Packaging device with liquid cooling function
By introducing a liquid cooling structure into the packaged device, the problem of insufficient chip heat dissipation is solved by using coolant to transfer heat, achieving efficient heat dissipation and stable operation, preventing chip burn-out, and simplifying the manufacturing process.
Patent Information
- Application Number
- CN202521219578.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-16
- Estimated Expiration
- 2035-06-13
AI Technical Summary
The heat dissipation performance of chips in existing packaged devices is insufficient, resulting in excessively high chip temperatures, which can easily cause the chips to burn out and affect their stable operation.
It adopts a liquid cooling structure, including an upper cover, a lower support component and a heat dissipation channel, which transfers heat through coolant to enhance the chip's heat dissipation performance and prevent overheating.
It improves the heat dissipation efficiency of the chip, maintains the stable operation of the chip inside the packaged device, avoids the chip burning out due to excessive temperature, simplifies the manufacturing process, and reduces manufacturing costs.
Smart Images
Figure CN224368293U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a packaged device with liquid cooling heat dissipation function. Background Technology
[0002] Chips are crucial components in electronic devices, significantly impacting their performance. As electronic devices become increasingly functional, the demands on chip performance rise, leading to increased power consumption. This increased power consumption exacerbates the problem of chip overheating, which can cause chip burnout. Therefore, heat dissipation has become one of the bottlenecks restricting chip development.
[0003] When a chip doesn't reach 100% efficiency, power consumption is transferred as heat. The purpose of heat dissipation design in packaged devices is to ensure the chip has a low thermal resistance, increasing heat flow and maintaining the chip's operating temperature within an appropriate range to prevent burnout. Currently, heat in packaged devices is mainly generated at the interface, transferred upwards via the molding compound to the chip surface, and finally dissipated into the air through the heat sink. However, as chip functionality increases, the heat generated during operation also increases. Relying solely on heat sinks to dissipate heat is insufficient to effectively remove the heat generated by the chip, thus still affecting chip performance and, in severe cases, even causing burnout.
[0004] Therefore, improving the heat dissipation performance of chips in packaged devices, maintaining stable operation of chips within packaged devices, and preventing chips from burning out due to excessive temperature are urgent technical problems that need to be solved. Summary of the Invention
[0005] This invention provides a packaged device with liquid cooling function to improve the heat dissipation performance of the chip in the packaged device, maintain the stable operation of the chip in the packaged device, and prevent the chip from burning out due to excessive temperature.
[0006] According to some embodiments, this utility model provides a packaged device with liquid cooling heat dissipation function, comprising:
[0007] The substrate includes a front side and a back side that are distributed opposite to each other along a first direction;
[0008] A chip is mounted on the front side of the substrate, the chip including a first surface facing the substrate and a second surface opposite to the first surface along the first direction;
[0009] A liquid cooling structure includes an upper cover, a lower support, and a heat dissipation channel for transferring coolant. The upper cover is located above the chip along a first direction. The upper cover includes a lower surface facing the substrate and an upper surface opposite to the lower surface along the first direction. The lower support is attached to the side of the chip and connected to the lower surface of the upper cover. The upper cover and the chip enclose each other to form the heat dissipation channel. The upper cover also includes a liquid inlet and a liquid outlet, both of which are connected to the heat dissipation channel. The liquid inlet is located on the upper surface of the upper cover.
[0010] In some embodiments, the top cover further includes a cavity located on the lower surface and a liquid inlet channel located on the side of the cavity opposite to the chip;
[0011] The cavity and the second surface of the chip enclose each other to form the heat dissipation channel, and one end of the liquid inlet channel is connected to the cavity and the other end is connected to the liquid inlet.
[0012] In some embodiments, the liquid inlet channel is perpendicularly connected to the heat dissipation channel; or...
[0013] The liquid inlet channel and the heat dissipation channel are connected at an angle.
[0014] In some embodiments, the outlet is located on the upper surface of the top cover.
[0015] In some embodiments, the top cover further includes a liquid outlet channel located on the side of the cavity opposite to the chip, one end of the liquid outlet channel being connected to the cavity and the other end being connected to the liquid outlet;
[0016] The liquid inlet channel and the liquid outlet channel are distributed at opposite ends of the upper cover along a second direction, which is parallel to the front side of the substrate.
