Distributed network controls apparatus for substrate handlers

Abstract

A linear electrical machine includes a frame, an array of electromagnets, and at least one reaction platen, where excitation of the electromagnets generates levitation and propulsion forces against the at least one reaction platen that controllably levitate and propel the at least one reaction platen along at least one drive line, in a controlled attitude relative to the drive plane. A controller system with coil controllers sequentially excites the electromagnets with a predetermined excitation characteristic so as to describe six degree of freedom reaction platen control of each of the at least one reaction platen, and the at least one reaction platen is levitated and propelled with at least four degrees of freedom. Each respective coil controller is coupled to electromagnets at a predetermined location so that the electromagnets at the corresponding predetermined location are controlled by the respective coil controller separate and distinct from each other coil controller.

Description

Atty. Docket No.390P017053-WO (PCT) DISTRIBUTED NETWORK CONTROLS APPARATUS FOR SUBSTRATE HANDLERS CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a non-provisional of and claims the benefit of United States provisional patent application number 63 / 597,250 filed on November 8, 2023, the disclosure of which is incorporated herein by reference in its entirety. BACKGROUND 1. Field

[0002] The present disclosure generally relates to substrate processing equipment, and more particularly, to substrate transports of the substrate processing equipment. 2. Brief Description of Related Developments

[0003] Magnetically levitated transports for substrate processing equipment generally include independently controlled coils that provide magnetic levitation of an apparatus (such as a six degree of freedom body), based on control of that apparatus within a sealed environment. The controls architecture for such an apparatus is generally supported a deterministic real time network to provide control and feedback signals to perform satisfactory motion control of a six degree of freedom body in space. Due to a potentially large number of coils to be controlled, network traffic may become excessive and prohibitive with respect to establishing the execution of competitive position loop controls. Here, the amount of network traffic would rapidlyAtty. Docket No.390P017053-WO (PCT) increase with an increase in the number of coils and motion range of the six degree of freedom body within the sealed environment.

[0004] Performance of high accuracy motion control of substrate transport systems may employ a model-based control algorithm. This model-based control algorithm may effect proper compensation for dynamic coupling between the six degrees of freedom of the six degree of freedom body. In applications such as magnetic levitation it may be challenging to develop an accurate analytical model of the relation between the control variables and the magnetic field and actuator parameters.

[0005] Accordingly, the present disclosure addresses a number of those issues. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The foregoing aspects and other features of the present disclosure are explained in the following description, taken in connection with the accompanying drawings, wherein:

[0007] Figs. 1A and 1B are exemplary substrate processing apparatus in accordance with the present disclosure;

[0008] Fig. 2 is an exemplary substrate processing apparatus in accordance with the present disclosure;

[0009] Fig. 3 is an exemplary substrate processing apparatus in accordance with the present disclosure;

[0010] Fig. 4 is an exemplary substrate processing apparatus in accordance with the present disclosure;Atty. Docket No.390P017053-WO (PCT)

[0011] Fig. 5 is an exemplary substrate processing apparatus in accordance with the present disclosure;

[0012] Fig. 6 is a schematic illustration of a portion of the substrate processing apparatus described herein, and in accordance with the present disclosure;

[0013] Fig. 7 is an exemplary substrate processing system in accordance with the present disclosure;

[0014] Fig. 8 is a schematic plan view of an exemplary substrate processing apparatus in accordance with the present disclosure;

[0015] Fig.8A is a schematic perspective view of a portion of a substrate handler in accordance with the present disclosure;

[0016] Fig.9 is a schematic plan view of a substrate processing apparatus in accordance with the present disclosure;

[0017] Fig. 10 is a schematic plan view of a substrate processing apparatus in accordance with the present disclosure;

[0018] Fig.10A is a schematic perspective view of a portion of a substrate handler of Fig.10 in accordance with the present disclosure;

[0019] Fig. 11 is a schematic plan view of a substrate processing apparatus in accordance with the present disclosure;

[0020] Fig.11A is a schematic perspective view of a portion of a substrate handler of Fig.11 in accordance with the present disclosure;

[0021] Fig.12A is a schematic plan view of a substrate processing apparatus in accordance with the present disclosure;Atty. Docket No.390P017053-WO (PCT)

[0022] Fig. 12B is a schematic elevation view of the substrate processing apparatus of Fig.12A in accordance with the present disclosure;

[0023] Fig.13A is a schematic plan view of a substrate processing apparatus in accordance with the present disclosure;

[0024] Fig.13B is a schematic elevation view of the substrate processing apparatus of Fig.13A in accordance with the present disclosure;

[0025] Fig. 14 is a schematic plan view of a substrate processing apparatus in accordance with the present disclosure;

[0026] Fig. 14A is a schematic plan view of a portion of the substrate processing apparatus of Fig.14 in accordance with the present disclosure;

[0027] Fig.14B is a schematic elevation view of a substrate transport cart in accordance with the present disclosure;

[0028] Fig.14C is a schematic plan view of the substrate transport cart in Fig.14B in accordance with the present disclosure;

[0029] Fig. 15A is a front elevation view of a substrate handler in accordance with the present disclosure;

[0030] Fig. 15B is a schematic side elevation view of the substrate handler of Fig. 15A in accordance with the present disclosure;

[0031] Fig.15C is a schematic plan view of the substrate handler of Fig.15A in accordance with the present disclosure;

[0032] Fig.16A is a schematic plan view of the substrate handler in accordance with the present disclosure;Atty. Docket No.390P017053-WO (PCT)

[0033] Fig. 16B is a schematic side elevation view of the substrate handler of Fig. 16A in accordance with the present disclosure;

[0034] Fig. 16C is a schematic plan view of a portion of a substrate processing apparatus including the substrate handler of Fig.16A in accordance with the present disclosure;

[0035] Fig. 17 is a schematic illustration of an exemplary actuator control system network in accordance with the present disclosure;

[0036] Fig. 18 is a schematic perspective illustration of a portion of a substrate processing apparatus in accordance with the present disclosure;

[0037] Fig. 18A is a schematic plan view of a portion of a substrate processing apparatus in accordance with the present disclosure;

[0038] Fig. 19 is an exemplary schematic electric circuit diagram of an electromagnet of a substrate processing apparatus in accordance with the present disclosure;

[0039] Fig. 20 is an exemplary schematic diagram of a driver circuit for electromagnets of a substrate processing apparatus in accordance with the present disclosure;

[0040] Fig. 21 is a schematic illustration of an electromagnet control system and electromagnet array of a substrate processing apparatus in accordance with the present disclosure;

[0041] Fig.22 is a schematic illustration of power factor patterns / matrices, of the electromagnet array of Fig. 21, corresponding to respective wafer handlers in accordance with the present disclosure;

[0042] Fig. 23A is a schematic illustration of the electromagnet control system and electromagnet array of Fig.21 in accordance with the present disclosure;Atty. Docket No.390P017053-WO (PCT)

[0043] Fig. 23B is a schematic illustration of the electromagnet control system and electromagnet array of Fig.21 in accordance with the present disclosure;

[0044] Fig. 23C is a schematic illustration of the electromagnet control system and electromagnet array of Fig.21 in accordance with the present disclosure;

[0045] Fig. 23D is a schematic illustration of the electromagnet control system and electromagnet array of Fig.21 in accordance with the present disclosure;

[0046] Fig. 23E is a schematic illustration of the electromagnet control system and electromagnet array of Fig.21 in accordance with the present disclosure;

[0047] Fig. 23F is a schematic illustration of the electromagnet control system and electromagnet array of Fig.21 in accordance with the present disclosure;

[0048] Fig.24 is a schematic illustration of a multi-frequency alternating current and alternating current voltage for electromagnets in an array of electromagnets for effecting position determination, levitation, and propulsion of a wafer handler in accordance with the present disclosure;

[0049] Fig. 25 is a schematic illustration of a portion of the substrate processing apparatus described herein showing a presence window in accordance with the present disclosure;

[0050] Fig.26A is a schematic illustration of an exemplary motion control of a substrate handler in accordance with the present disclosure;

[0051] Fig. 26B is a schematic perspective illustration of a substrate handler motion in accordance with the present disclosure;

[0052] Fig.27 is a free body force diagram with respect to a maximum allowed acceleration with conventional substrate transport apparatus;Atty. Docket No.390P017053-WO (PCT)

[0053] Fig.28 is a free body force diagram illustrating an effect of pitch angle on acceleration of a substrate handler with respect to substrate slippage in accordance with the present disclosure;

[0054] Fig.29A is a free body force diagram of a substrate illustrating the effects of pitch angle, without friction, on substrate slippage in accordance with the present disclosure;

[0055] Fig. 29B is an exemplary graph illustrating propulsion acceleration in relation to pitch angle, without friction, with respect to substrate slippage in accordance with the present disclosure;

[0056] Fig.30A is a free body force diagram of a substrate illustrating the effects of pitch angle, with friction, on substrate slippage in accordance with the present disclosure;

[0057] Fig.30B is a free body force diagram of a substrate illustrating the effects of pitch angle, with friction, on substrate slippage in accordance with the present disclosure;

[0058] Fig. 31 is an exemplary graph illustrating acceleration limits in relation to pitch angle, with friction, with respect to substrate slippage in accordance with the present disclosure;

[0059] Fig. 32 is a schematic elevation view of a substrate handler illustrating pitch control of the substrate handler in accordance with the present disclosure;

[0060] Fig. 33 is a schematic elevation view of one substrate handler passing by another substrate handler within a transport chamber in accordance with the present disclosure;

[0061] Fig. 34 is a schematic elevation view of one substrate handler passing by another substrate handler within a transport chamber in accordance with the present disclosure;

[0062] Fig. 35 is a schematic illustration of a portion of the actuator control system network showing dynamic phase allocation in accordance with the present disclosure;Atty. Docket No.390P017053-WO (PCT)

[0063] Figs. 36A and 36B illustrate tilt control of a portion of a substrate handler utilizing the actuator control system network with dynamic phase allocation and virtual multiphase actuator units in accordance with the present disclosure;

[0064] Fig. 36C illustrates electrical phase angle control with the actuator control system network to effect independent propulsion and lift control of a substrate handler in accordance with the present disclosure;

[0065] Figs. 37A, 37B, and 37C are schematic illustrations portions of a transport chamber in accordance with the present disclosure;

[0066] Figs. 38A, 38B, 38C, and 38D are schematic illustrations of portions of a transport chamber in accordance with the present disclosure;

[0067] Fig. 39 is an exemplary graph of wafer handler temperature cycling in accordance with the present disclosure;

[0068] Fig. 40 is an exemplary graph illustrating coil current versus frequency in accordance with the present disclosure;

[0069] Fig. 41 is an exemplary block diagram of an induction based position determination in accordance with the present disclosure;

[0070] Fig. 42 is an exemplary illustration of a portion of the controls architecture of the substrate processing apparatus described herein and in accordance with the present disclosure;

[0071] Fig.43 is a schematic illustration of the electromagnet control system and electromagnet array of Fig.21 in accordance with the present disclosure;

[0072] Fig.44 is a schematic illustration of the electromagnet control system and electromagnet array of Fig.21 in accordance with the present disclosure; andAtty. Docket No.390P017053-WO (PCT)

[0073] Figs. 45 and 46 are flow diagrams of exemplary methods in accordance with the present disclosure. DETAILED DESCRIPTION

[0074] The following detailed description is meant to assist the understanding of one skilled in the art, and is not intended in any way to unduly limit claims connected or related to the present disclosure.

[0075] The following detailed description references various figures, where like reference numbers refer to like components and features across various figures, whether specific figures are referenced, or not.

[0076] The word “each” as used herein refers to a single object (i.e., the object) in the case of a single object or each object in the case of multiple objects. The words “a,” “an,” and “the” as used herein are inclusive of “at least one” and “one or more” so as not to limit the object being referred to as being in its “singular” form.

[0077] Figs. 1A-14C illustrate exemplary processing apparatus 100, 100A, 200, 300, 400, 500, 800, 900, 1200, 1300 employing magnetically levitated transports in accordance with aspects of the present disclosure. Although the aspects of the present disclosure will be described with reference to the drawings, it should be understood that the aspects of the present disclosure can be embodied in many forms. In addition, any suitable size, shape or type of elements or materials could be used.

[0078] The present disclosure may provide for implementation of a control law, in a distributed controls architecture, that reduces an amount of real time network traffic independent from a number of coils providing magnetic levitation for magnetically levitating a body in space. TheAtty. Docket No.390P017053-WO (PCT) present disclosure may provide for automatically identify the relation between control variables and electromagnetic parameters that dictate the motion dynamics to be controlled.

[0079] As will be described herein, the exemplary processing apparatus include a matrix of independently controlled coils (also referred to herein as coil actuators) that, when energized, induce a magnetic levitation field on the body being levitated (for exemplary purposes such body is described as a substrate handler, but may be any suitable body being moved and / or transporting items). The substrate handler may be controlled in all six degrees of freedom, where a control architecture determines which coils of the matrix of independently controlled coils can contribute to a generation of forces and moments on the substrate handler. With the determination of the coils, the control architecture energizes the coils contributing to the generation of the forces and moments to effect propulsion and levitation of the substrate handler that yield a desired / predetermined motion path of the substrate handler within the processing apparatus. It is noted that while the control architecture may be described herein with respect to induction-based magnetic levitation, the control architecture may be applied to any suitable type of magnetic or electro-magnetic levitation technology that is employed for levitating any suitable object handling device.

[0080] Referring also to Fig. 21, an exemplary distributed controls network is illustrated as having a network of coil controllers. Each of the coil controllers is coupled to a respective coil set of the matrix of coils. For example, coil controller 1 is coupled to coil set 1, coil controller 2 is coupled to coil set 2, ..., and coil controller M is coupled to coil set M. The coil controllers are coupled to a master controller through a data communications network. Here, power is also provided to each coil controller and the master controller by an independent power line or with power embedded within the data communications network cabling. As illustrated in Fig. 21, substrate handlers are levitated and their motion is controlled by the actuation of the coils according to a control algorithm of the master controller 199. The master controller 199 sends control commands to each of the coil controllers 1750A-1750n so that the coil controllers 1750A-1750n effect the forces and moments exerted on the substrate handlers 1500A, 1500BAtty. Docket No.390P017053-WO (PCT) (generally referred to as substrate handler 1500) to move the substrate handlers 1500A, 1500B along the desired motion path.

[0081] The coil controllers 1750A-1750n are connected to the master controller 199 through the data communications network. The data network traffic is propagated in a deterministic real time execution (as described herein) where the data network traffic is collected and processed within tight execution time constraints in order to maintain stability of each substrate handler 1500A, 1500B motion in space. The present disclosure provides for a control architecture for controlling a magnetically levitated body such as, for example the substrate handlers 1500 described herein. The control architecture may simultaneously reduce network (data) traffic while being insensitive to a number of coils and coil controllers 1700A-1700n.

[0082] The present disclosure will be described herein with respect to induction based magnetic levitation substrate transport apparatus such as described in United States patent number 11,476,139 issued on October 18, 2022 and United States patent application number 18 / 050,300 filed on October 27, 2022 and published as United States pre-grant publication number 2023 / 0143307, the disclosures of which are incorporated herein by reference in their entireties. However, it should be understood that the present disclosure may be employed for any other type of distributed controls applications where high network traffic may arise from employment and control of many actuators.

[0083] Referring to Fig. 1A, there is shown a schematic plan view of a substrate processing apparatus 100 in accordance with the present disclosure. The substrate processing apparatus 100 is connected to an environmental front end module (EFEM) 114 which has a number of load ports 112 as shown in Fig. 1A. The load ports 112 are capable of supporting a number of substrate storage canisters 171 such as for example conventional FOUP canisters; though any other suitable type may be provided. The EFEM 114 communicates with the processing apparatus through load locks 116, which are connected to the processing apparatus as will be described further below. The EFEM 114 (which may be open to atmosphere) has a substrateAtty. Docket No.390P017053-WO (PCT) transport apparatus (not shown – but such transport apparatus may be similar to a substrate transport apparatus (of the transfer chamber 118) in the form of a linear electrical machine 1599 as described herein, e.g., the linear electrical machine 1599 described herein may be employed in vacuum and atmospheric environments) capable of transporting substrates from load ports 112 to load locks 116. The EFEM 114 may further include substrate alignment capability, batch handling capability, substrate and carrier identification capability or otherwise. It is noted, the load locks 116 may interface directly with the load ports 112 as in the case where the load locks have batch handling capability or in the case where the load locks have the ability to transfer wafers directly from the FOUP to the lock. Some examples of such apparatus are disclosed in US patent numbers 6,071,059, 6,375,403, 6,461,094, 5,588,789, 5,613,821, 5,607,276, 5,954,472, 6,120,229, and 6,869,263 all of which are incorporated by reference herein in their entirety. Other load lock options may be provided.

[0084] Still referring to Fig. 1A, the processing apparatus 100, may be used for processing semiconductor substrates (e.g.200 mm, 300 mm, 450 mm, or other suitably sized wafers), panels for flat panel displays, or any other desired kind of substrate. The processing apparatus 100 generally comprises transfer chamber 118 (which may hold a sealed atmosphere therein), processing modules 120, and at least one substrate transport apparatus or linear electrical machine 1599. The substrate transport apparatus 1599 shown may be integrated with the chamber 118 or coupled to the chamber in any suitable manner as will be described herein. Processing modules 120 may be mounted on both sides of the chamber 118; although, processing modules 120 may be mounted on one side of the chamber 118 as shown for example in Fig. 2. As illustrated in Fig. 1A, processing modules 120 are mounted opposite each other in rows Y1, Y2 or vertical planes; although, the processing modules 120 may be staggered from each other on the opposite sides of the transfer chamber 118 or stacked in a vertical direction relative to each other. Referring also to Figs. 15A-15C, 18, and 18A, the transport apparatus 1599 has substrate handler 1500 that is moved in the chamber 118 to transport substrates between load locks 116 and the processing chambers 120. While only one substrate handler 1500 isAtty. Docket No.390P017053-WO (PCT) illustrated, there may be more than one substrate handler may be provided. As seen in Fig. 1A, the transfer chamber 118 (which is subjected to vacuum or an inert atmosphere or simply a clean environment or a combination thereof in its interior) has a configuration, and employs the substrate transport apparatus or linear electrical machine 1599, that allows the processing modules 120 to be mounted to the chamber 118 in a Cartesian arrangement with processing modules 120 arrayed in substantially parallel vertical planes or rows. This results in the processing apparatus 100 having a more compact footprint than a comparable conventional processing apparatus, such as those having a clustered arrangement. Moreover, the transfer chamber 118 may be capable of being provided with any desired length (i.e., the length is scalable) to add any desired number of processing modules 120, as will be described in greater detail below, in order to increase throughput. The transfer chamber 118 may also be capable of supporting any desired number of transport apparatus 1599 therein and allowing the transport apparatus 1599 to reach any desired processing chamber 120 coupled to the transfer chamber 118 without interfering with each other. This in effect decouples the throughput of the processing apparatus 100 from the handling capacity of the transport apparatus 1599, and hence the processing apparatus 100 throughput becomes processing limited rather than handling limited. Accordingly, throughput can be increased as desired by adding processing modules 120 and corresponding handling capacity on the same platform.

[0085] Still referring to Fig.1A, the transfer chamber 118 may have a general rectangular shape; although, the chamber may have any other suitable shape. The transfer chamber 118 has a slender shape (i.e. length much longer than width) and defines a generally linear transport path for the transport apparatus 1599 therein. The chamber 118 has longitudinal side walls 118S. The side walls 118S have transport openings or ports 118O (also referred to as substrate pass through openings) formed therethrough. The transport ports 118O are sized large enough to allow substrates to pass through the ports (which ports can be sealable by valves) into and out of the transfer chamber 118. As can be seen in Fig. 1A, the processing modules 120 may be mounted outside the side walls 118S with each processing module 120 being aligned with aAtty. Docket No.390P017053-WO (PCT) corresponding transport port 118O in the transfer chamber 118. Each processing module 120 may be sealed against the sides 118S of the chamber 118 around the periphery of the corresponding transport aperture to maintain the vacuum in the transfer chamber. Each processing module 120 may have a valve (e.g., a slot valve), controlled by any suitable means, such as controller 199, to close the transport port 118O when desired. The transport ports 118O may be located in the same horizontal plane. Accordingly, the processing modules on the chamber are also aligned in the same horizontal plane. The transport ports 118O may be disposed in different horizontal planes. As seen in Fig. 1A, the load locks 116 are mounted to the chamber sides 118S at the two front most transport ports 118O. This allows the load locks 116 to be adjacent the EFEM 14 at the front of the processing apparatus. The load locks 116 may be located at any other transport ports 118O on the transfer chamber 118 such as shown for example in Fig. 2. The hexahedron shape of the transfer chamber 118 allows the length of the chamber to be selected as desired in order to mount as many rows of processing modules 120 as desired (for example see Figs.1B, 3, 4-7 showing other examples in which the transfer chamber 118 length is such to accommodate any number of processing modules 120).

