High density optical interconnects to confinement apparatuses

Abstract

Example embodiments provide methods, systems, apparatuses, computer program products and / or the like for high density optical interconnects to confinement apparatuses. In various embodiments, an optical coupler may be a prism coupler. In various embodiments, the optical coupler may be one or more micromachined couplers. In various embodiments, the one or more micromachined couplers may be coupled to the confinement apparatus in a direction transverse to the plane of the confinement apparatus. In various embodiments, the optical coupler may comprise one or more micromachined couplers having notches, one or more cloud chips coupled to the notches, and one or more confinement apparatuses. In various embodiments, the assemblies of micromachined couplers having notches, one or more cloud chips coupled to the notches, and one or more confinement apparatuses may be tiled together into an array.

Description

HIGH DENSITY OPTICAL INTERCONNECTS TO CONFINEMENT APPARATUSESCROSS-REFERENCE TO RELATED APPLICATION(S)

[0001] This application claims priority to U.S. Application No. 19 / 207,009, filed May 13, 2025, which claims priority to U.S. Application No. 63 / 648,342, filed May 16, 2024, the contents of which are incorporated herein by reference in their entireties.TECHNICAL FIELD

[0002] Various embodiments relate to apparatuses, systems, and methods relating to and / or including high density optical interconnects. Various embodiments relate to photonic elements that include high density optical interconnects. An example embodiment relates to confined object quantum computing (e.g., quantum charge-coupled device (QCCD)-based quantum computing) wherein high density optical interconnects are coupled to and / or disposed on a surface of an atomic object containment apparatus of a confined object quantum computer.BACKGROUND

[0003] Interacting with ions confined by an ion trap often includes precisely focusing light that is used to interact with ions onto the locations of the ions. For large ion traps this may mean that are large number of optical inputs that can precisely focus light onto respective locations of the ion trap are needed. For ion traps having integrated optics, this may mean that a large number of optical inputs need to be supported by the chip hosting the ion trap. However, the chip hosting the ion trap has a limited amount of area along its edge for edge coupling optical fibers, for example. Through applied effort, ingenuity, and innovation, many deficiencies of prior optical interconnects to ion traps and corresponding fabrication techniques have been solved by developing solutions that are structured in accordance with the embodiments of the present invention, many examples of which are described in detail herein.BRIEF SUMMARY OF EXAMPLE EMBODIMENTS

[0004] Example embodiments provide methods, systems, apparatuses, computer program products and / or the like for high density optical interconnects, for example, to confinement apparatuses, such as ion traps. In various embodiments, the high density optical interconnects are at least part of photonic structures or elements. For example, a high density opticalinterconnect may be part of a photonic chip or other photonic element. In various embodiments, the high density optical interconnects disclosed herein are scalable.

[0005] According to an aspect of the present disclosure, an alignment assembly is provided. In some embodiments, the alignment assembly comprises an alignment device. In some embodiments, the alignment device comprises: an optical coupler comprising a plurality of inputs at respective input positions, a plurality of outputs at respective output positions, and one or more optical paths between the plurality of inputs and the plurality of outputs configured to provide paths from one or more respective inputs of the plurality of inputs to one or more respective outputs of the plurality of outputs, wherein: one or more optical inputs are coupled to the optical coupler at one or more respective input positions; and the plurality of inputs defines an input direction and the plurality of outputs defines an output direction, wherein the input direction is at an angle to the output direction.

[0006] In some embodiments, the optical coupler is a prism coupler, and the one or more optical inputs are disposed on the prism coupler at one side.

[0007] In some embodiments, the prism coupler is a triangular prism, and the prism coupler further comprises optical features on its exit surface.

[0008] In some embodiments, the optical features are at least one of: diffractive optical elements (DOEs), metasurfaces, fiducials, micro-optics, or absorbers.

[0009] In some embodiments, the angle is at least one of: less than 90 degrees, approximately 90 degrees; or greater than 90 degrees.

[0010] In some embodiments, the optical coupler is a first micromachined coupler, and the first micromachined coupler comprises two or more optical inputs at two or more respective input positions, and the first micromachined coupler comprises two or more reflectors for directing light from the two or more optical inputs to one or more target locations.

[0011] In some embodiments, the first micromachined coupler comprises grooves for aligning incoming optical fibers with the two or more reflectors.

[0012] In some embodiments, the first micromachined coupler comprises one or more transparent membranes across an exit surface of the first micromachined coupler.

[0013] In some embodiments, one or more optical features are patterned on the one or more transparent membranes.

[0014] In some embodiments, the optical coupler is comprised of two or more micromachined couplers, wherein the two or more micromachined couplers comprise two or more first optical inputs at two or more first respective input positions at each of themicromachined couplers and two or more second optical inputs at two or more second respective input positions at each of the micromachined couplers, and wherein the two or more micromachined couplers comprise two or more first reflectors and two or more second reflectors for directing light from their respective inputs.

[0015] In some embodiments, the two or more micromachined couplers comprise grooves for aligning incoming optical fibers, and the two or more micromachined couplers further comprise one or more transparent membranes across an exit surface of the two or more micromachined couplers.

[0016] In some embodiments, one or more optical features are patterned on the one or more transparent membranes.

[0017] In some embodiments, the two or more micromachined couplers are coupled to a receiving device at two or more different sides of the receiving device.

[0018] In some embodiments, the optical coupler is a second micromachined coupler comprising a cloud support configured to at least partially support a cloud chip, and the second micromachined coupler comprises two or more micromachined couplers.

[0019] In some embodiments, the cloud support is comprised of two or more first notches created via precision photolithography or etching near the top edges of the two or more micromachined couplers, and the cloud chip is coupled to the two or more micromachined couplers via the two or more first notches.

[0020] In some embodiments, a trap chip is coupled to the two or more micromachined couplers via the two or more first notches.

[0021] In some embodiments, the cloud support is comprised of two or more second notches created via precision photolithography or etching near the edges of the cloud chip, such that the cloud chip is coupled to the two or more micromachined couplers via the two or more second notches.

[0022] In some embodiments, the optical coupler is comprised of at least one brick comprising two or more micromachined couplers and one or more cloud chips.

[0023] In some embodiments, the one or more cloud chips are coupled to the two or more micromachined couplers via two or more notches created via precision photolithography or etching in the two or more micromachined couplers.

[0024] According to an aspect of the present disclosure, a method for aligning one or more optical sources with respective target locations of a receiving device is provided. In some embodiments, the method comprises: providing an alignment device, the alignment device comprising an optical coupler comprising a plurality of inputs at respective inputpositions, a plurality of outputs at respective output positions, and one or more optical paths between the plurality of inputs and the plurality of outputs configured to provide paths from one or more respective inputs of the plurality of inputs to one or more respective outputs of the plurality of outputs, wherein: one or more optical inputs are coupled to the optical coupler at one or more respective input positions; and the plurality of inputs defines an input direction and the plurality of outputs defines an output direction, wherein the input direction is at an angle to the output direction. In some embodiments, the method comprises: securing the alignment device with respect to the receiving device such that an alignment criterion is satisfied.

[0025] In some embodiments, the angle is at least one of: less than 90 degrees, approximately 90 degrees; or greater than 90 degrees.

[0026] In some embodiments, the method comprises, at a point in time after the securing of the alignment device with respect to the receiving device, determining whether the alignment criterion is still satisfied.

[0027] According to an aspect of the present disclosure, a method for manufacturing an alignment device is provided. In some embodiments, the method comprises: obtaining at least one optical coupler; coupling a plurality of optical sources to a plurality of inputs at respective input positions on the optical coupler and coupling a plurality of outputs at respective output positions on the optical coupler, wherein the plurality of inputs defines an input direction and the plurality of outputs defines an output direction, wherein the input direction is at an angle to the output direction; and applying one or more optical paths to the optical coupler, wherein the one or more optical paths are configured to provide paths from one or more respective inputs of the plurality of inputs to one or more respective outputs of the plurality of outputs.

[0028] In some embodiments, the angle is at least one of: less than 90 degrees; approximately 90 degrees; or greater than 90 degrees.

[0029] In some embodiments, manufacturing the alignment device comprises lithographic, deposition and etching techniques to form at least one of the plurality of inputs, the plurality of outputs, or the one or more optical paths.

[0030] In some embodiments, manufacturing the alignment device comprises using direct-write techniques to form the one or more optical paths, the direct-write techniques comprising at least femtosecond laser processing.

[0031] In some embodiments, manufacturing the alignment device comprises using masked chemical processing techniques to form the one or more optical paths, the maskedchemical processing techniques comprising at least one of: glass-ion exchange; or local doping methods.

