Antenna structure and terminal device

Abstract

This disclosure relates to an antenna structure and a terminal device. The antenna structure includes: an antenna frame comprising: a conductive frame having a first frame and a second frame surrounding the first frame; the first frame having a gap; a circuit board assembly mounted on the second frame and connected to the first frame; the circuit board assembly being provided with an impedance component for adjusting the length of the antenna current path within the conductive frame. Embodiments of this disclosure enable improvements in antenna performance while reducing the impact on the device's appearance.

Description

Technical Field

[0001] This disclosure relates to the field of antenna technology, and in particular to an antenna structure and terminal device. Background Technology

[0002] With the rapid development of communication technology, the number of antennas in terminal devices is constantly increasing. Due to the limited space for device layout in the pursuit of thinner and lighter terminal devices, the integration of antennas in terminal devices is becoming increasingly higher, and the terminal device frame is often used as the antenna radiator. However, the industrial design (ID) of terminal devices, which involves openings in the frame, can affect the antenna performance of the frame antenna. Utility Model Content

[0003] To overcome the problems existing in related technologies, this disclosure provides an antenna structure and terminal device that can improve antenna performance while reducing the impact on ID appearance.

[0004] According to a first aspect of the present disclosure, an antenna structure is provided, comprising:

[0005] A conductive frame having a first frame and a second frame enclosed within the first frame;

[0006] The first frame has a seam;

[0007] A circuit board assembly is mounted on the second frame and connected to the first frame;

[0008] The circuit board assembly is provided with an impedance component, which is used to adjust the length of the antenna current path in the conductive frame.

[0009] In this embodiment, the length of the antenna current path is optimized by changing the impedance of the impedance component. This not only enables more precise improvement of antenna performance across the gap but also reduces antenna modifications and simplifies antenna performance tuning. Furthermore, in this embodiment, the circuit board assembly is mounted in the second frame without affecting the gap in the first frame, thus improving antenna performance while minimizing the impact on the ID (integrated design) appearance.

[0010] In some embodiments, the slit divides the first frame into a first radiator and a second radiator;

[0011] The circuit board assembly is connected to the first radiator and / or the second radiator, respectively.

[0012] In this embodiment of the disclosure, the circuit board assembly is connected to the first radiator and / or the second radiator respectively. The length of the antenna current path can be optimized by changing the impedance of the impedance assembly, thereby improving antenna performance without affecting the appearance of the ID.

[0013] In some embodiments, the circuit board assembly is provided with conductive connectors; the conductive connectors are respectively connected to the first radiator and the second radiator.

[0014] In this embodiment of the disclosure, by setting a conductive connector, the circuit board assembly can be linked to the conductive frame, and when the conductive frame is used as an antenna, the length of the antenna current path can be adjusted by changing the impedance component of the circuit board assembly.

[0015] In some embodiments, the conductive connector is laser welded to the first radiator and the second radiator;

[0016] And / or,

[0017] The circuit board assembly has a substrate, and the impedance component and the conductive connector are disposed on the substrate at intervals via surface mount technology.

[0018] In this embodiment, laser welding connects the first and second radiators, enabling the connection of conductive connectors and the second frame while simultaneously protecting the devices on the circuit board assembly and reducing thermal damage. Surface mount technology (SMT) for mounting impedance components and conductive connectors on the substrate improves manufacturing efficiency and welding reliability.

[0019] In some embodiments, the second frame is recessed in a direction away from the fracture to form a groove;

[0020] The circuit board assembly is installed in the groove and positioned close to the seam.

[0021] In this embodiment, mounting the circuit board assembly within the recess allows for improved antenna performance without additional space requirements. Furthermore, positioning the circuit board assembly close to the seam further enhances antenna performance.

[0022] In some embodiments, the second frame is formed with the groove by computer numerical control at a position aligned with the seam.

[0023] In this embodiment, forming a groove aligned with the fracture allows the circuit board assembly mounted in the groove to better approach the fracture, improving antenna performance. Furthermore, forming the groove using computer numerical control (CNC) machining improves the machining precision of the groove.

[0024] In some embodiments, the gap between the groove and the circuit board assembly, as well as the gap, are filled with an insulating material.

[0025] In this embodiment of the disclosure, by filling the gaps with insulating material, the stability of the circuit board assembly mounted in the groove can be improved. Furthermore, by filling the gaps with insulating material, the consistency of appearance can be maintained and the structural strength can be improved.

