Open type ceramic pressure and temperature sensor for non-conducting medium
By setting a conductive silk-screen layer and a glass glaze layer on the ceramic carrier and combining it with an O-ring seal, the problems of medium penetration and slow response time are solved, and a ceramic pressure and temperature sensor with fast response and reliable sealing is realized.
CN223346202UActive Publication Date: 2025-09-16WUXI SHENGBANG ELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202422522072.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-18
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-18
AI Technical Summary
Technical Problem
When the existing pressure and temperature sensor uses a clamp injection molding structure in the medium, the medium is easily permeated, resulting in seal failure, and the NTC thermistor has a slow response time.
Method used
The open-type ceramic pressure and temperature sensor is designed, using the conductive silk-screen layer and glass glaze layer on the ceramic carrier combined with O-ring sealing. The NTC thermistor is directly immersed in the medium, and the signal is transmitted through the conductive pin. O-rings are set at key positions to ensure sealing.
Benefits of technology
The fast response of the NTC thermistor in the medium is achieved, while the sealing failure caused by temperature changes is avoided, ensuring the long-term reliability of the sensor.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model discloses an open-type ceramic pressure and temperature sensor for a non-conducting medium, which solves the problem of uneven plane of a conductive silk-screen layer by sintering the conductive silk-screen layer on a ceramic chip and covering a glass glaze layer on the conductive layer to serve as a sealing surface of an O-shaped ring, and enables the surface of the conductive silk-screen layer to be sealed through a conductive pin outside the internal O-shaped ring. And a temperature signal of the NTC is transmitted to the FPC at the upper part of the pressure core body, so that the transmission of the NTC signal is realized. O-shaped rings are arranged on the upper surface and the lower surface of the ceramic chip for product sealing, and the influence of temperature change on the sealing structure can be almost ignored.
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