[0032] In some embodiments, the method further comprises coupling the at least one optical coupler to a receiving device.BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

[0033] Having thus described the invention in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein:

[0034] Figure l is a side view of a prism coupler, according to an example embodiment;

[0035] Figure 2 is a side view of a first micromachined coupler, according to an example embodiment;

[0036] Figure 3 A is a front cross-sectional view a micromachined coupler, according to an example embodiment;

[0037] Figure 3B is a top-down view of the micromachined coupler of Figure 3 A, according to an example embodiment;

[0038] Figure 3C is a side cross-sectional view of the micromachined coupler of Figure 3 A, according to an example embodiment;

[0039] Figure 4 is a side view of two micromachined couplers, according to an example embodiment;

[0040] Figure 5A is a front view of a second micromachined coupler comprising a cloud support, according to an example embodiment;

[0041] Figure 5B is a simplified view of the second micromachined coupler of Figure 5 A;

[0042] Figure 6A is a top-down view of an array of bricks comprising two or more micromachined couplers and one or more cloud chips;

[0043] Figure 6B is a perspective view of one brick of the array of bricks of Figure 6A;

[0044] Figure 7A is a flowchart of an example method for manufacturing an alignment device;

[0045] Figure 7B is flowchart of an example method for aligning one or more optical sources with respective target locations of a receiving device;

[0046] Figure 8 is a schematic diagram illustrating an example quantum computing system comprising a three-level structure, according to an example embodiment;

[0047] Figure 9 provides a schematic diagram of an example controller of a quantum computer configured to perform one or more deterministic reshaping and / or reordering functions, according to various embodiments; and

[0048] Figure 10 provides a schematic diagram of an example computing entity of a quantum computer system that may be used in accordance with an example embodiment.DETAILED DESCRIPTION OF SOME EXAMPLE EMBODIMENTS

[0049] The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. Indeed, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. The term “or” (also denoted “ / ”) is used herein in both the alternative and conjunctive sense, unless otherwise indicated. The terms “illustrative” and “exemplary” are used to be examples with no indication of quality level. The terms “generally,” “substantially,” and “approximately” refer to within engineering and / or manufacturing tolerances and / or within user measurement capabilities, unless otherwise indicated. Like numbers refer to like elements throughout.

[0050] Some microelectronic or microelectromechanical systems (MEMS) devices include on-chip photonic components to provide optical functionality and system miniaturization. For example, confinement apparatuses with on-chip photonics enable orders of magnitude increases in scaling over traps using free-space optics, and orders of magnitude miniaturization of the overall system using the confinement apparatus (such as a quantum computer).

[0051] A challenge with on-chip photonics is the input and output (I / O) of the optical signals, for example, if a large number of optical EOs are needed. A high efficiency EO may be achieved by “butt coupling” an optical fiber to the edge of the chip. An optical fiber may be butted up to the edge of a photonic integrated circuit (PIC) chip, with the core of the fiber aligned to a specially designed input coupling feature on the chip, such as an inverse taper. With proper taper design, alignment, and edge treatment of the fiber and chip, the light coming out of the fiber may couple efficiently into the taper and subsequently into a waveguide on the PIC (or vice versa). However, some challenges regarding the alignment of the fibers and the quantity and density of the fibers may arise.

[0052] Fibers are typically aligned to the inputs with precision of a fraction of a micron, for example, if the wavelength of interest is in the visible spectrum. The axes of the incomingoptical fibers may be approximately parallel to the plane of the PIC. The input features on the PIC may be positioned along the edge of the chip. In some examples, input couplers are buried some distance below the surface of the chip. When multiple inputs are placed along the edge of the PIC, their positions relative to the top surface of the PIC may vary by 10 microns or more from one input coupler to another. The positions of the inputs in the plane of the PIC are precise due to their fabrication via, for example, photolithography.

[0053] Often a large number of optical fibers are used to feed the necessary number of optical signals to the PIC. For example, a fiber may be -125 microns in diameter. Since each fiber carries one signal, this limits the input density to at most 1 input per 125 microns, or about 8 inputs per millimeter. If more than -200 inputs are needed, the size begins to approach dimensions that are impractical for a complex PIC. Therefore, there exists a limit to the number of fibers that can be attached to a conventional PIC. In addition, it may be preferable to space the optical signals more closely than -125 microns, regardless of the PIC size.

[0054] A solution for dealing with the quantity and density challenges is to use a so- called “photonic interposer.” In a photonic interposer, optical fibers input light into one portion of the interposer. Photonic interposers may be relatively simple chips and may therefore be easier to fabricate / manufacture larger than more complex chips. Therefore, a photonic interposer has more edge length for fiber attachment. Once signals are in waveguides on the interposer, they can be routed to a much smaller region where they may then be coupled into inputs on the PIC. The positioning of the waveguides at the output end of the photonic interposer is configured by photolithography, which is a precise method which allows excellent alignment to the inputs on the PIC. However, a shortcoming of this conventional solution is that a large area around the edge of the PIC is needed for the photonic interposer, so the assembly is not able to fit into a small space.

[0055] Therefore, there is a need for techniques for making large quantity, high-density inputs with high-precision alignment to the edge of a PIC. Embodiments of the present disclosure provide solutions to these problems, along with providing additional benefits. For example, in various embodiments the optical fibers are positioned with their axes perpendicular to the PIC surface rather than parallel to it. This takes advantage of the 3rd dimension, reducing the overall footprint of the assembly, and allowing it to fit into smaller spaces.

[0056] However, this solution introduces a new technical challenge in that the light provided by the optical fibers is propagating in a direction that is not aligned withwaveguides and / or other optical features of the PIC. Various technical solutions to this technical challenge are provided herein.

[0057] In various embodiments, a prism coupler is used to provide high density optical interconnects to confinement apparatuses. In various embodiments, in a confinement apparatus having ions above the surface of the confinement apparatus, there may be waveguides disposed from a few microns to 10-15 microns below the surface of the confinement apparatus. For example, the confinement apparatus may include a photonics layer (e.g., including waveguides and / or other photonics elements) disposed between the top metal layer that includes a plurality of electrodes configured for generating a confinement potential and a substrate on which the confinement apparatus is fabricated. In various embodiments, optical fibers may be butted up to the bottom edge of a prism such that light being transmitted by the optical fibers may reflect off the back surface of the prism at an angle (e.g., approximately 45 degrees). In various embodiments, using various lithographic methods (e.g., direct laser writing, electron beam lithography, nano imprint lithography, etc.), diffractive optical elements (DOEs) may be etched on a surface of the prism which faces the confinement apparatus, wherein the DOEs may serve to focus light, control polarization of light, and / or otherwise affect light as it travels to the waveguides on the confinement apparatus. For example, using femtosecond direct laser writing, inputs to the prism may be configured such that they are fanned out over an extended area to route signals within the prism to its reflecting face. An advantage of this method is that the features of the prism can be assembled ahead of coupling to the confinement apparatus as a single assembly, such that alignment of all inputs to the trap occurs in one step.

[0058] In various embodiments, a micromachined coupler (e.g., a first micromachined coupler) is used to provide high density optical interconnects to confinement apparatuses. In various embodiments, a chip may be micromachined such that the chip includes grooves or trenches through which optical fibers may be mechanically coupled to the micromachined chip, which may be referred to as a micromachined coupler herein. In various embodiments, the grooves or trenches may be v-grooves and / or rectangular trenches. In various embodiments, the grooves or trenches may be at the same depths or at different depths. In various embodiments, light can move through the micromachined chip and reflect off faces etched into the chip. In various embodiments, the chip may have transparent membranes on its surface. In various embodiments, the transparent membranes may be configured to have diffractive optical features patterned onto their surfaces which can provide focusing of the light. In various embodiments, the micromachined coupler may comprise DOEs,metasurfaces, diffractive lenses, and / or other features. In various embodiments, the micromachined coupler may be configured such that one fiber provides light that reflects off a reflector such that it inputs into a waveguide near the surface of the confinement apparatus and another fiber provides light that reflects off a reflector and shines directly at an ion without traveling through a waveguide. In various embodiments, the micromachined coupler can be comprised of a silicon wafer or a glass block.

[0059] In various embodiments, two or more micromachined couplers are used to provide high density optical interconnects to confinement apparatuses. In various embodiments, the two or more micromachined couplers may include multiple sources of light (e.g., optical fibers) that can provide light to the confinement apparatus from above and below the confinement apparatus. In various embodiments, the two or more micromachined couplers may include switchable reflectors. For example, instead of a reflective face permanently etched into the surface of a chip, there may be a flat piece of material disposed on the surface of the chip, wherein the flat piece of material has switchable positions such that it can reflect light through DOEs in the transparent membrane of the micromachined couplers. For example, the material with switchable positions may be configured to reflect light such that it travels from a first optical input to a second optical input. For example, the material with switchable positions may be configured to reflect the light away from a corresponding waveguide or ion location such that it effectively turns off the light. For example, the material with switchable positions may be configured to act as a modulator, allowing for intensity control of the light.