[0017] In some embodiments, the liquid outlet is located on the side of the top cover.
[0018] In some embodiments, the projected area of the cavity on the front side of the substrate is greater than the projected area of the second surface of the chip on the front side of the substrate.
[0019] In some embodiments, the coolant is deionized water.
[0020] In some embodiments, it also includes:
[0021] A barrier layer is applied to the second surface of the chip to prevent the coolant from penetrating the chip.
[0022] In some embodiments, the barrier layer is a metal material layer.
[0023] In some embodiments, the lower support is an injection molded part, which is distributed around the outer periphery of the chip and directly attached to the side of the chip.
[0024] In some embodiments, the lower support member includes a bottom surface facing the substrate and a top surface opposite the bottom surface along the first direction, and the top surface of the lower support member has a recess;
[0025] The lower surface of the upper cover has a positioning block that matches the recess, and the positioning block engages within the recess.
[0026] In some embodiments, it also includes:
[0027] A sealing layer is distributed around the outer periphery of the heat dissipation channel.
[0028] In some embodiments, it also includes:
[0029] A first adhesive layer is located between the upper cover and the lower support member, with one end of the first adhesive layer bonded to the lower surface of the upper cover and the other end bonded to the lower support member.
[0030] In some embodiments, the cavity has a first groove on its inner wall facing the chip, and the first groove communicates with the cavity.
[0031] In some embodiments, the second surface of the chip has a second groove, and the second groove is in communication with the heat dissipation channel.
[0032] This utility model provides a liquid-cooled heat dissipation packaged device. By mounting a chip and a liquid-cooling structure on the front side of a substrate, the liquid-cooling structure includes an upper cover, a lower support, and a heat dissipation channel. The lower support is mounted on the side of the chip and connected to the end of the upper cover. The heat dissipation channel is located between the upper cover and the second surface of the chip and is used to transport coolant. The coolant provides liquid cooling to the chip, thereby enhancing its heat dissipation performance, maintaining stable operation of the chip within the packaged device, and preventing chip burnout due to overheating. Furthermore, the upper cover includes an inlet and an outlet, both communicating with the heat dissipation channel. The inlet is located on the upper surface of the upper cover. On one hand, the height difference between the inlet and the heat dissipation channel facilitates the transfer of coolant into the channel and its flow within the channel. On the other hand, it facilitates the assembly of the upper cover and the lower support, reducing alignment difficulties and simplifying the manufacturing process of the liquid-cooled heat dissipation packaged device. In addition, the heat dissipation channel is formed by the upper cover and the chip, which not only shortens the distance between the coolant and the chip, thereby further improving the heat dissipation efficiency of the chip, but also eliminates the need to set up a channel embedded in the upper cover, thereby simplifying the manufacturing process of the upper cover and reducing the manufacturing cost of the packaged device with liquid cooling function. Attached Figure Description
[0033] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.
[0034] Figure 1 This is a schematic diagram of the first structure of the encapsulated device with liquid cooling heat dissipation function in a specific embodiment of this utility model;
[0035] Figure 2 yes Figure 1 Side view;
[0036] Figure 3 This is a schematic diagram of the structure of the upper surface of the cover in a specific embodiment of this utility model;
[0037] Figure 4 This is a schematic diagram of the structure of the lower surface of the cover in a specific embodiment of this utility model;
[0038] Figure 5This is a schematic diagram of the second structure of the encapsulated device with liquid cooling heat dissipation function in a specific embodiment of this utility model;
[0039] Figure 6 This is a schematic diagram of the third structure of the encapsulated device with liquid cooling heat dissipation function in a specific embodiment of this utility model;
[0040] Figure 7 This is a schematic diagram of the fourth structure of the encapsulated device with liquid cooling heat dissipation function in a specific embodiment of this utility model;
[0041] Figure 8 yes Figure 7 An exploded view of a packaged device with liquid cooling function;
[0042] Figure 9 This is a schematic diagram of the fifth structure of the packaged device with liquid cooling heat dissipation function in a specific embodiment of this utility model;
[0043] Figure 10 This is a sixth structural schematic diagram of a packaged device with liquid cooling heat dissipation function in a specific embodiment of this utility model.
