Adaptive chip test device

Abstract

A chip tester, comprising: a support frame movable in the vertical direction and a movable plate movable in the horizontal direction. An upper test base is mounted on the support frame; a lower test base capable of moving to a position directly below the upper test base along with the movable plate is mounted on the movable plate; a recess is formed in a lower surface of the upper test base and / or an upper surface of the lower test base; when the chip tester is in a test state, the lower surface of the upper test base is tightly attached to the upper surface of the lower test base to form at the recess region a sealing cavity used for accommodating a chip to be tested; and a PCB and a partition plate are sequentially stacked above the upper test base. Flat attachment is ensured while realizing standard conversion after the upper test base and the lower test seat are subjected to mold closing, thereby improving the consistency of test data, and improving the safety of the chip in a high-current and high-voltage test state.

Description

Adaptive chip testing equipment Technical Field

[0001] The invention relates to an adaptive chip testing device, belonging to the technical field of semiconductor chip testing. Background Art

[0002] With the development of the semiconductor industry, bare chip-based MCM packaging technology has received increasing attention from the industry. However, unknown quality issues of bare chips have led to reduced packaging yield and reliability, which has greatly limited MCM packaging technology. Among them, KGD testing of bare chips is the key to improving MCM yield and reliability.

[0003] The KGD process requires chips to be mounted in a temporary fixture, screened, and binned / sorted based on performance differences. KGD chips are known good die (KGD). After the wafers are aged and diced, the bare die undergo another round of pre-packaging testing, screening, and binning based on the test data from the burn-in process. This is known as KGD.

[0004] The bare chips of some power chips are generally very thin and the single pad area on them for contact with the test probe is very small. Therefore, the accuracy of the test socket used to load the bare chip to be tested, especially the flatness between the upper and lower test sockets after the mold is closed, is extremely high. However, the flatness is not convenient for perception and detection by sensors; moreover, the test generally requires ultra-large current and ultra-high voltage. Since it is a high-voltage test, the entire test fixture needs to ensure a high-pressure test atmosphere. By increasing the air pressure outside the chip to increase the maximum breakdown voltage, thereby avoiding spatial discharge between the probes, therefore, there are also very high requirements for airtightness in the closed-mold test state.

[0005] Summary of the Invention

[0006] The purpose of the present invention is to provide an adaptive chip testing device, which can realize the reference conversion after the upper and lower test seats are molded together, ensure smooth fitting, improve the consistency of test data, and improve the safety of the chip under high current and high voltage testing conditions.

[0007] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an adaptive chip testing device, comprising: a support frame movable in the vertical direction and a movable plate movable in the horizontal direction, an upper test seat being installed on the support frame, a lower test seat being installed on the movable plate and being movable to the position directly below the upper test seat with the movable plate, a groove being provided on the lower surface of the upper test seat and / or the upper surface of the lower test seat, when the testing device is in a testing state, the lower surface of the upper test seat is tightly fitted with the upper surface of the lower test seat and a sealed cavity for placing the chip to be tested is formed in the groove area, a PCB board and a partition are stacked in sequence above the upper test seat, the fixedly connected upper test seat, PCB board and partition are connected to the support frame through a mounting plate arranged above the partition, one end of a pipeline passes through the mounting plate, partition, PCB board and upper test seat in sequence and is connected to the sealed cavity, and the other end of the pipeline is used to be connected to a high-pressure gas source;

[0008] The upper surface of the support frame is provided with a strip through hole, and the lower parts of the two opposite inner walls of the strip through hole each have a first ridge, and the upper parts of the two opposite side surfaces of the mounting plate each have a second ridge corresponding to and extending to directly above the first ridge, and a strip block is provided above each of the second ridges, one side of the strip block is fixedly connected to the upper surface of the support frame, and the other side extends to directly above the second ridge and is connected to the second ridge through at least two springs, when the test equipment is in a non-test state, the lower surface of the second ridge overlaps and contacts the upper surface of the corresponding first ridge, and when the test equipment is in a test state, the lower surface of the upper test seat is tightly fitted with the upper surface of the lower test seat and a gap is formed between the lower surface of the second ridge and the upper surface of the corresponding first ridge.