[0086] As noted before, the transfer chamber 118 shown in Fig. 1A may have a substrate transport apparatus or linear electrical machine 1599 having a single substrate handler 1500. The transport apparatus 1599 is integrated with the chamber 118 to translate substrate handler 1500 back and forth in the chamber 118 between front 118F and back 118R. The substrate handler 1500 of the substrate transport apparatus 1599 has at least one end effector 1520 for holding one or more substrates.

[0087] It should be understood that the transport apparatus 1599, shown in Fig. 1A (also referring to Figs. 37A-37C) is a representative transport apparatus and, includes the substrate handler 1500 (a portion of which is illustrated in Figs. 37B, 37C for clarity) which is magnetically supported from linear tracks 1550 formed by an array of electromagnets or coil actuators 1700. The transport apparatus 1599 will be described in greater detail below.Atty. Docket No.390P017053-WO (PCT)

[0088] The transfer chamber 118 may form a frame 118M (see Fig. 1A) with a level reference plane 1299, e.g., that defines or otherwise corresponds (e.g., is substantially parallel) with a wafer transport plane 1290 (see Fig. 12B). The linear tracks 1550 formed by array of electromagnets 1700 may be mounted to the side walls 118S or floor 118L of the transfer chamber 118 (where the floor 118L forms a non-magnetic isolation wall between the array of electromagnets 170 and the wafer handler 1500) and may extend the length of the chamber 118. This allows the substrate handler 1500 to traverse the length of the chamber 118. As will be described in greater detail below the array of electromagnets 1700 (also referred to herein as actuators 1700) form the linear tracks 1550 of Fig.1A, where each of linear tracks 1500 includes a respective array of electromagnets or actuators 1700A-1700n. The array of electromagnets or actuators 1700A-1700n are referred to herein as a network of actuators as in Figs. 14A, 15A, 15B, 16B, 16C, 17, 18, and 18A (e.g., that form at least one linear induction motor stator 1560 - noting that in Figs.14A-16C there are two rows of electromagnets illustrated for each drive line 177-180 for clarity of illustration but it should be understood that more than two rows of electromagnets may be provided per drive line as illustrated in Figs. 18 and 18A (see also Figs. 37A-37C), where one or more electromagnets are common to more than one drive line), connected to the transfer chamber 118 to form a drive plane 1598 at a predetermined height H relative to the reference plane 1299, the array of electromagnets 1700 (see also Fig. 18) being arranged so that a series of the electromagnets 1700A-1700n define at least one drive line within the drive plane 1598, and each of the electromagnets 1700A-1700n (see Fig.15B) in the array of electromagnets 1700 being coupled to an alternating current (AC) power source 1585 energizing each electromagnet 1700A-1700n, where the alternating power source may be a three phase (or more) alternating current power source. As noted above (see Fig. 15A), the base or reaction platen 1510 is formed of a paramagnetic, diamagnetic, or non-magnetic conductive material disposed to cooperate with the electromagnets 1700A-1700n of the array of electromagnets 1700 so that excitation of the electromagnets 1700A-1700n with alternating current from the alternating current source 1585 generates levitation forces FZ and propulsion forces FP (see Fig. 21) against the base 1510 that controllably levitate and propel the base 1510 along the at leastAtty. Docket No.390P017053-WO (PCT) one drive line 177-180 (see, e.g., Figs. 1-8), in a controlled attitude relative to the drive plane 1598.

[0089] As noted above, the chamber floor 118L forms a non-magnetic isolation wall 4400 (see Figs.37A-37C) between the array of electromagnets 1700 and the wafer handler 1500. Here the array of electromagnets 1700 are disposed in an atmospheric environment while the wafer handler 1500 is disposed in a vacuum environment of the transfer chamber 118. The non- magnetic isolation wall 4400 (and the chamber floor 118L) is selected so as to have a low electrical conductivity and a high resistivity to minimize the occurrence of Eddy Currents (and minimize magnetic field losses due to the Eddy Currents) while allowing a magnetic field to pass through the non-magnetic isolation wall 4400 to establish a magnetic circuit between the (e.g., coils / poles) of the electromagnets in the array of electromagnets 1700 and the base 1510 of the wafer handler 1500. Suitable examples of materials from which the non-magnetic isolation wall 4400 (and the floor 118L) include materials that are vacuum compatible and have a high resistivity, high stiffness, high yield strength, and high thermal conductivity such as, for example, 300-Series Stainless Steel that conforms with the electrical and magnetic (e.g., non- magnetic) properties noted above. A suitable example of the 300-series Stainless Steel includes, but is not limited to, 304 Stainless Steel. The chamber floor 118L may be a separate (i.e., different) material than that of the frame 118M such as to reduce costs of the transfer chamber 118 structure. For example, the frame 118M may be constructed of aluminum (or other suitable material) while the floor 118L is constructed of stainless steel (or other suitable material). Other suitable examples of material from which the non-magnetic isolation wall 4400 (and the floor 118L) may be constructed includes, but is not limited to, low conductivity aluminum such as a 6061 series aluminum (e.g., 6061-F, 6061-0, 6061-O, 6061-T4, 6061-T6, and 6061-T9).

[0090] With respect to the magnetic circuit formed between the (e.g., coils / poles) of the electromagnets in the array of electromagnets 1700 and the base 1510 of the wafer handler 1500, the base 1510 is constructed of any suitable paramagnetic material. The paramagnetic material of the base 1510 has a low resistivity so as maximize induction of Eddy Currents, a low massAtty. Docket No.390P017053-WO (PCT) density to minimize weight of the base 1510, and be inert so as to be vacuum compatible and resistant at high temperatures (e.g., such as about 100°C or more). Suitable examples of materials from which the base 1510 may be constructed include, but are not limited to, 1100 series Aluminum Alloy (such as the 1100, 1100-O, and 1100-H18 Aluminum Alloys), and 6101 series Aluminum Alloy (such as the 6101-T6, 6101-T61, 6101-T63, 6101-T64, and 6101-T65 Aluminum Alloys). It is noted that for atmospheric applications of the transport described herein, the base 1510 may be constructed of copper or any of the other materials described herein for the base 1510.

[0091] The poles 4500P (see, e.g., Figs.38A-38C) of the electromagnets and the coil base plate are ferromagnetic and have a high magnetic permeability, high magnetic saturation, and high electrical resistivity (e.g., so as to minimize Eddy Currents) so as to maximize levitation efficiency for levitating the base 1510. As described herein, the poles and the coil base plate may be constructed of any suitable soft magnetic composite (SMC) material with a magnetic saturation reaching about 2 Tesla. A suitable example of a soft magnetic composite material being, but not limited to, Hoganas’ 700HR 5P.

[0092] Referring also to Fig.40, an exemplary graph illustrating coil current versus frequency is illustrated with respect to Eddy Current loses. The graph shows finite element electromagnetic model analysis of several materials (e.g., the SMC materials noted above and stainless steel, such as the stainless steels described herein) from which the coil base plate and poles 4500P may be constructed. The graph illustrates modelling conditions where the Eddy Currents are turned off in the poles, the Eddy Currents are turned off in the coil base plate, the Eddy Currents are off in both the poles and the coil base plate, and the Eddy Currents are turned on in both the poles and the coil base plate. The graph illustrates a substantial elimination of Eddy Current loses with both the poles 4500P and the coil base plate constructed of the soft magnetic composite material, e.g., when compared to model conditions with the poles constructed of the SMC material and the coil base plate is constructed of stainless steel and to model conditions with the both the poles and the coil base plate constructed of stainless steel. Here, constructing both the poles and theAtty. Docket No.390P017053-WO (PCT) coil base plate with the soft magnetic composite material provides for maximization of coil current given a predetermined voltage (e.g., in this analysis the peak (maximized) current is about 8.2 A with a voltage of about 43.2V).

[0093] Referring to Figs. 38A-38D, the array of electromagnets 1700 may be modular and include array modules 1700M. The array modules 1700M may include electromagnetic elements 4500 that are modularly coupled to the coil base plate in any suitable manner (such as, e.g., with any suitable retainers / fasteners) as illustrated in Fig. 38A. The electromagnetic elements 4500 may be integrally formed with the coil base plate. Each electromagnet element 4500 includes a base 4500B, a coil 4500C, and a pole 4500P. The pole 4500P may be monolithic, or may be constructed of more than one part 4500P1, 4500P2 that are coupled to each other (illustrated in Fig.38D) to form a respective pole 4500P. Electrical continuity may be effected between the electromagnetic elements 4500 through abutting contact between adjacent bases 4500B and / or through the coil base plate. The poles 4500P, the base 4500B, and the coil base plate may be constructed of any suitable material such as any suitable soft magnetic composite (SMC) material. Here, each (or one or more) of the array modules 1700M may be removed from the transfer chamber 118 for maintenance without disruption of the vacuum integrity / environment within the transfer chamber 118 as the array modules are disposed on the atmospheric side of the non-magnetic isolation wall 4400 (e.g., the chamber floor 118L).

[0094] Fig. 1B shows a substrate processing apparatus 100A which is generally similar to apparatus 100. The transfer chamber 118 may have two substrate handlers 1500A, 1500B independently operated by the array of electromagnets 1700 (as in Fig. 16C). The substrate handlers 1500A, 1500B are substantially the same as the substrate handler 1500 previously described. Both of the substrate handlers 1500A, 1500B may be supported from a common array of electromagnets 1700 as described before. The base 1510 of each substrate handler 1500A, 1500B may be driven by the same at least one linear induction motor stator 1560 (see Fig.18) as will be described herein, by individually controlling each coil element or electromagnet 1700A- 1700n (as in Fig. 15B). Thus, as can be realized the end effector 1520 each substrate handlerAtty. Docket No.390P017053-WO (PCT) 1500 can be independently moved in linear movement and / or rotation using the at least one linear induction motor stator 1560. The substrate handlers 1500A, 1500B may not be capable of passing each other in the transfer chamber 118 as the transfer chamber 118 includes but one drive line 177 (compared to transfer chambers having multiple substantially parallel drive lines as shown in Figs. 8-11). Accordingly, the processing modules 120 are positioned along the length of the transfer chamber 118 so that the substrate may be transported to be processed in the processing module in a sequence which would avoid the substrate handlers 1500A, 1500B from interfering with each other. For example, processing modules for coating may be located before heating modules, and cooling modules and etching modules may be located last.

[0095] However, referring to Figs. 8-11, the transfer chamber 118 may have any suitable width to provide for two or more substantially parallel drive lines 177, 178 (e.g., formed by the array of electromagnets 1700) that extend at least along a portion of a longitudinal length of the transfer chamber 118 so that the two substrate handlers 1500A, 1500B pass adjacent each other (akin to a side rail or bypass rail). As illustrated in Figs.8-11, the transport apparatus 1599 may have two drive lines 177, 178; although, any suitable number of substantially parallel longitudinally extending drive lines may be provided.

[0096] In accordance with the present disclosure, the controller 199 of the substrate processing apparatus described herein may be configured with a predetermined platen temperature management protocol PTMP (see Fig. 1) that effects temperature control (e.g., thermal management) of the base 1510 of the wafer handler 1500. Here, the base 1510 is thermally managed so as to maintain a predetermined levitation efficiency. As may be realized, with the base 1510 levitating, Eddy Currents induced in the base 1510 will generate heat and the temperature of the base 1510 will rise. An increase in temperature of the base 1510 may increase the electrical resistivity of the base 1510, which in turn may reduce the induction of Eddy Currents and the levitation force exerted on the base 1510 by the array of electromagnets 1700. Any suitable controller, such as controller 199 (described herein) is configured with the predetermined platen temperature management protocol PTMP to effect a base 1510 coolingAtty. Docket No.390P017053-WO (PCT) cycle to maintain the base 1510 within a predetermined temperature range (such as below about 100°C). For example, the predetermined platen temperature management protocol PTMP controls the temperature of the base 1510 vie (e.g., with) conduction from the base 1510 to a thermal sink 4444 (see Fig. 37A which may be the floor 118L or isolation wall 4400) commensurate (e.g., in time) with at least a wafer swap operation of the base 1510 (and the wafer handler 1500 thereof). Here, the controller 199 may activate (or deactivate) the array of electromagnets 1700 (or a portion thereof) so that the base 1510 lowers to seat on (e.g., lands on) the floor 118L of the transfer chamber 118 where heat is removed from the base 1510 by the floor 181L via conduction from the base through the floor 118L) (e.g., the isolation wall) towards the atmospheric side of the floor 118L where the coils 4500C, poles 4500P, and coil base plate are disposed (see Figs.38A-38D).

[0097] The cooling of the base 1510 may occur opportunistically such as with a wafer exchange operation (e.g., a swapping or transfer of one or more wafers at a wafer holding station as noted above). For example, where wafer handler 1500 includes at least two end effectors 1520, one of the end effectors 1520 waits or sits idle while the another of the at least two end effectors 1520 completes a pick / place operation. With the other end effector 1520 picking / placing the wafer, the idle end effector 1520 is seated on the floor 118L to cool off the base 1510. The controller 199 may command cooling of the base 1510 of the wafer handler 1500 (having one or more end effectors) at any suitable time.

[0098] Other thermal management solutions for cooling the base 1510 of the wafer handler 1500 that may be employed with the present disclosure include a wafer handler replacement (e.g., the wafer handler 1500 is replaced in its entirety) without disrupting the vacuum environment within the transfer chamber 118. For example, a “service lock” SL (see Fig. 1) is substantially similar to load lock 116 but with a floor similar to the transfer chamber 118L (so that the wafer handler transitions between the transfer chamber and service lock). The service lock SL also has sealable opening 1180T shaped and sized for passage of the wafer handler therethrough. Suitable examples of service locks SL are described in United States provisional patent applicationAtty. Docket No.390P017053-WO (PCT) number 63 / 594,743 filed on October 31, 2023 and titled “Scalable Substrate Handler Apparatus and Processing Apparatus Including the Same,” and having attorney docket number 390P017044-US (-#1), the disclosure of which is incorporated herein by reference in its entirety.

[0099] The service lock SL has a frame SLF that is shaped and sized so that one wafer transport 1500 (and the reaction platen or base 1510 thereof) may be replaced with another wafer transport 1500ALT (and the other reaction platen or base 1510ALT thereof). Here, the other base 1510ALT, is alternative to the base 1510, and is held inactive within the service lock SL so as to be in a cold state, relative to the temperature of the base 1510 in its operative state. Here, the predetermined platen temperature management protocol PTMP includes the other base 1510 (and the wafer handler 1500ALT thereof) being switched to an operative state (so that the base 1510 is levitated) and replacing the base 1510 (and the wafer handler 1500 thereof), at its temperature limits. For example, the wafer handler 1500 is commanded to move into the service lock SL and is placed in an inactive state (so the base 1510 is seated on the floor 118L of the service lock SL. The other wafer handler 1500ALT is placed in an operative state so as to levitate and is commanded to move into the transfer chamber 118 for wafer handling / transfer operations.

[0100] The service lock SL may be configured to introduce wafers (and / or wafer handlers) into the processing system. For example, the service lock SL may include a door that is shaped and sized so that an operator of the processing system may insert / remove one or more of wafers (for placement on a wafer handler disposed in the service lock SL) and wafer handlers (loaded with a wafer or unloaded) to and from the service lock SL. Here the wafers may be introduced into the processing system without the wafers being transported to the processing system in a FOUP 171.

[0101] The service lock SL can be added to or otherwise integrated with the transfer chamber 118. Here, a wafer handler 1500 within the isolated environment of the service lock SL provides for the wafer handler 1500 to be periodically (or at any suitable intervals which may be preset or determined based on a temperature of the wafer handler) removed and replaced with another wafer handler 1500ALT that is clean and cooler than the removed wafer handler 1500.Atty. Docket No.390P017053-WO (PCT)

[0102] Fig. 39 illustrates exemplary vacuum temperature transients of the wafer handler 1500 base 1510 versus time. Fig. 39 illustrates that the base 1510 (and the wafer handler 1500) can operate at over about 90% duty cycle levitation while maintaining the base 1510 within a temperature range of about 50°C to about 100°C, which maintains the levitation efficiency within a predetermined range.

[0103] Referring now to Figs.4 and 5 there are shown other substrate processing apparatus 400, 500 in accordance with the present disclosure. As seen in Figs. 4 and 5 the transfer chamber(s) 118, 118A, 118B, 118C may be elongated to accommodate additional processing modules 120. The apparatus shown in Fig.4 has twelve (12) processing modules 120 connected to the transfer chamber 118. The processing apparatus 500 in Fig. 5 is illustrated as having two transfer chambers 118A, 118B coupled to each other by a bridging chamber 118C that provides for movement of the substrate handlers 1500 between the transfer chambers 118A, 118B. Here, each transfer chamber 118A, 118B in Fig. 5 has 24 processing modules 120 connected thereto. The numbers of processing modules 120 shown are merely exemplary, and the substrate processing apparatus may have any other number of processing modules 120 as previously described. The processing modules 120 may be disposed along the sides of the respective transfer chamber 118A, 118B in a Cartesian arrangement similar to that previously discussed. The number of rows of processing modules 120, however have been greatly increased (e.g. six (6) rows in the apparatus of Fig.4, and twelve (12) rows in each of the apparatus of Fig.5). As shown in Fig.4, the EFEM may be removed and the load ports 112 may be mated directly to the load locks 116. The transfer chambers of the substrate processing apparatus 400, 500 in Figs.4, and 5 may have multiple substrate handlers 1500 to handle the substrates between the load locks 116 and the processing chambers 120. The number of substrate handlers 1500 shown is merely exemplary and more or fewer apparatus may be used. The substrate transport apparatus 1599 (a portion of which is illustrated in Figs. 4 and 5) may be generally similar to that previously described, comprising the linear tracks 1550 and substrate handler(s) 1500. As shown in Figs.4 and 5, while only a single longitudinal drive line (e.g., drive lines 177, 178, 179 is illustrated inAtty. Docket No.390P017053-WO (PCT) each chamber 118, 118A, 118B, 118C, it should be understood that multiple drive lines may longitudinally extend along each chamber 118, 118A, 118B, 118C in a manner substantially similar to that illustrated in Figs. 8-10. As with the other substrate transport apparatus 100, 100A, 200, 300, 800, 900, 1200, 1300 described herein, the substrate transport apparatus 400, 500 has a controller 199 for controlling the movements of the one or more substrate handlers 1500 of the substrate transport apparatus 1599.

[0104] Still referring to Fig. 5, the transfer chambers 118A, 118B in this case may be mated directly to a tool 300 (e.g., a stocker, photolithography cell, or other suitable processing tool) where the substrates are delivered to and removed from the tool 300 through chamber 118C.

[0105] As may be realized from Figs. 1B, 3 and 4-5 the transfer chamber 118 may be extended as desired to run throughout the processing facility P (see Fig. 5, and an example processing facility is illustrated in Fig.7). As seen in Fig.5, and as will be described in further detail below, the transfer chamber (generally referred to as transfer chamber 118) may connect and communicate with various sections or bays 118P1-118P4 in the processing facility P such as for example storage, lithography tool, metal deposition tool or any other suitable tool bays. Bays interconnected by the transfer chamber 118 may also be configured as process bays or processes 118P1, 118P3. Each bay has desired tools (e.g. lithography, metal deposition, heat soaking, cleaning) to accomplish a given fabrication process in the semiconductor workpiece. In either case, the transfer chamber 118 has processing modules 120, corresponding to the various tools in the facility bays, communicably connected thereto, as previously described, to allow transfer of the semiconductor workpiece between chamber 118 and processing modules 120. Hence, the transfer chamber 118 may contain different environmental conditions such as atmospheric, vacuum, ultra-high vacuum (e.g., 10-5Torr), inert gas, or any other, throughout its length corresponding to the environments of the various processing modules connected to the transfer chamber. Accordingly, the section 118P1 of the chamber in a given process or bay or within a portion of the bay, may have for example, one environmental condition (e.g. atmospheric), and another section 118P2, 118P3 of the chamber 118 may have a different environmental condition.Atty. Docket No.390P017053-WO (PCT) As noted before, the section 118P1-118P4 of the chamber 118 with different environments therein may be in different bays of the facility, or may all be in one bay of the facility. Fig. 5 shows the chamber 118 having four sections 118P-118P4 with different environments for example purposes only. The chamber 118 may have as many sections with as many different environments as desired.

