Low power integrated circuit package module based on three-dimensional stacked structure

Abstract

The utility model provides a low -power integrated circuit package module based on three -dimensional stacking structure, and relate to integrated circuit package technical field, including package shell, shell vertical stacking function chip no.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit packaging technology, and in particular to a low-power integrated circuit packaging module based on a three-dimensional stacked structure. Background Technology

[0002] With the rapid development of integrated circuit technology, chip integration is constantly increasing, and the power consumption and heat generation of functional chips are increasing significantly, placing higher demands on the heat dissipation performance of packaging modules. Traditional planar packaging structures have problems such as large footprint, low heat dissipation efficiency, and long signal transmission paths, making it difficult to meet the application requirements of high density and low power consumption.

[0003] 3D stacked packaging technology effectively reduces package size, shortens signal transmission paths, and lowers power consumption by stacking multiple functional chips vertically. However, the dense arrangement of chips in a 3D stacked structure leads to heat concentration. If heat dissipation is not timely, the chip operating temperature will rise, affecting circuit performance and reliability. Existing 3D packaging heat dissipation solutions mostly use a single heat dissipation structure (such as only setting heat sink fins or liquid cooling channels), which has limited heat dissipation efficiency and is difficult to adapt to the heat dissipation requirements under different operating conditions.

[0004] Based on this, the present invention provides a low-power integrated circuit packaging module based on a three-dimensional stacked structure to solve one or more of the problems mentioned above. Utility Model Content

[0005] This invention provides a low-power integrated circuit packaging module based on a three-dimensional stacked structure to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution, including a packaging shell, wherein a functional chip one, a thermal management layer, a functional chip two and a heat dissipation cavity are stacked and disposed vertically inside the packaging shell, the thermal management layer is disposed between the functional chip one and the functional chip two, and the heat dissipation cavity is disposed between the functional chip two and the inner wall of the packaging shell.

[0007] The thermal management layer includes a heat-conducting plate and a phase change material filling layer;

[0008] A miniature liquid pump and heat dissipation fins are installed inside the heat dissipation cavity.

[0009] Preferably, signal transmission is achieved between functional chip one and functional chip two through an electrical connection structure.

[0010] Preferably, the heat-conducting plate is fixed inside the encapsulation shell, and micro liquid cooling channels are symmetrically provided on both sides of the heat-conducting plate. The micro liquid cooling channels have an outlet and an inlet. The inlet is used to connect to the coolant, and the outlet is used to discharge the coolant after absorbing heat.

[0011] Preferably, the phase change material filling layer fills the gap between the micro liquid cooling channels, and the surface of the phase change material filling layer on both sides of the heat-conducting plate is respectively bonded to the adjacent functional chip one and functional chip two.

[0012] Preferably, the packaging shell has two sets of interfaces;

[0013] Thermally conductive silicone is provided between the phase change material filling layer and both functional chip one and functional chip two.

[0014] Preferably, the outlet of the micro liquid cooling channel is connected to the micro liquid pump via a coolant pipe, and the inlet of the micro liquid cooling channel is connected to one of the sets of interfaces.

[0015] Preferably, the end of the micro liquid pump away from the coolant pipe is connected to the heat dissipation fins, and the end of the heat dissipation fins away from the micro liquid pump is connected to another set of interfaces.

[0016] Preferably, the heat-conducting plate is made of copper or aluminum, and the cross-section of the micro liquid cooling channel inside the heat-conducting plate is rectangular or circular, with a cross-sectional size of 50 micrometers to 200 micrometers.

[0017] Preferably, the micro liquid cooling channels are distributed in a serpentine or grid pattern.

[0018] Preferably, the phase change material filling layer is made of paraffin-based composite phase change material or polymer phase change material.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] 1. High-efficiency heat dissipation: Through the dual heat dissipation mechanism of "thermal management layer (liquid cooling channel + phase change material) + heat dissipation cavity (liquid pump + fins)," heat is rapidly conducted, absorbed, and diffused, and the heat dissipation efficiency is improved by more than 40% compared with the traditional single heat dissipation structure.

[0021] 2. Low power consumption design: The three-dimensional stacked structure shortens the signal transmission path between chips and reduces transmission loss; at the same time, the phase change material can absorb peak heat, reduce the operating frequency of the liquid cooling system, and further reduce power consumption.

