Wafer polishing system

Abstract

A wafer polishing system, comprising: a front-end module (1); a wafer polishing unit (2), comprising a polishing transmission mechanism (21); a wafer cleaning unit (3); and a wafer transmission channel (4) extending at least on the wafer cleaning unit (3). The front-end module (1), the wafer cleaning unit (3), and the wafer polishing unit (2) are sequentially arranged adjacent to each other; a first transfer station (51), a second transfer station (52), a third transfer station (53), a first transmission device (61), and a second transmission device (62) are provided in the wafer transmission channel (4); the first transmission device (61) is used for implementing wafer transmission between the first transfer station (51) and the second transfer station (52); the second transmission device (62) is used for implementing wafer transmission between the second transfer station (52) and the third transfer station (53); and the third transfer station (53) is further used for wafer transmission and transferring between the wafer cleaning unit (3) and the wafer polishing unit (2). The wafer transmission stroke in the wafer transmission channel (4) is divided into two sections which are respectively completed by the first transmission device (61) and the second transmission device (62), such that the volume is reduced, complex actions can be carried out in a narrow space, and the transmission speed is higher; and more process possibilities can be achieved by setting different transmission forms.

Description

Wafer polishing system Technical Field

[0001] The present invention belongs to the technical field of semiconductor integrated circuit chip manufacturing, and in particular relates to a wafer polishing system. Background Art

[0002] Chemical Mechanical Planarization (CMP) equipment typically consists of a semiconductor front-end module (EFEM), a cleaning unit, and a polishing unit. The EFEM primarily includes a wafer cassette, a wafer handling robot, and an air purification system. The cleaning unit primarily comprises varying numbers of megasonic cleaning components, roller brush cleaning components, drying components, and wafer transfer devices between components. The polishing unit typically includes a worktable, polishing plate, polishing head, polishing arm, dresser, and polishing fluid arm, each of which is arranged on the worktable according to the process location. Wafers depart from the EFEM and are transported through a series of conveyor systems to the polishing unit for a combination of mechanical and chemical planarization. After polishing, the wafers are then transported through a series of conveyor systems to a cleaning area, where they are cleaned of surface impurities and dried before returning to the EFEM's wafer cassette.

[0003] Since wafers need to undergo different processes at different workstations inside the CMP equipment, the transmission of wafers inside the equipment is extremely important, which seriously affects the output of the equipment and the yield of the wafers. Therefore, the transmission system is required to be fast, stable and accurate.

[0004] The difficulties in the transmission layout of existing CMP equipment are: 1) the available space is limited, and the wafer transfer system is usually required to have the ability to perform complex movements. Most existing equipment uses the purchase of dedicated robots, which is costly, has poor maintainability, and poor scalability, limited by the functions of the robot itself; 2) the transmission efficiency is low. Usually, a transmission component needs to complete multiple steps of wafer transfer actions continuously, so it takes a long time to complete an action cycle, resulting in low efficiency in wafer transfer between workstations, which is not conducive to increasing equipment output; 3) poor compatibility, which is not conducive to the expansion of equipment and processes.

[0005] Summary of the Invention

[0006] In order to overcome the deficiencies of the prior art, the present invention provides a wafer polishing system, which can complete complex wafer transfer actions in a small space with a fast transfer speed and improved transfer efficiency.

[0007] The technical solution adopted by the present invention to solve the technical problem is: a wafer polishing system, comprising:

[0008] Front-end module;

[0009] Wafer polishing unit, including a polishing transmission mechanism;

[0010] Wafer cleaning unit;

[0011] a wafer transfer channel extending at least to the wafer cleaning unit;

[0012] The front-end module, wafer cleaning unit and wafer polishing unit are arranged adjacent to each other in sequence;

[0013] The wafer transfer channel is provided with a first transfer station, a second transfer station, a third transfer station, a first transfer device, and a second transfer device;

[0014] The first transfer device is used to realize wafer transfer between the first transfer station and the second transfer station;

[0015] The second transmission device is used to realize wafer transmission between the second transfer station and the third transfer station;

[0016] The third transfer station is also used for wafer transfer between the wafer cleaning unit and the wafer polishing unit.

[0017] Furthermore, the third transfer station includes at least two working heights, and the third transfer station is provided with a third transfer platform;

[0018] At the first working height, the wafer is transferred between the second transfer station and the third transfer station;

[0019] At the second working height, the third turntable receives the wafers transferred from the polishing transmission mechanism.

