Silicon carbide module packaging structure, motor controller and automobile

Abstract

The utility model belongs to the technical field of automobile motor controllers, and particularly relates to a silicon carbide module packaging structure, a motor controller and an automobile. According to the silicon carbide module packaging structure, the first active metal welding ceramic substrate is arranged on the upper side of the silicon carbide module, and the second active metal welding ceramic substrate is arranged on the lower side of the silicon carbide module; wherein the first active metal welding ceramic substrate and the second active metal welding ceramic substrate can be directly sintered through an active brazing process and then are directly arranged in the silicon carbide module through a simple filling process and the like, namely, the similar thermal process modes such as heat-conducting glue or solder welding when a copper substrate is arranged are not needed; therefore, the process installation requirement is reduced; meanwhile, the water cooling unit is further arranged, heat dissipation can be conducted on the heat conduction part on the lower side, and therefore the heat dissipation amount of the silicon carbide module is increased.

Description

Technical Field

[0001] This application belongs to the technical field of automotive motor controllers, and particularly relates to a silicon carbide module packaging structure, a motor controller, and an automobile. Background Art

[0002] In the technology of automotive motor controllers, the use of silicon carbide modules is included. In the existing packaging process of silicon carbide modules, single-sided or double-sided copper substrates are generally used for cooling. However, due to the single heat dissipation path of the single-sided heat dissipation structure, the heat dissipation effect is limited, and it is difficult to meet the heat management requirements under high power density conditions. Although the double-sided copper substrate heat dissipation structure has certain advantages in heat dissipation performance, its installation process is complex, increasing the cost and process difficulty. Summary of the Invention

[0003] An object of the invention of this application is to provide a silicon carbide module packaging structure that can achieve double-sided cooling of the silicon carbide module and reduce the installation process requirements.

[0004] Another object of the invention of this application is to provide a motor controller, which includes the above-mentioned silicon carbide module packaging structure.

[0005] Another object of the invention of this application is to provide an automobile, which includes the above-mentioned motor controller.

[0006] According to an embodiment of this application, in the first aspect, a silicon carbide module packaging structure is provided. The silicon carbide module packaging structure includes:

[0007] A silicon carbide module, on the upper side of the silicon carbide module, there is a first active metal brazed ceramic substrate and a first heat sink, on the lower side of the silicon carbide module, there is a second active metal brazed ceramic substrate and a second heat sink, and a heat conducting part is arranged at the lower part of the second heat sink;

[0008] A water cooling unit is arranged on the lower side of the second heat sink, and the water cooling unit can provide water cooling for the heat conducting part.

[0009] In one embodiment, the end of the heat conducting part facing the water cooling unit is semi-circular or semi-elliptical.

[0010] In one embodiment, the water cooling unit includes a cavity, the cavity is provided with a water inlet and a drain outlet, and the heat conducting part faces the cavity.

[0011] In one embodiment, a sealing layer is arranged between the side of the cavity facing the second heat sink and the second heat sink.

[0012] In one embodiment, the water cooling unit is threadedly connected to the second heat sink.

[0013] In one embodiment, a thermal conductive layer is provided between the first heat sink and the first active metal brazed ceramic substrate; and / or, the first heat sink is threadedly connected to the silicon carbide module.

[0014] In one embodiment, the first active metal brazed ceramic substrate includes a metal layer and a ceramic layer. The ceramic layer is close to the silicon carbide module, and the metal layer is located on the upper side of the ceramic layer; and / or, the second active metal brazed ceramic substrate has the same composition as the first active metal brazed ceramic substrate.

[0015] In one embodiment, the material of the metal layer is copper.

[0016] According to an embodiment of the present application, in a second aspect, a motor controller is provided, including the silicon carbide module packaging structure described above.

[0017] According to an embodiment of the present application, in a third aspect, a vehicle is provided, including the motor controller described above.

