Fan support structure for integrated heat sink circuit board

Abstract

The utility model relates to fan support structure technical field, and disclose fan support structure of integrated heat dissipation function circuit board, including support part, the support part includes tubular support and is used for supporting the base of tubular support, four internal thread cylinders that are symmetrical with each other are fixedly connected on the bottom inner wall of base, and the circuit board is sleeved on four internal thread cylinders, and the inside of multiple internal thread cylinders is all screw -threaded connection has screw, is used for fixing circuit board, the support is fixedly connected on the bottom inner wall of base. The utility model discloses the active air cooling component that the miniature heat dissipation fan of being equipped with constitutes, can carry out heat dissipation treatment to fan circuit board, avoids the situation that the internal overheating of fan long -time work leads to circuit board to appear damage or performance decline, and the design of miniature heat dissipation fan can be integrated in fan support structure well, guarantees the heat dissipation effect, and also can not influence the overall layout and installation of circuit board.

Description

Technical Field

[0001] This utility model relates to the field of fan support structure technology, and more specifically to a fan support structure for an integrated heat dissipation circuit board. Background Technology

[0002] As home appliances continue to develop towards intelligence, efficiency, and energy saving, modern electric fans have been fully upgraded from traditional simple mechanical control to electronic control based on microcontrollers. When running, their core circuit control board continuously generates heat, causing its own temperature to rise.

[0003] Traditional methods of heat dissipation for circuit boards rely on natural airflow to carry away the heat generated by the components on the circuit board. This method has extremely low heat dissipation efficiency, is highly dependent on ambient temperature and airflow, and is only suitable for simple control boards with very low power consumption. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a fan support structure with an integrated heat dissipation circuit board to solve the problems existing in the background art.

[0005] This utility model provides the following technical solution: a fan support structure for an integrated heat dissipation circuit board, including a support part, the support part including a tubular support and a base for supporting the tubular support, four mutually symmetrical internal threaded cylinders are fixedly connected to the inner wall of the bottom of the base, the circuit board is sleeved on the four internal threaded cylinders, and screws are threaded inside the internal threaded cylinders for fixing the circuit board, a bracket is fixedly connected to the inner wall of the bottom of the base, and multiple miniature heat dissipation fans for blowing air onto the circuit board are fixedly connected to the upper surface of the bracket.

[0006] As a further embodiment of this utility model, each of the four internally threaded cylinders is fitted with a slip ring on its outer side to lift the circuit board and disengage it from the inner wall of the base.

[0007] As a further embodiment of this utility model, a support plate is bonded between the multiple slip rings. The upper surface of the support plate is provided with multiple strip-shaped through holes, and heat dissipation fins are provided in each of the multiple strip-shaped through holes. The heat dissipation fins extend upward and contact the bottom of the circuit board.

[0008] As a further embodiment of this utility model, the support plate has a hollow structure, and multiple semiconductor cooling chips are provided inside the support plate, with the bottom of the multiple heat dissipation fins extending downward to contact the semiconductor cooling chips.

[0009] As a further embodiment of this invention, the semiconductor cooling chip is electrically connected to the high speed setting of the fan, and the plurality of miniature cooling fans are electrically connected to the fan switch.

[0010] As a further embodiment of this utility model, multiple sets of heat-conducting frames are provided between the multiple sets of heat dissipation fins.

[0011] As a further embodiment of this utility model, the base has multiple heat dissipation holes on its circumferential wall, and all the heat dissipation holes are inclined downwards.

[0012] As a further embodiment of this invention, the inner side of the heat dissipation hole is detachably covered with a dustproof mesh made of metal mesh.

[0013] The technical effects and advantages of this utility model are as follows: 1. This utility model uses an active air-cooling component consisting of a miniature cooling fan to dissipate heat from the fan circuit board, preventing overheating during prolonged fan operation that could damage or degrade the circuit board. The miniature cooling fan is well integrated into the fan support structure, ensuring effective heat dissipation without affecting the overall layout and installation of the circuit board.

[0014] 2. This utility model combines passive heat conduction, active air cooling, and active refrigeration to construct a multi-level, coordinated heat dissipation component. It can activate the corresponding heat dissipation scheme according to the thermal load of the circuit board, ensuring that it can provide matching heat dissipation capacity under any operating conditions, effectively preventing the chip from throttling or being damaged due to overheating, and significantly improving the reliability and stability of the system.

[0015] 3. This utility model electrically connects the semiconductor cooling chip with the high-speed setting of the fan and the miniature cooling fan with the fan switch, realizing a clever on-demand power supply strategy. This avoids the energy waste caused by the continuous operation of the semiconductor cooling chip, balances the contradiction between high-efficiency heat dissipation performance and daily energy consumption, and conforms to the design concept of green energy saving. Attached Figure Description

[0016] Figure 1 This is a structural diagram of the fan of this utility model.

[0017] Figure 2 This is an exploded view of the base of this utility model.

[0018] Figure 3 This is an enlarged view of the support plate of this utility model.

[0019] Figure 4 This is a schematic diagram of the support plate and heat dissipation fins of this utility model.

