Easy-to-clean type plastic packaging mold for semiconductor packaging

Abstract

The utility model relates to the field of semiconductor injection molds, in particular to an easy-to-clean plastic packaging mold for semiconductor packaging, which comprises an upper closing mold and a lower closing mold, a cleaning component is arranged between the upper closing mold and the lower closing mold, the cleaning component comprises a cleaning waterway, a water injection cylinder and a connecting block, and the connecting block is connected with the lower closing mold. The cleaning water paths are distributed at the positions, close to the connecting block, of the upper mold assembly and the lower mold assembly, the lower end of the connecting block is communicated with the cleaning water paths, the water injection cylinder is rotatably installed in the middle of the connecting block, and one side of the water injection cylinder is provided with a communicating hole matched with the cleaning water paths. Through mutual cooperation of the cleaning water path, the water injection cylinder and the connecting block, the water injection cylinder can be rotated, so that the communicating hole is communicated with the cleaning water path, then the water injection cylinder is connected with an external water source, water injection and pressurization are performed, the interior of the mold cavity is cleaned, dirt remaining in the cavity is reduced, and the packaging effect of a semiconductor is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor injection molds, in particular to an easy-to-clean plastic sealing mold for semiconductor packaging. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. In the semiconductor packaging process, plastic packaging molds are needed to support the plastic packaging process. There are at least the following disadvantages in the use of existing semiconductor packaging plastic packaging molds:

[0003] When semiconductors are packaged through injection molds, the molten plastic easily leaves dirt inside the mold, and it is inconvenient to clean the inside of the mold, which will affect the packaging effect of the semiconductor. Therefore, it is necessary to propose an easy-to-clean plastic mold for semiconductor packaging to solve the above problems. Utility Model Content

[0004] The utility model aims to solve the above defects and provide an easy-to-clean plastic sealing mold for semiconductor packaging.

[0005] The purpose of the utility model is achieved in the following way: an easy-to-clean plastic sealing mold for semiconductor packaging, including an upper mold and a lower mold, a cleaning component is provided between the upper mold and the lower mold, the cleaning component includes a cleaning water channel, a water injection cylinder and a connecting block, the connecting block is connected to the lower mold, the cleaning water channel is distributed in the upper mold and the lower mold near the connecting block, the lower end of the connecting block is connected to the cleaning water channel, the water injection cylinder is rotatably installed in the middle of the connecting block, and one side of the water injection cylinder is provided with a connecting hole matching the cleaning water channel.

[0006] In the above description, as a further solution, the water injection cylinder is a hollow structure, one end of the water injection cylinder is provided with a connecting valve for water injection, and the end of the water injection cylinder away from the connecting valve is provided with a rotating ring.

[0007] In the above description, as a further solution, a positioning point is provided at one end of the connecting block near the rotating ring, and an indicator needle is provided at the lower end of the connecting ring.

[0008] In the above description, as a further solution, the bottom surface of the upper mold and the top surface of the lower mold are both distributed with chip mold cavities and injection mold cavities, and the chip mold cavity close to the clean water channel is connected to the clean water channel.

[0009] In the above description, as a further solution, both sides of the upper mold and both sides of the lower mold are provided with injection water channels for injection molding, the injection water channels extend toward the injection mold cavity, and a fixed valve is provided at one end of the injection water channels.

[0010] In the above description, as a further solution, both ends of the lower mold top surface are provided with positioning columns for connection, both ends of the upper mold bottom surface are provided with card grooves matching the positioning columns, and the middle part of the upper mold bottom surface is provided with a connecting groove matching the connecting block.

[0011] The beneficial effects produced by the utility model are as follows: the easy-to-clean plastic encapsulation mold for semiconductor packaging can rotate the water injection cylinder through the mutual cooperation between the cleaning water channel, the water injection cylinder and the connecting block, so that the connecting hole and the cleaning water channel are connected, and then the water injection cylinder is connected to the external water source to inject water and increase pressure to clean the inside of the mold cavity, and the sewage can be discharged from the injection water channel, thereby reducing the dirt remaining in the cavity and improving the packaging effect of the semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional structural schematic diagram of the plastic sealing mold for easy-to-clean semiconductor packaging of the utility model;

[0013] Figure 2 This is a schematic diagram of the structure of the plastic encapsulation mold for the easy-to-clean semiconductor package of the utility model;

[0014] Figure 3 It is a cross-sectional view of the plastic encapsulation mold for easy-to-clean semiconductor packaging of the utility model;

[0015] In the figure: 1-upper mold, 2-lower mold, 3-cleaning water channel, 4-water injection cylinder, 5-connecting block, 6-connecting hole, 7-connecting valve, 8-rotating ring, 9-positioning point, 10-indicator needle, 11-chip mold cavity, 12-injection mold cavity, 13-injection water channel, 14-fixed valve, 15-positioning column. DETAILED DESCRIPTION

[0016] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the embodiments and drawings, and the contents mentioned in the implementation modes are not intended to limit the present invention. The present invention is described in detail below in conjunction with the drawings.