[0022] 3. Compact structure: All components are integrated along the vertical direction, and the package volume is reduced by more than 50% compared with planar packaging, making it suitable for high-density integration scenarios; Attached Figure Description

[0023] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0024] In the attached diagram:

[0025] Figure 1This is a schematic diagram of the structure of this utility model;

[0026] Figure 2 This is a schematic diagram of the heat-conducting plate structure in this utility model.

[0027] In the diagram: 1. Encapsulation shell; 2. Thermal management layer; 3. Thermally conductive silicone; 4. Functional chip one; 5. Coolant pipe; 6. Miniature liquid pump; 7. Heat dissipation cavity; 8. Heat dissipation fins; 9. Functional chip two; 10. Interface; 11. Heat-conducting plate; 12. Miniature liquid cooling channel; 13. Phase change material filling layer; 14. Liquid outlet; 15. Liquid inlet. Detailed Implementation

[0028] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0029] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described using the same technical terms, and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions and features of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination should be considered non-existent and not within the scope of protection claimed by this utility model.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] Please see Figures 1-2This utility model provides a low-power integrated circuit packaging module based on a three-dimensional stacked structure, including a packaging shell 1. Inside the packaging shell 1, a functional chip 4, a thermal management layer 2, a functional chip 9, and a heat dissipation cavity 7 are stacked vertically. The thermal management layer 2 is disposed between the functional chip 4 and the functional chip 9, and the heat dissipation cavity 7 is disposed between the functional chip 9 and the inner wall of the packaging shell 1. The packaging shell 1 provides physical protection and mounting reference for the internal components. The functional chip 4, thermal management layer 2, and functional chip 9 are stacked vertically in sequence to minimize the distance between the chips and shorten the signal path.

[0032] The thermal management layer 2 includes a heat-conducting plate 11 and a phase change material filling layer 13. The thermal management layer 2 is sandwiched between the two chips, directly contacting and absorbing the heat generated when the chips are working, thus preventing heat from accumulating on the chip surface.

[0033] The heat dissipation cavity 7 is equipped with a micro liquid pump 6 and heat dissipation fins 8. The heat dissipation cavity 7 is located between the functional chip 9 and the inner wall of the package shell 1. The micro liquid pump 6 inside provides power for the flow of coolant, and the heat dissipation fins 8 dissipate the heat carried by the coolant to the external environment by increasing the heat dissipation area, forming a basic heat dissipation path of "chip heat generation → initial heat absorption of the thermal management layer → deep heat dissipation of the heat dissipation cavity".

[0034] Therefore, the vertical stacking design reduces the package volume by more than 50% compared to traditional planar packaging, meeting the requirements of high-density integration. The thermal management layer 2 and the heat dissipation cavity 7 work together, with the former solving the problem of rapid heat absorption near the heat source and the latter solving the problem of efficient heat dissipation from the heat source. This provides a structural basis for subsequent optimization of heat dissipation efficiency. The package shell 1 uniformly fixes all internal components, preventing component displacement caused by vibration or temperature changes and improving the long-term reliability of the module.

[0035] Furthermore, signal transmission is achieved between functional chip 4 and functional chip 9 through an electrical connection structure. The electrical path between functional chip 4 and functional chip 9 is directly established through electrical connection structures such as through silicon vias (TSVs) and micro bumps. The signal does not need to be transmitted through an external long wire, but is directly transmitted between the two chips in the vertical direction, reducing the delay and loss of the signal during transmission.

[0036] Furthermore, the heat-conducting plate 11 is fixedly disposed inside the packaging shell 1, and micro liquid cooling channels 12 are symmetrically arranged on both sides of the heat-conducting plate 11. The micro liquid cooling channels 12 have an outlet 14 and an inlet 15. The inlet 15 is used to receive coolant, and the outlet 14 is used to discharge the coolant after absorbing heat. The heat-conducting plate 11 is fixed inside the packaging shell 1, and its high thermal conductivity material, such as copper or aluminum, can quickly transfer the heat from the two chips to the thermal management layer into itself. The micro liquid cooling channels 12 symmetrically arranged on both sides of the heat-conducting plate 11 receive external coolant through the inlet 15. When the coolant flows in the channel, it fully contacts the channel wall and absorbs the heat transferred by the heat-conducting plate, and then discharges through the outlet 14, forming an active heat dissipation path of "heat → heat-conducting plate → liquid cooling channel → coolant". The symmetrical design ensures that the heat on both sides of the heat-conducting plate is evenly carried away by the coolant, avoiding insufficient heat dissipation of the chip on one side.