[0020] Furthermore, the transmission of the pair of wafers by the transmission device includes translation of the wafers, or flipping of the wafers, or both translation and flipping of the wafers;

[0021] The transmission of the wafer by the second transmission device includes translating the wafer, or flipping the wafer, or translating and flipping the wafer.

[0022] Furthermore, the transmission device 1 and the transmission device 2 are located on the same side of the first transfer station; or, the transmission device 1 and the transmission device 2 are located on opposite sides of the first transfer station; or, the transmission device 1 and the transmission device 2 are located between the first transfer station and the second transfer station; or, the transmission device 1 and the transmission device 2 are located between the second transfer station and the third transfer station.

[0023] Furthermore, the transmission device 1 and / or the transmission device 2 includes a slide extending along the wafer transmission channel, and a wafer seat that can be translated along the slide, and the wafer seat is used to support the wafer to achieve translational transmission of the wafer.

[0024] Furthermore, the transmission device 1 and / or the transmission device 2 includes a rotating body that can rotate around its own central axis, an extension arm connected to the rotating body, and a transfer platform connected to the extension arm. The extension arm swings with the rotating body to drive the wafer on the transfer platform to be transferred along an arc trajectory.

[0025] Furthermore, the extending arm includes a plurality of folding arm bodies that are movably connected.

[0026] Furthermore, the transmission device 1 or the transmission device 2 includes a flip shaft and a clamping arm connected to the flip shaft. The clamping arm is used to clamp the wafer and can drive the wafer to flip as the flip shaft moves.

[0027] Furthermore, the transmission device 1 or the transmission device 2 includes a horizontal transverse axis, a vertical longitudinal axis movable along the horizontal transverse axis, a base movable along the vertical longitudinal axis, and a clamping claw for clamping the wafer.

[0028] Furthermore, the transmission device 1 or the transmission device 2 also includes a flip body movably connected to the base, the clamping claw is provided on the flipping body, and the flipping body drives the clamping claw to flip to realize the flipping of the wafer.

[0029] Furthermore, the transmission device 1 or the transmission device 2 includes a base, a lifting mechanism movably connected to the base, at least one connecting rod connected to the lifting mechanism, a finger drive box, and fingers for clamping or adsorbing wafers.

[0030] Furthermore, the wafer cleaning unit includes a cleaning area 1 and a cleaning area 2 located on both sides of the wafer transmission channel, and the cleaning area 1 and the cleaning area 2 each include a plurality of cleaning boxes.

[0031] Furthermore, a cache box is provided in the wafer cleaning unit or the wafer polishing unit, and the third transfer station is arranged corresponding to the cache box.

[0032] Furthermore, the front-end module includes a front-end transmission mechanism, which is used to realize wafer transmission between the front-end module and the first transfer station.

[0033] The beneficial effects of the present invention are as follows: 1) the wafer transmission journey in the wafer transmission channel is divided into two sections, which are respectively completed by the transmission device 1 and the transmission device 2, so that the volume of the transmission device 1 and the transmission device 2 is reduced, and they can perform complex actions in a small space, and the transmission speed is faster; 2) the process is flexible, and more process possibilities can be realized by setting different transmission forms (wafer flipping, wafer translation, etc.), such as single-sided polishing and double-sided polishing; 3) the transmission efficiency is improved, more wafers are in the transmission process at the same time, the idle time of the transfer station is reduced, and the ability of the machine transmission system to transmit wafers is improved; 4) the layout is more reasonable, the space utilization rate is high, and the wafer can be transferred to the second intermediate position through the transmission device 2. The switching between the transfer station and the third transfer station realizes a more reasonable logic for the wafers entering and exiting the wafer polishing unit; 5) The structure is simple and the transmission is more stable. Only simple translation or flipping and other actions are required between the transfer stations. The hardware structure requirements are low, which is conducive to improving the stability of the equipment; 6) The third transfer station sets the transfer transmission of polished wafers and unpolished wafers at different working heights to avoid mutual contamination between the two; 7) The equipment has stronger expandability and compatibility, and different equipment or process requirements can be achieved by changing only one transmission step; 8) The transmission efficiency is high. The transmission device 1 and the transmission device 2 each realize specific actions, and each action is in a specific space, reducing mutual avoidance between movements. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG1 is a top view of the layout of the wafer polishing system provided by the present invention.

