Electrical connection structure and electronic device

Abstract

The present application relates to the technical field of interconnection of circuit boards, and provides an electrical connection structure and an electronic device. In the present application, the size of a circuit board can be reduced, such that the sizes of other components around the circuit board are increased. The electrical connection structure comprises a circuit board, a first connector, a third group of terminals and a fourth group of terminals, wherein the circuit board comprises a first group of signal wires, a second group of signal wires, a first reference ground and a second reference ground; the first reference ground is spaced apart from the second reference ground; the first connector is arranged on the circuit board, and comprises a first group of terminals and a second group of terminals; and the third group of terminals are electrically connected to the first group of terminals by means of the first group of signal wires and the first reference ground, and the fourth group of terminals are electrically connected to the second group of terminals by means of the second group of signal wires and the second reference ground. The electrical connection structure provided in the present application is used for the interconnection of circuit boards.

Description

Electrical connection structure and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on June 9, 2023, with application number 202310688789.3 and invention name “Electrical Connection Structure and Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of interconnection of circuit boards, and in particular to an electrical connection structure and an electronic device. Background Art

[0003] Electronic devices such as mobile phones, tablet computers, and laptops typically have two or more circuit boards, such as a main board and a secondary board. These boards can be interconnected using an electrical connection structure consisting of a flexible printed circuit (FPC) and connectors.

[0004] Signals transmitted between circuit boards can include both RF and baseband signals. Baseband signals have a wider frequency spectrum and can include signals with frequencies in the same range as RF signals, making them susceptible to interference. To address this issue, the connectors used to transmit RF signals and baseband signals within electronic devices are typically separated by a certain distance to minimize crosstalk between the RF and baseband signals.

[0005] However, in this case, a large number of connectors are provided in the electronic device, the connectors occupy a large area on the circuit board, the size of the circuit board is large, and the size of other components around the circuit board is limited.

[0006] Summary of the Invention

[0007] The present application provides an electrical connection structure and an electronic device, which can reduce the size of a circuit board and increase the sizes of other components around the circuit board.

[0008] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0009] In a first aspect, an electrical connection structure is provided, comprising a circuit board, a first connector, a third group of terminals, and a fourth group of terminals. The circuit board comprises a first group of signal traces, a second group of signal traces, a first reference ground, and a second reference ground. The first reference ground faces the first group of signal traces, the second reference ground faces the second group of signal traces, and the first reference ground is spaced apart from the second reference ground. The first connector is disposed on the circuit board, and the first connector comprises a first group of terminals and a second group of terminals. The third group of terminals and the fourth group of terminals are disposed on the circuit board, and the third group of terminals is electrically connected to the first group of terminals via the first group of signal traces and the first reference ground, and the fourth group of terminals is electrically connected to the second group of terminals via the second group of signal traces and the second reference ground.

[0010] In this way, the first signal can be transmitted via the first set of terminals, the first set of signal traces, the first reference ground, and the third set of terminals, while the second signal can be transmitted via the second set of terminals, the second set of signal traces, the second reference ground, and the fourth set of terminals. Because the first reference ground is separated from the second reference ground, the first and second signals are not co-located, resulting in less interference and higher isolation. Furthermore, because the first and second sets of terminals are located within the first connector, the first and second signals are introduced into or output from the circuit board via the first connector. This reduces the number of connectors on the electrical connection structure and the external circuit board, reducing the size of the electrical connection structure and the external circuit board, thereby increasing the volume of other components (such as a battery) arranged around the electrical connection structure and the external circuit board in the electronic device.

[0011] In one possible implementation of the first aspect, a circuit board includes a first metal layer and a second metal layer stacked and spaced apart. A first group of signal traces is formed by at least a portion of the first metal layer. A first reference ground includes a first reference ground portion, which is formed by at least a portion of the second metal layer. An orthographic projection of at least a portion of the first group of signal traces on the second metal layer is located within the first reference ground portion. In this manner, the first reference ground portion can shield at least a portion of the first group of signal traces, thereby improving the anti-interference performance of the first group of signal traces.

[0012] In a possible implementation of the first aspect, when the first group of signal traces is formed by a portion of the first metal layer and the first reference ground portion is formed by a portion of the second metal layer, the second group of signal traces includes the first portion of signal traces. The first portion of signal traces is formed by another portion of the second metal layer, and the first portion of signal traces is separated from the first reference ground portion. The second reference ground includes a second reference ground portion, and the second reference ground portion is formed by another portion of the first metal layer, and the second reference ground portion is separated from the first group of signal traces. The orthographic projection of at least a portion of the first portion of signal traces on the first metal layer is located within the second reference ground portion. In this way, the second reference ground portion can provide a certain shielding effect on at least a portion of the first portion of signal traces, thereby improving the anti-interference performance of the first portion of signal traces.

[0013] In one possible implementation of the first aspect, the second reference ground further includes a third reference ground portion and a fourth reference ground portion, each formed by another portion of the second metal layer. Both the third and fourth reference ground portions are electrically connected to the second reference ground portion, with the third reference ground portion located on one side of the first signal trace and the fourth reference ground portion located on the other side of the first signal trace. Thus, the third and fourth reference ground portions can provide a shielding effect on the first signal trace within the plane of the second metal layer, improving the anti-interference performance of the first signal trace. Simultaneously, the area of ​​the second reference ground is increased, improving signal return performance. Furthermore, while maintaining the area of ​​the second reference ground, by arranging a portion of the second reference ground on the first metal layer and another portion on the second metal layer, thereby creating a stacked arrangement, the board area occupied by the second signal transmission component on the circuit board can be reduced, thereby reducing the volume of the electrical connection structure and facilitating installation in electronic devices with limited space.

[0014] In one possible implementation of the first aspect, the circuit board further includes a third metal layer. The third metal layer is located on a side of the first metal layer facing away from the second metal layer, and the third metal layer is stacked and spaced apart from the first metal layer. The first reference ground further includes a fifth reference ground portion. The fifth reference ground portion is formed by at least a portion of the third metal layer, is electrically connected to the first reference ground portion, and an orthographic projection of at least a portion of the first group of signal traces on the third metal layer is located within the fifth reference ground portion. In this way, the fifth reference ground portion can provide shielding for at least a portion of the first group of signal traces, further improving the anti-interference performance of the first group of signal traces.

[0015] In one possible implementation of the first aspect, when the fifth reference ground portion is formed by a portion of the third metal layer, the second group of signal traces further includes a second portion of signal traces, the second portion of signal traces being formed by another portion of the third metal layer, and at least a portion of the second portion of signal traces having an orthographic projection on the first metal layer located within the second reference ground portion. In this manner, the second reference ground portion can be used to isolate the second portion of signal traces from the first portion of signal traces, preventing interference between the two.

[0016] In one possible implementation of the first aspect, the second reference ground further includes a sixth reference ground portion and a seventh reference ground portion, each formed by another portion of the third metal layer. Both the sixth and seventh reference ground portions are electrically connected to the second reference ground portion, with the sixth reference ground portion located on one side of the second signal trace and the seventh reference ground portion located on the other side of the second signal trace. Thus, the sixth and seventh reference ground portions can provide a shielding effect for the second signal trace within the plane of the third metal layer, improving the anti-interference performance of the second signal trace. This also increases the area of ​​the second reference ground and improves signal return performance. Furthermore, while maintaining the area of ​​the second reference ground, by arranging another portion of the second reference ground in the third metal layer, the stacked arrangement can reduce the footprint of the second signal transmission component on the circuit board, thereby reducing the volume of the electrical connection structure and facilitating installation in electronic devices with limited space.

[0017] In a possible implementation of the first aspect, the circuit board includes a first metal layer, and the first reference ground includes an eighth reference ground portion and a ninth reference ground portion. The first group of signal traces is formed by a portion of the first metal layer, and the eighth reference ground portion and the ninth reference ground portion are formed by another portion of the first metal layer. The eighth reference ground portion is located on one side of at least a portion of the first group of signal traces, and the ninth reference ground portion is located on the other side of the at least a portion of the first group of signal traces. In this way, with the help of the eighth reference ground portion and the ninth reference ground portion, a certain shielding effect can be achieved for at least a portion of the first group of signal traces. At the same time, the eighth reference ground portion, the ninth reference ground portion, and at least a portion of the first group of signal traces located between the eighth reference ground portion and the ninth reference ground portion constitute a coplanar waveguide. The coplanar waveguide has a small insertion loss, which is conducive to improving the transmission efficiency of the radio frequency signal.

[0018] Optionally, the first group of signal traces further includes a second segment, which is part of the first group of signal traces. The eighth reference ground portion is located on one side of the second segment, and the ninth reference ground portion is located on the other side of the second segment. In this way, the eighth reference ground portion, the second segment, and the ninth reference ground portion can form a coplanar waveguide structure, which can reduce the insertion loss of the first group of signal traces to a certain extent and improve the transmission efficiency of RF signals.

[0019] In a possible implementation of the first aspect, the portion of the circuit board where the second section, the eighth reference ground portion, and the ninth reference ground portion are located can be passed through the hinge mechanism. The number of metal layers in this portion of the circuit board is smaller, the circuit board is softer, and is easier to fold.

