Sensor damping structure and inertial measurement unit

Abstract

The embodiment of the utility model provides a sensor damping structure and an inertial measurement unit, and relates to the technical field of sensor application. The sensor vibration reduction structure comprises a main control circuit board assembly, a sensor circuit board assembly, a vibration reduction module, a bottom cover and a box body. The vibration reduction module is in contact with the bottom cover and the box body, the sensor circuit board assembly is installed on the vibration reduction module, the main control circuit board assembly is installed on the box body, the box body is connected with the bottom cover, and the sensor circuit board assembly is in electrical communication connection with the main control circuit board assembly. Under the action of the vibration reduction module, the vibration conducted to the sensor circuit board assembly by the bottom cover or the box body is reduced, so that the influence of the vibration on the sensor is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of sensor application, and in particular to a sensor vibration reduction structure and an inertial measurement unit. Background Art

[0002] In some sensor application scenarios, vibration can affect the performance of the sensor, such as the Inertial Measurement Unit (IMU). The IMU is used to measure the motion posture, angular velocity, and acceleration of the carrier. The IMU contains a Micro-Electro-Mechanical System (MEMS), which receives information about external posture changes.

[0003] However, MEMS chips will be disturbed by external stress, such as stress caused by temperature change, stress caused by screw torque, stress caused by vibration deformation, etc.

[0004] How to reduce the impact of vibration on the sensor is a technical problem to be solved in this application. Utility Model Content

[0005] The purpose of the present application is to provide a sensor vibration reduction structure and an inertial measurement unit to reduce the impact of vibration on the sensor.

[0006] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions.

[0007] In a first aspect, an embodiment of the present application provides a sensor vibration reduction structure, including a main control circuit board assembly, a sensor circuit board assembly, a vibration reduction module, a bottom cover and a box body.

[0008] The vibration reduction module is in contact with the bottom cover and the box body respectively, the sensor circuit board assembly is installed on the vibration reduction module, the main control circuit board assembly is installed on the box body, the box body and the bottom cover are connected, and the sensor circuit board assembly is electrically communicated with the main control circuit board assembly; the vibration reduction module is used to reduce the vibration transmitted from the bottom cover or the box body to the sensor circuit board assembly.

[0009] Compared with the prior art, this application has the following beneficial effects:

[0010] In the sensor vibration reduction structure provided in the embodiment of the present application, under the action of the vibration reduction module, the vibration transmitted from the bottom cover or the box body to the sensor circuit board assembly is reduced, thereby reducing the impact of the vibration on the sensor.

[0011] Optionally, the vibration reduction module includes a vibration reduction pad and a carrier plate, the vibration reduction pad is in contact with the bottom cover and the box body respectively, and the carrier plate is mounted on the vibration reduction pad.

[0012] Optionally, at least four corners of the carrier plate are mounted on the vibration-damping pads. The four corners can make the carrier plate more stably mounted.

[0013] Optionally, the carrier plate can be designed to be rectangular, and the four corners of the carrier plate are then mounted on the vibration-damping pads to form a symmetrical vibration-damping method to avoid factors such as directional tilt and asymmetric vibration.

[0014] Optionally, the vibration damping pad comprises three layers from bottom to top.

[0015] The bottom surface of the first layer is connected to the bottom cover, and the upper surface of the first layer, the side surface of the second layer and the lower surface of the third layer form a receiving space to accommodate a corner of the carrier board, and the top view of the receiving space is L-shaped.

[0016] The upper surface of the first layer contacts the lower surface of the carrier plate, the lower surface of the third layer contacts the upper surface of the carrier plate, the side surface of the second layer contacts the edge of the carrier plate, and the vibration damping pad has a certain amount of extrusion.

[0017] The three layers can make the upper and lower surfaces of the carrier plate both be subjected to contact positioning or compression, thereby stabilizing the carrier plate.

[0018] Optionally, in the horizontal direction, the side surface of the vibration-damping pad is squeezed by the carrier plate and the box body; in the vertical direction, the bottom surface and the upper surface of the vibration-damping pad are squeezed by the box body and the bottom cover. Through this squeezing method, the vibration-damping pad is more firmly fixed, and the tight state improves the vibration-damping effect.

[0019] Optionally, the compression amount of the vibration damping pad in the horizontal and vertical directions is consistent to avoid bending moment torque during vibration.

[0020] Optionally, the carrier includes a bottom plate and a vertical plate, and the vertical plate is perpendicular to the bottom plate, so that two mutually perpendicular sensor circuit board assemblies can be installed.

[0021] The number of the sensor circuit board assemblies is 2, one sensor circuit board assembly is installed on the base plate, and the other sensor circuit board assembly is installed on the vertical plate; one sensor circuit board assembly is used to collect horizontal acceleration, and the other sensor circuit board assembly is used to collect gravity acceleration.