[0026] In some embodiments, the impedance component includes at least one of the following: a fixed impedance element; a variable impedance element; a digital impedance circuit; and an impedance network with switches.

[0027] In this embodiment of the disclosure, the length of the antenna current path can be flexibly adjusted by designing different impedance components.

[0028] In some embodiments, the impedance components on the circuit board assembly are coated with a protective adhesive.

[0029] In this embodiment of the disclosure, coating the impedance component with a protective adhesive can better protect the impedance component and extend its service life.

[0030] According to a second aspect of the present disclosure, a terminal device is provided, comprising: an antenna structure as described in the first aspect above.

[0031] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0032] In this embodiment, the length of the antenna current path is optimized by changing the impedance of the impedance component. This not only enables more precise improvement of antenna performance across the gap, but also reduces antenna modifications and simplifies antenna performance tuning. Furthermore, in this embodiment, the circuit board assembly is mounted in the second frame without affecting the gap in the first frame, thus improving antenna performance while minimizing the impact on the ID (integrated design) appearance.

[0033] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0034] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0035] Figure 1 This is a schematic diagram of the antenna structure of the present disclosure according to an exemplary embodiment. Figure 1 .

[0036] Figure 2 This is a schematic diagram of the antenna structure of the present disclosure according to an exemplary embodiment. Figure 2 .

[0037] Figure 3 This is a schematic diagram of an antenna structure disposed in a terminal device according to an exemplary embodiment. Figure 1 .

[0038] Figure 4 This is a schematic diagram of an antenna structure disposed in a terminal device according to an exemplary embodiment. Figure 2 .

[0039] Figure 5 This is a structural block diagram of a terminal device according to an exemplary embodiment. Detailed Implementation

[0040] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0041] This disclosure proposes an antenna structure suitable for scenarios with multiple antenna frequency bands and complex antenna environments. By configuring the antenna structure in a terminal device, the antenna performance of multiple antenna frequency bands can be improved in complex antenna environments.

[0042] Figure 1 This is a schematic diagram of the antenna structure of the present disclosure according to an exemplary embodiment. Figure 1 . Figure 2 This is a schematic diagram of the antenna structure of the present disclosure according to an exemplary embodiment. Figure 2 .like Figure 1 and Figure 2 As shown, the antenna structure includes:

[0043] The conductive frame 100 has a first frame 101 and a second frame 102 enclosed within the first frame 101;

[0044] The first frame 101 has a seam;

[0045] The circuit board assembly 200 is mounted on the second frame 102 and connected to the first frame 101;

[0046] The circuit board assembly 200 is provided with an impedance component (not shown in the figure), which is used to adjust the length of the antenna current path in the conductive frame.

[0047] In this embodiment of the disclosure, the antenna module is applied in an electronic device to transmit and receive radio waves to transmit and exchange wireless signals. The electronic device includes: smartphones, tablets, laptops, wearable devices, or personal digital assistants (PDAs), etc. Wearable devices include, but are not limited to, smartwatches or smart bracelets.

[0048] The aforementioned conductive mid-frame can be the conductive mid-frame of a terminal device. That is, the embodiments of this disclosure can reuse the conductive mid-frame of a terminal device as an antenna, achieving the effects of reducing space occupation and improving integration.

[0049] The first frame and the second frame described above can form a conductive middle frame. The first frame can form a ring, and the second frame can be located within the first frame of the ring.

[0050] It should be noted that the first frame can be understood as the outer frame of the terminal device. The second frame can be understood as the supporting frame for various components within the terminal device.

[0051] The aforementioned first frame has a gap. The first frame with the gap can be used as a radiator for transmitting and receiving wireless signals in an antenna structure.

[0052] It should be noted that the radiator of the antenna structure for transmitting and receiving wireless signals can operate in cellular mobile antenna bands, Wi-Fi bands, millimeter-wave antenna bands, Bluetooth antenna bands, satellite antenna bands, and / or ultra-wideband antenna bands, etc.

[0053] The aforementioned circuit board assembly is mounted on the second frame. Here, mounting the circuit board assembly on the second frame may include: the second frame and the first frame being spaced apart, with the circuit board assembly being mounted at the spaced-apart position between the first frame and the second frame; or the second frame may have a groove provided, with the circuit board assembly mounted in the groove, that is, a circuit board assembly is built into the second frame.

