Laser processing device and equipment

Abstract

The utility model is suitable for the technical field of laser processing, and provides a laser processing device and equipment. The laser processing device comprises a base, a first driving assembly, a laser head, a collecting box and a first telescopic cover; a placing space is arranged in the base, and the first driving assembly and the first telescopic cover are arranged on the base; the laser head is arranged at the output end of the first driving assembly; the collecting box is slidably arranged in the placing space, and the laser head is located above the collecting box; the first telescopic cover seals the top of the placing space, and the first telescopic cover can stretch out and draw back along with movement of the laser head in the first direction; a closed processing space is defined by the first telescopic cover, the base and the collecting box in the containing space. When the workpiece is machined in the machining space, waste generated by laser machining of the workpiece can be limited in the machining space, the waste finally falls into the collecting box, and the collecting rate of the waste is increased.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing device and equipment. Background Art

[0002] When cutting precious metals using laser cutting technology, the laser beam irradiates the surface of the precious metal material, causing the surface of the precious metal material to vaporize and evaporate to form holes. As the laser beam moves relative to the precious metal material, the holes on the surface of the precious metal material continuously form narrow slits, thereby completing the cutting of the precious metal material.

[0003] Since precious metal materials are expensive, it is still necessary to collect the waste after cutting precious metals. At present, an inclined funnel-shaped waste box is usually set under the laser head to collect precious metal waste through the waste box. However, since the space for processing precious metal materials is not closed, the precious metal materials vaporized by the energy of the laser beam and the precious metal materials splashed after melting cannot be collected in the waste box, resulting in a low waste collection rate of precious metal materials. Utility Model Content

[0004] The embodiments of the present application provide a laser processing device and equipment, which can improve the waste collection rate of workpieces.

[0005] In a first aspect, an embodiment of the present application provides a laser processing device, the laser processing device comprising:

[0006] A base, wherein a placement space is provided in the base;

[0007] a first driving assembly, wherein the first driving assembly is disposed on the base;

[0008] A laser head, the laser head is arranged at the output end of the first driving component, and the first driving component is used to drive the laser head to move along a first direction;

[0009] A collecting box, the collecting box is slidably disposed in the placement space, and the laser head is located above the collecting box;

[0010] A first telescopic cover, which is disposed on the base and closes the top of the placement space. The light outlet of the laser head is disposed in the first telescopic cover, and the first telescopic cover can be extended and retracted as the laser head moves along the first direction.

[0011] Wherein, the first telescopic cover, the base and the collecting box form a closed processing space in the placement space, and the first direction is parallel to the horizontal plane.

[0012] In some possible implementations of the first aspect, the first telescopic cover includes:

[0013] A first telescopic section, which is disposed on the base and connected to the laser head;

[0014] a second telescopic section, the second telescopic section is arranged on the base and connected to the laser head, the first telescopic section, the laser head and the second telescopic section are arranged in sequence along the first direction;

[0015] Wherein, the first telescopic section and the second telescopic section close the top of the placement space.

[0016] In some possible implementations of the first aspect, the laser processing device further includes:

[0017] A crossbeam, wherein the crossbeam is slidably disposed on the base along a second direction, the crossbeam is arranged across the placement space, and the first driving assembly and the first telescopic cover are both arranged on the crossbeam;

[0018] a second telescopic cover, the second telescopic cover is arranged on the base and connected to the first telescopic cover, the second telescopic cover can be telescoped along the movement of the first telescopic cover along the second direction; the first telescopic cover and the second telescopic cover close the top of the placement space;

[0019] The second direction is parallel to the horizontal plane and perpendicular to the first direction.

[0020] In some possible implementations of the first aspect, the laser processing device further includes:

[0021] A third telescopic cover is arranged on the base and connected to a side of the beam away from the second telescopic cover, and the third telescopic cover can be extended and retracted as the beam moves along the second direction; the first telescopic cover, the second telescopic cover and the third telescopic cover close the top of the placement space.

[0022] In some possible implementations of the first aspect, the laser processing device further includes:

[0023] The mounting frame is arranged on the cross beam, the first telescopic cover is arranged in the mounting frame, and the second telescopic cover is connected to a side of the mounting frame away from the cross beam.