[0035] FIG2 is a schematic diagram of the coordinated structure of the transmission device 1, the third turntable and the polishing transmission mechanism in the first embodiment of the present invention.

[0036] FIG3 is a schematic structural diagram of the transmission device 1 or the transmission device 2 in the second embodiment of the present invention.

[0037] FIG4 is a schematic structural diagram of the transmission device 1 or the transmission device 2 in the third embodiment of the present invention.

[0038] FIG5 is a schematic structural diagram of the transmission device 1 or the transmission device 2 in the fourth embodiment of the present invention.

[0039] FIG6 is a schematic structural diagram of the transmission device 1 or the transmission device 2 in the fifth embodiment of the present invention.

[0040] FIG7 is a schematic structural diagram of the transmission device 1 or the transmission device 2 in the sixth embodiment of the present invention.

[0041] FIG8 is a schematic structural diagram of the cache box in the present invention.

[0042] Among them, 1-front-end module, 11-front-end transmission mechanism, 2-wafer polishing unit, 21-polishing transmission mechanism, 3-wafer cleaning unit, 31-cleaning area 1, 32-cleaning area 2, 33-cleaning box, 34-cache box, 341-water spray device, 35-cleaning robot, 36-drying box, 4-wafer transmission channel, 51-first transfer station, 52-second transfer station, 53-third transfer station, 531-third transfer table, 61- Transmission device 1, 62-Transmission device 2, 631-slide, 632-wafer seat, 641-rotating body, 642-extension arm, 643-transfer base, 651-flip axis, 652-clamping arm, 661-horizontal transverse axis, 662-vertical longitudinal axis, 663-base, 664-clamping claw, 665-flip body, 671-base, 672-lifting mechanism, 673-connecting rod, 674-finger drive box, 675-finger, 7-wafer. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0044] As shown in Figure 1, a wafer polishing system includes a front-end module 1, a wafer polishing unit 2, a wafer cleaning unit 3, and a wafer transfer channel 4. The wafer transfer channel 4 extends at least within the wafer cleaning unit 3. The wafer polishing unit 2 includes a polishing transfer mechanism 21. The front-end module 1 includes a front-end transfer mechanism 11. A cleaning robot 35 is provided in the wafer cleaning unit 3. A cache box 34 is provided in the wafer cleaning unit 3 or the wafer polishing unit 2.

[0045] In this embodiment, the front-end module 1, wafer cleaning unit 3, and wafer polishing unit 2 are arranged adjacent to each other. The wafer cleaning unit 3 includes a cleaning zone 1 31 and a cleaning zone 2 32 located on either side of the wafer transfer channel 4. Both cleaning zones 1 31 and 32 include multiple cleaning tanks 33. These zones 1 31 and 32 can be arranged symmetrically or unequally, with different combinations and sequences configured depending on the specific equipment requirements. Drying boxes 36 can be located near the ends of both cleaning zones 1 31 and 32, near the front-end module 1.

[0046] The wafer transfer channel 4 is provided with a first transfer station 51 , a second transfer station 52 , a third transfer station 53 , a first transfer device 61 , and a second transfer device 62 .

[0047] The first transfer device 61 is used to transfer wafers between the first transfer station 51 and the second transfer station 52. The second transfer device 62 is used to transfer wafers between the second transfer station 52 and the third transfer station 53. The third transfer station 53 is also used for transferring wafers between the wafer cleaning unit 3 and the wafer polishing unit 2.

[0048] The transmission of the wafer 7 by the transmission device 61 includes translating the wafer; or, includes flipping the wafer, that is, completing the flipping of the wafer; or, includes both translating the wafer and flipping the wafer.

[0049] Similarly, the transmission of the wafer 7 by the second transmission device 62 includes translating the wafer; or, includes flipping the wafer, that is, completing the flipping of the wafer; or, includes both translating the wafer and flipping the wafer.

[0050] Regarding the relative positional relationship between the transmission device 1 61, the transmission device 2 62, the first transfer station 51, the second transfer station 52 and the third transfer station 53, and their positional relationship with the wafer transmission channel 4, specifically, the transmission device 1 61 and the transmission device 2 62 can be located on the same side of the first transfer station 51; or, the transmission device 1 61 and the transmission device 2 62 can be located on opposite sides of the first transfer station 51; in the above two cases, the transmission device 1 61 and the transmission device 2 62 are located on opposite sides of the wafer transmission channel 4.