[0044] Figure 11 This is a schematic diagram of the seventh structure of the encapsulated device with liquid cooling function in a specific embodiment of this utility model. Detailed Implementation
[0045] The following detailed description, in conjunction with the accompanying drawings, illustrates the specific embodiments of the liquid-cooled heat dissipation packaging device provided by this utility model.
[0046] This specific embodiment provides a packaged device with liquid cooling heat dissipation function. Figure 1 This is a schematic diagram of the first structure of the packaged device with liquid cooling function in a specific embodiment of this utility model. Figure 2 yes Figure 1 Side view, Figure 3 This is a schematic diagram of the structure of the upper surface of the cover in a specific embodiment of this utility model. For example... Figure 1 , Figure 2 and Figure 3 As shown, the packaged device with liquid cooling heat dissipation function includes:
[0047] The substrate 10 includes a front side 101 and a back side 102 that are relatively distributed along a first direction D1;
[0048] Chip 11 is mounted on the front side 101 of the substrate 10. Chip 11 includes a first surface facing the substrate 10 and a second surface opposite to the first surface along the first direction D1.
[0049] The liquid cooling structure includes an upper cover 12, a lower support 13, and a heat dissipation channel 17 for transferring coolant. The upper cover 12 is located above the chip 11 along the first direction D1. The upper cover 12 includes a lower surface facing the substrate 10 and an upper surface opposite to the lower surface along the first direction D1. The lower support 13 is attached to the side of the chip 11 and connected to the lower surface of the upper cover 12. The upper cover 12 and the chip 11 enclose each other to form the heat dissipation channel 17. The upper cover 12 also includes a liquid inlet 18 and a liquid outlet 19, both of which are connected to the heat dissipation channel 17. The liquid inlet 18 is located on the upper surface of the upper cover 12.
[0050] For example, the substrate 10 may be, but is not limited to, a PCB circuit board. The substrate 10 includes a front side 101 and a back side 102 that are distributed opposite to each other along the first direction D1, and the substrate 10 has a high-density wiring layer inside. The chip 11 is mounted on the front side 101 of the substrate 10, and the chip 11 includes a first surface facing the substrate 10 and a second surface opposite to the first surface along the first direction D1. In one example, the first surface of the chip 11 is the functional surface of the chip 11, that is, the chip 11 is flip-chip mounted on the front side 101 of the substrate 10. The first surface of the chip 11 has a plurality of conductive bumps 15, and one end of the conductive bumps 15 is electrically connected to the chip 11, and the other end is electrically connected to the high-density wiring layer in the substrate 10. A plurality of solder balls 16 are spaced apart on the back surface 102 of the substrate. The solder balls 16 are electrically connected to the high-density wiring layer inside the substrate 10, thereby enabling the transmission of control signals to the chip 11 or the extraction of signals from the chip 11 through the solder balls 16 and the conductive bumps 15. An underfill adhesive 14 is also filled between the chip 11 and the substrate 10 to enhance the connection strength between the chip 11 and the substrate 10.