[0024] In some possible implementations of the first aspect, the laser processing device further includes:

[0025] A placement box, the placement box is slidably disposed in the placement space, and the placement box is located between the collection box and the laser head; the first telescopic cover, the second telescopic cover, the base, the collection box and the placement box enclose the processing space in the placement space;

[0026] A carrier is arranged in the placement box.

[0027] In some possible implementations of the first aspect, the carrier includes:

[0028] A support frame, the support frame is arranged in the placement box;

[0029] A support bar, wherein the support bar is arranged on the support frame;

[0030] a second driving assembly, the second driving assembly being disposed on the supporting frame;

[0031] A pressing member is arranged at the output end of the second driving component, and the second driving component is used to drive the pressing member to move closer to or away from the supporting frame.

[0032] In some possible implementations of the first aspect, both ends of the second telescopic cover along the first direction are folded over the outside of the placement box.

[0033] In some possible implementations of the first aspect, the processing device further includes:

[0034] A protection box, wherein the first telescopic cover is connected to the protection box, the laser head is arranged in the protection box, and the light outlet of the laser head extends from the protection box into the first telescopic cover;

[0035] A closed door is provided on the protection box to open or close the protection box.

[0036] In a second aspect, an embodiment of the present application provides a laser processing equipment, which includes a laser processing device as described in any one of the above technical solutions.

[0037] In the laser processing device and equipment provided by the embodiment of the present application, a first driving component is arranged on the base, and a laser head is arranged on the output end of the first driving component, so that the laser head is driven to move along the first direction by the first driving component to realize laser processing of the workpiece; a placement space is arranged in the base for placing a collection box and placing the workpiece; the collection box is slidably arranged in the placement space, so that the collection box can be taken out or put into the placement space; the laser head is located above the collection box, so that the waste generated by the laser beam emitted by the laser head when processing the workpiece can fall into the collection box; a first telescopic cover is arranged on the base, and the first telescopic cover closes the placement space The top of the laser head is provided with a first telescopic cover, a base and a collecting box, so that the first telescopic cover, the base and the collecting box can enclose a closed processing space in the placement space; when the workpiece is processed in the processing space, the waste generated by the laser processing of the workpiece can be confined in the processing space, so that the waste will eventually fall into the collecting box, thereby improving the collection rate of the waste; the light outlet of the laser head is arranged in the first telescopic cover, so that the laser beam emitted by the laser head from the light outlet can be irradiated on the workpiece in the processing space; the first telescopic cover is connected to the laser head, so that the first telescopic cover can be extended and retracted as the laser head moves along the first direction, so that when the laser head moves, the first telescopic cover can also close the top of the placement space. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0039] Figure 1 This is a schematic structural diagram of an embodiment of a laser processing device of the present application;

[0040] Figure 2 for Figure 1 Schematic diagram of the structure of the medium-sized platform.

[0041] Description of Figure Numbers:

[0042] 1. Base; 11. Placement space; 2. Laser head; 3. Collection box; 4. First telescopic cover; 41. First telescopic section; 42. Second telescopic section; 5. Crossbeam; 6. Second telescopic cover; 7. Third telescopic cover; 8. Mounting frame; 9. Placement box; 10. Carrier; 101. Support frame; 102. Support bar; 103. Second drive assembly; 104. Pressing member.

[0043] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0045] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0046] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0047] It should be understood that the term “and / or” used in the specification and appended claims of this application refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0049] The embodiments of the present application provide a laser processing device and equipment for solving the technical problem of low waste collection rate of workpieces.

[0050] In the embodiments of the present application, Figure 1As shown, the laser processing device includes a base 1, a first drive assembly, a laser head 2, a collection box 3 and a first telescopic cover 4. A placement space 11 is provided in the base 1, and the first drive assembly and the first telescopic cover 4 are both provided on the base 1. The laser head 2 is provided at the output end of the first drive assembly, and the first drive assembly is used to drive the laser head 2 to move along a first direction. The collection box 3 is slidably provided in the placement space 11, and the laser head 2 is located above the collection box 3. The first telescopic cover 4 closes the top of the placement space 11, and the light outlet of the laser head 2 is provided in the first telescopic cover 4, and the first telescopic cover 4 can be extended and retracted as the laser head 2 moves along the first direction.

