Efficient heat dissipation circuit board of electric control equipment

Abstract

The utility model relates to the field of circuit boards, in particular to a high-efficiency heat dissipation circuit board of electric control equipment, which comprises a protective frame. The upper end of the protective frame is fixedly connected with a high-thermal-conductivity insulating layer, the upper end of the high-thermal-conductivity insulating layer is fixedly connected with a circuit board, and the lower end of the protective frame is provided with a first groove body. An aluminum plate layer and a heat-conducting silicone grease layer of a traditional aluminum substrate are omitted, the high-heat-conducting insulating layer is directly adopted to be connected with the radiator, the heat conduction path is remarkably shortened, heat resistance is reduced, heat of heating elements such as MOS tubes on the circuit board can be conducted to the radiator more quickly and efficiently and dissipated, and the service life of the radiator is prolonged. The protective frame is made of a stainless steel material and is of an inverted-U-shaped structure, rigid support is provided for the circuit board and the radiator, the anti-deformation capacity of the overall structure is enhanced, the service life of the equipment is prolonged, the assembly process is simplified through the sliding fit design of the first groove body and the radiator, and the production efficiency is improved. And meanwhile, the radiator is convenient to maintain and replace in the later period.

Description

Technical Field

[0001] This utility model belongs to the field of circuit boards, specifically relating to a high-efficiency heat dissipation circuit board for electrical control equipment. Background Technology

[0002] With the rapid development of electronic technology, electronic control equipment is increasingly widely used in various fields. However, electronic control equipment generates a lot of heat during operation. If it cannot be dissipated in a timely and effective manner, it will lead to a decline in equipment performance, a shortened lifespan, or even serious safety accidents.

[0003] Traditional heat dissipation solutions for electronic control equipment typically employ an aluminum substrate with a heat sink. The aluminum substrate has excellent thermal conductivity, enabling it to conduct heat from heat-generating components (such as MOSFETs) to the heat sink, which then dissipates the heat into the air. However, thermal grease needs to be applied between the aluminum substrate and the heat sink to fill the gap and improve heat transfer efficiency. But thermal grease has limited thermal conductivity and is prone to aging and cracking after long-term use, leading to a decrease in heat transfer efficiency. Furthermore, the assembly process between the aluminum substrate and the heat sink is cumbersome, increasing production costs.

[0004] Therefore, a high-efficiency heat dissipation circuit board for electrical control equipment is proposed. In the traditional circuit board structure, the aluminum plate layer and thermal grease layer of the aluminum substrate are reduced, the heat conduction channel is shortened, the thermal resistance is lowered, and the heat of the MOSFET is conducted to the heat sink more quickly and efficiently, thereby improving the operating efficiency and service life of the equipment. Utility Model Content

[0005] To overcome the problem of poor heat dissipation of existing circuit boards, which makes it difficult to improve equipment operating efficiency and service life, a high-efficiency heat dissipation circuit board for electrical control equipment is proposed.

[0006] The technical solution of this utility model is as follows: a high-efficiency heat dissipation circuit board for electrical control equipment, including a protective frame; a high thermal conductivity insulating layer is fixedly connected to the upper end of the protective frame, and a circuit board is fixedly connected to the upper end of the high thermal conductivity insulating layer; a first groove is opened at the lower end of the protective frame, and a heat sink is provided on the inner wall of the first groove; a second groove is opened through the upper part of one side of the protective frame, and the second groove is wavy; a third groove is opened through the upper end of the protective frame, and the second groove and the third groove are interconnected; a heat-conducting frame is slidably provided on the inner wall of the third groove, and uniformly distributed heat-conducting blocks are fixedly connected to the upper and lower ends of the inner wall of the heat-conducting frame.

[0007] Preferably, the guard frame is inverted U-shaped and made of stainless steel.

[0008] Preferably, the radiator includes a first heat-conducting plate and heat dissipation blocks; the first heat-conducting plate is slidably disposed on both sides of the inner wall of the first tank, and the lower end of the first heat-conducting plate is fixedly connected to a uniformly distributed heat dissipation block.

[0009] Preferably, the two sides of the first heat-conducting plate are flush with the two sides of the protective frame, the two sides of the heat sink are flush with the two sides of the protective frame, and the lower end of the heat sink is flush with the lower end of the protective frame.

[0010] Preferably, the heat-conducting frame is made of heat-conducting material, and the distance between two adjacent heat-conducting blocks is three centimeters.

[0011] Preferably, the top surface area of ​​the heat-conducting frame is smaller than the top surface area of ​​the first heat-conducting plate.

[0012] Preferably, ventilation holes are provided at the four corners of the upper part of the frame, with an inner diameter of two centimeters.