[0037] Compared to passive heat dissipation, such as relying solely on heat sinks, liquid cooling channels improve heat dissipation efficiency by 2-3 times, keeping chip temperatures below 60℃ under full load conditions. The symmetrical liquid cooling channel layout ensures that the temperature difference between functional chip 4 and functional chip 9 is ≤5℃, avoiding chip performance degradation due to unilateral overheating. The liquid cooling channel cross-sectional size of 50-200 micrometers matches the narrow space of three-dimensional stacking, without increasing the thickness of the thermal management layer, maintaining the high-density packaging advantage.

[0038] Furthermore, the phase change material filling layer 13 fills the gap between the micro liquid cooling channels 12, and the surfaces of the phase change material filling layer 13 on both sides of the heat-conducting plate 11 are respectively attached to the adjacent functional chip 4 and functional chip 9. The phase change material filling layer 13 fills the gap between the micro liquid cooling channels 12, which on the one hand eliminates the "thermal resistance dead zone" caused by the channel gap, and the heat can be transferred to the liquid cooling channel through the phase change material. On the other hand, when the chip generates a short-term peak heat, the phase change material absorbs heat and undergoes a phase change from solid to liquid, using the latent heat of phase change to store a large amount of heat, avoiding the coolant from rising sharply due to excessive instantaneous heat load. At the same time, the surface of the phase change material filling layer 13 is directly attached to the functional chip 4 and functional chip 9, shortening the heat transfer path from the chip to the thermal management layer.

[0039] The phase change material in this device can buffer 50-100W of instantaneous peak heat, preventing the chip from triggering frequency reduction protection due to short-term overheating. By passively storing heat, the circulation frequency of the coolant is reduced, which indirectly reduces the power consumption of the micro liquid pump 6 by 20%-30%. After filling the gaps in the liquid cooling channels, the thermal conductivity of the thermal management layer is improved by more than 15%, avoiding excessively high temperatures in local hot spots such as the gaps in the channels.

[0040] Furthermore, the encapsulation shell 1 is provided with two sets of interfaces 10, which are connected by a hose. The two sets of interfaces 10 on the encapsulation shell 1 serve as "input / output ports" for the coolant. One set of interfaces is connected to an external coolant source to provide low-temperature coolant for the micro liquid cooling channel 12, and the other set of interfaces is connected to an external recovery device to export the cooled coolant after heat dissipation, thereby realizing external circulation of the coolant.

[0041] Furthermore, thermally conductive silicone 3 is provided between the phase change material filling layer 13 and the functional chip 4 and the functional chip 9. The thermally conductive silicone 3 between the phase change material filling layer 13 and the two chips can fill the microscopic uneven gaps between the chip and the phase change material surface, avoid the air layer having extremely high thermal resistance that hinders heat transfer, and allow heat to be directly transferred from the chip surface to the phase change material.

[0042] Furthermore, the outlet 14 of the micro liquid cooling channel 12 is connected to the micro liquid pump 6 via the coolant pipe 5, and the inlet 15 of the micro liquid cooling channel 12 is connected to one of the sets of interfaces 10. The outlet 14 of the micro liquid cooling channel 12 is connected to the micro liquid pump 6 via the coolant pipe 5. The high-temperature coolant after absorbing heat is discharged from the outlet and transported to the micro liquid pump 6 via the coolant pipe 5. The micro liquid pump 6 pressurizes the high-temperature coolant through mechanical driving force such as piezoelectric drive or electromagnetic drive, and pushes it to flow into the heat dissipation fins 8 in the heat dissipation cavity 7. At the same time, the inlet 15 of the micro liquid cooling channel 12 is connected to one set of interfaces 10. The external low-temperature coolant enters the liquid cooling channel through this interface to replenish the discharged high-temperature coolant, forming the first half of the cycle of "low-temperature coolant → inlet → liquid cooling channel → outlet → coolant pipe → micro liquid pump".

[0043] Furthermore, the end of the micro liquid pump 6 away from the coolant pipe 5 is connected to the heat sink fin 8, and the end of the heat sink fin 8 away from the micro liquid pump 6 is connected to another set of interfaces 10. The micro liquid pump 6 pumps the high-temperature coolant into the heat sink fin 8. The heat sink fin 8 increases the contact area with the air or the enclosure, and quickly transfers the heat of the high-temperature coolant to the external environment, reducing the coolant temperature by 15-20°C. The cooled coolant flows out from the heat sink fin 8 and is discharged to the external recovery device through the other set of interfaces 10, completing the second half of the cycle of "micro liquid pump → heat sink fin → other set of interfaces → external recovery". Finally, a complete closed-loop cycle of "external low-temperature coolant input → liquid cooling channel heat absorption → micro liquid pump drive → heat sink fin cooling → external recovery" is formed.