[0051] The first telescopic cover 4, the base 1 and the collecting box 3 form a closed processing space in the placement space 11, and the first direction is parallel to the horizontal plane.

[0052] In this embodiment, the workpiece can be placed in the processing space, and then the laser head 2 is controlled to emit a laser beam from the light outlet toward the processing space, so as to process the workpiece with the laser beam. The workpiece can be a precious metal, such as gold.

[0053] like Figure 1 As shown, the X-axis is parallel to the first direction, and the Y-axis is parallel to the second direction.

[0054] The collecting box 3 is slidably disposed in the placement space 11, so that after the collecting box 3 collects enough workpiece waste, the collecting box 3 can be pulled out of the placement space 11 to reuse the workpiece waste in the collecting box 3. Then, the empty collecting box 3 is placed in the placement space 11 to collect the workpiece waste again.

[0055] The first driving assembly of the embodiment of the present application is arranged on the base 1, and the laser head 2 is arranged at the output end of the first driving assembly, so that the laser head 2 is driven by the first driving assembly to move along the first direction to realize laser processing of the workpiece; a placement space 11 is arranged in the base 1 for placing the collection box 3 and the workpiece; the collection box 3 is slidably arranged in the placement space 11, so that the collection box 3 can be taken out or put into the placement space 11; the laser head 2 is located above the collection box 3, so that the waste generated by the laser beam emitted by the laser head 2 when processing the workpiece can fall into the collection box 3; the first telescopic cover 4 is arranged on the base 1, and the first telescopic cover 4 closes the top of the placement space 11, So that the first telescopic cover 4, the base 1 and the collecting box 3 can form a closed processing space in the placement space 11; so that when the workpiece is processed in the processing space, the waste generated by the laser processing of the workpiece can be confined in the processing space, so that the waste will eventually fall into the collecting box 3, thereby improving the collection rate of the waste; the light outlet of the laser head 2 is arranged in the first telescopic cover 4, so that the laser beam emitted from the light outlet by the laser head 2 can be irradiated on the workpiece in the processing space; the first telescopic cover 4 is connected to the laser head 2, so that the first telescopic cover 4 can be telescoped as the laser head 2 moves along the first direction, so that when the laser head 2 moves, the first telescopic cover 4 can also close the top of the placement space 11.

[0056] In one embodiment, if Figure 1 As shown, the first telescopic cover 4 includes a first telescopic section 41 and a second telescopic section 42. The first telescopic section 41 and the second telescopic section 42 are both arranged on the base 1 and are respectively connected to the laser head 2. The first telescopic section 41, the laser head 2 and the second telescopic section 42 are arranged in sequence along the first direction. Among them, the first telescopic section 41 and the second telescopic section 42 close the top of the placement space 11.

[0057] Since the first telescopic section 41, the laser head 2 and the second telescopic section 42 are arranged in sequence along the first direction, when the laser head 2 moves along the first direction, the first telescopic section 41 can be extended and the second telescopic section 42 can be shortened. Alternatively, when the laser head 2 moves, the first telescopic section 41 can be shortened and the second telescopic section 42 can be extended, so that when the laser head 2 moves, the first telescopic section 41 and the second telescopic section 42 can always close the top of the placement space 11.

[0058] In one embodiment, if Figure 1 As shown, the length of the first telescopic section 41 is equal to the length of the second telescopic section 42 so as to increase the moving length of the laser head 2 along the first direction.

[0059] In one embodiment, if Figure 1As shown, the laser processing device further includes a crossbeam 5 and a second telescopic cover 6. The crossbeam 5 is slidably arranged on the base 1 along the second direction, and the crossbeam 5 is arranged across the placement space 11. The first drive assembly and the first telescopic cover 4 are both arranged on the crossbeam 5. The second telescopic cover 6 is arranged on the base 1 and connected to the first telescopic cover 4. The second telescopic cover 6 can be extended and retracted as the first telescopic cover 4 moves along the second direction; the first telescopic cover 4 and the second telescopic cover 6 close the top of the placement space 11. Among them, the second direction is parallel to the horizontal plane and perpendicular to the first direction.