[0018] In the silicon carbide module packaging structure of the present application, by providing a first active metal brazed ceramic substrate on the upper side of the silicon carbide module and a second active metal brazed ceramic substrate on the lower side of the silicon carbide module, the first active metal brazed ceramic substrate and the second active metal brazed ceramic substrate can be directly sintered through an active brazing process and then directly disposed in the silicon carbide module through a simple filling process or the like. That is, it is not necessary to use thermal process methods such as thermal conductive glue or solder welding when setting a copper substrate, thereby reducing the process installation requirements; at the same time, a water cooling unit is also provided in the present application, which can dissipate heat from the lower thermal conduction part, thereby accelerating the heat dissipation of the silicon carbide module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic structural diagram of a silicon carbide module packaging structure in an embodiment of the present application;

[0020] Figure 2 It is a schematic structural diagram of a silicon carbide module in an embodiment of the present application.

[0021] Description of the drawing reference numerals:

[0022] 100, silicon carbide module; 110, first active metal brazed ceramic substrate; 111, ceramic layer;

[0023] 112, metal layer; 120, first heat sink; 130, second active metal brazed ceramic substrate;

[0024] 140, second heat sink; 150, thermal conduction part;

[0025] 210. Cavity; 211. Water inlet; 212. Drain outlet. Detailed implementation manners

[0026] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0027] It should be noted that the diagrams provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner.

[0028] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the limiting conditions under which the present invention can be implemented. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention.

[0029] The orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "middle", "longitudinal", "transverse", "horizontal", "inner", "outer", "radial", "circumferential", etc. cited in this specification is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0030] As described in the background, the use of silicon carbide modules is included in the technology of automotive motor controllers. In the existing packaging process of silicon carbide modules, single-sided or double-sided copper substrates are generally used for cooling. However, due to the single heat dissipation path, the heat dissipation effect of the single-sided heat dissipation structure is limited, and it is difficult to meet the heat management requirements under high power density conditions. Although the double-sided copper substrate heat dissipation structure has certain advantages in terms of heat dissipation performance, its installation process is complex, increasing the cost and process difficulty. In order to better solve this problem, the R & D personnel proposed a silicon carbide module packaging structure, which can achieve double-sided cooling of the silicon carbide module and reduce the installation process requirements.

[0031] As Figure 1 shown, Figure 1FIG. 0 is a schematic structural diagram of a silicon carbide module packaging structure in an embodiment of the present application. The silicon carbide module packaging structure includes a silicon carbide module 100 and a water cooling unit. A first active metal brazed ceramic substrate 110 is disposed on the upper side of the silicon carbide module 100, and a second active metal brazed ceramic substrate 130 is disposed on the lower side of the silicon carbide module 100. Due to the first active metal brazed ceramic substrate 110 and the second active metal brazed ceramic substrate 130, a metal layer 112 is directly sintered on the ceramic substrate in advance by an active brazing process, thereby forming a highly integrated heat dissipation substrate. Then, the first active metal brazed ceramic substrate 110 and the second active metal brazed ceramic substrate 130 can be disposed in the silicon carbide module 100 through a simple filling layer setting process, so as to be used for double-sided cooling of the silicon carbide module 100. At the same time, in this embodiment, a water cooling unit is further disposed on the lower side of the second active metal brazed ceramic substrate 130 to accelerate the heat dissipation of the silicon carbide module 100.

[0032] Specifically, a first active metal brazed ceramic substrate 110 and a first heat sink 120 are disposed on the upper side of the silicon carbide module 100, a second active metal brazed ceramic substrate 130 and a second heat sink 140 are disposed on the lower side of the silicon carbide module 100, and a heat conducting portion 150 is disposed at the lower part of the second heat sink 140. The water cooling unit is disposed on the lower side of the second heat sink 140, and the water cooling unit can provide water cooling to the heat conducting portion 150.

[0033] In this embodiment, by disposing the first active metal brazed ceramic substrate 110 on the upper side of the silicon carbide module 100 and the second active metal brazed ceramic substrate 130 on the lower side of the silicon carbide module 100, double-sided cooling of the silicon carbide module 100 can be achieved. The heat on the upper side of the silicon carbide module 100 is transferred to the first heat sink 120 through the first active metal brazed ceramic substrate 110, and the heat on the lower side of the silicon carbide module 100 is transferred to the second heat sink 140 through the second active metal brazed ceramic substrate 130 and is transferred to the water cooling unit through the heat conducting portion 150 at the lower part of the second heat sink 140. The heat conducting portion 150 is cooled by water cooling, thereby accelerating the cooling of the silicon carbide module 100. That is, in this embodiment, by disposing the first active metal brazed ceramic substrate 110 and the second active metal brazed ceramic substrate 130, compared with the existing solution of disposing a copper substrate, the process installation difficulty can be reduced, and at the same time, the heat dissipation rate of the silicon carbide module 100 can be further accelerated by the water cooling unit disposed on the lower side.

