Conductive film

Abstract

To provide a conductive film having excellent adhesion and optical characteristics.SOLUTION: A conductive film comprises a substrate film and a conductive layer arranged on the substrate film, wherein the substrate film comprises a resin comprising a substituent unit having a fluorene skeleton, the conductive layer comprises a conductive metal and, when the temperature of the substrate film is raised from 30°C at a rate of 10°C / min in the thermomechanical analysis under a tensile load of 30 mN in an arbitrary direction, the temperature T at which the thermal expansion displacement from the length of the substrate film at 30°C becomes 3% is 139°C or higher.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a conductive film and various products using the conductive film. [Background technology]

[0002] Conductive films, especially transparent conductive films, are widely used in capacitive touch sensors, resistive touch sensors, electromagnetic wave shields, transparent antennas, image display devices, printed wiring boards, transparent heaters, and solar cells. Transparent conductive films have traditionally been made by forming a conductive layer made of a highly transparent metal oxide, such as indium tin oxide (ITO), on a transparent film substrate. Recently, conductive films have also been used in which metals such as copper or silver are formed on a substrate film by plating, vapor deposition, sputtering, coating, printing, or other methods to reduce electrical resistivity.

[0003] For example, Patent Document 1 exemplifies a transparent conductor in which a conductive layer containing silver nanowires is formed on a polyethylene terephthalate (PET) substrate. However, PET films require stretching to develop strength and heat resistance, resulting in a very large retardation. When a transparent conductive film obtained using such a PET substrate is incorporated into an image display device such as a liquid crystal display or organic electroluminescence (EL) display as a touch sensor component, rainbow-like mottling (hereinafter referred to as "rainbow mottling") occurs, deteriorating the appearance.

[0004] Furthermore, to solve the problem of iridescent spots, Patent Document 2 exemplifies a transparent conductive film in which an acrylic polymer or cycloolefin polymer (COP) with a small retardation is used as a substrate film and a transparent conductive layer made of silver nanowires is formed on the substrate film. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2009-505358 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-112510 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the substrate film described in Patent Document 2 is generally brittle and cannot be used in applications requiring flexibility, such as flexible displays, and its poor handling makes it susceptible to scratches and cracks during the manufacturing process. Furthermore, COP has poor adhesion to metals, making it difficult to directly form a conductive layer on the COP by methods such as sputtering. Meanwhile, acrylic polymers have a low Tg, making them unusable for applications such as printed wiring boards that are exposed to high temperatures during the manufacturing process, and they also have the problem of being prone to degradation in the environment during use.

[0007] The present invention has been made in consideration of the above problems, and aims to provide a conductive film having excellent adhesion and optical properties, and a touch sensor, a transparent antenna, an image display device, a transparent heater, a solar cell, and the like, which use the conductive film. [Means for solving the problem]

[0008] The present inventors have conducted extensive research to achieve the above object, and as a result have found that the above object can be achieved by a substrate film made of a resin containing a fluorene compound as a structural unit skeleton and having predetermined thermal expansion properties, thereby completing the present invention.

[0009] That is, the present invention is as follows. [1] A conductive film having a base film and a conductive layer provided on the base film, the base film contains a resin including a structural unit having a fluorene skeleton, the conductive layer includes a conductive metal; In a thermomechanical analysis, when a tensile load (30 mN) is applied to the base film in an arbitrary direction and the temperature is increased from 30°C at a rate of 10°C / min, the temperature T at which the thermal expansion displacement from the length of the base film at 30°C becomes 3% is 139°C or higher. Conductive film. [2] the resin is a polyester containing, as a constituent unit, a diol having a fluorene skeleton and / or a dicarboxylic acid having a fluorene skeleton; The conductive film according to [1]. [3] the resin is a polyester containing a diol having a fluorene skeleton as a constituent unit, the content of the structural unit derived from the diol having a fluorene skeleton is 20 to 90 mol % relative to the total amount of the diol components contained in the resin; The conductive film according to any one of [1] and [2]. [4] The glass transition temperature (Tg) of the resin is 115 to 160°C. The conductive film according to any one of [1] to [3]. [5] the resin does not contain any structural unit having a polycyclic aromatic group other than the structural unit having a fluorene skeleton; The conductive film according to any one of [1] to [4]. [6] The in-plane retardation Ro(550) of the substrate film is 0 to 200 nm. The conductive film according to any one of [1] to [5]. [7] The thickness retardation Rth(550) of the substrate film is −500 to 500 nm. The conductive film according to any one of [1] to [6]. [8] the conductive metal comprises copper; The conductive film according to any one of [1] to [7]. [9] The conductive layer is provided on both sides of the base film. The conductive film according to any one of [1] to [8].

[10] The conductive layer has a thickness of 100 to 1000 nm. The conductive film according to any one of [1] to [9].

[11] Surface resistance is 0.01 to 50 Ω / □. The conductive film according to any one of [1] to

[10] .

[12] Total light transmittance is 70% or more. The conductive film according to any one of [1] to

[11] .

[13] The conductive layer is composed of electrically continuous wiring having a width of 2 to 30 μm. The conductive film according to any one of [1] to

[12] .

[14] The conductive layer has an electrically continuous wiring pattern with an aperture ratio of 90 to 99%. The conductive film according to any one of [1] to

[13] .

[15] [1] to

[14] , the method for producing the conductive film according to any one of the above [1] to

[14] , a conductive layer forming step of forming a conductive layer on the substrate film by sputtering or electroless plating; A method for manufacturing a conductive film.

[16] a stretching step of stretching the base film before the conductive layer forming step;

[15] A method for producing a conductive film according to

[15] .

[17] [1] to

[14] , comprising the conductive film according to any one of [1] to

[14] . Capacitive or resistive type Touch sensor.

[18] [1] to

[14] , comprising the conductive film according to any one of [1] to

[14] . Transparent antenna.

[19]

[17] The touch sensor according to

[17] or the transparent antenna according to

[18] Image display device.