[0060] The crossbeam 5 can slide in the second direction, thereby driving the laser head 2 to move in the second direction. The laser head 2 can move in the first direction driven by the first driving assembly, so that the laser head 2 can move freely in the horizontal plane, thereby facilitating the processing of the workpiece. The second telescopic cover 6 is arranged on the base 1 and connected to the first telescopic cover 4, so that when the crossbeam 5 moves in the second direction and the first telescopic cover 4 moves along the second direction with the crossbeam 5, the second telescopic cover 6 can be telescoped along with the movement of the first telescopic cover 4 in the second direction. Thereby, when the crossbeam 5 moves in the second direction, the second telescopic cover 6 can close the top of the placement space 11 to improve the collection rate of the waste collected by the collection box 3.

[0061] In this embodiment, the laser head 2 can be slidably disposed on the crossbeam 5 along the first direction to improve the stability of the laser head 2 moving along the first direction.

[0062] In one embodiment, if Figure 1 As shown, the laser processing device further includes a third telescopic cover 7, which is disposed on the base 1 and connected to the side of the beam 5 away from the second telescopic cover 6. The third telescopic cover 7 can be telescoped along with the movement of the beam 5 in the second direction. The first telescopic cover 4, the second telescopic cover 6 and the third telescopic cover 7 close the top of the placement space 11. By providing the third telescopic cover 7, the length of the beam 5 moving in the second direction can be increased, and the top of the placement space 11 can be conveniently closed.

[0063] In one embodiment, if Figure 1 As shown, the laser processing device further includes a mounting frame 8, the mounting frame 8 is arranged on the cross beam 5, the first telescopic cover 4 is arranged in the mounting frame 8, and the second telescopic cover 6 is connected to the side of the mounting frame 8 away from the cross beam 5. By providing the mounting frame 8, the first telescopic cover 4 can be conveniently provided, so that the mounting frame 8 can support the first telescopic cover 4. By providing the mounting frame 8 on the cross beam 5, the first telescopic cover 4 can move along the second direction with the cross beam 5.

[0064] In one embodiment, if Figure 1 and Figure 2As shown, the laser processing device further includes a placement box 9 and a carrier 10. The placement box 9 is slidably disposed in the placement space 11, and the placement box 9 is located between the collection box 3 and the laser head 2. The first telescopic cover 4, the second telescopic cover 6, the base 1, the collection box 3 and the placement box 9 enclose a processing space in the placement space 11. The carrier 10 is disposed in the placement box 9.

[0065] The carrier 10 is used to place the workpiece. The carrier 10 is placed in the placement box 9, and the placement box 9 is placed in the placement space 11, so that the workpiece can be supported in the placement space 11. The first telescopic cover 4, the second telescopic cover 6, the base 1, the collection box 3 and the placement box 9 can enclose a processing space in the placement space 11, so the workpiece can be supported in the processing space by the carrier 10.

[0066] In one embodiment, if Figure 1 and Figure 2 As shown, the carrier 10 includes a support frame 101, a support bar 102, a second driving assembly 103 and a pressing member 104. The support frame 101 is disposed in the placement box 9, the support bar 102 is disposed on the support frame 101, and the second driving assembly 103 is disposed on the support frame 101. The pressing member 104 is disposed at the output end of the second driving assembly 103, and the second driving assembly 103 is used to drive the pressing member 104 to move closer to or away from the support frame 101.

[0067] The support bar 102 is used to support the workpiece. After the workpiece is placed on the support bar 102, the second driving assembly 103 is controlled to drive the pressing member 104 to move toward the support frame 101, so that the workpiece is pressed against the support frame 101 by the pressing member 104, thereby achieving positioning of the workpiece.

[0068] Understandably, if Figure 1 and Figure 2 As shown, a plurality of support bars 102 are provided, and there are gaps between two adjacent support bars 102 and between the support bars 102 and the support frame 101. Therefore, waste generated by laser processing of workpieces can fall into the collection box 3.

[0069] In one embodiment, if Figure 1 As shown, both ends of the second telescopic cover 6 along the first direction are folded outside the placement box 9, so as to facilitate the second telescopic cover 6 to be arranged outside the placement box 9, so as to improve the sealing property of the processing space.

[0070] In one embodiment, a transparent observation window is provided on the end surface of the placement box 9 so that the user can observe the processing status of the workpiece through the transparent observation window.