[0020] In one possible implementation of the first aspect, the first group of terminals includes a first signal terminal and multiple first ground terminals. At least a portion of the multiple first ground terminals is located between the first signal terminal and the second group of terminals. This isolation provided by at least a portion of the first ground terminals prevents crosstalk between a first signal transmitted by the first signal terminal and a second signal transmitted by the second group of terminals.

[0021] In one possible implementation of the first aspect, the first connector further includes a fifth group of terminals, the fifth group of terminals being located between the first group of terminals and the second group of terminals. A fifth group of solder pads is provided on the circuit board, the fifth group of solder pads being located between the first reference ground and the second reference ground, and the fifth group of solder pads being spaced apart from the first reference ground and the second reference ground. The fifth group of terminals is soldered to the fifth group of solder pads. The fifth group of terminals can be isolated to prevent crosstalk between the first signal transmitted in the first group of terminals and the second signal transmitted in the second group of terminals.

[0022] In one possible implementation of the first aspect, the electrical connection structure further includes a first reinforcement member. The first reinforcement member is located on a surface of the circuit board facing away from the first connector, and an orthographic projection of the first connector on the circuit board overlaps with an orthographic projection of the first reinforcement member on the circuit board. The first reinforcement member is an insulating member.

[0023] Specifically, the material of the first reinforcement includes but is not limited to non-metals such as FR-4 epoxy glass cloth laminate, polycarbonate, PC+glass fiber, and ABS plastic.

[0024] In this way, the first reinforcement member can increase the structural strength of the portion of the circuit board connected to the first connector, facilitating the plugging operation. Furthermore, because the first reinforcement member is an insulating member, capacitive coupling effects between the first reference ground and the first reinforcement member, as well as between the second reference ground and the first reinforcement member, can be avoided. This prevents crosstalk between the first reference ground and the second reference ground via the first reinforcement member, thereby increasing the isolation between the first and second signals.

[0025] In one possible implementation of the first aspect, the electrical connection structure further includes a second connector disposed on the circuit board, the third group of terminals forming part of the second connector, and the fourth group of terminals forming another part of the second connector. In this manner, the third and fourth groups of terminals form part of the second connector, facilitating management and maintenance.

[0026] In a possible implementation of the first aspect, the first group of signal traces is used to transmit radio frequency signals, and the second group of signal traces is used to transmit baseband signals. That is, the first type of signal is a radio frequency signal, and the second type of signal is a baseband signal.

[0027] In a possible implementation manner of the first aspect, the circuit board is a flexible circuit board.

[0028] In one possible implementation of the first aspect, the circuit board includes a first circuit board portion and a second circuit board portion. One end of the first circuit board portion along its length is connected to another end of the second circuit board portion along its length, and the length direction of the first circuit board portion intersects the length direction of the second circuit board portion. In this way, the circuit board is generally L-shaped, which can match the relative positions of the two connected circuit boards.

[0029] In one possible implementation of the first aspect, an opening is provided on the circuit board. The opening includes a first opening portion and a second opening portion. The first opening portion is located at the end of the first circuit board portion facing the second circuit board portion and extends along the length of the first circuit board portion. The second opening portion is located at the end of the second circuit board portion facing the first circuit board portion and communicates with the first opening portion. The second opening portion extends along the length of the second circuit board portion. In this way, the opening can reduce stress concentration and avoid problems such as redundancy or tearing of the circuit board.

[0030] In a second aspect, an electronic device is provided, comprising a first circuit board and an electrical connection structure as described in any of the above technical solutions. A fourth connector is provided on the first circuit board. The first connector of the electrical connection structure is electrically connected to the fourth connector.

[0031] Since the electronic device provided in the present application includes the electrical connection structure described in any of the above technical solutions, both can solve the same technical problem and achieve the same effect.

[0032] In a possible implementation manner of the second aspect, the electronic device further includes a second circuit board, and the third group of terminals and the fourth group of terminals of the electrical connection structure are electrically connected to the second circuit board.

[0033] In one possible implementation of the second aspect, an electronic device includes a first screen, a first housing, a second housing, and a hinge mechanism. The first screen includes a first screen portion and a second screen portion connected to the first screen portion. The first screen portion is connected to the first housing, the second screen portion is connected to the second housing, and the hinge mechanism is connected between the first and second housings. The second circuit board is disposed within the first housing, the first circuit board is disposed within the second housing, and the electrical connection structure passes through the hinge mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG1 is a perspective view of an electronic device provided in some embodiments of the present application;

[0035] FIG2 is a perspective view of the electronic device shown in FIG1 when viewed from a direction D1;

[0036] FIG3 is a schematic structural diagram of the electronic device shown in FIG1 when the first screen is in a folded state;

[0037] FIG4 is a schematic structural diagram of internal components of the electronic device shown in FIG2 ;

[0038] FIG5 a is a schematic diagram of an exploded structure of the first circuit board, the second circuit board, and the electrical connection structure in the electronic device shown in FIG4 ;

[0039] FIG5 b is a partial enlarged view of region I in the decomposed structure shown in FIG5 a ;

[0040] FIG5c is a partial enlarged view of region II in the decomposed structure shown in FIG5a;

[0041] FIG6 a is a schematic structural diagram of the exploded structure shown in FIG5 a when viewed from direction D2;

[0042] FIG6 b is a partial enlarged view of the decomposed structure shown in FIG6 a at region III;

[0043] FIG6 c is a partial enlarged view of the decomposed structure shown in FIG6 a at region IV;

[0044] FIG7 is a schematic diagram of the specific structure of the electrical connection structure at the second connector in the exploded structure shown in FIG6a;

[0045] FIG8 is a schematic structural diagram of the electrical connection structure shown in FIG7 when viewed from direction D3;

[0046] FIG9 is a top view of the first metal layer in the circuit board shown in FIG8 ;

[0047] FIG10 is a top view of the second metal layer in the circuit board shown in FIG8 ;

[0048] FIG11 is a top view of the third metal layer in the circuit board shown in FIG8 ;

[0049] FIG12 is a graph showing a change in isolation between the first signal and the second signal transmitted in the electrical connection structure shown in FIG7 as a function of frequency, as verified by a simulation experiment;

[0050] FIG13 is a graph showing how the isolation between the first signal and the second signal varies with frequency in a comparison of electrical connection structures verified by simulation experiments;

[0051] FIG14 is a schematic structural diagram of an electronic device provided in some other embodiments of the present application. DETAILED DESCRIPTION

[0052] In the embodiments of the present application, the terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh", "eighth", "ninth", "tenth", "eleventh", and "twelfth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", "fourth", "fifth", "sixth", "seventh", "eighth", "ninth", "tenth", "eleventh", and "twelfth" may explicitly or implicitly include one or more of the features.

[0053] In the embodiments of the present application, the terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0054] The embodiment of the present application provides an electronic device, which may be a user equipment (UE) or a terminal device, for example, a tablet computer (portable Android device, PAD), a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, and other mobile terminals or fixed terminals. The embodiment of the present application does not specifically limit the form of the electronic device.

[0055] Please refer to Figure 1, which is a stereoscopic diagram of an electronic device 10 provided in some embodiments of the present application. This embodiment and the embodiments below are exemplified by taking the electronic device 10 as a folding screen device, which can be, for example, a folding screen mobile phone. In Figure 1, the folding screen device is in an unfolded state, in which the electronic device is approximately in the shape of a rectangular flat plate. Based on this, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established for the electronic device 10 in the unfolded state, defining the length direction of the electronic device 10 as the X-axis direction, the width direction of the electronic device 10 as the Y-axis direction, and the thickness direction of the electronic device 10 as the Z-axis direction. It can be understood that the coordinate system setting of the electronic device 10 can be flexibly set according to actual needs, and no specific limitation is made here. In some other embodiments, when the electronic device 10 is in the unfolded state, the shape of the electronic device 10 can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc.

[0056] Please refer to Figure 1 and Figure 2 together. Figure 2 is a three-dimensional view of the electronic device 10 shown in Figure 1 when viewed from a direction D1. The electronic device 10 includes a first screen 1, a supporting device 2, and a second screen 3.

[0057] It is understood that Figures 1 and 2 schematically illustrate some components of the electronic device 10, and the actual shape, size, position, and structure of these components are not limited by Figures 1 and 2. In other embodiments, the electronic device 10 may not include the first screen 1 and the second screen 3.

[0058] Please refer to Figure 1 , where the first screen 1 is used to display images, videos, and other information. The first screen 1 can be an organic light-emitting diode (OLED) screen, a micro organic light-emitting diode (MLD) screen, or a quantum dot light-emitting diode (QLED) screen, etc.

[0059] The first screen 1 includes a display surface S1, through which a user can view images or videos displayed on the first screen 1. The first screen 1 has a back side, which refers to a side of the first screen 1 facing away from the display surface S1.

[0060] The supporting device 2 is located on the back side of the first screen 1 and is fixed to the first screen 1. The supporting device 2 is used to support the first screen 1 and protect internal components.