[0009] The further improved scheme in the above technical scheme is as follows:

[0010] 1. In the above solution, each of the second convex strips is connected to the strip block via 4 to 8 springs arranged at equal intervals along the length direction thereof.

[0011] 2. In the above solution, a mounting groove for the end of the spring to be embedded is provided on the upper surface of the second convex strip and / or the lower surface of the strip block.

[0012] 3. The above scheme also includes: a vertically arranged mounting base, two vertical guide rails are installed on the surface of one side of the mounting base at intervals and in parallel, the vertical portion of the support frame and each vertical guide rail are connected by at least two vertical sliders, so that the vertical guide rails can move in the vertical direction, and the upper test seat is installed on the horizontal portion of the support frame, and the horizontal portion is located at the upper end of the vertical portion and extends to the other side of the mounting base.

[0013] 4. In the above scheme, a horizontal base is installed on the other side surface of the mounting substrate and below the horizontal part of the support frame, and two horizontal guide rails are installed on the upper surface of the horizontal base in parallel and at intervals, and the lower surface of the movable plate is connected to each horizontal guide rail through at least two horizontal sliders.

[0014] 5. In the above solution, a T-shaped block is provided on the lower surface of the movable plate and located between the two horizontal guide rails. A T-shaped slot that cooperates with the T-shaped block is provided on the horizontal base, and the T-shaped block can be slidably embedded in the T-shaped slot extending in the horizontal direction.

[0015] 6. In the above solution, a bidirectional slide is installed on the upper surface of the movable plate, and the lower test seat is installed on the bidirectional slide.

[0016] 7. In the above scheme, the lower surface of the lower test seat is connected to a lower base plate, and a vacuum air pipe joint is installed on the side surface of the lower base plate. A vacuum pipeline is arranged inside the lower test seat and the lower base plate, and one end of the vacuum pipeline is connected to the sealed cavity, and the other end is connected to the vacuum air pipe joint.

[0017] 8. In the above solution, an annular groove is provided on the upper surface of the lower substrate and located outside the vacuum pipeline, and an annular sealing strip is embedded in the annular groove.

[0018] 9. In the above solution, a sealing strip is provided between the lower surface of the upper test seat and the upper surface of the lower test seat, and the sealing strip extends continuously along the edges of the upper test seat and the lower test seat.

[0019] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0020] The adaptive chip testing equipment of the present invention, when in the testing state, the lower surface of the upper test seat and the upper surface of the lower test seat are tightly fitted and combined in the groove area to form a sealed cavity for placing the chip to be tested, and a PCB board and a partition are stacked in sequence above the upper test seat, and the fixedly connected upper test seat, PCB board and partition are connected to the support frame through a mounting plate arranged above the partition, one end of a pipeline passes through the mounting plate, partition, PCB board and upper test seat in sequence and is connected to the sealed cavity, and the other end of the pipeline is used to connect with the high-pressure gas source, and the chip is protected by the high-pressure gas, which can improve the safety of the chip in high-current and high-voltage test states; further, a strip through hole is opened on the upper surface of the support frame, and the lower parts of the two opposite inner walls of the strip through hole each have a first convex strip, and the upper parts of the two opposite side surfaces of the mounting plate each have a second convex strip corresponding to and extending to just above the first convex strip, each A strip block is provided above the second ridge, one side of the strip block is fixedly connected to the upper surface of the support frame, and the other side extends to directly above the second ridge and is connected to the second ridge through at least two springs. When in a non-test state, the lower surface of the second ridge overlaps and contacts the upper surface of the corresponding first ridge. When in a test state, the lower surface of the upper test seat is tightly attached to the upper surface of the lower test seat and a gap is formed between the lower surface of the second ridge and the upper surface of the corresponding first ridge. After the upper and lower test seats are molded, the horizontal plane reference of the upper test seat can be transferred to the lower test seat, and the spring can absorb slight offsets while continuously providing mold clamping pressure, thereby ensuring a smooth fit between the upper and lower test seats, which can not only improve the overall sealing and pressure resistance of the test seat, but also ensure the consistency of the contact resistance between each test probe and the corresponding pad area on the chip, thereby improving the consistency of the test data.