[0054] It should be noted that this circuit board assembly is different from the motherboard assembly with chips installed in the terminal device. This circuit board assembly can be understood as a circuit board with a dedicated load-bearing impedance component used for antenna frequency modulation.

[0055] In this embodiment of the disclosure, the antenna current path is used to indicate the path of the current formed on the conductive frame when the conductive frame is operating as an antenna.

[0056] Here, the length of the antenna current path is negatively correlated with the antenna resonant frequency; that is, the longer the antenna current path, the lower the antenna resonant frequency; and the shorter the antenna current path, the higher the antenna resonant frequency.

[0057] In this embodiment, the gap in the first frame may interrupt the current, causing a shortening of the antenna current path. Therefore, this embodiment adds a circuit board assembly to adjust the length of the antenna current path via an impedance component on the circuit board assembly, thereby achieving antenna frequency modulation.

[0058] It should be noted that when using impedance components, the introduced impedance (such as capacitive or inductive reactance) changes the antenna's phase constant, which is equivalent to changing the length of the antenna's current path in terms of electrical performance. Therefore, by changing the impedance of the impedance components, the length of the antenna's current path can be lengthened or shortened, thereby optimizing the antenna performance.

[0059] For example, increasing the capacitive reactance may lengthen the antenna current path, thus lowering the antenna resonant frequency. Conversely, increasing the inductive reactance may shorten the antenna current path, thus increasing the antenna resonant frequency.

[0060] In some embodiments, the impedance component includes at least one of the following: an impedance element with a fixed impedance value; an impedance element with a variable impedance value; a digital impedance circuit; or an impedance network with a switch.

[0061] The aforementioned impedance elements with fixed impedance values ​​may include: inductors with fixed impedance values, capacitors with fixed impedance values, and / or resistors with fixed impedance values.

[0062] It should be noted that when forming the circuit board assembly, appropriate impedance components with fixed impedance values ​​can be selected based on factors such as the transmit and receive frequency bands of the antenna structure and impedance matching, in order to optimize the length of the antenna current path.

[0063] The aforementioned impedance components with variable impedance values ​​may include: capacitors with variable impedance values, inductors with variable impedance values, and / or trimmer resistors.

[0064] It should be noted that the impedance of a variable impedance component can be adjusted by external force, thereby optimizing the length of the antenna current path. In other words, embodiments of this disclosure can also replace inductors with fixed impedance components by using variable impedance components to suit a wider range of antenna scenarios.

[0065] The aforementioned digital impedance circuit may include circuits that pass through I 2 Integrated circuits that control impedance values ​​using digital interfaces such as the C bus or Serial Peripheral Interface (SPI).

[0066] It should be noted that by setting up a digital impedance circuit to change the impedance value, the impedance value can be adjusted in a programmed manner.

[0067] The aforementioned impedance network with switches can be constructed from controlled switches and impedance circuits. Here, the impedance value can be changed by altering the switching state of the controlled switches, thereby optimizing the length of the antenna current path.

[0068] It is understood that, in the embodiments of this disclosure, the length of the antenna current path can be flexibly adjusted by designing different impedance components.

[0069] In related technologies, the impact of gaps on antenna performance is typically mitigated by altering antenna size, feed location, or the mainboard. However, this approach suffers from drawbacks such as significant modifications, impact on the antenna's appearance, long verification cycles, and limited debugging capabilities.

[0070] Based on this, the present disclosure proposes a first frame with a seam, a circuit board assembly mounted on a second frame, the circuit board being connected to the first frame, and an impedance component disposed on the circuit board assembly for adjusting the length of the antenna current path. Thus, the present disclosure can optimize the length of the antenna current path by changing the impedance of the impedance component, thereby not only achieving more precise improvement in antenna performance across the seam, but also reducing antenna modifications and simplifying antenna performance tuning. Furthermore, the present disclosure mounts the circuit board assembly on the second frame without affecting the seam in the first frame, thereby achieving improved antenna performance while reducing the impact on the ID (individual appearance).

[0071] In some embodiments, such as Figure 1 and Figure 2 As shown, the slit 300 divides the first frame 101 into a first radiator L1 and a second radiator L2;

[0072] The circuit board assembly 200 is connected to the first radiator L1 and / or the second radiator L2, respectively.

[0073] In this embodiment of the disclosure, the first radiator L1 and the second radiator L2 can be used as radiators for transmitting and receiving wireless signals in an antenna structure, and operate under the excitation of a feed signal.