[0071] In one embodiment, the processing device further includes a protection box and a closed door. The first telescopic cover 4 is connected to the protection box, the laser head 2 is arranged in the protection box, and the light outlet of the laser head 2 extends from the protection box into the first telescopic cover 4. The closed door is arranged in the protection box to open or close the protection box.

[0072] The protection box is used to protect the laser head 2. After the closed door closes the protection box, the closed space formed by the closed door and the protection box can improve the sealing of the processing space, thereby improving the waste collection rate. When the laser head 2 needs to be maintained or replaced, it is only necessary to open the closed door, which is simple and convenient to operate.

[0073] In addition, an embodiment of the present application also provides a laser processing equipment, which includes a laser processing device. The specific structure of the laser processing device refers to the above embodiment. Since the laser processing equipment adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments.

[0074] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the inventive concept of the present application, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A laser processing device, characterized in that: The laser processing device comprises: A base, wherein a placement space is provided in the base; a first driving assembly, wherein the first driving assembly is disposed on the base; A laser head, the laser head is arranged at the output end of the first driving component, and the first driving component is used to drive the laser head to move along a first direction; A collecting box, the collecting box is slidably disposed in the placement space, and the laser head is located above the collecting box; A first telescopic cover, which is disposed on the base and closes the top of the placement space. The light outlet of the laser head is disposed in the first telescopic cover, and the first telescopic cover can be extended and retracted as the laser head moves along the first direction. Wherein, the first telescopic cover, the base and the collecting box form a closed processing space in the placement space, and the first direction is parallel to the horizontal plane.

2. The laser processing device according to claim 1, characterized in that: The first telescopic cover comprises: A first telescopic section, which is disposed on the base and connected to the laser head; a second telescopic section, the second telescopic section is arranged on the base and connected to the laser head, the first telescopic section, the laser head and the second telescopic section are arranged in sequence along the first direction; Wherein, the first telescopic section and the second telescopic section close the top of the placement space.

3. The laser processing device according to claim 1, characterized in that: The laser processing device also includes: A crossbeam, wherein the crossbeam is slidably disposed on the base along a second direction, the crossbeam is arranged across the placement space, and the first driving assembly and the first telescopic cover are both arranged on the crossbeam; a second telescopic cover, the second telescopic cover is arranged on the base and connected to the first telescopic cover, the second telescopic cover can be telescoped along the movement of the first telescopic cover along the second direction; the first telescopic cover and the second telescopic cover close the top of the placement space; The second direction is parallel to the horizontal plane and perpendicular to the first direction.

4. The laser processing device according to claim 3, characterized in that: The laser processing device also includes: A third telescopic cover is arranged on the base and connected to a side of the beam away from the second telescopic cover, and the third telescopic cover can be extended and retracted as the beam moves along the second direction; the first telescopic cover, the second telescopic cover and the third telescopic cover close the top of the placement space.

5. The laser processing device according to claim 3, characterized in that: The laser processing device also includes: The mounting frame is arranged on the cross beam, the first telescopic cover is arranged in the mounting frame, and the second telescopic cover is connected to a side of the mounting frame away from the cross beam.

6. The laser processing device according to claim 3, characterized in that: The laser processing device also includes: A placement box, the placement box is slidably disposed in the placement space, and the placement box is located between the collection box and the laser head; the first telescopic cover, the second telescopic cover, the base, the collection box and the placement box enclose the processing space in the placement space; A carrier is arranged in the placement box.

7. The laser processing device according to claim 6, characterized in that: The carrier comprises: A support frame, the support frame is arranged in the placement box; A support bar, wherein the support bar is arranged on the support frame; a second driving assembly, the second driving assembly being disposed on the supporting frame; A pressing member is arranged at the output end of the second driving component, and the second driving component is used to drive the pressing member to move closer to or away from the supporting frame.

8. The laser processing device according to claim 6, characterized in that: Both ends of the second telescopic cover along the first direction are folded over the outer side of the placement box.

9. The laser processing device according to claim 1, characterized in that: The processing device also includes: A protection box, wherein the first telescopic cover is connected to the protection box, the laser head is arranged in the protection box, and the light outlet of the laser head extends from the protection box into the first telescopic cover; A closed door is provided on the protection box to open or close the protection box.

10. A laser processing device, characterized in that: The laser processing equipment includes the laser processing device according to any one of claims 1 to 9.

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