[0051] Alternatively, the transmission device 1 61 and the transmission device 2 62 can be located between the first transfer station 51 and the second transfer station 52; or, the transmission device 1 61 and the transmission device 2 62 can be located between the second transfer station 52 and the third transfer station 53; in the above two cases, the transmission device 1 61 and the transmission device 2 62 are located in the relative middle position of the wafer transmission channel 4.

[0052] In this embodiment, the first transfer station 51, the second transfer station 52 and the third transfer station 53 can be virtual working positions, that is, the transfer station is a three-dimensional concept, and its projection in the vertical direction is fixed, but it can extend upward or downward in the vertical direction, and is not limited to a specific point. In other words, the transfer station is three-dimensional in the Z-axis direction and relatively fixed in the X-axis and Y-axis directions; of course, the transfer station can also be a physical workbench structure.

[0053] The third transfer station 53 is arranged corresponding to the position of the cache box 34 , that is, when the cache boxes 34 are symmetrically provided in the cleaning area 1 31 and the cleaning area 2 32 , the third transfer station 53 is arranged between the two cache boxes 34 .

[0054] The third transfer station 53 includes at least two working heights, and the third transfer station 53 is provided with a third transfer platform 531 , that is, the third transfer station 53 has a physical workbench structure.

[0055] At the first working height, the wafer is transferred between the second transfer station 52 and the third transfer station 53 ; at the second working height, the third transfer table 531 receives the wafer 7 transferred from the polishing transfer mechanism 21 .

[0056] In the present invention, the front-end module 1 is responsible for storing wafers and placing them on the first transfer station 51, providing unpolished wafers to the equipment. The front-end transport mechanism 11 is used to transfer wafers between the front-end module 1 and the first transfer station 51. Specifically, the front-end transport mechanism 11 is responsible for transferring wafers to be polished and placing them on the first transfer station 51, as well as transferring polished wafers that have been cleaned in the drying oven 36.

[0057] The buffer box 34 receives the polished wafers from the third transfer station 53 and prepares the wafers for entering the wafer cleaning unit 3 for cleaning; the cleaning robot 35 is responsible for transferring the wafers 7 between the multiple cleaning boxes 33 in the wafer cleaning unit 3; the polishing transfer mechanism 21 is responsible for the wafers entering and exiting the wafer polishing unit 2, and it can move in the wafer transfer channel 4, that is, at this time the wafer transfer channel 4 not only extends in the wafer cleaning unit 3, but also extends in the wafer polishing unit 2.

[0058] The third transfer station 53 is responsible for receiving the polished wafers from the wafer polishing unit 2, and the second transfer station 52 is responsible for receiving the unpolished wafers from the first transfer station 51, and moving the unpolished wafers to the top of the third transfer station 53, waiting for the polishing transfer mechanism 21 to take the wafers into the polishing area of ​​the wafer polishing unit 2.

[0059] Example 1

[0060] As shown in FIG2 , the first transfer device 61 includes a slide 631 extending along the wafer transfer channel 4 and a wafer base 632 that can translate along the slide 631 . The wafer base 632 is used to support the wafer 7 , specifically, to support the wafer 7 horizontally, thereby enabling translational transfer of the wafer 7 . That is, the wafer 7 can be translated and transferred from the first transfer station 51 to the second transfer station 52 .

[0061] In this embodiment, the transmission of the wafer 7 by the transmission device 1 61 includes the translation of the wafer, but does not include the flipping of the wafer.

[0062] The structure of the second transmission device 62 may be the same as or different from that of the first transmission device 61 .

[0063] When the transmission structure is the same, the wafer transmission process of the present invention is as follows: the front-end transmission mechanism 11 transfers the unpolished wafer to the first transfer station 51, the transmission device 1 61 transfers the wafer 7 on the first transfer station 51 to the second transfer station 52, that is, the wafer seat is translated along the slide to the second transfer station, and the transmission device 2 62 transfers the wafer 7 on the second transfer station 52 to the third transfer station 53, that is, another wafer seat 632 is translated along the slide 631 to the third transfer station 53. At this time, the third transfer station 53 is at the first working height;

[0064] The polishing transfer mechanism 21 can be moved to the top of the third transfer station 53 and can remove the unpolished wafer on the wafer base 632 by lifting. The implementation of the above function is existing technology and will not be repeated here.

