Thinning, scribing and particle picking workbench

Abstract

The utility model provides a thinning, scribing and particle picking workbench, and belongs to the technical field of thinning and scribing. The thinning, scribing and particle picking workbench comprises a workbench assembly, a waste water pool is formed in one end of the top of the workbench assembly, two carrier tape grooves are formed in the other end of the top of the workbench assembly, a moving platform is arranged in the waste water pool, and a fixing assembly is fixedly installed at the top of the moving end of the moving platform; a thinning assembly, a thickness detection assembly, a scribing assembly and a manipulator are fixedly mounted on one side of the top of the wastewater pool in sequence, a visual recognition device is fixedly mounted at one end of the inner side of the wastewater pool, first moving rails are arranged on the two sides of the interior of the wastewater pool, and the moving platform comprises a moving seat; first linear motors are fixedly installed at the two ends of the moving seat, and the first linear motors are in sliding connection with the first moving rails, the thinning, scribing and particle picking work can be carried out, transferring is not needed in the process, and the practical value is high.

Description

Technical Field

[0001] The utility model relates to the technical field of thinning and scribing, and in particular to a thinning and scribing particle picking workbench. Background Art

[0002] Thinning, dicing and chip picking are three consecutive steps in integrated circuit manufacturing and packaging, mainly used to process complete wafers into independent functional chips and perform preliminary chip selection. Thinning is to reduce the thickness of the back of the wafer. Dicing is the process of cutting the thinned wafer along the predetermined cutting line into individual chips. Picking refers to the process of picking up the cut chips from the wafer and transferring them to a carrier such as a carrier tape or tray.

[0003] For example, a Chinese patent with publication number CN204303775U discloses a visual automatic empty wafer picker, including a material discharge test system, a bonding system and a wafer test system, wherein the material discharge test system includes a Tray plate PR projection mechanism, a first light metering auxiliary light and a Tray plate workbench; the bonding system includes a robotic arm, a solenoid valve vacuum suction and blowing tube and a swing arm motor; the wafer test system includes an ion gun, a wafer PR projection mechanism, a second light metering auxiliary light, a wafer, a wafer workbench, an inner ring fixing ring, a pin assembly, an XY screw and a motor; the technical solution recorded in the scheme realizes automatic empty jump when a wafer chip is missing through the Tray plate PR projection mechanism, but the technical solution can only complete the step of picking particles, and thinning and dicing still need to be performed on other equipment.

[0004] Based on the above, the inventors have discovered the following problems: current thinning, slicing and particle picking usually need to be performed on three independent devices, which are then transported to other devices after the steps on each device are completed. During the transportation process, the risk of wafer damage and contamination by dust particles in the air is increased, resulting in defective products and inconvenient use.

[0005] Therefore, in view of this, the existing structure and defects are studied and improved, and a thinning dicing and picking workbench is provided to achieve a purpose with greater practical value. Utility Model Content

[0006] The purpose of the utility model is to provide a thinning, slicing and particle picking workbench to solve the problem proposed in the above background technology that thinning, slicing and particle picking need to be performed on three independent devices, and each device is transported to other devices after the steps are completed. During the transportation process, the risk of wafer damage and contamination by dust particles in the air is increased, resulting in the production of defective products.

[0007] A thinning, slicing and particle picking workbench comprises a workbench assembly, a wastewater tank is provided at one end of the top of the workbench assembly, and two tape carrier slots are provided at the other end of the top of the workbench assembly, a moving platform is provided inside the wastewater tank, a fixed assembly is fixedly installed on the top of the movable end of the moving platform, a thinning assembly, a thickness detection assembly, a slicing assembly and a manipulator are fixedly installed on one side of the top of the wastewater tank in sequence, a visual recognition device is fixedly installed at one end of the inner side of the wastewater tank, a first moving track is provided on both sides of the wastewater tank, the moving platform comprises a moving seat, first linear motors are fixedly installed at both ends of the moving seat, and the first linear motor is slidably connected to the first moving track.