[0022] Optionally, the main control circuit board assembly is mounted on the top surface of the box body, thereby reducing the occupied area of ​​the bottom surface of the entire sensor vibration reduction structure.

[0023] Optionally, the sensor vibration reduction structure further comprises a flexible flat cable, and the sensor circuit board assembly is electrically connected to the main control circuit board assembly via the flexible flat cable. The flexible flat cable does not transmit vibration, thereby preventing the vibration that may be generated by the main control circuit board assembly from affecting the sensor circuit board assembly.

[0024] In a second aspect, an embodiment of the present application provides an inertial measurement unit, including the sensor vibration reduction structure of the first aspect, wherein the sensor circuit board assembly includes a MEMS chip. Due to the vibration reduction effect of the sensor vibration reduction structure, the MEMS chip is less affected by vibration, thereby increasing the accuracy of the entire inertial measurement unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of a sensor vibration reduction structure provided in an embodiment of the present application;

[0027] Figure 2 A vibration reduction module provided in an embodiment of the present application includes a vibration reduction pad and a sensor vibration reduction structure schematic diagram of a carrier plate;

[0028] Figure 3 A schematic top view of a carrier plate provided in an embodiment of the present application with four corners mounted on a vibration damping pad;

[0029] Figure 4 A schematic diagram of a three-layer structure of a vibration damping pad provided in an embodiment of the present application;

[0030] Figure 5 A three-dimensional schematic diagram of a sensor vibration reduction structure provided in an embodiment of the present application;

[0031] Figure 6 A schematic diagram of a carrier structure provided in an embodiment of the present application.

[0032] Description of reference numerals:

[0033] 11 Main control circuit board assembly

[0034] 12 Sensor PCB Assembly

[0035] 121 Horizontal Circuit Board

[0036] 122 Level sensor

[0037] 123 vertical circuit board

[0038] 124 Vertical sensor

[0039] 13 Vibration reduction module

[0040] 131 Vibration Damping Pad

[0041] 1311 First Floor

[0042] 1312 Second Floor

[0043] 1313 Third Floor

[0044] 132 Carrier Board

[0045] 1321 Base Plate

[0046] 1322 Stand

[0047] 14 Bottom cover

[0048] 15 Box

[0049] 151 Prominent

[0050] 16 Soft flat cable DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. The described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described in the drawings here can be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0053] In the description of this application, it should be noted that:

[0054] Relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations;

[0055] "Connection" should be understood in a broad sense, for example, it can be fixed connection, detachable connection, or integral connection; it can be directly connected or indirectly connected through an intermediate medium;

[0056] The orientation or position relationship indicated by the spatial relationship terms "top", "bottom", etc. is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship commonly placed when the product of the application is used, or is the orientation or position relationship commonly understood by technical personnel in this field. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0057] See also Figure 1 The embodiment of the present application provides a sensor vibration reduction structure, including a main control circuit board assembly 11, a sensor circuit board assembly 12, a vibration reduction module 13, a bottom cover 14 and a box body 15. Although the various parts in the figure are rectangular geometric shapes, this shape does not represent the real shape, nor does it represent the shape of the projection of the real object on a plane. The real product is not necessarily rectangular. The real product can be various shapes or a combination of shapes. The box only represents the module or component.

[0058] The main control circuit board assembly 11 may include a first circuit board and a main control chip mounted on the first circuit board, and the sensor circuit board assembly 12 may include a second circuit board and a sensor mounted on the second circuit board.

[0059] The vibration reduction module 13 is in contact with the bottom cover 14 and the box body 15 respectively. The bottom cover 14 and the box body 15 can provide a positioning function for the vibration reduction module 13 and can also have a certain squeezing force to make the positioning of the vibration reduction module 13 more secure.

[0060] The sensor circuit board assembly 12 is installed on the vibration reduction module 13 . The sensor circuit board assembly 12 can be installed by gluing or by screws.

[0061] The main control circuit board assembly 11 is installed in the box body 15. The main control circuit board assembly 11 can be installed on the side of the box body 15 or on the top surface of the box body 15, both of which can reduce the occupation of the bottom area of ​​the box body. In addition, the main control circuit board assembly 11 is not directly connected to the sensor circuit board assembly 12, so as to prevent the sensor circuit board assembly 12 from being affected by the vibration of the main control circuit board assembly 11.

[0062] The box body 15 and the bottom cover 14 are connected, for example, the box body 15 and the bottom cover 14 are connected by screws.

[0063] The sensor circuit board assembly 12 is electrically connected to the main control circuit board assembly 11, for example, the main control circuit board assembly 11 and the sensor circuit board assembly 12 can be electrically connected via a flexible flat cable. The side of the box body 15 can be provided with an interface for communicating with the outside world, and the interface component is installed on the side of the box body 15.