[0061] In some embodiments, the support device 2 includes a first housing 21 and a second housing 22. When the electronic device 10 is another product, the electronic device 10 may not include the second housing 22, or, in addition to the first housing 21 and the second housing 22, may also include a third housing, a fourth housing, or a fifth housing, etc., which is not specifically limited in this application.

[0062] The first housing 21 and the second housing 22 are used to support the first screen 1. Specifically, please refer to Figure 1. The first screen 1 includes a first screen portion 11 and a second screen portion 12. The first screen portion 11 is connected to the first housing 21, and the second screen portion 12 is connected to the second housing 22.

[0063] The second screen 3 is disposed on a side of the first housing 21 that faces away from the first screen portion 11. The second screen 3 includes a display surface S2 that faces away from the display surface of the first screen portion 11. The display surface of the first screen portion 11 is the portion of the display surface S1 located within the first screen portion 11.

[0064] The support device 2 also includes a hinge mechanism, which is connected between the first shell 21 and the second shell 22. The first shell 21 and the second shell 22 are rotatably connected by the hinge mechanism, so that the first screen 1 can be folded from the unfolded state shown in Figure 1 to the folded state. In Figure 1, the first screen 1 is in the unfolded state. Please refer to Figure 3, which is a structural schematic diagram of the electronic device 10 shown in Figure 1 when the first screen 1 is in the folded state. In this state, the first shell 21 and the second shell 22 are protected outside the first screen 1, which can prevent the first screen 1 from being scratched, and the electronic device 10 is folded for easy carrying. At the same time, the second screen 3 is exposed, and a small screen display can be achieved with the help of the second screen 3.

[0065] Please refer to Figure 4, which is a schematic diagram illustrating the internal components of electronic device 10 shown in Figure 2. It should be noted that in Figure 4, the internal components of electronic device 10 are depicted by dashed lines. Electronic device 10 also includes a first circuit board 4, a second circuit board 5, an electrical connection structure 6, and an antenna module 7.

[0066] Please refer to FIG. 4 . The first circuit board 4 may be disposed in the second housing 22 , and the second circuit board 5 may be disposed in the first housing 21 .

[0067] The first circuit board 4 may be the mainboard of the electronic device 10. A rear camera module 41 may be provided on the first circuit board 4. A radio frequency (RF) transceiver module 42 may also be provided on the first circuit board 4. The RF transceiver module 42 includes, but is not limited to, an RF transceiver circuit and an RF transceiver chip. The RF transceiver module 42 is used to generate RF transmission signals and process RF reception signals.

[0068] Based on the above, please continue to refer to Figure 4. Electrical connection structure 6 is connected between first circuit board 4 and second circuit board 5, and electrical connection structure 6 passes through the hinge mechanism. Electrical connection structure 6 can transmit the RF transmission signal generated by RF transceiver module 42 in first circuit board 4 to second circuit board 5, and transmit the RF reception signal from second circuit board 5 to RF transceiver module 42 in first circuit board 4.

[0069] Furthermore, the electrical connection structure 6 can also transmit baseband signals. In this embodiment, baseband signals are signals other than radio frequency signals. Specifically, baseband signals may include control signals, video stream signals, audio signals, and the like. These baseband signals have a wide frequency spectrum and may include signals with a frequency range that is the same as that of radio frequency signals (including radio frequency transmission signals and radio frequency reception signals). Therefore, baseband signals and radio frequency signals are prone to mutual interference.

[0070] Continuing with Figure 4 , the antenna module 7 can be disposed within the first housing 21. In some embodiments, the antenna module 7 can include a radiator 71 and a control circuit board 72. The radiator 71 can be formed by at least a portion (e.g., a frame) of the first housing 21. The control circuit board 72 is electrically connected to the radiator 71 and is configured to switch the operating frequency band or operating state of the radiator 71. The control circuit board 72 is located within the first housing 21.

[0071] Antenna module 7 is electrically connected to second circuit board 5 to receive the aforementioned RF transmission signals, as well as baseband signals such as antenna control signals and power signals, from the second circuit board 5. Radiator 71 transmits the RF transmission signals as electromagnetic waves. Control circuit board 72 switches the operating frequency band or operating state of radiator 71 based on the antenna control signals. Antenna module 7 also receives electromagnetic wave signals and converts them into RF receive signals for transmission to second circuit board 5.

[0072] The following focuses on the specific structure of the electrical connection structure 6.

[0073] Please refer to FIG. 5 a , which is a schematic diagram of an exploded structure of the first circuit board 4 , the second circuit board 5 , and the electrical connection structure 6 in the electronic device 10 shown in FIG. 4 .

[0074] The first circuit board 4 may be provided with a fourth connector 43 , and the second circuit board 5 may be provided with a fifth connector 51 . The fourth connector 43 is electrically connected to the fifth connector 51 via the electrical connection structure 6 .

[0075] It is understandable that other connectors may be provided on the first circuit board 4. For example, in the embodiment shown in Figure 5a, a sixth connector 44 may be provided on the first circuit board 4, and a seventh connector 52 may be provided on the second circuit board 5. The sixth connector 44 is electrically connected to the seventh connector 52 by means of the electrical connection structure 6.

[0076] The following embodiments mainly introduce the specific connection structure between the fourth connector 43 , the electrical connection structure 6 and the fifth connector 51 .

[0077] Specifically, referring to Figure 5b, which is a partial enlarged view of region I in the exploded structure shown in Figure 5a, the fourth connector 43 may include a seventh group of terminals A7 and an eighth group of terminals A8. Referring to Figure 5c, which is a partial enlarged view of region II in the exploded structure shown in Figure 5a, the fifth connector 51 may include a ninth group of terminals A9 and a tenth group of terminals A10. The seventh group of terminals A7 is electrically connected to the ninth group of terminals A9 via the electrical connection structure 6 to transmit a first signal, which may be the aforementioned RF signal. The eighth group of terminals A8 is electrically connected to the tenth group of terminals A10 via the electrical connection structure 6 to transmit a second signal, which may be the aforementioned baseband signal.

[0078] Of course, in other embodiments, the first signal may be a baseband signal, and the second signal may be a radio frequency signal; or both the first signal and the second signal may be radio frequency signals; or both the first signal and the second signal may be baseband signals. The following embodiments are described illustratively with the first signal being a radio frequency signal and the second signal being a baseband signal, and this is not to be considered a special limitation of the present application.

[0079] Please refer to Figure 6a, which is a schematic diagram of the exploded structure shown in Figure 5a when viewed from a direction D2. The electrical connection structure 6 includes a circuit board 61, a first connector 62 and a second connector 63.

[0080] The circuit board 61 can be a flexible board or a combination of flexible and rigid boards. In this embodiment, the circuit board 61 is exemplified as a flexible board. Specifically, the circuit board 61 can be an FPC.

[0081] The circuit board 61 can have various shapes. For example, the circuit board 61 can be S-shaped, L-shaped, straight-line, etc. The shape of the circuit board 61 can be specifically designed according to the relative positions of the first circuit board 4 and the second circuit board 5 .

[0082] In some embodiments, referring to FIG. 6 a , the circuit board 61 may include a first circuit board portion 611 and a second circuit board portion 612 .

[0083] The first circuit board portion 611 has a length direction, which is consistent with the direction in which the internal signal traces of the first circuit board portion 611 extend. Specifically, the length direction of the first circuit board portion 611 is substantially parallel to the X-axis. Similarly, the second circuit board portion 612 also has a length direction, which is consistent with the direction in which the internal signal traces of the second circuit board portion 612 extend. Specifically, the length direction of the second circuit board portion 612 is substantially parallel to the Y-axis.

[0084] Based on the above, one end of the lengthwise direction of the first circuit board portion 611 is connected to one end of the lengthwise direction of the second circuit board portion 612, and the lengthwise direction of the first circuit board portion 611 intersects the lengthwise direction of the second circuit board portion 612. "Intersecting" means forming a certain angle, which can be greater than 0° and less than 180°. Optionally, the lengthwise direction of the first circuit board portion 611 and the lengthwise direction of the second circuit board portion 612 can be substantially perpendicular.

[0085] In this way, the circuit board 61 is roughly L-shaped, which can match the relative positions of the first circuit board 4 and the second circuit board 5 .

[0086] On the basis of the above, since the relative positions of the first circuit board 4 and the second circuit board 5 will inevitably deviate, the position of the fourth connector 43 on the first circuit board 4 and the position of the fifth connector 51 on the second circuit board 5 will inevitably deviate. Based on this, after the electrical connection structure 6 is connected to the fourth connector 43 and the fifth connector 51, the circuit board 61 will inevitably have problems such as redundant wrinkles or tears.

[0087] To address the above issues, in some embodiments, referring to FIG. 6 a , an opening 66 is provided on the circuit board 61. The opening 66 includes a first opening portion 66a and a second opening portion 66b. The first opening portion 66a is located at the end of the first circuit board portion 611 facing the second circuit board portion 612, and the first opening portion 66a extends substantially along the length of the first circuit board portion 611. The second opening portion 66b is located at the end of the second circuit board portion 612 facing the first circuit board portion 611 and communicates with the first opening portion 66a. The second opening portion 66b extends along the length of the second circuit board portion 612.