[0106] As seen in Fig. 5, the substrate handlers 1500 in the transfer chamber 118 are capable of transiting between sections 118P1-118P4 of the chamber 118 with different environments therein. Hence, as can be realized from Fig.5, each of the substrate handlers 1500 may with one pick move a semiconductor workpiece from the tool in one process or bay of the processing facility to another tool with a different environment in a different process or bay of the process facility. For example, substrate handler 1500A may pick a substrate in processing module 301, which may be an atmospheric module, lithography, etching, or any other desired processing module in section 118P1, of transfer chamber 118. The substrate handler 1500A may then move along drive line 177 (or a drive line substantially parallel thereto where more than one longitudinal drive line are provided) from section 118P1 of the chamber 118 to section 118P3 (e.g., where the other substrate handlers 1500 are controlled to avoid interference with substrate handler 1500A in any suitable manner, such as described herein). In section 118P3, the substrate handler 1500A may place the substrate in processing module 302, which may be any desired processing module.

[0107] As can be realized from Fig.5, the transfer chamber 118 may be modular, with chamber modules connected as desired to form the chamber 118 (e.g., formed by the three chamber sections 118A, 118B, 118C, where each chamber section 118A, 118B, 118C may also include one or more chamber modules that are coupled to each other in any suitable manner). Referring also to Fig.1A, the modules may include internal walls 118I, similar to walls 118F, 118R in Fig. 1A, to segregate sections 118P1-118P4 of the chamber 118. Internal walls 18I may include slot valves, or any other suitable valve allowing one section of the chamber 118P1-118P4 to communicate with one or more adjoining sections. The slot valves 118V, may be sized to allow,Atty. Docket No.390P017053-WO (PCT) one or more substrate handlers 1500 to transit through the valves 18V from one section 118P1- 118P4 to another. In this way, the substrate handlers 1500 may move anywhere throughout the chamber 118. The valves 118V may be closed to isolate sections 118P1-1184 of the chamber 118 so that the different sections may contain disparate environments as described before. Further, the internal walls 118I of the chamber modules may be located to form load locks (see section 118P4) as shown in Fig. 5. The load locks 118P4 (only one is shown in Fig. 5 for example purposes) may be located in chamber 118 as desired and may hold any desired number of substrate handlers 1500 therein.

[0108] As shown in Fig.5, processes within chamber sections 118A and 118B may be the same processes, for example etch, where the processing apparatus 500 including tool 300 (such as a stocker) are capable of processing substrates without any associated material handling overhead associated with transporting FOUPS from the stocker to individual process modules 120 via an automated material handling system, and transporting individual wafers via EFEM’s to the respective processing modules 120. Instead, a robot within the stocker directly transfers FOUPS 171 to the load ports (three load ports are shown per chamber section, more or less could be provided depending on throughput requirements) where the wafers are batch moved into locks and dispatched to their respective process module(s) depending on the desired process and / or throughput required. The chamber sections 118A, 118B or the stocker 300 may further have metrology capability, sorting capability, material identification capability, test capability, inspection capability, etc. as required to effectively process and test substrates.

[0109] As shown in Fig.5, more or less chamber sections 118A and 118B may be provided that have different processes, for example etch, CMP, copper deposition, PVD, CVD, etc. where the chamber sections 118A, 118B, etc. in combination with the tool 300 being, for example a photolithography cell are capable of processing substrates without the associated material handling overhead associated with transporting FOUPs from stockers to individual process tool bays and a lithography bay via an automated material handling system, and transporting individual wafers via EFEM’s to the respective processing tools. Instead, the automation withinAtty. Docket No.390P017053-WO (PCT) the lithography cell directly transfers FOUPS, substrates or material to the load ports 112 (again three load ports are shown per chamber section / process type, noting more or less could be provided depending on throughput requirements) where the substrates are dispatched to their respective process depending on the desired process and / or throughput required. An example of such an alternative is shown in Fig. 7. In this manner, the apparatus in Fig. 5 processes substrates with less cost, lower footprint, less work in process (WIP) required (compared to the conventional processing systems described herein) – therefor with less inventory and with a quicker turnaround when looking at the time to process a single carrier lot (or “hot lot”), and with a higher degree of contamination control resulting in significant advantages for the fabrication facility operator. The transfer chamber sections 118A, 118B (each of which may be referred to as a tool or tool section) or the tool or cell 300 may further have metrology capability, processing capability, sorting capability, material identification capability, test capability, inspection capability, etc. as required to effectively process and test substrates. As can be realized from Fig.5, the transfer chamber sections 118A, 118B, and tool 300 may be coupled to share a common controlled environment (e.g. inert atmosphere, or vacuum). This ensures that substrates remain in a controlled environment from tool 300 and throughout the substrate processing apparatus 500. This eliminates use of special environment controls of the FOUPs as in conventional substrate processing apparatus.

[0110] Referring now to Fig. 7, there is shown an exemplary fabrication facility layout 601 incorporating aspects of the present disclosure that are shown in Fig. 5. Wafer handlers 406, similar to wafer handlers 1500 transport substrates or wafers through process steps within the fabrication facility 601 through transfer chambers 602, 604, 606, 608, 610, 612, 614, 616, 618, 620, 624, 626. Process steps may include epitaxial silicon 630, dielectric deposition 632, photolithography 634, etching 636, ion implantation 638, rapid thermal processing 640, metrology 642, dielectric deposition 644, etching 646, metal deposition 648, electroplating 650, chemical mechanical polishing 652. More or less processes may be involved or mixed; such as etch, metal deposition, heating and cooling operations in the same sequence. As noted before,Atty. Docket No.390P017053-WO (PCT) wafer handlers 406 may be capable of carrying a single wafer or multiple wafers and may have transfer capability, such as in the case where wafer handler 406 has the capability to pick a processed wafer and place an unprocessed wafer at the same module. Wafer handlers 406 may travel through isolation valves 654 for direct tool to tool or bay to bay transfer or process to process transfer. Valves 654 may be sealed valves or simply conductance type valves depending upon the pressure differential or gas species difference on either side of a given valve 654. In this manner, wafers or substrates may be transferred from one process step to the next with a single handling step or “one touch”. As a result, contamination due to handling is minimized. Examples of such pressure or species difference could be for example, clean air on one side and nitrogen on the other; or roughing pressure vacuum levels on one side and high vacuum on the other; or vacuum on one side and nitrogen on the other. Load locks 656, similar to chambers 118P4 in Fig. 5, may be used to transition between one environment and another; for example between vacuum and nitrogen or argon. Other pressures or species may be provided in any number of combinations. Load locks 656 may be capable of transitioning a single wafer handler or multiple wafer handlers in a manner substantially similar to that described herein where a single drive line or multiple substantially parallel and / or orthogonal drive lines are provided. Alternately, substrate(s) may be transferred into load lock 656 on shelves (not shown) or otherwise where the wafer handler 406 is not desired to pass through the valve. Additional features 658 such as alignment modules, metrology modules, cleaning modules, process modules (ex: etch, deposition, polish, etc.), thermal conditioning modules or otherwise, may be incorporated in lock 656 or the transfer chambers. Service ports 660 may be provided to remove wafer handlers 406 or wafers from the tool. Wafer or carrier stockers 662, 664 may be provided to store and buffer process and or test wafers. Stockers 662, 664 may not be provided, such as where carts are directed to lithography tools directly. Another example is where indexer or wafer storage module 666 is provided on the tool set. Recirculation unit 668 may be provided to circulate and or filter air or the gas species in any given section such as tool section 612. Recirculation unit 668 may have a gas purge, particle filters, chemical filters, temperature control, humidity control or other features to condition the gas species being processed. In aAtty. Docket No.390P017053-WO (PCT) given tool section more or less circulation and or filter or conditioning units may be provided. Isolation stages 670 may be provided to isolate wafer handlers 406 and / or wafers from different processes or tool sections that cannot be cross contaminated. Locks or interconnects 672 may be provided to change wafer handler 406 orientation or direction in the event the wafer handler 406 may pick or place within a generic workspace without an orientation change. Any suitable combination of process sequences or make up could be provided.

[0111] Referring now to Fig. 9, the controller 199 controls the propulsion forces, generated by the array of electromagnets 1700, across the base 1510 so as to impart a controlled yaw moment on the base, yawing the base 1510 about a yaw axis (e.g., axis of rotation 777), substantially normal to the drive plane 1598, from a first predetermined orientation relative to the frame of the chamber 118 (such as where the end effector 1520 is substantially aligned with drive line 177), to a second different predetermined orientation relative to the frame of the chamber 118 (such as where the end effector is extended into process module 120). As may be realized yawing of the base 1510 may be performed in conjunction with propulsion motion of the base 1510 (such as where a single drive line is provided in the chamber 118) or with the base at a predetermined location (such as where the base 1510 is rotated while remaining substantially stationary along the X and Y axes). Referring also to Fig. 15C, the controller 199 may control the propulsion forces (e.g., Fxright, Fxleft), generated by the array of electromagnets 1700, so as to impart a moment couple (illustrated in Fig.15C with movement of the substrate handler 1500 along the X axis) on the base 1510 effecting controlled yaw of the base 1510 so as to effect at least one of positioning and centering of a substrate (also referred to as a wafer payload or payload) on the base 1510 relative to a predetermined substrate holding location (such as a load lock, process module, etc.) of the frame of the chamber 118. As may be realized, pitch (rotation about Y axis) and roll (rotation about X axis) (see Figs. 15A and 15B) control may be effected with the controller 199 (controlling lift forces Fz across the reaction platen) simultaneously with yaw motion countering dynamic moment coupling and maintaining substantially flat yaw of the wafer holder / reaction platen in the wafer transfer plane.Atty. Docket No.390P017053-WO (PCT)

[0112] Where a single drive line 177 is provided in each transfer chamber (as illustrated in Figs. 1A, 1B, 2, 4, and 5) or where access to a process module, such as process module 120A (see Fig. 8) from a drive line 178 closest to the process module 120A (such as when multiple substantially parallel longitudinal drive lines 177, 178 are provided – see Fig. 8), the controller 199 is configured to drive the base 1510 simultaneously in two or more of yaw, pitch, roll, and in propulsion (as described herein) to pick and place substrates from any suitable substrate holding stations (e.g. load locks 116, process modules 120, etc.). For example, the controller 199 is configured to energize the array of electromagnets 1700 as described herein so that the base moves along the drive line 177 and rotates about a base rotation axis 777 so that a substrate seating surface 1520A of the substrate handler 1520 enters a process module 120 or other suitable holding station where the substrate S travels along a substantially straight line path 790 in a predetermined wafer / substrate transfer plane. Referring to Figs. 8-11; although, where multiple longitudinal drive lines 177, 178 are provided in the transfer chamber 118 the base 1510 may be rotated so that the substrate handler 1520 is aligned with a desired / predetermined substrate holding station prior to entrance into the substrate holding station. For example, the base 1510 may be positioned at an intersection between drive lines 178 and 179A, where drive line 179 provides for extension and retraction of the substrate handler into substrate holding station 120BH of process module 120B (e.g., in a propulsion direction substantially orthogonal (or any suitable angle that enables access to the process module) to the propulsion direction along drive lines 177, 178). The base 1510 may be rotated about rotation axis 777 so that the substrate handler 1520 is aligned with the substrate holding station 120BH and the base may be moved along drive line 179A to move or extend the substrate handler 1520 into the substrate holding station 120BH for picking / placing a substrate(s).

[0113] Referring to Figs. 14 and 14A-14C, while the substrate handler 1500 has been described as including an end effector 1520; although, one or more substrate handlers may be configured as a cart 1500C that is configured to support one or more substrates on the base 1510. For example, the base 1510 may include one or more substrate supports 1431-1433 configured to stably hold aAtty. Docket No.390P017053-WO (PCT) substrate (e.g., from the bottom or edge grip) so that substrate handlers 1500, 1500A, 1500B or substrate transports within, e.g., a load or other substrate holding station, may transport substrate(s) to and from the substrate supports 1431-1433. The substrate supports 1431-1433 may be configured to substantially center one or more substrates on the base 1510 (i.e., the supports are self-centering supports, that are either passive supports or may be actuated (e.g., piezo-electric) from a suitable power source energized on the reaction platen) so that a center of the substrate(s) is substantially coincident with the axis of rotation 777 of the base. One or more of the carts 1500C may include a substrate support rack 1440 for holding two or more substrates in a stack, where each rack level includes respective substrate supports 1431-1433, 1431A- 1433A. Referring to Figs. 14 and 14A, the carts 1500C may provide an interface between the substrate handlers 1500A, 1500B and the load locks 116 where a transport apparatus 116R (such as a SCARA arm, linear sliding arm, etc.) of the load lock transfers substrate(s) to the cart 1500C and the substrate handlers 1500A, 1500B pick the substrates from the cart and vice versa. Where the process module 120 includes a transport apparatus 120R (such as a SCARA arm, linear sliding arm, etc.) the carts 1500C may be employed to transfer substrate(s) to and from the process module 120. While the base 1510 of the carts 1500C (and of the substrate handlers 1500, 1500A, 1500B) are illustrated as having a circular shape when viewed from the top (see Fig. 14C); although, the base 1510 may have any suitable shape (e.g., square, rectangular, circular, etc. when viewed from the top) that otherwise interfaces with the array of electromagnets 1700 for effecting one or more of linear propulsion, lift, yaw, pitch, roll, and rotation control of the base 1510.

[0114] Referring to Figs. 12A, 12B, 13A, 13B, while the transfer chamber 118 has been described above as a longitudinally extended chamber that forms part of a linear processing tool, the transfer chamber may have a cluster tool configuration. For example, referring to Figs. 12A and 12B the transfer chamber 118T1 has a substantially square configuration (although the transfer chamber may have any suitable shape such as hexagonal, octagonal, etc.). An electrical machine 1599R (substantially similar to the linear electrical machine 1599) may be configured asAtty. Docket No.390P017053-WO (PCT) a side-by-side transport apparatus that includes at least two side-by-side substrate handlers 1500A, 1500B that are substantially similar to substrate handler 1500 described herein. The array of electromagnets 1700 may be configured to move the substrate handlers 1500A, 1500B so that the substrate handlers 1500A, 1500B rotate about common axis of rotation 1277 (such axis being akin to a θ axis of, for example, a conventional SCARA type robot) for changing a direction of “extension and retraction” (the terms extension and retraction are being used herein for convenience noting that the extension and retraction is effected by linear propulsion movement of the substrate handler 1500, 1500A, 1500B along a respective drive line) of the side-by-side transport apparatus. For example, the array of electromagnets 1700 has an arrangement that forms drive lines 177, 178, 179, 180. Here drive lines 177, 178 are spaced from one another and substantially parallel to one other so as to be substantially aligned with a respective transport openings 1180A, 1180F and 1180B, 1180E. The drive lines 179, 180 are substantially orthogonal to drive lines 177, 178 and are spaced from one another and substantially parallel to one other so as to be substantially aligned with a respective transport openings 1180C, 1180H and 1180D, 1180G. The drive lines can be in any suitable pattern (such as arced or curved segments with constant or varying radii) and orientation and the description that follows is for exemplary purposes. The electromagnets 1700A-1700N (illustrated in Fig. 12A but not numbered for clarity of the figure) provide for at least linear propulsion of the substrate handlers 1500A, 1500B through the transport openings 1180A-1180H. The array of electromagnets 1700 may include rotational electromagnet sub-arrays 1231-1234 that effect, under control of controller 199, with the electromagnets that form the drive lines 177-180 the rotation of the substrate handlers 1500A, 1500B about the common axis of rotation 1277. Alternatively, the electromagnets may form a dense enough and large enough grid without being specifically designated for propulsion or rotation and can perform that function based on the base’s 1510 position and the control law of the controller 199. As may be realized, while the substrate handlers 1500A, 1500B may rotate about the common axis of rotation 1277 at the same time, extension and retraction of the substrate handler 1500A, 1500B may be independent of extension and retraction of the other one of the substrate handler 1500A, 1500B. In general, theAtty. Docket No.390P017053-WO (PCT) motion of the substrate handler 1500A, 1500B is independent of each other and the complexity of that motion can range from one degree of freedom to six degrees of freedom.

[0115] Referring to Fig. 12B, the substrate transport apparatus or electrical machine 1599R includes multiple transport levels 1220A, 1220B that are stacked one above the other. Each level 1220A, 1220B is formed by a respective level support 1221 each having a respective reference plane 1299R that is substantially parallel with the level reference plane 1299 of the transfer chamber 118T1 frame. Each level support 1221 includes an array of electromagnets 1700 substantially similar to that illustrated in Fig. 12A for linearly driving the side-by-side substrate handlers 1500A, 1500B along drive lines 177-180 and rotating the side by side substrate handlers 1500A, 1500B (e.g., with full six degree of freedom control) about the common axis of rotation 1277. Each level support 1221 is coupled to a common Z axis drive 1211 that moves the level supports 1221 and the substrate handlers 1500A, 1500B thereon in the Z direction so as to align the end effectors 1520 of the substrate handlers 1500A, 1500B on the respective level supports 1221 with a substrate transport plane 1290 of the transport openings 1180 of the transfer chamber 118T1. The Z axis drive 1211 may be any suitable linear actuator such as a screw drive, electromagnetic drive, pneumatic drive, hydraulic drive, etc.

[0116] Referring to Figs. 13A and 13B the transfer chamber 118T2 may have a substantially hexagonal configuration (although the transfer chamber may have any suitable shape as noted herein). The electrical machine 1599R (substantially similar to the linear electrical machine 1599 of Fig. 15C) is configured as a radial transport apparatus that includes a substrate handler 1500 having a double ended / sided end effector 1520D, as will be described herein (although a single ended / sided end effector may be employed). The array of electromagnets 1700 may be configured to rotate the substrate handler 1500 about axis of rotation 1377 (such axis being akin to a θ axis of, for example, a conventional SCARA type robot) for changing a direction of “extension and retraction” (the terms extension and retraction are being used herein for convenience noting that the extension and retraction is effected by linear propulsion movement of the substrate handler 1500 along a respective drive line), and linearly propel the substrateAtty. Docket No.390P017053-WO (PCT) handler 1500 so as to extend through the transport openings 1180A-1180F. For example, the array of electromagnets 1700 has an arrangement that forms radially offset drive lines 177, 178, 179, where an angle α between adjacent drive lines depends on the number of sides / facets of the transfer chamber 118T2 on which the transport openings 1180A-1180F are located. The electromagnets 1700A-1700N (illustrated in Fig.12A but not numbered for clarity of the figure) provide for at least linear propulsion of the substrate handler 1500 through the transport openings 1180A-1180H and rotation of the substrate handler 1500 about axis of rotation 1377 with full six degree of freedom control so as to maintain linear transport and rotation in a desired attitude in pitch and roll.

[0117] Referring to Fig.13B, the electrical machine 1599R may include multiple transport levels 1320A, 1320B that are stacked one above the other in a manner substantially similar to that described above with respect to Fig.12B. For example, each level 1320A, 1320B is formed by a respective level support 1321 each having a respective reference plane 1299R that is substantially parallel with the level reference plane 1299 of the transfer chamber 118T1 frame. Each level support 1321 includes an array of electromagnets 1700 substantially similar to that illustrated in Fig. 13A for linearly driving (along drive lines 177-179) and rotating (about axis 1377) the substrate handler 1500. Each level support 1321 is coupled to a common Z axis drive 1311 (that is substantially similar to Z-axis drive 1211) that moves the level supports 1321 and the substrate handler 1500 thereon in the Z direction so as to align each of the end effector 1520D of the substrate hander 1500 on the respective level supports 1321 with a substrate transport plane 1390 of the transport openings 1180 of the transfer chamber 118T2.

[0118] Referring to Figs.12B and 13B, the vertical motion provided by the Z actuator 1211 can be used for enabling the wafer handler 1220A or 1220B to perform wafer handoff operations such as pick or place to / from a wafer process station. The supports 1221, 1321 can include a single module (level) with the purpose of providing additional elevation capability to the wafer handler 1220A, 1220B to achieve larger vertical strokes during the wafer handoff operations. For example, in the case of process modules or load locks that have more than one stacked waferAtty. Docket No.390P017053-WO (PCT) slot, it would be advantageous to have a vertical lift apparatus such as Z-axis actuator 1211, 1311 to be able to reach each of the stacked wafer slots without increase of applied levitation power provided by the electrical machine 1599R.