[0051] The liquid cooling structure is disposed on the front surface 101 of the substrate 10. The top end of the lower support member 13 in the liquid cooling structure is connected to the end of the lower surface of the upper cover 12, and the bottom end is connected to the front surface 101 of the substrate 10, thereby allowing the upper cover 12 and the lower support member 13 to together form a receiving cavity. The chip 11 is located within the receiving cavity, and the lower support member 13 is attached to the side of the chip 11, meaning the side of the chip 11 is in close contact with the inner wall of the receiving cavity, thus preventing the coolant from flowing to the side of the chip 11. The upper cover 12 has a liquid inlet 18 and a liquid outlet 19. The upper cover 12 and the chip 11 together form a heat dissipation channel 17, and both the liquid inlet 18 and the liquid outlet 19 communicate with the heat dissipation channel 17. The coolant can enter the heat dissipation channel 17 through the inlet 18, and after absorbing the heat generated by the chip 11, it is discharged from the outlet 19. That is, the coolant continuously flows in the heat dissipation channel 17 along the extension direction of the heat dissipation channel 17, thereby realizing liquid cooling of the chip 11, enhancing the heat dissipation performance of the chip 11, maintaining the stable operation of the chip in the packaged device, and avoiding the chip from burning out due to excessive temperature. The liquid inlet 18 is located on the upper surface of the upper cover 12. On the one hand, due to the height difference between the liquid inlet and the heat dissipation channel, it is convenient to transfer the coolant into the heat dissipation channel 17 and facilitate the flow of the coolant within the heat dissipation channel 17. This allows the coolant to flow out from the liquid outlet 19 in a timely manner after absorbing the heat generated by the chip 11, thereby quickly carrying the heat generated by the chip 11 to the outside of the packaging structure, improving the heat dissipation efficiency of the liquid cooling packaging structure, and avoiding the accumulation of heat generated by the chip 11 inside the liquid cooling packaging structure. On the other hand, it facilitates the assembly of the upper cover 12 and the lower support 13, reduces the alignment difficulty between the upper cover 12 and the lower support 13, and simplifies the manufacturing process of the packaging device with liquid cooling function. In addition, the heat dissipation channel 17 is formed by the upper cover 12 and the chip 11, which not only shortens the distance between the coolant and the chip 11, thereby further improving the heat dissipation efficiency of the chip 11, but also eliminates the need to set up a channel embedded in the upper cover 12, thereby simplifying the manufacturing process of the upper cover 12 and reducing the manufacturing cost of the packaged device with liquid cooling function.
[0052] Figure 4 This is a structural schematic diagram of the lower surface of the upper cover in a specific embodiment of this utility model. In some embodiments, such as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the upper cover 12 also includes a cavity 30 located on the lower surface and a liquid inlet channel 20 located on the side of the cavity 30 away from the chip;
[0053] The cavity 30 and the second surface of the chip 11 enclose each other to form the heat dissipation channel 17. One end of the liquid inlet channel 20 is connected to the cavity 30 and the other end is connected to the liquid inlet 18.
[0054] For example, the upper cover 12 includes a lower surface facing the substrate 10 and an upper surface opposite to the lower surface along the first direction D1. The upper cover 12 also includes a cavity 30 extending from the lower surface into the interior of the upper cover 12 along the first direction D1, and the cavity 30 does not penetrate the upper cover 12 in either the horizontal direction (i.e., the direction parallel to the front surface 101 of the substrate 10) or the vertical direction (e.g., the first direction D1). The cavity 30 and the second surface of the chip 11 enclose the heat dissipation channel 17. The upper cover 12 also includes a liquid inlet channel 20 located on the side of the cavity 30 away from the chip 11 and communicating with the cavity 30, and one end of the liquid inlet channel 20 communicating with the cavity 30 and the other end communicating with the liquid inlet 18, so that the coolant enters the heat dissipation channel 17 sequentially through the liquid inlet 18 and the liquid inlet channel 20. By providing the liquid inlet 18 on the upper surface of the upper cover 12 and connecting the liquid inlet 18 and the heat dissipation channel 17 through the liquid inlet channel 20, the position and size of the liquid inlet 18 on the upper surface can be flexibly adjusted as needed, thereby improving the manufacturing flexibility of the packaged device with liquid cooling function.
[0055] In some embodiments, the liquid inlet channel 20 is vertically connected to the heat dissipation channel 17; or...
[0056] The liquid inlet channel 20 is inclinedly connected to the heat dissipation channel 17.
[0057] In one example, such as Figure 1 As shown, the heat dissipation channel 17 extends along the second direction D2, which is parallel to the front surface 101 of the substrate 10. The liquid inlet channel 20 extends along the first direction D1, thereby making the liquid inlet channel 20 vertically connected to the heat dissipation channel 17, which further simplifies the manufacturing process of the top cover 12.