[0064] The vibration reduction module 13 is used to reduce the vibration transmitted from the bottom cover 14 or the box body 15 to the sensor circuit board assembly 12. Under the action of the vibration reduction module, the vibration transmitted from the bottom cover or the box body to the sensor circuit board assembly is reduced, thereby reducing the impact of the vibration on the sensor.

[0065] refer to Figure 2 The vibration reduction module 13 includes a vibration reduction pad 131 and a carrier plate 132. The vibration reduction pad 131 contacts the bottom cover 14 and the box body 15 respectively. The box body 15 has a protrusion 151. The protrusion 151 is on the vibration reduction pad. The vibration reduction pad is clamped between the protrusion 151 and the bottom cover 14.

[0066] The corner of the carrier board 132 can be installed on the vibration-damping pad 131, or the edge of the carrier board 132 can be installed on the vibration-damping pad 131, and a small area of ​​the carrier board 132 can be used for installation, leaving the entire area in the center of the carrier board 132 for the sensor circuit board assembly 12, thereby improving the space utilization efficiency. The sensor circuit board assembly 12 can be installed on the carrier board 132 by gluing.

[0067] Regarding the shape of the carrier plate 132, the carrier plate 132 can be designed as a rectangle, and the four corners of the carrier plate 132 are installed on the vibration-damping pad 131. Figure 3 The carrier plate can be made of stainless steel, which has high rigidity and strength and is not easily deformed.

[0068] Regarding the shape of the vibration-damping pad 131, the vibration-damping pad 131 includes three layers from bottom to top, such as Figure 4 .

[0069] The bottom surface of the first layer 1311 is connected to the bottom cover 14, and the upper surface of the first layer 1311, the side surface of the second layer 1312 and the lower surface of the third layer 1313 form a receiving space. If the receiving space is designed to receive a corner of the rectangular carrier 132, the top view of the receiving space is L-shaped. The contact surfaces of the upper surface of the first layer 1311 and the lower surface of the third layer 1313 with the upper and lower surfaces of the carrier can be L-shaped.

[0070] The upper surface of the first layer 1311 contacts the lower surface of the carrier 132, the lower surface of the third layer 1313 contacts the upper surface of the carrier 132, the side of the second layer 1312 contacts the edge of the carrier 132, and the vibration damping pad 131 can have a certain amount of extrusion in the vertical direction or the horizontal direction.

[0071] The dimensions of the components may be designed so that the side surfaces of the vibration-damping pad 131 are squeezed by the carrier plate 132 and the box body 15 , and the bottom and top surfaces of the vibration-damping pad 131 are squeezed by the box body 15 and the bottom cover 14 .

[0072] The vibration damping pad 131 can be set to have the same extrusion amount in the horizontal and vertical directions. Since vibration generates deformation, the deformation will cause the extrusion force to change. If the vibration damping pad 131 has the same extrusion amount in the horizontal and vertical directions, the forces in the horizontal and vertical directions will be consistent during vibration, avoiding bending moment torque during vibration, ensuring the stability of the carrier 132 and the sensor circuit board assembly 12 thereon, and avoiding the inclination of the sensor circuit board assembly 12 and inaccurate detection. The carrier 132 can solve the problem of inconsistent vibration damping in the horizontal and vertical directions.

[0073] Figure 5 A three-dimensional structure of a sensor vibration reduction structure is shown, wherein the box body 15 is separated upward to clearly show the interior of the box body.

[0074] like Figure 5 The carrier plate 132 may include a bottom plate 1321 and a vertical plate 1322, wherein the vertical plate is perpendicular to the bottom plate, so that two mutually perpendicular sensors may be installed, and the two mutually perpendicular sensors may detect motion accelerations in two mutually perpendicular directions.

[0075] The number of sensor circuit board assemblies 12 can be two, one sensor circuit board assembly can be used to collect horizontal acceleration, and the other sensor circuit board assembly can be used to collect gravity acceleration. The two sensor circuit board assemblies can be electrically connected to the main control circuit board assembly using a flexible cable.

[0076] like Figure 5 A sensor circuit board assembly includes a horizontal circuit board 121 and a horizontal sensor 122. Four horizontal sensors 122 are mounted on the horizontal circuit board 121, and the horizontal circuit board 121 is mounted on the bottom plate 1321. The components on the two sensor circuit board assemblies can be arranged symmetrically, which can prevent the center of mass from being misaligned during shaking and reduce vibration.

[0077] Another sensor circuit board assembly includes a vertical circuit board 123 and a vertical sensor 124 . The vertical sensor 124 is mounted on the vertical circuit board 123 , and the vertical circuit board 123 is mounted on the vertical plate 1322 .