[0017] See also Figure 1-3 The specific implementation of the easy-to-clean plastic encapsulation mold for semiconductor packaging includes an upper mold 1 and a lower mold 2, a cleaning component is provided between the upper mold 1 and the lower mold 2, the cleaning component includes a cleaning water channel 3, a water injection cylinder 4 and a connecting block 5, the connecting block 5 is connected to the lower mold 2, the cleaning water channel 3 is distributed at positions of the upper mold 1 and the lower mold 2 close to the connecting block 5, the lower end of the connecting block 5 is connected to the cleaning water channel 3, the water injection cylinder 4 is rotatably installed in the middle of the connecting block 5, and a connecting hole 6 matching the cleaning water channel 3 is provided on one side of the water injection cylinder 4.

[0018] The water injection cylinder 4 is a hollow structure, and a connecting valve 7 for water injection is provided at one end of the water injection cylinder 4, a rotating ring 8 is provided at the end of the water injection cylinder 4 away from the connecting valve 7, a positioning point 10 is provided at one end of the connecting block 5 near the rotating ring 8, and an indicator needle 10 is provided at the lower end of the connecting ring.

[0019] The bottom surface of the upper mold 1 and the top surface of the lower mold are both distributed with a chip mold cavity 11 and an injection mold cavity 12. The chip mold cavity 11 close to the clean water channel 3 is connected to the clean water channel 3. Both sides of the upper mold 1 and both sides of the lower mold 2 are provided with injection water channels 13 for injection molding. The injection water channel 13 extends toward the injection mold cavity 12, and a fixed valve 14 is provided at one end of the injection water channel 13.

[0020] Both ends of the top surface of the lower clamping mold 2 are provided with positioning columns 15 for connection, and both ends of the bottom surface of the upper clamping mold 1 are provided with slots matching the positioning columns 15. The middle part of the bottom surface of the upper clamping mold 1 is provided with a connecting groove matching the connecting block 5.

[0021] When cleaning the easy-to-clean semiconductor packaging plastic mold, the water injection cylinder 4 is rotated to make the connecting hole 6 and the cleaning water path 3 conductive, and then the water injection cylinder 4 is connected to the external water source to inject water and increase pressure to clean the inside of the mold cavity, and the sewage can be discharged from the injection water path 13, thereby reducing the dirt remaining in the cavity and improving the packaging effect of the semiconductor;

[0022] When performing injection molding, it is only necessary to rotate the water injection cylinder 4. After rotation, the semiconductor chip is placed in the position of the chip cavity 11, and the chip blocks the clean water channel; the mold is closed, and the injection liquid is injected from the injection water channel 13 into the injection cavity 12 to complete the injection molding.

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0024] In addition, in the description of the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In the description of the present utility model, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0025] Finally, it should be noted that the above embodiments are only specific implementation methods of the utility model, which are used to illustrate the technical solution of the utility model, rather than to limit it. The protection scope of the utility model is not limited thereto. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art should understand that any technician familiar with the technical field can still modify the technical solution recorded in the above embodiments within the technical scope disclosed by the utility model, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiment of the utility model, and should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.

Claims

1. An easy-to-clean plastic mold for semiconductor packaging, comprising an upper mold and a lower mold, wherein a cleaning component is provided between the upper mold and the lower mold, and characterized in that: The cleaning assembly includes a cleaning water circuit, a water injection cylinder and a connecting block. The connecting block is connected to the lower mold. The cleaning water circuit is distributed at positions of the upper mold and the lower mold near the connecting block. The lower end of the connecting block is connected to the cleaning water circuit. The water injection cylinder is rotatably installed in the middle of the connecting block. A connecting hole matching the cleaning water circuit is provided on one side of the water injection cylinder.

2. The easy-to-clean plastic mold for semiconductor packaging according to claim 1, characterized in that: The water injection cylinder is a hollow structure, one end of the water injection cylinder is provided with a connecting valve for water injection, and the end of the water injection cylinder away from the connecting valve is provided with a rotating ring.

3. The easy-to-clean plastic encapsulation mold for semiconductor packaging according to claim 2, characterized in that: A positioning point is arranged at a position close to the rotating ring at one end of the connecting block, and an indicating needle is arranged at the lower end of the connecting ring.

4. The easy-to-clean plastic mold for semiconductor packaging according to claim 1, characterized in that: The bottom surface of the upper mold and the top surface of the lower mold are both distributed with chip mold cavities and injection mold cavities, and the chip mold cavity close to the clean water channel is connected to the clean water channel.

5. The easy-to-clean plastic mold for semiconductor packaging according to claim 4, characterized in that: Both sides of the upper mold and both sides of the lower mold are provided with injection water channels for injection molding, the injection water channels extend toward the injection mold cavity, and a fixed valve is provided at one end of the injection water channels.

6. The easy-to-clean plastic encapsulation mold for semiconductor packaging according to claim 1, characterized in that: Both ends of the lower mold top surface are provided with positioning columns for connection, both ends of the upper mold bottom surface are provided with slots matching the positioning columns, and the middle of the upper mold bottom surface is provided with a connecting groove matching the connecting block.

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