A scanning electron microscope assembly mounting frame system suitable for TKD experiments

Abstract

The utility model discloses a scanning electron microscope assembly mounting frame system suitable for TKD experiment belongs to utilize wave or particle radiation to test material field, it is including: sample clamp, dynamic decoupling layer, silicon base vacuum grease, sealed damping module and shock absorbing base. The bottom of sample clamp is connected with the top surface of silicon base damping shell of sealed damping module through screw, and dynamic decoupling layer is arranged between sample clamp and silicon base damping shell, silicon base vacuum grease is filled in sealed damping module, and the bottom surface of silicon base damping shell of sealed damping module is connected with the top of shock absorbing base. The utility model effectively reduces the TKD test data drift and resolution drop caused by vibration transmission when scanning electron microscope works, makes TKD sample not appear test data drift under high amplification, and kikuchi band is clear.

Description

Technical Field

[0001] This invention belongs to the field of material testing technology using wave or particle radiation, specifically a scanning electron microscope assembly mount system suitable for TKD experiments. Background Technology

[0002] Currently, all modules of the TKD sample carrier use rigid connections. This structure can ensure the overall stability of the device. However, when testing ultrathin samples (3mm discs and FIB sheets) at high magnification, the vibrations generated by the scanning electron microscope assembly during operation are transmitted to the stage through the rigid connections, thus affecting the experimental data of the ultrathin samples. This results in test data drift and submicron-level vibrations causing fuzziness of the Kikuchi band. Utility Model Content

[0003] To address the problems existing in the background technology, this utility model provides a scanning electron microscope assembly mount system suitable for TKD experiments. The technical solution includes: a sample clamp, a dynamic decoupling layer, a silicon-based vacuum grease, a sealing damping module, and a vibration damping base. The bottom of the sample clamp is connected to the top surface of the silicon-based damping shell of the sealing damping module via screws. A dynamic decoupling layer is provided between the sample clamp and the silicon-based damping shell. The sealing damping module is filled with silicon-based vacuum grease, and the bottom surface of the silicon-based damping shell of the sealing damping module is connected to the top of the vibration damping base.

[0004] The sealing damping module includes a main spring, a counterweight, a damping spring, and a silicon-based damping shell. The main spring, counterweight, and damping spring are disposed inside the silicon-based damping shell. The top surface of the silicon-based damping shell is connected to the counterweight through the main spring, and the counterweight is connected to the bottom surface of the silicon-based damping shell through the damping spring.

[0005] The pre-compression of the main spring and damping spring is 30%. The weight of the counterweight is 30-50g; the density of the counterweight is 16.5~19.0g / cm³.

[0006] The dynamic decoupling layer has a through hole at its center for screws to pass through; the dynamic decoupling layer is an anisotropic silicone pad.

[0007] The shock-absorbing base is placed on the support platform.

[0008] The shock-absorbing base is composed of at least one set of metal sheet layers and conductive silicone layers stacked on top of each other, wherein the metal sheet layers are fixed on the conductive silicone layers, the thickness of the metal sheet layers is not less than 0.2 mm, and the thickness of the conductive silicone layers is not greater than 1 mm.

[0009] The surface of the conductive silicone layer is laser-textured.

[0010] The beneficial effects of this utility model are as follows:

[0011] 1. The sealed damping module reduces the problem of test data drift and resolution degradation caused by the transmission of vibrations generated during the operation of the scanning electron microscope to the sample.

[0012] 2. The dynamic decoupling layer can absorb the micro-deformation caused by screw preload and effectively isolate impact vibration. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of an embodiment of a scanning electron microscope assembly mount system suitable for TKD experiments according to the present invention;

[0014] Among them: 1-sample clamp, 2-dynamic decoupling layer, 3-sealed damping module, 4-vibration damping base, 301-main spring, 302-counterweight, 303-damping spring, 304-silicon-based damping shell, 305-silicon-based vacuum grease, 401-metal sheet layer, 402-conductive silicone layer. Detailed Implementation

[0015] The present invention will be further described in detail below with reference to the accompanying drawings.

[0016] like Figure 1 The embodiment of this utility model shown includes: a sample clamp 1, a dynamic decoupling layer 2, a silicon-based vacuum grease 305, a sealing damping module 3, and a vibration damping base 4. The bottom of the sample clamp 1 is connected to the top surface of the silicon-based damping shell 304 of the sealing damping module 3 by screws. A dynamic decoupling layer 2 is provided between the sample clamp 1 and the silicon-based damping shell 304. The sealing damping module 3 is filled with silicon-based vacuum grease 305. The bottom surface of the silicon-based damping shell 304 of the sealing damping module 3 is connected to the top of the vibration damping base 4, which is placed on a support platform.

[0017] The sealed damping module 3 includes: a main spring 301, a counterweight 302, a damping spring 303, and a silicon-based damping housing 304. The main spring 301, counterweight 302, and damping spring 303 are disposed inside the silicon-based damping housing 304. The top surface of the silicon-based damping housing 304 is connected to the counterweight 302 through the main spring 301, and the counterweight 302 is connected to the bottom surface of the silicon-based damping housing 304 through the damping spring 303. The pre-compression of the main spring 301 and the damping spring 303 is 30%.

