Optical package structure

Abstract

The utility model discloses an optical packaging structure, which mainly provides a first optical packaging unit and a second optical packaging unit, and is in signal connection with the first optical packaging unit and the second optical packaging unit through an optical transmission element, so that the signal communication efficiency is improved.

Description

Technical Field

[0001] This application relates to a semiconductor packaging structure, and more particularly to an optical packaging structure with optical elements. Background Technology

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, processed, and stored. The demand for data transmission, in particular, is surging, leading industries to replace electricity with light as the data transmission medium to improve transmission capacity, efficiency, and distance, while reducing energy consumption. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technology.

[0003] Please see Figure 1A and Figure 1B The diagram shows a top view and a partial cross-sectional view of the existing co-packaged optical device 1.

[0004] like Figure 1A As shown, in the existing co-packaged optical device 1, multiple optical engines 11 and a conversion chip 12 are integrated onto a circuit board 10. Figure 1B As shown, the conversion chip 12 is first disposed on a substrate 13, and then connected to the circuit board 10 through the substrate 13. Each optical engine 11 includes a semiconductor chip 112 formed in a package structure 111 and an optical chip 113 connected to the package structure 111. One end of the optical chip 113 is connected to an optical fiber 14, and a shelf 15 is provided below the junction of the optical chip 113 and the optical fiber 14 to enable the optical signal to be transmitted to the photoelectric engine 11 for communication.

[0005] However, in the aforementioned co-packaged optical device, the optical chip and the conversion chip must transmit signals through the metal lines in the circuit board and substrate. Not only is the overall size of the device too large and too thick, which is not conducive to the miniaturization of electronic products, but its signal transmission path is also too long, which can easily lead to signal loss and cause problems in the application of end products. In addition, there is a risk that the support is suspended, resulting in insufficient support for the optical fiber and breakage.

[0006] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content

[0007] In view of the various deficiencies of the prior art, this application provides an optical packaging structure, including: a first optical packaging unit, comprising a first electronic component and a first optical engine; a second optical packaging unit, comprising a second electronic component and a second optical engine; and an optical transmission element, one end of which is connected to the first optical engine of the first optical packaging unit, and the other end of which is connected to the second optical engine of the second optical packaging unit.

[0008] This application also provides a method for manufacturing an optical packaging structure, comprising: providing a first optical packaging unit, which includes a first electronic component and a first optical engine; providing a second optical packaging unit, which includes a second electronic component and a second optical engine; and connecting the first optical packaging unit and the second optical packaging unit with an optical transmission element, wherein one end of the optical transmission element is connected to the first optical engine of the first optical packaging unit, and the other end is connected to the second optical engine of the second optical packaging unit.

[0009] In the aforementioned optical packaging structure and its manufacturing method, the first electronic component is a system single-chip.

[0010] In the aforementioned optical packaging structure and its manufacturing method, the optical transmission element is an optical waveguide element or a dielectric planar waveguide.

[0011] In the aforementioned optical packaging structure and manufacturing method, the first optical packaging unit further includes a carrier plate for mounting the first electronic component and the first optical engine. The carrier plate is an intermediary plate with multiple conductive perforations.

[0012] In the aforementioned optical packaging structure and manufacturing method, the first optical packaging unit further includes a covering layer that covers the first optical engine and the first electronic component.

[0013] In the aforementioned optical packaging structure and its manufacturing method, each of the first optical engine and the second optical engine includes an optical element and a semiconductor element stacked on the optical element. The optical element has multiple vias. The optical element is an optical chip or an optical module. The semiconductor element is an integrated circuit element. The first optical engine and the second optical engine further include optical elements disposed on the optical element.

[0014] In the aforementioned optical packaging structure and manufacturing method, the second optical packaging unit further includes another carrier plate for mounting the second electronic component and the second optical engine.

[0015] In the aforementioned optical packaging structure and its manufacturing method, the second electronic component is a high-bandwidth memory.

[0016] In the aforementioned optical packaging structure and its manufacturing method, the first optical packaging unit and the second optical packaging unit are disposed on a circuit board.

[0017] As can be seen from the above, the optical packaging structure of this application mainly involves placing electronic components on a carrier plate, and sequentially stacking optical components and semiconductor components on the carrier plate to form a three-layer vertically stacked optical engine. Simultaneously, through multiple vias formed in the optical components and multiple conductive vias formed in the carrier plate, the optical components, semiconductor components, electronic components, and carrier plate can be directly electrically connected to each other through these vias and vias, thereby shortening the signal transmission path between them and improving the transmission rate. Furthermore, the optical components are supported by the optical components and the carrier plate, reducing the risk of breakage. Moreover, the optical packaging unit, composed of electronic components and the optical engine mounted on the carrier plate, can be mounted on a circuit board together with another optical packaging unit, and an optical transmission element can be used to connect the optical packaging unit and the other optical packaging unit, enabling optical communication between multiple optical packaging units, thereby improving signal communication performance. Attached Figure Description

[0018] Figure 1A and Figure 1B This is a plan view and a partial cross-sectional view of an existing co-packaged optical device.

