip 3 and the light emitting surface of the laser chip 3 is ≤110 μm, and the fast axis divergence half angle θ is ⊥ =10°, ensuring that the height of the optical modulation area does not block the outgoing light.

[0041] In this embodiment, there is a distance e between the optical modulation area 12 and the laser chip 3, and the distance e is 10 μm.

[0042] In this embodiment, the housing 4 is a plastic-encapsulated housing.

[0043] The beneficial effects of the above embodiments are:

[0044] The laser packaging structure is provided by setting the optically controlled heat sink platform 1 as a chip mounting area 11 and an optical modulation area 12, wherein the thickness of the optical modulation area 12 is less than the length of the chip mounting area 11, the chip mounting area 11 provides a mounting position for the heat sink 2, and the thickness b of the optical modulation area 12 is greater than the thickness c of the heat sink 2 and less than the sum of the thickness (c+d) of the heat sink 2 and the laser chip 3, so that the distance between the end point of the optical modulation area near the laser chip and the light-emitting surface of the laser chip is ≤(c+db) / tanθ ⊥ -a, θ ⊥ The fast axis divergence half angle enables the optical modulation area 12 to selectively block the light-emitting cavity surface of the laser chip 3 without affecting the normal light emission of the laser chip, thereby reducing the influence of the invalid light-emitting area of ​​the laser light-emitting surface and improving the quality of the laser light beam.

[0045] The laser packaging structure uses a stamping or bending process to process the optical control heat sink platform 1 into a combination of a chip assembly area 11 and an optical modulation area 12. The processing method is simple and easy to promote and use. By setting a spacing e between the optical modulation area 12 and the laser chip 3, and 10μm≤e≤50μm, the optical modulation area 12 can be prevented from contacting the light output cavity surface of the laser chip 3, thereby improving the stability of the device.

[0046] The laser packaging structure and the optical control heat sink platform material can select the corresponding absorption material for processing according to the wavelength of the output laser, so as to further improve the optical control capability. It can not only realize the luminescence of the invalid area of ​​the cavity surface by spatially shielding, but also be an excellent light absorber of the output laser band, further increasing the optical control effect and improving the quality of the output laser beam.

[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A laser packaging structure, comprising an optically controlled heat sink platform (1) and a housing (4), characterized in that: The optically controlled heat sink platform (1) comprises a chip assembly area (11) and an optical modulation area (12); a heat sink (2) is fixedly mounted on the left side of the optical modulation area (12) and located on the top of the chip assembly area (11); and a laser chip (3) is fixedly mounted on the top of the heat sink (2); The housing (4) comprises a bracket (41), electrode pins (42) and a protective shell (43).

2. A laser packaging structure according to claim 1, characterized in that: The chip assembly area (11) and the optical modulation area (12) of the optical regulation heat sink platform (1) are formed by stamping or bending.

3. The laser packaging structure according to claim 1, characterized in that: The material of the optically controlled heat sink platform (1) is a visible light absorbing material.

4. The laser packaging structure according to claim 1, characterized in that: The thickness of the optical modulation area (12) is smaller than the length of the chip mounting area (11), the width of the optical modulation area (12) is the same as the thickness of the chip mounting area (11), and the width of the optical modulation area (12) is a.

5. The laser packaging structure according to claim 1, characterized in that: The length of the chip mounting area (11) is greater than the length of the heat sink (2), the thickness of the optical modulation area (12) is greater than the thickness of the heat sink (2) and less than the sum of the thicknesses of the heat sink (2) and the laser chip (3), and the distance between the end point of the optical modulation area (12) near the laser chip (3) and the light emitting surface of the laser chip (3) is ≤ (c+db) / tanθ ⊥ -a, θ ⊥ is the fast axis divergence half angle, b is the thickness of the optical modulation region (12), c is the thickness of the heat sink (2), and d is the thickness of the laser chip (3).

6. The laser packaging structure according to claim 1, characterized in that: There is a distance between the optical modulation area (12) and the laser chip (3), and the distance is 10 μm-50 μm.

7. The laser packaging structure according to claim 1, characterized in that: The optically controlled heat sink platform (1) is adapted for TO packaging and plastic packaging.

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