[0058] Figure 5 This is a schematic diagram of a second structure of a packaged device with liquid cooling function in a specific embodiment of this utility model. In another example, such as... Figure 5As shown, the heat dissipation channel 17 extends along the second direction D2, and the extension direction of the liquid inlet channel 20 intersects the second direction D2 at an obtuse angle, that is, the angle between the liquid inlet channel 20 and the heat dissipation channel 17 is an obtuse angle, so that the coolant can flow into the heat dissipation channel 17 from the liquid inlet 18.
[0059] In some embodiments, the liquid outlet 19 is located on the upper surface of the upper cover 12.
[0060] In some embodiments, the top cover further includes a liquid outlet channel 21 located on the side of the cavity 30 opposite to the chip 11, one end of the liquid outlet channel 21 being connected to the cavity 30 and the other end being connected to the liquid outlet 19;
[0061] The liquid inlet channel 20 and the liquid outlet channel 21 are distributed at opposite ends of the upper cover 12 along a second direction D2, which is parallel to the front surface 101 of the substrate 10.
[0062] For example, such as Figure 1 As shown, the upper cover 12 also includes a liquid outlet channel 21 located on the side of the cavity 30 opposite to the chip 11 and communicating with the cavity 30. One end of the liquid outlet channel 21 communicates with the cavity 30, and the other end communicates with the liquid outlet 19, so that the coolant enters the heat dissipation channel 17 sequentially through the liquid inlet 18 and the liquid inlet channel 20. After absorbing the heat generated by the chip 11, the coolant in the heat dissipation channel 17 is discharged sequentially through the liquid outlet channel 21 and the liquid outlet 19. By setting the liquid inlet 18 and the liquid outlet 19 on the upper surface of the upper cover 12, the relative positional relationship of the liquid inlet 18 and the liquid outlet 19 can be flexibly adjusted as needed, improving the manufacturing flexibility of the packaged device with liquid cooling function. The inlet channel 20 and the outlet channel 21 are distributed at opposite ends of the upper cover 12 along the second direction D2, ensuring the smooth flow of the coolant in the heat dissipation channel 17 and preventing the coolant with a lower temperature entering the inlet 18 from interacting with the coolant with a higher temperature exiting from the outlet 19.
[0063] Figure 6 This is a schematic diagram of a third structure of a packaged device with liquid cooling function in a specific embodiment of this utility model. In other embodiments, such as... Figure 6 As shown, the liquid outlet 19 is located on the side of the upper cover 12.
[0064] For example, such as Figure 6As shown, the liquid outlet 19 is located on the side of the upper cover 12, and the lower support 13 and the upper cover 12 enclose the liquid outlet channel 21. One end of the liquid outlet channel 21 is connected to the heat dissipation channel 17, and the other end is connected to the liquid outlet 19. By setting the liquid outlet 19 on the side of the upper cover 12, there is a height difference between the liquid inlet 18 and the liquid outlet 19, which facilitates the flow of the coolant in the heat dissipation channel 17, allowing the heat generated by the chip 11 to be carried away by the coolant more quickly.
[0065] In some embodiments, the projected area of the cavity 30 on the front surface 101 of the substrate 10 is greater than the projected area of the second surface of the chip 11 on the front surface 101 of the substrate 10. This increases the contact area between the chip 11 and the coolant, and facilitates uniform liquid cooling of the chip 11, thus avoiding uneven heat dissipation of the chip 11.
[0066] In some embodiments, the coolant is deionized water.
[0067] Specifically, since the heat dissipation channel 17 is formed by the upper cover 12 and the second surface of the chip 11, the coolant within the heat dissipation channel 17 directly contacts the second surface of the chip 11. The resistivity of the deionized water is less than 10 ohms. -10 This ensures that even if the deionized water comes into contact with the second surface of the chip 11, it will not cause an electrical short circuit in the chip 11, thus ensuring the normal operation of the chip 11.
[0068] In some embodiments, the packaging device with liquid cooling function further includes:
[0069] A barrier layer is applied to the second surface of the chip 11 to prevent the coolant from penetrating the chip 11.
[0070] In some embodiments, the barrier layer is a metal material layer.