[0060] In various embodiments, a micromachined coupler (e.g., a second micromachined coupler) is used to provide high density optical interconnects to confinement apparatuses. In various embodiments, the micromachined coupler may include a cloud support configured to at least partially support a cloud chip. In various embodiments, two or more micromachined couplers may comprise notches created via precision photolithography and / or etching near their tops. In various embodiments, a cloud chip may be precisely positioned using the cloud supports such that it is disposed parallel to the confinement apparatus. In various examples, cloud chips may host detectors and / or additional optical features such as diffractive lenses, metasurface lenses, absorbers, holes, and / or other features. An advantage of this combination is that the system of the two or more micromachined couplers, the optical fibers, and the cloud chip may be assembled together as a single assembly and later combined with a confinement apparatus such that the trap receives a minimal amount of handling. Another advantage of this combination is its robust structure.

[0061] In various embodiments, tiled confinement apparatuses comprising so-called “bricks” of micromachined couplers and cloud chips as building blocks are used to provide high density optical interconnects to confinement apparatuses. In various embodiments, a system of two or more micromachined couplers with cloud support may be assembled into bricks, which may further be tiled together into a matrix of many confinement apparatuses. Instead of unstable assemblies with many individual components, such bricks are much more robust. Further, some fanning out of optical inputs may be built into the micromachined couplers to allow a higher density of optical input points onto the traps.

[0062] Thus, various embodiments provide technical improvements to the fields of high density optical interconnects and systems that include high density optical interconnects and / or other optical components that may be replaced with high density optical interconnects.Exemplary Prism Coupler

[0063] Figure l is a side view of a prism coupler, according to an example embodiment. Figure 1 shows an alignment assembly comprising an alignment device 100, which includes a confinement apparatus 101 and a prism 102. The confinement apparatus 101 may be an atomic confinement apparatus, such as an ion trap. The prism 102 may be a triangular prism. In various embodiments, the prism 102 is used as an optical coupler. In various embodiments, the optical coupler (e.g., the prism 102 and / or optical couplers described with respect to Figures 2-6B herein) comprises a plurality of inputs at respective input positions, a plurality of outputs at respective output positions, and one or more optical paths between the plurality of inputs and the plurality of outputs (e.g., waveguides, free-space optical paths, and / or the like) configured to provide paths from one or more respective inputs of the plurality of inputs to one or more respective outputs of the plurality of outputs. In various embodiments, one or more optical inputs are coupled to the optical coupler at one or more respective input positions, and the plurality of inputs defines an input direction and the plurality of outputs defines an output direction, wherein the input direction is at an angle (e.g., at an angle less than 90 degrees, approximately equal to 90 degrees, and / or greater than 90 degrees) to the output direction.

[0064] The confinement apparatus 101 may have ions disposed and / or confined above its surface. The confinement apparatus 101 may comprise optical paths (e.g., waveguides, free- space optical paths, and / or the like) disposed from a few microns to approximately 10-15 microns below the surface of the confinement apparatus 101.

[0065] One or more fibers 104A. . .n may be aligned and affixed to one face of the prism 102 (e.g., an entrance 105 face of the prism 102). In various embodiments, light from the fibers 102 reflects off the 45-degree face of the prism 102 (e.g., depicted as the hypotenuse of the right triangle in Figure 1) and exits through an exit face 106 (e.g., the face orthogonal to the entrance face 105 of the prism 102). For example, a V-groove array, ferrule, and / or the like may be used to secure the optical fibers 104 A. . .n to the entrance face of the prism 102 such that the optical fibers 104A. . .n are aligned with respective inputs formed on / in the entrance face 105 of the prism 102.

[0066] The prism 102 comprises one or more features 103. For example, the one or more features 103 may be configured to be on the exit face of the prism 102. In various embodiments, the features 103 are configured to affect one or more optical properties of light passing therethrough. For example, a feature 103 may be configured to control, filter, modify, and / or the like the wavelength / frequency, polarization, phase delay, intensity, focal location, direction of propagation, and / or other optical property of light passing therethrough. In various embodiments, the one or more features 103 comprise one or more of diffractive optical elements, such as lenses, metasurfaces, DOEs, and / or other features configured to control one or more optical properties of light passing therethrough.

[0067] Micro-printing techniques (e.g., photolithography, electron-beam lithography, focused ion beam printing, etc.) may be used to create many different kinds of features on either face of the prism 102. For example, the various features 103 including alignment marks, diffraction DOEs, metasurfaces, fiducials, micro-optics, absorbers, modulators, detectors, active optical devices, and / or other features may be fabricated using a microprinting technique on the exit face 106 of the prism 102.

[0068] Micro-printing techniques may achieve sub-micron accuracy placement so that they match well with the input couplers on the PIC. For example, using femtosecond direct laser writing, inputs to the prism may be configured such that they are fanned out over an extended area to route signals within the prism to its reflecting face. Light traveling through the features 103 can be used for alignment when the fibers are being positioned and attached to the fiber-attach face (e.g., the entrance face).

[0069] An advantage of this solution, for example, is that it uses much less space than the photonic interposer which is positioned in the plane of the trap. An additional advantage of this solution is, for example, that the prism 102, the features 103, and / or the one or more fibers 104A. . .n may be assembled ahead of coupling to the confinement apparatus as a single assembly, such that alignment of all inputs to the trap occurs in one step.Exemplary Micromachined Coupler

[0070] Figure 2 is a side view of a first micromachined coupler, according to an example embodiment. A coupler may be referred to as “micromachined”, for example, if it is microfabricated on the micron scale (e.g., ranging from approximately 0.1 microns to approximately thousands of microns). In various embodiments, the first micromachined coupler is used as an optical coupler. In various embodiments, the first micromachined coupler comprises two or more optical inputs at two or more respective input positions. In various embodiments, the first micromachined coupler comprises two or more reflectors for directing light from the two or more optical inputs to one or more target locations.

[0071] Figure 2 shows an alignment assembly comprising an alignment device 200, which includes a confinement apparatus 201, a target location 202, and a micromachined coupler 203. In various embodiments, the confinement apparatus 201 may define, at least in part, a plurality of target locations, such as the target location 202. In various embodiments, signals are provided to the target location 202 that are defined at least in part by the confinement apparatus 201. Ions, atomic objects, quantum objects, and / or other objects may be confined and / or disposed at the target location 202. In various embodiments, one or more signals are directed at target locations (e.g., such as the target location 202), for example, regardless of the presence of the ions, atomic objects, quantum objects, and / or other objects at the target locations.

[0072] The micromachined coupler 203 may be comprised of a wafer. The micromachined coupler 203 comprises a first reflective face 204 and a second reflective face 205, wherein the reflective faces 204 and 205 may be angled at approximately 54.7 degrees to the wafer surface. The micromachined coupler 203 comprises a first input 206 through which light travels to the first reflective face 204. The micromachined coupler 203 comprises a second input 207 through which light travels to the second reflective face 205. The micromachined coupler may be configured to bring light in either from above or below the confinement apparatus 201.

[0073] Figures 3A-3C show various views of a micromachined coupler. Figure 3A is a front cross-sectional view a micromachined coupler, for example, the first micromachined coupler, according to an example embodiment. In various embodiments, the first micromachined coupler comprises grooves for aligning incoming optical fibers with the two or more reflectors. In various embodiments, the first micromachined coupler further comprises one or more transparent membranes across an exit surface of the firstmicromachined coupler. In various embodiments, one or more optical features are patterned on the one or more transparent membranes.

[0074] Figure 3 A shows a front cross-sectional view of an alignment assembly comprising an alignment device 300A. The front cross-sectional view of the alignment assembly comprising the alignment device 300A comprises a chip 301 having grooves. The grooves may be v-grooves, rectangular grooves, and / or other types of grooves. In various embodiments, the grooves are patterned into the chip 301 to support and / or coarsely align incoming optical fibers.

[0075] The front cross-sectional view of the alignment assembly comprising the alignment device 300A comprises optical fibers 302A. . .n, optical features 303 A. . .n, and a membrane 304. In various embodiments, light from the optical fibers 302A. . .n reflects off an anisotropically-etched reflective face that is angled at approximately 54.7 degrees to the wafer surface. In various embodiments, a substantially transparent membrane (e.g., the membrane 304) is stretched across the surface of the micromachined chip where the light exits. In various embodiments, the membrane 304 may be comprised of silicon nitride (SiN) and / or other materials. In various embodiments, the membrane 304 may include antireflection and / or other coatings to optimize transmission.

[0076] In various embodiments, the optical features 303 A. . .n are patterned on the surface of the membrane 304. In various embodiments, the optical features 303 A. . .n may be diffraction DOEs, metasurface lenses, micro-optic lenses, and / or other optical features. In various embodiments, the optical features 303 A. . .n redirect the incoming light such that it exits out of the micromachined chip and into input couplers on a confinement apparatus (e.g., ion trap).

[0077] In various embodiments, additional reflectors, membranes and / or optical features may be positioned on the micromachined coupler such that the light coming out of those locations focuses onto target locations (e.g., which comprise ions) above the surface of the confinement apparatus. In various embodiments, these additional reflectors, membranes, and / or optical features may be displaced further along the axis of the optical fibers 302A. . .n by an amount approximately equal to the ion height over the confinement apparatus surface.