[20] [1] to

[14] , comprising the conductive film according to any one of [1] to

[14] . Transparent heater. 〔twenty one〕 [1] to

[14] , comprising the conductive film according to any one of [1] to

[14] . Solar cell. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a conductive film having excellent adhesion and optical properties, and in particular a transparent conductive film having good optical properties. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view illustrating one aspect of a conductive film according to an embodiment of the present invention. [Figure 2] FIG. 1 is a perspective view illustrating one aspect of a conductive film according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, an embodiment of the present invention (hereinafter referred to as "the present embodiment") will be described in detail with reference to the drawings as necessary, but the present invention is not limited to this, and various modifications are possible without departing from the spirit of the present invention. In the drawings, the same elements are given the same reference numerals, and redundant explanations will be omitted. Furthermore, positional relationships such as up, down, left, and right will be based on the positional relationships shown in the drawings unless otherwise specified. Furthermore, the dimensional ratios of the drawings are not limited to those shown in the drawings.

[0013] 1.Conductive film The conductive film of this embodiment is a conductive film having a base film and a conductive layer provided on the base film, wherein the base film contains a resin including a structural unit having a fluorene skeleton, and the conductive layer contains a conductive metal, and in thermomechanical analysis, when a tensile load (30 mN) is applied to the base film in any direction and the temperature is increased from 30°C at a rate of 10°C / min, the temperature T at which the thermal expansion displacement from the length of the base film at 30°C is 3% is 139°C or higher.

[0014] Fig. 1 shows a cross-sectional view illustrating one embodiment of the conductive film of this embodiment, and Fig. 2 shows a perspective view illustrating one embodiment of the conductive film of this embodiment. As shown in Figs. 1 and 2, the conductive film 10 of this embodiment has a base film 11 and a conductive layer 12 provided on the base film 11. The conductive layer 12 may be a uniform, solid metal thin film layer formed on the base film 11 by a sputtering method or the like, or may be a metal layer having a pattern such as predetermined openings formed by etching the metal thin film layer, as shown in Fig. 2.

[0015] As described above, when forming the conductive layer by a sputtering method or the like, heat is applied to the base film. In this regard, in this embodiment, a base film having predetermined thermal expansion characteristics and excellent dimensional stability due to heat is used. This suppresses changes in the dimensions of the base film during the formation of the conductive layer and at room temperature after the formation of the conductive layer, thereby suppressing deterioration in adhesion due to dimensional changes of the base film.

[0016] Furthermore, in the conductive film of this embodiment, the substrate film contains a resin containing a structural unit having a fluorene skeleton, which suppresses the occurrence of rainbow spots and further improves the optical properties.

[0017] The surface resistance of the conductive film is preferably 0.01 to 50 Ω / □, 0.01 to 25 Ω / □, or 0.01 to 10 Ω / □. When the surface resistance is within the above range, the conductive film tends to have excellent conductivity. The surface resistance of the conductive film may be adjusted by the type of metal constituting the conductive layer, the thickness of the conductive layer, the pattern shape of the conductive layer, etc.

[0018] The total light transmittance of the conductive film is preferably 70% or more, 75 to 100%, or 80 to 95%. When the total light transmittance is within the above range, the transparency of the conductive film tends to be further improved. The total light transmittance of the conductive film may be adjusted by the pattern shape of the conductive layer, the thin line width, etc.

[0019] 1.1.Base film The substrate film contains a resin containing a structural unit having a fluorene skeleton, and may contain other components as necessary. The substrate film may be an unstretched film or a stretched film.

[0020] Physical Properties In this embodiment, when a tensile load (30 mN) is applied to a base film in any direction and the temperature is increased from 30°C at a rate of 10°C / min in thermomechanical analysis, the temperature T at which the thermal expansion displacement from the length of the base film at 30°C is 3% is specified to be 139°C or higher. Here, in this embodiment, even if the temperature T is 130°C in one direction, if the temperature T is 140°C in another direction, this is considered to satisfy the configuration that the temperature T is 139°C or higher in any direction.

[0021] The temperature T at which the thermal expansion displacement is 3% is 139° C. or higher, preferably 142 to 170° C., 145 to 165° C., or 150 to 160° C. When the temperature T is 139° C. or higher, the adhesion tends to be further improved.

[0022] The temperature T can be adjusted by the type of resin constituting the base film and the structural units constituting the resin, as well as by the conditions for stretching the base film.

[0023] The in-plane retardation Ro(550) of the substrate film is preferably 0 to 200 nm, 0 to 160 nm, or 0 to 50 nm. When the in-plane retardation Ro(550) is within the above range, the optical properties tend to be further improved.

[0024] The thickness retardation Rth(550) of the substrate film is preferably −500 to 500 nm, −150 to 150 nm, or −30 to 30 nm. When the thickness retardation Rth(550) is within the above range, the optical properties tend to be further improved.

[0025] The glass transition temperature of the resin is preferably 115 to 160°C, 121 to 151°C, or 125 to 145°C. When the glass transition temperature is 115°C or higher, the thermal expansion characteristics of the resin tend to be further improved. Furthermore, when the glass transition temperature is 190°C or lower, the processability of the resin tends to be further improved. The glass transition temperature can be measured by the method described in the examples below.

[0026] The thickness of the substrate film is preferably 20 to 300 μm, 25 to 200 μm, or 50 to 100 μm. When the thickness of the substrate film is within the above range, the optical properties tend to be further improved.

[0027] Resin The base film contains a resin containing a structural unit having a fluorene skeleton, and may contain other resins as needed. The resin is not particularly limited as long as it contains a structural unit having a fluorene skeleton, and examples thereof include polyester, polyester polycarbonate, polycarbonate, polyacrylate, and epoxy resin.

[0028] Among these, polyesters containing a diol having a fluorene skeleton and / or a dicarboxylic acid having a fluorene skeleton as a structural unit are preferred, and polyesters containing a diol having a fluorene skeleton as a structural unit are more preferred. By using such resins, optical properties and adhesion tend to be further improved.

[0029] It is preferable that the resin does not contain a structural unit having a polycyclic aromatic group other than a structural unit having a fluorene skeleton. This tends to further improve optical properties. Here, the polycyclic aromatic group refers to a group in which two or more rings including an aromatic ring are condensed.

[0030] The polyester is not particularly limited, but examples thereof include polyesters containing a dicarboxylic acid having a fluorene skeleton and an arbitrary diol as constituent units, polyesters containing an arbitrary dicarboxylic acid and a diol having a fluorene skeleton as constituent units, and polyesters containing a dicarboxylic acid having a fluorene skeleton and a diol having a fluorene skeleton as constituent units.

[0031] 1.1.2.1. Dicarboxylic acids The dicarboxylic acid is not particularly limited, but examples thereof include dicarboxylic acids having a fluorene skeleton and dicarboxylic acids not having a fluorene skeleton. The dicarboxylic acids may be used alone or in combination of two or more.