[0021] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0023] FIG1 is a schematic structural diagram of an adaptive chip testing device according to the present invention;

[0024] FIG2 is a schematic diagram of a partial structure of the adaptive chip testing device of the present invention;

[0025] Figure 3 is a schematic cross-sectional view along AA in Figure 2;

[0026] FIG4 is a second schematic diagram of the partial structure of the adaptive chip testing device of the present invention;

[0027] Figure 5 is a schematic cross-sectional view along line BB in Figure 4;

[0028] Figure 6 is an enlarged schematic diagram of point C in Figure 5;

[0029] FIG7 is a third schematic diagram of the partial structure of the adaptive chip testing device of the present invention;

[0030] FIG8 is a schematic diagram of an upper test socket of the adaptive chip testing device of the present invention;

[0031] FIG9 is a fourth schematic diagram of the partial structure of the adaptive chip testing device of the present invention;

[0032] Figure 10 is a schematic cross-sectional view along DD in Figure 9;

[0033] FIG11 is a schematic diagram of the film-closed state of the adaptive chip testing device of the present invention;

[0034] Figure 12 is an enlarged schematic diagram of point E in Figure 10;

[0035] Figure 13 is an enlarged schematic diagram of point F in Figure 10.

[0036] In the above figures: 100, chip to be tested; 1, support frame; 101, vertical part; 102, horizontal part; 2, movable plate; 3, upper test seat; 4, lower test seat; 5, mounting plate; 6, strip through hole; 71, first convex strip; 72, second convex strip; 8, strip block; 9, spring; 10, gap; 11, mounting groove; 12, sealing cavity; 13, PCB board; 14, partition; 15, pipeline; 16, groove; 171, limit convex block; 172, avoidance groove; 18, sealing strip; 19, mounting groove; 22, screw Bolt; 23. Nut; 24. Lifting hole; 25. Lifting bolt; 251. Column; 252. Cap; 26. Lifting nut; 27. Avoidance groove; 28. Countersunk groove; 29. ​​Gasket; 31. Mounting base plate; 32. Vertical guide rail; 33. Vertical slider; 34. Horizontal base; 35. Horizontal guide rail; 36. Horizontal slider; 37. T-block; 38. T-slot; 39. Bidirectional slide; 40. Lower base plate; 41. Vacuum air pipe joint; 42. Vacuum pipeline; 43. Annular groove; 44. Annular sealing strip. DETAILED DESCRIPTION

[0037] The present invention can be further understood by referring to the following specific examples, which, however, are not intended to limit the present invention.

[0038] Embodiment 1: An adaptive chip testing device comprises: a support frame 1 movable in the vertical direction and a movable plate 2 movable in the horizontal direction, an upper test seat 3 is installed on the support frame 1, a lower test seat 4 is installed on the movable plate 2 which can move with the movable plate 2 to just below the upper test seat 3, a groove is provided on the lower surface of the upper test seat 3, when the chip tester is in a testing state, the lower surface of the upper test seat 3 is tightly fitted with the upper surface of the lower test seat 4 and a sealed cavity 12 for placing the chip 100 to be tested is formed in the groove area, a PCB board 13 and a partition 14 are stacked in sequence above the upper test seat 3, the fixedly connected upper test seat 3, PCB board 13 and partition 14 are connected to the support frame 1 through a mounting plate 5 arranged above the partition 14, one end of a pipeline 15 passes through the mounting plate 5, partition 14, PCB board 13 and upper test seat 3 in sequence and is connected to the sealed cavity 12, and the other end of the pipeline 15 is used to be connected to a high-pressure gas source;

[0039] Move the movable plate to the loading and unloading station at the end of the horizontal base away from the mounting substrate to facilitate the placement and removal of the chip;

[0040] The chip to be tested is placed on the designated area of ​​the lower test seat above the movable plate, i.e., above the test probes, through the loading mechanism, so that the multiple test probes correspond one-to-one to the pad areas on the chip to be tested;