[0119] Referring to Figs. 12A and 12B, the vertical lift apparatus (or Z-axis actuator) 1211 and level 1221 may have dual (or more) separate and independently operable apparatus, e.g., one for each wafer handler 1520. This would give the ability to perform independent vertical strokes for different wafer handlers that can access different slots on at least two independent stations (e.g., process modules, load locks, etc.).

[0120] Referring now to Figs. 15A, 15B, 15C, 16A, 16B, 16C, 18, and 18A, the substrate transport apparatus or linear electrical machine 1599 will be described in greater detail (again noting that the electrical machine 1599R is substantially similar to the linear electrical machine 1599). Generally, the linear electrical machine 1599 includes a structure (e.g., wafer handler) 1500 without magnets and any moving parts such as bearings, revolute or prismatic joints, metal bands, pulleys, steel cables or belts. As noted above, the structure or wafer handler 1500 includes the base 1510 that is formed of a paramagnetic material, diamagnetic material, or a non- magnetic conductive material. The base 1510 may have any suitable shape and size for cooperating with the electromagnets 1700A-1700n of the array of electromagnets 1700 so as to stably transport substrates S in the manner described herein. As will be described herein, such as where multiple wafer handlers 1500 are employed, the shape and size of the base 1510 may define a unique identification signature that identifies the wafer handler 1500 with respect to absolute position determination of the wafer handler in the manner(s) described herein.

[0121] As illustrated in Figs. 9 and 11-16C the base 1510 is shown with a frusto-conical shape where the tapered side 1510TS of the frustum 1510FR face the array of electromagnets 1700 (although other suitable shapes are operative). The tapered side 1510TS of the frusto-conical shape have an angle λ (see Fig. 15B) that is between about 50° and about 60° relative to the planar surfaces of the frustum 1510FR; although, the angle λ may be greater than about 60° orAtty. Docket No.390P017053-WO (PCT) less than about 50°. The base may have a frusto-pyramidal shape as shown in Figs. 8, 8A, and 10. Here each side 1510TSP of the frustum 1510FRP have an angle λ (see Fig. 8B) that is between about 50° and about 60° relative to the planar surfaces of the frustum 1510FRP; although, the angle λ may be greater than about 60° or less than about 50°. While the frusto- pyramidal shape is illustrated as having four sides, the frusto-pyramidal shape may have any suitable number of sides, such as, for example, six or eight sides or may be round or have curved sides. The base 1510 may not have a frusto-conical or frusto-pyramidal shape and it may comprise of a planar shape with suitable and asymmetric contour and size in order to be properly controlled by electromagnets 1700.

[0122] The end-effector 1520, 1520D may be substantially similar to conventional end effectors; however, as described herein the end effector is rigidly coupled to the base 1510. As an example, the end effector may be a single sided / ended (see end effector 1520) with a single substrate holding location 1520A, a double sided / ended (see end effector 1520D) with two longitudinally spaced apart substrate holding locations 1520A, 1520B, a side-by-side configuration where multiple substrate holding locations are arranged side-by-side (e.g., laterally spaced apart) and supported from a common base so as to extend through side-by-side substrate transport openings, a stacked configuration were multiple substrate holding locations are arranged in a stack one above the other and supported from a common base so as to extend through vertically arrayed substrate transport openings. The end effector may have any suitable configuration. The end effector 1520, 1520D may be made of materials that can one or more of withstand high temperatures, have low mass density, have low thermal expansion, have low thermal conductivity and have low outgassing. A suitable material from which the end effector 1520, 1520D may be constructed is Alumina Oxide (A12O3), although any suitable material may be used.

[0123] The end-effector 1520, 1520D may be coupled to the base 1510 with a substantially rigid and unarticulated stanchion 1510S so as to set the end-effector 1520, 1520D at a suitable nominal height H2 relative to, for example, the level reference plane 1299. The substrate handlerAtty. Docket No.390P017053-WO (PCT) 1500, as described herein, is moved in space (in at least three degrees of freedom) using electrodynamic levitation principles. The actuation elements (e.g., the array of electromagnets 1700), as shown in Figs. 15A-15C, 16B, 16C, and 18 include independently controlled coils or electromagnetics 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5 (also referred to herein as coil segments) that generate desired magnetic field that induces thrust and lift force vectors in the base 1510. As will be described herein, the independently controlled coils or electromagnetics 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 also effect self- deterministic absolute wafer handler position feedback for each wafer handler(s) 1500.

[0124] Referring to Figs. 10, 10A, 11, and 11A, multiple wafer handlers may be nested with respect to each other so as to travel linearly along the drive lines 177-180 as a single unit with the end effectors 1520 of the nested substrate handler disposed in a stack one above the other. For example, referring to Figs. 10 and 10A the nested bases 1510FP (may be symmetrical as a body of revolution, revolute symmetry e.g., frusto-conical, or bi-symmetrical, e.g., frusto- pyramidal, or a channel shaped cross section of which are illustrated in Fig.10A) are configured so that one base 1510FP may be inserted into another base 1510FP so as to stack the bases 1510FP in a manner similar to that of stacking cups one inside the other. The bases 1510FP may be configured so that when stacked the vertical space between end effectors 1520 (e.g., when the end effectors 1520 are substantially level with the level reference plane 1299) is substantially the same as a vertical space between stacked substrate holding stations so as to provide for simultaneous picking and placing of substrates by the stacked end effectors 1520. The stacking of the bases 1510FP may provide, depending on the levitation forces generated by the array of electromagnets 1700, independent vertical or Z-axis movement of at least one of the bases 1510FP (and the respective substrate handler 1500A, 1500B the base is part of). In this example, the uppermost substrate handler 1500B may be moved in the Z-axis independent of the lowermost substrate handler 1500A; however, when the uppermost substrate handler 1500B is lifted away from the lowermost substrate handler 1500A, the lowermost substrate handler 1500AAtty. Docket No.390P017053-WO (PCT) may also be moved in the Z-axis direction independent of the uppermost substrate handler 1500B. Here, bi-symmetrical bases are interlocked and rotation of the substrate handlers 1500A, 1500B is linked by virtue of the shape of the bases 1510FP so that the substrate handlers 1500A, 1500B rotate in unison. The stackable configuration of the bases 1510FP provides for the stacking of any suitable number of substrate handlers one above the other (in this example two are shown stacked one above the other; although, more than two substrate handlers may be stacked one above the other).

[0125] Referring to Figs.11 and 11A, the revolute symmetry bases 1510FC may be stacked one above the other, moved in the propulsion direction, and moved relative to each other along the Z- axis in a manner substantially similar to that described above with respect to the frusto-pyramidal bases 1510FP. However, the revolute symmetry shape of the bases 1510FC may not interlock and provide for independent rotation of each substrate handler 1500A, 1500B about substrate handler axis of rotation relative to another of the substrate handlers 1500A, 1500B. Independent rotation of the frusto-conical based substrate handlers 1500A, 1500B effects a fast swapping of substrates from a single substrate holding station such as where end effector 1520 of substrate handler 1500A is aligned with substrate holding station 120BH for picking substrate S1, where end effector 1520 of substrate handler 1500B is rotated to a position so as to not extend into the substrate holding station 120BH. Once the substrate S1 is removed from substrate holding station 120BH by substrate handler 1500A, the positions of the end effectors 1520 of the substrate handlers may be swapped so that end effector 1520 of substrate handler 1500B is aligned with the substrate holding station 120BH for placing substrate S2 at the substrate holding station 120BH while end effector 1520 of substrate handler 1500A is rotated to a position so as to not enter the substrate holding station 120BH. As may be realized, the substrate handlers 1500A, 1500B may be moved along the Z-axis to accommodate the stacked heights of the end effectors relative to a height of the substrate holding station 120BH. Though symmetrical (revolute about one or more axis) bases have been illustrated, one or more bases may be asymmetrical or lacking any axis of symmetry.Atty. Docket No.390P017053-WO (PCT)

[0126] As described herein linear propulsion is generally provided by one or more linear tracks 1550 of independently controlled electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2- 1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5. The number of electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5- 1700n5. Where there is more than one linear track 1550 the linear tracks 1550 are substantially parallel to each other and are spaced apart from one another depending on dimensions of the base 1510 so as to control all six degrees of freedom (roll, pitch, yaw, and translation in each of the X, Y, Z directions) of the substrate handler in space. For example, as illustrated in Figs. 15B and 18, the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 may be spaced apart from each other so that two or more electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5 (cooperating so as to form a motor actuator (e.g., the motor primary) 1701 and in combination with the base (e.g., the motor secondary) 1510 the motor) of each parallel linear track 1550 are disposed underneath the base 1510 at all times in the direction of motion of the base 1510 so as to stably levitate and propel the base 1510 (as may be realized, Figs.15A, 15B, and 18 schematically illustrate a representative configuration of the system, and are provided to show generally an exemplary representation of the interrelationship between the base 1510 and the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3- 1700n3, 1700A4-1700n4, 1700A5-1700n5, and is not intended as limiting in any way.

[0127] The size, numbers, and spacing (e.g., pitch) of the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3. 1700A4-1700n4, 1700A5-1700n5 in both the X and Y axes may vary, as may the size and shape of the base 1510 in relation to the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5. For example, referring to Figs. 6, 18, and 18A, the spacing between the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5 may vary between pitch PX1 and pitch PX2 where the pitch PX2 is smaller than pitch PX1 and provides for greater definition of movement of the base 1510 andAtty. Docket No.390P017053-WO (PCT) wafer handler 1500. Here, the larger pitch (or greater distance between electromagnets) such as pitch PX1 is employed for long movements of the wafer handler 1500 where position location of the wafer handler 1500 is to be grossly known. In areas where picking and placing of substrates S occurs (or other areas where wafer handler position is to be known with increased position definition / accuracy), such as at the process module 120, the spacing or pitch PX2 between the electromagnets is decreased to provide a higher electromagnet density that effects greater definition of position location of the wafer handler 1500 (compared to the definition of position location provided by electromagnets spaced apart by the larger pitch PX1) so that the wafer handler 1500 picks and places substrates S at the process module 120 with sub-micron position accuracy. In the examples illustrated the pitch PX of the electromagnets 1700A-1700n, 1700A1- 1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 is shown as varying in the X direction along the longitudinal length of the transfer chamber 118 to provide varying degrees of wafer handler position accuracy; however, the pitch of the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5- 1700n5 may also vary in the Y direction (see pitches PX3 and PX4) along a lateral width of the transfer chamber 118 so as to provide increased accuracy with respect to wafer handler 1500 rotations and / or Z axis height movements. For example, in the areas where picking and placing of substrates S occurs (or other areas where wafer handler position is to be known with increased position definition / accuracy) the pitch between electromagnets may be a decreased pitch PX3 compared to a pitch between the electromagnets in the areas of long motions (e.g., motions between substrate holding stations) where wafer handler rotations and Z height motions are not desired.

[0128] As illustrated in Figs. 8, 18, and 18A, the array of electromagnets 1700 may include stabilization tracks 1550S disposed laterally outward of the tracks 1550. In Fig. 18 the stabilization tracks 1550S may be formed by one or more rows of the electromagnets 1700A- 1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5. The stabilization tracks may be substantially similar to the tracks 1550 and are configured toAtty. Docket No.390P017053-WO (PCT) provide additional stabilization of the base 1510 through the generation of additional lift and / or propulsion forces (e.g., in addition to the lift and propulsion forces generated by electromagnets of the parallel linear tracks 1550) that act on the base 1510. The result is a substrate handler 1500 that can move along a direction of the tracks 1550 (i.e., the propulsion direction) while changing orientation in one or more of roll, pitch and yaw. According to magnetic induction principles where the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3- 1700n3, 1700A4-1700n4, 1700A5-1700n5 are akin to the “primary” and the base 1510 corresponds to the “secondary” where electrical currents are induced by means of Eddy current effects.

[0129] Figs.17 and 20 illustrate an actuator control system network (also referred to herein as a controller system) 1799 (which may be part of or communicably coupled to controller 199), in accordance with the present disclosure, configured to effect individual control of each electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4- 1700n4, 1700A5-1700n5 to provide the desired force components and degrees of freedom described and illustrated with respect to Figs.15A-16C.

[0130] The controller system 1799 has a distributed control configuration (see, e.g., Figs.17, 20- 23F, and 43-44) with a master controller 199 and more than one coil controllers 1750A-1750n communicably connected to each other. The master controller 199 and the more than one coil controllers 1750A-1750n are communicably connected to each other by a deterministic network for real time controls (e.g., real time control of the coil controllers and of the substrate handlers 1500). Suitable examples of the deterministic network include, but are not limited to, EtherCat®, FireWire®, SyncNet™, CAN, and Sercos®networks. The master controller 199 may be configured to send master commands MC (see, e.g., Fig. 1 noting the master commands are omitted in the other figures depicting the controller for clarity of the drawings) describing high level control variables to the more than one coil controllers 1750A-1750n operably coupled to the array of electromagnets 1700 and the power source 1585 and configured so as to sequentially excite the electromagnets with a predetermined excitation characteristic so as to describe sixAtty. Docket No.390P017053-WO (PCT) degree of freedom reaction platen control of each of the at least one reaction platen (e.g., substrate handler 1500), and the at least one reaction platen is levitated and propelled with at least four degrees of freedom. The master controller 199 may be configured to send master commands MC and a feed forward term to the more than one coil controllers 1750A-1750n operably coupled to the array of electromagnets 1700 and the power source 1585 and configured so as to sequentially excite the electromagnets with a predetermined excitation characteristic, where the master commands MC describe high level control variables, and the feed forward term modulates the high level control variables so as to describe six degree of freedom reaction platen control of each of the at least one reaction platen 1510, and the at least one reaction platen 1510 is levitated and propelled with at least four degrees of freedom. It is noted that the master command, position / feedback, feedforward, and other control loops described herein that are output to the coil controllers 1750A-1750n are configured for output as a determinative network output for real time controls of the coil controllers 1750A-1750n (and the substrate handlers 1500).

[0131] Each respective coil controller 1750A-1750n is coupled to a number of electromagnets at a predetermined location in the array of electromagnets 1700 corresponding to the respective coil controller 1750A-1750n so that the number of electromagnets at the corresponding predetermined location are controlled by the respective coil controller 1750A-1750n separate and distinct from each other coil controller 1750A-1750n of the controller system 1799 (that control electromagnets at each other location of the array of electromagnets 1700), and each reaction platen (e.g., substrate handler 1500) is levitated and propelled with the at least four degrees of freedom based on the high level control variables and the corresponding predetermined location, stored in the respective coil controller 1750A-1750n, of the electromagnets at the corresponding predetermined location. Each other coil controller 1750A-1750n may respectively control electromagnets 1700A-1700n at other corresponding locations of the array 1700, so that electromagnets 1700A-1700n at each other corresponding location are controlled by a different respective coil controller 1750A-1750n.Atty. Docket No.390P017053-WO (PCT)

[0132] The actuator control system may be configured so that the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 form motor actuator units (collectively referred to as the motor actuator), each motor actuator unit having m number of electromagnets / coils cooperating to form the motor (where m is a dynamically selectable number of two or more electromagnets forming one or more of the motor actuator units as will be described further below). The actuator control system network 1799 is thus a scalable motion control system that has a clustered architecture with at least a master controller 1760 and distributed local drive controllers 1750A-1750n as will be described in greater detail below. Matrices or groups of electromagnets 1700G1-1700Gn may be coupled to a respective local drive or coil controller 1750A-1750n that is configured to control the electrical currents on electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 within the respective group of electromagnets 1700G1- 1700Gn. The local drive controller 1750A-1750n can be a “slave” in a network that is connected to a master controller 1760 that is configured to output a set of control variables (as described herein) that are sent to the local drive controllers 1750A-1750n along with substrate handler 1500 location information via the data network, where the local drive controllers 1750A-1750n employ the set of control variables and substrate handler 1500 location for determining whether to energize one or more of their respective electromagnets. The drive controllers 1750A-1750n, illustrated generally as drive controller 1750 in Fig. 20 (where Fig. 20 illustrates a drive controller and its respective group of electromagnets 1700G1-1700Gn) are coupled to the respective electromagnets 1700A-1700n by an amplifier drive circuit 2010 as will be described herein.

[0133] As will also be described herein, the electromagnets 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 can be physical electromagnets / coils that can be dynamically configured when it comes to the respective “phase” definitions of each coil with respect to “phase” definitions of the other electromagnets / coils of the given motor actuator unit so that the position of the given motor actuator unit (formed ofAtty. Docket No.390P017053-WO (PCT) cooperative excitation phases of the motor under propulsion) may be deemed as moving virtually in unison with the base propulsion, though the physical electromagnets / coils are fixed (e.g., static) as will be described further below. This provides continuity in the desired force vectors for motion control of the substrate handler.

[0134] In accordance with the present disclosure, and referring to Figs. 18, 18A, and 19, the controller 199 may be operably coupled to the array of electromagnets 1700 and the alternating current power source 1585 and configured to sequentially excite the electromagnets 1700A- 1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 with multiphase alternating current with a predetermined excitation characteristic (such as, e.g., inductance, a phase lag / amplitude, and / or power factor as will be described herein – see also Figs. 22 and 24) so that each reaction platen or base 1510 (of the wafer handler 1500 or cart 1500C) is levitated and propelled with the at least four degrees of freedom. As described herein, the array of electromagnets 1700 is configured to produce levitation and propulsion forces that drive, under control of controller 199, the substrate handler 1500 along a predetermined trajectory. The controller may be configured so as to determine reaction platen position feedback, in at least one degree of freedom from the at least four degrees of freedom, in any suitable manner. For example, the controller 199 is configured to determine reaction platen position feedback (i.e., referred to herein as a position feedback signal PFBS) from one or more of a variance in a predetermined excitation characteristic (e.g., changes in inductance, impedance, phase lag / amplitude, and / or power factor signature) of the alternating current of at least one electromagnet 1700A-1700n, 1700A1-1700n1, 1700A2-1700N2, 1700A3-1700n3, 1700A4-1700n4, 1700A5-1700n5 effecting levitation or propulsion of the base 1510 (as described in United States patent application number 18 / 050,300, previously incorporated herein by reference in its entirety) and any suitable vision system VS configured to track movement of the reaction platen (see also Fig. 1A noting the vision system may be included in any of the processing apparatus described herein, where the vision system includes any suitable cameras,Atty. Docket No.390P017053-WO (PCT) scanners, etc. configured to determine, through machine vision and suitable machine vision algorithms of the controller 199, the location of the substrate handler(s)).

[0135] Still referring to Figs. 18, 18A and also to Figs. 21 and 23B, as described herein, the linear electric machine 1599 includes a matrix of independently controlled electromagnets or coil actuators 1700A-1700n, that wen energized induce a magnetic levitation field on a predetermined one or more of the substrate handler 1500. To control all six degrees of freedom of the substrate handler 1500 a determination is made, such as by master controller 199, as to which coil actuators 1700A-1700n can contribute to forces and moments on substrate handler 1500 where these determined coil actuators 1700A-1700n are energized to generate desired propulsion and levitation forces on the substrate handler 1500 that produce a desired motion path of the substrate handler 1500.

[0136] The master controller 199 is programmed or otherwise configured to determine kinematic motion of the base 1510 from an initial substrate handler pose to a final substrate handler pose. The master controller 199 is also programmed or otherwise configured to determine the kinematics of attitude / yaw control (in three degrees of freedom – pitch, roll, and yaw) related to the determined kinematic motion. The kinematic motion and kinematics of attitude / yaw (i.e., control variable values) may be determined, using, for example, one or more of a dynamic model and a form factor in combination with a predetermined substrate processing recipe (e.g., where and when the substrate is to be transferred and what process is to be performed on the substrate) in a manner substantially similar to that described in United States patent application number 18 / 050,300 previously incorporated by reference herein in its entirety. The kinematic motion and kinematics of attitude / yaw (i.e., the control variable values) may be determined, using, for example, a neural network 199N in combination with a predetermined substrate processing recipe (e.g., the substrate processing recipe defining where and when the substrate is to be transferred and what process is to be performed on the substrate).Atty. Docket No.390P017053-WO (PCT)

[0137] Fig. 21 illustrates a distributed network of drive or coil controllers 1750A-1750n where each coil controller 1750A-1750n is communicably coupled (e.g., through a wired or wireless connection) to a respective matrix or group of coil actuators 1700G1-1700Gn. Each (or all) of the coil controllers 1750A-1750n are communicably coupled (e.g., through a wired or wireless connection) to the master controller 199 through, for example, the data network (which may be a wired or wireless network). Power is provided to each coil controller 1750A-1750n and the master controller 199 in any suitable manner, such as by independent power lines or by power transmitted through the data network cable (such as, or in a manner similar to, power over Ethernet).