[0088] In this way, with the help of the opening 66, stress concentration can be reduced, and problems such as redundancy or tearing of the circuit board 61 can be avoided.

[0089] Continuing with FIG6a , the first connector 62 and the second connector 63 are disposed on the circuit board 61. The first connector 62 and the second connector 63 may be plug-in board-to-board (BTB) connectors. Of course, in other embodiments, the first connector 62 and the second connector 63 may also be magnetic connectors or contact connectors, which are not specifically limited in this application.

[0090] 6 a , the first connector 62 may be disposed at an end of the first circuit board portion 611 away from the second circuit board portion 612 . The second connector 63 may be disposed at an end of the second circuit board portion 612 away from the first circuit board portion 611 .

[0091] The first connector 62 is mated and connected with the fourth connector 43 , and the second connector 63 is mated and connected with the fifth connector 51 .

[0092] For details, please refer to Figure 6b, which is a partial, enlarged view of region III of the exploded structure shown in Figure 6a. The electrical connection structure includes a first set of terminals A1 and a second set of terminals A2, which are disposed on circuit board 61. Specifically, referring to Figures 6a and 6b, the first set of terminals A1 is a portion of the first connector 62, and the second set of terminals A2 is another portion of the first connector 62. The first set of terminals A1 mates with the aforementioned seventh set of terminals A7, and the second set of terminals A2 mates with the aforementioned eighth set of terminals A8.

[0093] Please refer to Figure 6c, which is a partial enlarged view of region IV of the exploded structure shown in Figure 6a. The electrical connection structure 6 also includes a third group of terminals A3 and a fourth group of terminals A4, which are disposed on the circuit board 61. In some embodiments, referring to both Figures 6a and 6c, the third group of terminals A3 forms part of the second connector 63, and the fourth group of terminals A4 forms another part of the second connector 63. The third group of terminals A3 mates with the ninth group of terminals A9, and the fourth group of terminals A4 mates with the tenth group of terminals A10.

[0094] Please refer to Figure 7, which illustrates the detailed structure of the electrical connection structure 6 at the second connector 63 in the exploded structure shown in Figure 6a. Circuit board 61 includes a first set of signal traces 611, a second set of signal traces 612, a first reference ground GND1, and a second reference ground GND2. In Figure 7, the first reference ground GND1 and the second reference ground GND2 are filled with dots.

[0095] The first reference ground GND1 faces the first group of signal traces 611, and the second reference ground GND2 faces the second group of signal traces 612. "Face" should be understood as being closer. Specifically, the first reference ground GND1 faces the first group of signal traces 611, meaning that, of the first reference ground GND1 and the second reference ground GND2, the first reference ground GND1 is closer to the first group of signal traces 611. That is, the distance between the first reference ground GND1 and the first group of signal traces 611 is shorter than the distance between the second reference ground GND2 and the first group of signal traces 611.

[0096] Similarly, the second reference ground GND2 is directed toward the second group of signal traces 612, which means that: between the first reference ground GND1 and the second reference ground GND2, the distance between the second reference ground GND2 and the second group of signal traces 612 is closer, that is, the distance between the second reference ground GND2 and the second group of signal traces 612 is smaller than the distance between the first reference ground GND1 and the second group of signal traces 612.

[0097] The third terminal group A3 is electrically connected to the first terminal group A1 via the first signal trace 611 and the first reference ground GND1 to transmit the first signal. The fourth terminal group A4 is electrically connected to the second terminal group A2 via the second signal trace 612 and the second reference ground GND2 to transmit the second signal.

[0098] 7 , the third group of terminals A3 may include at least one third signal terminal A31 and at least one third ground terminal A32. In FIG7 , the third signal terminal A31 is filled with hatching, and the third ground terminal A32 is filled with black solid.

[0099] Accordingly, the first group of terminals A1 may include at least one first signal terminal and at least one first ground terminal.

[0100] Continuing to refer to FIG. 7 , the first group of signal traces 611 may include at least one first signal trace 6111 .

[0101] At least one third signal terminal A31 in the third group of terminals A3 is electrically connected to at least one first signal terminal in the first group of terminals A1 by means of at least one signal 611a line in the first group of signal lines 611 to transmit the first signal; at least one third ground terminal A32 in the third group of terminals A3 is electrically connected to at least one first ground terminal in the first group of terminals A1 by means of the first reference ground GND1 to achieve signal return.

[0102] In some embodiments, referring to FIG7 , the number of third signal terminals A31 in the third group of terminals A3 is one. Correspondingly, the number of first signal terminals in the first group of terminals A1 is also one. The number of first signal traces 6111 in the first group of signal traces 611 is one. The third signal terminal A31 in the third group of terminals A3, the first signal traces 6111 in the first group of signal traces 611, and the first signal terminal in the first group of terminals A1 are connected to form a first transmission path. The first transmission path is used to transmit the first signal described above, which includes a radio frequency transmit signal and a radio frequency receive signal. Specifically, the radio frequency transmit signal and the radio frequency receive signal can be transmitted in the first transmission path using a time division duplexing (TDD) method.

[0103] TDD is a duplex mode used in mobile communication systems to separate the receive and transmit channels (or uplink and downlink). In TDD mobile communication systems, reception and transmission occur in different time slots of the same frequency channel, i.e., the carrier, using guaranteed time to separate the receive and transmit channels.

[0104] In some embodiments, as shown in FIG7 , the third terminal group A3 can include multiple third ground terminals A32. "Multiple" means two or more, for example, seven third ground terminals A32. Accordingly, the first terminal group A1 can also include multiple first ground terminals. This allows the first signal to be recirculated using multiple third ground terminals A32 and multiple first ground terminals, improving the recirculation performance of the first signal.

[0105] In some embodiments, referring to FIG7 , at least a portion of the third ground terminals A32 in the third terminal group A3 can be located between the third signal terminal A31 and the fourth terminal group A4 in the third terminal group A3. For example, in the embodiment shown in FIG7 , four third ground terminals A32 in the third terminal group A3 are located between the third signal terminal A31 and the fourth terminal group A4.

[0106] In this way, at least a portion of the third ground terminal A32 can play a certain shielding role, thereby avoiding crosstalk between the first signal transmitted by the third signal terminal A31 and the second signal transmitted by the fourth group of terminals A4.

[0107] Similarly, at least a portion of the first ground terminals in the first group of terminals A1 may be located between the first signal terminals and the second group of terminals A2 to avoid crosstalk between the first signal transmitted by the first signal terminals and the second signal transmitted by the second group of terminals A2.

[0108] 7 , the fourth group of terminals A4 may include at least one fourth signal terminal A41 and at least one fourth ground terminal A42 . In FIG7 , the fourth signal terminal A41 is filled with hatching, and the fourth ground terminal A42 is filled with solid black.

[0109] Accordingly, the second group of terminals A2 may include at least one second signal terminal and at least one second ground terminal. The second group of signal traces 612 may include at least one second signal trace 6121. At least one fourth signal terminal A41 within the fourth group of terminals A4 is electrically connected to at least one second signal terminal within the second group of terminals A2 via at least one second signal trace 6121 within the second group of signal traces 612. At least one fourth ground terminal A42 within the fourth group of terminals A4 is electrically connected to at least one second ground terminal within the second group of terminals A2 via the second reference ground GND2.

[0110] In the embodiment shown in FIG7 , the fourth terminal group A4 can include multiple fourth signal terminals A41 and multiple fourth ground terminals A42. Accordingly, the second terminal group A2 can include multiple second signal terminals and multiple second ground terminals. The second signal traces 6121 can include multiple second signal traces 6121. The multiple fourth signal terminals A41 in the fourth terminal group A4 are electrically connected to the multiple second signal terminals via the multiple second signal traces 6121 in the second signal trace 612.

[0111] Based on any of the above embodiments, the first reference ground GND1 is spaced apart from the second reference ground GND2. That is, there is a certain gap between the first reference ground GND1 and the second reference ground GND2, and the first reference ground GND1 and the second reference ground GND2 are not electrically connected.

[0112] In this way, the first signal transmitted in the first group of signal traces 611 and the second signal transmitted in the second group of signal traces 612 are arranged independently of each other, resulting in greater isolation between the first and second signals, which can reduce crosstalk to a certain extent. Furthermore, because the first and second groups of terminals A1 and A2 are located within the first connector 62, and the third and fourth groups of terminals A3 and A4 are located within the second connector 63, the first and second signals are introduced into or output from the circuit board via the first connector 62, and are output from or introduced into the circuit board via the second connector 63. This reduces the number of connectors provided on the electrical connection structure 6 and the external circuit boards (the first and second circuit boards 4 and 5), and reduces the size of the electrical connection structure 6 and the external circuit boards, thereby increasing the volume of other components (such as a battery) arranged around the electrical connection structure and the external circuit boards in the electronic device.

[0113] The structure of the circuit board 61 will be described in detail below.

[0114] Specifically, please refer to Figure 8, which is a schematic structural diagram of the electrical connection structure 6 shown in Figure 7 when viewed from a direction D3. The circuit board 61 may include a first metal layer 61a, a second metal layer 61b, and a third metal layer 61c.