[0041] The upper surface of the support frame 1 is provided with a strip through hole 6, and the lower part of the two opposite inner walls of the strip through hole 6 is respectively provided with a first ridge 71, and the upper part of the two opposite side surfaces of the mounting plate 5 is respectively provided with a second ridge 72 corresponding to and extending to just above the first ridge 71, and a strip block 8 is provided above each of the second ridges 72, one side of the strip block 8 is fixedly connected to the upper surface of the support frame 1, and the other side extends to just above the second ridge 72 and is connected to the second ridge 72 through at least two springs 9. When the chip tester is in a non-testing state, the lower surface of the second ridge 72 overlaps and contacts the upper surface of the corresponding first ridge 71. When the chip tester is in a testing state, the lower surface of the upper test seat 3 is tightly fitted with the upper surface of the lower test seat 4, and a gap 10 is formed between the lower surface of the second ridge 72 and the upper surface of the corresponding first ridge 71;

[0042] The test seat installed on the mounting plate continues to move downward with the support frame and is subjected to an upward reaction force from the lower support seat. Under the action of the reaction force, the two second ridges on the mounting plate separate upward from the first ridge on the support frame, thereby forming a gap between the second ridge and the first ridge, and the spring continuously applies a downward pressure to the two second ridges on the mounting plate as a mold clamping pressure. At this time, the upper test seat installed on the mounting plate is in a floating state, and the conversion of the upper test seat plane reference from the support frame to the lower test seat is realized. The spring absorbs and balances the slight deviation on the horizontal plane, thereby achieving a tight and flat fit between the upper and lower test seats.

[0043] Each of the second protruding strips 72 is connected to the strip block 8 via five springs 9 that are evenly spaced along the length thereof.

[0044] The upper surface of the second protruding strip 72 and the lower surface of the strip block 8 are each provided with a mounting groove 11 for the end of the spring 9 to be embedded.

[0045] The above also includes: a vertically arranged mounting base 31, two vertical guide rails 32 are installed on the surface of one side of the mounting base 31 at intervals and in parallel, the vertical portion 101 of the support frame 1 and each vertical guide rail 32 are connected by at least two vertical sliders 33, so that the vertical guide rails 32 can move in the vertical direction, and the upper test seat 3 is installed on the horizontal portion 102 of the support frame 1, and the horizontal portion 102 is located at the upper end of the vertical portion 101 and extends to the other side of the mounting base 31.

[0046] A horizontal base 34 is installed on the other side surface of the above-mentioned mounting substrate 31 and below the horizontal portion 102 of the support frame 1. Two horizontal guide rails 35 are installed parallel and spaced apart on the upper surface of the horizontal base 34. The lower surface of the movable plate 2 is connected to each horizontal guide rail 35 by at least two horizontal sliders 36.

[0047] A T-shaped block 37 is provided on the lower surface of the movable plate 2 and between the two horizontal guide rails 35. A T-shaped slot 38 cooperating with the T-shaped block 37 is provided on the horizontal base 34. The T-shaped block 37 can be slidably embedded in the T-shaped slot 38 extending in the horizontal direction.

[0048] A bidirectional slide 39 is installed on the upper surface of the movable plate 2 , and the lower test seat 4 is installed on the bidirectional slide 39 .

[0049] The lower surface of the lower test seat 4 is connected to a lower base plate 40, and a vacuum air pipe joint 41 is installed on the side surface of the lower base plate 40. A vacuum pipe 42 is arranged inside the lower test seat 4 and the lower base plate 40. One end of the vacuum pipe 42 is connected to the sealed cavity 12, and the other end is connected to the vacuum air pipe joint 41.

[0050] An annular groove 43 is formed on the upper surface of the lower substrate 40 and outside the vacuum pipe 42 . An annular sealing strip 44 is embedded in the annular groove 43 .

[0051] A sealing strip 18 is provided between the lower surface of the upper test seat 3 and the upper surface of the lower test seat 4 . The sealing strip 18 extends continuously along the edges of the upper test seat 3 and the lower test seat 4 .