[0032] The dicarboxylic acid having a fluorene skeleton is not particularly limited, but examples thereof include a compound represented by the following general formula (1) or an ester thereof. [ka] (In the formula, R 1a and R 1b each independently represents an aryl group; each k independently represents an integer of 0 to 4; X 1 each independently represents an alkylene group having 1 to 8 carbon atoms.

[0033] In the above general formula (1), the group R 1a , R 1b The substitution positions of the aryl group represented by the following formula (I) on the fluorene ring are not particularly limited, but the 2-position and / or the 7-position are preferred. The aryl group is not particularly limited, but examples thereof include a phenyl group, a 1-naphthyl group, and a 2-naphthyl group.

[0034] base R 1a and R 1b The number of substitutions k is an integer of 0 to 4, and may be, for example, 0, 1, or 1 to 3.

[0035] X 1 The alkylene group having 1 to 8 carbon atoms represented by the formula (I) is not particularly limited, and examples thereof include a methylene group, an ethylene group, a trimethylene group, a propylene group, a 2-ethylethylene group, a 2-methylpropane-1,3-diyl group, etc. Among these, an alkylene group having 1 to 4 carbon atoms such as a methylene group, an ethylene group, a trimethylene group, a propylene group, or a 2-methylpropane-1,3-diyl group is preferred.

[0036] Representative compounds represented by general formula (1) are not particularly limited, but include, for example, 9,9-bis(2-carboxyethyl)fluorene (FDP-m), 9,9-bis(2-carboxypropyl)fluorene, 9,9-bis(carboxy C 4-6 alkyl)fluorene, 9,9-bis(2-carboxyethyl)2,7-diphenylfluorene, 9,9-bis(2-carboxypropyl)2,7-diphenylfluorene, 9,9-bis(carboxy C 4-6 alkyl)2,7-diphenylfluorene, 9,9-bis(2-carboxyethyl)2,7-di(2-naphthyl)fluorene (DNFDP-m), 9,9-bis(2-carboxypropyl)2,7-di(2-naphthyl)fluorene, 9,9-bis(carboxyC 4-6 alkyl)2,7-di(2-naphthyl)fluorene, 9,9-bis(2-carboxyethyl)2,7-di(1-naphthyl)fluorene, 9,9-bis(2-carboxypropyl)2,7-di(1-naphthyl)fluorene, 9,9-bis(carboxy C4-6 and 2,7-di(1-naphthyl)fluorene.

[0037] The content of the structural units derived from dicarboxylic acid having a fluorene skeleton may be 50 to 100 mol %, 60 to 100 mol %, or 65 to 95 mol % relative to all the structural units of dicarboxylic acid. When the content of dicarboxylic acid having a fluorene skeleton is within the above range, the optical properties tend to be further improved.

[0038] Furthermore, the content of the structural units derived from dicarboxylic acid having a fluorene skeleton may be 0 to 45 mol%, 0 to 35 mol%, or 0 to 25 mol% relative to all structural units of dicarboxylic acid. When the content of dicarboxylic acid having a fluorene skeleton is within the above range, adhesion tends to be further improved.

[0039] The dicarboxylic acid having no fluorene skeleton is not particularly limited as long as it does not have a fluorene skeleton, and examples thereof include aliphatic dicarboxylic acids, alicyclic dicarboxylic acids, and aromatic dicarboxylic acids.

[0040] The aliphatic dicarboxylic acid is not particularly limited, but examples thereof include saturated aliphatic dicarboxylic acids such as succinic acid, adipic acid, sebacic acid, and decanedicarboxylic acid; and unsaturated aliphatic dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid.

[0041] The alicyclic dicarboxylic acid component is not particularly limited, but examples thereof include cycloalkane dicarboxylic acids such as 1,3-cyclohexane dicarboxylic acid, 1,4-cyclohexane dicarboxylic acid, decalin dicarboxylic acid, norbornane dicarboxylic acid, adamantane dicarboxylic acid, and tricyclodecane dicarboxylic acid; and cycloalkene dicarboxylic acids such as cyclohexene dicarboxylic acid and norbornene dicarboxylic acid.

[0042] The aromatic dicarboxylic acid component is not particularly limited, and examples thereof include monocyclic aromatic dicarboxylic acids such as phthalic acid, terephthalic acid, isophthalic acid, and 4-methylisophthalic acid; condensed polycyclic aromatic dicarboxylic acids such as 1,5-naphthalenedicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 1,7-naphthalenedicarboxylic acid, 1,8-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, anthracenedicarboxylic acid, and phenanthrenedicarboxylic acid; and non-condensed polycyclic aromatic dicarboxylic acids such as arylarene dicarboxylic acids such as 2,2'-biphenyldicarboxylic acid and 4,4'-biphenyldicarboxylic acid, diarylalkane dicarboxylic acids such as 4,4'-diphenylmethanedicarboxylic acid, and diaryl ketone dicarboxylic acids such as 4,4'-diphenylketone dicarboxylic acid.

[0043] The content of the structural units derived from dicarboxylic acid having no fluorene skeleton is 0 to 50 mol%, 0 to 40 mol%, or 5 to 35 mol% relative to the total structural units of dicarboxylic acid. When the content of dicarboxylic acid having no fluorene skeleton is within the above range, the optical properties tend to be further improved.

[0044] Furthermore, the content of the structural units derived from dicarboxylic acid having no fluorene skeleton may be 55 to 100 mol %, 65 to 100 mol %, or 75 to 100 mol % relative to all the structural units of dicarboxylic acid. When the content of dicarboxylic acid having no fluorene skeleton is within the above range, adhesion tends to be further improved.

[0045] 1.1.2.2. Diol The diol is not particularly limited, but examples thereof include diols having a fluorene skeleton and diols not having a fluorene skeleton. The diols may be used alone or in combination of two or more.

[0046] The diol having a fluorene skeleton is not particularly limited, but examples thereof include compounds represented by the following general formula (2) or (3). [ka] (wherein each Z independently represents a phenylene group or a naphthylene group; R 2a and R 2b each independently represents a substituent that is inert to the reaction; each p independently represents an integer of 0 to 4; R 3 each independently represents an alkyl group, an alkoxy group, a cycloalkyloxy group, an aryloxy group, an aralkyloxy group, an aryl group, a cycloalkyl group, an aralkyl group, a halogen atom, a nitro group, or a cyano group; each q independently represents an integer of 0 to 2; R 4 each independently represents an alkylene group having 2 to 6 carbon atoms, and each r independently represents an integer of 1 or greater.