[0115] The materials of the first metal layer 61a, the second metal layer 61b and the third metal layer 61c include, but are not limited to, copper and copper alloys. Copper and copper alloys have excellent electrical conductivity and can improve the electrical performance of the electrical connection structure 6.

[0116] The first metal layer 61a and the second metal layer 61b are stacked and spaced apart. The third metal layer 61c is located on a side of the first metal layer 61a facing away from the second metal layer 61b. The third metal layer 61c and the first metal layer 61a are stacked and spaced apart.

[0117] In some embodiments, referring to FIG. 8 , a first insulating dielectric layer 61d is disposed between the first metal layer 61a and the second metal layer 61b. The material of the first insulating dielectric layer 61d includes, but is not limited to, polyimide (PI) and polyester film. The first metal layer 61a and the second metal layer 61b are separated by the first insulating dielectric layer 61d.

[0118] Similarly, a second insulating dielectric layer 61e is provided between the second metal layer 61b and the third metal layer 61c, and the second metal layer 61b and the third metal layer 61c are separated by the second insulating dielectric layer 61e.

[0119] Based on the above embodiments, the first group of signal traces 611 and the first reference ground GND1 constitute a first signal transmission component, and the second group of signal traces 612 and the second reference ground GND2 constitute a second signal transmission component. The first signal transmission component and the second signal transmission component can be formed by at least part of the first metal layer 61a, the second metal layer 61b and the third metal layer 61c.

[0120] First, the specific structure of the first signal transmission component in the first metal layer 61a, the second metal layer 61b and the third metal layer 61c is introduced below.

[0121] Please refer to Figure 9, which is a top view of the first metal layer 61a of the circuit board 61 shown in Figure 8. The first group of signal traces 611 is formed by at least a portion of the first metal layer 61a. Please refer to Figure 10, which is a top view of the second metal layer 61b of the circuit board 61 shown in Figure 8. The first reference ground GND1 includes a first reference ground portion GND01, which is formed by at least a portion of the second metal layer 61b.

[0122] Based on the above, referring to Figures 9 and 10 , at least a portion of the first group of signal traces 611 has its orthographic projection on the second metal layer 61b located within the first reference ground portion GND01. In other words, the orthographic projection of the first group of signal traces 611 on the second metal layer 61b may be partially located within the first reference ground portion GND01, or the orthographic projection of the entire first group of signal traces 611 on the second metal layer 61b may be located within the first reference ground portion GND01.

[0123] In this way, the first reference ground portion GND01 can shield at least a portion of the first group of signal traces 611 , thereby improving the anti-interference performance of the first group of signal traces 611 .

[0124] In the above embodiment, optionally referring to FIG9 , the first group of signal traces 611 includes a first segment A, which is part of the first group of signal traces 611 . Referring to FIG9 and FIG10 , the orthographic projection of the first segment A on the second metal layer 61b is located within the first reference ground portion GND01 . This improves the anti-interference performance of the first segment A to a certain extent.

[0125] In some embodiments, please continue to refer to FIG. 9 , the first reference ground GND1 may further include an eighth reference ground portion GND08 and a ninth reference ground portion GND09 .

[0126] In the case where the first group of signal traces 611 is formed by a portion of the first metal layer 61a, the eighth reference ground portion GND08 and the ninth reference ground portion GND09 are formed by another portion of the first metal layer 61a, and the eighth reference ground portion GND08 is located on one side of at least a portion of the first group of signal traces 611, and the ninth reference ground portion GND09 is located on the other side of the at least a portion of the first group of signal traces 611.

[0127] In this way, with the help of the eighth reference ground portion GND08 and the ninth reference ground portion GND09, a certain shielding effect can be achieved for at least a portion of the first group of signal traces 611. At the same time, the eighth reference ground portion GND08, the ninth reference ground portion GND09 and at least a portion of the first group of signal traces 611 located between the eighth reference ground portion GND08 and the ninth reference ground portion GND09 form a coplanar waveguide. The insertion loss of the coplanar waveguide is small, which is conducive to improving the transmission efficiency of the radio frequency signal.

[0128] In the above embodiment, optionally, referring to FIG. 9 , the first group of signal traces 611 further includes a second segment B, which is part of the first group of signal traces 611 . The eighth reference ground portion GND08 is located on one side of the second segment B, and the ninth reference ground portion GND09 is located on the other side of the second segment B. In this way, the eighth reference ground portion GND08 , the second segment B, and the ninth reference ground portion GND09 can form a coplanar waveguide structure, which can reduce the insertion loss of the first group of signal traces 611 to a certain extent and improve the transmission efficiency of RF signals.

[0129] In some embodiments, the portion of the circuit board 61 where the second section B, the eighth reference ground portion GND08 and the ninth reference ground portion GND09 are located can be passed through the hinge mechanism. The number of metal layers in this portion of the circuit board is smaller, it is softer, and easier to fold.

[0130] In some embodiments, the first reference ground portion GND01, the eighth reference ground portion GND08, and the ninth reference ground portion GND09 can be electrically connected as a whole. Specifically, the first reference ground portion GND01, the eighth reference ground portion GND08, and the ninth reference ground portion GND09 can be electrically connected as a whole using a first metallized via (not shown) and other metal regions. The first metallized via can be disposed within the first insulating dielectric layer 61d.

[0131] Please refer to Figure 11, which is a top view of the third metal layer 61c in the circuit board 61 shown in Figure 8. The first reference ground GND1 also includes a fifth reference ground portion GND05. The fifth reference ground portion GND05 is formed by at least a portion of the third metal layer 61c and is electrically connected to the first reference ground portion GND01. Specifically, the fifth reference ground portion GND05 and the first reference ground portion GND01 can be electrically connected via a second metalized via (not shown) and other metal areas. The second metalized via can be provided in the first insulating dielectric layer 61d and the second insulating dielectric layer 61e.

[0132] Based on the above, at least a portion of the orthographic projection of the first group of signal traces 611 on the third metal layer 61c is located within the fifth reference ground portion GND05. In other words, the orthographic projection of the first group of signal traces 611 on the third metal layer 61c can be partially located within the fifth reference ground portion GND05, or the orthographic projection of the entire first group of signal traces 611 on the third metal layer 61c can be located within the fifth reference ground portion GND05.

[0133] In this way, the fifth reference ground portion GND05 can shield at least a portion of the first group of signal traces 611 , further improving the anti-interference performance of the first group of signal traces 611 .

[0134] In some embodiments, referring to FIG11 , the fifth reference ground portion GND05 includes a first reference ground unit GND051. Referring to FIG9 and FIG11 , the orthographic projection of the first segment A on the third metal layer 61 c is located within the first reference ground unit GND051, and the orthographic projection of the first reference ground unit GND051 on the first metal layer 61 a overlaps with the first reference ground portion GND01.

[0135] In this way, the first reference ground portion GND01 , the first segment A and the first reference ground unit GND051 form a stripline structure, which can further improve the anti-interference performance of the first segment A.

[0136] Based on the above embodiment, optionally, referring to FIG. 11 , the fifth reference ground portion GND05 further includes a second reference ground unit GND052. The second reference ground unit GND052 is separated from the first reference ground unit GND051, and the second reference ground unit GND052 is electrically connected to the first reference ground unit GND051. Specifically, the second reference ground unit GND052 and the first reference ground unit GND051 can be electrically connected via another metal region (not shown).

[0137] 9 , the first group of signal traces 611 further includes a third segment C. In some embodiments, the third segment C is connected to the end of the second segment B away from the first segment A. The orthographic projection of the third segment C on the third metal layer 61 c is located within the second reference ground unit GND052.

[0138] In this way, the third section C and the second reference ground unit GND052 form a microstrip line structure. With the help of the second reference ground unit GND052, the third section C can be shielded, thereby improving the anti-interference performance of the third section C.

[0139] According to the introduction of the above embodiments, the first signal transmission component may have a stripline structure, a coplanar waveguide structure and a microstrip line structure at the same time, or may have two of the stripline structure, the coplanar waveguide structure and the microstrip line structure, or may have only one of the stripline structure, the coplanar waveguide structure and the microstrip line structure. This application does not make any specific restrictions on this.

[0140] Next, the specific structure of the second signal transmission component within the first metal layer 61a, the second metal layer 61b and the third metal layer 61c is introduced below.

[0141] Referring back to Figures 9 and 10 , while the first group of signal traces 611 is formed from a portion of the first metal layer 61a, and the first reference ground portion GND01 is formed from a portion of the second metal layer 61b, please refer specifically to Figure 10 . The second group of signal traces 612 includes a first portion of signal traces 612a. The first portion of signal traces 612a is formed from another portion of the second metal layer 61b. The first portion of signal traces 612a is separated from the first reference ground portion GND01; that is, the first portion of signal traces 612a is independent of and not electrically connected to the first reference ground portion GND01.

[0142] Based on the above, please refer to Figure 9 , the second reference ground GND2 includes a second reference ground portion GND02. The second reference ground portion GND02 is formed by another portion of the first metal layer 61a.

[0143] The second reference ground portion GND02 is spaced apart from the first group of signal traces 611 , that is, the second reference ground portion GND02 and the first group of signal traces 611 are independent of each other and are not electrically connected.