[0078] Figure 3B is a top-down view of the micromachined coupler of Figure 3 A, according to an example embodiment. Figure 3B shows a top-down view of an alignment assembly comprising an alignment device 300B. The alignment assembly comprising the alignment device 300B comprises a chip 301 having grooves. The grooves may be v-grooves,rectangular grooves, and / or other types of grooves. In various embodiments, the grooves are patterned into the chip 301 to support and / or coarsely align incoming optical fibers.

[0079] The top-down view of the alignment assembly comprising the alignment device 300B comprises optical fibers 302A. . .n, optical features 303 A. . .n, and a membrane 304. In various embodiments, light from the optical fibers 302A. . .n reflects off an anisotropically- etched reflective face that is angled at approximately 54.7 degrees to the wafer surface. In various embodiments, a substantially transparent membrane (e.g., the membrane 304) is stretched across the surface of the micromachined chip where the light exits. In various embodiments, the membrane 304 may be comprised of silicon nitride (SiN) and / or other materials. In various embodiments, the membrane 304 may include antireflection and / or other coatings to optimize transmission.

[0080] In various embodiments, the optical features 303 A. . .n are patterned on the surface of the membrane 304. In various embodiments, the optical features 303 A. . .n may be diffraction DOEs, metasurface lenses, micro-optic lenses, and / or other optical features. In various embodiments, the optical features 303 A. . .n redirect the incoming light such that it exits out of the micromachined chip and into input couplers on a confinement apparatus (e.g., ion trap).

[0081] In various embodiments, additional reflectors, membranes and / or optical features may be positioned on the micromachined coupler such that the light coming out of those locations focuses onto target locations (e.g., which comprise ions) above the surface of the confinement apparatus. In various embodiments, these additional reflectors, membranes, and / or optical features may be displaced further along the axis of the optical fibers 302A. . .n by an amount approximately equal to the ion height over the confinement apparatus surface.

[0082] Figure 3C is a side cross-sectional view of the micromachined coupler of Figure 3 A, according to an example embodiment. Figure 3C shows a side cross-sectional view of an alignment assembly comprising an alignment device 300C. The alignment assembly comprising the alignment device 300C comprises a chip 301 having grooves. The grooves may be v-grooves, rectangular grooves, and / or other types of grooves. In various embodiments, the grooves are patterned into the chip 301 to support and / or coarsely align incoming optical fibers.

[0083] The side cross-sectional view of the alignment assembly comprising the alignment device 300C comprises optical fibers 302A. . .n, optical features 303 A. . .n, a membrane 304, and an exemplary light path 305. In various embodiments, light from the optical fibers 302A. . .n travels along the exemplary light path 305 and reflects off an anisotropically-etchedreflective face that is angled at approximately 54.7 degrees to the wafer surface. In various embodiments, a substantially transparent membrane (e.g., the membrane 304) is stretched across the surface of the micromachined chip where the light exits. In various embodiments, the membrane 304 may be comprised of silicon nitride (SiN) and / or other materials. For example, the membrane 304 may be a SiN film and / or other film that is substantially transparent for a light characterized by a wavelength of interest. In various embodiments, the membrane 304 may include antireflection and / or other coatings to optimize transmission.

[0084] In various embodiments, the optical features 303 A. . .n are patterned on the surface of the membrane 304. In various embodiments, the optical features 303 A. . .n may be diffraction DOEs, metasurface lenses, micro-optic lenses, and / or other optical features. In various embodiments, the optical features 303 A. . .n redirect the incoming light such that it exits out of the micromachined chip and into input couplers on a confinement apparatus (e.g., ion trap).

[0085] In various embodiments, additional reflectors, membranes and / or optical features may be positioned on the micromachined coupler such that the light coming out of those locations focuses onto target locations (e.g., which comprise ions) above the surface of the confinement apparatus. In various embodiments, these additional reflectors, membranes, and / or optical features may be displaced further along the axis of the optical fibers 302A. . .n by an amount approximately equal to the ion height over the confinement apparatus surface.

[0086] Advantages of the examples of Figures 3A-3C include, for example, good mechanical support for the incoming optical fibers 302A. . .n from the grooves and easy scalability (e.g., many copies of the device can be made on a single wafer).

[0087] In various embodiments, a micromachined coupler (e.g., the first micromachined coupler) is used to provide high density optical interconnects to confinement apparatuses. In various embodiments, a chip may be micromachined such that the chip includes grooves or trenches through which optical fibers may be mechanically coupled to the micromachined chip. In various embodiments, the grooves or trenches may be v-grooves and / or rectangular trenches. In various embodiments, the grooves or trenches may be at the same depths or at different depths. In various embodiments, light can move through the micromachined chip and reflect off faces etched into the chip. In various embodiments, the chip may have transparent membranes on its surface. In various embodiments, the transparent membranes may be configured to have diffractive optical features patterned onto their surfaces which can provide focusing of the light. In various embodiments, the micromachined coupler may comprise DOEs, metasurfaces, diffractive lenses, and / or other features. In variousembodiments, the micromachined coupler may be configured such that one fiber provides light that reflects off a reflector such that it inputs into a waveguide near the surface of the confinement apparatus and another fiber provides light that reflects off a reflector and shines directly at a target location (e.g., comprising an ion) without traveling through a waveguide. In various embodiments, the micromachined coupler can be comprised of a silicon wafer or a glass block.

[0088] In various embodiments, the membrane 304 may include DOEs (e.g., for mode control) and / or absorbers (e.g., for stray light control). In various embodiments, reflectors (e.g., the reflective faces 204 and 205) and / or membranes (e.g., the membrane 304) may be located at different locations such that some amount of light exits into the confinement apparatus surface and some other amount of light exits (e.g., and is focused) directly at a target location (e.g., comprising ions).

[0089] In various embodiments, fibers (e.g., the first and second inputs 206 and 207 and the optical fibers 302A. . .n) may couple to optical paths (e.g., waveguides, free-space optical paths, and / or the like) at an edge of the micromachined chip. In various embodiments, the optical paths may be recessed approximately 10-15 microns below the surface of the micromachined chip such that light may travel to the reflectors and / or membranes. In various embodiments, the fibers may be disposed in grooves and / or trenches such that they output light directly to the reflectors and / or membranes. In various embodiments, the grooves and / or trenches may be recessed at a depth in the micromachined chip such that the fibers are fully buried within the grooves and / or trenches. This arrangement may provide advantages such as increased efficiency.Exemplary Micromachined Coupler Comprising a Plurality of Micromachined Chips

[0090] Figure 4 is a side view of two micromachined couplers, according to an example embodiment. Figure 4 shows an alignment assembly comprising an alignment device 400. In various embodiments, the alignment assembly comprising an alignment device 400 comprises an optical coupler. In various embodiments, the optical coupler is comprised of two or more micromachined chips, wherein the two or more micromachined chips comprise two or more first optical inputs at two or more first respective input positions at each of the micromachined couplers and two or more second optical inputs at two or more second respective input positions at each of the micromachined chips, and wherein the two or more micromachined chips comprise two or more first reflectors and two or more second reflectors for directing light from their respective inputs.

[0091] In various embodiments, the two or more micromachined chips comprise grooves for aligning incoming optical fibers. In various embodiments, the two or more micromachined chips further comprise one or more transparent membranes across an exit surface of the two or more micromachined chips. In various embodiments, one or more optical features are patterned on the one or more transparent membranes. In various embodiments, the two or more micromachined chips are coupled to a receiving device (e.g., an atomic confinement apparatus, such as the confinement apparatus 201) at two or more different sides of the receiving device.

[0092] The alignment assembly comprising the alignment device 400 comprises two or more micromachined chips. For example, the alignment assembly comprising the alignment device 400 may comprise the micromachined coupler 203 (e.g., and its corresponding components) and a micromachined coupler 403. The alignment assembly comprising the alignment device 400 may comprise the confinement apparatus 201 and the target location 202.

[0093] In various embodiments, there may be a plurality of target locations, such as the target location 202. In various embodiments, signals are provided to the target location 202 that are defined at least in part by the confinement apparatus 201. Ions, atomic objects, quantum objects, and / or other objects may be confined and / or disposed at the target location 202. In various embodiments, one or more signals are directed at target locations (e.g., such as the target location 202), for example, regardless of the presence of the ions, atomic objects, quantum objects, and / or other objects at the target locations.

[0094] The micromachined coupler 203 may be comprised of a chip fabricated on a wafer. In various embodiments, the wafer may comprise many chips. The micromachined coupler 203 comprises a first reflective face 204 and a second reflective face 205, wherein the reflective faces 204 and 205 may be angled at approximately 54.7 degrees to the wafer surface. The micromachined coupler 203 comprises a first input 206 through which light travels to the first reflective face 204. The micromachined coupler 203 comprises a second input 207 through which light travels to the second reflective face 205.