[0071] Specifically, by covering the entire second surface of the chip 11 with the barrier layer, the barrier layer can prevent the coolant from penetrating to the chip 11, thereby further avoiding the impact of the coolant on the performance of the chip 11. The barrier layer being a metallic material layer means that the material of the barrier layer is a metallic material. Using this metallic material to make the barrier layer allows it to not only prevent the coolant (e.g., deionized water) from penetrating but also prevent oxygen penetration. Furthermore, the metallic material also has good thermal conductivity, thereby further contributing to improving the heat dissipation effect of the chip 11. In one example, the material of the barrier layer is titanium.
[0072] In some embodiments, the lower support 13 is an injection molded part, which is distributed around the outer periphery of the chip 11 and directly attached to the side surface of the chip 11.
[0073] For example, after mounting the chip 11 onto the front side 101 of the substrate 10, an injection molding process can be used to form an injection molded part that surrounds the outer periphery of the chip 11 and is directly attached to the side surface of the chip 11. This injection molded part serves as the lower support 13 of the liquid cooling structure. By using the injection molded part as the lower support 13 and directly attaching it to the side surface of the chip 11, gaps can be avoided between the lower support 13 and the side surface of the chip 11, thereby preventing coolant leakage between the lower support 13 and the side surface of the chip 11, thus protecting the chip 11. The material of the injection molded part can be epoxy resin molding compound.
[0074] Figure 7 This is a schematic diagram of the fourth structure of the packaged device with liquid cooling function in a specific embodiment of this utility model. Figure 8 yes Figure 7 An exploded view of a packaged device with liquid cooling functionality. In some embodiments, such as... Figure 7 and Figure 8 As shown, the lower support member 13 includes a bottom surface facing the substrate 10 and a top surface opposite to the bottom surface along the first direction D1, and the top surface of the lower support member 13 has a recess 80.
[0075] The lower surface of the upper cover 12 has a positioning block 70 that matches the recess 80, and the positioning block 70 is engaged in the recess 80.
[0076] For example, after the lower support member 13, which is directly attached to the side of the chip 11, is formed using injection molding, the recess 80 can be formed on the top surface of the lower support member 13 using laser grooving or dry etching. After forming a positioning block 70 at the end of the lower surface of the upper cover 12 that matches the shape and size of the recess 80, the positioning block 70 is slid into the recess 80 from the side of the lower support member 13 to achieve the connection between the upper cover 12 and the lower support member 13, such as... Figure 7 and Figure 8 As shown, the upper cover 12 and the lower support 13 are connected by the interlocking of the recess 80 and the positioning block 70, thus eliminating the need for adhesive application, avoiding the risk of adhesive overflow, and helping to increase the connection strength between the upper cover 12 and the lower support 13. Furthermore, the interlocking connection of the recess 80 and the positioning block 70 allows for proper positioning and alignment between the upper cover 12 and the lower support 13, simplifying the assembly process.
[0077] Figure 9 This is a fifth structural schematic diagram of a packaged device with liquid cooling heat dissipation function according to a specific embodiment of the present invention. In some embodiments, the packaged device with liquid cooling heat dissipation function further includes:
[0078] A sealing layer 90 is distributed around the outer periphery of the heat dissipation channel 17.
[0079] Specifically, the sealing layer 90 is used to prevent the coolant from seeping out of the heat dissipation channel 17, so as to avoid the seepage affecting the performance of the packaged device with liquid cooling function. In one example, such as Figure 9 As shown, the sealing layer 90 is located inside the upper cover 12, and the sealing layer 90 is distributed around the outer periphery of the cavity 30 and the outer periphery of the chip 11. In another example, the sealing layer 90 is located outside the upper cover 12, and the sealing layer 90 is distributed around the outer periphery of the junction of the upper cover 12 and the lower support 13.
[0080] In some embodiments, the packaging device with liquid cooling function further includes:
[0081] A first adhesive layer is located between the upper cover 12 and the lower support member 13, with one end of the first adhesive layer bonded to the lower surface of the upper cover 12 and the other end bonded to the lower support member 13.
[0082] For example, the first adhesive layer is distributed at least on both sides of the cavity 30 along a third direction D3, which is parallel to the front surface 101 of the substrate 10 and intersects perpendicularly with the second direction D2. After the injection molded part serving as the lower support 13 is formed by injection molding, the upper cover 12 can be directly attached to the top surface of the lower support 13 (i.e., the surface of the lower support 13 facing away from the substrate 10) through the first adhesive layer, thereby helping to simplify the manufacturing process of the packaged device with liquid cooling function.