[0144] Referring to Figures 9 and 10 , at least a portion of the first signal trace 612a has its orthographic projection on the first metal layer 61a located within the second reference ground portion GND02. In other words, the orthographic projection of the first signal trace 612a on the first metal layer 61a may be partially or entirely located within the second reference ground portion GND02.

[0145] In this way, the second reference ground portion GND02 can shield at least a portion of the first portion of the signal trace 612 a to a certain extent, thereby improving the anti-interference performance of the first portion of the signal trace 612 a.

[0146] In some embodiments, referring to Figures 9 and 10 , the orthographic projection of the entire first portion of signal trace 612a on the first metal layer 61a is located within the second reference ground portion GND02. This shields the entire first portion of signal trace 612a, effectively improving the anti-interference performance of the first portion of signal trace 612a.

[0147] Based on the above embodiment, please refer specifically to Figure 10 . The second reference ground GND2 also includes a third reference ground portion GND03 and a fourth reference ground portion GND04. The third reference ground portion GND03 and the fourth reference ground portion GND04 are formed by another portion of the second metal layer 61b. The third reference ground portion GND03 and the fourth reference ground portion GND04 are both electrically connected to the second reference ground portion GND02. Specifically, the third reference ground portion GND03 and the fourth reference ground portion GND04 can be electrically connected to the second reference ground portion GND02 via a third metalized via (not shown). The third metalized via can be provided within the first insulating dielectric layer 61d.

[0148] Based on the above, the third reference ground portion GND03 is located on one side of the first portion of the signal trace 612 a , and the fourth reference ground portion GND04 is located on the other side of the first portion of the signal trace 612 a .

[0149] In this way, the third reference ground portion GND03 and the fourth reference ground portion GND04 can provide a certain shielding effect for the first portion of the signal trace 612a within the plane of the second metal layer 61b, thereby improving the anti-interference performance of the first portion of the signal trace 612a. At the same time, the area of ​​the second reference ground GND2 is increased, improving the signal return performance. On the other hand, while ensuring that the area of ​​the second reference ground GND2 remains unchanged, by arranging a portion of the second reference ground GND2 on the first metal layer 61a and another portion on the second metal layer 61b, thereby forming a stacked arrangement, the area occupied by the second signal transmission component on the circuit board 61 can be reduced, which helps to reduce the volume of the electrical connection structure 6 and facilitates installation in electronic devices with limited space.

[0150] In some embodiments, referring to FIG11 , in the case where the fifth reference ground portion GND05 is formed by a portion of the third metal layer 61c , the second group of signal traces 612 further includes a second portion of signal traces 612b , and the second portion of signal traces 612b is formed by another portion of the third metal layer 61c . Referring to FIG9 and FIG11 , at least a portion of the second portion of signal traces 612b has an orthographic projection on the first metal layer 61a located within the second reference ground portion GND02 .

[0151] In this way, the second reference ground portion GND02 can be used to isolate the second portion of the signal trace 612b from the first portion of the signal trace 612a to prevent interference between the two portions.

[0152] Based on the above embodiment, please continue to refer to Figure 11. The second reference ground GND2 also includes a sixth reference ground portion GND06 and a seventh reference ground portion GND07. The sixth reference ground portion GND06 and the seventh reference ground portion GND07 are formed by another portion of the third metal layer 61c. The sixth reference ground portion GND06 and the seventh reference ground portion GND07 are both electrically connected to the second reference ground portion GND02. Specifically, the sixth reference ground portion GND06 and the seventh reference ground portion GND07 can be electrically connected to the second reference ground portion GND02 via a fourth metallized via (not shown). The fourth metallized via is disposed within the second insulating dielectric layer 61e.

[0153] Based on the above, the sixth reference ground portion GND06 is located on one side of the second portion of the signal trace 612 b , and the seventh reference ground portion GND07 is located on the other side of the second portion of the signal trace 612 b .

[0154] In this way, the sixth reference ground portion GND06 and the seventh reference ground portion GND07 can provide a certain degree of shielding for the second portion of the signal trace 612b within the plane of the third metal layer 61c, thereby improving the anti-interference performance of the second portion of the signal trace 612b. At the same time, the area of ​​the second reference ground GND2 is increased, improving signal return performance. Furthermore, while ensuring that the area of ​​the second reference ground GND2 remains unchanged, by arranging another portion of the second reference ground GND2 within the third metal layer 61c, the stacked arrangement can reduce the footprint of the second signal transmission component on the circuit board 61, thereby reducing the volume of the electrical connection structure 6 and facilitating installation within electronic devices with limited space.

[0155] According to the description of the above embodiments, the second signal transmission component is divided into three metal layers, and the metal layer in the middle of the three metal layers (corresponding to the first metal layer 61a) is used to set the reference ground, and the metal layers on both sides (including the second metal layer 61b and the third metal layer 61c) are used to set the signal lines. In this way, a larger number of signal lines can be set, and crosstalk between multiple signal lines can be avoided. In some other embodiments, the second signal transmission component can also be set only in one of the first metal layer 61a, the second metal layer 61b and the third metal layer 61c, or in addition to being set in the first metal layer 61a, the second metal layer 61b and the third metal layer 61c, it can also be set in other metal layers. This application does not make specific limitations on this.

[0156] Based on the above embodiment, the first connector 62 and the second connector 63 are both located on the side of the second metal layer 61 b ​​facing away from the first metal layer 61 a .

[0157] Specifically, please refer back to Figure 6a. A first pad set (not shown in the figure) can be provided at the position corresponding to the first connector 62 on the circuit board 61. Specifically, the first pad set can be formed by a portion of the second metal layer 61b shown in Figure 10. The first pad set includes multiple pads, and the terminals of the first connector 62 are soldered to the first pad set.

[0158] The first pad set may include a first pad group and a second pad group, each of which includes at least one pad. Based on this, the first terminal group A1 on the first connector 62 is welded to the first pad group, and the second terminal group A2 is welded to the second pad group.

[0159] In this way, the first connector 62 can be electrically and fixedly connected to the circuit board 61 by means of the first pad set.

[0160] Similarly, please continue to refer to Figure 6a. A second pad set G can be provided at the position corresponding to the second connector 63 on the circuit board 61. Please refer to Figure 10. The second pad set G can be formed by a portion of the second metal layer 61b shown in Figure 10. The second pad set G includes multiple pads, and the terminals of the second connector 63 are welded to the second pad set G.

[0161] As shown in FIG10 , the second pad set G may include a third pad group G3 and a fourth pad group G4, each of which includes at least one pad. Referring to FIG7 , the third terminal group A3 on the second connector 63 is soldered to the third pad group G3, and the fourth terminal group A4 is soldered to the fourth pad group G4.

[0162] In this way, with the help of the second pad set G, the second connector 63 can be electrically and fixedly connected to the circuit board 61.

[0163] Based on the above, referring to Figures 9 and 10 , the two ends of the first group of signal traces 611 can be connected to the first pad in the first pad set and the third pad in the second pad set G, respectively, via metallized vias in the second insulating dielectric layer 61e. The first pad is the pad in the first pad set used for soldering the first signal terminal, and the third pad is the pad in the second pad set G used for soldering the third signal terminal A31. This structure is simple and has a neat appearance.

[0164] Similarly, referring to Figures 10 and 11 , the two ends of the second portion of the signal trace 612b within the third metal layer 61c can also be connected to the second pad within the first pad set and the fourth pad within the second pad set G, respectively, via metallized vias within the first insulating dielectric layer 61d and the second insulating dielectric layer 61e. The second pad is the pad within the first pad set used for soldering the second signal terminal, and the fourth pad is the pad within the second pad set G used for soldering the fourth signal terminal A41. This structure is simple and has a neat appearance.

[0165] Based on any of the above embodiments, referring back to FIG6 b , the first connector 62 further includes a fifth terminal group A5 located between the first terminal group A1 and the second terminal group A2. The fifth terminal group A5 includes at least one terminal. In the embodiment shown in FIG6 b , the fifth terminal group A5 includes three terminals.

[0166] Based on the above embodiment, the first solder pad set further includes a fifth set of solder pads, which are located on the circuit board 61 at positions corresponding to the fifth set of terminals A5. The fifth set of solder pads includes at least one solder pad. In some embodiments, the number of solder pads in the fifth set of solder pads is equal to the number of terminals in the fifth set of terminals A5, and the number of terminals A5 is one-to-one. The fifth set of terminals A5 is soldered to the fifth set of solder pads.

[0167] Based on the above, the fifth group of pads is located between the first reference ground GND1 and the second reference ground GND2, and is spaced apart from the first reference ground GND1 and the second reference ground GND2. In other words, the fifth group of pads is independent of and not electrically connected to the first reference ground GND1 and the second reference ground GND2.

[0168] In this way, isolation can be achieved with the help of the fifth group of terminals A5, thereby avoiding crosstalk between the first signal transmitted in the first group of terminals A1 and the second signal transmitted in the second group of terminals A2.