[0008] The beneficial effect of adopting the above further scheme is that a wastewater pool is provided at one end of the top of the workbench component, which is convenient for collecting and treating the wastewater generated during the thinning and slicing process; two carrier slots are provided at the other end of the top of the workbench component, which is convenient for the finished product carrier and the waste carrier to move inside the carrier slot, and convenient for the robot to pick particles, move good chips to the finished product carrier, and move defective chips to the waste carrier; a fixed component is fixedly installed on the top of the moving end of the motion platform, which is convenient for the fixed component to fix the carrier with the wafer fixedly installed, and the motion platform drives the wafer to move when it works, which is convenient for the thinning component, the thickness detection component, the slicing component and The robot performs thinning, slicing and particle picking on the wafer. A thinning component, a thickness detection component, a slicing component and a robot are fixedly installed in sequence on one side of the top of the wastewater tank. A visual recognition device is fixedly installed on one end of the inner side of the wastewater tank to facilitate the thinning component to grind and thin the wafer. The thickness detection component detects the thickness of the polished wafer. The slicing component slicing the thinned wafer, the robot and the visual recognition device are used together to pick particles. The first linear motor is slidably connected to the first moving track, so that the first linear motor can drive the moving seat to move along the first moving track, so as to drive the fixed component to move on the top of the wastewater tank.

[0009] Furthermore, a second movable track is provided on the top of the movable seat, a second linear motor is slidably connected to the top of the second movable track, and the fixed component is fixedly installed on the top of the second linear motor.

[0010] The beneficial effect of adopting the above further scheme is that a second linear motor is slidably connected to the top of the second movable rail, and the fixed component is fixedly installed on the top of the second linear motor, so that the second linear motor can drive the fixed component to move along the second movable rail, and the fixed component can drive the wafer to move precisely, thereby performing thinning, slicing and grain picking work.

[0011] Furthermore, foldable waterproof covers are fixedly installed on both sides of the second linear motor, and one end of the foldable waterproof cover is fixedly connected to one side of the first linear motor.

[0012] The beneficial effect of adopting the above further scheme is that a foldable waterproof cover is fixedly installed on both sides of the second linear motor, and one end of the foldable waterproof cover is fixedly connected to one side of the first linear motor, so that the foldable waterproof cover can be conveniently arranged on the outside of the second moving track to achieve a waterproof effect, thereby extending the service life of the motion platform.

[0013] Furthermore, a fixing groove is provided in the middle of the top end of the fixing component, and a positioning protrusion is provided at one end inside the fixing groove.

[0014] The beneficial effect of adopting the above further scheme is that by providing a positioning protrusion at one end of the inner side of the fixing groove, it is convenient to place the carrier with the wafer bonded with the fixing glue inside the fixing groove, and the positioning protrusion positions the angle of the carrier, thereby facilitating the device to perform precise thinning, slicing and particle picking operations on the wafer.

[0015] Furthermore, a heating plate is provided at the bottom of the fixing groove, and a fixing claw is fixedly installed on the outer side of the top of the fixing component.

[0016] The beneficial effect of adopting the above further scheme is that a heating plate is provided at the bottom of the fixing groove, and a fixing claw is fixedly installed on the outer side of the top of the fixing component, so that the fixing claw can fix the carrier to avoid loosening during the processing. The heating plate works after the thinning and dicing is completed, and the fixing glue is softened and decomposed, making it convenient for the robot arm to take out the diced chips for particle picking.

[0017] Furthermore, the thinning component includes a first mounting seat, one end of which is slidably connected to a first lifting seat, a grinding head is provided in the middle of the first lifting seat, and a first nozzle is fixedly installed at the bottom of one end of the first mounting seat.

[0018] The beneficial effect of adopting the above further scheme is that a grinding head is provided in the middle of the first lifting seat, and a first nozzle is fixedly installed at the bottom of one end of the first mounting seat, so that the first lifting seat can drive the grinding head to move up and down, so that the grinding head can thin the wafer, and the first nozzle can spray water to wash the powder generated by grinding and thinning.