[0074] Here, when the first radiator and the second radiator are working, since the circuit board assembly is connected to the first radiator and / or the second radiator respectively, the impedance component of the circuit board assembly can adjust the length of the antenna current path.

[0075] In this embodiment of the disclosure, the antenna module is applied in a terminal device. The first radiator has a first length along the extension direction of the side of the terminal device, and the second radiator has a second length along the extension direction of the side of the terminal device. The first length and the second length may be equal or unequal, and this embodiment of the disclosure does not limit this.

[0076] It is understood that in the embodiments of this disclosure, by connecting the circuit board assembly to the first radiator and / or the second radiator respectively, the length of the antenna current path can be optimized by changing the impedance of the impedance assembly, thereby improving antenna performance without affecting the ID appearance.

[0077] In some embodiments, such as Figure 1 and Figure 2 As shown, the circuit board assembly 200 is provided with a conductive connector 400; the conductive connector 400 is connected to the first radiator L1 and the second radiator L2 respectively.

[0078] In this embodiment of the disclosure, the conductive connector may include a first conductive part and a second conductive part. The first conductive part is electrically connected to the first radiator and the second radiator respectively, and the second conductive part is electrically connected to the circuit board assembly, thereby realizing that the conductive connector connects both the circuit board assembly and the conductive frame.

[0079] It should be noted that the first conductive part and the second conductive part may be disposed on opposite sides or adjacent sides of the conductive connector, and the embodiments disclosed herein do not impose any restrictions on this.

[0080] The aforementioned conductive connector may include conductive sheets or conductive pins, etc. Here, the conductive sheet includes, but is not limited to, copper sheets or aluminum sheets, etc.

[0081] It should be noted that the conductive connector is made of conductive material, which may include metal or conductive plastic, etc., and the embodiments disclosed herein are not limited thereto.

[0082] It is understood that, in the embodiments of this disclosure, by setting conductive connectors, the circuit board assembly can be linked to the conductive frame, and when the conductive frame is used as an antenna, the length of the antenna current path can be adjusted by changing the impedance component of the circuit board assembly.

[0083] In some embodiments, the conductive connector is laser-welded to the first radiator and the second radiator; and / or,

[0084] The circuit board assembly has a substrate, and the impedance component and the conductive connector are disposed on the substrate at intervals via surface mount technology.

[0085] In this embodiment of the disclosure, laser welding can be understood as melting and connecting the conductive connector and the conductive middle frame. It can not only connect the conductive connector and the conductive middle frame, but also fix the conductive connector and the conductive middle frame at the same time.

[0086] It is understood that in this embodiment of the present disclosure, the conductive connector is connected to the first radiator and the second radiator by laser welding, which can protect the devices on the circuit board assembly and reduce thermal damage while connecting the conductive connector and the second frame.

[0087] In this embodiment of the disclosure, the substrate is used to carry impedance components and conductive connectors.

[0088] Here, the substrate may include a rigid substrate (e.g., a metal substrate or a ceramic substrate) or a flexible substrate (e.g., a substrate made of polyimide or polyester).

[0089] In this embodiment of the disclosure, the impedance component and the conductive connector may be disposed at intervals on the same side of the substrate. For example, both the impedance component and the conductive connector may be disposed on the side of the substrate facing the fracture.

[0090] Of course, the impedance component and the conductive connector can also be disposed at intervals on different sides of the substrate. For example, the impedance component can be disposed on the side of the substrate away from the fracture, and the conductive connector can be disposed on the side of the substrate facing the fracture.

[0091] It is understood that, in the embodiments of this disclosure, mounting impedance components and conductive connectors on the substrate using surface mount technology (SMT) can improve manufacturing efficiency and soldering reliability.

[0092] In some embodiments, such as Figure 1 and Figure 2 As shown, the second frame 102 is recessed in the direction away from the fracture 300 to form a groove 500;

[0093] The circuit board assembly 200 is installed in the groove 500 and positioned near the gap 300.

[0094] In this embodiment, the second frame is recessed in a direction away from the fracture line to form a groove, the opening of which may face the fracture line. A circuit board assembly can be mounted within the groove through the opening.

[0095] The aforementioned grooves are used to accommodate circuit board assemblies. Here, the grooves can be designed according to the size and shape of the circuit board assembly to achieve better accommodation of the circuit board assembly while minimizing the groove size.