[0044] The heat dissipation area of ​​the heat dissipation fins 8 is 5-10 times that of the liquid cooling channel, which can effectively reduce the temperature of the coolant and prevent the high-temperature coolant from flowing back into the liquid cooling channel, thus reducing the heat dissipation efficiency. The complete closed-loop path enables the coolant utilization rate to reach 80%, with no waste, and is suitable for long-term continuous working scenarios such as servers running 24 / 7.

[0045] Furthermore, the heat-conducting plate 11 is made of copper or aluminum, and the cross-section of the micro liquid cooling channel 12 inside the heat-conducting plate 11 is rectangular or circular. The cross-sectional size of the micro liquid cooling channel 12 is 50 micrometers-200 micrometers. The heat-conducting plate 11 uses copper or aluminum with thermal conductivity of 401W / (m·K) and 237W / (m·K) respectively, which can quickly transfer the heat of the chip to the liquid cooling channel and avoid heat accumulation in the heat-conducting plate. The cross-section of the micro liquid cooling channel 12 is rectangular or circular to adapt to different processing technologies. The cross-sectional size is 50-200 micrometers. This size can ensure sufficient coolant flow to meet heat dissipation requirements and can also adapt to the narrow space of three-dimensional stacking without exceeding 1 / 3 of the thickness of the thermal management layer, avoiding the channel being too thick and causing other components to have no installation space.

[0046] Furthermore, the miniature liquid cooling channels 12 are distributed in a serpentine or grid pattern. The serpentine distribution extends the path length of the liquid cooling channels within the limited area of ​​the heat-conducting plate. For example, a 10mm×10mm heat-conducting plate can achieve a channel length of 50mm, increasing the contact time between the coolant and the channel wall and improving heat exchange efficiency. The grid pattern ensures that the liquid cooling channels uniformly cover the surface of the heat-conducting plate, avoiding heat accumulation caused by the lack of channel coverage in some areas. Both distribution forms ensure that the heat at any position on the heat-conducting plate can be quickly carried away by the coolant.

[0047] Furthermore, the phase change material filling layer 13 is made of paraffin-based composite phase change material or polymer phase change material. The phase change temperature of the paraffin-based composite phase change material or polymer phase change material is usually 40-60℃, which matches the normal operating temperature range of the chip 30-85℃. When the chip temperature rises to the phase change temperature, the material absorbs heat and changes from solid to liquid, with a latent heat of 200-300J / g, storing a large amount of heat. When the chip temperature drops below the phase change temperature, the material releases heat and changes from liquid to solid, restoring its heat storage capacity, forming a cycle of "heat absorption-heat storage-heat release", continuously buffering the temperature fluctuations of the chip.

[0048] The working principle and beneficial effects of the above scheme are as follows: This low-power integrated circuit packaging module based on a three-dimensional stacked structure achieves complete functionality through "vertical stacking architecture + active-passive collaborative heat dissipation + closed-loop coolant circulation". Functional chip 1 4 and functional chip 2 9 first transmit signals vertically through an electrical connection structure such as TSV, thereby shortening the signal path and reducing transmission loss. The heat generated by the chip operation is transferred to the phase change material filling layer 13 through the thermally conductive silicone 3. The phase change material stores peak heat with the help of latent heat of phase change, while transferring basic heat to the heat-conducting plate 11. Subsequently, the heat-conducting plate 11 introduces the heat into the micro liquid cooling channels 12 on both sides. The external low-temperature coolant enters the channel through the interface 10 and the inlet 15, absorbs heat, and is discharged from the outlet 14 and enters the micro liquid pump 6 through the coolant pipe 5. Finally, the micro liquid pump 6 pumps the high-temperature coolant into the heat dissipation fins 8. The fins dissipate heat by increasing the heat dissipation area. The cooled coolant then flows back to the external system through another set of interfaces 10 to form a closed-loop circulation, ultimately achieving efficient heat dissipation from the chip. This module also has many significant beneficial effects, on the one hand, through " The triple synergy of phase change material heat storage, liquid cooling active heat dissipation, and finned deep heat dissipation improves heat dissipation efficiency by more than 40% compared to traditional single heat dissipation solutions. Simultaneously, the low-power design of the micro-liquid pump (≤5W) and reduced signal transmission power consumption lower the overall module power consumption by 25%-30%, achieving a balance between heat dissipation efficiency and power consumption. Furthermore, the vertical stacking architecture reduces the package volume by more than 50%, meeting the requirements of high-density integration. The unified fixing and sealing circulation path design of the package shell enables the module to withstand vibrations of 10-500Hz and has a leakage rate of ≤0.01mL / year, significantly improving long-term reliability and achieving a balance between high density and reliability. Moreover, the module can be adapted to different scenarios such as high-power servers, low-power consumer electronics, and high-low temperature automotive electronics by adjusting the liquid cooling channel size, phase change material type, and interface specifications, without requiring core architecture reconstruction, thus offering broad scenario adaptability. In addition, the use of mature materials such as copper / aluminum heat-conducting plates and paraffin-based phase change materials, combined with mass production processes such as etching / injection molding, reduces the module cost by more than 30% compared to customized 3D packaging, achieving a balance between high performance and economy.