[0138] For exemplary purposes only, Fig. 21 illustrates two substrate handlers 1500A, 1500B that may be simultaneously controlled with any suitable control algorithm (such as of the master controller 199) which configures the master controller 199 to send commands to each of the coil controllers 1750A-1750n. The coil controllers 1750A-1750n employ the commands to effect generation of the desired forces and moments on each substrate handler 1500A, 1500B so that the substrate handlers 1500A, 1500B travel along a desired motion path in space (i.e., within the transfer chamber 118). Here, the data network traffic propagates in a deterministic real time execution where, as described in greater detail herein, the data network traffic is collected and processed within tight execution times constraints in order to maintain stability of each substrate handler 1500A, 1500B motion in space.

[0139] Fig. 23A illustrates one example of a motion control architecture operating in the data network. Here, the master controller 199 includes a processor and operating system that configure the controller 199 (e.g., with any suitable non-transitory computer program code) to effect (or run thereon) a deterministic position (or feedback) control loop at a sampling rate (e.g., such as 1 KHz, although the sampling rate may be greater or less than 1 KHz) that is fast enough to be able to control the motion of the levitating substrate handlers 1500A, 1500B. The (master) controller 199 includes a path planning module PPM that is configured to define a set of desired trajectories for each of the levitating substrate handlers 1500A, 1500B. The path planningAtty. Docket No.390P017053-WO (PCT) module PPM defines a planned trajectory (such as in the at least four degrees of freedom along one or more drivelines 177-180) of the at least one reaction platen 1510, and has a control module (such as control law module CLM) that calculates, based on the planned trajectory, the high level control variables that describe the six degree of freedom control and effect the planned trajectory. The respective coil controller 1750A-1750n may be configured to receive the master commands MC (see, e.g., Fig.1) describing the high level control variables, and generate, based on the high level control variables, output signals to excite each of the number of electromagnets, corresponding to the respective coil controller, effecting levitation and propulsion of the at least one reaction platen 1510 (such as of one or more of substrate handlers 1500A, 1500B) with the at least four degrees of freedom control along the planned trajectory (see Fig. 23A). The master commands MC may include pose information of the at least one reaction platen 1510 with respect to the reference plane 1299 (see, e.g., at least Figs.15A, 26A, 32, 33, 34). The respective coil controller 1750A-1750n may be configured with location information LL (see, e.g., Fig.17) that informs the corresponding predetermined location of the number of electromagnets 1700A- 1700n with respect to the reference plane 1299. The respective coil controller 1750A-1750n may control and effect excitation of the number of electromagnets 1700A-1700n at the corresponding predetermined location based on the location information LL and pose information of the at least one platen 1510. The respective coil controller 1750A-1750n may be configured so as to effect local control, separate from each of the high level control variables received from the master controller 199, of excitation of the number of electromagnets 1700A- 1700n at the corresponding predetermined location.

[0140] Referring also to Fig.41, the path planning module PPM may be similar to that described in United States patent application number 18 / 050,300 filed on October 27, 2022, the disclosure of which was previously incorporated herein by reference in its entirety. For example, the local drive controller 1750A-1750n (or the controller 199, such as where the local drive controller 1750A-1750n conveys the voltage and current to the controller 199 for position determination) are configured with any suitable strategy for position determination of the substrate handler(s)Atty. Docket No.390P017053-WO (PCT) 1500 within the transfer chamber 118. As an exemplary position determination strategy, the controller 199 of local drive controllers 1750A-1750n include a finite element model (FEA) configured to provide a matrix of coil inductances based on the position of the substrate handler 1500 within the transfer chamber 118. Here a multidimensional table (referred to as a forward position-inductance table and represented as FEA model 4110 in Fig.41) is generated that relates each substrate handler 1500 spatial position in the array of electromagnets 1700 to the respective inductances of the electromagnets in the array of electromagnets 1700. The respective inductances of the electromagnets 1700 may be referred to as a coil inductance matrix that is associated with a given six degree of freedom position of the base 1510 of the substrate handler 1500. An inverse position inductance table (represented in Fig.41 as inverse FEA model 4111) is generated from the forward position-inductance table 4110. The inverse position inductance table 4111 is configured to effect determination of the substrate handler 1500 position based on the coil induction matrix. As may be realized, other variables or their combinations can be employed in addition to the coil inductance, such as power factor and impedance. To determine the define a set of desired trajectories for each of the levitating substrate handlers 1500A, 1500B the controller 199 (or local drive controllers 1750A-1750n) includes an inductance estimator 4120 configured to estimate the real time inductances L of the elements of the coil induction matrix based on the voltages and currents of the electromagnets in the array of electromagnets 1700. The inductance estimator 4120 is configured to estimate the real time inductances L of the electromagnets in the array of electromagnets 1700 based on the alternating current voltages CV and currents I (determined in any suitable manner such as described in United States patent application number 18 / 050,300 filed October 27, 2022).

[0141] A position feedback signal PFBS (e.g., obtained in the manner described herein) is received by (in the case of, e.g., vision system or other sensor feedback) or generated by (in the case of variance in predetermined excitation characteristics of the alternating current of at least one electromagnet) the controller 199, where the position feedback signal PFBS includes or otherwise embodies a six degree of freedom vector for each levitating substrate handler 1500A,Atty. Docket No.390P017053-WO (PCT) 1500B. The controller 199 also includes a control law module CLM that is configured to receive the actual trajectories (e.g., from position feedback) and desired trajectories of the substrate handlers 1500A, 1500B and calculate (or otherwise determine) a set of control signal outputs for each coil actuator 1700A-1700n in the network of coil controllers 1750A-1750n. As an example, the control law of the control law module CLM can be a set of six proportional-Integral- Derivative (PID) control equations associated with the tracking errors of each degree of freedom (e.g., such as X, Y, Z, roll, pitch, and Yaw) respectively of each substrate handler 1500A, 1500B. As an example, for induction based levitation of the substrate handlers 1500 as described herein, the control output variables associated with the respect coil actuators 1700A-1700n may be a desired alternating current amplitude and alternating current phase angle between neighboring coil actuators 1700-1700n or relative to a reference coil actuator of the array of coil actuators 1700. The notation of such variables is illustrated in Fig.23A as Magijkand Phijk, for alternating current (AC) current magnitude and phase angle, respectively.

[0142] As used herein, the term “magnitude” refers to the amplitude of an alternating current flowing to a respective coil actuator 1700A-1700n at a certain frequency in Hertz. The term “phase angle” refers to an amount of phase shift between AC current on a given coil actuator 1700A-1700n relative to the reference coil actuator or its immediate neighboring coil actuator. Indices i, j, and k range from 1 to L, 1 to N, and 1 to M respectively (where L, N, and M are integers denoting an upper limit number of the respective index).

[0143] As can be seen in, e.g., Fig.23A each of the matrices or groups of coil actuators 1700G1- 1700Gn has a total of LxN coil actuators and there is a total of M coil controllers 1750A-1750n. The total coil phase matrix illustrated in Fig. 247A includes all required phase angles of all coil actuators 1700A-1700n. Likewise, the coil magnitude matrix includes all required AC current amplitudes, where each AC current magnitude and phase is calculated by the master controller 199 at each controller sampling period. For exemplary purposes only, if the position control loop runs at 1 KHz, the AC current magnitude and phase is calculated within a 1 msec time interval (e.g., what may be referred to as deterministic real time execution) and the dataAtty. Docket No.390P017053-WO (PCT) associated with the AC current magnitude and phase is transmitted to the coil controllers 1750A- 1750n through the data network. Depending on a number of coil actuators 1700A-1700n in the processing apparatus (such as those described herein), the data network traffic over the data network is linearly scalable with the number of coil actuators 1700A-1700n where the data network traffic and number of coil actuators 1700A-1700n may be limited by a traffic capacity of the data network.

[0144] As illustrated in Fig.23B, the data network traffic transmitted over the data network may be reduced compared to what is illustrated in Fig. 23A in a manner that is insensitive to the number of actuator coils 1700A-1700n and coil controllers 1750A-1750n. In this example the control law module CLM is configured (e.g., with the set of six PID control equations noted above) to output the set of six control variables in the form of a control vector [U1m, U2m, U3m, U4m, U5m, U6m] (such control vector referred to for brevity as 6CV) where m = 1, ..., NWH(which is the number of substrate handlers 1500). As may be realized, there are six control variables for each substrate handler 1500 because the number of outputs required to control a six degrees of freedom rigid body levitating in space is six. The control outputs for the one or more substrate handlers 1500 of the processing apparatus described herein may collectively be referred to as a control output matrix (NWHx 6CV) COM. The data traffic over the data network in this example includes the control output matrix COM and spatial locations matrix SLM (NWH x 6SL) of the one or more substrate handlers 1500. The spatial locations matrix SLM includes a respective spatial location Xm, Ym, Zm, RXm, RYm, RZm (collectively referred to as 6SL and as determined in the manner described herein) of each of the one or more substrate handler 1500, where Xm, Ym, Z, represent the Cartesian location of the mthsubstrate handler 1500 (e.g., in a respective transfer chamber 118) and RXm, RYm, RZm represent the roll, pitch, and yaw orientation of the respective mthsubstrate handler 1500. Both the control output matrix COM and spatial location matrix SLM are sent (e.g., broadcast over the data network) to each of the slave coil controllers 1750A-1750n by the master controller 199.Atty. Docket No.390P017053-WO (PCT)

[0145] In the example illustrated herein, each of the coil controllers 1750A-1750n is communicably coupled to a respective group of coil actuators 1700G1-1700Gn, which respective group of coil actuators 1700G1-1700Gn has a known spatial location within the transfer chamber 118. In the example illustrated in Fig. 23B, each coil controller 1750A-1750n is configured to determine, based on the received spatial location matrix SLM, whether or not to energize one or more respective coil actuators 1700A-1700n of the respective coil actuator group 1700G1- 1700Gn. Where a coil controller 1750A-1750n determines that one or more respective coil actuators 1700A-1700n of the respective coil actuator group 1700G1-1700Gn are to be energized to impart forces and moments on a substrate handler 1500, the coil controller 1750A-1750n is configured to define or otherwise calculate (based on the control output matrix COM) an alternating current magnitude current and phase for each respective coil 1700A-1700n of the respective coil actuator group 1700G1-1700Gn contributing (e.g., based on the spatial location of the substrate handler 1500 determined by the spatial location matrix SLM) to the levitation of the substrate handler 1500, so as to generate the forces and moments on the substrate handler 1500. For example, where a coil controller 1750A-1750n receives the coil output matric COM and spatial location matrix SLM but there is no substrate handler 1500 overlapping (in space) the actuator coils 1700A-1700n of the respective coil actuator group 1700G1-1700Gn, the coil controller 1750A-1750n does not actuate (i.e., at least the alternating current magnitude remains zero) any coil actuators 1700A-1700n within the respective coil actuator group 1700G1-1700Gn.

[0146] For exemplary purposes, a comparison is made between the exemplary control architectures illustrated in Figs. 23A and 23B, with exemplary reference to the processing apparatus architecture of Fig. 18A (which may have a similar architecture to any of the processing tools described herein) where there are two substrate handlers 1500A, 1500B and a total of 210 actuator coils. Here, with the control architecture of Fig.23A the expected network traffic (i.e., variables to be transmitted over the data network) would be:

[0147] ENT = NWHx NTC [eq.1]Atty. Docket No.390P017053-WO (PCT)

[0148] Where ENT is the estimated network traffic, NWHis the number of substrate handlers, and NTC is the total number of actuator coils. In the example illustrated in Fig. 23A, the estimated network traffic is 2 x 210 = 420 variables expected to be transmitted over the data network per control sampling period. At a control sampling period of 1 KHz, 420,000 variables would be transmitted over the data network per second. In contrast to this, the estimated network traffic of the control architecture illustrated in Fig.23B may be calculated as:

[0149] ENT = NWHx (6 + 6) [eq.2]

[0150] where there are six control outputs and six spatial variables per substrate handler 1500. Here, the number of variables to be transmitted over the data network is 2 x (6 + 6) = 24 variables versus the 420 noted above (about a 94% reduction in data network traffic). As the linear tool grows larger (e.g., more substrate handlers and / or actuator coils are added), the control architecture of Fig. 23B will still require only the same 24 variables to be transmitted over the data network, while the control architecture of Fig.23A will require additional variables to be broadcast as indicated above. As can be seen here, the control architecture of Fig.23B may simultaneously reduce network (data) traffic (compared to the control architecture of Fig. 23A) while being insensitive to a number of coils and coil controllers.

[0151] Still referring to Figs. 23A and 23B, the present disclosure may provide for a neural network component in the illustrated control architectures and respective control loops. It is noted a model-based controller may be challenging to implement with respect to induction based control of a substrate handler 1500 in processing apparatus such as described herein. Referring also to Fig.23C (see also Fig.44), a neural network 199N is integrated with the master controller 199 of Figs. 23A, 23B so that the control architecture thereof is a neural network based control architecture. A schematic holistic representation of the neural network 199N is illustrated in Fig. 42 (see also Fig. 43 for another version of the holistic representation of the control architecture embodied in Fig. 42) where the neural network receives as its input, for each substrate handler 1500, the output from the path planner PPM and outputs (e.g., from the local drive controllersAtty. Docket No.390P017053-WO (PCT) 1750A-1750n) a coil output (e.g., coil current amplitude vector and coil phase angle vector) for each specific coil and for each specific substrate handler 1500. It is noted that the substrate handlers 1500 may influence each other with respect to substrate handler control. It is also noted that the control of one substrate handler may differ from the control of another substrate handler due to, for example, manufacturing tolerances, thermal effects, etc. for each respective substrate handler. The neural network 199N is configured to discriminate between the substrate handlers to account for the above-noted influence and control differences.

[0152] The neural network 199N may be configured to provide a feedforward loop having an output (e.g., a feedforward term) that is a predicted control vector [U1m, U2m, U3m, U4m, U5m, U6m]pthat is a control vector assumed to generate the best motion quality associated with the respective mthsubstrate handler 1500. The predicted (output) control vector is discrete for each substrate handler 1500 (i.e., the prediction is unique to and corresponds directly to each substrate handler 1500 / substrate handler state). The control law module CLM may be implemented as a proportional-Integral-Derivative (PID) loop that outputs the set of six control variables (e.g., determined with the set of six PID control equations) in the form of the control vector [U1m, U2m, U3m, U4m, U5m, U6m] as described above with respect to Figs. 23A and 23B; however, the “effort” or magnitude of the alternating current is expected to be reduced (e.g., compared to the control architecture without the neural network 199N) where the prediction by the Neural Network 199N operates as desired. Here, the output of the neural network 199N and the output of the control law module CLM are interposed with each other with the result being transmitted to the local drive controllers 1750A-1750n for actuation of the electromagnets in the array of electromagnets 1700. As a result of the reduced feedback control “effort” the motion tacking errors of the levitated substrate handler 1500 is expected to be reduced effecting an increase in motion quality of the substrate handler 1500. It is noted the addition of the neural network 199N in the master controller 199 does not affect implementation of the slaved coil controllers 1750A- 1750n, which operated as described above.Atty. Docket No.390P017053-WO (PCT)

[0153] With the implementation of the neural network 199N the feedforward loop predicts the required control signals using the desired motion path expressed by the vectors [Xcmd, Ycmd, Zcmd, RXcmd, RYcmd, RZcmd]j(where j = 1 ... NWH) and the respective first and second derivatives (velocity and acceleration, respectively). Here, the feedforward path to the control architecture does not impact stability of the levitated substrate handler 1500 because the neural network 199N is based on the commanded (i.e., desired) trajectories of the substrate handler 1500, noting the stability is primarily dictated by the tuning parameters of the “PID controls” of the control law module CLM.

[0154] Referring also to Fig. 23D, the neural network 199N is trained with a training data set obtained from a data collection operation based on experiments (or training grid moves) from the system to be controlled, which in accordance with the present disclosure, is the linear electrical machine 1599 (i.e., the substrate transport apparatus). The neural network training discriminates each substrate handler 1500 from each other substrate handler 1500 (e.g., the training uniquely represents machine learning for each substrate handler). One example of the training data set is illustrated in Fig.23D where the training data set is obtained by employing a certain commanded path [Xcmd, Ycmd, Zcmd, RXcmd, RYcmd, RZcmd] of the substrate handler 1500, where the path planner PPM generates the first and second derivatives (velocity and acceleration, respectively) of the certain commanded path. A control law (such as of any suitable module of the controller 199) calculates the tracking errors for the specific motion of the substrate handler 1500 (i.e., the motion effected by the certain commanded path) as the difference between the commanded path and actual path of the substrate handler 1500 by employing respective actual positions [Xact, Yact, Zact, RXact, RYact, RZact] (e.g., obtained with any suitable position feedback device 2400 such as those described herein), and the first derivative of the actual positions. The PID controls of the control law module CLM generate a control output vector [U1m, U2m, U3m, U4m, U5m, U6m] for each substrate handler 1500 (where m = 1 ... NWH). The training data set includes a recording of respective values of the control output vectors and resultant actual motion path (positions, velocities, and accelerations) at each time sample (1 toAtty. Docket No.390P017053-WO (PCT) “p” samples, as shown in Fig. 23D). The training data set may be enlarged by repeating the above training process for several different motion paths of the substrate handler 1500, where (as may be realized) larger motion ranges provide more accurate training grids.

[0155] The training data obtained above, and illustrated in Fig. 23D is employed by the controller 199 (e.g., through the training process) to find optimal parameters for the neural network 199N given a pre-defined number of neurons and layers of the neural network 199N. The training data set is employed by the controller 199 to teach or train the neural network to understand the cause-and-effect relationship between a given motion path and the control outputs [U1m, U2m, U3m, U4m, U5m, U6m] (where m = 1 ... NWH) required to produce the given motion path for each respective substrate handler 1500. With the neural network 199N trained, the commanded (or desired) motion path variables (e.g., positions, velocities, and accelerations) for each substrate handler 1500 are employed as inputs to the neural network 199N where the neural network 199N generates or otherwise outputs the predicted control vectors required to (as accurately as possible) track the desired motion of the substrate handler 1500.

[0156] Fig. 23E illustrates another exemplary neural network based feedforward control architecture. The control architecture is substantially similar to that illustrated in Fig. 23C; however, additional feedforward elements in the form of additional neural networks 199N2- 199NQ(where Q is an integer greater than one) are added to the feedback controls. Each additional neural network 199N2-199NQmay contribute to additional levels of feedforward quality improvement and further reduction to the feedback control “effort” compared to employment of the single neural network 199N. The first neural network 199N (i.e., the first layer of neural network) is trained as described above. Each additional (layer) of neural network 199N2-199NQis trained by employing the output(s) (i.e., predicted control vector(s) [U1m, U2m, U3m, U4m, U5m, U6m]p1-pQ) of the previously trained neural network(s) and the output [U1m, U2m, U3m, U4m, U5m, U6m] of the PID controls of the control law module CLM. For example, with the PID controls of the control law module CLM and the first neural network 199N enabled, the second layer of neural network 199N2is trained using variables similar to those illustrated in andAtty. Docket No.390P017053-WO (PCT) described with respect to Fig.23D; however, the control vector is replaced by the summation of the outputs [U1m, U2m, U3m, U4m, U5m, U6m]p1and [U1m, U2m, U3m, U4m, U5m, U6m] from the neural network 199N and the PID controls of the control law module CLM, respectively. The same applies for each additional layer of neural network, where the control vector f Fig.23D) in the training data incudes the summation of the output [U1m, U2m, U3m, U4m, U5m, U6m] of PID controls of the control law module CLM and all of the neural network outputs [U1m, U2m, U3m, U4m, U5m, U6m]p1-(pQ-1)of the trained neural networks 199N-199NQ-1.