[0013] The beneficial effects of this utility model are as follows: By eliminating the aluminum plate layer and thermal grease layer of the traditional aluminum substrate, and directly using a high thermal conductivity insulating layer to connect with the heat sink, the heat conduction path is significantly shortened, the thermal resistance is reduced, and the heat from heat-generating components such as MOSFETs on the circuit board can be conducted to the heat sink and dissipated more quickly and efficiently, greatly improving the stability of equipment operation and heat dissipation efficiency. The protective frame is made of stainless steel with an inverted U-shaped structure, which not only provides rigid support for the circuit board and heat sink, but also enhances the overall structure's resistance to deformation, avoids contact problems caused by thermal expansion and contraction, and extends the service life of the equipment. The sliding fit design between the first groove and the heat sink simplifies the assembly process, reduces production costs, and facilitates later maintenance and heat sink replacement. The design of the wavy second groove and the interconnected third groove, combined with the uniform distribution of the heat-conducting frame and heat-conducting blocks, effectively expands the heat dissipation area, solving the problem of poor heat dissipation effect of existing circuit boards, which makes it difficult to improve equipment operating efficiency and service life. Attached Figure Description

[0014] Figure 1 The diagram shown is a three-dimensional structural schematic of the high-efficiency heat dissipation circuit board for the electrical control equipment of this utility model.

[0015] Figure 2 The diagram shows a three-dimensional structural schematic of the protective frame of the high-efficiency heat dissipation circuit board for the electrical control equipment of this utility model.

[0016] Figure 3 The diagram shows a three-dimensional structural schematic of the heat-conducting frame of the high-efficiency heat dissipation circuit board for the electrical control equipment of this utility model.

[0017] Figure 4 The diagram shows a three-dimensional structure of the heat dissipation holes in the high-efficiency heat dissipation circuit board of the electrical control equipment of this utility model.

[0018] The labels in the attached diagram are as follows: 1. Protective frame; 2. High thermal conductivity insulation layer; 3. Circuit board; 4. First slot; 5. Heat sink; 51. First heat conduction plate; 52. Heat dissipation block; 6. Second slot; 7. Third slot; 8. Heat conduction frame; 9. Heat conduction block; 10. Heat dissipation hole. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Please see Figures 1-4 This utility model provides an embodiment: a high-efficiency heat dissipation circuit board for an electrical control device, including a protective frame 1; a high thermal conductivity insulation layer 2 is fixedly connected to the upper end of the protective frame 1, and a circuit board 3 is fixedly connected to the upper end of the high thermal conductivity insulation layer 2; a first groove 4 is opened at the lower end of the protective frame 1, and a heat sink 5 is provided on the inner wall of the first groove 4; a second groove 6 is opened through the upper part of one side of the protective frame 1, and the second groove 6 is wavy; a third groove 7 is opened through the upper end of the protective frame 1, and the second groove 6 and the third groove 7 are interconnected; a heat-conducting frame 8 is slidably provided on the inner wall of the third groove 7, and uniformly distributed heat-conducting blocks 9 are fixedly connected to the upper and lower ends of the inner wall of the heat-conducting frame 8.

[0021] By setting up a protective frame 1 and a high thermal conductivity insulation layer 2, a three-dimensional heat dissipation channel is formed by the wave-shaped second groove 6 and the interconnected third groove 7. Combined with the heat-conducting frame 8 and the uniformly distributed heat-conducting blocks 9 inside, multi-path heat conduction is achieved, which effectively disperses the concentrated heat generated by the circuit board 3 and improves the heat dissipation effect of the circuit board 3.

[0022] Please see Figure 1 and Figure 2 In this embodiment, the protective frame 1 is inverted U-shaped and made of stainless steel. The inverted U-shaped protective frame 1 is made of stainless steel, which has both structural support strength and corrosion resistance, and can protect the internal circuit board 3 from external impact.

[0023] Please see Figure 1 and Figure 3 In this embodiment, the heat sink 5 includes a first heat-conducting plate 51 and heat dissipation blocks 52; the first heat-conducting plate 51 is slidably provided on both sides of the inner wall of the first tank 4, and the lower end of the first heat-conducting plate 51 is fixedly connected to a uniformly distributed heat dissipation block 52. The first heat-conducting plate 51 is slidably installed along both sides of the first tank 4, and together with the densely distributed heat dissipation blocks 52 below, it is convenient to disassemble as a whole during maintenance, and the air convection heat dissipation effect is enhanced by increasing the surface area. After the first heat-conducting plate 51 is installed on the inner wall of the first tank 4, the first heat-conducting plate 51 and the inner wall of the first tank 4 can be bonded together with glue.

[0024] Please see Figure 1 and Figure 3 In this embodiment, the two sides of the first heat-conducting plate 51 are flush with the two sides of the protective frame 1, the two sides of the heat dissipation block 52 are flush with the two sides of the protective frame 1, and the lower end of the heat dissipation block 52 is flush with the lower end of the protective frame 1, ensuring the aesthetics of the structure and facilitating installation on other objects.