[0019] Figures 2A to 2E This is a cross-sectional and top view of the optical packaging structure and its manufacturing method of this application.

[0020] Explanation of reference numerals in the attached figures

[0021] 1. Co-packaged optical devices

[0022] 10 Circuit Boards

[0023] 11 Optical Engine

[0024] 111 Package Structure

[0025] 112 Semiconductor wafers

[0026] 113 Optical Chip

[0027] 12 conversion chips

[0028] 13 substrate

[0029] 14 optical fibers

[0030] 15 brackets

[0031] 2. Optical Packaging Structure

[0032] 2a First Optical Engine

[0033] 2a' Second optical engine

[0034] 2b First optical packaging unit

[0035] 2c Second optical packaging unit

[0036] 20,20' bearing plate

[0037] 20a First side

[0038] 20b Second side

[0039] 200 conductive via

[0040] 21 First Electronic Component

[0041] 22' Second electronic component

[0042] 23 Optical Components

[0043] 230 Through Hole

[0044] 24 Semiconductor Components

[0045] 25 Optical Components

[0046] 26 Conductive elements

[0047] 27. Coating layer

[0048] 28 circuit boards

[0049] 29. Optical transmission elements. Detailed Implementation

[0050] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0051] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "third," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0052] Please see Figures 2A to 2E The diagram shows a cross-sectional view and a top view of the optical packaging structure and its manufacturing method of this application.

[0053] like Figure 2A As shown, a carrier plate 20 is provided, and a first electronic component 21 and an optical component 23 are disposed on and electrically connected to the carrier plate 20, and a semiconductor component 24 and an optical component 25 are disposed on and electrically connected to the optical component 23.

[0054] The carrier plate 20 is, for example, an interposer plate, and has a plurality of conductive vias 200 (e.g., conductive silicon vias) formed inside it. The carrier plate 20 has a first side 20a and a second side 20b opposite to each other. The first electronic component 21 and the optical component 23 are disposed on the first side 20a, and a plurality of conductive components 26 (e.g., solder bumps or copper bumps) can be implanted on the second side 20b of the carrier plate 20.

[0055] In this embodiment, the first electronic component 21 is a system-on-a-chip (SoC), such as a switch ASIC, which can be mounted and electrically connected to the carrier plate 20 via multiple conductive bumps.

[0056] The optical element 23 has multiple through holes 230 formed therein, and can be connected to the carrier plate 20 by multiple conductive bumps.

[0057] In this embodiment, the optical element 23 is, for example, an optical chip (photonic integrated circuit, PIC) or an optical module (PIC module), which selectively includes a coupler, an optical chip, a total reflection mirror, a fiber array unit (FAU), etc.

[0058] The semiconductor element 24 is, for example, an electronic integrated circuit (EIC) element, which can be disposed and electrically connected to the optical element 23 through multiple conductive bumps.

[0059] The optical element 25, such as a fiber optic slot, lens, or bracket, is mounted on the optical element 23 and supported by the optical element 23 and the carrier plate 20 to reduce the risk of breakage of the optical element 23 or the optical element 25. In other embodiments, the optical element 25 may be integrated into the optical element 23.

[0060] like Figure 2B As shown, it is Figure 2AThe top view diagram shows that in this embodiment, the optical element 23 and the semiconductor element 24 (and the optical element 25) constitute a first optical engine (OE) 2a, wherein the first electronic element 21 and the first optical engine 2a are disposed on the same side of the carrier plate 20 and are arranged adjacent to each other.

[0061] This application utilizes multiple vias 230 formed in the optical element 23 to directly stack and electrically connect the semiconductor element 24, the optical element 23, and the carrier plate 20, thereby forming a 3D stacked structure to shorten the interconnection distance between the optical element 23 (PIC) and the semiconductor element 24 (EIC) and improve signal transmission efficiency. At the same time, multiple conductive vias 200 formed in the carrier plate 20 (intermediate plate) are used to integrate the first electronic component 21 (SoC) and the first optical engine 2a (OE) to further shorten the signal transmission distance.

[0062] like Figure 2C As shown, a packaging process is performed to form a covering layer 27 on the carrier plate 20, which covers the first optical engine 2a and the first electronic component 21. The covering layer 27 can be thinned so that the optical component 25 is exposed outside the covering layer 27, thereby forming the first optical packaging unit 2b. In this embodiment, the upper surface of the semiconductor component 24 and the upper surface of the first electronic component 21 are also exposed outside the covering layer 27.

[0063] like Figure 2D As shown, a circuit board 28 is provided, and the first optical packaging unit 2b is disposed on the circuit board 28. The first optical packaging unit 2b can be connected to the circuit board 28 through the plurality of conductive elements 26.

[0064] like Figure 2E As shown, a second optical packaging unit 2c is provided and disposed on the circuit board 28 and electrically connected to the circuit board 28. The second optical packaging unit 2c is adjacent to the first optical packaging unit 2b and is communicatively connected to the first optical packaging unit 2b to obtain the optical packaging structure 2 of this application.