[0157] Fig. 23F illustrates still another exemplary neural network based feedforward control architecture. The control architecture is substantially similar to that illustrated in Fig. 23E; however, the architecture has been genericized to further improve the controlled motion of each substrate handler 1500 (e.g., compared to controlled motion of the substrate handler 1500 effected by the architecture of Fig.23E). For example, each of the coil controllers 1750A-1750n includes a respective neural network that receives as inputs the actual positions of each substrate handler 1500-1500NWHand the summation of the output [U1m, U2m, U3m, U4m, U5m, U6m] of PID controls of the control law module CLM and all of the neural network outputs [U1m, U2m, U3m, U4m, U5m, U6m]p1-pQ. The neural network based feedforward control architecture illustrated in Fig.23A may improve the quality of transformation between the control variables [U1m, U2m, U3m, U4m, U5m, U6m] and the required alternating current amplitude and phase angles, and consequently the required voltages across the terminal of each actuator coil 1700-1700n. Each of the neural networks of the coil controllers 1750A-1750n may be trained in a manner substantially similar to that described above with respect to Figs.23C and 23D.

[0158] It is noted that the neural network 199N may be configured to effect increased or decreased positional accuracy of a substrate handler 1500. For example, for positions within the transfer chamber 118 where the substrate handler 1500 traverses without a substrate S handoff (i.e., transfer chamber traverse regions), the neural network 199N may be configured to employ less input data (i.e., fewer network nodes) and / or fewer neural network layers for effecting determination of the control commands of the substrate handler 1500 within the transfer chamberAtty. Docket No.390P017053-WO (PCT) 118 compared to substrate handler control in transfer chamber handoff regions. At locations within the transfer chamber at which substrate handoff occurs (i.e., transfer chamber handoff regions), the neural network 199N may be configured to employ more input data (i.e., more nodes) and / or more neural network layers for effecting determination of the control commands of the substrate handler 1500 within the transfer chamber 118 compared to substrate handler control in transfer chamber traverse regions.

[0159] Referring also to Fig. 25, the present disclosure may provide for “weighting” an amount of energy to be applied or otherwise delivered to each coil actuator 1700-1700n in terms of a spatial location of a substrate handler 1500 relative to each of the coil actuators 1700-1700n. For exemplary purposes, each substrate handler 1500 exists within what may be referred to as a “presence window” 1500PW. For exemplary purposes only, as noted above, the shape of the presence window 1500PW is predefined and may be associated with or otherwise correspond to the geometry of the base 1510 of the substrate handler 1500. Here, for example, the presence window 1500PW has dimensions PWH, PWW that are substantially the same size and conformal to a plan view shape of the substrate handler 1500 base 1510. It is noted that the base 1510 is illustrated in Fig. 25 as having a substantially square or rectangular plan view shape and the presence window 1500PW is illustrated as having a substantially similar shape and size to that of the base 1500; although, the base 1510 and corresponding presence window 1500PW may have any suitable corresponding shapes such as those described herein with respect to the base 1510.

[0160] As an example of assigning weights to the coil actuators 1700-1700n based on the spatial location of the base 1510 (and presence window 1500PW thereof), Fig.25 illustrates the array of coil actuators 1700 as having coil actuators that are denoted by the reference numeral CX, where X is an integer greater than zero. As can be seen in Fig.25 the row of coil actuators C11-C17 in the X direction, the row of coil actuators C61-C67 in the X direction, the column of coil actuators C11-C61 in the Y direction, the column of coil actuators C16-C66 in the Y direction, and the column of coil actuators C17-C67 in the Y direction are outside of the presence window 1500PW and do not contribute to the levitation and propulsion of the substrate handler 1500, andAtty. Docket No.390P017053-WO (PCT) as such, do not need to be energized. Here, the presence window weight for the column of coil actuators C11-C61 in the Y direction, the column of coil actuators C16-C66 in the Y direction, and the column of coil actuators C17-C67 in the Y direction is set to zero. On the other hand, each of the coil actuators C22-C26, C32-C35, C42-C45, and C52-C55 are at least partially within the presence window 1500PW and do contribute to the levitation and propulsion of the substrate handler 1500. Here, the coil actuators C32-C34, C42-C44, C52-C54 are substantially entirely within the presence window 1500PW and their presence window weight can be set to 1 (i.e., where the presence window weighting ranges from 0 to 1); while the remaining coil actuators C22-C25, C35, C45, C55 are partially within the presence window 1500PW (i.e., within a transition zone or boundary of the presence window 1500PW and substrate handler 1500 base 1510) and their presence window weight is set to a value between 0 and 1, which value may depend on an area of the respective actuator coil C22-C25, C35, C45, C55 that is covered by the presence window 1500PW and / or a transition profile of the presence window 1500PW. The presence window 1500PW transition zone may have any suitable shape, such as corresponding with or defined by any suitable mathematical curve including but not limited to polynomial curves, exponential curves, and Bezier curves.

[0161] It should be understood that while the presence window 1500PW and the weighting established thereby is described with respect to the linear electrical machine 1599 for exemplary purposes only. It should also be understood that the presence window 1500PW and the weighting established thereby may be applied to any suitable electrical machine having distributed actuators where not all actuators contribute to the motion of a levitated body at any given instant in time. The presence window weighting provides for, at least, the optimization of energy consumption, support for multiple substrate handlers 1500 operated by a common (i.e., the same) array of coil actuators, minimization of force and torque disturbance ripple effects during substrate handler motion, an ability to adapt different coil actuator geometries (e.g., such as a variable pitch between adjacent coil actuators), and the ability to support different shapes of substrate handlers 1500 (such as those shapes described herein).Atty. Docket No.390P017053-WO (PCT)

[0162] The slave coil controllers 1750A-1750n command electromagnet 1700A-1700n modulation, in accordance with the control output of the master controller 199, to effect one or more of dynamic phase allocation and the creation of virtual multiphase motor actuator / position units as described in greater detail herein.

[0163] Fig. 26A illustrates exemplary controlled motion(s) of the substrate handler 1500 in accordance with the present disclosure with respect to increased substrate handler throughput while carrying a substrate S. Here, the controller 199 controls the levitation forces (e.g., FZT, FZL), generated by the array of electromagnets 1700, so as to impart differential levitation forces (illustrated in Fig.29A) across the base 1510 that effect a controlled inclination (e.g., e+ or e-) of the base 1510, relative to the drive plane 1598, that controls a predetermined reaction platen attitude in at least one of pitch (shown in Figs. 15B, 26A and 32) and roll (shown in Figs. 15A and 34). The controller 199 may control the levitation forces (e.g., FZT, FZL), generated by the array of electromagnets 1700 of the motor actuator units (that are virtually moving), so as to effect a predetermined bias attitude BA+ or BA- of the base 1510, relative to the drive plane 1598, that imparts a bias reaction force F2 (Fig. 28), from a base payload seating surface (e.g., such as a substrate seating surface 1520SS (Figs. 28, 30A, 30B) of the end effector 1520 or a seating surface defined by substrate supports of cart 1431-1433 of cart 1500C) on a substrate S supported by the base seating surface, in a direction countering payload inertial force arising from acceleration of the reaction platen along the drive plane 1598. The controller 199 is configured to determine acceleration of the base 1510 (and the substrate handler thereof) along the drive plane 1598 at least from changes in the position of the base 1510 as determined based on changes in predetermined excitation characteristic (such as, e.g., inductance, phase lag / amplitude, and / or power factor – as described herein), and in response to the acceleration determine, control the bias attitude of the base 1510 to provide the predetermined bias attitude countering the payload inertial force arising from the acceleration of the base 1510. The controller 199 may apply a predefined acceleration from commanded trajectory for bias attitude control. Here, the controller 199 controls excitation of the electromagnets 1700A-1700n of theAtty. Docket No.390P017053-WO (PCT) virtually moving motor actuator units of the array of electromagnets 1700 so as to set the bias attitude BA+ or BA- to bias the base 1510 against inertial forces tending to displace a substrate S, seated against the base 1510 (e.g., on an end effector 1520 thereof or substrate supports 1431- 1433 thereof), relative to the base 1510 along a seat between the substrate S and the base 1510 (see, e.g., Figs.22 and 29A).

[0164] As an example of countering payload inertial forces, starting at the left-hand side of Fig. 26A, a substrate handler 1500 (which may be any of the substrate handlers described herein) is depicted at a starting point of a motion in direction 2122 in Fig. 26A. As the substrate handler begins to move, a set of propulsion force vectors FP and lift force vectors FZ are generated by the Control System (e.g., the actuator control system network 1799which may be part of controller 199) so as to cause the substrate handler 1500 to accelerate in the motion direction with an increased Pitch angle e+ (e.g., the end effector 1520 is tilted in, e.g., a clockwise direction). To effect the increased pitch angle e+ the lift force vectors FZ are generated so that a magnitude of a trailing lift force vector FZTis larger than a magnitude of a leading lift force vector FZL(where leading and trailing are in reference to the motion direction). As the substrate handler reaches approximately its halfway point towards the end of the motion (e.g., such as where there is substantially zero acceleration of the substrate handler 1500), the pitch angle e+ is reduced in magnitude so that the tilted orientation of the end effector 1520 is reversed from the clockwise orientation to zero (e.g., substantially parallel with the level reference plane 1299 – the trailing lift force vector FZTand the leading lift force vector FZLare substantially equal). At this point in the trajectory, the substrate handler 1500 motion begins a deceleration stage where the pitch angle e- is decreased so that the end effector 1520 pitches to a counter clockwise orientation. To effect the decreased pitch angle e- the lift force vectors FZ are generated so that the magnitude of the trailing lift force vector FZTis less than a magnitude of the leading lift force vector FZL). As the substrate handler 1500 reaches its final destination, the pitch angle e- is increased to zero so that the tilted orientation of the end effector 1520 is substantially parallel with the level reference plane 1299, as in the start of the motion.Atty. Docket No.390P017053-WO (PCT)

[0165] While the pitch of the end effector is increased or decreased to account for acceleration and deceleration of the substrate handler 1500 substantially without slippage of the substrate S relative to the end effector while travelling along a substantially straight / linear path (such as along drive lines 177-180), the roll r and / or pitch e of the substrate handler 1500 may be increased or decreased to provide for higher rotational accelerations of the substrate handler 1500 (such as about one or more of axes 777, 1277, 1377 in a manner substantially similar to that described above with respect to the linear motion (see Fig. 26B which illustrates rolling of the end effector in rotation direction with roll control as shown in Fig. 15A where lift force vector FZleftis greater than lift force vector FZright).

[0166] The motion control illustrated in Fig. 26A effects a substantially faster substrate motion transport (e.g., provides for higher accelerations substantially without substrate slippage relative to the end effector) when compared to conventional substrate transport where the end effector is parallel with the wafer transfer plane throughout end effector motion. As an example, if the pitch angle e of Fig. 26A is set to be zero (as with conventional substrate transports) during the entire motion then the maximum allowable propulsion acceleration is limited to the static coefficient of friction (μ) between the substrate S and a contact surface of the end effector 1520. This is illustrated in Fig. 27, which constitutes the typical use case in a conventional substrate transport where the substrate S is held by its back side in contact with the end-effector. As it can be seen in Fig. 27, the maximum acceleration imposed to the substrate S is μg before wafer slippage takes place. Where “g” is the acceleration of gravity (about 9.8 m / S2), μ is the coefficient of friction, M is the mass of the substrate, W is the weight of the substrate, and N is the normal force.

[0167] Fig.28 illustrates the case where the substrate S (having a mass m) is carried by substrate handler 1500 (having a mass M) with a pitch angle e while the substrate handler 1500 is accelerated in the X direction. The force diagrams in Fig. 28 illustrate the dynamics of the motion of the substrate S and substrate handler 1500. In Fig. 28, the substrate hander 1500 is accelerated along the propulsion direction X with acceleration a. As a result, the force at theAtty. Docket No.390P017053-WO (PCT) substrate handler is represented by the variable Fl. The acceleration a along the X direction, impacts the reaction (normal) force N on the substrate S in a way that once added to the weight of the substrate W yields a resultant wafer force F2. It is possible to relate the angle e and the acceleration a in such a way that the substrate S substantially does not slip relative to the end effector 1520 of the substrate handler 1500. To substantially prevent wafer slippage, two situations can be considered for the sake of clarity. First, it is assumed that there is no friction between the substrate and the end effector 1520. Fig. 29A illustrates a free body diagram of the substrate S on the end effector 1520 in the absence of friction μ. As can be seen in Fig. 29A, despite the absence of friction μ, an acceleration a can be determined in terms of the pitch angle e such that the substrate mass m is traveling along the X direction. This relation is expressed by equation 16 below:

[0168] a = g tan e [eq.3]

[0169] where g is the acceleration of gravity (9.8m / s2). Fig. 29B illustrates wafer slippage regions in terms of the pitch angle e. It is noted that the substrate S will slip relative to the end effector 1520 without friction μ if the pitch angle e is substantially zero. The curve illustrated in Fig.29B represents the desired pitch angle “e” to keep the substrate S moving at an acceleration “a” along the X direction without slippage. Alternatively, the same curve of Fig. 29B can be interpreted as the demanded acceleration “a” of the substrate handler 1500 to prevent the substrate S from slipping while moving along the X direction with the pitch angle “e”. Deviation from the curve illustrated in Fig. 29B will cause the substrate S to slide either “downhill” or “uphill” (where the terms downhill and uphill are used for convenience relative to the pitch) relative to the end effector 1520 depending on the acceleration value.

[0170] Figs. 30A and 30B show the effect of a non-zero static friction coefficient μ on the relation between acceleration a and pitch angle e. For example, Fig.30A illustrates a minimum propulsion acceleration before slippage of the substrate S relative to the end effector 1520 takes place. In this case, the friction force direction points “uphill” to substantially prevent the waferAtty. Docket No.390P017053-WO (PCT) mass m from sliding “downhill” (again relative to the direction of pitch). Here, the “slowest” expected acceleration to prevent wafer slippage is calculated as:

[0171] amin= [-μ + tan e] / [l + μ tan e] [eq.4]

[0172] Fig. 30B, illustrates the case for the maximum (e.g., fastest) expected propulsion acceleration a before slippage of the substrate S relative to the end effector 1520. In this case, the friction force direction points “downhill” to substantially prevent the wafer mass m from sliding “uphill” (again relative to the direction of pitch). Here, the “fastest” expected acceleration a is calculated as:

[0173] amax= [μ + tan e] / [1 - μ tan e] [eq.5]

[0174] Consequently, in the presence of a non-zero static friction coefficient μ the propulsion acceleration a should stay within the limits below in order to prevent substrate S slippage, for a given pitch angle:

[0175] amin< a < amax

[0176] Fig. 31 provides an example of the dependency between acceleration a and pitch angle e for a static coefficient of μ that is about 0.1, which is a typical value for substrate handlers used in high temperature applications. The curve of Fig.29B is repeated in Fig.31 under the case of μ equal to about 0. The region between the top and bottom curves (μ equal to about 0.1) represents a non-slippage region (e.g., a region of acceleration for a given pitch angle where the substrate slippage relative to the end effector substantially does not occur). The areas outside this region may have wafer slippage either in the upwards of downwards direction relative to the substrate handler inclination (i.e., pitch angle e). In the example of Fig. 31, the maximum acceleration with a substantially zero pitch angle is about 0.l g which is the fastest acceleration that conventional substrate handlers can provide for typical high temperature applications. If theAtty. Docket No.390P017053-WO (PCT) pitch angle e is set to about 16 degrees of inclination, the substrate can be transported at accelerations as high as 0.4 g using the same end effector material (as in conventional substrate handlers) which constitutes a substantial throughput improvement compared to the conventional substrate handlers. The pitch angle e can be set according to a predetermined acceleration in order to maximize throughput such as depicted in Fig.26A.

[0177] Fig. 32 illustrates active control of the substrate handler 1500 orientation in roll, pitch, and yaw with respect to leveling of the substrate handler 1500 relative to a substrate station, such as process module 120. Mechanical deflection imposes challenges on entering and exiting process module openings 2780 which are becoming increasingly smaller in height H3 due to the need of optimizing process module 120 process times. Conventional substrate transports generally suffer from the inherent potential of mechanical deflection due to the presence of articulated links with bearings that add weight and decrease stiffness, noting that compensating for the end-effector orientation as the wafer goes through the process module opening 2780 may not be practical. In these cases, it is becoming increasingly difficult to be able to comply with more restrictive mechanical deflection constraints. The present disclosure may provide a solution to mechanical deflection that dynamically compensates for any mechanical deflection by controlling the substrate handler orientation in space, relative to the level reference plane (e.g., by adjusting the roll, pitch and yaw angles as described herein) such that a substrate passes through the process module opening 2780 substantially without contact between the substrate S and the opening 2780 and substantially without contact between the end effector 1520 and the opening 2780.

[0178] Figs. 15A-16C illustrate the controlled adjustment, by the local drive controller(s) 1750A-1750n (and based on the position determination of the wafer handler 1500 as described herein), of the roll and yaw angles of the substrate handler 1500 in addition to the pitch angle. Referring also to Fig. 32, the controlled adjustment of each of the roll, yaw, and pitch angles (e.g., by differentially varying at least the lift force vectors acting on the base 1510 as described herein) effects leveling a position of the substrate handler 1500 at any suitable substrate holdingAtty. Docket No.390P017053-WO (PCT) station such as a process module 120 so that a plane 2770 of the substrate S (and end effector 1520 on which the substrate S is supported) is substantially the same as a plane 2771 defined by the substrate holding station 120 substrate support surface 2760. The roll, yaw, and pitch angles may be adjusted independent of each other. The controlled adjustment of the substrate handler 1500 orientation angles (e.g., roll, pitch, and yaw) also provides for compensation of mechanical deflection of the end effector 1520 due to, for example, the substrate loading as well as the weight of the substrate handler 1500 structure.

[0179] Referring to Figs. 8-11 and 33 and 34, as described above, multiple drive lines 177, 178 may be provided so as to extend longitudinally along a length of the transport chamber 118 to provide passage of one substrate handler 1500 by another substrate handler along the longitudinal direction of the transport chamber 118. Fig. 33 illustrates passage of two substrate handlers 1500A, 1500B past one another with substrate handler 1500A traveling along an inbound track 1550A and with substrate handler 1500B travelling along an outbound track 1550B. Here each of the substrate handlers 1500A, 1500B have roll, pith, and yaw angles so that the plane 2770 of the end effector 1520 (and substrate s held thereon) is substantially parallel (i.e., level) with the level reference plane 1299. Here, with the end effectors 1520 level, the transport chamber 118 has a lateral width W1. However, in accordance with the present disclosure, the width of the transport chamber 118 may be minimized or otherwise reduced from lateral width W1 to lateral width W2 by adjusting one or more of the roll, the pitch, and the yaw of the substrate handlers 1500A, 1500B as they pass one another along the length of the transport chamber 118. For example, as illustrated in Fig. 34 the roll angle of each substrate handler 1500A, 1500B may be adjusted to a predetermined angle β relative to the level reference plane 1299 to avoid contact between the substrate handlers 1500A, 1500B as they move past one another during a period of time that both substrate handlers 1500A, 1500B would otherwise occupy the same space. The predetermined roll angle β may depend on end effector configuration (e.g., so that the substrate S does not slip relative to the end effector). As may be realized it advantageous to have control of the roll, pitch, and / or yaw angles of each substrateAtty. Docket No.390P017053-WO (PCT) handler 1500 in order to reduce a footprint of the transport chamber 118 that houses the wafer handling automation, where the reduced footprint at least increases tool density on the fabrication facility floor and decreases pump down times of the transport chamber which may result in increased throughput.