[0047] In the general formula (2), the group R 2a and R 2b Examples of the R group include, but are not limited to, alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, and t-butyl; aryl groups such as phenyl and naphthyl; cyano; and halogen atoms. 2a and R 2b The substitution position may be, for example, the 2-position, the 7-position, or the 2- and 7-positions of the fluorene. In this embodiment, "inert to the reaction" means inert to the polymerization reaction of the polyester.

[0048] The number of substitutions p is an integer of 0 to 4, and may be 0 to 2, preferably 0 or 1, and particularly 0.

[0049] In the general formula (2), the substituent R 3 is not particularly limited, and examples thereof include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, and t-butyl; cycloalkyl groups such as cyclohexyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl and phenethyl; alkoxy groups such as methoxy and ethoxy; and cycloalkyloxy groups such as cyclohexyloxy. aryloxy groups such as a phenoxy group; aralkyloxy groups such as a benzyloxy group; halogen atoms such as a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom; a nitro group; and a cyano group.

[0050] Among these, the group R 3 Examples of the alkyl group include an alkyl group (an alkyl group having 1 to 6 carbon atoms, preferably an alkyl group having 1 to 4 carbon atoms, and particularly a methyl group), an alkoxy group (an alkoxy group having 1 to 4 carbon atoms, etc.), a cycloalkyl group (C 5-8 cycloalkyl groups, aryl groups (phenyl groups, etc.) 6-12 aryl group) and the like are preferred.

[0051] The number of substitutions q is an integer of 0 to 4, and may be 0 to 3, and preferably 0 to 2, or 0 or 1.

[0052] In the general formula (2), the group R 4 is not particularly limited, and examples thereof include linear or branched alkylene groups having 2 to 6 carbon atoms, such as an ethylene group, a propylene group (1,2-propanediyl group), a trimethylene group, a 1,2-butanediyl group, and a tetramethylene group.

[0053] The number of repetitions r may be 1 or more, for example, 1 to 12, 1 to 8, 1 to 5, 1 to 4, 1 to 3, or 1 or 2.

[0054] The diol represented by general formula (2) is not particularly limited, but for example, representative diol components (A) include 9,9-bis(hydroxy(poly)alkoxyphenyl)fluorenes, 9,9-bis(hydroxy(poly)alkoxynaphthyl)fluorenes, and the like.

[0055] The 9,9-bis(hydroxy(poly)alkoxyphenyl)fluorenes are not particularly limited, but examples thereof include (i) 9,9-bis(hydroxy C) such as 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene (BPEF) and 9,9-bis[4-(2-hydroxypropoxy)phenyl]fluorene.2-4 (ii) 9,9-bis(hydroxy C such as 9,9-bis[4-(2-hydroxyethoxy)-3-methylphenyl]fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-isopropylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-isobutylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-t-butylphenyl)fluorene, 9,9-bis[4-(2-hydroxyethoxy)-3,5-dimethylphenyl]fluorene, and 9,9-bis(4-(2-hydroxyethoxy)-3-t-butyl-5-methylphenyl)fluorene. 2-4 Alkoxy-mono or di C 1-4 (iii) 9,9-bis(hydroxy C, alkylphenyl)fluorene, such as 9,9-bis(4-(2-hydroxyethoxy)-3-cyclohexylphenyl)fluorene; 2-4 Alkoxy C 5-10 (iv) 9,9-bis(hydroxy C such as 9,9-bis[4-(2-hydroxyethoxy)-3-phenylphenyl]fluorene (BOPPEF) and 9,9-bis[4-(2-hydroxypropoxy)-3-phenylphenyl]fluorene 2-4 Alkoxy C 6-10 arylphenyl)fluorene, etc.; compounds in which r is 2 to 5 in the above compounds (ii) to (iv), such as 9,9-bis(hydroxy C 2-4 Alkoxy C 2-4 Alkoxyphenyl)fluorene, 9,9-bis(hydroxy C 2-4 Alkoxy C 2-4 Alkoxy-mono or di-C1-C4 alkylphenyl)fluorene, 9,9-bis(hydroxy C 2-4 Alkoxy C 2-4 Alkoxy C 6-10 arylphenyl)fluorene and the like.

[0056] The 9,9-bis(hydroxy(poly)alkoxynaphthyl)fluorenes are not particularly limited, and examples thereof include 9,9-bis(hydroxyalkoxynaphthyl)fluorenes such as 9,9-bis[6-(2-hydroxyethoxy)-2-naphthyl]fluorene, 9,9-bis[5-(2-hydroxyethoxy)-1-naphthyl]fluorene, and 9,9-bis[6-(2-hydroxypropoxy)-2-naphthyl]fluorene; compounds in which r is 2 to 5, such as 9,9-bis(hydroxyC 2-4 Alkoxy C 2-4 Alkoxynaphthyl)fluorenes and the like.

[0057] The content of the constitutional unit derived from the diol represented by general formula (2) is preferably 15 to 95 mol%, 20 to 90 mol%, 30 to 90 mol%, 45 to 90 mol%, or 60 to 90 mol%, relative to the total amount of diol components contained in the resin. When the content of the constitutional unit derived from the diol represented by general formula (2) is within the above range, the optical properties and adhesion are further improved, and the glass transition temperature tends to be further improved.

[0058] [ka] (In the formula, R 5a and R 5b each independently represents a substituent inert to the reaction; each m independently represents an integer of 0 to 4; X 2 each independently represents an alkylene group having 1 to 8 carbon atoms.

[0059] In the general formula (3), the group R 5a and R 5b , m is R in the general formula (2), including preferred embodiments. 2a and R 2b , p can be mentioned. Also, X 2 is X in the general formula (1), including preferred embodiments. 1 The same can be mentioned.

[0060] The diol represented by the general formula (3) is not particularly limited, but examples thereof include 9,9-bis(hydroxymethyl)fluorene, 9,9-bis(2-hydroxyethyl)fluorene, 9,9-bis(hydroxy C 3-6 Among these, 9,9-bis(hydroxymethyl)fluorene is preferred.