[0020] The attached figures are labeled as follows: 1. Support; 2. Tubular support; 3. Base; 4. Internally threaded cylinder; 5. Support plate; 6. Bracket; 7. Miniature cooling fan; 8. Slip ring; 9. Heat dissipation hole; 10. Strip-shaped through hole; 11. Heat dissipation fins; 12. Semiconductor cooling chip; 13. Screw; 14. Heat-conducting frame. Detailed Implementation

[0021] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. In addition, the forms of the various structures described in the following embodiments are merely illustrative. This utility model is not limited to the structures described in the following embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0022] Reference Figures 1-4 This utility model provides a fan support structure for an integrated heat dissipation circuit board, including a support part 1. The support part 1 includes a tubular support 2 and a base 3 for supporting the tubular support 2. Four internally threaded cylinders 4 are symmetrically connected to the bottom inner wall of the base 3 by bolts. The circuit board is sleeved on the four internally threaded cylinders 4. Screws 13 are threaded inside the internally threaded cylinders 4 to fix the circuit board. A bracket 6 is fixed to the bottom inner wall of the base 3 by bolts. Multiple miniature cooling fans 7 (model of miniature cooling fan 7: ADDA-AD01703HX04AB00-1704-1.7cm miniature cooling fan) are fixed to the upper surface of the bracket 6 by bolts to blow air onto the circuit board.

[0023] The active air-cooling component, consisting of a miniature cooling fan 7, can dissipate heat from the fan circuit board, preventing overheating during prolonged operation and thus avoiding damage or performance degradation of the circuit board. The miniature cooling fan 7 is well integrated into the fan support structure, ensuring heat dissipation without affecting the overall layout and installation of the circuit board.

[0024] When the fan is turned on, multiple miniature cooling fans 7 electrically connected to the fan switch are activated. The miniature cooling fans 7 operate and generate airflow that blows directly onto the bottom of the circuit board and the already heated heat sink fins 11 and heat conduction frame 14. The heat is quickly carried away by convection heat transfer, and the heated air forms an airflow inside the base 3.

[0025] Furthermore, slip rings 8 are fitted on the outer sides of the four internally threaded cylinders 4 to lift the circuit board and disengage it from the bottom inner wall of the base 3.

[0026] In this utility model, a support plate 5 is bonded between multiple slip rings 8. Multiple strip-shaped through holes 10 are provided on the upper surface of the support plate 5. Heat dissipation fins 11 are provided in each of the multiple strip-shaped through holes 10. The heat dissipation fins 11 extend upward and contact the bottom of the circuit board. Multiple sets of heat conduction frames 14 are provided between the multiple sets of heat dissipation fins 11.

[0027] It should be noted that both the heat sink fins 11 and the heat conduction frame 14 are made of copper, which can quickly absorb and evenly distribute the heat on the circuit board, forming a large-area "heat spreader" effect.

[0028] When the circuit board starts working and generates heat, its bottom will be in close contact with the top of the heat sink fins 11 and the heat conduction frame 14. These components, made of highly thermally conductive materials, can quickly absorb and evenly distribute the heat on the circuit board, and can respond to and handle the initial heat generation of the circuit board in an instant, preventing local heat accumulation.

[0029] Furthermore, the support plate 5 has a hollow structure, and multiple semiconductor cooling chips 12 (the semiconductor cooling chip 12 model is: TEC-16103 cooling chip) are installed inside the support plate 5, and multiple heat dissipation fins 11 extend downward at the bottom to contact the semiconductor cooling chip 12.

[0030] By combining passive heat conduction, active air cooling, and active refrigeration, a multi-level, coordinated heat dissipation component is constructed. It can activate the corresponding heat dissipation scheme according to the thermal load of the circuit board, ensuring that it can provide matching heat dissipation capacity under any operating conditions, effectively preventing the chip from throttling or being damaged due to overheating, and significantly improving the reliability and stability of the system.

[0031] When the fan is turned on at high speed, the thermoelectric cooler 12, which is electrically connected to the high speed setting of the fan, is activated. When the thermoelectric cooler 12 is working, its cold end cools down rapidly and comes into close contact with the heat dissipation fins 11 extending downward to its surface, thereby reducing the temperature of the heat dissipation fins 11. This creates a huge temperature difference between the heat dissipation fins 11 and the circuit board, which greatly enhances the efficiency of heat conduction from the circuit board to the heat dissipation fins 11. At this time, the miniature cooling fan 7 carries away and dissipates the heat generated by the hot end of the thermoelectric cooler 12.

[0032] Furthermore, the semiconductor cooling chip 12 is electrically connected to the high speed setting of the fan, and multiple miniature cooling fans 7 are electrically connected to the fan switch.

[0033] By electrically connecting the thermoelectric cooler 12 to the high-speed fan and the miniature cooling fan 7 to the fan switch, a clever on-demand power supply strategy is achieved. This avoids energy waste caused by the continuous operation of the thermoelectric cooler 12, balances the contradiction between efficient heat dissipation performance and daily energy consumption, and conforms to the design concept of green energy saving.