[0180] Referring now to Figs. 17 and 35, an exemplary control of the array of electromagnets 1700 will be described where dynamic phase allocation is employed. As described herein, the controller 199 (which may be a clustered or master controller as described herein – see Figs. 23A-23F) is operably coupled to the array of electromagnets 1700 and the alternating current power source 1585 (the power source may be any suitable type and can be direct current in which case the controller driving circuit will modulate that to desired frequency / phase for as many alternating current power phases as desired) and configured so as to sequentially excite the electromagnets 1700A-1700n with multiphase alternating current so that the base 1510 of a substrate handler 1500 is levitated and propelled with at least one of attitude control and yaw control with a common set of the electromagnets 1700A-1700n (such as those electromagnets of a respective drive line 177-180). As noted above, the controller 199 is configured to sequentially excite the electromagnets 1700A-1700n cooperating in multi-phase alternating current excitation that form motor actuator units 1701 corresponding to the position of the base 1510 as determined based on the changes in the excitation characteristic (e.g., inductance, a phase lag / amplitude, and / or power factor) as described herein. The number n (an integer in the example of three or more, although the integer may be two or more) of electromagnets 1700A-1700n of each motor actuator unit 1701 as well as the location (static) of the respective n electromagnets 1700A- 1700n of each motor actuator unit 1701 are dynamically selectable by the controller 199 in effecting lift and propulsion of the base (secondary) 1510 at any given time throughout operation of the motor actuator. Each of the electromagnets 1700A-1700n generates, from excitation with common multiphase alternating current having a single common frequency per phase, both the separately controllable levitation and the propulsion forces against the base 1510 so as to control the base 1510 with the at least four independent degrees of freedom including at least one ofAtty. Docket No.390P017053-WO (PCT) attitude and yaw at least with the base 1510 levitated. The common single frequency per phase of each phase (here respective phases A, B, C) may be selectably variable from different desired excitation frequencies so that levitation and propulsion forces generated by the motor actuation unit 1701 enable substantially independent control of the base 1510 in each of the at least four independent degrees of freedom. The controller 199 may control the roll, pitch, and yaw angles generated by the array of electromagnets 1700A-1700n arranged in the respective motor actuator units 1701, including at least the attitude with the base 1510 levitated and propelled so as to move relative to the array of electromagnets 1700 along the at least one drive line 177-180 from a first predetermined position P1 (see Fig.1B) with respect to the frame of the chamber 118 to a second different predetermined position P2 (see Fig. 1B) with respect to the frame of the chamber 118. The controller 199 may control the roll, pitch, and yaw angles generated by the array of electromagnets 1700, including at least the base 1510 attitude and the base 1510 yaw with the base 1510 levitated and stationary relative to the array of electromagnets 1700 in a predetermined position (such as position P2 in Fig.1B) along the at least one drive line 177-180 with respect to the frame of the chamber 118.

[0181] Figs.36A and 36B illustrate an example where each electromagnet (or coil unit) 1700A- 1700n is grouped so as to define a motor actuator unit 1701 having a dynamically selected number of electromagnets, for example three electromagnets (n=3) and three corresponding phases (m=3) with an electrical angle between the phases of 120° (see also Fig. 17) is also dynamically associated with the three different phases A, B, C so that association of each phase A, B, C with the corresponding static electromagnet 1700A-1700n comports with the dynamic state of the motor actuation unit 1701. Accordingly, with the electromagnets of the motor actuator unit 1701 propelling the base 1510 ( (e.g., along direction 3100) each phase A, B, C respectively changes or moves from one static electromagnet to another (i.e., rolling the designation or allocation of the respective phases to consecutive electromagnets 1700A-1700n so as to generate a virtual (motion) multi-phase actuator unit 3000, 3000tP1, 3000tP2of each of the linear electrical machine 1599 and the electrical machine 1599R proceeding in the direction ofAtty. Docket No.390P017053-WO (PCT) motion 3100 commensurate with motion of the base 1510 generated by the excitation of the electromagnets 1700A-1700n corresponding to the virtual motion multi-phase actuation unit 3000, 3000tP1, 3000tP2. This dynamic relationship or association producing the virtual motion multi-phase actuator unit 3000, 3000tP1, 3000tP2between coil units and phase will be referred to here for convenience as “dynamic phase allocation” wherein the virtual motion of the representative virtual motion multi-phase actuator unit 3000, 3000tP1, 3000tP2effecting propulsion of the base 1510 is illustrated schematically in Fig. 35 (see also Fig. 17). Here the virtual motion multi-phase actuator / position sensing unit (or “MAU” in Fig. 17) 3000 has dynamically selected three electromagnets and associated phases A, B, C, shown in an initial (representative) position P=0 at time t=t0. The respective excitation of the virtual motion multi- phase actuator unit 3000 electromagnets generate propulsion forces that move the platen / base 1510 between t1 and t2 (see also Figs. 36A and 36B). Here, as shown, at P=0 and t=t0, electromagnets 1700A-1700C are grouped to form virtual motion multi-phase actuator unit 3000, and are respectively associated with phases A, B, C. Coincident with generation of propulsion forces Fx, respective excitation of virtual motion multi-phase actuator unit 3000 electromagnets 1700A-1700C generate separately controllable lift forces Fy with a controlled variable height relative to the platen / base 1510, that simultaneously lifts and effect tilt adjustment of the platen / base 1510 simultaneously with propulsion (see Figs. 36A and 36B). As may be realized, under effect of the lift Fy and propulsion Fx forces imparted by the respective electromagnets 1700A-1700C of the virtual motion multi-phase actuator unit 3000 at time t=t0 and position P=0 the platen / base 1510 moves (relative to the transfer chamber and hence the static electromagnets 1700A-1700C) with a predetermined lift and tilt. To maintain steady state tilt of the platen / base 1510 during motion away from the group of electromagnets 1700A-1700C (defining virtual motion multi-phase actuator unit 3000 at P=0 and T=T0) the controller 199 and circuitry 3050, of the respective electromagnets of the electromagnet array 1700A-1700n, are configured to dynamically “move” (or “change”) the allocation of the respective phases A, B, C (from the initial virtual motion multi-phase actuator unit 3000 at P=0 and t=t0) commensurate with the travel of the platen / base 1510 at time t=t1 and position P=1 to corresponding electromagnetsAtty. Docket No.390P017053-WO (PCT) 1700B-1700D that now define virtual motion multi-phase actuator unit 3000tP1 disposed at position P=1 at time t=t1, and subsequently allocation of the respective phases A, B, C (from the virtual motion multi-phase actuator unit 3000tP1 at P=1 and t=t1) commensurate with the travel of the platen / base 1510 at time t=t2 and position P=2 to corresponding electromagnets 1700C- 1700E that now define virtual motion multi-phase actuator unit 3000tP2 disposed at position P=2 at time t=t2, and so on. Dynamic phase allocation is repeated throughout platen / base 1510 motion so that the phase distribution with respect to the platen, and excitation by respective phases (here A, B, C) of the platen / base 1510 remain substantially steady state throughout motion of the platen / base 1510.

[0182] The virtual multi-phase actuator / position sensing unit 3000, 3000tP1, 3000tP2may comprise a series of electromagnets 1700A-1700n of the array of electromagnets 1700 coupled to at least the multiphase alternating current power source 1585 that define at least one drive line 177-180 within the drive plane 1598, where electromagnets 1700A-1700n in the series of electromagnets 1700A-1700n are dynamically grouped into at least one multiphase actuator unit DLIM1, DLIM2, DLIM3, and each of the at least one multiphase actuator unit DLIM1, DLIM2, DLIM3 being coupled to at least the multiphase alternating current power source 1585. In this case, on initiating propulsion (effecting motion of the base / secondary) by excitation of corresponding electromagnet groups of the motor actuation unit at an initial position (P=0, t=0) the definition of phases A, B, C and the associated "motors" (e.g., DLIM1, DLIM2, DLIM3) are changing in space and time (Pi, ti), as described above, in order to maintain substantially steady state force vectors FZ1, FZ2, FX1, FX2 imparted on the base 1510 throughout the range of motion, that provide a desired substantially steady state or constant tilt orientation of the substrate handler 1500 throughout the range of motion. As noted herein, an exemplary actuator control system network 1799 configured to effect dynamic phase allocation is described with respect to Fig. 17. As can be seen in Figs. 36A and 36B, the dynamic phase allocation is controlled by the controller 199 so that the respective electromagnets 1700A-1700n grouped into corresponding motor actuation units (such as described herein) energized by the multiphaseAtty. Docket No.390P017053-WO (PCT) alternating current A, B, C present, with respect to the base 1510 (represented by the front portion 3110 and rear portion 3111), a substantially steady state multiphase distribution across respective electromagnets 1700A-1700n of the virtually moving at least one multiphase actuator unit DLIM1, DLIM2, DLIM3. It is noted that the phase currents A, B, C are illustrated within respective electromagnets 1700A-1700n and the phase current distribution across the at least one multiphase actuator unit DLIM1, DLIM2, DLIM3 remains constant or steady state with respect to the base 1510 (e.g., as an example of steady state note phase current A remains at the trailing end of the rear portion 3111, phase current C remains at the leading end of the rear portion 3111, and phase current B remains in the center of the rear portion 3111 throughout movement of the base 1510 and the at least one (virtually moving) multiphase actuator unit DLIM1, DLIM2, DLIM3 in the direction 3100).

[0183] In greater detail of dynamic phase allocation, Fig. 35 depicts at time t1 electromagnets 1700A, 1700B, 1700C which are respectively defined as phases A, B, C (Figs. 35 and 36A) which generate a spatial force vector(s) that provides separately controllable lift and propulsion forces of a predetermined wafer handler 1500 (i.e., a wafer handler identified by its unique signature as determined by the predetermined excitation characteristic (such as, e.g., a phase lag) of the electromagnets and selected for movement by the controller 199). As the substrate handler 1500 moves in space (e.g., along the drive line associated with the array of electromagnets 1700), at time t2 electromagnets 1700B, 1700C, 1700D respectively become phases A, B, C (Figs.35 and 36B). As the substrate handler 1500 continues to travel along the drive line (which in this example is in direction 3100 as shown in Figs. 36A, 36B, and 36C), at time t3 phases A, B, C are associated with electromagnets 1700C, 1700D, 1700E, respectively. This dynamic phase allocation effects continuous spatial and time control of the force vectors that maintain propulsion, lift, and orientation of the predetermined substrate handler 1500. The alternating current power source 1585 may be coupled to each of the electromagnets 1700A-1700n of the array of electromagnets 1700 through any suitable signal conditioning circuitry 3050 which may include current amplification power supply units 3011 or any other suitable signal processing.Atty. Docket No.390P017053-WO (PCT) The phase A, B, C currents are transmitted to each of the local drive controllers 1750A-1750n which, under control of or in response to instruction from, master controller 1760 provide a specified one of the phase A, B, C currents to the respective electromagnets in the manner noted above to effect dynamic phase allocation.

[0184] As described herein, the base 1510 (see, e.g., Fig. 16B) of a substrate handler cooperates with the electromagnets 1700A-1700n of the at least one multiphase actuator unit (Fig. 36A) DLIM, DLIM2, DLIM3 so that excitation of the electromagnets 1700A-1700n with alternating current generates levitation and propulsion forces against the base 1510 that controllably levitate and propel the base 1510 along the at least one drive line 177-180, in a controlled attitude relative to the drive plane 1598. The controller 199 (which may include at least the master controller 1760 and any controller subordinate to the master controller such as the coil controllers 1750A-1750n; although, the controller may have any suitable configuration), is operably coupled to the alternating current power source 1585 and the array of electromagnets 1700. The alternating current power source 1585 may include any suitable associated circuitry 3050 through which the alternating current power source 1585 is connected to the array of electromagnets 1700. The alternating current power source 1585 is controlled by the local drive controllers or any other suitable controller such as the master controller 1760. Typical control parameters for the alternating current power source comprise of signal amplitude, signal frequency, and phase shift relative to a reference coil unit. Other types of control parameters may be defined. As used herein the “phase” A, B, C as illustrated in Fig. 35 is similar to a particular coil in a multi-phase electrical motor; however, the each of the phase definitions (such as A, B, C in Fig.35) is not physically tied to any particular coil.

[0185] As described before, and now referring to Fig.36C, controlling propulsion and levitation simultaneously and separately (so that propulsion forces and lift forces are separately controllable in full, so that control of each may be deemed independent of one another though both forces are effected by excitation with common multiphase alternating current having a single common frequency per phase, the common frequency per phase is selectably variableAtty. Docket No.390P017053-WO (PCT) from different desired frequencies) may be effected by a variant of the dynamic phase allocation described herein, where one or more dynamic linear motor (DLIM) may include a selectable n number of phases associated with electromagnets defining the virtual motion multi-phase actuator unit, where n can be an integer larger than three. The number n of electromagnets defining the virtual motion multi-phase actuator unit may be dynamically selected, for example, for effecting different moves of the platen / base 1510 depending on kinematic characteristics of the desired move. Here the excitation frequency commonly applied per phase of the virtual motion multi-phase actuator unit is selected by the controller 199 so as to generate desired kinematic performance and control of the platen / base 1510. Here, the phase control algorithm maintains the same electrical phase angle difference between the phases (e.g., electromagnets of the motor), as shown in Fig. 36C. The electrical phase difference is calculated relative to a reference phase or relative to each phase. The electrical phase angle difference φ between phases may have a range so as to produce positive and negative values of propulsion forces while maintaining levitation. Depending on the value of the electrical phase angle difference φ the number of electromagnets within a respective dynamic linear motor varies. Here, the boundary between DLIM1 (illustrated for exemplary purposes with 6 electromagnets) and DLIM2 as shown in Fig. 32C is dynamic. Although, in the dynamic linear motor electromagnet / phase allocation, not all electromagnets of a dynamic linear motor need to be energized at the same time. Referring to DLIM 1, only m (in this example m = 4) electromagnets out of all n (in this example n = 6) electromagnets of dynamic linear motor DLIM1 (where m is the number of electromagnets covered by the base (or secondary)) are energized to effect lift and propulsion of the base 1510, while the other electromagnets of the n electromagnets of the dynamic linear motor DLIM1 can be turned off.

[0186] Referring to Figs. 1A-26B, 28, and 32-45, an exemplary method will be described in accordance with the present disclosure. The method includes providing a linear electrical machine 1599 (Fig. 45, Block 45000), such as that described herein. For example, the linear electrical machine 1599 has: a frame 118M with a level reference plane 1299; an array ofAtty. Docket No.390P017053-WO (PCT) electromagnets 1700; at least one reaction platen 1510; and a controller system 1799. The array of electromagnets 1700 is connected to the frame 118M to form a drive plane 1598 at a predetermined height H relative to the reference plane 1299, the array of electromagnets 1700 (see also Fig. 18) being arranged so that a series of the electromagnets 1700A-1700n define at least one drive line within the drive plane 1598, and each of the electromagnets 1700A-1700n (see Fig. 15B) in the array of electromagnets 1700 being coupled to a power source 1585 energizing each electromagnet 1700A-1700n. The base or reaction platen 1510 is formed of a material disposed to cooperate with the electromagnets 1700A-1700n of the array of electromagnets 1700 so that excitation of the electromagnets 1700A-1700n generates levitation forces FZ and propulsion forces FP (see Fig. 21) against the base 1510 that controllably levitate and propel the base 1510 along the at least one drive line 177-180 (see, e.g., Figs. 1-8), in a controlled attitude relative to the drive plane 1598. The controller system 1799 has a distributed control configuration (see, e.g., Figs. 17, 20-23F, and 43-44) with a master controller 199 and more than one coil controllers 1750A-1750n communicably connected to each other. As described herein, the master controller 199 is configured to send master commands describing high level control variables to the more than one coil controllers 1750A-1750n operably coupled to the array of electromagnets 1700 and the power source 1585.

[0187] The method includes sequentially exciting the electromagnets (Fig. 45, Block 45010) with a predetermined excitation characteristic so as to describe six degree of freedom reaction platen control of each of the at least one reaction platen (e.g., substrate handler 1500), and the at least one reaction platen is levitated and propelled with at least four degrees of freedom. Each respective coil controller 1750A-1750n is coupled to a number of electromagnets at a predetermined location in the array of electromagnets 1700 corresponding to the respective coil controller 1750A-1750n so that the number of electromagnets at the corresponding predetermined location are controlled by the respective coil controller 1750A-1750n separate and distinct from each other coil controller 1750A-1750n of the controller system 1799 (that control electromagnets at each other location of the array of electromagnets 1700), and each reactionAtty. Docket No.390P017053-WO (PCT) platen (e.g., substrate handler 1500) is levitated and propelled with the at least four degrees of freedom based on the high level control variables and the corresponding predetermined location, stored in the respective coil controller 1750A-1750n, of the electromagnets at the corresponding predetermined location.

[0188] The method may include one or more of the following, individually, in any suitable combination, and / or in any suitable combination with the features described herein: the master controller is communicably connected to the more than one coil controllers by a deterministic network for real time controls; the power source 1585 is an alternating current power source; the reaction platen 1510 is of paramagnetic, diamagnetic, or non-magnetic conductive material; each other coil controller 1750A-1750n may respectively control electromagnets 1700A-1700n at other corresponding locations of the array 1700, so that electromagnets 1700A-1700n at each other corresponding location are controlled by a different respective coil controller 1750A- 1750n; the master controller 199 has a path planning module PPM that defines a planned trajectory (such as in the at least four degrees of freedom along one or more drivelines 177-180) of the at least one reaction platen 1510, and has a control module (such as control law module CLM) that calculates, based on the planned trajectory, the high level control variables that describe the six degree of freedom control and effect the planned trajectory; the respective coil controller 1750A-1750n may be configured to receive the master commands MC (see, e.g., Fig. 1) describing the high level control variables, and generate, based on the high level control variables, output signals to excite each of the number of electromagnets, corresponding to the respective coil controller, effecting levitation and propulsion of the at least one reaction platen 1510 (such as of one or more of substrate handlers 1500A, 1500B) with the at least four degrees of freedom control along the planned trajectory (see Fig. 23A); the master commands MC may include pose information of the at least one reaction platen 1510 with respect to the reference plane 1299 (see, e.g., at least Figs. 15A, 26A, 32, 33, 34); the respective coil controller 1750A- 1750n may be configured with location information LL (see, e.g., Fig. 17) that informs the corresponding predetermined location of the number of electromagnets 1700A-1700n withAtty. Docket No.390P017053-WO (PCT) respect to the reference plane 1299; the respective coil controller 1750A-1750n may control and effect excitation of the number of electromagnets 1700A-1700n at the corresponding predetermined location based on the location information LL and pose information of the at least one platen 1510; and the respective coil controller 1750A-1750n may be configured so as to effect local control, separate from each of the high level control variables received from the master controller 199, of excitation of the number of electromagnets 1700A-1700n at the corresponding predetermined location.

[0189] Referring to Figs. 1A-26B, 28, 32-44, and 46, an exemplary method will be described in accordance with the present disclosure. The method includes providing a linear electrical machine 1599 (Fig. 46, Block 46000), such as that described herein. For example, the linear electrical machine 1599 has: a frame 118M with a level reference plane 1299; an array of electromagnets 1700; at least one reaction platen 1510; and a controller system 1799. The array of electromagnets 1700 is connected to the frame 118M to form a drive plane 1598 at a predetermined height H relative to the reference plane 1299, the array of electromagnets 1700 (see also Fig.18) being arranged so that a series of the electromagnets 1700A-1700n of the array of electromagnets 1700 define at least one drive line within the drive plane 1598, and each of the electromagnets 1700A-1700n (see Fig. 15B) being coupled to a power source 1585 energizing each electromagnet 1700A-1700n. The base or reaction platen 1510 is formed of a material disposed to cooperate with the electromagnets 1700A-1700n of the array of electromagnets 1700 so that excitation of the electromagnets 1700A-1700n generates levitation forces FZ and propulsion forces FP (see Fig.21) against the base 1510 that controllably levitate and propel the base 1510 along the at least one drive line 177-180 (see, e.g., Figs. 1-8), in a controlled attitude relative to the drive plane 1598. The controller system 1799 has a distributed control configuration (see, e.g., Figs.17, 20-23F, and 43-44) with a master controller 199 and more than one coil controllers 1750A-1750n communicably connected to each other.

[0190] The method includes sending, with the master controller 199, master commands MC (see Fig. 1) and a feed forward term (see, e.g., Figs. 23A-23F) to the more than one coil controllersAtty. Docket No.390P017053-WO (PCT) 1750A-1750n operably coupled to the array of electromagnets 1700 and the power source 1585 and configured so as to sequentially excite the electromagnets 1700A-1700n with a predetermined excitation characteristic. Each respective coil controller 1750A-1750n is coupled to a number of electromagnets 1700A-1700n at a predetermined location in the array 1700 corresponding to the respective coil controller 1750A-1750n so that the number of electromagnets 1700A-1700n at the corresponding predetermined location are controlled by the respective coil controller 1750A-1750n separate and distinct from each other coil controller 1750A-1750n of the controller system 1799. The master commands MC describe high level control variables, and the feed forward term modulates the high level control variables so as to describe six degree of freedom reaction platen control of each of the at least one reaction platen 1510, and the at least one reaction platen 1510 is levitated and propelled with at least four degrees of freedom.