[0096] It should be noted that the groove can be placed at any position near the break, and this embodiment does not limit this.

[0097] Here, when the groove is positioned close to the seam, the circuit board assembly can also be positioned close to the seam.

[0098] It should be noted that the circuit board assembly is positioned close to the break, which may include: the center of the circuit board assembly and the center of the break being on the same straight line, or the center of the circuit board assembly being aligned with one side of the break.

[0099] It is understood that, in this embodiment of the disclosure, mounting the circuit board assembly within the recess allows for improved antenna performance without additional space occupation. Furthermore, placing the circuit board assembly close to the seam further enhances antenna performance.

[0100] In some embodiments, such as Figure 1 and Figure 2 As shown, the second frame 102 forms the groove 500 by computer numerical control at a position aligned with the seam 300.

[0101] In this embodiment of the disclosure, the groove is disposed at the position where the second frame is aligned with the break seam, that is, the groove is aligned with the break seam.

[0102] Here, the groove is aligned with the break, including the center of the groove and the center of the break being on the same straight line.

[0103] It should be noted that when the groove is aligned with the seam, the circuit board assembly mounted in the groove can be better aligned with the seam, thereby improving antenna performance.

[0104] It is understood that in this embodiment of the present disclosure, forming a groove at a position aligned with the fracture allows the circuit board assembly mounted in the groove to better approach the fracture, thereby improving antenna performance. Furthermore, forming the groove through computer numerical control machining improves the machining precision of the groove.

[0105] In some embodiments, the gap between the groove and the circuit board assembly, as well as the gap, are filled with an insulating material.

[0106] In embodiments of this disclosure, the insulating component includes, but is not limited to, plastics. These plastics include, but are not limited to, those formed from polyphenylene sulfide, polybutylene terephthalate, or polyphenylene sulfone.

[0107] It is understood that, in the embodiments of this disclosure, by filling the gaps with insulating material, the stability of the circuit board assembly mounted in the groove can be improved. Furthermore, by filling the gaps with insulating material, the consistency of appearance can be maintained and the structural strength can be improved.

[0108] In some embodiments, such as Figure 1 and Figure 2 As shown, the impedance component on the circuit board assembly 200 is coated with protective adhesive 600.

[0109] In this embodiment of the disclosure, the protective adhesive may cover the impedance component, and the protective adhesive includes, but is not limited to, epoxy resin adhesive, silicone adhesive, polyurethane adhesive, UV adhesive, thermally conductive silicone, silicone adhesive, hot melt adhesive, etc.

[0110] It is understood that, in the embodiments of this disclosure, coating the impedance component with protective adhesive can better protect the impedance component and extend its service life.

[0111] This disclosure also proposes a terminal device. Figure 3 This is a schematic diagram of an antenna structure disposed in a terminal device according to an exemplary embodiment. Figure 1 . Figure 4 This is a schematic diagram of an antenna structure disposed in a terminal device according to an exemplary embodiment. Figure 2 .

[0112] like Figure 3 and Figure 4 As shown, the terminal device includes an antenna structure 10 as described in one or more of the above embodiments.

[0113] In this embodiment of the disclosure, such as Figure 3 and Figure 4 As shown, the terminal device has a battery module 700, which is disposed near the bottom frame 800 of the terminal device.

[0114] The antenna structure 10 can be positioned at any location near the bottom frame body 800.

[0115] The antenna structure 10 may also be located near the first side of the battery module 700, or the antenna structure 10 may also be located near the second side of the battery module 700. Neither the second side nor the first side is a side of the battery module that is close to or away from the bottom frame, and the first side and the second side are two sides of the battery module that are opposite to each other.

[0116] It is understood that the terminal device includes an antenna structure that can extend the length of the antenna current path by changing the impedance of the impedance components, thereby not only improving antenna performance but also reducing antenna modifications and simplifying debugging. Furthermore, in this embodiment, the circuit board assembly is mounted in the second frame without affecting the seam in the first frame, thus achieving improved antenna performance while minimizing the impact on the ID (integrated design) appearance.

[0117] Figure 5 This is a structural block diagram illustrating a terminal device according to an exemplary embodiment. For example, the terminal device may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0118] Reference Figure 5 The terminal device may include one or more of the following components: processing component 502, memory 504, power supply component 506, multimedia component 508, audio component 510, input / output (I / O) interface 512, sensor component 514, and communication component 516.