[0034] In one embodiment, the end of the heat conducting portion 150 facing the water cooling unit is semi-circular or semi-elliptical.

[0035] In this embodiment, by designing the end of the heat conduction part 150 facing the water cooling unit into a semi-circular or semi-elliptical structure, compared with the traditional straight design, this structure can effectively increase the contact area between the heat conduction part 150 and the water cooling unit, and improve the heat conduction efficiency. Due to the increase in the contact area, the heat conduction part 150 can transfer the heat from the lower side of the silicon carbide module 100 to the water cooling unit faster, thereby accelerating the overall heat dissipation rate.

[0036] In one embodiment, referring to Figure 1 As shown, the water cooling unit includes a cavity 210, the cavity 210 is provided with a water inlet 211 and a drain outlet 212, and the heat conduction part 150 faces the cavity 210.

[0037] In this embodiment, the water cooling unit includes a cavity 210 provided with a water inlet 211 and a drain outlet 212, and the heat conduction part 150 is arranged facing the cavity 210. This design enables the heat conduction part 150 to directly transfer heat to the coolant inside the cavity 210, and then quickly remove the heat through the circulation of the coolant. The water inlet 211 and the drain outlet 212 provided in the cavity 210 can ensure that the coolant forms an effective flow path around the heat conduction part 150, further improving the heat dissipation efficiency.

[0038] Furthermore, in one embodiment, a sealing layer is provided between the side of the cavity 210 facing the second heat sink 140 and the second heat sink 140.

[0039] In this embodiment, a sealing layer is provided between the side of the cavity 210 facing the second heat sink 140 and the second heat sink 140. The design of the sealing layer can effectively prevent the coolant from leaking from the contact surface between the cavity 210 and the second heat sink 140, ensuring the sealing performance of the water cooling unit. By providing a sealing layer between the cavity 210 and the second heat sink 140, the stable contact between the heat conduction part 150 and the water cooling unit can be maintained, further improving the heat dissipation efficiency. In addition, the presence of the sealing layer can also prevent external pollutants from entering the cavity 210, protecting the long-term stable operation of the water cooling system, and ensuring the safety and heat dissipation performance of the silicon carbide module 100 under high power density conditions. Among them, the sealing layer can be a sealing strip.

[0040] In one embodiment, the water cooling unit is threadedly connected to the second heat sink 140.

[0041] In this embodiment, the water cooling unit and the second heat sink 140 are threadedly connected. The threaded connection method provides a firm and detachable connection method, which is convenient for later installation and maintenance. The threaded connection method not only ensures the close contact between the water cooling unit and the second heat sink 140, thereby enhancing the heat conduction efficiency, but also enables convenient component replacement or maintenance when needed.

[0042] In one embodiment, a thermal conductive layer is provided between the first heat sink 120 and the first active metal brazed ceramic substrate 110; and / or, the first heat sink 120 is threadedly connected to the silicon carbide module 100.

[0043] In this embodiment, a thermal conductive layer is provided between the first heat sink 120 and the first active metal brazed ceramic substrate 110. The thermal conductive layer can be made of a material with high thermal conductivity, such as thermal grease or thermal pad, which can effectively reduce the thermal resistance and ensure that the heat generated by the silicon carbide module 100 is quickly transferred to the first heat sink 120, thereby improving the overall heat dissipation effect. In addition, the first heat sink 120 and the silicon carbide module 100 can also be threadedly connected. This threaded connection design makes the contact between the first heat sink 120 and the silicon carbide module 100 closer.

[0044] In one embodiment, referring to Figure 2 As shown, the first active metal brazed ceramic substrate 110 includes a metal layer 112 and a ceramic layer 111. The ceramic layer 111 is close to the silicon carbide module 100, and the metal layer 112 is located on the upper side of the ceramic layer 111; and / or, the second active metal brazed ceramic substrate 130 has the same composition as the first active metal brazed ceramic substrate 110.