[0078] The main control circuit board assembly 11 can be installed on the top surface of the box body 15, for example, fixed on the top surface of the box body 15 by dispensing glue. In this way, the main control chip and the like can be separated from the sensor circuit board assembly 12, the weight of the components on the carrier can be reduced, and the vibration-damping pad can stabilize the carrier more easily, thereby further reducing the vibration of the sensor circuit board assembly 12.

[0079] like Figure 5 The main control circuit board assembly 11 and the sensor circuit board assembly 12 can be connected by a flexible flat cable 16 , which does not transmit vibration, thereby avoiding the influence of the vibration of the main control circuit board assembly 11 on the sensor circuit board assembly 12 .

[0080] like Figure 6 The carrier board 132 can be designed to be hollow with a hole in the middle so that the edges of the circuit board of the sensor circuit board assembly 12 can be stably installed around the hole. The hollow form can reduce the weight of the carrier board 132, making it easier for the vibration-damping pad 131 to stabilize the carrier board 132, thereby further reducing the vibration of the sensor circuit board assembly 12.

[0081] Based on the above embodiment, the embodiment of the present application further provides an inertial measurement unit, the inertial measurement unit includes the above sensor vibration reduction structure, wherein the sensor circuit board assembly includes a MEMS chip. The MEMS chip receives information related to the external attitude, the vibration reduction module has a vibration reduction effect, and the vibration reduction improves the performance of the inertial measurement unit.

[0082] In general, the present application proposes a sensor vibration reduction structure and an inertial measurement unit. Under the action of the vibration reduction module, the vibration transmitted from the bottom cover or the box body to the sensor circuit board assembly is reduced, thereby reducing the impact of the vibration on the sensor.

[0083] The above-described device and system embodiments are merely illustrative, and some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment. A person skilled in the art may understand and implement the present embodiment without creative effort.

[0084] The above are only preferred specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A sensor vibration reduction structure, characterized in that: It includes a main control circuit board assembly, a sensor circuit board assembly, a vibration reduction module, a bottom cover and a box body; The vibration reduction module is in contact with the bottom cover and the box body respectively, the sensor circuit board assembly is installed on the vibration reduction module, the main control circuit board assembly is installed on the box body, the box body and the bottom cover are connected, and the sensor circuit board assembly is electrically communicated with the main control circuit board assembly; the vibration reduction module is used to reduce the vibration transmitted from the bottom cover or the box body to the sensor circuit board assembly.

2. The sensor vibration reduction structure according to claim 1, characterized in that: The vibration reduction module includes a vibration reduction pad and a carrier plate. The vibration reduction pad is in contact with the bottom cover and the box body respectively, and the carrier plate is installed on the vibration reduction pad.

3. The sensor vibration reduction structure according to claim 2, characterized in that: At least four corners of the carrier plate are mounted on the vibration-damping pads.

4. The sensor vibration reduction structure according to claim 3, characterized in that: The vibration damping pad comprises three layers from bottom to top; The bottom surface of the first layer is connected to the bottom cover, the upper surface of the first layer, the side surface of the second layer and the lower surface of the third layer form a receiving space to receive a corner of the carrier board, and the receiving space is L-shaped in a top view; The upper surface of the first layer contacts the lower surface of the carrier plate, the lower surface of the third layer contacts the upper surface of the carrier plate, the side surface of the second layer contacts the edge of the carrier plate, and the vibration-damping pad has an extrusion amount.

5. The sensor vibration reduction structure according to claim 2, characterized in that: In the horizontal direction, the side surface of the vibration-damping pad is squeezed by the carrier plate and the box body; in the vertical direction, the bottom surface and the upper surface of the vibration-damping pad are squeezed by the box body and the bottom cover.

6. The sensor vibration reduction structure according to claim 5, characterized in that: The extrusion amount of the vibration damping pad in the horizontal and vertical directions is consistent.

7. The sensor vibration reduction structure according to claim 2, characterized in that: The carrier plate includes a bottom plate and a vertical plate, and the vertical plate is perpendicular to the bottom plate; The number of the sensor circuit board assemblies is 2, one sensor circuit board assembly is installed on the base plate, and the other sensor circuit board assembly is installed on the vertical plate; one sensor circuit board assembly is used to collect horizontal acceleration, and the other sensor circuit board assembly is used to collect gravity acceleration.

8. The sensor vibration reduction structure according to claim 1, characterized in that: The main control circuit board assembly is installed on the top surface of the box body.

9. The sensor vibration reduction structure according to claim 1, characterized in that: The sensor vibration reduction structure also includes a flexible flat cable, and the sensor circuit board assembly is electrically connected to the main control circuit board assembly through the flexible flat cable.

10. An inertial measurement unit, characterized in that: The sensor vibration reduction structure comprises the sensor vibration reduction structure according to any one of claims 1 to 9, wherein the sensor circuit board assembly comprises a MEMS chip.

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