[0095] The micromachined coupler 403 may be comprised of a chip fabricated on a wafer. In various embodiments, the wafer may comprise many chips. The micromachined coupler 403 comprises a first reflective face 404 and a second reflective face 405, wherein the reflective faces 404 and 405 may be angled at approximately 54.7 degrees to the wafer surface. The micromachined coupler 403 comprises a first input 406 through which lighttravels to the first reflective face 404. The micromachined coupler 403 comprises a second input 407 through which light travels to the second reflective face 405.

[0096] In various embodiments, incoming light is launched into optical paths (e.g., waveguides, free-space optical paths, and / or the like) on the surface of the micromachined couplers 203 and 403. In various embodiments, the optical paths route the light to mirrors or diffraction DOEs (e.g., 204, 205, 404, 405) to launch light off the chip. In various embodiments, outputs can be located precisely using photolithography so that they couple directly into the inputs on the trap and / or launch directly toward the target location. An advantage of this configuration is, for example, that the chip can be shaped like a photonic interposer such that a large array of fibers can be condensed into a more compact, higher- density array of outputs. In various embodiments, commercially available v-groove arrays may be used as the inputs to these micromachined couplers, making them more economical. In various embodiments, multiple layers of waveguides may be patterned onto the chip, allowing for complex routing configurations. The micromachined coupler may be configured to bring light in either from above or below the confinement apparatus 201.

[0097] The micromachined coupler may be configured to be a more complex chip with “active” features. For example, the reflective faces could be actively moving MEMS mirrors (e.g., such as a digital mirror device) which would allow turning beams on and off at will. For example, a modulator may allow for intensity control of the light. For example, an optical light source such as a laser may be used to provide the light.

[0098] In various embodiments, two or more micromachined chips are used to provide high density optical interconnects to confinement apparatuses. In various embodiments, the two or more micromachined chips may include multiple sources of light (e.g., optical fibers, inputs 206, 207, 406, 407) that can provide light to the confinement apparatus from above and below the confinement apparatus. In various embodiments, the two or more micromachined chips may include switchable reflectors. For example, instead of a reflective face permanently etched into the surface of a chip, there may be a substantially flat piece of material disposed (e.g., the reflective faces 204, 205, 404, 405) on the surface of the chip, wherein the substantially flat piece of material has switchable positions such that it can reflect light through DOEs in the transparent membrane of the micromachined couplers. For example, the material with switchable positions may be configured to reflect light such that it travels from a first optical input to a second optical input. For example, the material with switchable positions may be configured to reflect the light away from a corresponding waveguide or target location such that it effectively turns off the light. For example, thematerial with switchable positions may be configured to act as a modulator, allowing for intensity control of the light.Exemplary Micromachined Coupler Comprising Cloud Support

[0099] Figures 5A-5B show a micromachined coupler comprising cloud support. Figure 5A is a front view of a micromachined coupler (e.g., a second micromachined coupler) comprising a cloud support, according to an example embodiment. Figure 5A shows an alignment assembly comprising an alignment device 500A. The alignment assembly comprising the alignment device 500A comprises an optical coupler. In various embodiments, the optical coupler is a second micromachined coupler comprising a cloud support configured to at least partially support a cloud chip. In various embodiments, the second micromachined coupler comprises two or more micromachined chips. In various embodiments, the cloud support is comprised of two or more notches created via precision photolithography and / or etching near the top edges of the two or more micromachined chips. In various embodiments, the cloud chip is coupled to the two or more micromachined chips via the two or more notches. In various embodiments, a trap chip (e.g., a confinement apparatus chip) is coupled to the two or more micromachined couplers via the two or more notches. In various embodiments, the cloud support is comprised of two or more notches created via precision photolithography and / or etching near the edges of the cloud chip, such that the cloud chip is coupled to the two or more micromachined couplers via the two or more notches in the cloud chip.

[0100] The alignment assembly comprising the alignment device 500A comprises the confinement apparatus 201 and / or one or more target locations 202. The alignment assembly comprising the alignment device 500A comprises two or more micromachined chips (e.g., two or more micromachined chips 403). The micromachined chips 403 may be comprised of wafers. The micromachined chips 403 each comprise a first reflective face 404 and a second reflective face 405, wherein the reflective faces 404 and 405 may be angled at approximately 54.7 degrees to the wafer surface. The micromachined chips 403 each comprise a first input 406 through which light travels to the first reflective face 404. The micromachined chips 403 each comprise a second input 407 through which light travels to the second reflective face 405.

[0101] The alignment assembly comprising the alignment device 500A comprises a cloud chip 501 coupled to the micromachined chips 403 via two or more notches 502. The notches 502 may be etched lithographically into the surface of the micromachined chips 403, forexample, with alignment precision on the order of a micron. The notches 502 may be used as “stops” to position one chip next to another. For example, the notches 502 may be used to position the cloud chip 501 above the confinement apparatus chip. The cloud chip 501 may comprise optical and / or electrical devices such as light sources, absorbers, detectors, metasurfaces, DOEs, micro-optics and / or others. An advantage of micromachined couplers having notches is fixturing of cloud chips, which positions and accurately couples one or more cloud chip to a micromachined coupler.

[0102] Figure 5B is a simplified view of the second micromachined coupler of Figure 5 A. Figure 5B shows a simplified view 500B of the second micromachined coupler. The simplified view comprises the confinement apparatus 201, the micromachined chips 403, the cloud chip 501, and the notches 502 which couple the cloud chip 501 to the micromachined chips 403.

[0103] In various embodiments, a micromachined coupler (e.g., the second micromachined coupler) is used to provide high density optical interconnects to confinement apparatuses. In various embodiments, the micromachined coupler may include a cloud support configured to at least partially support a cloud chip. In various embodiments, two or more micromachined chips may comprise notches created via precision photolithography and / or etching near their tops. In various embodiments, a cloud chip may be precisely positioned using the cloud supports such that it is disposed substantially parallel to the confinement apparatus. In various examples, cloud chips may host detectors and / or additional optical features such as diffractive lenses, metasurface lenses, absorbers, holes, and / or other features.

[0104] An advantage of this combination is, for example, that the system of the two or more micromachined chips, the optical fibers, and the cloud chip may be assembled together as a single assembly and later combined with a confinement apparatus such that the confinement apparatus receives a minimal amount of handling. Another advantage of this combination is its robust structure, for example.Exemplary Array of Bricks Comprising Micromachined Couplers and Cloud Chips

[0105] Figures 6A-6B show bricks comprising two or more micromachined couplers and cloud chips. Figure 6 A is a top-down view of an array of bricks 600A comprising two or more micromachined couplers and one or more cloud chips. The array of bricks 600 A may be an array of partially enclosed volumes. The array of bricks 600A is comprised of a plurality of optical couplers. An optical coupler of the optical couplers may be comprised of at leastone brick comprising two or more micromachined chips and one or more cloud chips. The one or more cloud chips are coupled to the two or more micromachined chips via two or more notches created via precision photolithography and / or etching in the two or more micromachined chips.

[0106] The array of bricks 600A is comprised of two or more bricks which are comprised of confinement apparatuses, micromachined couplers, and cloud chips. The confinement apparatuses 601 and 602 may be of the same design or they could be of different designs and / or having different functions. For example, the functions may include being quantum processing units (QPUs), conveyors, and / or the like.

[0107] Figure 6B is a perspective view 600B of one brick of the array of bricks of Figure 6 A. The perspective view 600B shows a partially enclosed volume (e.g., brick) 605. The brick 605 is comprised of a confinement apparatus 605A. The confinement apparatus 605A may be a confinement apparatus chip (e.g., an ion trap chip). The brick 605 is further comprised of one or more micromachined chips 605B (e.g., photonic interposers, any of the micromachined couplers / chips described herein, etc.), and one or more cloud chips 605C, wherein the one or more cloud chips 605C are coupled to the one or more micromachined chips 605B via notches (e.g., such as the notches 502). The brick 605 further comprises one or more target locations 202, at which one or more atomic objects, ions, quantum objects, and / or other objects may be disposed. The bricks 605 may implement functions such as the QPUs and / or conveyors described herein. For example, QPUs and / or conveyors may be implemented by the confinement apparatus 605 A. For example, optical couplers may be implemented by the one or more micromachined chips 605B. For example, cloud chips may be implemented by the one or more cloud chips 605C.

[0108] Increasing scalability of quantum computers may benefit from tiling of many individual traps into a matrix. Any of the optical couplers described herein may be used in a tiled configuration as shown in Figure 6A. A particular advantage is that the trap-interposer- cloud assemblies can be built first (e.g., as in Figure 6B), and then these bricks can be assembled into the tiled matrix. Assembling the bricks may be more robust and efficient than assembling individual components, and careful planning of the electrical and optical inputs may allow a “plug and play” assembly process. The optical couplers may be variously shaped. For example, the optical couplers may be rectangular chips and / or they may have one or more fanned out edges, allowing for a higher density of input points onto the trap.Exemplary Methods for Fabrication and Alignment of Devices Comprising Optical Interconnects

[0109] Figures 7A-7B are flowcharts showing example methods for manufacturing an alignment device and aligning one or more optical sources with respective target locations of a receiving device, respectively.