[0019] Furthermore, the thickness detection component includes a mounting frame, a distance sensor is fixedly mounted on one end of the mounting frame, air nozzles are fixedly mounted on both sides of the distance sensor, and an air interface is provided on the top of the air nozzle.

[0020] The beneficial effect of adopting the above-mentioned further scheme is that air nozzles are fixedly installed on both sides of the distance sensor, and an air interface is provided on the top of the air nozzle, which is convenient for the air interface to be connected to an external pipeline, so that the high-pressure airflow generated by the external high-pressure air pump can be ejected from the air nozzle to blow away the water droplets on the surface of the wafer, making it convenient for the distance sensor to detect the thickness of the thinned wafer.

[0021] Furthermore, the dicing assembly includes a second mounting seat, one end of the second mounting seat is slidably connected to a second lifting seat, and a rotating seat is provided in the middle of the second lifting seat.

[0022] The beneficial effect of adopting the above further solution is that, by providing a rotating seat in the middle of the second lifting seat, the second lifting seat can drive the rotating seat to move up and down.

[0023] Furthermore, an electric cutter is fixedly mounted on the bottom of the rotating seat, and a second nozzle is fixedly mounted on the bottom of one end of the second mounting seat.

[0024] The beneficial effect of adopting the above-mentioned further scheme is that an electric cutter is fixedly installed on the bottom of the rotating seat, and a second nozzle is fixedly installed on the bottom of one end of the second mounting seat, so that the rotating seat can adjust the angle of the electric cutter and the electric cutter can slice the thinned wafer conveniently, and the second nozzle sprays water to wash the powder generated by slicing.

[0025] Furthermore, a vacuum nozzle is fixedly installed on the mobile end of the manipulator, and a camera is provided on the top of the visual recognition device.

[0026] The beneficial effect of adopting the above further scheme is that a vacuum suction nozzle is fixedly installed on the moving end of the manipulator, and a camera is provided on the top of the visual recognition device, so that the manipulator can drive the vacuum suction nozzle to move, so that the vacuum suction nozzle can remove the cut chip from the carrier, move it to the top of the camera for visual inspection, and then move it to the finished product carrier or the waste carrier according to the inspection results.

[0027] The beneficial effects of the utility model are as follows: the utility model obtains a thinning, slicing and particle picking workbench through the above design, and the thinning, slicing and particle picking workbench is provided with a wastewater pool at one end of the top of the workbench component, which is convenient for collecting and treating the wastewater generated during the thinning and slicing process, and two carrier slots are provided at the other end of the top of the workbench component, which is convenient for the finished product carrier and the waste carrier to move inside the carrier slot, so that the robot can pick particles, move good chips to the finished product carrier, and move defective chips to the waste carrier, and a fixed component is fixedly installed on the top of the moving end of the motion platform, so that the fixed component can fix the carrier with the wafer fixedly installed, and the motion platform drives the wafer to move when it works, which is convenient for the thinning component, the thickness detection component, the slicing component and the robot. The wafer is thinned, sliced ​​and grain-picked. A thinning component, a thickness detection component, a slicing component and a manipulator are fixedly installed in sequence on one side of the top of the wastewater tank. A visual recognition device is fixedly installed on one end of the inner side of the wastewater tank to facilitate the thinning component to grind and thin the wafer. The thickness detection component detects the thickness of the polished wafer. The slicing component slicing the thinned wafer, the manipulator and the visual recognition device are used together to pick grains. The first linear motor is slidably connected to the first moving track so that the first linear motor can drive the moving seat to move along the first moving track, and the fixed component can be driven to move on the top of the wastewater tank. The utility model can perform thinning, slicing and grain-picking work without the need for transportation during the process, and has high practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 A three-dimensional structural diagram of a thinning, dicing and particle picking workbench provided by the utility model;

[0030] Figure 2 An exploded view of the motion platform provided by the utility model;

[0031] Figure 3 A three-dimensional structural schematic diagram of a fixing assembly provided by the utility model;

[0032] Figure 4 A three-dimensional structural schematic diagram of a workbench assembly provided by the utility model;

[0033] Figure 5 This is a three-dimensional structural schematic diagram of the thickness detection component provided by the utility model.