[0045] In this embodiment, the first active metal brazed ceramic substrate 110 includes a metal layer 112 and a ceramic layer 111. The ceramic layer 111 is in close contact with the silicon carbide module 100, while the metal layer 112 is located on the upper side of the ceramic layer 111. The advantage of this structural design is that the ceramic layer 111, as an insulating layer, can effectively prevent electrical interference between the silicon carbide module 100 and external electrical components, and at the same time has a high thermal conductivity, which can quickly transfer the heat generated by the silicon carbide module 100 to the upper metal layer 112. Due to its high thermal conductivity, the metal layer 112 further transfers the heat quickly to the first heat sink 120, thereby improving the upper-side heat dissipation efficiency. In addition, the second active metal brazed ceramic substrate 130 has the same composition as the first active metal brazed ceramic substrate 110, enabling similar thermal management characteristics on both the upper and lower sides of the silicon carbide module 100.

[0046] Further, in one embodiment, the material of the metal layer 112 is copper. In this embodiment, the material of the metal layer 112 is selected as copper. This choice is based on the excellent thermal conductivity of copper, which enables it to quickly conduct the heat transferred by the ceramic layer 111 to the heat sink.

[0047] This application also proposes a motor controller, including the above-mentioned silicon carbide module packaging structure.

[0048] In a motor controller, by integrating this optimized silicon carbide module packaging structure, the motor controller can operate under high-power and high-frequency conditions and can significantly improve heat dissipation performance and electrical stability.

[0049] This application also provides a vehicle, which includes the above-mentioned motor controller.

[0050] In the vehicle, by adopting this motor controller, the vehicle can maintain a lower thermal load during high-performance operation, thereby improving the overall efficiency and reliability of the vehicle.

[0051] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0052] The above embodiments only represent several implementation manners of this application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of the patent of this application shall be subject to the appended claims.

Claims

1. A silicon carbide module packaging structure, characterized in that: The silicon carbide module packaging structure comprises: A silicon carbide module (100), wherein a first active metal welded ceramic substrate (110) and a first heat sink (120) are arranged on the upper side of the silicon carbide module (100), a second active metal welded ceramic substrate (130) and a second heat sink (140) are arranged on the lower side of the silicon carbide module (100), and a heat conducting portion (150) is arranged at the lower part of the second heat sink (140); A water cooling unit is arranged at the lower side of the second heat sink (140), and the water cooling unit can provide water cooling to the heat conduction part (150).

2. The silicon carbide module packaging structure according to claim 1, characterized in that: The end of the heat conducting portion (150) facing the water cooling unit is semicircular or semi-elliptical.

3. The silicon carbide module packaging structure according to claim 1, characterized in that: The water cooling unit comprises a cavity (210), the cavity (210) is provided with a water inlet (211) and a water outlet (212), and the heat conducting part (150) faces the cavity (210).

4. The silicon carbide module packaging structure according to claim 3, characterized in that: A sealing layer is provided between a side of the cavity (210) facing the second heat sink (140) and the second heat sink (140).

5. The silicon carbide module packaging structure according to claim 1, characterized in that: The water cooling unit is threadedly connected to the second heat sink (140).

6. The silicon carbide module packaging structure according to claim 1, characterized in that: A heat-conducting layer is provided between the first heat sink (120) and the first active metal welded ceramic substrate (110); and / or the first heat sink (120) and the silicon carbide module (100) are threadedly connected.

7. The silicon carbide module packaging structure according to claim 1, characterized in that: The first active metal welded ceramic substrate (110) comprises a metal layer (112) and a ceramic layer (111), wherein the ceramic layer (111) is close to the silicon carbide module (100), and the metal layer (112) is located on the upper side of the ceramic layer (111); and / or the composition of the second active metal welded ceramic substrate (130) is the same as that of the first active metal welded ceramic substrate (110).

8. The silicon carbide module packaging structure according to claim 7, characterized in that: The material of the metal layer (112) is copper.

9. A motor controller, characterized in that: The invention comprises the silicon carbide module packaging structure as described in any one of claims 1 to 8.

10. An automobile, characterized in that: Includes the motor controller described in claim 9.

Images