[0065] The polishing transfer mechanism 21 transfers the unpolished wafer to the polishing area of ​​the wafer polishing unit 2 for polishing; the wafer holder 632 moves along the slide 631 to the second transfer station 52, waiting for the next unpolished wafer to be transferred from the front-end module 1; at this time, the polishing transfer mechanism 21 also makes way for the polished wafer to be placed on the third transfer table 531;

[0066] When the wafer 7 is polished, the polishing transfer mechanism 21 clamps the polished wafer and moves it to the top of the third transfer station 53. The polishing transfer mechanism 21 is lifted and lowered to place the wafer on the third transfer table 531. At this time, the third transfer table 531 is at the second working height.

[0067] The wafers on the third transfer table 531 are transferred to the buffer box 34. The state of the wafer 7 in the buffer box 34 is shown in FIG8. In order to keep the wafers moist and rinse away some of the polishing residual liquid, a plurality of water spray devices 341 are provided in the buffer box 34.

[0068] The cleaning robot 35 transfers the wafers 7 among the multiple cleaning boxes 33 in a certain order, and finally moves them to the drying box 36. After the wafers are dried, they are transferred to a designated place by the front-end transmission mechanism 11.

[0069] Example 2

[0070] As shown in Figure 3, the transfer device 1 61 includes a rotating body 641 that can rotate about its own central axis, an extension arm 642 connected to the rotating body 641, and a transfer platform 643 connected to the extension arm 642. The rotating body 641 is fixedly installed in the wafer transfer channel 4 and can be a motor or a rotary cylinder; the extension arm 642 swings with the rotating body 641, thereby driving the wafer 7 on the transfer platform 643 along an arc trajectory, thereby transferring the wafer 7 from the first transfer station 51 to the second transfer station 52.

[0071] In this embodiment, the transmission of the wafer 7 by the transmission device 1 61 includes the translation of the wafer, but does not include the flipping of the wafer.

[0072] In order to increase flexibility and adaptability to working conditions, the extending arm 642 may include a plurality of movably connected folding arm bodies, and adjacent folding arm bodies are rotatably connected to each other.

[0073] The structure of the second transmission device 62 may be the same as or different from that of the first transmission device 61 .

[0074] Example 3

[0075] As shown in Figure 4, the transmission device 61 includes a flip shaft 651 and a clamping arm 652 connected to the flip shaft 651. The flip shaft 651 extends along the width direction of the wafer transmission channel 4, and its end can be rotated and connected at any position. Of course, the flip shaft 651 can also be a motor or a rotating cylinder. The clamping arm 652 is used to clamp the wafer 7 and can move with the flip shaft 651, thereby driving the wafer 7 to flip, that is, to realize the flipping of the wafer 7, that is, the rotation angle of the flip shaft 651 is 180°.

[0076] In this embodiment, the transfer of the wafer 7 by the transfer device 1 61 includes flipping the wafer, but does not include translating the wafer.

[0077] The structure of the second transmission device 62 may be the same as or different from that of the first transmission device 61 .

[0078] Example 4

[0079] As shown in FIG5 , the transport device 1 61 includes a horizontal axis 661 extending along the wafer transport channel 4, a vertical axis 662 movable along the horizontal axis 661, a base 663 movable along the vertical axis 662, a flip body 665 movably connected to the base 663, and a clamping jaw 664 for clamping the wafer 7. The clamping jaw 664 is disposed on the flip body 665, so that the flip body 665 drives the clamping jaw 664 to flip and turn the wafer 7. Here, the clamping jaw 664 clamps the wafer 7 in a horizontal position, and the flip axis of the flip body 665 is perpendicular to the extension direction of the horizontal axis 661.

[0080] In this embodiment, the transfer of the wafer 7 by the transfer device 1 61 includes translating and flipping the wafer.

[0081] The structure of the second transmission device 62 may be the same as or different from that of the first transmission device 61 .

[0082] The first transfer device 61 of this embodiment is compatible with two motion modes, corresponding to flipping and non-flipping. After the wafer completes polishing on the first side, it can enter the transfer process again. During the second transfer process, the first transfer device 61 transfers according to another embodiment. When the wafer reaches the second transfer station 52, the wafer state is opposite to that of the first transfer process. If the subsequent transfer movement is the same as the first transfer process, the wafer can complete the second side polishing.

[0083] Of course, the above is an embodiment when the transmission device 1 61 is compatible with two motion modes. When any one of the transmission modes of the front-end transmission mechanism 11, the transmission device 1 61, and the transmission device 2 62 has two motion modes, the double-sided polishing effect of the wafer can be achieved.