[0034] In the figure: 101, workbench assembly; 10101, wastewater tank; 10102, tape carrier slot; 10103, first moving track; 10104, visual recognition device; 10105, camera; 102, motion platform; 10201, moving seat; 10202, first linear motor; 10203, second moving track; 10204, second linear motor; 10205, folding waterproof cover; 103, fixing assembly; 10301, fixing slot; 10302, positioning protrusion; 10303, fixing claw; 104, thinning Components; 10401, first mounting seat; 10402, first lifting seat; 10403, grinding head; 10404, first nozzle; 105, thickness detection component; 10501, mounting frame; 10502, distance sensor; 10503, air nozzle; 10504, air interface; 106, dicing component; 10601, second mounting seat; 10602, second lifting seat; 10603, rotating seat; 10604, electric cutter; 10605, second nozzle; 107, robot; 10701, vacuum nozzle. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the implementation of the utility model clearer, the technical solution in the implementation of the utility model will be clearly and completely described below in conjunction with the drawings in the implementation of the utility model. Obviously, the described implementation is a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0037] Embodiment 1 of the utility model of a thinning, slicing and particle picking workbench

[0038] The utility model provides the following technical solutions: Figure 1-Figure 5As shown, a thinning, slicing and picking workbench includes a workbench component 101, a wastewater tank 10101 is opened at one end of the top of the workbench component 101, and the wastewater tank 10101 is opened at one end of the top of the workbench component 101, so that the wastewater generated during the thinning and slicing process can be collected and treated, and two carrier slots 10102 are opened at the other end of the top of the workbench component 101, and the two carrier slots 10102 are opened at the other end of the top of the workbench component 101, so that the finished product carrier and the waste carrier can be moved inside the carrier slot 10102, so that the robot 107 can pick the particles, move the good chips to the finished product carrier, and move the defective chips to the waste carrier. A moving platform 102 is arranged inside the wastewater tank 10101, and the moving platform 102 is arranged inside the wastewater tank 10101. A fixing component 103 is fixedly installed on the top of the moving end of the moving platform 102. The fixing component 103 is fixedly installed on the top of the moving end of the moving platform 102, so that the fixing component 103 can fix the carrier with the wafer fixedly installed thereon. The working of the moving platform 102 drives the wafer to move, so that the thinning component 104, the thickness detection component 105, the dicing component 106 and the manipulator 107 can be conveniently used to thin, slice and pick the wafer. A thinning component 104, a thickness detection component 105, a dicing component 106 and a manipulator 107 are fixedly installed on one side of the top of the wastewater tank 10101 in sequence. A visual recognition device 10104 is fixedly installed on one end of the inner side of the wastewater tank 10101. The wastewater tank 10101 includes a thinning component 104, a thickness detection component 105, a dicing component 106 and a manipulator 107. A visual recognition device 10104 is fixedly installed at one end of the inner side of the wastewater tank 10101, so that the thinning component 104 can grind and thin the wafer. The thickness detection component 105 detects the thickness of the polished wafer. The dicing component 106 dices the thinned wafer. The manipulator 107 and the visual recognition device 10104 are used together to pick particles. First moving rails 10103 are arranged on both sides of the wastewater tank 10101. The motion platform 102 includes a moving seat 10201. First linear motors 10202 are fixedly installed at both ends of the moving seat 10201. The first linear motor 10202 and the first moving rail 10103 are connected to each other. 3 sliding connection, through the first linear motor 10202 and the first moving track 10103 sliding connection, it is convenient for the first linear motor 10202 to drive the moving seat 10201 to move along the first moving track 10103, and it is convenient to drive the fixed component 103 to move on the top of the wastewater tank 10101, the second moving track 10203 is opened on the top of the moving seat 10201, the second moving track 10203 is slidingly connected with the second linear motor 10204 on the top, the fixed component 103 is fixedly installed on the top of the second linear motor 10204, and the second linear motor 10204 is slidingly connected with the second linear motor 10204 on the top of the second moving track 10203, and the fixed component 103 is fixedly installed on the top of the second linear motor 10204.In order to facilitate the second linear motor 10204 to drive the fixed component 103 to move along the second moving track 10203, the fixed component 103 can drive the wafer to move accurately, so as to perform thinning, dicing and grain picking. The second linear motor 10204 is fixedly installed with folding waterproof covers 10205 on both sides, and one end of the folding waterproof cover 10205 is fixedly connected to one side of the first linear motor 10202. The folding waterproof cover 10205 is fixedly installed on both sides of the second linear motor 10204, and one end of the folding waterproof cover 10205 is fixedly connected to one side of the first linear motor 10202. It is convenient to cover the folding waterproof cover 10205 on the outside of the second moving track 10203, so as to achieve a waterproof effect, thereby extending the service life of the motion platform 102.

