Rapid thermal annealing machine wafer carrying device

Abstract

The utility model discloses a quick heat annealing machine platform wafer bearing device, including U type board, one side fixed connection board of U type board is provided with a plurality of bearing plates in the U type groove of U type board, a plurality of bearing plate and the side arm of U type board all form the clearance between each other, the top height of U type board and a plurality of bearing plate is identical. Compared with the prior art, the utility model discloses a plurality of supports of U type board and bearing plate, prevent wafer bottom large -area suspension, so that wafer even breakage can stay in the top of the device, not only keep the first scene of breakage convenient to investigate the reason, also avoid wafer falling damage lower unprocessed wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer heat treatment technology, and in particular to a wafer carrier device for a rapid thermal annealing machine. Background Technology

[0002] In semiconductor manufacturing processes, high-temperature rapid thermal annealing equipment is one of the key pieces of equipment, mainly used for thermal annealing of wafers. This process requires heating the equipment to approximately 1000 degrees Celsius. By precisely controlling the temperature and processing time, the performance of the wafers can be optimized and improved, making it an important step in the semiconductor device fabrication process.

[0003] However, in actual manufacturing processes, wafer breakage is difficult to completely avoid. Breakage can stem from inherent quality defects in the wafer itself, such as internal stress or microcracks, or from equipment malfunctions, such as abnormal temperature control or mechanical component failure. In most cases, wafer breakage occurs after the process is completed and the wafer exits the reaction chamber.

[0004] However, since damaged wafers often occur during the inter-transfer process after the process is completed, existing wafer carrier devices, such as... Figure 4 As shown, since there is no supporting mechanism in the middle, the broken wafer will fall directly onto the wafer waiting for processing below. This not only damages the unprocessed wafer and increases production costs, but also destroys the initial site of the wafer breakage, making it extremely difficult to investigate the cause of the breakage and hindering process optimization and machine maintenance. Utility Model Content

[0005] The main purpose of this utility model is to provide a wafer support device for a rapid thermal annealing machine. Through the multiple supports of the U-shaped plate and the support plate, it prevents a large area of ​​the bottom of the wafer from being suspended in the air, so that even if the wafer is damaged, it can remain on the top of the device. This preserves the initial scene of the damage for easy investigation of the cause, and also prevents the wafer from falling and damaging the unprocessed wafers below.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: A wafer carrier device for a rapid thermal annealing machine includes a U-shaped plate, a connecting plate fixed to one side of the U-shaped plate, and a plurality of carrier plates arranged in the U-shaped groove of the U-shaped plate. The plurality of carrier plates and the side arms of the U-shaped plate form gaps between each other, and the top heights of the U-shaped plate and the plurality of carrier plates are the same.

[0007] Furthermore, several first through holes are provided on the two side arms of the U-shaped plate.

[0008] Furthermore, several second through holes are formed on the top surface of several of the bearing plates.

[0009] Furthermore, several second through holes are equidistantly arranged along the center line of the bearing plate.

[0010] Furthermore, the top of the U-shaped plate is provided with several protrusions.

[0011] Furthermore, the support plate is provided with a number of protrusions.

[0012] Furthermore, the top heights of the plurality of said bosses and the plurality of said protrusions are the same.

[0013] Furthermore, the protrusions are integrally formed with the support plate and are both made of quartz.

[0014] Furthermore, the gap size is 3 mm to 10 mm.

[0015] Compared with the prior art, the present invention has the following beneficial effects: This invention uses multiple supports from a U-shaped plate and a carrier plate to prevent a large area of ​​the bottom of the wafer from being suspended in the air. This ensures that even if the wafer is damaged, it can remain on top of the device, preserving the initial scene of the damage for easy investigation and preventing the wafer from falling and damaging the unprocessed wafers below.

[0016] The first through hole of the U-shaped plate side arm and the second through hole of the bearing plate of this invention can ensure smooth airflow in the device and reduce particle adhesion on the surface of the device.

[0017] The bosses of this invention are at the same height as the top of the protrusions, and multiple bosses are provided to provide sufficient support points when the wafer flatness is poor, thereby reducing stress. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of a wafer carrier device for a rapid thermal annealing machine according to this utility model.

[0019] Figure 2 This is a schematic diagram of the support plate structure of a wafer support device for a rapid thermal annealing machine according to this utility model.

[0020] Figure 3 This is a schematic diagram showing the connection between the support plate and the protrusion of a wafer support device for a rapid thermal annealing machine according to this utility model.

[0021] Figure 4 This is a schematic diagram of the existing technology structure.

[0022] In the diagram: 1. U-shaped plate; 101. Side arm; 2. Connecting plate; 3. First through hole; 4. Second through hole; 5. Bearing plate; 6. Boss; 7. Protrusion; 8. Gap. Detailed Implementation

[0023] The present invention will now be described in detail with reference to the accompanying drawings.

[0024] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] like Figure 1-3 As shown, a wafer carrier device for a rapid thermal annealing machine includes a U-shaped plate 1, a connecting plate 2 fixed on one side of the U-shaped plate 1, and a plurality of carrier plates 5 arranged in the U-shaped groove of the U-shaped plate 1. The plurality of carrier plates 5 and the side arms 101 of the U-shaped plate 1 form gaps 8 between each other, and the top heights of the U-shaped plate 1 and the plurality of carrier plates 5 are the same.