[0061] The content of the structural units derived from the diol represented by general formula (3) is preferably 15 to 95 mol%, 20 to 90 mol%, 30 to 90 mol%, 45 to 90 mol%, or 60 to 90 mol%, relative to the total amount of diol components contained in the resin. When the content of the structural units derived from the diol represented by general formula (3) is within the above range, the optical properties and adhesion are further improved, and the glass transition temperature tends to be further improved.

[0062] The content of the structural units derived from diols having a fluorene skeleton is preferably 15 to 95 mol%, 20 to 90 mol%, 30 to 90 mol%, 45 to 90 mol%, or 60 to 90 mol%, relative to the total amount of diol components contained in the resin. When the content of the structural units derived from diols having a fluorene skeleton is within the above range, the optical properties and adhesion are further improved, and the glass transition temperature tends to be further improved.

[0063] The diol not having a fluorene skeleton is not particularly limited as long as it does not have a fluorene skeleton, and examples thereof include aliphatic diols, alicyclic diols, and aromatic diols.

[0064] The aliphatic diol is not particularly limited, but examples thereof include alkanediols such as ethylene glycol (EG), 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,3-pentanediol, 1,4-pentanediol, 1,5-pentanediol, neopentyl glycol, and 1,6-hexanediol; di- or tri-C diols such as ethylene glycol, dipropylene glycol, and triethylene glycol; 2-4 Examples of suitable alkanediols include polyalkanediols such as alkanediols.

[0065] The alicyclic diol is not particularly limited, but examples thereof include cyclohexanediol, cyclohexanedimethanol, and isosorbide.

[0066] Examples of aromatic diols include dihydroxyarenes such as hydroquinone and resorcinol; biphenols; bisphenols such as bisphenol A; alkylene oxide adducts of bisphenols; and di(hydroxyalkyl)arenes such as 1,3-benzenedimethanol and 1,4-benzenedimethanol.

[0067] Among these, aliphatic diols are preferred, and alkanediols having 2 to 4 carbon atoms are more preferred.

[0068] The content of the structural units derived from diols having no fluorene skeleton is preferably 5 to 85 mol%, 10 to 80 mol%, 10 to 70 mol%, 10 to 55 mol%, or 10 to 40 mol%, relative to the total amount of diols contained in the resin. When the content of the structural units derived from diols having no fluorene skeleton is within the above range, the optical properties and adhesion are further improved, and the glass transition temperature tends to be further improved.

[0069] 1.1.3.Resin manufacturing method The method for producing polyester is not particularly limited, but it can be prepared, for example, by a polymerization reaction between a diol and a dicarboxylic acid. The method for producing polycarbonate resin is not particularly limited, but it can be prepared, for example, by a polymerization reaction between a diol and phosgene or a carbonate. Hereinafter, the method for producing polyester will be described as an example, but the method for producing the resin of this embodiment is not limited to the following.

[0070] The polyester polymerization method is not particularly limited, but examples thereof include melt polymerization methods such as transesterification and direct polymerization, solution polymerization, and interfacial polymerization. These polymerization reactions may use transesterification catalysts, polycondensation catalysts, heat stabilizers, light stabilizers, polymerization modifiers, solvents, etc.

[0071] The transesterification catalyst is not particularly limited, but examples thereof include alkoxides, organic acid salts, inorganic acid salts, and metal oxides containing alkaline earth metals such as magnesium, calcium, and barium; and alkoxides, organic acid salts, inorganic acid salts, and metal oxides containing transition metals such as manganese, zinc, cobalt, and titanium. Among these, manganese acetate and calcium acetate are preferably used.

[0072] The type of polycondensation catalyst is not particularly limited, and examples thereof include compounds containing alkaline earth metals, transition metals, metals of Group 13 of the periodic table, metals of Group 14 of the periodic table, and metals of Group 15 of the periodic table. More specific examples include germanium compounds such as germanium dioxide, germanium hydroxide, germanium oxalate, germanium tetraethoxide, and germanium-n-butoxide; antimony compounds such as antimony trioxide, antimony acetate, and antimony ethylene glycolate; and titanium compounds such as tetra-n-propyl titanate, tetraisopropyl titanate, tetra-n-butyl titanate, titanium oxalate, and potassium titanium oxalate. These catalysts may be used alone or in combination of two or more.

[0073] The heat stabilizer is not particularly limited, but examples thereof include phosphorus compounds such as trimethyl phosphate, triethyl phosphate, triphenyl phosphate, phosphorous acid, trimethyl phosphite, and triethyl phosphite.

[0074] The polymerization reaction may be carried out in air or in an inert gas atmosphere. The reaction may be carried out under normal pressure or reduced pressure. The reaction temperature may be, for example, 150 to 300°C, 180 to 290°C, or 200 to 280°C.

[0075] 1.1.4. Other Additives The substrate film may contain various additives as needed, such as plasticizers, flame retardants, stabilizers, antistatic agents, fillers, foaming agents, antifoaming agents, lubricants, release agents, and lubrication agents.

[0076] Examples of the plasticizer include esters, phthalic acid compounds, epoxy compounds, and sulfonamides. Examples of the flame retardant include inorganic flame retardants, organic flame retardants, and colloidal flame retardants.

[0077] Examples of the stabilizer include antioxidants, ultraviolet absorbers, and heat stabilizers, and examples of the filler include oxide-based inorganic fillers, non-oxide-based inorganic fillers, and metal powders.

[0078] Examples of the release agent include natural waxes, synthetic waxes, straight-chain fatty acids or metal salts thereof, and acid amides.

[0079] Examples of the lubricity-imparting agent include inorganic fine particles such as silica, titanium oxide, calcium carbonate, clay, mica, and kaolin; and organic fine particles such as (meth)acrylic resins and styrene resins (crosslinked polystyrene resins, etc.). These additives may be used alone or in combination of two or more.

[0080] The total content of these additives is preferably 30 parts by mass or less, 0.1 to 20 parts by mass, or 1 to 10 parts by mass, relative to 100 parts by mass of the resin.

[0081] 1.2.Conductive Layer The conductive layer is a layer containing a conductive metal, and may be a solid layer, or may have a predetermined pattern formed by etching a solid layer or the like, or a predetermined pattern formed by a printing method. Among these, from the viewpoint of making the conductive film transparent, a pattern containing thin metal wires of a size that is difficult to see is preferred.

[0082] Specifically, the conductive layer may be composed of electrically continuous wiring. The width of the wiring is preferably 2 to 30 μm, 2 to 25 μm, or 2 to 20 μm. When the wiring width is 2 μm or more, the surface resistance tends to decrease and the conductivity tends to be further improved. Furthermore, when the wiring width is 30 μm or less, the visibility of the wiring tends to decrease and the transparency of the conductive film tends to be further improved.