[0052] Embodiment 2: A chip testing machine comprises: a support frame 1 movable in the vertical direction and a movable plate 2 movable in the horizontal direction, an upper test seat 3 being installed on the support frame 1, a lower test seat 4 being installed on the movable plate 2 and movable with the movable plate 2 to be directly below the upper test seat 3, a groove being provided on the lower surface of the upper test seat 3 and the upper surface of the lower test seat 4, when the chip testing machine is in a testing state, the lower surface of the upper test seat 3 is tightly fitted with the upper surface of the lower test seat 4 and a sealed cavity 12 for placing the chip 100 to be tested is formed in the groove area, a PCB board 13 and a partition 14 are stacked in sequence above the upper test seat 3, the upper test seat 3, PCB board 13 and partition 14 being fixedly connected are connected to the support frame 1 through a mounting plate 5 arranged above the partition 14, one end of a pipeline 15 passes through the mounting plate 5, partition 14, PCB board 13 and upper test seat 3 in sequence and is connected to the sealed cavity 12, and the other end of the pipeline 15 is used to be connected to a high-pressure gas source;

[0053] The movable plate is pushed to move along the horizontal guide rail toward the mounting base plate by a horizontal drive component (such as a motor, a lead screw, or a cylinder) until the lower test seat is moved to the test station directly below the upper test seat;

[0054] The support frame is driven downward by a vertical drive component (such as a motor, a lead screw or a cylinder).

[0055] After the upper and lower test seats are molded together, high-pressure nitrogen is injected into the sealed cavity for protection before testing.

[0056] The upper surface of the support frame 1 is provided with a strip through hole 6, and the lower part of the two opposite inner walls of the strip through hole 6 is respectively provided with a first ridge 71, and the upper part of the two opposite side surfaces of the mounting plate 5 is respectively provided with a second ridge 72 corresponding to and extending to just above the first ridge 71, and a strip block 8 is provided above each of the second ridges 72, one side of the strip block 8 is fixedly connected to the upper surface of the support frame 1, and the other side extends to just above the second ridge 72 and is connected to the second ridge 72 through at least two springs 9. When the chip tester is in a non-testing state, the lower surface of the second ridge 72 overlaps and contacts the upper surface of the corresponding first ridge 71. When the chip tester is in a testing state, the lower surface of the upper test seat 3 is tightly fitted with the upper surface of the lower test seat 4, and a gap 10 is formed between the lower surface of the second ridge 72 and the upper surface of the corresponding first ridge 71;

[0057] As the support frame moves downward, the lower surface of the upper test seat first contacts the upper surface of the lower test seat, but there is still a slight deviation, which makes it impossible for the upper and lower test seats to completely fit together. The spring absorbs and balances the slight deviation on the horizontal plane, thereby achieving a tight and flat fit between the upper and lower test seats.

[0058] Each of the second protruding strips 72 is connected to the strip block 8 via seven springs 9 that are evenly spaced along the length thereof.

[0059] A mounting groove 11 for inserting the end of the spring 9 is provided on the lower surface of the strip block 8 .

[0060] A bidirectional slide 39 is installed on the upper surface of the movable plate 2 , and the lower test seat 4 is installed on the bidirectional slide 39 .

[0061] The lower surface of the lower test seat 4 is connected to a lower base plate 40, and a vacuum air pipe joint 41 is installed on the side surface of the lower base plate 40. A vacuum pipe 42 is provided inside the lower test seat 4 and the lower base plate 40. One end of the vacuum pipe 42 is connected to the sealed cavity 12, and the other end is connected to the vacuum air pipe joint 41.

[0062] An installation groove 19 for inserting the lower portion of the sealing strip 18 is provided at the edge of the upper surface of the lower test seat 4 . The upper surface of the sealing strip 18 is higher than the upper surface of the lower test seat 4 .

[0063] The stacked partition 14, PCB board 13 and upper test seat 3 are fixedly connected by at least two sets of bolts 22 and nuts 23. A plurality of lifting through holes 24 are opened on the upper surface of the mounting plate 5. A lifting bolt 25 passes through the lifting through hole 24 and is threadedly connected with a lifting nut 26 embedded in the partition 14. The inner diameter of the lifting through hole 24 is larger than the outer diameter of the columnar portion 251 of the lifting bolt 25. A gasket 26 is mounted on the columnar portion 251 of the lifting bolt 25. The gasket 26 is located between the upper surface of the mounting plate 5 and the cap portion 252 of the lifting bolt 25. The mounting plate 5 is installed on a support frame 1 that can move in the vertical direction.

[0064] The inner diameter of the hanging through hole 24 is larger than the outer diameter of the cap portion 252 of the hanging bolt 25 .