[0083] Figure 10 This is a sixth structural schematic diagram of a packaged device with liquid cooling heat dissipation function according to a specific embodiment of this utility model. In some embodiments, such as Figure 4 and Figure 10 As shown, the cavity 30 has a first groove 100 on its inner wall facing the chip 11, and the first groove 100 is in communication with the cavity 30.
[0084] For example, such as Figure 4 and Figure 10 As shown, the cavity 30 has a first groove 100 on its bottom wall facing the chip 11 along the first direction D1, and the first groove 100 communicates with the cavity 30, allowing the coolant to enter the first groove 100 from the heat dissipation channel 17. This increases the amount of coolant that the liquid-cooled packaging device can hold, further improving the heat dissipation effect. Moreover, after the coolant absorbs the heat generated during the operation of the chip 11, some of the heat can be transferred upwards to the outside through the top cover 12. The first groove 100 effectively increases the heat dissipation area of the chip 11, further improving the heat dissipation effect of the chip 11. In one example, the cavity 30 has multiple first grooves 100 spaced apart along the second direction D2 on its inner wall facing the chip 11, and all of the first grooves 100 communicate with the cavity 30. The cross-sectional shape of the first groove 100 is arc-shaped, quadrilateral, or triangular.
[0085] Figure 11 This is a seventh structural schematic diagram of a packaged device with liquid cooling heat dissipation function according to a specific embodiment of this utility model. In some embodiments, such as... Figure 11 As shown, the second surface of the chip 11 has a second groove 110, and the second groove 110 is connected to the heat dissipation channel 17.
[0086] For example, by etching the second surface of the chip 11, a second groove 110 is formed on the second surface of the chip 11, and the second groove 110 communicates with the heat dissipation channel 17. The provision of the second groove 110 can further increase the contact area between the chip 11 and the coolant, that is, increase the heat dissipation area of the chip 11, thereby further improving the heat dissipation effect of the chip 11. In one example, the second surface of the chip 11 has a plurality of second grooves 110 arranged at intervals along the second direction D2, and all the second grooves 110 communicate with the heat dissipation channel 17.
[0087] This specific embodiment provides a liquid-cooled heat dissipation packaged device. By mounting a chip and a liquid-cooling structure on the front side of a substrate, the liquid-cooling structure includes an upper cover, a lower support, and a heat dissipation channel. The lower support is mounted on the side of the chip and connected to the end of the upper cover. The heat dissipation channel is located between the upper cover and the second surface of the chip and is used to transport coolant. The coolant provides liquid cooling to the chip, thereby enhancing the chip's heat dissipation performance, maintaining stable operation of the chip within the packaged device, and preventing chip burnout due to overheating. Furthermore, the upper cover includes an inlet and an outlet, both communicating with the heat dissipation channel. The inlet is located on the upper surface of the upper cover. On one hand, the height difference between the inlet and the heat dissipation channel facilitates the transfer of coolant into the channel and its flow within the channel. On the other hand, it facilitates the assembly of the upper cover and the lower support, reducing the alignment difficulty between them and simplifying the manufacturing process of the liquid-cooled heat dissipation packaged device. In addition, the heat dissipation channel is formed by the upper cover and the chip, which not only shortens the distance between the coolant and the chip, thereby further improving the heat dissipation efficiency of the chip, but also eliminates the need to set up a channel embedded in the upper cover, thereby simplifying the manufacturing process of the upper cover and reducing the manufacturing cost of the packaged device with liquid cooling function.
[0088] It should be noted that the terms "comprising" and "having," and their variations, used in this utility model document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context; it should be understood that such use of data can be interchanged where appropriate. The term "one or more" depends at least in part on the context and can be used to describe features, structures, or characteristics in a singular sense, or in a plural sense to describe combinations of features, structures, or characteristics. The term "based on" can be understood as not necessarily intended to express an exclusive set of factors, but can instead, also at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, embodiments and features in embodiments of this utility model can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this utility model. In the various embodiments described above, each embodiment focuses on the differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.