[0018] The following vibration transfer function must be maintained between the main spring 301, the counterweight 302, and the damping spring 303:

[0019]

[0020] Where m: weight of counterweight 302 (kg), c: viscous damping coefficient (N·s / m), k1: stiffness of main spring 301 (N / m), k2: stiffness of damping spring 303 (N / m), s: complex frequency variable (rad / s);

[0021] The weight of counterweight 302 is 30-50g; the density of counterweight 302 is 16.5~19.0g / cm³.

[0022] The dynamic decoupling layer 2 has a through hole in the center for screws to pass through; the dynamic decoupling layer 2 is an anisotropic silicone pad.

[0023] The vibration damping base 4 is composed of at least one set of metal sheet layers 401 and conductive silicone layer 402 stacked on top of each other, wherein the metal sheet layer 401 is fixed on top of the conductive silicone layer 402, the thickness of the metal sheet layer 401 is not less than 0.2mm, and the thickness of the conductive silicone layer 402 is not greater than 1mm, so as to achieve wideband vibration attenuation.

[0024] The surface of the conductive silicone layer 402 is laser-textured (Ra=3.2μm) to improve adhesion by 40%.

[0025] The process of alternately stacking and connecting the metal sheet layer 401 and the conductive silicone layer 402 is a vacuum screw process: pre-pressed with a torque of 0.5 N·m and left to stand for 24 hours to eliminate assembly stress.

[0026] The parameters and functions of each component in the sealing damping module 3 in this embodiment are shown in Table 1.

[0027] Table 1. Parameters and Functions of Components in Sealed Damping Module 3

[0028] part parameter physical action main spring Stiffness 1.2 N / mm, SUS631 stainless steel Bear 90% of the static load counterweight 30g tungsten alloy (Φ10x21.3mm) tungsten alloy counterweight with 2μm nickel plating to suppress outgassing. Provides inertial mass, blocking vibration transmission Damping spring Stiffness 5 N / mm, stroke ±1.5 mm Dissipation of vibrational energy Silicon-based vacuum grease Viscosity 500 cSt <![CDATA[viscous energy consumption, resistant to 10 -7 Pa vacuum]]>

[0029] The working process of this embodiment is as follows: Before the TKD experiment, the shock-absorbing base 4 is placed on the support stage of the scanning electron microscope (SEM), and the TKD sample is installed on the sample holder 1; the scanning electron microscope is started to perform the scanning experiment. The sealed damping module 3 effectively reduces the drift of TKD test data and the decrease in resolution caused by the vibration transmission during the operation of the scanning electron microscope, so that the TKD sample will not have test data drift at high magnification and the Kikuchi band is clear.

Claims

1. A scanning electron microscope assembly mount system suitable for TKD experiments, characterized in that, include: The sample clamp (1), dynamic decoupling layer (2), silicon-based vacuum grease (305), sealing damping module (3) and shock-absorbing base (4) are provided. The bottom of the sample clamp (1) is connected to the top surface of the silicon-based damping shell (304) of the sealing damping module (3) by screws. A dynamic decoupling layer (2) is provided between the sample clamp (1) and the silicon-based damping shell (304). The sealing damping module (3) is filled with silicon-based vacuum grease (305). The bottom surface of the silicon-based damping shell (304) of the sealing damping module (3) is connected to the top of the shock-absorbing base (4).

2. The scanning electron microscope assembly mount system suitable for TKD experiments according to claim 1, characterized in that, The sealing damping module 3 includes: a main spring (301), a counterweight (302), a damping spring (303), and a silicon-based damping shell (304). The main spring (301), the counterweight (302), and the damping spring (303) are disposed inside the silicon-based damping shell (304). The top surface of the silicon-based damping shell (304) is connected to the counterweight (302) through the main spring (301), and the counterweight (302) is connected to the bottom surface of the silicon-based damping shell (304) through the damping spring (303).

3. A scanning electron microscope assembly mount system suitable for TKD experiments according to claim 2, characterized in that, The pre-compression of the main spring (301) and damping spring (303) is 30%.

4. A scanning electron microscope assembly mount system suitable for TKD experiments according to claim 2, characterized in that, The weight of the counterweight (302) is 30-50g; the density of the counterweight (302) is 16.5~19.0g / cm³.

5. A scanning electron microscope assembly mount system suitable for TKD experiments according to claim 1, characterized in that, The dynamic decoupling layer (2) has a through hole in the center for screws to pass through; the dynamic decoupling layer (2) is an anisotropic silicone pad.

6. A scanning electron microscope assembly mount system suitable for TKD experiments according to claim 1, characterized in that, The shock-absorbing base (4) is placed on the support platform.

7. A scanning electron microscope assembly mount system suitable for TKD experiments according to claim 6, characterized in that, The shock-absorbing base (4) is composed of at least one set of metal sheet (401) and conductive silicone layer (402) stacked on top of each other, wherein the metal sheet (401) is fixed on top of the conductive silicone layer (402), the thickness of the metal sheet (401) is not less than 0.2 mm, and the thickness of the conductive silicone layer (402) is not greater than 1 mm.

8. A scanning electron microscope assembly mount system suitable for TKD experiments according to claim 7, characterized in that, The surface of the conductive silicone layer (402) is laser-textured.

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