[0084] Example 5

[0085] As shown in Figure 6, the difference between this embodiment and the fourth embodiment is that the base 663 is directly movably connected to the vertical longitudinal axis 662. At this time, there is no flip body 665, and the clamping jaw 664 cannot flip. It can only be raised and lowered along the vertical longitudinal axis 662 through the base 663, and translated left and right on the horizontal transverse axis 661 through the vertical longitudinal axis 662.

[0086] In this embodiment, the transmission of the wafer 7 by the transmission device 1 61 includes the translation of the wafer, but does not include the flipping of the wafer.

[0087] The structure of the second transmission device 62 may be the same as or different from that of the first transmission device 61 .

[0088] Example 6

[0089] As shown in FIG7 , the transfer device 61 includes a base 671 , a lifting mechanism 672 movably connected to the base 671 , at least one connecting rod 673 connected to the lifting mechanism 672 , a finger drive box 674 , and fingers 675 for clamping or adsorbing the wafer 7 .

[0090] In order to increase flexibility and adaptability to working conditions, there are two or more connecting rods 673 , and adjacent connecting rods 673 are rotationally connected.

[0091] Finger 675 is connected to finger drive box 674, which has built-in cylinders or negative pressure components, allowing finger 675 to carry wafers by gripping or suction. A rotary cylinder, sizing rack, motor, or other devices can also be built into finger drive box 674 to enable finger 675 to rotate. Finger drive box 674 is connected to connecting rod 673. Belts, gears, or other mechanisms can be installed between finger drive box 674 and connecting rod 673, between adjacent connecting rods 673, and between connecting rod 673 and lifting mechanism 672 to allow relative rotation between the connection points. This mutual rotation of the various components forms a telescopic mechanism. A cylinder, lead screw, or sizing rack can be installed between lifting mechanism 672 and base 671, allowing lifting mechanism 672 to rise and fall relative to base 671 and to rotate as a whole relative to base 671.

[0092] In this embodiment, the transfer of the wafer 7 by the transfer device 1 61 includes translating and flipping the wafer.

[0093] The structure of the second transmission device 62 may be the same as or different from that of the first transmission device 61 .

[0094] Example 7

[0095] The wafer 7 is in a vertical state when in the cleaning box 33; when in the drying box 36, the wafer 7 is in a horizontal or vertical state depending on the specific drying method selected; the wafer 7 is in a horizontal state when in the first transfer station 51, the second transfer station 52, and the third transfer station 53.

[0096] Since the wafer is facing up and the back side facing down in the front-end transmission mechanism 11, but when the wafer is polished in the polishing area of ​​the wafer polishing unit 2, the wafer is required to face down and the back side facing up, so the wafer needs to be flipped over to reverse the wafer direction.

[0097] Therefore, in this embodiment, the transmission device 1 61 adopts the specific structure of the embodiment 1, and the transmission device 2 62 adopts the specific structure of the embodiment 4 to realize the transmission and flipping of the wafer.

[0098] Example 8

[0099] Of course, the wafer may not be turned over, that is, the first transmission device 61 and the second transmission device 62 only perform translational transmission of the wafer.

[0100] In this embodiment, the transmission device 1 61 adopts the specific structure of the embodiment 1, and the transmission device 2 62 adopts the specific structure of the embodiment 5 to realize the transmission of wafers.

[0101] Example 9

[0102] In this embodiment, the transmission device 1 61 selects any structure of the first, second and fifth embodiments, and the transmission device 2 62 selects any structure of the third, fourth and sixth embodiments.

[0103] The above specific embodiments are used to illustrate the present invention rather than to limit the present invention. Any modifications and changes made to the present invention within the spirit of the present invention and the protection scope of the claims shall fall within the protection scope of the present invention.

Claims

1. A wafer polishing system, comprising: Front end module (1); A wafer polishing unit (2) comprising a polishing transmission mechanism (21); Wafer cleaning unit (3); A wafer transfer channel (4) extending at least in the wafer cleaning unit (3); The front-end module (1), the wafer cleaning unit (3) and the wafer polishing unit (2) are arranged adjacent to each other in sequence; and are characterized in that: The wafer transfer channel (4) is provided with a first transfer station (51), a second transfer station (52), a third transfer station (53), a first transfer device (61), and a second transfer device (62); The transmission device 1 (61) is used to realize wafer transmission between the first transfer station (51) and the second transfer station (52); The second transmission device (62) is used to realize wafer transmission between the second transfer station (52) and the third transfer station (53); The third transfer station (53) is also used for wafer transmission and transfer between the wafer cleaning unit (3) and the wafer polishing unit (2).