[0065] The second optical packaging unit 2c is similar in formation and architecture to the first optical packaging unit 2b. It includes another carrier plate 20' (e.g., an interposer plate with multiple conductive vias), and a second electronic component 22' and another optical engine, namely a second optical engine 2a', disposed on the other carrier plate 20'. The second optical engine 2a' includes an optical element with multiple vias and semiconductor and optical elements disposed on the optical element, so that the second electronic component 22' and the second optical engine 2a' can be integrated using the other carrier plate 20'. The second electronic component 22' may be the same as the first electronic component 21 (e.g., a system-on-a-chip). In this embodiment, the second electronic component 22' is different from the first electronic component 21, for example, a high-bandwidth memory (HBM).

[0066] The first optical packaging unit 2b and the second optical packaging unit 2c can be directly connected to each other via the optical transmission element 29. In this embodiment, one end of the optical transmission element 29 (e.g., an optical waveguide element, a dielectric planar waveguide, or an optical fiber) can be connected to the first optical engine 2a (optoelectronic component) of the first optical packaging unit 2b, and the other end can be connected to the second optical engine 2a' (optoelectronic component) of the second optical packaging unit 2c, so as to realize optical communication between the first optical packaging unit 2b and the second optical packaging unit 2c, avoiding the losses caused by traditional communication using metal lines.

[0067] Through the aforementioned manufacturing method, this application also discloses an optical packaging structure 2, including: a first optical packaging unit 2b and a second optical packaging unit 2c; and an optical transmission element 29 that communicates with the first optical packaging unit 2b and the second optical packaging unit 2c.

[0068] The first optical packaging unit 2b includes a carrier plate 20, and a first electronic component 21 and a first optical engine 2a disposed on the carrier plate 20.

[0069] The second optical packaging unit 2c includes a carrier plate 20', a second electronic component 22' disposed on the carrier plate 20', and a second optical engine 2a', such that one end of the light transmission element 29 is connected to the first optical engine 2a of the first optical packaging unit 2b, and the other end is connected to the second optical engine 2a' of the second optical packaging unit 2c, thereby enabling optical communication between the first optical packaging unit 2b and the second optical packaging unit 2c. The first optical packaging unit 2b and the second optical packaging unit 2c are disposed on a circuit board 28.

[0070] In summary, the optical packaging structure of this application mainly involves placing electronic components on a carrier plate, and sequentially stacking optical elements and semiconductor elements on the carrier plate to form a three-layer vertically stacked optical engine. Simultaneously, through multiple vias formed in the optical elements and multiple conductive vias formed in the carrier plate, the optical elements, semiconductor elements, electronic components, and carrier plate can be directly electrically connected to each other vias and conductive vias, thereby shortening the signal transmission path between them and improving the transmission rate. Furthermore, the optical elements are supported by the optical elements and the carrier plate, reducing the risk of breakage. Moreover, the optical packaging unit, composed of electronic components and the optical engine mounted on the carrier plate, can be mounted on a circuit board together with another optical packaging unit, and an optical transmission element can be used to connect the optical packaging unit and the other optical packaging unit, enabling optical communication between multiple optical packaging units, thereby improving signal communication performance.

[0071] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. An optical package structure, characterized by, Comprising: a first optical package unit including a first electronic component and a first optical engine; a second optical package unit including a second electronic component and a second optical engine; and an optical transmission element having one end connected to the first optical engine of the first optical package unit and the other end connected to the second optical engine of the second optical package unit. The first electronic component is a system-on-chip.

2. The optical package structure of claim 1, wherein, The optical transmission element is an optical waveguide element or a dielectric slab waveguide.

3. The optical package structure of claim 1, wherein, The first optical package unit further includes a carrier plate for receiving the first electronic component and the first optical engine.

4. The optical package structure of claim 1, wherein, The carrier plate is an interposer having a plurality of conductive vias.

5. The optical package structure of claim 4, wherein, The first optical package unit further includes a cladding layer for cladding the first optical engine and the first electronic component.

6. The optical package structure of claim 4, wherein, The first optical engine and the second optical engine each include an optical component and a semiconductor component stacked on the optical component.

7. The optical packaging structure of claim 1, wherein, The optical component has a plurality of vias.

8. The optical package structure of claim 7, wherein, The optical component is an optical wafer or an optical module.

9. The optical package structure of claim 7, wherein, The semiconductor component is an electronic integrated circuit component.

10. The optical package structure of claim 7, wherein, The first optical engine and the second optical engine further include an optical element disposed on the optical component.

11. The optical package structure of claim 7, wherein, The second optical package unit further includes another carrier plate for receiving the second electronic component and the second optical engine.

12. The optical packaging structure of claim 1, wherein, The second electronic component is a high-bandwidth memory.

13. The optical packaging structure of claim 1, wherein, The first optical package unit and the second optical package unit are disposed on a circuit board.

14. The optical packaging structure of claim 1, wherein, ​

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