[0039] Embodiment 2 of a thinning, dicing and particle picking workbench of the utility model

[0040] Reference Figure 1-Figure 5As shown, a fixing groove 10301 is provided in the middle of the top of the fixing component 103, and a positioning protrusion 10302 is provided at one end of the inner side of the fixing groove 10301. The positioning protrusion 10302 is provided at one end of the inner side of the fixing groove 10301, so that the carrier with the wafer bonded by the fixing glue can be placed in the fixing groove 10301. The positioning protrusion 10302 can position the angle of the carrier, so as to facilitate the device to perform precise thinning, dicing and grain picking operations on the wafer. A heating plate is provided at the bottom of the fixing groove 10301, and a fixing claw 10303 is fixedly installed on the outer side of the top of the fixing component 103. A heating plate is provided at the bottom of the fixed groove 10301, and a fixing claw 10303 is fixedly installed on the outer side of the top of the fixing component 103, so that the fixing claw 10303 can fix the carrier to prevent loosening during the processing. The heating plate works after the thinning and dicing is completed to soften and decompose the fixing glue, so that the robot 107 can take out the diced chips for particle selection. The thinning component 104 includes a first mounting seat 10401, and one end of the first mounting seat 10401 is slidably connected to the first lifting seat 10402. A grinding head 10403 is provided in the middle of the first lifting seat 10402. A first nozzle 10404 is fixedly installed at the bottom of one end of the mounting seat 10401, and a grinding head 10403 is provided in the middle of the first lifting seat 10402. The first nozzle 10404 is fixedly installed at the bottom of one end of the first mounting seat 10401, so that the first lifting seat 10402 can drive the grinding head 10403 to move up and down, so that the grinding head 10403 can perform a thinning operation on the wafer. The first nozzle 10404 sprays water to wash the powder generated by the grinding and thinning. The thickness detection component 105 includes a mounting frame 10501, and a distance sensor is fixedly installed at one end of the mounting frame 10501. Sensor 10502, air nozzles 10503 are fixedly installed on both sides of the distance sensor 10502, and an air interface 10504 is provided on the top of the air nozzle 10503. The air nozzles 10503 are fixedly installed on both sides of the distance sensor 10502, and an air interface 10504 is provided on the top of the air nozzle 10503, so that the air interface 10504 can be connected to an external pipeline, so that the high-pressure airflow generated by an external high-pressure air pump can be ejected from the air nozzle 10503 to blow away the water droplets on the surface of the wafer, so that the distance sensor 10502 can detect the thickness of the thinned wafer.