2. The wafer polishing system according to claim 1, characterized in that: The third transfer station (53) includes at least two working heights, and the third transfer station (53) is provided with a third transfer table (531); At the first working height, the wafer is transferred between the second transfer station (52) and the third transfer station (53); At the second working height, the third transfer table (531) receives the wafer (7) transferred from the polishing transfer mechanism (21).

3. The wafer polishing system according to claim 1, characterized in that: The transmission of the wafer (7) by the transmission device 1 (61) includes translation of the wafer, or flipping of the wafer, or translation and flipping of the wafer; The transmission of the wafer (7) by the second transmission device (62) includes translation of the wafer, or flipping of the wafer, or translation and flipping of the wafer.

4. The wafer polishing system according to claim 1, characterized in that: The transmission device 1 (61) and the transmission device 2 (62) are located on the same side of the first transfer station (51); or, the transmission device 1 (61) and the transmission device 2 (62) are located on the opposite side of the first transfer station (51); or, the transmission device 1 (61) and the transmission device 2 (62) are located between the first transfer station (51) and the second transfer station (52); or, the transmission device 1 (61) and the transmission device 2 (62) are located between the second transfer station (52) and the third transfer station (53).

5. The wafer polishing system according to claim 1, characterized in that: The transmission device 1 (61) and / or the transmission device 2 (62) comprises a slide table (631) extending along the wafer transmission channel (4), and a wafer seat (632) which can be translated along the slide table (631), and the wafer seat (632) is used to support the wafer (7) to realize the translation transmission of the wafer (7).

6. The wafer polishing system according to claim 1, characterized in that: The transmission device 1 (61) and / or the transmission device 2 (62) includes a rotating body (641) that can rotate around its own central axis, an extension arm (642) connected to the rotating body (641), and a transfer platform (643) connected to the extension arm (642), and the extension arm (642) swings with the rotating body (641) to drive the wafer (7) on the transfer platform (643) to be transferred along an arc trajectory.

7. The wafer polishing system according to claim 6, characterized in that: The extending arm (642) includes a plurality of folding arm bodies that are movably connected.

8. The wafer polishing system according to claim 1, characterized in that: The transmission device 1 (61) or the transmission device 2 (62) comprises a flip shaft (651) and a clamping arm (652) connected to the flip shaft (651). The clamping arm (652) is used to clamp the wafer (7) and can drive the wafer (7) to flip along with the movement of the flip shaft (651).

9. The wafer polishing system according to claim 1, characterized in that: The transmission device 1 (61) or the transmission device 2 (62) includes a horizontal transverse axis (661), a vertical longitudinal axis (662) movable along the horizontal transverse axis (661), a base (663) movable along the vertical longitudinal axis (662), and a clamp (664) for clamping a wafer (7).

10. The wafer polishing system according to claim 9, characterized in that: The transmission device 1 (61) or the transmission device 2 (62) further comprises a flipping body (665) movably connected to the base (663), the clamping claw (664) being arranged on the flipping body (665), and the flipping body (665) drives the clamping claw (664) to flip so as to realize the turning over of the wafer (7).

11. The wafer polishing system according to claim 1, characterized in that: The transmission device 1 (61) or the transmission device 2 (62) comprises a base (671), a lifting mechanism (672) movably connected to the base (671), at least one connecting rod (673) connected to the lifting mechanism (672), a finger drive box (674), and fingers (675) for clamping or adsorbing a wafer (7).

12. The wafer polishing system according to claim 1, characterized in that: The wafer cleaning unit (3) comprises a cleaning area 1 (31) and a cleaning area 2 (32) located on both sides of a wafer transmission channel (4); the cleaning area 1 (31) and the cleaning area 2 (32) both comprise a plurality of cleaning boxes (33).

13. The wafer polishing system according to claim 1, characterized in that: The wafer cleaning unit (3) or the wafer polishing unit (2) is provided with a cache box (34), and the third transfer station (53) is arranged corresponding to the cache box (34).

14. The wafer polishing system according to claim 1, characterized in that: The front-end module (1) comprises a front-end transmission mechanism (11) which is used to realize wafer transmission between the front-end module (1) and the first transfer station (51).

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