[0169] Specifically, referring back to Figure 5b, the fourth connector 43 also includes an eleventh group of terminals A11. This eleventh group of terminals A11 is located between the seventh group of terminals A7 and the eighth group of terminals A8, and is electrically connected to a reference ground layer (not shown) within the first circuit board 4. Consequently, the eleventh group of terminals A11 is coupled to the fifth group of terminals A5. This connection of the fifth group of terminals A5 to the reference ground of the first circuit board 4 allows the fifth group of terminals A5 to function as an electromagnetic shield, preventing crosstalk between the first signal transmitted within the first group of terminals A1 and the second signal transmitted within the second group of terminals A2.

[0170] Similarly, referring to FIG6c , the second connector 63 further includes a sixth terminal group A6 located between the third terminal group A3 and the fourth terminal group A4 . The sixth terminal group A6 includes at least one terminal. In the embodiment shown in FIG6c , the sixth terminal group A6 includes three terminals.

[0171] Based on the above embodiment, referring to FIG. 10 , the first pad set G further includes a sixth group of pads G6, which are located on the circuit board 61 at positions corresponding to the sixth group of terminals A6. The sixth group of pads G6 includes at least one pad. In some embodiments, the number of pads in the sixth group of pads G6 is equal to the number of terminals in the sixth group of terminals A6, and the sixth group of terminals A6 is soldered to the sixth group of pads G6.

[0172] Based on the above, the sixth group of pads G6 is located between the first reference ground GND1 and the second reference ground GND2, and is spaced apart from the first reference ground GND1 and the second reference ground GND2. In other words, the sixth group of pads G6 is not electrically connected to either the first reference ground GND1 or the second reference ground GND2.

[0173] In this way, the sixth group of pads G6 can be connected to the ground terminal in the opposite connector (that is, the fifth connector 51) to form isolation, thereby avoiding crosstalk between the first signal transmitted in the third group of terminals A3 and the second signal transmitted in the fourth group of terminals A4.

[0174] Specifically, referring back to Figure 5c, the fifth connector 51 also includes a twelfth group of terminals A12. This twelfth group of terminals A12 is located between the ninth group of terminals A9 and the tenth group of terminals A10, and is electrically connected to the reference ground layer within the second circuit board 5. Consequently, this twelfth group of terminals A12 is coupled to the aforementioned sixth group of terminals A6. This connection of the sixth group of terminals A6 to the reference ground of the second circuit board 5 enables the sixth group of terminals A6 to function as an electromagnetic shield, preventing crosstalk between the first signal transmitted through the third group of terminals A3 and the second signal transmitted through the fourth group of terminals A4.

[0175] In some embodiments, referring back to FIG. 5 a , the electrical connection structure 6 further includes a first reinforcement member 64. The first reinforcement member 64 is located on the surface of the circuit board 61 facing away from the first connector 62, and the orthographic projection of the first connector 62 on the circuit board 61 overlaps with the orthographic projection of the first reinforcement member 64 on the circuit board 61. The first reinforcement member 64 is an insulating member.

[0176] Specifically, the material of the first reinforcement 64 includes, but is not limited to, non-metallic materials such as FR-4 epoxy glass cloth laminate, polycarbonate (PC), PC+glass fiber, and ABS plastic (acrylonitrile butadiene styrene plastic). FR-4 is a code for a flame retardant material grade.

[0177] In this way, the first reinforcement member 64 can increase the structural strength of the portion of the circuit board 61 connected to the first connector 62, facilitating the plugging operation. Furthermore, because the first reinforcement member 64 is an insulating member, capacitive coupling effects can be avoided between the first reference ground GND1 and the first reinforcement member 64, as well as between the second reference ground GND2 and the first reinforcement member 64. This prevents crosstalk between the first reference ground GND1 and the second reference ground GND2 via the first reinforcement member 64, thereby increasing the isolation between the first signal and the second signal.

[0178] The first reinforcement member 64 can be bonded to the circuit board 61 using adhesive. The adhesive can be either conductive or non-conductive. If the adhesive is conductive, it can be dispensed between the circuit board 61 and the first reinforcement member 64. This prevents the formation of a full layer of conductive adhesive, thereby preventing crosstalk between the first reference ground GND1 and the second reference ground GND2.

[0179] Similarly, referring to FIG5a, the electrical connection structure 6 further includes a second reinforcement member 65. The second reinforcement member 65 is located on the surface of the circuit board 61 facing away from the second connector 63, and the second connector 63 is located between the positive projection of the circuit board 61 and the second connector 63.

[0180] The orthographic projection of the second reinforcement member 65 overlaps with the circuit board 61 , and the second reinforcement member 65 is an insulating member.

[0181] In this way, the second reinforcement member 65 can increase the structural strength of the portion of the circuit board 61 connected to the second connector 63, facilitating the plugging operation. Furthermore, because the second reinforcement member 65 is an insulating member, it can prevent capacitive coupling between the first reference ground GND1 and the second reinforcement member 65, and between the second reference ground GND2 and the second reinforcement member 65. This prevents crosstalk between the first reference ground GND1 and the second reference ground GND2 via the second reinforcement member 65, thereby increasing the isolation between the first signal and the second signal.

[0182] In order to verify the isolation effect of the electrical connection structure 6 provided in the present application on the first signal and the second signal, please refer to Figure 12, which is a curve diagram of the change in isolation between the first signal and the second signal transmitted in the electrical connection structure 6 shown in Figure 7 as a function of frequency (Frequency) verified by a simulation experiment. In Figure 12, S3,1, S4,1, S5,1, S6,1, S7,1, S8,1, S9,1, S10,1, S11,1, S12,1, S13,1, S14,1, S15,1, S16,1, S17,1, S18,1, and S19,1 are respectively the isolation between the first signal transmitted by the first signal trace 6111 in the first group of signal traces 611 and the second signal transmitted by the second signal trace 6121 in the second group of signal traces 612. As can be seen from FIG12 , at the 1.1313 GHz frequency, the isolation between the first signal and different second signals is between -61.471823 dB and -91.466965 dB.

[0183] As a comparative electrical connection structure, the comparative electrical connection structure has roughly the same structure and size as the electrical connection structure 6 shown in Figure 7, but in the comparative electrical connection structure, the first reference ground GND1 and the second reference ground GND2 are connected together, there is no fifth group of terminals A5 that serves as isolation between the first group of terminals A1 and the second group of terminals A2, there is no sixth group of terminals A6 that serves as isolation between the third group of terminals A3 and the fourth group of terminals A4, and the first reinforcement 64 and the second reinforcement 65 are both made of metal.

[0184] Please refer to Figure 13, which shows a graph of the frequency-dependent isolation between the first and second signals in the comparative electrical connection structure, verified by simulation experiments. Similarly, in Figure 13, S3,1, S4,1, S5,1, S6,1, S7,1, S8,1, S9,1, S10,1, S11,1, S12,1, S13,1, S14,1, S15,1, S16,1, S17,1, S18,1, and S19,1 represent the isolation between the first signal transmitted by first signal trace 6111 within the first group of signal traces 611 and the second signal transmitted by different second signal traces 6121 within the second group of signal traces 612. As shown in Figure 13, at a frequency of 1.0754 GHz, the isolation between the first signal and different second signals ranges from -42.285563 dB to -60.823607 dB.

[0185] By comparing the simulation results shown in Figures 12 and 13, it can be seen that compared with the comparative electrical connection structure, the isolation between the first signal and the second signal in the electrical connection structure 6 provided in the present application is improved by more than 10dB, so the isolation effect is better and crosstalk between the two signals can be avoided.

[0186] The above embodiments are illustrative examples in which the first group of terminals A1 is a part of the terminals of the first connector 62, the second group of terminals A2 is another part of the terminals of the first connector 62, the third group of terminals A3 is a part of the terminals of the second connector 63, and the fourth group of terminals A4 is another part of the terminals of the second connector 63.

[0187] In some other embodiments, on the basis that the first group of terminals A1 is a portion of the terminals of the first connector 62 and the second group of terminals A2 is another portion of the terminals of the first connector 62, the third group of terminals A3 and the fourth group of terminals A4 may not be terminals of the second connector 63. For example, the third group of terminals A3 and the fourth group of terminals A4 are independently provided on the circuit board 61, for example, both are solder pads on the circuit board 61; or, the third group of terminals A3 and the fourth group of terminals A4 are terminals of two or more connectors on the circuit board 61; or, some of the terminals of the third group of terminals A3 and the fourth group of terminals A4 are terminals in the connector, and another portion of the terminals are independent of the connector, for example, the other portion of the terminals may be solder pads on the circuit board 61. This application does not make specific limitations on this.

[0188] In this way, the first signal and the second signal are introduced into the circuit board 61 or output from the circuit board 61 by means of the first connector 62, which can also reduce the number of connectors set on the electrical connection structure 6 and the external circuit board, reduce the size of the electrical connection structure 6 and the external circuit board, and thus increase the volume of other components (such as batteries) arranged around the electrical connection structure 6 and the external circuit board in the electronic device.

[0189] In addition, the above embodiments are exemplified by the fact that the third group of terminals A3 and the fourth group of terminals A4 are both connected to the second circuit board 5. In other embodiments, the third group of terminals A3 and the fourth group of terminals A4 can be respectively connected to two or more circuit boards, and this application does not make specific limitations on this.