[0034] In this utility model, a plurality of heat dissipation holes 9 are provided on the circumferential wall of the base 3, and the plurality of heat dissipation holes 9 are all inclined downwards. The inner side of the heat dissipation holes 9 is detachably covered with a dustproof net made of metal mesh.

[0035] The airflow is finally discharged to the outside of the structure through the downward-sloping heat dissipation holes 9 on the circumferential wall of the base 3. The downward-sloping holes themselves have a certain dustproof and water droplet splash-proof effect. With the further protection of the metal dustproof mesh, the heat dissipation channel is ensured to remain unobstructed during long-term operation.

[0036] The use of this utility model involves the following steps: S1: When the circuit board starts working and generates heat, its bottom will directly and tightly contact the top of the heat sink fins 11 and the heat conduction frame 14. These components, made of highly thermally conductive materials, can quickly absorb and evenly distribute the heat on the circuit board, and can respond to and handle the initial heat generation of the circuit board in an instant, preventing local heat accumulation. S2: When the fan is started, multiple miniature cooling fans 7 electrically connected to the fan switch are activated. The miniature cooling fans 7 operate and generate airflow that blows directly onto the bottom of the circuit board and the already heated heat sink fins 11 and heat conduction frame 14. The heat is quickly carried away by convection heat transfer. The heated air forms an airflow inside the base 3 and is finally discharged outside the structure through the downward-sloping heat dissipation holes 9 on the circumferential wall of the base 3. The downward-sloping holes themselves have a certain dustproof and water droplet splash-proof effect. With the further protection of the metal dustproof mesh, the heat dissipation channel is ensured to be unobstructed during long-term operation. S3: When the fan is turned on at high speed, the thermoelectric cooler 12, which is electrically connected to the high speed setting of the fan, is activated. When the thermoelectric cooler 12 is working, its cold end will cool down rapidly and come into close contact with the heat dissipation fins 11 extending downward to its surface, thereby reducing the temperature of the heat dissipation fins 11. This creates a huge temperature difference between the heat dissipation fins 11 and the circuit board. This temperature difference greatly enhances the rate and efficiency of heat conduction from the circuit board to the heat dissipation fins 11. At this time, the miniature cooling fan 7 carries away the heat generated by the hot end of the thermoelectric cooler 12.

[0037] Finally, the following points should be noted: In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection" and "linkage" should be interpreted broadly, and can be mechanical or electrical connection, or internal connection between two components, or direct connection. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may change. The electronic components and modules used in this utility model can all be parts that are commonly used in the market and can achieve the specific functions in this case. The specific models and sizes can be selected and adjusted according to actual needs. The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

Claims

1. A fan support structure for an integrated heat dissipation circuit board, comprising a support part (1), the support part (1) comprising a tubular support (2) and a base (3) for supporting the tubular support (2), characterized in that: The base (3) has four symmetrical internal threaded cylinders (4) fixedly connected to its bottom inner wall. The circuit board is sleeved on the four internal threaded cylinders (4). Each of the internal threaded cylinders (4) has screws (13) threaded inside to fix the circuit board. The base (3) has a bracket (6) fixedly connected to its bottom inner wall. The bracket (6) has multiple miniature cooling fans (7) fixedly connected to its upper surface to blow air onto the circuit board.

2. The fan support structure of the integrated heat dissipation circuit board according to claim 1, characterized in that: Each of the four internally threaded cylinders (4) is fitted with a slip ring (8) to lift the circuit board and disengage it from the bottom inner wall of the base (3).

3. The fan support structure of the integrated heat dissipation circuit board according to claim 2, characterized in that: A support plate (5) is bonded between multiple slip rings (8). Multiple strip-shaped through holes (10) are provided on the upper surface of the support plate (5). Heat dissipation fins (11) are provided in each of the multiple strip-shaped through holes (10), and the heat dissipation fins (11) extend upward to contact the bottom of the circuit board.

4. The fan support structure of the integrated heat dissipation circuit board according to claim 3, characterized in that: The support plate (5) is a hollow structure, and multiple semiconductor cooling chips (12) are provided inside the support plate (5). The bottom of the multiple heat dissipation fins (11) extends downward to contact the semiconductor cooling chips (12).

5. The fan support structure of the integrated heat dissipation circuit board according to claim 4, characterized in that: The semiconductor cooling chip (12) is electrically connected to the high speed setting of the fan, and the multiple micro cooling fans (7) are electrically connected to the fan switch.

6. The fan support structure of the integrated heat dissipation circuit board according to claim 4, characterized in that: Multiple sets of heat-conducting frames (14) are provided between the multiple sets of heat dissipation fins (11).

7. The fan support structure of the integrated heat dissipation circuit board according to claim 1, characterized in that: The base (3) has multiple heat dissipation holes (9) on its circumferential wall, and all the heat dissipation holes (9) are inclined downward.

8. The fan support structure of the integrated heat dissipation circuit board according to claim 7, characterized in that: The inner side of the heat dissipation hole (9) is detachably covered with a dustproof mesh made of metal mesh.

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