[0041] Embodiment 3 of a thinning, dicing and particle picking workbench of the utility model

[0042] Reference Figure 1-Figure 4As shown, the dicing assembly 106 includes a second mounting seat 10601, one end of the second mounting seat 10601 is slidably connected to a second lifting seat 10602, a rotating seat 10603 is provided in the middle of the second lifting seat 10602, and the rotating seat 10603 is provided in the middle of the second lifting seat 10602, so that the second lifting seat 10602 can drive the rotating seat 10603 to move up and down, an electric cutter 10604 is fixedly installed at the bottom of the rotating seat 10603, a second nozzle 10605 is fixedly installed at the bottom of one end of the second mounting seat 10601, the electric cutter 10604 is fixedly installed at the bottom of the rotating seat 10603, and the second nozzle 10605 is fixedly installed at the bottom of one end of the second mounting seat 10601, so that the rotating seat 10603 can be adjusted during operation. The angle of the electric cutter 10604 facilitates the electric cutter 10604 to slice the thinned wafer. The second nozzle 10605 sprays water to rinse the powder generated by slicing. The mobile end of the manipulator 107 is fixedly installed with a vacuum suction nozzle 10701, and a camera 10105 is provided on the top of the visual recognition device 10104. The vacuum suction nozzle 10701 is fixedly installed on the mobile end of the manipulator 107, and the top of the visual recognition device 10104 is provided with a camera 10105, which facilitates the manipulator 107 to drive the vacuum suction nozzle 10701 to move, so that the vacuum suction nozzle 10701 removes the cut chip from the carrier, moves it to the top of the camera 10105 for visual inspection, and then moves it to the finished product carrier or the waste carrier according to the inspection result.

[0043] Specifically, the working principle of this thinning, slicing and picking workbench is as follows: when in use, a positioning protrusion 10302 is provided at one end of the inner side of the fixed groove 10301, so that the carrier with the wafer bonded with the fixing glue can be placed inside the fixed groove 10301, and the positioning protrusion 10302 positions the angle of the carrier, so as to facilitate the device to perform precise thinning, slicing and picking operations on the wafer. A heating plate is provided at the bottom of the fixed groove 10301, and a fixing claw 10303 is fixedly installed on the outer side of the top of the fixing component 103, so that the fixing claw 10303 can fix the carrier to avoid loosening during the processing. The first linear motor 10202 is slidably connected to the first movable rail 10103, which is convenient for the first linear motor 10202 to work. The movable seat 10201 is driven to move along the first movable track 10103, so as to conveniently drive the fixed component 103 to move on the top of the wastewater tank 10101. A second linear motor 10204 is slidably connected to the top of the second movable track 10203. The fixed component 103 is fixedly installed on the top of the second linear motor 10204, so as to facilitate the second linear motor 10204 to drive the fixed component 103 to move along the second movable track 10203, so as to facilitate the fixed component 103 to drive the wafer to move accurately, so as to perform the thinning and dicing work. A folding waterproof cover 10205 is fixedly installed on both sides of the second linear motor 10204, and one end of the folding waterproof cover 10205 is connected to the first linear motor 10202 One side is fixedly connected, so that the foldable waterproof cover 10205 can be arranged on the outside of the second moving track 10203 to achieve waterproof effect, thereby extending the service life of the motion platform 102. A grinding head 10403 is provided in the middle of the first lifting seat 10402, and a first nozzle 10404 is fixedly installed at the bottom of one end of the first mounting seat 10401, so that the first lifting seat 10402 can drive the grinding head 10403 to move up and down, so that the grinding head 10403 can perform thinning operation on the wafer. The first nozzle 10404 sprays water to wash the powder generated by grinding and thinning. Air nozzles 10503 are fixedly installed on both sides of the distance sensor 10502, and an air interface 10504 is provided on the top of the air nozzle 10503. The air interface 10504 is connected to an external pipeline, so that the high-pressure airflow generated by the external high-pressure air pump can be ejected from the air nozzle 10503 to blow away the water droplets on the surface of the wafer, so that the distance sensor 10502 can detect the thickness of the thinned wafer. A rotating seat 10603 is provided in the middle of the second lifting seat 10602, so that the second lifting seat 10602 can drive the rotating seat 10603 to move up and down. An electric cutter 10604 is fixedly installed at the bottom of the rotating seat 10603, and a second nozzle 10605 is fixedly installed at the bottom of one end of the second mounting seat 10601, so that the rotating seat 10603 can adjust the angle of the electric cutter 10604, so that the electric cutter 10604 can slice the thinned wafer.The second nozzle 10605 sprays water to wash the powder produced by slicing. The heating plate works after the thinning and slicing is completed to soften and decompose the fixing glue, so that the robot 107 can take out the slicing chips for particle selection. The vacuum suction nozzle 10701 is fixedly installed on the mobile end of the robot 107. The top of the visual recognition device 10104 is provided with a camera 10105, which is convenient for the robot 107 to drive the vacuum suction nozzle 10701 to move, so that the vacuum suction nozzle 10701 can take the cut chips from the carrier, move them to the top of the camera 10105 for visual inspection, and then move them to the finished product carrier or the waste carrier according to the inspection results.