[0083] From the same viewpoint, the conductive layer may have an electrically continuous wiring pattern with a predetermined aperture ratio. The aperture ratio is preferably 90 to 99%, 91 to 98%, or 92 to 97%. An aperture ratio of 90% or more tends to further improve transparency. An aperture ratio of 99% or less tends to further improve conductivity. The aperture ratio refers to the proportion of the area in a unit area where no wiring pattern is formed.

[0084] The conductive layer may be formed on one surface of the base film, or on both surfaces of the base film.

[0085] The conductive metal is not particularly limited, but examples thereof include gold, silver, copper, etc. Among these, it is preferable to include copper as the conductive metal, as this tends to further improve conductivity and adhesion.

[0086] The thickness of the conductive layer is preferably 100 to 1000 nm, 125 to 750 nm, 150 to 500 nm, or 175 to 250 nm. When the thickness of the conductive layer is within the above range, the conductivity and adhesion tend to be further improved.

[0087] 2. Conductive film manufacturing method The method for producing a conductive film of this embodiment includes a conductive layer forming step of forming a conductive layer on a base film, and may, if necessary, include a base film forming step, a stretching step of stretching the base film, or an etching step of etching a part of the conductive layer to form an arbitrary pattern, before the conductive layer forming step.

[0088] 2.1. Film formation process The film-forming step is a step of molding a resin into a substrate film. The molding method is not particularly limited, but examples thereof include extrusion molding. The melting temperature of the resin during extrusion molding is preferably Tg+80 to Tg+100°C or higher, Tg+80 to Tg+180°C, or Tg+80 to Tg+150°C.

[0089] 2.2.Stretching process The stretching step is a step of stretching a substrate film. The stretching method is not particularly limited, and may be uniaxial stretching or biaxial stretching. Examples of biaxial stretching include, but are not particularly limited to, a tenter method (also called a flat method) and a tube method. Furthermore, the biaxial stretching may be sequential biaxial stretching or simultaneous biaxial stretching.

[0090] In the uniaxial or biaxial stretching, the stretching ratio in each direction is preferably 1.1 to 3.5, 1.2 to 3.0, or 1.3 to 2.5. When the stretching ratio is within the above range, the temperature T at which the thermal expansion displacement becomes 3% can be further increased, and adhesion tends to be further improved.

[0091] The stretching temperature is preferably Tg-10°C or higher and Tg+20°C or lower, Tg-5°C or higher and Tg+15°C or lower, or Tg°C or higher and Tg+10°C or lower. Here, Tg represents the glass transition temperature of the resin. By keeping the stretching temperature within the above range, the temperature T at which the thermal expansion displacement becomes 3% can be further increased, which tends to further improve adhesion.

[0092] Furthermore, even if preheating is performed before stretching, by performing heat setting after stretching, the variation in retardation value after stretching can be reduced, and the variation in orientation angle due to bowing can be reduced. Either preheating or heat setting may be performed, but it is more preferable to perform both. These preheating and heat setting are preferably performed by holding with clips, that is, preferably performed continuously with stretching.

[0093] 2.3. Conductive layer formation process The conductive layer forming process is a process of forming a conductive layer on a substrate film. The method for forming the conductive layer is not particularly limited, and examples thereof include electroless plating, electroplating, and coating methods, which are classified as wet processes, and sputtering, vacuum deposition, ion plating, and chemical vapor deposition, which are classified as dry processes. Among these, sputtering and electroless plating are preferred because they can produce a high-purity metal film and can prevent deterioration of the substrate film. The conditions for these methods for forming the conductive layer are not particularly limited as long as they are conventional methods.

[0094] 2.4.Etching process The etching process is a process of etching a portion of a conductive layer to form a desired pattern. Specifically, a resist layer such as a dry film resist is formed on the conductive layer, and then the resist layer is formed into a desired pattern by an exposure and development process. Then, using the resist layer with the formed pattern as a mask, the conductive layer is etched using a developer, and finally, the resist layer is removed to form the pattern.

[0095] 3.Applications The conductive film of this embodiment can be used as a constituent material of a touch sensor, a transparent antenna, an image display device, a transparent heater, a solar cell, an electromagnetic wave shield, or a printed wiring board.

[0096] The touch sensor of this embodiment includes a conductive film and is either a capacitive or resistive touch sensor. Capacitive touch sensors are not particularly limited as long as they detect changes in capacitance due to touching the touch sensor. Specific examples include projected capacitive and surface capacitive touch sensors. In either case, the conductive film may have an extraction electrode. Projected capacitive touch sensors require conductive layers on the front and back surfaces of an insulator. However, by using a conductive film of this embodiment with conductive layers having thin metal line patterns on both surfaces, a touch sensor with two thin metal line patterns on the front and back surfaces of an insulator (substrate film) can be obtained. Resistive touch sensors are also capable of detecting continuity when two electrodes come into contact. The conductive film of this embodiment can be used for one or both of these two electrodes.

[0097] The transparent antenna of this embodiment includes the conductive film. In this case, the conductive layer of the conductive film has a predetermined pattern from the viewpoints of transparency and functioning as an antenna. The conductive layer, which serves as an antenna, generates electricity in response to electromagnetic waves of a predetermined frequency, or releases the electrical energy of a current flowing through the conductive film into space in the form of electromagnetic waves, thereby enabling the transmission and reception of information in a specific frequency band.

[0098] The image display device of this embodiment may include the touch sensor or the transparent antenna. The type of the image display device is not particularly limited, but specific examples include a liquid crystal display, an organic EL display, a quantum dot display, and electronic paper.

[0099] The transparent heater of this embodiment includes the conductive film. In this case, the conductive layer of the conductive film has a predetermined pattern from the viewpoints of transparency and functioning as a heater. The conductive layer, which serves as a heater, generates heat when current is applied, and functions as a heater.

[0100] The solar cell of this embodiment includes the conductive film, which may function as a transparent electrode in place of ITO in the solar cell. [Example]

[0101] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Evaluation methods and raw materials are shown below.

[0102] [Evaluation method] (glass transition temperature (Tg)) Using a differential scanning calorimeter (Seiko Instruments Inc., "DSC 6220"), the sample was placed in an aluminum pan and subjected to differential scanning calorimetry in the range of 30°C to 200°C in accordance with JIS K 7121, and the midpoint glass transition temperature was taken as Tg.