[0049] Those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A low-power integrated circuit packaging module based on a three-dimensional stacked structure, characterized in that: It includes a package shell (1), and inside the package shell (1) are stacked along the vertical direction a first functional chip (4), a thermal management layer (2), a second functional chip (9) and a heat dissipation cavity (7). The thermal management layer (2) is disposed between the first functional chip (4) and the second functional chip (9), and the heat dissipation cavity (7) is disposed between the second functional chip (9) and the inner wall of the package shell (1). The thermal management layer (2) includes a heat-conducting plate (11) and a phase change material filling layer (13); A miniature liquid pump (6) and heat dissipation fins (8) are installed inside the heat dissipation cavity (7).

2. The low-power integrated circuit packaging module based on a three-dimensional stacked structure as described in claim 1, characterized in that: Signal transmission is achieved between functional chip 1 (4) and functional chip 2 (9) through an electrical connection structure.

3. The low-power integrated circuit packaging module based on a three-dimensional stacked structure as described in claim 1, characterized in that: The heat-conducting plate (11) is fixed inside the encapsulation shell (1), and miniature liquid cooling channels (12) are symmetrically provided on both sides of the heat-conducting plate (11). The miniature liquid cooling channel (12) has an outlet (14) and an inlet (15). The inlet (15) is used to connect to the coolant, and the outlet (14) is used to discharge the coolant after absorbing heat.

4. The low-power integrated circuit packaging module based on a three-dimensional stacked structure as described in claim 3, characterized in that: The phase change material filling layer (13) fills the gap between the micro liquid cooling channels (12), and the surface of the phase change material filling layer (13) on both sides of the heat-conducting plate (11) is attached to the adjacent functional chip one (4) and functional chip two (9), respectively.

5. The low-power integrated circuit packaging module based on a three-dimensional stacked structure as described in claim 4, characterized in that: The encapsulation shell (1) is provided with two sets of interfaces (10), and the two sets of interfaces (10) are connected by a flexible tube; Thermally conductive silicone (3) is provided between the phase change material filling layer (13) and functional chip one (4) and functional chip two (9).

6. The low-power integrated circuit packaging module based on a three-dimensional stacked structure as described in claim 5, characterized in that: The outlet (14) of the micro liquid cooling channel (12) is connected to the micro liquid pump (6) through the coolant pipe (5), and the inlet (15) of the micro liquid cooling channel (12) is connected to one of the interfaces (10).

7. The low-power integrated circuit packaging module based on a three-dimensional stacked structure as described in claim 6, characterized in that: The end of the micro liquid pump (6) away from the coolant pipe (5) is connected to the heat dissipation fins (8), and the end of the heat dissipation fins (8) away from the micro liquid pump (6) is connected to another set of interfaces (10).

8. The low-power integrated circuit packaging module based on a three-dimensional stacked structure as described in claim 3, characterized in that: The heat-conducting plate (11) is made of copper or aluminum. The cross-section of the micro liquid cooling channel (12) inside the heat-conducting plate (11) is rectangular or circular. The cross-sectional size of the micro liquid cooling channel (12) is 50 micrometers to 200 micrometers.

9. The low-power integrated circuit package module based on three-dimensional stacking structure according to claim 8, characterized in that: The micro liquid cooling channel (12) is in a serpentine or grid distribution.

10. The low-power integrated circuit package module based on three-dimensional stacking structure according to claim 4, characterized in that: The phase change material filling layer (13) is made of paraffin-based composite phase change material or polymer phase change material.

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