[0119] Processing component 502 typically controls the overall operation of the terminal device, such as operations associated with at least one of display, telephone call, data communication, camera operation, and recording operation. Processing component 502 may include one or more processors 520 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 502 may include one or more modules to facilitate interaction between processing component 502 and other components. For example, processing component 502 may include a multimedia module to facilitate interaction between multimedia component 508 and processing component 502.

[0120] Memory 504 is configured to store various types of data to support operation on the terminal device. Examples of such data include at least one of the following: instructions for any application or method operating on the terminal device, contact data, phonebook data, messages, pictures, and videos. Memory 504 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0121] Power supply component 506 provides power to various components of the terminal device. Power supply component 506 may include at least one of the following: a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the terminal device.

[0122] Multimedia component 508 includes a screen that provides an output interface between the terminal device and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a Touch Panel, the screen may be implemented as a touchscreen to receive input signals from the user. The Touch Panel includes one or more touch sensors to sense touches, swipes, and gestures on the Touch Panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 508 includes a front-facing camera and / or a rear-facing camera. When the terminal device is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0123] Audio component 510 is configured to output and / or input audio signals. For example, audio component 510 includes a microphone (MIC) configured to receive external audio signals when the terminal device is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 504 or transmitted via communication component 516. In some embodiments, audio component 510 also includes a speaker for outputting audio signals.

[0124] I / O interface 512 provides an interface between processing component 502 and peripheral interface modules, such as keyboards, click wheels, and buttons. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0125] Sensor assembly 514 includes one or more sensors for providing status assessments of various aspects of the terminal device. For example, sensor assembly 514 can detect the on / off state of the terminal device, the relative positioning of components such as the terminal device's display and keypad, changes in the position of the terminal device or a component within it, the presence or absence of user contact with the terminal device, the terminal device's orientation or acceleration / deceleration, and temperature changes. Sensor assembly 514 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 514 may also include an optical sensor, such as a Complementary Metal Oxide Semiconductor (CMOS) or Charge Coupled Device (CCD) image sensor, for use in imaging applications. In some embodiments, sensor assembly 514 may also include, but is not limited to, at least one of the following: an accelerometer, a gyroscope, a magnetometer, a pressure sensor, and a temperature sensor.

[0126] Communication component 516 is configured to facilitate wired or wireless communication between the terminal device and other devices. The terminal device can access wireless networks based on communication standards, such as Wi-Fi, 4G, 6G, or combinations thereof. In one exemplary embodiment, communication component 516 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 516 also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wide Band (UWB), Bluetooth (BT), and other technologies.

[0127] In an exemplary embodiment, the terminal device may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0128] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0129] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An antenna structure, characterized by include: A conductive frame having a first frame and a second frame enclosed within the first frame; The first frame has a seam; A circuit board assembly is mounted on the second frame and connected to the first frame; The circuit board assembly is provided with an impedance component, which is used to adjust the length of the antenna current path in the conductive frame.

2. The antenna structure of claim 1, wherein, The fracture divides the first frame into a first radiator and a second radiator. The circuit board assembly is connected to the first radiator and / or the second radiator, respectively.

3. The antenna structure of claim 2, wherein, The circuit board assembly is provided with conductive connectors; the conductive connectors are respectively connected to the first radiator and the second radiator.

4. The antenna structure of claim 3, wherein, The conductive connector is laser welded to the first radiator and the second radiator. And / or, The circuit board assembly has a substrate, and the impedance component and the conductive connector are disposed on the substrate at intervals via surface mount technology.

5. The antenna structure according to any one of claims 1 to 4, characterized in that The second frame is recessed in the direction away from the fracture to form a groove; The circuit board assembly is installed in the groove and positioned close to the seam.

6. The antenna structure of claim 5, wherein, The second frame is formed with the groove by computer numerical control at a position aligned with the seam.

7. The antenna structure according to claim 5, characterized in that, The gap between the groove and the circuit board assembly, as well as the gap, are filled with insulating material.

8. The antenna structure according to any one of claims 1 to 4, characterized in that, The impedance component includes at least one of the following: an impedance element with a fixed impedance value; an impedance element with a variable impedance value; a digital impedance circuit; or an impedance network with a switch.

9. The antenna structure according to any one of claims 1 to 4, characterized in that, The impedance components on the circuit board assembly are coated with protective adhesive.

10. A terminal device, characterized in that, include: The antenna structure as described in any one of claims 1 to 9.

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