[0110] Figure 7A is a flowchart of an example method 700A for manufacturing an alignment device. At step 702, one or more lithographic techniques may be used to form at least one of a plurality of inputs, a plurality of outputs, and / or one or more optical paths (e.g., waveguides, free-space optical paths, and / or the like). In various embodiments, the one or more waveguides are optical paths. In various embodiments, the one or more optical paths are configured to provide paths from one or more respective inputs of the plurality of inputs to one or more respective outputs of the plurality of outputs. At step 702, at least one optical coupler may be formed and / or fabricated. An optical coupler may be a prism coupler, one or more micromachined chips (e.g., one or more micromachined couplers), one or more micromachined couplers comprising cloud chips, one or more bricks comprising micromachined chips and cloud chips and atomic confinement chips, and / or other apparatuses. For example, the at least one optical coupler may be the one or more micromachined chips 605B. In various embodiments, manufacturing the alignment device comprises using direct-write techniques to form the one or more optical paths, the direct- write techniques comprising at least femtosecond laser processing. In various embodiments, manufacturing the alignment device comprises using masked chemical processing techniques to form the one or more optical paths, the masked chemical processing techniques comprising at least one of: glass-ion exchange; or local doping methods.

[0111] At step 704, one or more receiving devices may be obtained. In various embodiments, a receiving device is a confinement apparatus, such as an atomic confinement apparatus and / or the confinement apparatus 605A.

[0112] At step 706, a plurality of optical sources may be coupled to the plurality of inputs at respective input positions on an optical coupler. In various embodiments, the plurality of inputs define an input direction.

[0113] At step 708, a plurality of outputs may be coupled at respective output positions on the optical coupler. In various embodiments the plurality of outputs define an output direction. In various embodiments, the input direction is at an angle to the output direction. In various embodiments, the input direction is transverse to the output direction.

[0114] At step 710, the at least one optical coupler may be coupled to a receiving device. For example, a receiving device may be a confinement apparatus such as the confinement apparatuses 101 and / or 201. The optical coupler may be assembled in one step (e.g., step 702) and separately coupled to the receiving device, such that the receiving device receives minimal handling.

[0115] Figure 7B is flowchart of an example method 700B for aligning one or more optical sources with respective target locations of a receiving device. At step 712, an alignment device is provided. In various embodiments, the alignment device comprises an optical coupler (e.g., the prism coupler 102, the micromachined coupler 203, the chip 301, the micromachined chips 203 and 403, etc.) comprising a plurality of inputs at respective input positions, a plurality of outputs at respective output positions, and one or more optical paths between the plurality of inputs and the plurality of outputs configured to provide paths from one or more respective inputs of the plurality of inputs to one or more respective outputs of the plurality of outputs, wherein one or more optical inputs are coupled to the optical coupler at one or more respective input positions and the plurality of inputs defines an input direction and the plurality of outputs defines an output direction, and wherein the input direction is at an angle to the output direction. In various embodiments, the input direction is transverse to the output direction.

[0116] At step 714, a cloud chip may be coupled to the alignment device. For example, a cloud chip such as the one or more cloud chips 605C may be coupled to the alignment device comprised of an optical coupler (e.g., such as the one or more micromachined couplers 605B) and / or a confinement apparatus (e.g., such as the confinement apparatus 605A).

[0117] At step 716, the alignment device is secured with respect to the receiving device (e.g., an atomic confinement apparatus such as an ion trap) such that an alignment criterion is satisfied. In various embodiments, the receiving device may be the confinement apparatuses 101 and / or 201. For example, in order to determine whether the alignment criterion is satisfied, light may be provided to one or more of the optical fibers (e.g., one or more channels may be turned on). The light coming out of the corresponding photonic components of the confinement apparatus may be measured to determine whether a predetermined quantity of light is measured, for example. In various embodiments, there may be one or more channels (e.g., optical fibers) which are aligned with photodetectors and / or calibration sensors on the confinement apparatus.

[0118] At step 718, at a point in time after the securing of the alignment device with respect to the receiving device, it is determined whether the alignment criterion is stillsatisfied. If the alignment criterion is no longer satisfied, the method 700B may return to step 716. If the alignment criterion is no longer satisfied, the alignment device may be resecured with respect to the receiving device.Technical Advantages

[0119] Various embodiments provide technical advantages, as described herein. In various embodiments, a prism coupler uses much less space than a photonic interposer which is positioned in the plane of the trap. In various embodiments, the prism 102, the features 103, and / or the one or more fibers 104A. . .n may be assembled ahead of coupling to the confinement apparatus as a single assembly, such that alignment of all inputs to the trap occurs in one step.

[0120] In various embodiments, a micromachined coupler (e.g., a micromachined chip) having grooves and / or trenches provides good mechanical support for the incoming optical fibers (e.g., the optical fibers 302A. . .n) from the grooves. In various embodiments, the micromachined coupler is easily scalable (e.g., many copies of the device can be made on a single wafer). In various embodiments, the micromachined coupler may be configured to bring light in either from above or below the confinement apparatus.

[0121] In various embodiments, a micromachined coupler may be comprised of two or more micromachined chips. In various embodiments, the chips can be shaped like a photonic interposer such that a large array of fibers can be condensed into a more compact, higher- density array of outputs. In various embodiments, commercially available v-groove arrays may be used as the inputs to these micromachined couplers, making them more economical. In various embodiments, multiple layers of waveguides may be patterned onto the chip, allowing for complex routing configurations. In various embodiments, the micromachined coupler may be configured to bring light in either from above or below the confinement apparatus.

[0122] In various embodiments, micromachined couplers comprise notches for fixturing of cloud chips, which positions and accurately couples one or more cloud chip to a micromachined coupler. In various embodiments, a system comprising two or more micromachined chips, optical fibers, and a cloud chip may be assembled together as a single assembly and later combined with a confinement apparatus such that the confinement apparatus receives a minimal amount of handling. In various embodiments, such a single assembly has robust structure.

[0123] In various embodiments, an array of tiled traps may increase scalability of quantum computers. Any of the optical couplers described herein may be used in a tiled configuration as shown in Figure 6A. In various embodiments, the trap-interposer-cloud assemblies can be built first (e.g., as in Figure 6B), and then these bricks can be assembled into the tiled array / matrix. Assembling the bricks may be more robust and efficient than assembling individual components, and careful planning of the electrical and optical inputs may allow a “plug and play” assembly process. The optical couplers may be variously shaped. For example, the optical couplers may be rectangular chips and / or they may have one or more fanned out edges, allowing for a higher density of input points onto the trap.Example Quantum Computing System Comprising a Confinement Apparatus

[0124] Various embodiments provide high density optical interconnects and methods for fabrication thereof. Various embodiments provide systems that include one or more of such high density optical interconnects. Various embodiments provide various optical, electro- optical, opto-mechanical systems that include such high density optical interconnects. One example system is a quantum computing system.

[0125] Figure 8 provides a schematic diagram of an example quantum computing system 800 comprising an atomic object confinement apparatus 820 (e.g., an ion trap such as a surface ion trap, Paul trap, and / or the like), which is also referred to as a confinement apparatus herein, in accordance with an example embodiment. In various embodiments, the atomic object confinement apparatus 820 is configured to confine one or more atomic objects (e.g., neutral or ionic atoms; neutral, ionic, or multipolar molecules; and / or the like). For example, Figure 8 schematically illustrates an example quantum charge-coupled device (QCCD)-based quantum computer. However, various high density optical interconnects may be incorporated into various types of quantum computers (e.g., for providing manipulation signals for qubit interaction, cooling, and / or the like) and / or various types of atomic systems (e.g., for providing manipulation signals for trapped particle / ion / atom / molecule interaction).

[0126] In various embodiments, the quantum computing system 800 comprises a computing entity 10 and a quantum computer 810. In various embodiments, the quantum computer 810 comprises a controller 30, a cryostat and / or vacuum chamber 40 enclosing a confinement apparatus 820 (e.g., an ion trap), and one or more manipulation sources 60. For example, the cryostat and / or vacuum chamber 40 may be a pressure-controlled chamber. In an example embodiment, the manipulation signals generated by the manipulation sources 60 are provided to the interior of the cryostat and / or vacuum chamber 40 (where the atomicobject confinement apparatus 820 is located) via corresponding optical paths 66 (e.g., 66A, 66B, 66C). In an example embodiment, the one or more manipulation sources 60 may comprise one or more lasers (e.g., optical lasers, microwave sources, and / or the like). In various embodiments, each manipulation source is configured to generate a manipulation signal having a respective characteristic wavelength in the microwave, infrared, visible, or ultraviolet portion of the electromagnetic spectrum. In various embodiments, the one or more manipulation sources 60 are configured to manipulate and / or cause a controlled quantum state evolution of one or more atomic objects within the confinement apparatus. For example, in an example embodiment, wherein the one or more manipulation sources 60 comprise one or more lasers, the lasers may provide one or more laser beams to atomic objects trapped within the confinement apparatus 820 within the cryostat and / or vacuum chamber 40. For example, the manipulation sources 60 may be configured to generate one or more beams that may be used to initialize an atomic object into a state of a qubit space such that the atomic object may be used as a qubit of the confined atomic object quantum computer, perform one or more gates on one or more qubits of the confined atomic object quantum computer, read and / or determine a state of one or more qubits of the confined atomic object quantum computer, and / or the like.