[0191] The method may include one or more of the following, individually, in any suitable combination, and / or in any suitable combination with the features described herein: the feed forward term is generated by a trained neural network 199N; the neural network 199N is trained via a heuristic model of the linear electrical machine 1599 that predicts modulation of control variables that describe the six degree of freedom reaction platen control of the at least one reaction platen 1510 levitated and propelled with the at least four degrees of freedom along a planned trajectory; the respective coil controller 1750A-1750n is configured to excite the number of electromagnets 1700A-1700n at the predetermined location so that each reaction platen 1510 is levitated and propelled with at least four degrees of freedom based on the high level control variables, the feed forward term, and the corresponding predetermined location, stored in the respective coil controller 1750A-1750n, of the electromagnets 1700A-1700n at the corresponding predetermined location; the master controller is communicably connected to the more than one coil controllers by a deterministic network for real time controls; the power source 1585 is an alternating current power source; the reaction platen 1510 is of paramagnetic, diamagnetic, or non-magnetic conductive material; the master controller 199 has a path planningAtty. Docket No.390P017053-WO (PCT) module PPM that defines a planned trajectory (such as in the at least four degrees of freedom along one or more drivelines 177-180) of the at least one reaction platen 1510, and has a control module (such as control law module CLM) that calculates, based on the planned trajectory, the high level control variables that describe the six degree of freedom control and effect the planned trajectory; the respective coil controller 1750A-1750n may be configured to receive the master commands MC (see, e.g., Fig.1) describing the high level control variables, and generate, based on the high level control variables, output signals to excite each of the number of electromagnets, corresponding to the respective coil controller, effecting levitation and propulsion of the at least one reaction platen 1510 (such as of one or more of substrate handlers 1500A, 1500B) with the at least four degrees of freedom control along the planned trajectory (see Fig. 23A); the master commands MC may include pose information of the at least one reaction platen 1510 with respect to the reference plane 1299 (see, e.g., at least Figs.15A, 26A, 32, 33, 34); the respective coil controller 1750A-1750n may be configured with location information LL (see, e.g., Fig.17) that informs the corresponding predetermined location of the number of electromagnets 1700A- 1700n with respect to the reference plane 1299; the respective coil controller 1750A-1750n may control and effect excitation of the number of electromagnets 1700A-1700n at the corresponding predetermined location based on the location information LL and pose information of the at least one platen 1510; and the respective coil controller 1750A-1750n may be configured so as to effect local control, separate from each of the high level control variables received from the master controller 199, of excitation of the number of electromagnets 1700A-1700n at the corresponding predetermined location.

[0192] The following are provided in accordance with the present disclosure and may be employed individually, in any combination with each other, and / or in any combination with the features described above:

[0193] A linear electric machine comprises: a frame with a level reference plane; an array of electromagnets, connected to the frame to form a drive plane at a predetermined height relative to the reference plane, the array of electromagnets being arranged so that a series ofAtty. Docket No.390P017053-WO (PCT) electromagnets of the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets being coupled to power source energizing each electromagnet; at least one reaction platen of material disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets generates levitation and propulsion forces against the reaction platen that controllably levitate and propel the reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane; and a controller system that has a distributed control configuration with a master controller and more than one coil controllers communicably connected to each other, the master controller being configured to send master commands describing high level control variables to the more than one coil controllers operably coupled to the array of electromagnets and the power source and configured so as to sequentially excite the electromagnets with a predetermined excitation characteristic so as to describe six degree of freedom reaction platen control of each of the at least one reaction platen, and the at least one reaction platen is levitated and propelled with at least four degrees of freedom; wherein each respective coil controller is coupled to a number of electromagnets at a predetermined location in the array corresponding to the respective coil controller so that the number of electromagnets at the corresponding predetermined location are controlled by the respective coil controller separate and distinct from each other coil controller of the controller system, and each reaction platen is levitated and propelled with the at least four degrees of freedom based on the high level control variables and the corresponding predetermined location, stored in the respective coil controller, of the electromagnets at the corresponding predetermined location.

[0194] The linear electric machine may include one or more of the following, individually, in any suitable combination, and / or in any suitable combination with the features described herein:

[0195] the master controller is communicably connected to the more than one coil controllers by a deterministic network for real time controls;

[0196] the power source is an alternating current power source;Atty. Docket No.390P017053-WO (PCT)

[0197] the reaction platen is of paramagnetic, diamagnetic, or non-magnetic conductive material;

[0198] each other coil controller respectively controls electromagnets at other corresponding locations of the array, so that electromagnets at each other corresponding location are controlled by a different respective coil controller;

[0199] the master controller has a path planning module that defines a planned trajectory of the at least one reaction platen, and has a control module that calculates, based on the planned trajectory, the high level control variables that describe the six degree of freedom control and effect the planned trajectory;

[0200] the respective coil controller is configured to receive the master commands describing the high level control variables, and generate, based on the high level control variables, output signals to excite each of the number of electromagnets, corresponding to the respective coil controller, effecting levitation and propulsion of the at least one reaction platen with the at least four degrees of freedom control along the planned trajectory;

[0201] the master commands include pose information of the at least one reaction platen with respect to the reference plane;

[0202] the respective coil controller is configured with location information that informs the corresponding predetermined location of the number of electromagnets with respect to the reference plane;

[0203] the respective coil controller controls and effects excitation of the number of electromagnets at the corresponding predetermined location based on the location information and pose information of the at least one platen; and

[0204] the respective coil controller is configured so as to effect local control, separate from each of the high level control variables received from the master controller, of excitation of the number of electromagnets at the corresponding predetermined location.Atty. Docket No.390P017053-WO (PCT)

[0205] A method comprises: providing a linear electrical machine having: a frame with a level reference plane; an array of electromagnets, connected to the frame to form a drive plane at a predetermined height relative to the reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets being coupled to a power source energizing each electromagnet; at least one reaction platen of a material disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets generates levitation and propulsion forces against the at least one reaction platen that controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane; and a controller system that has a distributed control configuration with a master controller and more than one coil controllers communicably connected to each other, the master controller being configured to send master commands describing high level control variables to the more than one coil controllers operably coupled to the array of electromagnets and the power source; and sequentially exciting, with the controller, the electromagnets with a predetermined excitation characteristic so as to describe six degree of freedom reaction platen control of each of the at least one reaction platen, and the at least one reaction platen is levitated and propelled with at least four degrees of freedom; wherein each respective coil controller is coupled to a number of electromagnets at a predetermined location in the array corresponding to the respective coil controller so that the number of electromagnets at the corresponding predetermined location are controlled by the respective coil controller separate and distinct from each other coil controller of the controller system, and each reaction platen is levitated and propelled with at least four degrees of freedom based on the high level control variables and the corresponding predetermined location, stored in the respective coil controller, of the electromagnets at the corresponding predetermined location.

[0206] The method may include one or more of the following, individually, in any suitable combination, and / or in any suitable combination with the features described herein:Atty. Docket No.390P017053-WO (PCT)

[0207] the master controller is communicably connected to the more than one coil controllers by a deterministic network for real time controls;

[0208] the power source is an alternating current power source;

[0209] the reaction platen is of paramagnetic, diamagnetic, or non-magnetic conductive material;

[0210] each other coil controller respectively controls electromagnets at other corresponding locations of the array, so that electromagnets at each other corresponding location are controlled by a different respective coil controller;

[0211] the master controller has a path planning module that defines a planned trajectory of the at least one reaction platen, and has a control module that calculates, based on the planned trajectory, the high level control variables that describe the six degree of freedom control and effect the planned trajectory;

[0212] the respective coil controller is configured to receive the master commands describing the high level control variables, and generate, based on the high level control variables, output signals to excite each of the number of electromagnets, corresponding to the respective coil controller, effecting levitation and propulsion of the at least one reaction platen with the at least four degrees of freedom control along the planned trajectory;

[0213] the master commands include pose information of the at least one reaction platen with respect to the reference plane;

[0214] the respective coil controller is configured with location information that informs the corresponding predetermined location of the number of electromagnets with respect to the reference plane;Atty. Docket No.390P017053-WO (PCT)

[0215] the respective coil controller controls and effects excitation of the number of electromagnets at the corresponding predetermined location based on the location information and pose information of the at least one platen; and

[0216] the respective coil controller is configured so as to effect local control, separate from each of the high level control variables received from the master controller, of excitation of the number of electromagnets at the corresponding predetermined location.

[0217] A linear electrical machine comprises: a frame with a level reference plane; an array of electromagnets, connected to the frame to form a drive plane at a predetermined height relative to the reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets being coupled to a power source energizing each electromagnet; at least one reaction platen of a material disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets generates levitation and propulsion forces against the at least one reaction platen that controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane; and a controller system that has a distributed control configuration with a master controller and more than one coil controllers communicably connected to each other, the master controller being configured to send master commands and a feed forward term to the more than one coil controllers operably coupled to the array of electromagnets and the power source and configured so as to sequentially excite the electromagnets with a predetermined excitation characteristic; wherein each respective coil controller is coupled to a number of electromagnets at a predetermined location in the array corresponding to the respective coil controller so that the number of electromagnets at the corresponding predetermined location are controlled by the respective coil controller separate and distinct from each other coil controller of the controller system; and wherein the master commands describe high level control variables, and the feed forward term modulates the high level control variables so as to describe six degree of freedom reaction platen control of each of the at least one reactionAtty. Docket No.390P017053-WO (PCT) platen, and the at least one reaction platen is levitated and propelled with at least four degrees of freedom.

[0218] The linear electric machine may include one or more of the following, individually, in any suitable combination, and / or in any suitable combination with the features described herein:

[0219] the feed forward term is generated by a trained neural network;

[0220] the neural network is trained via a heuristic model of the linear electrical machine that predicts modulation of control variables that describe the six degree of freedom reaction platen control of the at least one reaction platen levitated and propelled with the at least four degrees of freedom along a planned trajectory;

[0221] the respective coil controller is configured to excite the number of electromagnets at the predetermined location so that each reaction platen is levitated and propelled with at least four degrees of freedom based on the high level control variables, the feed forward term, and the corresponding predetermined location, stored in the respective coil controller, of the electromagnets at the corresponding predetermined location;

[0222] the master controller is communicably connected to the more than one coil controllers by a deterministic network for real time controls;

[0223] the power source is an alternating current power source;

[0224] the at least one reaction platen is of paramagnetic, diamagnetic, or non-magnetic conductive material;

[0225] the master controller has a path planning module that defines a planned trajectory of the at least one reaction platen, and has a control module that calculates, based on the planned trajectory, the high level control variables that describe the six degree of freedom control and effect the planned trajectory;Atty. Docket No.390P017053-WO (PCT)

[0226] the respective coil controller is configured to receive the master commands describing the high level control variables, and generate, based on the high level control variables, output signals to excite each of the number of electromagnets, corresponding to the respective coil controller, effecting levitation and propulsion of the at least one reaction platen with the at least four degrees of freedom control along the planned trajectory;

[0227] the master commands include pose information of the at least one reaction platen with respect to the reference plane;

[0228] the respective coil controller is configured with location information that informs the corresponding predetermined location of the number of electromagnets with respect to the reference plane;

[0229] the respective coil controller controls and effects excitation of the number of electromagnets at the corresponding predetermined location based on the location information and pose information of the at least one platen; and

[0230] the respective coil controller is configured so as to effect local control, separate from each of the high level control variables received from the master controller, of excitation of the number of electromagnets at the corresponding predetermined location.

[0231] A method comprises: providing a linear electrical machine including: a frame with a level reference plane; an array of electromagnets, connected to the frame to form a drive plane at a predetermined height relative to the reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets being coupled to a power source energizing each electromagnet; at least one reaction platen of a material disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets generates levitation and propulsion forces against the at least one reaction platen that controllably levitate and propel the at least one reaction platen along the at least one drive line, inAtty. Docket No.390P017053-WO (PCT) a controlled attitude relative to the drive plane; and a controller system that has a distributed control configuration with a master controller and more than one coil controllers communicably connected to each other; and sending, with the master controller, master commands and a feed forward term to the more than one coil controllers operably coupled to the array of electromagnets and the power source and configured so as to sequentially excite the electromagnets with a predetermined excitation characteristic; wherein each respective coil controller is coupled to a number of electromagnets at a predetermined location in the array corresponding to the respective coil controller so that the number of electromagnets at the corresponding predetermined location are controlled by the respective coil controller separate and distinct from each other coil controller of the controller system; and wherein the master commands describe high level control variables, and the feed forward term modulates the high level control variables so as to describe six degree of freedom reaction platen control of each of the at least one reaction platen, and the at least one reaction platen is levitated and propelled with at least four degrees of freedom.

[0232] The method may include one or more of the following, individually, in any suitable combination, and / or in any suitable combination with the features described herein:

[0233] the feed forward term is generated by a trained neural network;

[0234] the neural network is trained via a heuristic model of the linear electrical machine that predicts modulation of control variables that describe the six degree of freedom reaction platen control of the at least one reaction platen levitated and propelled with the at least four degrees of freedom along a planned trajectory;

[0235] the respective coil controller is configured to excite the number of electromagnets at the predetermined location so that each reaction platen is levitated and propelled with at least four degrees of freedom based on the high level control variables, the feed forward term, and theAtty. Docket No.390P017053-WO (PCT) corresponding predetermined location, stored in the respective coil controller, of the electromagnets at the corresponding predetermined location;

[0236] the master controller is communicably connected to the more than one coil controllers by a deterministic network for real time controls;

[0237] the power source is an alternating current power source;

[0238] the at least one reaction platen is of paramagnetic, diamagnetic, or non-magnetic conductive material;

[0239] the master controller has a path planning module that defines a planned trajectory of the at least one reaction platen, and has a control module that calculates, based on the planned trajectory, the high level control variables that describe the six degree of freedom control and effect the planned trajectory;

[0240] the respective coil controller is configured to receive the master commands describing the high level control variables, and generate, based on the high level control variables, output signals to excite each of the number of electromagnets, corresponding to the respective coil controller, effecting levitation and propulsion of the at least one reaction platen with the at least four degrees of freedom control along the planned trajectory;

[0241] the master commands include pose information of the at least one reaction platen with respect to the reference plane;

[0242] the respective coil controller is configured with location information that informs the corresponding predetermined location of the number of electromagnets with respect to the reference plane;Atty. Docket No.390P017053-WO (PCT)

[0243] the respective coil controller controls and effects excitation of the number of electromagnets at the corresponding predetermined location based on the location information and pose information of the at least one platen; and

[0244] the respective coil controller is configured so as to effect local control, separate from each of the high level control variables received from the master controller, of excitation of the number of electromagnets at the corresponding predetermined location.

[0245] It should be understood that the foregoing description is only illustrative of the present disclosure. Various alternatives and modifications can be devised by those skilled in the art without departing from the present disclosure. Accordingly, the present disclosure is intended to embrace all such alternatives, modifications and variances that fall within the scope of any claims appended hereto. Further, the mere fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be advantageously used, such a combination remaining within the scope of the present disclosure.

[0246] What is claimed is:

Claims

Atty. Docket No.390P017053-WO (PCT) CLAIMS 1. A linear electrical machine comprising: a frame with a level reference plane; an array of electromagnets, connected to the frame to form a drive plane at a predetermined height relative to the reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets being coupled to a power source energizing each electromagnet; at least one reaction platen of a material disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets generates levitation and propulsion forces against the at least one reaction platen that controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane; and a controller system that has a distributed control configuration with a master controller and more than one coil controllers communicably connected to each other, the master controller being configured to send master commands describing high level control variables to the more than one coil controllers operably coupled to the array of electromagnets and the power source and configured so as to sequentially excite the electromagnets with a predetermined excitation characteristic so as to describe six degree of freedom reaction platen control of each of the at least one reaction platen, and the at least one reaction platen is levitated and propelled with at least four degrees of freedom, wherein each respective coil controller is coupled to a number of electromagnets at a predetermined location in the array corresponding to the respective coil controller so that the number of electromagnets at the corresponding predetermined location are controlled by theAtty. Docket No.390P017053-WO (PCT) respective coil controller separate and distinct from each other coil controller of the controller system, and each reaction platen is levitated and propelled with at least four degrees of freedom based on the high level control variables and the corresponding predetermined location, stored in the respective coil controller, of the electromagnets at the corresponding predetermined location.

2. The linear electrical machine of claim 1, wherein the master controller is communicably connected to the more than one coil controllers by a deterministic network for real time controls.

3. The linear electrical machine of claim 1, wherein the at least one reaction platen is of paramagnetic, diamagnetic, or non-magnetic conductive material.

4. The linear electrical machine of claim 1, wherein each other coil controller respectively controls electromagnets at other corresponding locations of the array, so that electromagnets at each other corresponding location are controlled by a different respective coil controller.

5. The linear electrical machine of claim 1, wherein the master controller has a path planning module that defines a planned trajectory of the at least one reaction platen, and has a control module that calculates, based on the planned trajectory, the high level control variables that describe the six degree of freedom control and effect the planned trajectory.

6. The linear electrical machine of claim 5, wherein the respective coil controller is configured to receive the master commands describing the high level control variables, and generate, based on the high level control variables, output signals to excite each of the number of electromagnets, corresponding to the respective coil controller, effecting levitation and propulsion of the at least one reaction platen with the at least four degrees of freedom control along the planned trajectory.

7. The linear electrical machine of claim 1, wherein the master commands include pose information of the at least one reaction platen with respect to the reference plane.Atty. Docket No.390P017053-WO (PCT) 8. The linear electrical machine of claim 7, wherein the respective coil controller is configured with location information that informs the corresponding predetermined location of the number of electromagnets with respect to the reference plane.

9. The linear electrical machine of claim 8, wherein the respective coil controller controls and effects excitation of the number of electromagnets at the corresponding predetermined location based on the location information and pose information of the at least one platen.

10. The linear electrical machine of claim 1, wherein the respective coil controller is configured so as to effect local control, separate from each of the high level control variables received from the master controller, of excitation of the number of electromagnets at the corresponding predetermined location.

11. A method comprising: providing a linear electrical machine having: a frame with a level reference plane; an array of electromagnets, connected to the frame to form a drive plane at a predetermined height relative to the reference plane, the array of electromagnets being arranged so that a series of electromagnets of the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets being coupled to a power source energizing each electromagnet; at least one reaction platen of a material disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets generates levitation and propulsion forces against the at least one reaction platen that controllably levitate and propel the at least one reaction platen along the at least one drive line, in a controlled attitude relative to the drive plane; andAtty. Docket No.390P017053-WO (PCT) a controller system that has a distributed control configuration with a master controller and more than one coil controllers communicably connected to each other, the master controller being configured to send master commands describing high level control variables to the more than one coil controllers operably coupled to the array of electromagnets and the power source; and sequentially exciting, with the controller, the electromagnets with a predetermined excitation characteristic so as to describe six degree of freedom reaction platen control of each of the at least one reaction platen, and the at least one reaction platen is levitated and propelled with at least four degrees of freedom; wherein each respective coil controller is coupled to a number of electromagnets at a predetermined location in the array corresponding to the respective coil controller so that the number of electromagnets at the corresponding predetermined location are controlled by the respective coil controller separate and distinct from each other coil controller of the controller system, and each reaction platen is levitated and propelled with at least four degrees of freedom based on the high level control variables and the corresponding predetermined location, stored in the respective coil controller, of the electromagnets at the corresponding predetermined location.

12. The method of claim 11, wherein the master controller is communicably connected to the more than one coil controllers by a deterministic network for real time controls.

13. The method of claim 11, wherein the reaction platen is of paramagnetic, diamagnetic, or non-magnetic conductive material.

14. The method of claim 11, wherein each other coil controller respectively controls electromagnets at other corresponding locations of the array, so that electromagnets at each other corresponding location are controlled by a different respective coil controller.Atty. Docket No.390P017053-WO (PCT) 15. The method of claim 11, wherein the master controller has a path planning module that defines a planned trajectory of the at least one reaction platen, and has a control module that calculates, based on the planned trajectory, the high level control variables that describe the six degree of freedom control and effect the planned trajectory.

16. The method of claim 15, wherein the respective coil controller is configured to receive the master commands describing the high level control variables, and generate, based on the high level control variables, output signals to excite each of the number of electromagnets, corresponding to the respective coil controller, effecting levitation and propulsion of the at least one reaction platen with the at least four degrees of freedom control along the planned trajectory.

17. The method of claim 11, wherein the master commands include pose information of the at least one reaction platen with respect to the reference plane.

18. The method of claim 17, wherein the respective coil controller is configured with location information that informs the corresponding predetermined location of the number of electromagnets with respect to the reference plane.

19. The method of claim 18, wherein the respective coil controller controls and effects excitation of the number of electromagnets at the corresponding predetermined location based on the location information and pose information of the at least one platen.

20. The method of claim 11, wherein the respective coil controller is configured so as to effect local control, separate from each of the high level control variables received from the master controller, of excitation of the number of electromagnets at the corresponding predetermined location.

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