Electroplating device for circuit board processing

Abstract

The utility model relates to the technical field of circuit board electroplating, and discloses an electroplating device for circuit board processing, which comprises an electroplating box with an opening at the top, a liftable mounting plate is arranged at the top of the electroplating box, and a fixing frame with an inverted U-shaped structure is arranged at the bottom of the mounting plate. The mounting plate is provided with a shaking mechanism used for enabling the fixing frame to move up and down in a reciprocating mode, and the fixing frame is provided with a clamping assembly used for fixing a circuit board. Under the action of the shaking mechanism, the fixing frame can move up and down in the electroplate liquid in a reciprocating manner, and the circuit board can continuously move up and down in the electroplate liquid, so that the electroplate liquid can uniformly cover the surface of the whole circuit board, the phenomenon of non-uniform covering is avoided, and the service life of the circuit board is prolonged. And up-down continuous shaking can help to break surface tension, reduce generation of bubbles in the electroplating liquid and promote contact between the electroplating liquid and the surface of the circuit board.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board electroplating, in particular to an electroplating device for processing circuit boards. Background Art

[0002] The electroplating of circuit boards is a process in which the circuit boards are immersed in a plating solution and the metal ions are deposited from the plating solution onto the surface of the circuit boards to form a metal film using an electric current. During the electroplating process, the circuit boards are placed in a plating tank containing a salt solution of the desired metal. By applying an electric current to the surface of the circuit boards, metal ions are deposited from the electrolyte onto the surface of the circuit boards to form a uniform metal film, thereby achieving surface metallization. This metallization treatment can improve the conductivity, corrosion resistance and welding performance of the circuit boards, making them suitable for the installation and connection of electronic components.

[0003] However, the electroplating method of immersing the circuit board in the plating solution is likely to cause uneven coverage for circuit boards with complex surface shapes or fine structures. In addition, there are easily some bubbles in the plating solution, making it difficult for the plating solution to evenly cover the surface of the circuit board. Therefore, it is necessary to design an electroplating device for circuit board processing to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide an electroplating device for processing a circuit board, which is used to solve the technical problems raised in the above-mentioned background technology.

[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a plating device for processing circuit boards, comprising a plating box with an open top, a liftable mounting plate is arranged on the top of the plating box, a fixing frame with an inverted concave structure is arranged at the bottom of the mounting plate, and a shaking mechanism for making the fixing frame move up and down is arranged on the mounting plate, and a clamping assembly for fixing the circuit board is arranged on the fixing frame.

[0006] Preferably, the inner wall of the fixing frame is fixedly connected to two left-right symmetrical fixing plates along its height direction, and the clamping assembly includes four symmetrical guide rods fixedly connected to the front side of the fixing frame, and a clamping frame with an inverted concave structure is slidably sleeved on the four guide rods, and the fixing frame has a moving assembly for moving the clamping frame forward and backward.

[0007] Preferably, the moving assembly includes a threaded rod rotatably connected to the front side of the fixing frame via a bearing, and the threaded rod is connected to the top of the clamping frame via threaded engagement, and a handle is fixedly connected to the side of the threaded rod away from the fixing frame.

[0008] Preferably, the top of the fixing frame is fixedly connected to two fixing rods which are symmetrical on both sides and are interlaced with the mounting plate, both fixing rods are sleeved with springs located between the mounting plate and the fixing frame, and the tops of the two fixing rods are fixedly connected to limit blocks that abut against the top surface of the mounting plate.

[0009] Preferably, the shaking mechanism includes a bracket fixedly connected to the back of the mounting plate, a motor is fixedly mounted on the bracket, a cam is fixedly connected to the end of the output shaft of the motor, and the top of the inner wall of the fixing bracket abuts against the surface of the cam.

[0010] Preferably, a mounting frame in an inverted L-shaped structure is fixedly connected to the back of the electroplating box, a servo electric cylinder with a piston rod facing downward is fixedly installed on the top of the mounting frame, and the end of the piston rod of the servo electric cylinder is fixedly connected to the top of the mounting plate.