[0044] The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A thinning and dicing workbench, characterized in that: The invention comprises a workbench component (101), wherein a wastewater pool (10101) is provided at one end of the top of the workbench component (101), and two tape carrier slots (10102) are provided at the other end of the top of the workbench component (101), a moving platform (102) is provided inside the wastewater pool (10101), a fixing component (103) is fixedly installed on the top of the moving end of the moving platform (102), and a thinning component (104) and a thickness detection component (105) are fixedly installed on one side of the top of the wastewater pool (10101) in sequence. , a slicing assembly (106) and a manipulator (107), a visual recognition device (10104) is fixedly installed at one end of the inner side of the wastewater tank (10101), first movable tracks (10103) are provided on both sides of the interior of the wastewater tank (10101), the motion platform (102) includes a movable seat (10201), first linear motors (10202) are fixedly installed at both ends of the movable seat (10201), and the first linear motor (10202) is slidably connected to the first movable track (10103).

2. A thinning and dicing workbench according to claim 1, characterized in that: A second movable track (10203) is provided on the top of the movable seat (10201), a second linear motor (10204) is slidably connected to the top of the second movable track (10203), and the fixed component (103) is fixedly installed on the top of the second linear motor (10204).

3. A thinning and dicing workbench according to claim 2, characterized in that: Folding waterproof covers (10205) are fixedly installed on both sides of the second linear motor (10204), and one end of the folding waterproof cover (10205) is fixedly connected to one side of the first linear motor (10202).

4. A thinning and dicing workbench according to claim 2, characterized in that: A fixing groove (10301) is provided in the middle of the top end of the fixing component (103), and a positioning protrusion (10302) is provided at one end inside the fixing groove (10301).

5. A thinning and dicing workbench according to claim 4, characterized in that: A heating plate is provided at the bottom of the fixing groove (10301), and a fixing claw (10303) is fixedly installed on the outer side of the top end of the fixing component (103).

6. The thinning and dicing workbench according to claim 1, characterized in that: The thinning component (104) comprises a first mounting seat (10401), one end of the first mounting seat (10401) is slidably connected to a first lifting seat (10402), a grinding head (10403) is provided in the middle of the first lifting seat (10402), and a first nozzle (10404) is fixedly installed at the bottom of one end of the first mounting seat (10401).

7. The thinning and dicing workbench according to claim 1, characterized in that: The thickness detection component (105) comprises a mounting frame (10501), a distance sensor (10502) is fixedly mounted on one end of the mounting frame (10501), air nozzles (10503) are fixedly mounted on both sides of the distance sensor (10502), and an air interface (10504) is provided at the top of the air nozzle (10503).

8. The thinning and dicing workbench according to claim 1, characterized in that: The dicing assembly (106) comprises a second mounting seat (10601), one end of the second mounting seat (10601) is slidably connected to a second lifting seat (10602), and a rotating seat (10603) is provided in the middle of the second lifting seat (10602).

9. A thinning and dicing workbench according to claim 8, characterized in that: An electric cutter (10604) is fixedly mounted on the bottom of the rotating seat (10603), and a second nozzle (10605) is fixedly mounted on the bottom of one end of the second mounting seat (10601).

10. The thinning and dicing workbench according to claim 1, characterized in that: A vacuum nozzle (10701) is fixedly mounted on the mobile end of the manipulator (107), and a camera (10105) is disposed on the top of the visual recognition device (10104).

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