[0065] Each of the four bolts 22 passes through the upper test seat 3 , the PCB board 13 and the partition 14 in sequence from bottom to top and is threadedly connected to the nut 23 located above the partition 14 .

[0066] The lower surface of the mounting plate 5 is provided with four avoidance grooves 27 for the nuts 23 to be inserted into, and the inner diameter of the avoidance grooves 27 is much larger than the outer diameter of the nuts 23 .

[0067] The lower surface of the upper test seat 3 is provided with a countersunk groove 28 for the head of the nut 23 to be embedded in.

[0068] The working principle of the present invention is as follows:

[0069] Move the movable plate to the loading and unloading station at the end of the horizontal base away from the mounting substrate to facilitate the placement and removal of the chip;

[0070] The chip to be tested is placed on the designated area of ​​the lower test seat above the movable plate through the loading mechanism (i.e., above the test probes, and so that multiple test probes correspond one to one to the pad areas on the chip to be tested);

[0071] The movable plate is pushed to move along the horizontal guide rail toward the mounting base plate by a horizontal drive component (such as a motor, a lead screw, or a cylinder) until the lower test seat is moved to the test station directly below the upper test seat;

[0072] The support frame is driven downward by a vertical drive component (such as a motor, screw or cylinder). During this process:

[0073] First, the lower surface of the upper test seat, which moves downward with the support frame, first contacts the upper surface of the lower test seat, but there is still a slight deviation so that the upper and lower test seats cannot be completely fitted together.

[0074] Then, the test seat installed on the mounting plate continues to move downward with the support frame and is subjected to an upward reaction force from the lower support seat. Under the action of the reaction force, the two second ridges on the mounting plate separate upward from the first ridge on the support frame, thereby forming a gap between the second ridge and the first ridge, and the spring continuously applies a downward pressure to the two second ridges on the mounting plate as a clamping pressure. At this time, the upper test seat installed on the mounting plate is in a floating state, and the conversion of the upper test seat plane reference from the support frame to the lower test seat is realized, and the spring absorbs and balances the slight deviation on the horizontal plane, thereby achieving a tight and flat fit between the upper and lower test seats, which can not only improve the overall sealing and pressure resistance of the test seat, but also ensure the consistency of the contact resistance between each test probe and the corresponding pad area on the chip, thereby improving the consistency of the test data and avoiding sparking and probe ablation due to poor contact under high-pressure environment;

[0075] After the upper and lower test seats are molded together, high-pressure nitrogen is injected into the sealed cavity for protection before testing.

[0076] After the test is completed, the mold is opened, and the movable plate drives the lower test seat to move back to the loading and unloading station. The chip that has completed the test is then taken away by the unloading mechanism, and the loading mechanism re-inserts the next chip to be tested.

[0077] When using the above-mentioned chip testing machine, it protects the chip through high-pressure gas, which can improve the safety of the chip under high-current and high-voltage test conditions; it can also transfer the horizontal plane reference of the upper test seat to the lower test seat after the upper and lower test seats are clamped, and absorb small offsets while continuously providing clamping pressure through the spring, thereby ensuring a smooth fit between the upper and lower test seats, which can not only improve the overall sealing and pressure resistance of the test seat, but also ensure the consistency of the contact resistance between each test probe and the corresponding pad area on the chip, thereby improving the consistency of the test data.