[0011] Compared with the prior art, the technical solution provided by the utility model has the following beneficial effects:

[0012] The utility model can make the fixing frame move up and down reciprocatingly in the electroplating liquid under the action of the shaking mechanism, and make the circuit board move up and down continuously in the electroplating liquid, which helps to ensure that the electroplating liquid evenly covers the entire surface of the circuit board, thereby avoiding the phenomenon of uneven coverage, and the continuous shaking up and down can help break the surface tension, reduce the generation of bubbles in the electroplating liquid, and promote the contact between the electroplating liquid and the surface of the circuit board, especially for the circuit board with complex shape or small structure, it will have a better covering effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0014] Figure 2 It is another three-dimensional structural schematic diagram of the utility model;

[0015] Figure 3 It is a schematic diagram of the partial structure disassembly of the utility model;

[0016] Figure 4 This is a schematic diagram of the use state of the utility model;

[0017] In the figure: 1. electroplating box; 2. mounting plate; 3. fixing frame; 4. clamping assembly; 41. fixing plate; 42. guide rod; 43. clamping frame; 44. threaded rod; 45. handle; 5. fixing rod; 6. spring; 7. limit block; 8. motor; 9. cam; 10. mounting frame; 11. servo electric cylinder. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0019] Obviously, many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0020] See also Figure 1-4 The utility model provides an electroplating device for processing circuit boards, comprising an electroplating box 1 with an opening at the top, wherein the electroplating box 1 stores electroplating liquid, wherein a lifting mounting plate 2 is arranged on the top of the electroplating box 1, wherein a fixing frame 3 in an inverted concave-shaped structure is arranged at the bottom of the fixing plate 2, and a shaking mechanism for making the fixing frame 3 move up and down is arranged on the fixing plate 2, and a clamping assembly 4 for fixing the circuit board is arranged on the fixing frame 3. Through such a design, after the circuit board is fixed on the fixing frame 3 by the clamping assembly 4, the circuit board can be lifted up when the fixing plate 2 is lowered. The circuit board descends and is immersed in the plating liquid in the plating box 1. At this time, the fixing frame 3 can move up and down reciprocatingly in the plating liquid under the action of the shaking mechanism, and the circuit board can continuously move up and down in the plating liquid, which helps to ensure that the plating liquid evenly covers the entire surface of the circuit board, thereby avoiding uneven coverage. The continuous up and down shaking can help break the surface tension, reduce the generation of bubbles in the plating liquid, and promote the contact between the plating liquid and the surface of the circuit board, especially for circuit boards with complex shapes or small structures, which will have a better coverage effect.

[0021] In order to fix the circuit board on the fixing frame 3, in some embodiments, it is proposed that the inner wall of the fixing frame 3 is fixedly connected to two left-right symmetrical fixing plates 41 along its height direction, and the clamping assembly 4 includes four symmetrical guide rods 42 fixedly connected to the front side of the fixing frame 3, and a clamping frame 43 with an inverted concave structure is slidably sleeved on the four guide rods 42, and the fixing frame 3 has a moving assembly for moving the clamping frame 43 back and forth. In this way, after the circuit board is inserted between the fixing frame 3 and the clamping frame 43 from the side, the two sides of the circuit board can be located between the clamping frame 43 and the corresponding fixing plate 41, and the moving assembly can make the clamping frame 43 move toward the direction of the fixing frame 3, and use the clamping frame 43 to press the two sides of the circuit board against the corresponding fixing plate 41, so as to achieve the purpose of fixing the circuit board.

[0022] The specific manner in which the clamping frame 43 can move forward and backward is as follows: the moving assembly includes a threaded rod 44 rotatably connected to the front face of the fixing frame 3 through a bearing, and the threaded rod 44 is inserted and connected to the top of the clamping frame 43 through threaded cooperation, and a handle 45 is fixedly connected to the side of the threaded rod 44 away from the fixing frame 3. The staff can rotate the handle 45 by hand, so that the threaded rod 44 can drive the clamping frame 43 to move forward and backward along the axial direction of the guide rod 42 through threaded cooperation, and achieve the effect of clamping / releasing the circuit board.