[0103] (Temperature T at which thermal expansion displacement becomes 3%) A thermal analyzer (Seiko Instruments Inc.'s "EXSTAR6000") was used, and a substrate film cut to a width of 4 mm and a length of 30 mm was set. Using tensile mode thermomechanical analysis (TMA), the temperature was raised from 30°C to 180°C at a rate of 10°C / min, and the temperature T at which the thermal expansion displacement from the length of the substrate film at 30°C reached 3% was measured.

[0104] (In-plane retardation Ro(550), thickness retardation Rth(550)) Using a retardation measurement device (Otsuka Electronics Co., Ltd., "RETS-100"), Ro(550) and Rth(550) of the unstretched film and the stretched film were measured at a measurement temperature of 20°C.

[0105] (adhesion) Adhesion was evaluated using the cross-cut method in accordance with JIS-K5600-5-6. Specifically, six 1mm-spaced cuts were made vertically and horizontally on the conductive layer side of the conductive film using a utility knife, creating a total of 25 grids. Approximately 75mm lengths of transparent pressure-sensitive adhesive tape (Nichiban Cellotape No. 405) were then attached to the grid. The edge of the tape was then grasped and peeled off at a 60° angle over a period of 0.5 to 1.0 seconds. The state of peeling of the conductive layer was visually confirmed to determine whether it fell into one of the categories 0 to 5 listed in Table 1 of JIS-K5600-5-6.

[0106] (Surface resistance) The surface resistance of the conductive film was measured by the four-point probe method in accordance with JIS-K7194 using a low resistivity meter (Loresta AX MCP-T370 manufactured by Mitsubishi Chemical Analytech Co., Ltd.).

[0107] (Iridescence observation) A substrate film and two linear polarizers were prepared and stacked in the following order: linear polarizer, substrate film, linear polarizer. The two linear polarizers were arranged so that their absorption axes were perpendicular to each other and so that the slow axis of the substrate film was at a 45° angle with the absorption axis of one of the linear polarizers. The resulting laminate was placed on a backlight, and the presence or absence of rainbow spots was evaluated by visually observing the light transmitted through the laminate.

[0108] (raw materials) (diol) BPEF: 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene, manufactured by Osaka Gas Chemicals Co., Ltd. EG: Ethylene glycol BOPPEF: 9,9-bis[4-(2-hydroxyethoxy)-3-phenylphenyl]fluorene

[0109] (dicarboxylic acid) DMT: dimethyl terephthalate FDP-m: 9,9-bis(2-carboxyethyl)fluorene DNFDP-m: 9,9-bis(2-methoxycarbonylethyl)2,7-di(2-naphthyl)fluorene DMI: Dimethyl isophthalate DMN: 2,6-naphthalenedicarboxylic acid dimethyl ester CHDA-m: 1,4-cyclohexanedicarboxylic acid dimethyl (trans ratio 98 mol%)

[0110] (film) PET: Polyethylene terephthalate film, Toray Industries "Lumirror S10 (film thickness 100 μm)" COP: Cycloolefin polymer film, Zeon Corporation's "Zeonorfilm ZF14 (film thickness 50 μm, glass transition temperature Tg = 140°C)"

[0111] BOPPEF was synthesized in the same manner as in Example 4 of JP 2001-206863 A. FDP-m was synthesized in the same manner as in Example 1 of JP 2005-89422 A, except that t-butyl acrylate was replaced with methyl acrylate [37.9 g (0.44 mol)]. DNFDP-m was synthesized by the method described in Example 1 of WO 2020 / 213470 A.

[0112] (Resin manufacturing) [Manufacturing Example 1] 0.70 mol of BPEF, 2.30 mol of EG, 1.00 mol of DMT, and 2 x 10 mol of manganese acetate tetrahydrate as a transesterification catalyst. -4 8×10 mol of calcium acetate monohydrate -4 The mixture was heated to 230°C and gradually melted with stirring. -4 moles of germanium oxide 20 x 10 -4 EG was removed while gradually increasing the temperature and reducing the pressure until the temperature reached 270°C and the pressure reached 0.13 kPa or less. After the predetermined stirring torque was reached, the contents were removed from the reactor and pellets of polyester A were prepared.

[0113] Analysis of the resulting pellets by 1H-NMR revealed that 70 mol % of the diol components introduced into Polyester A were derived from BPEF, 30 mol % were derived from EG, and 100 mol % of the dicarboxylic acid components introduced into Polyester A were derived from DMT. The glass transition temperature (Tg) was 142°C.

[0114] [Manufacturing Examples 2 to 7] Pellets of polyesters B to G were prepared in the same manner as in Production Example 1, except that the monomer compositions of the diol component and dicarboxylic acid component used were changed as shown in Table 1 below.

[0115] [Table 1]

[0116] [Example 1] (Production of unstretched resin film) The polyester A pellets prepared in Production Example 1 were fed into a twin-screw extruder (manufactured by Technovel Corporation, model number "KZW 15 / 45", screw diameter D = 15 mm, L / D = 32), kneaded at a screw temperature of 280°C and a rotation speed of 200 rpm, and then extruded through a T-die to produce an unstretched resin film A with a thickness of 200 μm.

[0117] (Conductive film manufacturing) The unstretched resin film A was set as a base film on the substrate holder of a magnetron sputtering device ("MS-3C100L" manufactured by Osaka Vacuum Equipment Works, Ltd.), and a Cu target was set on the target holder. -5 After evacuating the chamber to a vacuum of 0.1 Pa or less, argon gas, which was a sputtering gas, was supplied to the vacuum chamber until the pressure inside the vacuum chamber reached 0.1 Pa. The sputtering power was 100 W, and the sputtering time was adjusted so that the Cu film thickness was 200 nm, thereby producing a conductive film of Example 1 in which a Cu thin film was formed on unstretched resin film A.

[0118] [Examples 2 to 4, Comparative Examples 1 to 3] As shown in Table 2 below, the conductive films of Examples 2 to 4 and Comparative Examples 1 to 3 were produced in the same manner as in Example 1, except that the polyester used and the film thickness were changed in the manufacturing process of the unstretched resin film, which is the base film.

[0119] [Comparative Examples 4 and 5] As shown in Table 2 below, conductive films of Comparative Examples 4 and 5 were produced in the same manner as in Example 1, except that the base film used in the conductive film production process was changed.