[0127] In various embodiments, the quantum computer 810 comprises an optics collection system configured to collect and / or detect photons generated by qubits (e.g., during reading procedures). The optics collection system may comprise one or more optical elements (e.g., three-level structures, lenses, mirrors, waveguides, fiber optics cables, and / or the like) and one or more photodetectors. In various embodiments, the optical elements include diffractive optical elements such as grating couplers. In various embodiments, grating couplers may be comprised of one or more three-level structures. In various embodiments, the photodetectors may be photodiodes, photomultipliers, charge-coupled device (CCD) sensors, complementary metal oxide semiconductor (CMOS) sensors, Micro-Electro- Mechanical Systems (MEMS) sensors, and / or other photodetectors that are sensitive to light at an expected fluorescence wavelength of the qubits of the quantum computer. In various embodiments, the detectors may be in electronic communication with the controller 30 via one or more A / D converters 925 (see Figure 9) and / or the like. For example, an atomic object being read and / or having its quantum state determined may emit an emitted signal, at least a portion of which is incident on a collection array of meta material structures formed and / or disposed on the surface of the atomic object confinement apparatus 820. The emitted signal being incident on the collection array of meta material structures induces the meta materialstructures to emit a detected signal directed toward and / or focused at collection optics of the atomic object confinement apparatus. The collection optics are configured to provide the collection signal to a photodetector.

[0128] In various embodiments, the quantum computer 810 comprises one or more voltage sources 50. For example, the voltage sources 50 may comprise a plurality of voltage drivers and / or voltage sources and / or at least one RF driver and / or voltage source. The voltage sources 50 may be electrically coupled to the corresponding potential generating elements (e.g., electrodes) of the confinement apparatus 820, in an example embodiment.

[0129] In various embodiments, a computing entity 10 is configured to allow a user to provide input to the quantum computer 810 (e.g., via a user interface of the computing entity 10) and receive, view, and / or the like output from the quantum computer 810. The computing entity 10 may be in communication with the controller 30 of the quantum computer 810 via one or more wired or wireless networks 20 and / or via direct wired and / or wireless communications. In an example embodiment, the computing entity 10 may translate, configure, format, and / or the like information / data, quantum computing algorithms and / or circuits, and / or the like into a computing language, executable instructions, command sets, and / or the like that the controller 30 can understand and / or implement.

[0130] In various embodiments, the controller 30 is configured to control the voltage sources 50, cryostat system and / or vacuum system controlling the temperature and pressure within the cryostat and / or vacuum chamber 40, manipulation sources 60, and / or other systems controlling various environmental conditions (e.g., temperature, pressure, and / or the like) within the cryostat and / or vacuum chamber 40 and / or configured to manipulate and / or cause a controlled evolution of quantum states of one or more atomic objects within the confinement apparatus. For example, the controller 30 may cause a controlled evolution of quantum states of one or more atomic objects within the confinement apparatus to execute a quantum circuit and / or algorithm. For example, the controller 30 may cause a reading procedure comprising coherent shelving to be performed, possibly as part of executing a quantum circuit and / or algorithm. In various embodiments, the atomic objects confined within the confinement apparatus are used as qubits of the quantum computer 810.Example Controller

[0131] In various embodiments, a confinement apparatus 820 is incorporated into a system (e.g., a quantum computer 810) comprising a controller 30. In various embodiments, the controller 30 is configured to control various elements of the system (e.g., quantumcomputer 810). For example, the controller 30 may be configured to control the voltage sources 50, a cryostat system and / or vacuum system controlling the temperature and pressure within the cryostat and / or vacuum chamber 40, manipulation sources 60, cooling system, and / or other systems controlling the environmental conditions (e.g., temperature, humidity, pressure, and / or the like) within the cryostat and / or vacuum chamber 40 and / or configured to manipulate and / or cause a controlled evolution of quantum states of one or more atomic objects confined by the atomic object confinement apparatus 820. In various embodiments, the controller 30 may be configured to receive signals from one or more optics collection systems.

[0132] As shown in Figure 9, in various embodiments, the controller 30 may comprise various controller elements including processing elements 905, memory 910, driver controller elements 915, a communication interface 920, analog-digital converter elements 925, and / or the like. For example, the processing elements 905 may comprise programmable logic devices (CPLDs), microprocessors, coprocessing entities, application-specific instruction-set processors (ASIPs), integrated circuits, application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), programmable logic arrays (PLAs), hardware accelerators, other processing devices and / or circuitry, and / or the like, and / or controllers. The term circuitry may refer to an entirely hardware embodiment or a combination of hardware and computer program products. In an example embodiment, the processing element 505 of the controller 30 comprises a clock and / or is in communication with a clock.

[0133] For example, the memory 910 may comprise non-transitory memory such as volatile and / or non-volatile memory storage such as one or more of as hard disks, ROM, PROM, EPROM, EEPROM, flash memory, MMCs, SD memory cards, Memory Sticks, CBRAM, PRAM, FeRAM, RRAM, SONOS, racetrack memory, RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, and / or the like. In various embodiments, the memory 910 may store a queue of commands to be executed to cause a quantum algorithm and / or circuit to be executed (e.g., an executable queue), qubit records corresponding the qubits of quantum computer (e.g., in a qubit record data store, qubit record database, qubit record table, and / or the like), a calibration table, computer program code (e.g., in a one or more computer languages, specialized controller language(s), and / or the like), and / or the like. In an example embodiment, execution of at least a portion of the computer program code stored in the memory 910 (e.g., by a processing element 905)causes the controller 30 to perform one or more steps, operations, processes, procedures and / or the like described herein for providing manipulation signals to atomic object locations and / or collecting, detecting, capturing, and / or measuring indications of emitted signals emitted by atomic objects located at corresponding atomic object locations of the atomic object confinement apparatus 820.

[0134] In various embodiments, the driver controller elements 915 may include one or more drivers and / or controller elements each configured to control one or more drivers. In various embodiments, the driver controller elements 915 may comprise drivers and / or driver controllers. For example, the driver controllers may be configured to cause one or more corresponding drivers to be operated in accordance with executable instructions, commands, and / or the like scheduled and executed by the controller 30 (e.g., by the processing element 905). In various embodiments, the driver controller elements 915 may enable the controller 30 to operate a voltage sources 50, manipulation sources 60, cooling system, and / or the like. In various embodiments, the drivers may be laser drivers configured to operate one or manipulation sources 60 to generate manipulation signals; vacuum component drivers; drivers for controlling the flow of current and / or voltage applied to electrodes used for maintaining and / or controlling the trapping potential of the atomic object confinement apparatus 820 (and / or other drivers for providing driver action sequences to potential generating elements of the atomic object confinement apparatus); cryostat and / or vacuum system component drivers; cooling system drivers, and / or the like. In various embodiments, the controller 30 comprises means for communicating and / or receiving signals from one or more optical receiver components (e.g., photodetectors of the optics collection system). For example, the controller 30 may comprise one or more analog-digital converter elements 925 configured to receive signals from one or more optical receiver components (e.g., a photodetector of the optics collection system), calibration sensors, and / or the like.

[0135] In various embodiments, the controller 30 may comprise a communication interface 920 for interfacing and / or communicating with a computing entity 10. For example, the controller 30 may comprise a communication interface 920 for receiving executable instructions, command sets, and / or the like from the computing entity 10 and providing output received from the quantum computer 810 (e.g., from an optical collection system) and / or the result of a processing the output to the computing entity 10. In various embodiments, the computing entity 10 and the controller 30 may communicate via a direct wired and / or wireless connection and / or via one or more wired and / or wireless networks 20.Example Computing Entity

[0136] Figure 10 provides an illustrative schematic representative of an example computing entity 10 that can be used in conjunction with embodiments of the present invention. In various embodiments, the computing entity 10 is a classical or semiconductorbased computing apparatus that is part of the quantum computing system 800.

[0137] In various embodiments, the computing entity 10 is configured to allow a user to provide input to the quantum computer 810 (e.g., via a user interface of the computing entity 10) and receive, display, analyze, and / or the like output from the quantum computer 810.