[0190] Furthermore, the first connector 62 may include other groups of terminals in addition to the first, second, and fifth groups of terminals A1, A2, and A5. Furthermore, the electrical connection structure 6 may include other groups of terminals in addition to the third and fourth groups of terminals A3 and A4. These other groups of terminals may be electrically connected to the other groups of terminals within the first connector 62 via the circuit board 61, thereby enabling the transmission of other baseband signals or radio frequency signals. This is not specifically limited in this application.

[0191] The above embodiments are based on the first circuit board 4 and the second circuit board 5 being respectively accommodated in the first housing 21 and the second housing 22. In other embodiments, the first circuit board 4 and the second circuit board 5 can also be accommodated in the same housing.

[0192] For example, please refer to Figure 14, which is a structural diagram of an electronic device 10 provided in some other embodiments of the present application. In this embodiment, the first circuit board 4 and the second circuit board 5 are both accommodated in the first shell 21. Based on this, the above-mentioned electrical connection structure 6 can also be connected between the first circuit board 4 and the second circuit board 5 and the control circuit board 72. Specifically, the first connector 62 of the electrical connection structure 6 is connected to the first circuit board 4, and a part of the third group of terminals A3 and the fourth group of terminals A4 of the above-mentioned electrical connection structure 6 are electrically connected to the control circuit board 72, thereby enabling the transmission of radio frequency signals and baseband signals between the first circuit board 4 and the control circuit board 72 with the help of the electrical connection structure 6. Another part of the terminals of the fourth group of terminals A4 of the above-mentioned electrical connection structure 6 are electrically connected to the second circuit board 5, thereby enabling the transmission of baseband signals between the first circuit board 4 and the second circuit board 5 with the help of the electrical connection structure 6.

[0193] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0194] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electrical connection structure, It is characterized in that include: A circuit board, the circuit board comprising a first group of signal traces, a second group of signal traces, a first reference ground, and a second reference ground; the first reference ground is oriented toward the first group of signal traces, the second reference ground is oriented toward the second group of signal traces, and the first reference ground is spaced apart from the second reference ground; A first connector, the first connector is disposed on the circuit board, and the first connector includes a first group of terminals and a second group of terminals; A third group of terminals and a fourth group of terminals, the third group of terminals and the fourth group of terminals are arranged on the circuit board, and the third group of terminals are electrically connected to the first group of terminals by means of the first group of signal routings and the first reference ground, and the fourth group of terminals are electrically connected to the second group of terminals by means of the second group of signal routings and the second reference ground.

2. The electrical connection structure according to claim 1, It is characterized in that The circuit board comprises a first metal layer and a second metal layer which are stacked and spaced apart; The first group of signal routings is formed by at least a portion of the first metal layer, the first reference ground includes a first reference ground portion, the first reference ground portion is formed by at least a portion of the second metal layer, and the orthographic projection of at least a portion of the first group of signal routings on the second metal layer is located within the first reference ground portion.

3. The electrical connection structure according to claim 2, It is characterized in that In a case where the first group of signal traces is formed by a portion of the first metal layer, and the first reference ground portion is formed by a portion of the second metal layer, The second group of signal traces includes a first portion of signal traces, the first portion of signal traces is formed by another portion of the second metal layer, the first portion of signal traces is spaced apart from the first reference ground portion, the second reference ground includes a second reference ground portion, the second reference ground portion is formed by another portion of the first metal layer, the second reference ground portion is spaced apart from the first group of signal traces; An orthographic projection of at least a portion of the first portion of the signal routing line on the first metal layer is located within the second reference ground portion.

4. The electrical connection structure according to claim 3, It is characterized in that The second reference ground further includes a third reference ground portion and a fourth reference ground portion, wherein the third reference ground portion and the fourth reference ground portion are formed by another portion of the second metal layer; The third reference ground portion and the fourth reference ground portion are both electrically connected to the second reference ground portion, and the third reference ground portion is located on one side of the first portion of the signal routing, and the fourth reference ground portion is located on the other side of the first portion of the signal routing.

5. The electrical connection structure according to any one of claims 2 to 4, It is characterized in that The circuit board further includes a third metal layer, the third metal layer is located on a side of the first metal layer facing away from the second metal layer, and the third metal layer is stacked and spaced apart from the first metal layer; The first reference ground also includes a fifth reference ground portion, which is formed by at least a portion of the third metal layer, the fifth reference ground portion is electrically connected to the first reference ground portion, and the orthographic projection of at least a portion of the first group of signal routing lines on the third metal layer is located within the fifth reference ground portion.

6. The electrical connection structure according to claim 5, It is characterized in that In the case where the fifth reference ground portion is formed by a portion of the third metal layer, The second group of signal routings also includes a second portion of signal routings, which is formed by another portion of the third metal layer, and at least a portion of the orthographic projection of the second portion of signal routings on the first metal layer is located within the second reference ground portion.

7. The electrical connection structure according to claim 6, It is characterized in that The second reference ground further includes a sixth reference ground portion and a seventh reference ground portion, wherein the sixth reference ground portion and the seventh reference ground portion are formed by another portion of the third metal layer; The sixth reference ground portion and the seventh reference ground portion are both electrically connected to the second reference ground portion, and the sixth reference ground portion is located on one side of the second portion of the signal routing, and the seventh reference ground portion is located on the other side of the second portion of the signal routing.

8. The electrical connection structure according to any one of claims 1 to 7, It is characterized in that The circuit board includes a first metal layer, the first reference ground includes an eighth reference ground portion and a ninth reference ground portion; The first group of signal routings is formed by a portion of the first metal layer, the eighth reference ground portion and the ninth reference ground portion are formed by another portion of the first metal layer, the eighth reference ground portion is located on one side of at least a portion of the first group of signal routings, and the ninth reference ground portion is located on the other side of the at least a portion of the first group of signal routings.

9. The electrical connection structure according to any one of claims 1 to 8, It is characterized in that The first group of terminals includes a first signal terminal and a plurality of first ground terminals; At least a portion of the plurality of first ground terminals are located between the first signal terminal and the second group of terminals.

10. The electrical connection structure according to any one of claims 1 to 9, It is characterized in that The first connector further includes a fifth group of terminals, the fifth group of terminals being located between the first group of terminals and the second group of terminals; A fifth group of solder pads is provided on the circuit board, and the fifth group of solder pads is located between the first reference ground and the second reference ground, and the fifth group of solder pads and the first reference ground, as well as the fifth group of solder pads and the second reference ground are spaced apart; the fifth group of terminals is welded on the fifth group of solder pads.

11. The electrical connection structure according to any one of claims 1 to 10, It is characterized in that Also includes: The first reinforcement member is located on a surface of the circuit board facing away from the first connector, and the orthographic projection of the first connector on the circuit board overlaps with the orthographic projection of the first reinforcement member on the circuit board. The first reinforcement member is an insulating member.

12. The electrical connection structure according to any one of claims 1 to 11, It is characterized in that Also includes: The second connector is arranged on the circuit board, the third group of terminals is a part of the terminals of the second connector, and the fourth group of terminals is another part of the terminals of the second connector.

13. The electrical connection structure according to any one of claims 1 to 12, It is characterized in that The first group of signal traces is used to transmit radio frequency signals, and the second group of signal traces is used to transmit baseband signals.

14. The electrical connection structure according to any one of claims 1 to 13, It is characterized in that The circuit board is a flexible circuit board.

15. The electrical connection structure according to any one of claims 1 to 14, It is characterized in that The circuit board includes a first circuit board part and a second circuit board part, one end of the first circuit board part along its own length direction is connected to one end of the second circuit board part along its own length direction, and the length direction of the first circuit board part intersects with the length direction of the second circuit board part.

16. The electrical connection structure according to claim 15, It is characterized in that The circuit board is provided with an opening, the opening comprising a first opening portion and a second opening portion, the first opening portion is located at an end of the first circuit board portion facing the second circuit board portion, and the first opening portion extends along the length direction of the first circuit board portion; The second opening portion is disposed at an end portion of the second circuit board portion facing the first circuit board portion and is communicated with the first opening portion. The second opening portion extends along a length direction of the second circuit board portion.

17. An electronic device, It is characterized in that include: a first circuit board, wherein a fourth connector is provided on the first circuit board; The electrical connection structure according to any one of claims 1 to 16, wherein the first connector of the electrical connection structure is electrically connected to the fourth connector of the first circuit board.

18. The electronic device according to claim 17, It is characterized in that Also includes: The second circuit board, the third group of terminals and the fourth group of terminals of the electrical connection structure are electrically connected to the second circuit board.

19. The electronic device according to claim 18, It is characterized in that The electronic device comprises a first screen, a first shell, a second shell and a rotating shaft mechanism; The first screen includes a first screen portion and a second screen portion connected to the first screen portion; The first screen portion is connected to the first shell, the second screen portion is connected to the second shell, and the shaft mechanism is connected between the first shell and the second shell; The second circuit board is arranged in the first shell, the first circuit board is arranged in the second shell, and the electrical connection structure passes through the rotating shaft mechanism.

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