[0120] [Example 5] (Preparation of stretched film) The unstretched resin film A was subjected to simultaneous biaxial stretching using a tenter stretching device (manufactured by Imoto Machinery Co., Ltd., model number "IMC-1A97") under conditions of a stretching temperature of the resin Tg+5°C and a stretching ratio of 1.4 × 1.4, thereby producing a stretched film with a thickness of 100 μm. The obtained stretched film was used as a base film and subjected to the conductive film production process in the same manner as in Example 1, thereby producing the conductive film of Example 5.

[0121] [Examples 6 and 7] As shown in Table 2 below, the conductive films of Examples 6 and 7 were produced in the same manner as in Example 5, except that the resin of the base film used or the stretching conditions were changed in the stretched film production process.

[0122] [Example 8] As shown in Table 2 below, the conductive film of Example 8 was produced in the same manner as in Example 1, except that the thickness of the Cu film was set to 1000 nm in the conductive film production process.

[0123] The evaluation results for each conductive film are shown in Table 2 below.

[0124] [Table 2] *: Temperature at which the thermal expansion displacement becomes 3%

[0125] As shown in Table 2, the conductive films of Examples 1 to 8 have excellent adhesion between the substrate film and the conductive layer, and the substrate film has good retardation properties, and therefore can be suitably used, particularly in applications where the conductive layer is subsequently etched to form a transparent conductive film.

[0126] On the other hand, the conductive films of Comparative Examples 1 to 4 are not suitable as conductive films because the temperature T at which the thermal expansion displacement of the substrate film reaches 3% is low or the resin contained in the substrate film does not contain a structural unit having a fluorene skeleton, resulting in poor adhesion between the substrate film and the conductive layer.Furthermore, the conductive film of Comparative Example 5 uses a PET film as the substrate film, which results in a large retardation and the occurrence of rainbow spots, making it unsuitable for use as a transparent conductive film.

[0127] Furthermore, in Examples 6 and 7, in which the base film made of polyester G, which had poor adhesion in Comparative Example 3, was stretched before providing the conductive layer, the temperature T at which the thermal expansion displacement becomes 3% increased and the adhesion between the conductive layer and the base film was improved. This suggests that the temperature T at which the thermal expansion displacement becomes 3% is closely related to the adhesion between the conductive layer and the base film.

[0128] (Preparation of transparent conductive film) [Example 9] A conductive film was produced in the same manner as in Example 1, except that the Cu film thickness was set to 500 nm in the conductive film manufacturing process. A dry film resist was then attached to the resulting conductive film. The film was then exposed to light using a high-pressure mercury lamp equipped with a mask that produced a grid pattern with a wiring width of 20 μm and a wiring pitch of 600 μm, and then developed with an aqueous sodium hydroxide solution. The metal layer was then etched by immersing the patterned dry film resist as a mask in an etching solution consisting of phosphoric acid and nitric acid heated to 35°C for 30 seconds. The aperture ratio of this grid pattern was 93%. The film with the pattern thus formed was washed with water and dried to produce the transparent conductive film of Example 9.

[0129] The evaluation results of the transparent conductive film produced in Example 9 are shown in Table 3 below. As shown in Table 3, the transparent conductive film of Example 9 exhibits low surface resistance and high transmittance, and can be suitably used in various applications requiring transparency.

[0130] The total light transmittance of the conductive film was measured using a haze meter ("NDH 4000" manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS K 7361-1.

[0131] [Table 3] [Industrial Applicability]

[0132] The present invention has industrial applicability as a conductive film having excellent optical properties and high adhesion.

Claims

1. A conductive film having a base film and a conductive layer provided on the base film, the base film contains a resin including a structural unit having a fluorene skeleton, the conductive layer includes a conductive metal; In a thermomechanical analysis, when a tensile load (30 mN) is applied to the base film in an arbitrary direction and the temperature is increased from 30°C at a rate of 10°C / min, the temperature T at which the thermal expansion displacement from the length of the base film at 30°C becomes 3% is 139°C or higher. Conductive film.

2. the resin is a polyester containing, as a constituent unit, a diol having a fluorene skeleton and / or a dicarboxylic acid having a fluorene skeleton; The conductive film according to claim 1 .

3. the resin is a polyester containing a diol having a fluorene skeleton as a constituent unit, the content of the structural unit derived from the diol having a fluorene skeleton is 20 to 90 mol % relative to the total amount of the diol component contained in the resin; The conductive film according to claim 1 .

4. The glass transition temperature (Tg) of the resin is 115 to 160°C. The conductive film according to claim 1 .

5. the resin does not contain any structural unit having a polycyclic aromatic group other than the structural unit having a fluorene skeleton; The conductive film according to claim 1 .

6. The in-plane retardation Ro(550) of the substrate film is 0 to 200 nm. The conductive film according to claim 1 .

7. The thickness retardation Rth(550) of the substrate film is −500 to 500 nm. The conductive film according to claim 1 .

8. the conductive metal comprises copper; The conductive film according to claim 1 .

9. The conductive layer is provided on both sides of the base film. The conductive film according to claim 1 .

10. The thickness of the conductive layer is 100 to 1000 nm. The conductive film according to claim 1 .

11. The surface resistance is 0.01 to 50 Ω / □. The conductive film according to claim 1 .

12. The total light transmittance is 70% or more. The conductive film according to claim 1 .

13. The conductive layer is composed of electrically continuous wiring having a width of 2 to 30 μm. The conductive film according to claim 1 .

14. the conductive layer has an electrically continuous wiring pattern with an aperture ratio of 90 to 99%; The conductive film according to claim 1 .

15. A method for producing a conductive film according to any one of claims 1 to 14, comprising: a conductive layer forming step of forming a conductive layer on the substrate film by sputtering or electroless plating; A method for manufacturing a conductive film.

16. a stretching step of stretching the base film before the conductive layer forming step; The method for producing a conductive film according to claim 15 .

17. The conductive film according to any one of claims 1 to 14, Capacitive or resistive type Touch sensor.

18. The conductive film according to any one of claims 1 to 14, Transparent antenna.

19. 19. A touch sensor according to claim 17 or a transparent antenna according to claim 18. Image display device.

20. The conductive film according to any one of claims 1 to 14, Transparent heater.

21. The conductive film according to any one of claims 1 to 14, Solar cell.

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