[0138] As shown in Figure 6, a computing entity 10 can include an antenna 1012, a transmitter 1004 (e.g., radio), a receiver 1006 (e.g., radio), and a processing element 1008 that provides signals to and receives signals from the transmitter 1004 and receiver 1006, respectively. The signals provided to and received from the transmitter 1004 and the receiver 1006, respectively, may include signaling information / data in accordance with an air interface standard of applicable wireless systems to communicate with various entities, such as a controller 30, other computing entities 10, and / or the like. In this regard, the computing entity 10 may be capable of operating with one or more air interface standards, communication protocols, modulation types, and access types. For example, the computing entity 10 may be configured to receive and / or provide communications using a wired data transmission protocol, such as fiber distributed data interface (FDDI), digital subscriber line (DSL), Ethernet, asynchronous transfer mode (ATM), frame relay, data over cable service interface specification (DOCSIS), or any other wired transmission protocol. Similarly, the computing entity 10 may be configured to communicate via wireless external communication networks using any of a variety of protocols, such as general packet radio service (GPRS), Universal Mobile Telecommunications System (UMTS), Code Division Multiple Access 2000 (CDMA2000), CDMA2000 IX (IxRTT), Wideband Code Division Multiple Access (WCDMA), Global System for Mobile Communications (GSM), Enhanced Data rates for GSM Evolution (EDGE), Time Division-Synchronous Code Division Multiple Access (TD- SCDMA), Long Term Evolution (LTE), Evolved Universal Terrestrial Radio Access Network (E-UTRAN), Evolution-Data Optimized (EVDO), High Speed Packet Access (HSPA), High-Speed Downlink Packet Access (HSDPA), IEEE 802.11 (Wi-Fi), Wi-Fi Direct, 802.16 (WiMAX), ultra-wideband (UWB), infrared (IR) protocols, near field communication (NFC) protocols, Wibree, Bluetooth protocols, wireless universal serial bus (USB) protocols, and / or any other wireless protocol. The computing entity 10 may use suchprotocols and standards to communicate using Border Gateway Protocol (BGP), Dynamic Host Configuration Protocol (DHCP), Domain Name System (DNS), File Transfer Protocol (FTP), Hypertext Transfer Protocol (HTTP), HTTP over TLS / SSL / S ecure, Internet Message Access Protocol (IMAP), Network Time Protocol (NTP), Simple Mail Transfer Protocol (SMTP), Telnet, Transport Layer Security (TLS), Secure Sockets Layer (SSL), Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Datagram Congestion Control Protocol (DCCP), Stream Control Transmission Protocol (SCTP), HyperText Markup Language (HTML), and / or the like.

[0139] Via these communication standards and protocols, the computing entity 10 can communicate with various other entities using concepts such as Unstructured Supplementary Service information / data (USSD), Short Message Service (SMS), Multimedia Messaging Service (MMS), Dual-Tone Multi-Frequency Signaling (DTMF), and / or Subscriber Identity Module Dialer (SIM dialer). The computing entity 10 can also download changes, add-ons, and updates, for instance, to its firmware, software (e.g., including executable instructions, applications, program modules), and operating system.

[0140] In various embodiments, the computing entity 10 comprises one or more network interfaces 1020 configured for communicating via one or more wired and / or wireless computer networks.

[0141] The computing entity 10 may also comprise a user interface device comprising one or more user input / output interfaces (e.g., a display 1016 and / or speaker / speaker driver coupled to a processing element 1008 and a touch screen, keyboard, mouse, and / or microphone coupled to a processing element 1008). For instance, the user output interface may be configured to provide an application, browser, user interface, interface, dashboard, screen, webpage, page, and / or similar words used herein interchangeably executing on and / or accessible via the computing entity 10 to cause display or audible presentation of information / data and for interaction therewith via one or more user input interfaces. The user input interface can comprise any of a number of devices allowing the computing entity 10 to receive data, such as a keypad 1018 (hard or soft), a touch display, voice / speech or motion interfaces, scanners, readers, or other input device. In embodiments including a keypad 1018, the keypad 1018 can include (or cause display of) the conventional numeric (0-9) and related keys (#, *), and other keys used for operating the computing entity 10 and may include a full set of alphabetic keys or set of keys that may be activated to provide a full set of alphanumeric keys. In addition to providing input, the user input interface can be used, for example, to activate or deactivate certain functions, such as screen savers and / or sleep modes.Through such inputs the computing entity 10 can collect information / data, user interaction / input, and / or the like.

[0142] The computing entity 10 can also include volatile storage or memory 1022 and / or non-volatile storage or memory 1024, which can be embedded and / or may be removable. For instance, the non-volatile memory may be ROM, PROM, EPROM, EEPROM, flash memory, MMCs, SD memory cards, Memory Sticks, CBRAM, PRAM, FeRAM, RRAM, SONOS, racetrack memory, and / or the like. The volatile memory may be RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, and / or the like. The volatile and non-volatile storage or memory can store databases, database instances, database management system entities, data, applications, programs, program modules, scripts, source code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and / or the like to implement the functions of the computing entity 10.Conclusion

[0143] Many modifications and other embodiments of the invention set forth herein will come to mind to one skilled in the art to which the invention pertains having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the invention is not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

CLAIMSThat which is claimed:

1. An alignment assembly comprising: an alignment device comprising: an optical coupler comprising a plurality of inputs at respective input positions, a plurality of outputs at respective output positions, and one or more optical paths between the plurality of inputs and the plurality of outputs configured to provide paths from one or more respective inputs of the plurality of inputs to one or more respective outputs of the plurality of outputs, wherein: one or more optical inputs are coupled to the optical coupler at one or more respective input positions; and the plurality of inputs defines an input direction and the plurality of outputs defines an output direction, wherein the input direction is at an angle to the output direction.

2. The alignment assembly of claim 1, wherein the optical coupler is a prism coupler, and wherein the one or more optical inputs are disposed on the prism coupler at one side.

3. The alignment assembly of any of claims 1 or 2, wherein the prism coupler is a triangular prism, and wherein the prism coupler further comprises optical features on its exit surface.

4. The alignment assembly of any of claims 1 to 3, wherein the optical features are at least one of: diffractive optical elements (DOEs), metasurfaces, fiducials, micro-optics, or absorbers.

5. The alignment assembly of any of claims 1 to 4, wherein the angle is at least one of: less than 90 degrees; approximately 90 degrees; or greater than 90 degrees.

6. The alignment assembly of any of claims 1 to 5, wherein the optical coupler is a first micromachined coupler, and wherein the first micromachined coupler comprises two or more optical inputs at two or more respective input positions, and wherein the first micromachined coupler comprises two or more reflectors for directing light from the two or more optical inputs to one or more target locations.

7. The alignment assembly of any of claims 1 to 6, wherein the first micromachined coupler comprises grooves for aligning incoming optical fibers with the two or more reflectors.

8. The alignment assembly of any of claims 1 to 7, wherein the first micromachined coupler comprises one or more transparent membranes across an exit surface of the first micromachined coupler.

9. The alignment assembly of any of claims 1 to 8, wherein one or more optical features are patterned on the one or more transparent membranes.

10. The alignment assembly of any of claims 1 to 9, wherein the optical coupler is comprised of two or more micromachined couplers, wherein the two or more micromachined couplers comprise two or more first optical inputs at two or more first respective input positions at each of the micromachined couplers and two or more second optical inputs at two or more second respective input positions at each of the micromachined couplers, and wherein the two or more micromachined couplers comprise two or more first reflectors and two or more second reflectors for directing light from their respective inputs.

11. The alignment assembly of any of claims 1 to 10 wherein the two or more micromachined couplers comprise grooves for aligning incoming optical fibers, and wherein the two or more micromachined couplers further comprise one or more transparent membranes across an exit surface of the two or more micromachined couplers.

12. The alignment assembly of any of claims 1 to 11, wherein one or more optical features are patterned on the one or more transparent membranes.

13. The alignment assembly of any of claims 1 to 12, wherein the two or more micromachined couplers are coupled to a receiving device at two or more different sides of the receiving device.

14. A method for aligning one or more optical sources with respective target locations of a receiving device, the method comprising: providing an alignment device, the alignment device comprising an optical coupler comprising a plurality of inputs at respective input positions, a plurality of outputs at respective output positions, and one or more optical paths between the plurality of inputs and the plurality of outputs configured to provide paths from one or more respective inputs of the plurality of inputs to one or more respective outputs of the plurality of outputs, wherein: one or more optical inputs are coupled to the optical coupler at one or more respective input positions; and the plurality of inputs defines an input direction and the plurality of outputs defines an output direction, wherein the input direction is at an angle to the output direction; and securing the alignment device with respect to the receiving device such that an alignment criterion is satisfied.

15. A method compri sing : obtaining at least one optical coupler; coupling a plurality of optical sources to a plurality of inputs at respective input positions on the optical coupler and coupling a plurality of outputs at respective output positions on the optical coupler, wherein the plurality of inputs defines an input direction and the plurality of outputs defines an output direction, wherein the input direction is at an angle to the output direction; and applying one or more optical paths to the optical coupler, wherein the one or more optical paths are configured to provide paths from one or more respective inputs of the plurality of inputs to one or more respective outputs of the plurality of outputs.

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