[0028] In this embodiment, the gap 8 is 3 mm to 10 mm in size. The connecting plate 2 is connected to the robotic arm, so that the robotic arm drives the U-shaped plate 1 to move through the connecting plate 2. At this time, the U-shaped plate 1 can move into the reaction chamber and move towards the bottom of the wafer. During this process, the U-shaped plate 1 passes through the positioning pin supporting the wafer through the gap 8, thereby picking up and placing the wafer.

[0029] When placing or removing wafers, since several carrier plates 5 are fixed inside the U-shaped groove of the U-shaped plate 1, the bottom of the wafer will simultaneously contact the U-shaped plate 1 and the carrier plates 5, thus avoiding a large area of ​​the bottom of the wafer being suspended in the air. Therefore, even if the wafer is damaged, it will remain on top of the U-shaped plate 1 and will not fall. This preserves the original scene of the wafer damage, making it easier to investigate the cause of the damage, and also prevents the damaged wafer from damaging the unprocessed wafers below after it falls.

[0030] Among them, such as Figure 1 and Figure 2 As shown, several first through holes 3 are provided on the two side arms 101 of the U-shaped plate 1, and several second through holes 4 are provided on the top surface of several support plates 5. The several second through holes 4 are equidistantly arranged along the center line of the support plates 5. Airflow can pass through the first through holes 3 and the second through holes 4, thereby ensuring smooth airflow in the U-shaped plate 1 and the support plates 5, and thus reducing particle adhesion on the device.

[0031] Among them, such as Figure 1 and Figure 2 As shown, the top of the U-shaped plate 1 is provided with several protrusions 6, which are integrally formed with the U-shaped plate 1 and are made of quartz. The support plate 5 is provided with several protrusions 7. The top heights of the protrusions 6 and the protrusions 7 are the same. When the wafer is located on the top of the U-shaped plate 1, the protrusions 6 and the protrusions 7 support the wafer at the same time. Thus, when the wafer flatness is not good, there are enough support points to support the wafer, thereby avoiding large areas of the wafer being suspended and generating stress, and thus reducing the risk of breakage.

[0032] The protrusion 7 and the supporting plate 5 are integrally formed and both are made of quartz, which can withstand high temperatures.

[0033] Working principle: The connecting plate 2 is connected to the robotic arm. The robotic arm drives the U-shaped plate 1 to move into the reaction chamber and approach the bottom of the wafer. Due to the 3 mm-10 mm gap 8 formed between the U-shaped plate 1 and the support plate 5, and between the support plates 5 themselves, the device can smoothly pass through the positioning pins supporting the wafer, realizing the wafer picking and placing operation. When picking and placing the wafer, the top height of several protrusions 6 on the top of the U-shaped plate 1 is consistent with the top height of several protrusions 7 on the support plate 5, which simultaneously support the wafer. The multiple support structure avoids a large area of ​​the bottom of the wafer being suspended. Even if the wafer is damaged, it can remain on the top of the U-shaped plate 1. This preserves the first scene of the wafer damage, making it easy to investigate the cause of the damage. It also prevents the damaged wafer from damaging the unprocessed wafer below after falling. In addition, it provides sufficient support points when the wafer flatness is not good, reducing stress and lowering the risk of damage.

[0034] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent transformations or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A wafer carrier device for a rapid thermal annealing machine, comprising a U-shaped plate (1), wherein a connecting plate (2) is fixed to one side of the U-shaped plate (1), characterized in that: The U-shaped plate (1) has several bearing plates (5) arranged in the U-shaped groove. The bearing plates (5) and the side arms (101) of the U-shaped plate (1) form gaps (8) between each other. The top heights of the U-shaped plate (1) and the bearing plates (5) are the same.

2. The wafer carrier device for a rapid thermal annealing machine according to claim 1, characterized in that: The two side arms (101) of the U-shaped plate (1) are provided with a number of first through holes (3).

3. The wafer carrier device for a rapid thermal annealing machine according to claim 1, characterized in that: Several second through holes (4) are provided on the top surface of several of the bearing plates (5).

4. The wafer carrier device for a rapid thermal annealing machine according to claim 3, characterized in that: Several second through holes (4) are equidistantly arranged along the center line of the bearing plate (5).

5. A wafer carrier device for a rapid thermal annealing machine according to any one of claims 1-4, characterized in that: The top of the U-shaped plate (1) is provided with several protrusions (6).

6. The wafer support apparatus for a rapid thermal anneal tool of claim 5, wherein: The support plate (5) is provided with a number of protrusions (7).

7. The wafer support apparatus of claim 6, wherein: The top heights of the plurality of said bosses (6) and the plurality of said protrusions (7) are the same.

8. A wafer carrier device for a rapid thermal annealing machine according to claim 6, characterized in that: The protrusion (7) and the support plate (5) are integrally formed and both are made of quartz.

9. A wafer carrier device for a rapid thermal annealing machine according to claim 1, characterized in that: The gap (8) is 3 mm to 10 mm in size.

Images