[0089] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A packaged device with liquid cooling heat dissipation function, characterized in that, include: The substrate includes a front side and a back side that are distributed opposite to each other along a first direction; A chip is mounted on the front side of the substrate, the chip including a first surface facing the substrate and a second surface opposite to the first surface along the first direction; A liquid cooling structure includes an upper cover, a lower support, and a heat dissipation channel for transferring coolant. The upper cover is located above the chip along a first direction. The upper cover includes a lower surface facing the substrate and an upper surface opposite to the lower surface along the first direction. The lower support is attached to the side of the chip and connected to the lower surface of the upper cover. The upper cover and the chip enclose each other to form the heat dissipation channel. The upper cover also includes a liquid inlet and a liquid outlet, both of which are connected to the heat dissipation channel. The liquid inlet is located on the upper surface of the upper cover.
2. The packaged device with liquid cooling heat dissipation function according to claim 1, characterized in that, The upper cover also includes a cavity located on the lower surface and a liquid inlet channel located on the side of the cavity opposite to the chip; The cavity and the second surface of the chip enclose each other to form the heat dissipation channel, and one end of the liquid inlet channel is connected to the cavity and the other end is connected to the liquid inlet.
3. The packaged device with liquid cooling heat dissipation function according to claim 2, characterized in that, The liquid inlet channel is perpendicularly connected to the heat dissipation channel; or... The liquid inlet channel and the heat dissipation channel are connected at an angle.
4. The packaged device with liquid cooling heat dissipation function according to claim 2, characterized in that, The liquid outlet is located on the upper surface of the upper cover.
5. The packaged device with liquid cooling heat dissipation function according to claim 4, characterized in that, The top cover also includes a liquid outlet channel located on the side of the cavity opposite to the chip, one end of the liquid outlet channel being connected to the cavity and the other end being connected to the liquid outlet; The liquid inlet channel and the liquid outlet channel are distributed at opposite ends of the upper cover along a second direction, which is parallel to the front side of the substrate.
6. The packaged device with liquid cooling heat dissipation function according to claim 1, characterized in that, The liquid outlet is located on the side of the top cover.
7. The packaged device with liquid cooling heat dissipation function according to claim 2, characterized in that, The projected area of the cavity on the front side of the substrate is greater than the projected area of the second surface of the chip on the front side of the substrate.
8. The packaged device with liquid cooling heat dissipation function according to claim 1, characterized in that, The coolant is deionized water.
9. The packaged device with liquid cooling heat dissipation function according to claim 1, characterized in that, Also includes: A barrier layer is applied to the second surface of the chip to prevent the coolant from penetrating the chip.
10. The packaged device with liquid cooling heat dissipation function according to claim 9, characterized in that, The barrier layer is a metal material layer.
11. The packaged device with liquid cooling heat dissipation function according to claim 1, characterized in that, The lower support is an injection molded part, which is distributed around the outer periphery of the chip and directly attached to the side of the chip.
12. The packaged device with liquid cooling heat dissipation function according to claim 1, characterized in that, The lower support member includes a bottom surface facing the substrate and a top surface opposite the bottom surface along the first direction, and the top surface of the lower support member has a recess. The lower surface of the upper cover has a positioning block that matches the recess, and the positioning block engages within the recess.
13. The packaged device with liquid cooling heat dissipation function according to claim 1, characterized in that, Also includes: A sealing layer is distributed around the outer periphery of the heat dissipation channel.
14. The packaged device with liquid cooling heat dissipation function according to claim 1, characterized in that, Also includes: A first adhesive layer is located between the upper cover and the lower support member, with one end of the first adhesive layer bonded to the lower surface of the upper cover and the other end bonded to the lower support member.
15. The packaged device with liquid cooling heat dissipation function according to claim 2, characterized in that, The cavity has a first groove on its inner wall facing the chip, and the first groove communicates with the cavity.
16. The packaged device with liquid cooling heat dissipation function according to claim 1, characterized in that, The second surface of the chip has a second groove, and the second groove is in communication with the heat dissipation channel.