[0023] Specifically, two left-right symmetrical fixing rods 5 which are inserted and connected to the mounting plate 2 are fixedly connected to the top of the fixing frame 3, and the two fixing rods 5 are both sleeved with springs 6 located between the mounting plate 2 and the fixing frame 3, and the tops of the two fixing rods 5 are both fixedly connected with limit blocks 7 which abut against the top surface of the mounting plate 2, so that the fixing frame 3 can form an elastic connection with the bottom of the mounting plate 2.

[0024] At the same time, the shaking mechanism includes a bracket fixedly connected to the back of the mounting plate 2, on which a motor 8 is fixedly mounted, and a cam 9 is fixedly connected to the end of the output shaft of the motor 8, and the top of the inner wall of the fixing frame 3 abuts against the surface of the cam 9. When the output shaft of the motor 8 rotates, the cam 9 can be driven to rotate, and the fixing frame 3 will always be close to the surface of the cam 9 under the elastic action of the spring 6, so that the fixing frame 3 can move up and down reciprocatingly following the rotation of the cam 9, and realize the up and down shaking of the circuit board in the electroplating solution.

[0025] It should be noted that an inverted L-shaped mounting frame 10 is fixedly connected to the back of the electroplating box 1, and a servo electric cylinder 11 with a piston rod facing downward is fixedly installed on the top of the mounting frame 10. The end of the piston rod of the servo electric cylinder 11 is fixedly connected to the top of the mounting plate 2. The mounting plate 2 can be driven up and down by the extension and retraction of the piston rod of the servo electric cylinder 11, so that the circuit board can be delivered into the electroplating box 1 for covering with the electroplating liquid. Such a design will be more reasonable.

[0026] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, and these simple modifications all belong to the protection scope of the present invention.

[0027] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present utility model will not further describe various possible combinations.

[0028] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. An electroplating device for processing circuit boards, comprising an electroplating box (1) with an opening at the top, characterized in that: The top of the electroplating box (1) is provided with a lifting mounting plate (2), the bottom of the mounting plate (2) is provided with a fixing frame (3) in the shape of an inverted concave letter, and the mounting plate (2) is provided with a shaking mechanism for enabling the fixing frame (3) to move up and down reciprocatingly, and the fixing frame (3) is provided with a clamping assembly (4) for fixing a circuit board.

2. The electroplating device for circuit board processing according to claim 1, characterized in that: The inner wall of the fixing frame (3) is fixedly connected to two left-right symmetrical fixing plates (41) along its height direction. The clamping assembly (4) comprises four symmetrical guide rods (42) fixedly connected to the front face of the fixing frame (3). A clamping frame (43) in an inverted concave structure is slidably sleeved on the four guide rods (42). The fixing frame (3) is provided with a moving assembly for moving the clamping frame (43) forward and backward.

3. The electroplating device for circuit board processing according to claim 2, characterized in that: The moving assembly comprises a threaded rod (44) rotatably connected to the front of the fixing frame (3) via a bearing, and the threaded rod (44) is connected to the top of the clamping frame (43) through threaded engagement, and a handle (45) is fixedly connected to the side of the threaded rod (44) away from the fixing frame (3).

4. The electroplating device for circuit board processing according to claim 1, characterized in that: The top of the fixing frame (3) is fixedly connected to two fixing rods (5) which are symmetrical and inserted into the mounting plate (2); the two fixing rods (5) are sleeved with springs (6) located between the mounting plate (2) and the fixing frame (3); and the tops of the two fixing rods (5) are fixedly connected to limit blocks (7) which abut against the top surface of the mounting plate (2).

5. The electroplating device for processing a circuit board according to claim 4, characterized in that: The shaking mechanism comprises a bracket fixedly connected to the back of the mounting plate (2), a motor (8) fixedly mounted on the bracket, a cam (9) fixedly connected to the end of the output shaft of the motor (8), and the top of the inner wall of the fixing frame (3) abuts against the surface of the cam (9).

6. The electroplating device for circuit board processing according to claim 1, characterized in that: The back of the electroplating box (1) is fixedly connected to a mounting frame (10) in an inverted L-shaped structure, and the top of the mounting frame (10) is fixedly installed with a servo electric cylinder (11) with a piston rod facing downward, and the end of the piston rod of the servo electric cylinder (11) is fixedly connected to the top of the mounting plate (2).

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