[0025] Please see Figure 1and Figure 3 In this embodiment, the heat-conducting frame 8 is made of heat-conducting material, and the distance between two adjacent heat-conducting blocks 9 is three centimeters. The heat-conducting frame 8 is made of high heat-conducting material, and heat-conducting blocks 9 are set every three centimeters inside, which improves the structural strength.

[0026] Please see Figure 1 and Figure 3 In this embodiment, the top surface area of ​​the heat-conducting frame 8 is smaller than the top surface area of ​​the first heat-conducting plate 51, and the top view area of ​​the heat-conducting frame 8 is smaller than that of the first heat-conducting plate 51, forming a graded heat dissipation structure. The main heat is preferentially handled by the large-area heat sink 5, and the remaining heat is conducted secondary by the heat-conducting frame 8, which improves the heat dissipation effect.

[0027] Please see Figure 1 and Figure 4 In this embodiment, heat dissipation holes 10 are provided through the four corner edges of the upper end of the protective frame 1. The inner diameter of the heat dissipation holes 10 is two centimeters, which makes it convenient to install on other objects.

[0028] Working principle: First, when the circuit board 3 is running, heat is generated. The heat is first conducted vertically to the protective frame 1 through the high thermal conductivity insulation layer 2 (made of high thermal conductivity materials such as aluminum nitride or boron nitride). The protective frame 1 adopts an inverted U-shaped stainless steel structure, which not only provides mechanical support, but its metal material can also serve as a secondary heat carrier to diffuse the heat laterally to the overall frame.

[0029] Since the wave-shaped second groove 6 and the interconnected third groove 7 form a three-dimensional heat dissipation channel, the wave-shaped structure significantly improves the convective heat dissipation efficiency by increasing the air contact area and turbulence effect.

[0030] The first heat-conducting plate 51 of the radiator 5 is slidably embedded into the guide rails on both sides of the first groove 4 and is bonded to the protective frame 1 with thermally conductive silicone. The densely distributed heat dissipation blocks 52 below it achieve efficient air convection by increasing the surface area;

[0031] The heat-conducting frame 8 is installed via the sliding guide rail of the third groove 7. The heat-conducting blocks 9 evenly distributed inside form a grid-like heat-conducting structure. When heat is conducted to the third groove 7 through the protective frame 1, the heat-conducting frame 8 diffuses the remaining heat laterally to the wave-shaped channel area, and further dissipates heat through the airflow of the second groove 6.

Claims

1. An electric control device high-efficiency heat dissipation circuit board, comprising a protective frame (1); characterized in that: A high thermal conductivity insulation layer (2) is fixed to the upper end of the protective frame (1), and a circuit board (3) is fixed to the upper end of the high thermal conductivity insulation layer (2). A first groove (4) is opened at the lower end of the protective frame (1). A heat sink (5) is provided on the inner wall of the first groove (4). A second groove (6) is opened through the upper part of one side of the protective frame (1). The second groove (6) is wavy. A third groove (7) is opened through the upper end of the protective frame (1). The second groove (6) and the third groove (7) are interconnected. A heat-conducting frame (8) is slidably provided on the inner wall of the third groove (7). A uniformly distributed heat-conducting block (9) is fixed to both the upper and lower ends of the inner wall of the heat-conducting frame (8).

2. The high-efficiency heat-dissipation circuit board for electric control equipment according to claim 1, characterized in that: The protective frame (1) is inverted U-shaped and is made of stainless steel.

3. The high-efficiency heat-dissipation circuit board for electrically controlled equipment according to claim 1, characterized in that: The radiator (5) includes a first heat-conducting plate (51) and a heat-dissipating block (52); the first heat-conducting plate (51) is slidably provided on both sides of the inner wall of the first groove (4), and the lower end of the first heat-conducting plate (51) is fixed with a uniformly distributed heat-dissipating block (52).

4. The high-efficiency heat dissipation circuit board for electrical control equipment according to claim 3, characterized in that: The two sides of the first heat-conducting plate (51) are flush with the two sides of the protective frame (1), the two sides of the heat sink (52) are flush with the two sides of the protective frame (1), and the lower end of the heat sink (52) is flush with the lower end of the protective frame (1).

5. The high-efficiency heat-dissipation circuit board for electrically controlled equipment according to claim 1, characterized in that: The heat-conducting frame (8) is made of heat-conducting material, and the distance between two adjacent heat-conducting blocks (9) is three centimeters.

6. The electrically controlled device high-efficiency heat dissipation circuit board of claim 1, wherein: The surface area of ​​the heat-conducting frame (8) is smaller than that of the surface area of ​​the first heat-conducting plate (51).

7. The electrically controlled device high-efficiency heat dissipation circuit board of claim 1, wherein: The upper four corners of the protective frame (1) are provided with heat dissipation holes (10), and the inner diameter of the heat dissipation holes (10) is two centimeters.

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