[0078] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made in accordance with the spirit of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. An adaptive chip testing device, wherein: The adaptive chip testing device comprises: a support frame (1) movable in the vertical direction and a movable plate (2) movable in the horizontal direction, an upper test seat (3) being mounted on the support frame (1), and a lower test seat (4) being mounted on the movable plate (2) and being movable with the movable plate (2) to be directly below the upper test seat (3), characterized in that: a groove is provided on the lower surface of the upper test seat (3) and / or the upper surface of the lower test seat (4), and when the testing device is in a testing state, the lower surface of the upper test seat (3) and the upper surface of the lower test seat (4) are tightly attached to each other in the groove area. A sealed cavity (12) is formed in the domain for placing a chip (100) to be tested, a PCB board (13) and a partition (14) are sequentially stacked above the upper test seat (3), the upper test seat (3), the PCB board (13) and the partition (14) are fixedly connected to the support frame (1) via a mounting plate (5) arranged above the partition (14), one end of a pipeline (15) passes through the mounting plate (5), the partition (14), the PCB board (13) and the upper test seat (3) in sequence and is connected to the sealed cavity (12), and the other end of the pipeline (15) is used to be connected to a high-pressure gas source; The upper surface of the support frame (1) is provided with a strip through hole (6), and the lower parts of the two opposite inner walls of the strip through hole (6) each have a first convex strip (71), and the upper parts of the two opposite side surfaces of the mounting plate (5) each have a second convex strip (72) correspondingly extending to the top of the first convex strip (71), and a strip block (8) is arranged above each of the second convex strips (72), one side of the strip block (8) is fixedly connected to the upper surface of the support frame (1), and the other side extends to the second convex strip (71). The upper test seat (3) and the lower test seat (4) are connected to the second convex strip (72) via at least two springs (9); when the test device is in a non-testing state, the lower surface of the second convex strip (72) overlaps and contacts the upper surface of the corresponding first convex strip (71); when the test device is in a testing state, the lower surface of the upper test seat (3) and the upper surface of the lower test seat (4) are tightly fitted and a gap (10) is formed between the lower surface of the second convex strip (72) and the upper surface of the corresponding first convex strip (71).

2. The adaptive chip testing device according to claim 1, wherein: Each of the second convex strips (72) is connected to the strip-shaped block (8) via 4 to 8 springs (9) arranged at equal intervals along the length direction thereof.

3. The adaptive chip testing device according to claim 1 or 2, wherein: The upper surface of the second convex strip (72) and / or the lower surface of the strip block (8) is provided with a mounting groove (11) for the end of the spring (9) to be embedded.

4. The adaptive chip testing device according to claim 1, further comprising: A vertically arranged mounting base plate (31), on one side surface of which two vertical guide rails (32) are installed at intervals and in parallel, the vertical portion (101) of the support frame (1) and each vertical guide rail (32) are respectively connected by at least two vertical sliders (33), so that the vertical guide rail (32) can move in the vertical direction, and the upper test seat (3) is installed on the horizontal portion (102) of the support frame (1), and the horizontal portion (102) is located at the upper end of the vertical portion (101) and extends to the other side of the mounting base plate (31).

5. The adaptive chip testing device according to claim 4, wherein: A horizontal base (34) is installed on the other side surface of the mounting substrate (31) and below the horizontal portion (102) of the support frame (1). Two horizontal guide rails (35) are installed in parallel and at intervals on the upper surface of the horizontal base (34). The lower surface of the movable plate (2) is connected to each horizontal guide rail (35) via at least two horizontal sliders (36).

6. The adaptive chip testing device according to claim 5, wherein: A T-shaped block (37) is provided on the lower surface of the movable plate (2) and between the two horizontal guide rails (35); a T-shaped slot (38) cooperating with the T-shaped block (37) is provided on the horizontal base (34); the T-shaped block (37) can be slidably embedded in the T-shaped slot (38) extending in the horizontal direction.

7. The adaptive chip testing device according to claim 1, wherein: A bidirectional slide table (39) is installed on the upper surface of the movable plate (2), and the lower test seat (4) is installed on the bidirectional slide table (39).

8. The adaptive chip testing device according to claim 1, wherein: The lower surface of the lower test seat (4) is connected to a lower base plate (40), a vacuum air pipe joint (41) is installed on the side surface of the lower base plate (40), and a vacuum pipeline (42) is arranged inside the lower test seat (4) and the lower base plate (40), one end of the vacuum pipeline (42) is connected to the sealing cavity (12), and the other end is connected to the vacuum air pipe joint (41).

9. The adaptive chip testing device according to claim 9, wherein: An annular groove (43) is provided on the upper surface of the lower substrate (40) and located outside the vacuum pipeline (42), and an annular sealing strip (44) is embedded and installed in the annular groove (43).

10. The adaptive chip testing device according to claim 1, wherein: A sealing strip (18) is provided between the lower surface of the upper test seat (3) and the upper surface of the lower test seat (4), and the sealing strip (18) extends continuously along the edges of the upper test seat (3) and the lower test seat (4).

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